JP6499586B2 - Double-sided adhesive tape for portable electronic devices - Google Patents
Double-sided adhesive tape for portable electronic devices Download PDFInfo
- Publication number
- JP6499586B2 JP6499586B2 JP2015545229A JP2015545229A JP6499586B2 JP 6499586 B2 JP6499586 B2 JP 6499586B2 JP 2015545229 A JP2015545229 A JP 2015545229A JP 2015545229 A JP2015545229 A JP 2015545229A JP 6499586 B2 JP6499586 B2 JP 6499586B2
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- double
- pressure
- weight
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002390 adhesive tape Substances 0.000 title description 30
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 102
- 229920005989 resin Polymers 0.000 claims description 84
- 239000011347 resin Substances 0.000 claims description 84
- 239000010410 layer Substances 0.000 claims description 53
- 239000000853 adhesive Substances 0.000 claims description 39
- 230000001070 adhesive effect Effects 0.000 claims description 39
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 31
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 28
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 28
- 229920006243 acrylic copolymer Polymers 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 8
- 150000003505 terpenes Chemical class 0.000 claims description 8
- 235000007586 terpenes Nutrition 0.000 claims description 8
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 description 34
- 239000006260 foam Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 18
- 239000012790 adhesive layer Substances 0.000 description 17
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- 150000002148 esters Chemical class 0.000 description 15
- 239000000203 mixture Substances 0.000 description 15
- 239000003431 cross linking reagent Substances 0.000 description 13
- 239000000178 monomer Substances 0.000 description 12
- -1 2-ethylhexyl Chemical group 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 229920000515 polycarbonate Polymers 0.000 description 11
- 239000004417 polycarbonate Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 238000004132 cross linking Methods 0.000 description 9
- 229920000098 polyolefin Polymers 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 229920002799 BoPET Polymers 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000009863 impact test Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000004712 Metallocene polyethylene (PE-MC) Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920013716 polyethylene resin Polymers 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 2
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000007718 adhesive strength test Methods 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- FYRCDEARNUVZRG-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CC(C)CC(C)(C)C1 FYRCDEARNUVZRG-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- RTEZVHMDMFEURJ-UHFFFAOYSA-N 2-methylpentan-2-yl 2,2-dimethylpropaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)C(C)(C)C RTEZVHMDMFEURJ-UHFFFAOYSA-N 0.000 description 1
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 1
- NFWPZNNZUCPLAX-UHFFFAOYSA-N 4-methoxy-3-methylaniline Chemical compound COC1=CC=C(N)C=C1C NFWPZNNZUCPLAX-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 230000005250 beta ray Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011980 kaminsky catalyst Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Description
本発明は、細幅であっても、加熱圧着後の粘着力が高く、優れた耐衝撃性を発揮できる携帯電子機器用両面粘着テープに関する。 The present invention relates to a double-sided pressure-sensitive adhesive tape for portable electronic devices that has high adhesive strength after thermocompression bonding and can exhibit excellent impact resistance even if it is narrow.
画像表示装置又は入力装置を搭載した電子機器(例えば、携帯電話、携帯情報端末等)においては、組み立てのために粘着テープが用いられている。具体的には、例えば、電子機器の表面を保護するためのカバーパネルをタッチパネルモジュール又はディスプレイパネルモジュールに接着したり、タッチパネルモジュールとディスプレイパネルモジュールとを接着したりするために粘着テープが用いられている。このような粘着テープは、例えば、額縁状等の形状に打ち抜かれ、表示画面の周辺に配置されるようにして用いられる。 In an electronic device (for example, a mobile phone, a portable information terminal, etc.) equipped with an image display device or an input device, an adhesive tape is used for assembly. Specifically, for example, an adhesive tape is used to bond a cover panel for protecting the surface of an electronic device to a touch panel module or a display panel module, or to bond a touch panel module and a display panel module. Yes. Such an adhesive tape is used, for example, by being punched into a frame shape or the like and arranged around the display screen.
電子機器に用いられる粘着テープには、高い粘着力をはじめとする様々な性能が求められており、例えば、衝撃が加わった場合であっても剥がれることがなく、かつ、部品に強い衝撃が加わらない耐衝撃性も必要とされている。 Adhesive tapes used in electronic devices are required to have various performances including high adhesive strength. For example, even if an impact is applied, the tape does not peel off and a strong impact is applied to the parts. No impact resistance is needed.
近年、電子機器の小型化、表示画面の大画面化に伴って開口部面積が増大しており、それにより表示画面の周辺の接合固定部分が狭幅化している。このため、粘着テープは年々、細幅になってきており、細幅で用いられると接着面積が低下する。接着面積が低下すると、電子機器設計メーカーでの粘着力試験、落下衝撃試験等において粘着テープが合格基準値に達することが困難になるため、設計メーカーは粘着テープを希望する細幅にデザインすることが困難になりつつある。 In recent years, with the downsizing of electronic devices and the increase in the size of display screens, the area of the opening has increased, thereby narrowing the joint fixing portion around the display screen. For this reason, the pressure-sensitive adhesive tape is becoming narrower year by year, and when it is used with a narrow width, the adhesion area is lowered. If the adhesive area decreases, it becomes difficult for the adhesive tape to reach the acceptable standard value in the adhesive strength test, drop impact test, etc. at the electronic equipment design manufacturer, so the design manufacturer should design the adhesive tape to the narrow width desired. Is becoming difficult.
