JP6503224B2 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP6503224B2 JP6503224B2 JP2015101865A JP2015101865A JP6503224B2 JP 6503224 B2 JP6503224 B2 JP 6503224B2 JP 2015101865 A JP2015101865 A JP 2015101865A JP 2015101865 A JP2015101865 A JP 2015101865A JP 6503224 B2 JP6503224 B2 JP 6503224B2
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- end side
- heat
- support
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 238000004891 communication Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 230000001965 increasing effect Effects 0.000 description 8
- 230000000191 radiation effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/06—Hollow fins; fins with internal circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
Description
2 支持本体
3 筒状体
3a 開口部
3b 貫通口
3c 基端
4 支持板
5、6 筒体
9 冷却対象物
20、21 面
30 固定部分
31、32 位置
40 取付穴
41 厚肉部
42 脚部
60 凹凸表面
61 突条部
90 筐体プレート
91 基板
s1 隙間
Claims (6)
- 冷却対象物が固定される良熱伝導性材料よりなる支持本体と、
該支持本体に立設された単又は複数の良熱伝導性材料よりなる筒状体とを備え、
前記筒状体が、先端に内外開放された開口部を有するとともに、基端側の側壁に内外連通させる貫通口を設けてなり、
前記筒状体を、前記貫通口を有し且つ前記支持本体に固定される基端側の筒体と、前記開口部を有する先端側の筒体とを含む、少なくとも2つ以上の筒体を内部空間が連通した状態で軸方向に連結して構成し、
前記支持本体から放射された熱を含む雰囲気を、前記貫通口を通じて筒状体の内部に流入させるとともに、該筒状体の内部空間を流通させたうえ、先端の開口部から外部に放出可能としたことを特徴とするヒートシンク。 - 基端側の筒体の外径を先端側の筒体よりも小径に設定するとともに、基端側の筒体を先端側の筒体よりも熱伝導性の高い材料で構成してなる請求項1記載のヒートシンク。
- 先端側の筒体の外周面に、軸方向に沿って延びる突条部を周方向に間隔をおいて複数設けてなる請求項1又は2記載のヒートシンク。
- 筒体同士の連結を、拡管カシメで互いの端部同士を固定することにより連結してなる請求項1〜3の何れか1項に記載のヒートシンク。
- 前記支持本体を、プレス加工により前記筒状体をカシメ固定する支持板より構成してなる請求項1〜4の何れか1項に記載のヒートシンク。
- 支持板に筒状体を挿入して固定するための取付穴を設け、該取付穴の内周縁に沿ってバーリング加工により厚肉部を形成し、筒状体を前記取付穴に挿入した状態において厚肉部を軸方向から圧縮プレス加工し、該厚肉部を取付穴中心方向に塑性変形させて筒状体の外周面に圧着させることによりカシメ固定してなる請求項5記載のヒートシンク。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015101865A JP6503224B2 (ja) | 2015-05-19 | 2015-05-19 | ヒートシンク |
US15/139,539 US10297524B2 (en) | 2015-05-19 | 2016-04-27 | Heat sink |
CN201610334369.5A CN106168364B (zh) | 2015-05-19 | 2016-05-19 | 散热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015101865A JP6503224B2 (ja) | 2015-05-19 | 2015-05-19 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016219575A JP2016219575A (ja) | 2016-12-22 |
JP6503224B2 true JP6503224B2 (ja) | 2019-04-17 |
Family
ID=57325259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015101865A Active JP6503224B2 (ja) | 2015-05-19 | 2015-05-19 | ヒートシンク |
Country Status (3)
Country | Link |
---|---|
US (1) | US10297524B2 (ja) |
JP (1) | JP6503224B2 (ja) |
CN (1) | CN106168364B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205213228U (zh) * | 2015-10-30 | 2016-05-04 | 比亚迪股份有限公司 | 散热器底板以及具有其的散热器和igbt模组 |
US10101097B2 (en) * | 2016-09-25 | 2018-10-16 | Cooler Master Co., Ltd. | Heat sink having thermal distortion compensation |
US10488028B2 (en) * | 2017-05-03 | 2019-11-26 | Fluence Bioengineering, Inc. | Systems and methods for a heat sink |
WO2018220417A1 (en) * | 2017-05-31 | 2018-12-06 | Agile Power Switch 3D Integration Apsi3D | Heat sink structure |
JP6918765B2 (ja) * | 2018-11-29 | 2021-08-11 | ファナック株式会社 | 放熱装置 |
DE102018221951A1 (de) * | 2018-12-17 | 2020-06-18 | Rolls-Royce Deutschland Ltd & Co Kg | Rohrförmige Kühlrippen und deren Anwendung |
US11435144B2 (en) * | 2019-08-05 | 2022-09-06 | Asia Vital Components (China) Co., Ltd. | Heat dissipation device |
CN113395866B (zh) * | 2020-03-11 | 2023-04-28 | 苏州佳世达光电有限公司 | 散热装置 |