細幅であっても高い粘着力を維持できる粘着テープとして、感熱粘着剤からなる粘着テープが検討されている。
特許文献1には、ウレタン基、アミド基、およびアクリル基を有するポリマーからなる熱粘着性フィルムが記載されている。また、特許文献2には、ポリエステル系熱可塑性接着剤からなる感熱接着剤層表面を両面に有する両面接着シートの各表面に剥離フィルムが設けられた熱接着シートが記載されている。
しかしながら、一般的に感熱粘着剤は感圧粘着剤と比較して衝撃に弱く、落下時等に容易に剥がれてしまうという問題がある。As an adhesive tape that can maintain a high adhesive force even if it is narrow, an adhesive tape made of a heat-sensitive adhesive has been studied.
However, in general, heat-sensitive adhesives are less susceptible to impacts than pressure-sensitive adhesives and have a problem that they are easily peeled off when dropped.
本発明は、細幅であっても、加熱圧着後の粘着力が高く、優れた耐衝撃性を発揮できる携帯電子機器用両面粘着テープを提供することを目的とする。 An object of the present invention is to provide a double-sided pressure-sensitive adhesive tape for portable electronic devices that has a high adhesive strength after thermocompression bonding and can exhibit excellent impact resistance even if it is narrow.
本発明は、基材の両面に粘着剤層を有する携帯電子機器用両面粘着テープであって、少なくとも一方の粘着剤層が、ブチルアクリレートに由来する構造単位45〜90重量%と、2−エチルヘキシルアクリレートに由来する構造単位5〜40重量%とを含み、重量平均分子量が40万〜100万のアクリル共重合体100重量部と、粘着付与樹脂40〜60重量部とを含有し、23℃でのせん断弾性率G’が1.0×106〜8.0×106Paであり、前記粘着付与樹脂40〜60重量部は、軟化点が100℃以下の粘着付与樹脂(a)を5〜30重量部含有する携帯電子機器用両面粘着テープである。
以下に本発明を詳述する。The present invention is a double-sided pressure-sensitive adhesive tape for portable electronic devices having a pressure-sensitive adhesive layer on both sides of a substrate, wherein at least one pressure-sensitive adhesive layer is 45 to 90% by weight of structural units derived from butyl acrylate, and 2-ethylhexyl. Containing 5 to 40% by weight of structural units derived from acrylate, 100 parts by weight of acrylic copolymer having a weight average molecular weight of 400,000 to 1 million, and 40 to 60 parts by weight of tackifying resin, The shear modulus G ′ of the resin is 1.0 × 10 6 to 8.0 × 10 6 Pa, and 40 to 60 parts by weight of the
The present invention is described in detail below.
本発明者は、基材の両面に粘着剤層を有する携帯電子機器用両面粘着テープにおいて、少なくとも一方の粘着剤層に、特定のアクリル共重合体と特定の粘着付与樹脂とを所定量配合し、該粘着剤層の23℃でのせん断弾性率G’を特定範囲に調整することにより、細幅であっても、加熱圧着後の粘着力が高く、優れた耐衝撃性を発揮できる携帯電子機器用両面粘着テープが得られることを見出し、本発明を完成させるに至った。 In the double-sided pressure-sensitive adhesive tape for portable electronic devices having a pressure-sensitive adhesive layer on both surfaces of the substrate, the present inventor blends a predetermined amount of a specific acrylic copolymer and a specific tackifying resin in at least one pressure-sensitive adhesive layer. By adjusting the shear modulus G ′ at 23 ° C. of the pressure-sensitive adhesive layer to a specific range, even if it is narrow, the portable electronic device has high adhesive strength after thermocompression bonding and can exhibit excellent impact resistance. The inventors have found that a double-sided pressure-sensitive adhesive tape for equipment can be obtained, and have completed the present invention.
本発明の携帯電子機器用両面粘着テープ(本明細書において単に「両面粘着テープ」ともいう)は、基材の両面に粘着剤層を有する。
本発明の両面粘着テープにおいては、少なくとも一方の粘着剤層が、ブチルアクリレートに由来する構造単位45〜90重量%と、2−エチルヘキシルアクリレートに由来する構造単位5〜40重量%とを含み、重量平均分子量が40万〜100万のアクリル共重合体100重量部と、粘着付与樹脂40〜60重量部とを含有する。
上記粘着剤層をこのような組成とすることで、両面粘着テープの加熱圧着後の粘着力と、耐衝撃性とを高めることができる。The double-sided pressure-sensitive adhesive tape for portable electronic devices of the present invention (also simply referred to as “double-sided pressure-sensitive adhesive tape” in the present specification) has pressure-sensitive adhesive layers on both surfaces of a substrate.
In the double-sided pressure-sensitive adhesive tape of the present invention, at least one pressure-sensitive adhesive layer contains 45 to 90% by weight of structural units derived from butyl acrylate and 5 to 40% by weight of structural units derived from 2-ethylhexyl acrylate. It contains 100 parts by weight of an acrylic copolymer having an average molecular weight of 400,000 to 1,000,000 and 40 to 60 parts by weight of a tackifier resin.
By making the said adhesive layer into such a composition, the adhesive force after thermocompression-bonding of a double-sided adhesive tape and impact resistance can be improved.
上記アクリル共重合体は、モノマー混合物を共重合することにより調製することができる。
上記モノマー混合物は、ブチルアクリレート45〜90重量部と2−エチルヘキシルアクリレート5〜40重量部とを含んでいる。
ブチルアクリレートの含有量が45重量部未満であると、両面粘着テープの加熱圧着後の粘着力が低下する。ブチルアクリレートの含有量が90重量部を超えると、接着面に強い衝撃が加わった場合に両面粘着テープが被着体から剥がれやすくなる。
2−エチルヘキシルアクリレートの含有量が5重量部未満であると、接着面に強い衝撃が加わった場合に両面粘着テープが被着体から剥がれやすくなる。2−エチルヘキシルアクリレートの含有量が40重量部を超えると、両面粘着テープの加熱圧着後の粘着力が低下する。The acrylic copolymer can be prepared by copolymerizing a monomer mixture.
The monomer mixture contains 45 to 90 parts by weight of butyl acrylate and 5 to 40 parts by weight of 2-ethylhexyl acrylate.
If the butyl acrylate content is less than 45 parts by weight, the adhesive strength of the double-sided pressure-sensitive adhesive tape after thermocompression bonding decreases. When the content of butyl acrylate exceeds 90 parts by weight, the double-sided pressure-sensitive adhesive tape is easily peeled off from the adherend when a strong impact is applied to the adhesive surface.
When the content of 2-ethylhexyl acrylate is less than 5 parts by weight, the double-sided pressure-sensitive adhesive tape is easily peeled off from the adherend when a strong impact is applied to the adhesive surface. When content of 2-ethylhexyl acrylate exceeds 40 weight part, the adhesive force after the thermocompression bonding of a double-sided adhesive tape will fall.
上記モノマー混合物は、必要に応じてブチルアクリレート及び2−エチルヘキシルアクリレート以外の共重合可能な他の重合性モノマーを含んでいてもよい。
上記共重合可能な他の重合性モノマーとして、例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n−プロピル、(メタ)アクリル酸イソプロピル等のアルキル基の炭素数が1〜3の(メタ)アクリル酸アルキルエステル、メタクリル酸トリデシル、(メタ)アクリル酸ステアリル等のアルキル基の炭素数が13〜18の(メタ)アクリル酸アルキルエステル、(メタ)アクリル酸ヒドロキシアルキル、グリセリンジメタクリレート、(メタ)アクリル酸グリシジル、2−メタクリロイルオキシエチルイソシアネート、(メタ)アクリル酸、イタコン酸、無水マレイン酸、クロトン酸、マレイン酸、フマル酸等の官能性モノマーが挙げられる。The monomer mixture may contain other polymerizable monomers other than butyl acrylate and 2-ethylhexyl acrylate as necessary.
Examples of other polymerizable monomers that can be copolymerized include, for example, carbon number of alkyl groups such as methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and isopropyl (meth) acrylate. 1 to 3 (meth) acrylic acid alkyl ester, tridecyl methacrylate, and (meth) acrylic acid alkyl ester having 13 to 18 carbon atoms such as stearyl (meth) acrylate, hydroxyalkyl (meth) acrylate , Glycerin dimethacrylate, glycidyl (meth) acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, fumaric acid and the like.
なかでも、上記モノマー混合物は、更に、ブチルアクリレートと2−エチルヘキシルアクリレートとの合計100重量部に対して20重量部未満のエチルアクリレート又はメチルアクリレートを含むことが好ましい。上記モノマー混合物に20重量部未満のエチルアクリレート又はメチルアクリレートを添加することで、両面粘着テープの加熱圧着後の粘着力を高め、接着面に強い衝撃が加わった場合に被着体から剥がれにくくすることができる。エチルアクリレート又はメチルアクリレートの含有量の好ましい下限は5重量部、より好ましい上限は15重量部である。 Especially, it is preferable that the said monomer mixture contains further less than 20 weight part ethyl acrylate or methyl acrylate with respect to a total of 100 weight part of butyl acrylate and 2-ethylhexyl acrylate. By adding less than 20 parts by weight of ethyl acrylate or methyl acrylate to the above monomer mixture, the adhesive strength after thermocompression bonding of the double-sided adhesive tape is increased, and it is difficult to peel off from the adherend when a strong impact is applied to the adhesive surface. be able to. The minimum with preferable content of ethyl acrylate or methyl acrylate is 5 weight part, and a more preferable upper limit is 15 weight part.
上記モノマー混合物を共重合して上記アクリル共重合体を得るには、上記モノマー混合物を、重合開始剤の存在下にてラジカル反応させればよい。上記モノマー混合物をラジカル反応させる方法、即ち、重合方法としては、従来公知の方法が用いられ、例えば、溶液重合(沸点重合又は定温重合)、乳化重合、懸濁重合、塊状重合等が挙げられる。
上記重合開始剤は特に限定されず、例えば、有機過酸化物、アゾ化合物等が挙げられる。上記有機過酸化物として、例えば、1,1−ビス(t−ヘキシルパーオキシ)−3,3,5−トリメチルシクロヘキサン、t−ヘキシルパーオキシピバレート、t−ブチルパーオキシピバレート、2,5−ジメチル−2,5−ビス(2−エチルヘキサノイルパーオキシ)ヘキサン、t−ヘキシルパーオキシ−2−エチルヘキサノエート、t−ブチルパーオキシ−2−エチルヘキサノエート、t−ブチルパーオキシイソブチレート、t−ブチルパーオキシ−3,5,5−トリメチルヘキサノエート、t−ブチルパーオキシラウレート等が挙げられる。上記アゾ化合物として、例えば、アゾビスイソブチロニトリル、アゾビスシクロヘキサンカルボニトリル等が挙げられる。これらの重合開始剤は単独で用いてもよいし、2種以上を併用してもよい。In order to copolymerize the monomer mixture to obtain the acrylic copolymer, the monomer mixture may be radically reacted in the presence of a polymerization initiator. As a method of radical reaction of the monomer mixture, that is, a polymerization method, a conventionally known method is used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like.