FR3108230A1 (fr) * | 2020-03-13 | 2021-09-17 | Safran | Dissipateur thermique pour composant electronique |
FR3108169B1 (fr) * | 2020-03-13 | 2022-03-25 | Safran | Dispositif de transfert de calories |
JP7452253B2 (ja) * | 2020-05-26 | 2024-03-19 | 富士通株式会社 | 冷却装置 |
EP4096376A1 (en) * | 2021-05-24 | 2022-11-30 | Aptiv Technologies Limited | Cooling device and heatsink assembly incorporating the same |
US20230125822A1 (en) * | 2021-10-27 | 2023-04-27 | Intel Corporation | Immersion cooling for integrated circuit devices |
US20230180434A1 (en) * | 2021-12-06 | 2023-06-08 | Intel Corporation | Circuit devices integrated with boiling enhancement for two-phase immersion cooling |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1591842A (en) * | 1977-02-11 | 1981-06-24 | Serck Industries Ltd | Method of and apparatus for joining a tubular element to a support |
US4620216A (en) * | 1983-04-29 | 1986-10-28 | International Business Machines Corporation | Unitary slotted heat sink for semiconductor packages |
USD304715S (en) * | 1987-09-16 | 1989-11-21 | International Business Machines Corporation | Heat sink or similar article |
US5351748A (en) * | 1993-01-21 | 1994-10-04 | Baruch Dagan | Tubular pin fin heat sink for electronic components |
JPH06244328A (ja) * | 1993-02-19 | 1994-09-02 | Fujitsu Ltd | ヒートシンク |
EP0633608B1 (en) * | 1993-07-08 | 2000-10-11 | Sumitomo Metal Industries, Ltd. | Process for producing a pin-finned heat sink |
JPH08247594A (ja) * | 1995-03-13 | 1996-09-27 | Alpha:Kk | 熱交換装置 |
JP3177921B2 (ja) * | 1995-12-08 | 2001-06-18 | 三菱電機株式会社 | 電子部品の放熱装置 |
US5781411A (en) * | 1996-09-19 | 1998-07-14 | Gateway 2000, Inc. | Heat sink utilizing the chimney effect |
US6085830A (en) * | 1997-03-24 | 2000-07-11 | Fujikura Ltd. | Heat sink, and process and apparatus for manufacturing the same |
JPH10270616A (ja) * | 1997-03-27 | 1998-10-09 | Mitsubishi Electric Corp | 電子部品の放熱装置 |
JP3885197B2 (ja) * | 1997-04-11 | 2007-02-21 | 株式会社アルファ | 基板部に長孔を有する熱交換部品並びにその製造方法 |
EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
US6134783A (en) * | 1997-10-29 | 2000-10-24 | Bargman; Ronald D. | Heat sink and process of manufacture |
US6374490B1 (en) * | 1998-08-12 | 2002-04-23 | Nakamura Seisakusho Kabushikigaisha | Method of forming a hollow pole projecting on a plate and a method of manufacturing a heat sink using said method |
US6021045A (en) * | 1998-10-26 | 2000-02-01 | Chip Coolers, Inc. | Heat sink assembly with threaded collar and multiple pressure capability |
JP3273505B2 (ja) * | 1999-08-18 | 2002-04-08 | 古河電気工業株式会社 | 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法 |
TW564009U (en) * | 2001-02-13 | 2003-11-21 | Foxconn Prec Components Co Ltd | Locking device for heat sink |
JP2002314008A (ja) * | 2001-03-14 | 2002-10-25 | Expan Electronics Co Ltd | 熱伝逹パイプを備えたヒートシンク及び冷却モジュール |
US6741470B2 (en) * | 2001-06-01 | 2004-05-25 | Intel Corporation | Reusable thermal solution attachment mechanism and methods of using same |
AT413163B (de) * | 2001-12-18 | 2005-11-15 | Fotec Forschungs Und Technolog | Kühlvorrichtung für einen chip sowie verfahren zur herstellung |
US6817405B2 (en) * | 2002-06-03 | 2004-11-16 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
US6754078B1 (en) * | 2003-03-03 | 2004-06-22 | Shyh-Ming Chen | Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate |
TW566838U (en) * | 2003-04-25 | 2003-12-11 | Hon Hai Prec Ind Co Ltd | Heat sink |