The said polymerization initiator is not specifically limited, For example, an organic peroxide, an azo compound, etc. are mentioned. Examples of the organic peroxide include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5 -Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Examples include isobutyrate, t-butylperoxy-3,5,5-trimethylhexanoate, and t-butylperoxylaurate. Examples of the azo compound include azobisisobutyronitrile and azobiscyclohexanecarbonitrile. These polymerization initiators may be used alone or in combination of two or more.
上記アクリル共重合体の重量平均分子量(Mw)は、40万〜100万である。重量平均分子量が40万未満であると、接着面に強い衝撃が加わった場合に両面粘着テープが被着体から剥がれやすくなる。重量平均分子量が100万を超えると、両面粘着テープの加熱圧着後の粘着力が低下する。重量平均分子量の好ましい下限は50万、好ましい上限は95万であり、より好ましい下限は60万、より好ましい上限は90万である。
重量平均分子量を上記範囲に調整するためには、重合開始剤、重合温度等の重合条件を調整すればよい。
なお、重量平均分子量(Mw)とは、GPC(Gel Permeation Chromatography:ゲルパーミエーションクロマトグラフィ)による標準ポリスチレン換算の重量平均分子量である。The acrylic copolymer has a weight average molecular weight (Mw) of 400,000 to 1,000,000. When the weight average molecular weight is less than 400,000, the double-sided pressure-sensitive adhesive tape is easily peeled off from the adherend when a strong impact is applied to the adhesive surface. If the weight average molecular weight exceeds 1,000,000, the adhesive strength of the double-sided adhesive tape after thermocompression bonding will decrease. The preferable lower limit of the weight average molecular weight is 500,000, the preferable upper limit is 950,000, the more preferable lower limit is 600,000, and the more preferable upper limit is 900,000.
In order to adjust the weight average molecular weight within the above range, polymerization conditions such as a polymerization initiator and a polymerization temperature may be adjusted.
In addition, a weight average molecular weight (Mw) is a weight average molecular weight of standard polystyrene conversion by GPC (Gel Permeation Chromatography: gel permeation chromatography).
上記粘着剤層は、上記アクリル共重合体100重量部に対して、粘着付与樹脂を40〜60重量部含有する。
上記粘着付与樹脂の含有量が40重量部未満であると、両面粘着テープが加熱圧着後に充分な粘着力を発現し難くなる。粘着付与樹脂の含有量が60重量部を超えると、上記粘着剤層が脆化し、落下時等の衝撃で両面粘着テープが被着体から容易に剥がれてしまう。粘着付与樹脂の含有量の好ましい下限は45重量部、好ましい上限は55重量部である。The pressure-sensitive adhesive layer contains 40 to 60 parts by weight of a tackifier resin with respect to 100 parts by weight of the acrylic copolymer.
When the content of the tackifying resin is less than 40 parts by weight, it is difficult for the double-sided pressure-sensitive adhesive tape to exhibit sufficient adhesive strength after thermocompression bonding. When the content of the tackifying resin exceeds 60 parts by weight, the pressure-sensitive adhesive layer becomes brittle, and the double-sided pressure-sensitive adhesive tape is easily peeled off from the adherend due to an impact such as dropping. The minimum with preferable content of tackifying resin is 45 weight part, and a preferable upper limit is 55 weight part.
上記粘着付与樹脂40〜60重量部は、軟化点が100℃以下の粘着付与樹脂(a)を5〜30重量部含有する。なお、軟化点とは、JIS K2207環球法により測定した軟化点である。
上記軟化点が100℃以下の粘着付与樹脂(a)の含有量が5重量部未満であると、上記粘着剤層の柔軟性が低下し、落下時等の衝撃で両面粘着テープが被着体から容易に剥がれてしまう。上記軟化点が100℃以下の粘着付与樹脂(a)の含有量が30重量部を超えると、上記粘着剤層が過度に柔軟になり、両面粘着テープが加熱圧着後に充分な粘着力を発現し難くなる。上記軟化点が100℃以下の粘着付与樹脂(a)の含有量の好ましい上限は25重量部である。40 to 60 parts by weight of the tackifying resin contains 5 to 30 parts by weight of a tackifying resin (a) having a softening point of 100 ° C. or less. The softening point is a softening point measured by the JIS K2207 ring and ball method.
When the content of the tackifying resin (a) having a softening point of 100 ° C. or less is less than 5 parts by weight, the flexibility of the pressure-sensitive adhesive layer is lowered, and the double-sided pressure-sensitive adhesive tape is adhered to the adherend by an impact such as dropping. Easily peels off. When the content of the tackifying resin (a) having a softening point of 100 ° C. or less exceeds 30 parts by weight, the pressure-sensitive adhesive layer becomes excessively flexible, and the double-sided pressure-sensitive adhesive tape exhibits sufficient adhesive strength after thermocompression bonding. It becomes difficult. The upper limit with preferable content of the tackifying resin (a) whose softening point is 100 degrees C or less is 25 weight part.
上記軟化点が100℃以下の粘着付与樹脂(a)の軟化点を100℃以下とすることで、上記粘着剤層のもつ耐衝撃性及び柔軟性を維持したまま、加熱圧着後の粘着力を高めることができる。
なかでも、上記軟化点が100℃以下の粘着付与樹脂(a)は、軟化点が80℃以下であることが好ましい。軟化点を80℃以下とすることで、上記粘着剤層の耐衝撃性をより高めることができる。By setting the softening point of the tackifier resin (a) having a softening point of 100 ° C. or lower to 100 ° C. or lower, the adhesive strength after thermocompression bonding can be maintained while maintaining the impact resistance and flexibility of the pressure-sensitive adhesive layer. Can be increased.
Especially, it is preferable that the softening point is 80 degrees C or less about the tackifying resin (a) whose said softening point is 100 degrees C or less. By setting the softening point to 80 ° C. or less, the impact resistance of the pressure-sensitive adhesive layer can be further increased.
上記粘着付与樹脂は、ロジン系粘着付与樹脂及び/又はテルペン系粘着付与樹脂を含有することが好ましい。ただし、ロジン系粘着付与樹脂及び/又はテルペン系粘着付与樹脂のほかにも、上記粘着付与樹脂として、例えば、クマロンインデン系樹脂、脂環族飽和炭化水素系樹脂、C5系石油樹脂、C9系石油樹脂、C5−C9共重合系石油樹脂等が挙げられる。
上記ロジン系粘着付与樹脂は特に限定されないが、ロジンエステル系樹脂が好ましい。上記ロジンエステル系樹脂とは、アビエチン酸を主成分とするロジン樹脂、不均化ロジン樹脂及び水添ロジン樹脂、並びに、アビエチン酸等の樹脂酸の二量体(重合ロジン樹脂)等を、アルコール類によってエステル化させて得られる樹脂である。
ロジン樹脂をエステル化したものがロジンエステル樹脂、不均化ロジン樹脂をエステル化したものが不均化ロジンエステル樹脂、水添ロジン樹脂をエステル化したものが水添ロジンエステル樹脂、重合ロジン樹脂をエステル化したものが重合ロジンエステル樹脂である。上記エステル化に使用されるアルコール類としては、エチレングリコール、グリセリン、ペンタエリスリトール等の多価アルコールが挙げられる。The tackifier resin preferably contains a rosin tackifier resin and / or a terpene tackifier resin. However, in addition to rosin-based tackifier resins and / or terpene-based tackifier resins, examples of the tackifier resins include coumarone indene resins, alicyclic saturated hydrocarbon resins, C5-based petroleum resins, and C9-based resins. Examples thereof include petroleum resins and C5-C9 copolymer petroleum resins.
The rosin-based tackifying resin is not particularly limited, but a rosin ester-based resin is preferable. The rosin ester-based resin includes a rosin resin mainly composed of abietic acid, a disproportionated rosin resin and a hydrogenated rosin resin, and a dimer (polymerized rosin resin) of a resin acid such as abietic acid. It is a resin obtained by esterification with a kind.
Esterified rosin resin is rosin ester resin, disproportionated rosin resin is esterified disproportionated rosin ester resin, hydrogenated rosin resin is esterified hydrogenated rosin ester resin, polymerized rosin resin The esterified product is a polymerized rosin ester resin. Examples of the alcohols used for the esterification include polyhydric alcohols such as ethylene glycol, glycerin, and pentaerythritol.
上記水添ロジンエステル樹脂として、例えば、荒川化学工業社製パインクリスタルKE−359(水酸基価42、軟化温度100℃)、同社製エステルガムH(水酸基価29、軟化温度68℃)等が挙げられる。
上記重合ロジンエステル樹脂として、例えば、荒川化学工業社製ペンセルD135(水酸基価45、軟化温度135℃)、同社製ペンセルD130(水酸基価45、軟化温度130℃)、同社製ペンセルD125(水酸基価34、軟化温度125℃)、同社製ペンセルD160(水酸基価42、軟化温度160℃)等が挙げられる。
これらのロジン系粘着付与樹脂は、単独で用いてもよく、2種以上を併用してもよい。Examples of the hydrogenated rosin ester resin include Pine Crystal KE-359 (hydroxyl value 42, softening temperature 100 ° C.) manufactured by Arakawa Chemical Industries, and ester gum H (hydroxyl value 29, softening temperature 68 ° C.) manufactured by the same company. .
Examples of the polymerized rosin ester resin include Pencel D135 (hydroxyl value 45, softening temperature 135 ° C.) manufactured by Arakawa Chemical Industries, Pencel D130 (hydroxyl value 45, softening temperature 130 ° C.) manufactured by Arakawa Chemical Co., Ltd. , Softening temperature 125 ° C.), Pencel D160 (hydroxyl value 42, softening temperature 160 ° C.) manufactured by the same company.
These rosin-based tackifier resins may be used alone or in combination of two or more.
上記テルペン系粘着付与樹脂は特に限定されないが、テルペンフェノール系樹脂が好ましい。上記テルペンフェノール系樹脂とは、フェノールの存在下においてテルペンを重合させて得られた樹脂である。
上記テルペン系粘着付与樹脂として、例えば、ヤスハラケミカル社製YSポリスターG150(軟化点150℃)、同社製YSポリスターT100(軟化点100℃)、同社製YSポリスターG125(軟化点125℃)、YSポリスターT115(軟化点115℃)、同社製YSポリスターT130(軟化点130℃)等が挙げられる。The terpene-based tackifier resin is not particularly limited, but a terpene phenol-based resin is preferable. The terpene phenol-based resin is a resin obtained by polymerizing terpene in the presence of phenol.
As the terpene-based tackifying resin, for example, YS Polystar G150 (softening point 150 ° C.) manufactured by Yashara Chemical Co., Ltd. YS Polystar T100 (softening point 100 ° C.) manufactured by Yasuhara Chemical Co., Ltd. YS Polystar G125 (softening point 125 ° C.) manufactured by Yasuhara Chemical Co. (Softening point 115 ° C.), YS Polystar T130 (softening point 130 ° C.) manufactured by the same company.
上記粘着剤層は、架橋剤が添加されることにより上記粘着剤層を構成する樹脂(上記アクリル共重合体及び/又は上記粘着付与樹脂)の主鎖間に架橋構造が形成されていることが好ましい。
上記架橋剤は特に限定されず、例えば、イソシアネート系架橋剤、アジリジン系架橋剤、エポキシ系架橋剤、金属キレート型架橋剤等が挙げられる。なかでも、イソシアネート系架橋剤が好ましい。上記粘着剤層にイソシアネート系架橋剤が添加されることで、イソシアネート系架橋剤のイソシアネート基と上記粘着剤層を構成する樹脂中のアルコール性水酸基とが反応して、上記粘着剤層の架橋が緩くなる。従って、上記粘着剤層は、断続的に加わる剥離応力を分散させることができ、強い衝撃が加わった場合に被着体の変形に伴って生じる剥離応力に対し、被着体からの剥離耐性がより向上する。
上記架橋剤の添加量は、上記アクリル共重合体100重量部に対して0.1〜15重量部が好ましく、1〜10重量部がより好ましい。In the pressure-sensitive adhesive layer, a crosslinking structure may be formed between main chains of the resin (the acrylic copolymer and / or the tackifying resin) constituting the pressure-sensitive adhesive layer by adding a crosslinking agent. preferable.
The said crosslinking agent is not specifically limited, For example, an isocyanate type crosslinking agent, an aziridine type crosslinking agent, an epoxy-type crosslinking agent, a metal chelate type crosslinking agent etc. are mentioned. Of these, isocyanate-based crosslinking agents are preferred. By adding an isocyanate-based crosslinking agent to the pressure-sensitive adhesive layer, the isocyanate group of the isocyanate-based crosslinking agent reacts with the alcoholic hydroxyl group in the resin constituting the pressure-sensitive adhesive layer, thereby cross-linking the pressure-sensitive adhesive layer. It becomes loose. Therefore, the pressure-sensitive adhesive layer can disperse the peeling stress applied intermittently, and has a resistance to peeling from the adherend against the peeling stress caused by the deformation of the adherend when a strong impact is applied. More improved.
The addition amount of the crosslinking agent is preferably 0.1 to 15 parts by weight and more preferably 1 to 10 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
上記粘着剤層の架橋度(ゲル分率)は、高すぎても低すぎても、上記粘着剤層が被着体の変形に伴って生じる剥離応力によって被着体から剥離しやすくなることがあるので、5〜60重量%が好ましく、10〜50重量%がより好ましく、20〜45重量%が特に好ましい。
なお、粘着剤層の架橋度(ゲル分率)は、粘着剤層をW1(g)採取し、この粘着剤層を酢酸エチル中に23℃にて24時間浸漬して不溶解分を200メッシュの金網で濾過し、金網上の残渣を真空乾燥して乾燥残渣の重量W2(g)を測定し、下記式(1)により算出する。
架橋度(ゲル分率)(重量%)=100×W2/W1 (1)Even if the degree of cross-linking (gel fraction) of the pressure-sensitive adhesive layer is too high or too low, the pressure-sensitive adhesive layer can be easily peeled off from the adherend due to the peeling stress caused by the deformation of the adherend. Therefore, 5 to 60% by weight is preferable, 10 to 50% by weight is more preferable, and 20 to 45% by weight is particularly preferable.
The degree of cross-linking (gel fraction) of the pressure-sensitive adhesive layer was determined by collecting W1 (g) of the pressure-sensitive adhesive layer and immersing this pressure-sensitive adhesive layer in ethyl acetate at 23 ° C. for 24 hours to give an insoluble content of 200 mesh. The residue on the wire mesh is vacuum-dried, and the weight W2 (g) of the dry residue is measured and calculated by the following formula (1).
Cross-linking degree (gel fraction) (% by weight) = 100 × W2 / W1 (1)
上記粘着剤層は、23℃でのせん断弾性率G’が1.0×106〜8.0×106Paである。上記粘着剤層の23℃でのせん断弾性率G’を上記範囲に調整することで、両面粘着テープの常温における耐衝撃性を高めることができる。
上記23℃でのせん断弾性率G’が1.0×106Pa未満であると、両面粘着テープが加熱圧着後に充分な粘着力を発現し難くなる。上記23℃でのせん断弾性率G’が8.0×106Paを超えると、上記粘着剤層の柔軟性が低下し、落下時等の衝撃で両面粘着テープが被着体から容易に剥がれてしまう。また、上記粘着剤層の初期タックが低下し、両面粘着テープの打ち抜き加工時に上記粘着剤層に貼り合わせた離型紙に対する接着力が低下し、加工性が著しく低下する。上記23℃でのせん断弾性率G’の好ましい下限は1.1×106Pa、好ましい上限は7.0×106Paであり、より好ましい下限は1.2×106Pa、より好ましい上限は6.0×106Paである。
なお、23℃でのせん断弾性率G’とは、例えば、アイティー計測制御社製のDVA−200等を用いて、測定周波数10Hzにて測定した値である。The pressure-sensitive adhesive layer has a shear elastic modulus G ′ at 23 ° C. of 1.0 × 10 6 to 8.0 × 10 6 Pa. By adjusting the shear elastic modulus G ′ at 23 ° C. of the pressure-sensitive adhesive layer within the above range, the impact resistance of the double-sided pressure-sensitive adhesive tape at room temperature can be enhanced.
When the shear elastic modulus G ′ at 23 ° C. is less than 1.0 × 10 6 Pa, the double-sided pressure-sensitive adhesive tape hardly exhibits sufficient adhesive strength after thermocompression bonding. When the shear elastic modulus G ′ at 23 ° C. exceeds 8.0 × 10 6 Pa, the flexibility of the pressure-sensitive adhesive layer is lowered, and the double-sided pressure-sensitive adhesive tape is easily peeled off from the adherend due to an impact such as dropping. End up. In addition, the initial tack of the pressure-sensitive adhesive layer is reduced, the adhesive force to the release paper bonded to the pressure-sensitive adhesive layer during punching of the double-sided pressure-sensitive adhesive tape is reduced, and the workability is significantly reduced. The preferred lower limit of the shear modulus G ′ at 23 ° C. is 1.1 × 10 6 Pa, the preferred upper limit is 7.0 × 10 6 Pa, and the more preferred lower limit is 1.2 × 10 6 Pa, the more preferred upper limit. Is 6.0 × 10 6 Pa.
The shear modulus G ′ at 23 ° C. is a value measured at a measurement frequency of 10 Hz using, for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.
上記粘着剤層の23℃でのせん断弾性率G’を上記範囲に調整するには、上述したような範囲内で上記粘着剤層の組成を調整すればよい。 In order to adjust the shear elastic modulus G ′ at 23 ° C. of the pressure-sensitive adhesive layer to the above range, the composition of the pressure-sensitive adhesive layer may be adjusted within the above range.
上記粘着剤層は、液晶ディスプレイ(LCD)等の表示画面からの光を遮光する目的で、着色されていてもよい。上記粘着剤層を着色するために用いられる着色顔料は特に限定されず、例えば、カーボンブラック、酸化チタン等が挙げられる。 The pressure-sensitive adhesive layer may be colored for the purpose of shielding light from a display screen such as a liquid crystal display (LCD). The color pigment used for coloring the pressure-sensitive adhesive layer is not particularly limited, and examples thereof include carbon black and titanium oxide.
上記粘着剤層の厚みは特に限定されないが、粘着剤層の厚み(片面の粘着剤層の厚み)が10〜150μmであることが好ましい。厚みが10μm未満であると、上記粘着剤層は、耐衝撃性が低下することがある。厚みが150μmを超えると、上記粘着剤層は、リワーク性又は加工性が損なわれることがある。 Although the thickness of the said adhesive layer is not specifically limited, It is preferable that the thickness (thickness of the adhesive layer of one side) of an adhesive layer is 10-150 micrometers. When the thickness is less than 10 μm, the pressure-sensitive adhesive layer may have reduced impact resistance. When the thickness exceeds 150 μm, the pressure-sensitive adhesive layer may have impaired reworkability or workability.
本発明の両面粘着テープにおいては、少なくとも一方の粘着剤層が上述したような粘着剤層であれば、両面の粘着剤層が同じ組成であってもよいし、それぞれ異なる組成であってもよい。 In the double-sided pressure-sensitive adhesive tape of the present invention, as long as at least one pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer as described above, the double-sided pressure-sensitive adhesive layers may have the same composition or may have different compositions. .
上記基材は特に限定されず、例えば、比較的剛性の高い樹脂フィルム、比較的剛性の低い樹脂フィルム、シート状発泡体等が挙げられる。
上記比較的剛性の高い樹脂フィルムは特に限定されず、例えば、ポリエチレンテレフタレート(PET)フィルム、軸延伸ポリプロピレン(OPP)フィルム等が挙げられる。本発明の両面粘着テープは、上述したような粘着剤層を有することから、上記基材がこのような比較的剛性が高く自身の衝撃吸収性が低い樹脂フィルムである場合であっても、充分な加熱圧着後の粘着力と、耐衝撃性とを有することができる。The said base material is not specifically limited, For example, a resin film with comparatively high rigidity, a resin film with comparatively low rigidity, a sheet-like foam etc. are mentioned.
The resin film having relatively high rigidity is not particularly limited, and examples thereof include a polyethylene terephthalate (PET) film and an axially stretched polypropylene (OPP) film. Since the double-sided pressure-sensitive adhesive tape of the present invention has the pressure-sensitive adhesive layer as described above, it is sufficient even when the base material is a resin film having such a relatively high rigidity and a low impact absorption. It is possible to have adhesive strength after heat and pressure bonding and impact resistance.
上記比較的剛性の高い樹脂フィルムの厚みは特に限定されないが、5〜100μmが好ましい。上記厚みが5μm未満であると、上記基材は、強度が低下し、強い衝撃が加わった場合に破壊したり、打ち抜き加工性が低下したりすることがある。上記厚みが100μmを超えると、上記基材は、柔軟性が低下し、強い衝撃が加わった場合に上記粘着剤層との界面で剥離することがあり、また、両面粘着テープを被着体の形状に沿って密着させて貼り合わせることが困難になることがある。 The thickness of the relatively rigid resin film is not particularly limited, but is preferably 5 to 100 μm. When the thickness is less than 5 μm, the base material may have a reduced strength, and may be broken or subjected to punching workability when a strong impact is applied. When the thickness exceeds 100 μm, the base material is reduced in flexibility, and may be peeled off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied, and the double-sided pressure-sensitive adhesive tape is attached to the adherend. It may be difficult to stick together along the shape.
上記基材が上記比較的剛性の低い樹脂フィルム又はシート状発泡体である場合は、上記基材自身が緩衝性を有するため、両面粘着テープの耐衝撃性を更に高めることができる。
上記比較的剛性の低い樹脂フィルムは特に限定されず、例えば、ゴム系又はウレタン系の樹脂フィルム等が挙げられる。When the base material is the resin film or sheet-like foam having a relatively low rigidity, the base material itself has a buffer property, so that the impact resistance of the double-sided pressure-sensitive adhesive tape can be further improved.
The resin film having relatively low rigidity is not particularly limited, and examples thereof include rubber-based or urethane-based resin films.
上記シート状発泡体としては特にポリオレフィン発泡体が好ましい。
上記ポリオレフィン発泡体は、ポリオレフィン系樹脂を含む発泡体であれば特に限定されず、例えば、ポリエチレン系発泡体、ポリプロピレン系発泡体、エチレン−プロピレン系発泡体等が挙げられるが、耐衝撃性が向上することから、重合触媒として四価の遷移金属を含むメタロセン化合物を用いて得られたポリオレフィン系樹脂を含む発泡体(本明細書において「メタロセン系ポリオレフィン発泡体」ともいう)が好ましい。なかでも、メタロセン化合物を用いて得られたポリエチレン系樹脂を含む発泡体(本明細書において「メタロセン系ポリエチレン発泡体」ともいう)がより好ましい。
上記メタロセン化合物として、例えば、カミンスキー触媒等が挙げられる。As the sheet-like foam, a polyolefin foam is particularly preferable.
The polyolefin foam is not particularly limited as long as it is a foam containing a polyolefin resin, and examples thereof include a polyethylene foam, a polypropylene foam, an ethylene-propylene foam, and the impact resistance is improved. Therefore, a foam containing a polyolefin resin obtained by using a metallocene compound containing a tetravalent transition metal as a polymerization catalyst (also referred to as “metallocene polyolefin foam” in the present specification) is preferable. Among these, a foam containing a polyethylene resin obtained by using a metallocene compound (also referred to as “metallocene polyethylene foam” in the present specification) is more preferable.
Examples of the metallocene compounds include Kaminsky catalysts.
上記メタロセン系ポリエチレン発泡体に含まれる上記メタロセン化合物を用いて得られたポリエチレン系樹脂として、例えば、上記メタロセン化合物を用いて、エチレンと、必要に応じて配合される他のα−オレフィンとを共重合することにより得られたポリエチレン系樹脂等が挙げられる。上記他のα−オレフィンとして、例えば、プロペン、1−ブテン、1−ペンテン、1−ヘキセン等が挙げられる。 As a polyethylene resin obtained using the metallocene compound contained in the metallocene polyethylene foam, for example, using the metallocene compound, ethylene and another α-olefin blended as necessary may be used. Examples thereof include polyethylene-based resins obtained by polymerization. Examples of the other α-olefin include propene, 1-butene, 1-pentene, 1-hexene and the like.
上記メタロセン系ポリエチレン発泡体は、上記メタロセン化合物を用いて得られたポリエチレン系樹脂に加えて、更に、他のオレフィン系樹脂を含んでいてもよい。上記他のオレフィン系樹脂として、例えば、ポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体等が挙げられる。
なお、この場合、上記メタロセン系ポリエチレン発泡体における上記メタロセン化合物を用いて得られたポリエチレン系樹脂の含有量は、40重量%以上が好ましい。上記メタロセン化合物を用いて得られたポリエチレン系樹脂の含有量が40重量%以上であると、上記メタロセン系ポリエチレン発泡体の厚みが薄くても高い圧縮強度を得ることができる。The metallocene polyethylene foam may further contain another olefin resin in addition to the polyethylene resin obtained using the metallocene compound. Examples of the other olefin-based resin include polyethylene, polypropylene, ethylene-propylene copolymer, and the like.
In this case, the content of the polyethylene resin obtained by using the metallocene compound in the metallocene polyethylene foam is preferably 40% by weight or more. When the content of the polyethylene resin obtained by using the metallocene compound is 40% by weight or more, high compressive strength can be obtained even if the metallocene polyethylene foam is thin.
上記ポリオレフィン発泡体は、架橋されていることが好ましい。上記ポリオレフィン発泡体を架橋することで、耐衝撃性を向上させることができる。
上記ポリオレフィン発泡体を架橋する方法は特に限定されず、例えば、上記ポリオレフィン発泡体に電子線、α線、β線、γ線等の電離性放射線を照射する方法、上記ポリオレフィン発泡体に予め配合しておいた有機過酸化物を加熱により分解させる方法等が挙げられる。The polyolefin foam is preferably cross-linked. By cross-linking the polyolefin foam, impact resistance can be improved.
The method for crosslinking the polyolefin foam is not particularly limited. For example, a method of irradiating the polyolefin foam with ionizing radiation such as electron beam, α ray, β ray, γ ray, Examples include a method of decomposing the organic peroxide by heating.
上記ポリオレフィン発泡体の製造方法は特に限定されないが、ポリオレフィン系樹脂と発泡剤とを含有する発泡性樹脂組成物を調製し、この発泡性樹脂組成物を押出機を用いてシート状に押出加工する際に発泡剤を発泡させ、得られたポリオレフィン発