US6940718B2 (en) * | 2003-08-27 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Heat dissipation apparatus and method |
US7182124B2 (en) * | 2004-08-31 | 2007-02-27 | Egbon Electronics Ltd. | Heat sink structure |
US20090014154A1 (en) * | 2005-11-09 | 2009-01-15 | Tir Technology Lp | Passive Thermal Management System |
JP4945433B2 (ja) * | 2007-12-28 | 2012-06-06 | シャープ株式会社 | 照明装置 |
JP5688568B2 (ja) * | 2008-07-15 | 2015-03-25 | 山野井精機株式会社 | 被加工金属部材に突起を形成する突起形成方法 |
US8910706B2 (en) * | 2009-02-05 | 2014-12-16 | International Business Machines Corporation | Heat sink apparatus with extendable pin fins |
CN101848626B (zh) * | 2009-03-27 | 2013-08-07 | 富准精密工业(深圳)有限公司 | 散热器及其制造方法 |
US8018720B2 (en) * | 2009-06-25 | 2011-09-13 | International Business Machines Corporation | Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |
JP5813300B2 (ja) * | 2010-08-23 | 2015-11-17 | 三桜工業株式会社 | 冷却装置 |
US20120186798A1 (en) * | 2011-01-26 | 2012-07-26 | Celsia Technologies Taiwan, I | Cooling module for led lamp |
JP6102276B2 (ja) * | 2012-01-26 | 2017-03-29 | Apsジャパン株式会社 | カシメ組付品の製造方法 |
JP6226446B2 (ja) | 2012-10-09 | 2017-11-08 | Apsジャパン株式会社 | ヒートシンクの製造方法 |
WO2015083201A1 (ja) * | 2013-12-05 | 2015-06-11 | 三菱電機株式会社 | 電力半導体装置 |
-
2015
- 2015-05-19 JP JP2015101865A patent/JP6503224B2/ja active Active
-
2016
- 2016-04-27 US US15/139,539 patent/US10297524B2/en active Active
- 2016-05-19 CN CN201610334369.5A patent/CN106168364B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN106168364A (zh) | 2016-11-30 |
US20160341492A1 (en) | 2016-11-24 |
JP2016219575A (ja) | 2016-12-22 |
CN106168364B (zh) | 2019-12-13 |
US10297524B2 (en) | 2019-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6503224B2 (ja) | ヒートシンク | |
US6956740B2 (en) | Heat sink with fins and manufacturing method thereof | |
US20080060793A1 (en) | Cooler device | |
TWI810448B (zh) | 散熱器 | |
US20100326644A1 (en) | Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same | |
JP2004111968A (ja) | 部品と直接接触したヒートパイプ付きヒートシンク | |
EP2437023A2 (en) | Heat dissipation device | |
JP5323614B2 (ja) | ヒートパイプおよびその製造方法 | |
US9772143B2 (en) | Thermal module | |
US8162036B2 (en) | Heat pipe structure and flattened heat pipe structure | |
US20080093055A1 (en) | Heat-dissipating structure | |
JP2004079754A (ja) | ヒートシンク | |
US7316266B2 (en) | Liquid-cooled pipe | |
WO2018181933A1 (ja) | ヒートシンク | |
JP2004071635A (ja) | タワー型ヒートシンク | |
US10352625B2 (en) | Thermal module | |
JP2000018852A (ja) | ヒートパイプ付きヒートシンクおよびその製造方法 | |
US20150159966A1 (en) | Manufacturing Method of Thermal Module | |
JP2018031549A (ja) | 放熱装置 | |
KR200210927Y1 (ko) | 히트 싱크의 방열핀구조 | |
JP2012013277A (ja) | ヒートシンク | |
JP2005143265A (ja) | 電気接続箱 | |
KR20090001415U (ko) | 히트 파이프 | |
WO2023276938A1 (ja) | 熱デバイス冷却用ヒートシンク | |
WO2023276939A1 (ja) | 熱デバイス用ヒートシンク |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180223 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181005 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181016 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20181214 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190215 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190305 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190325 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6503224 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |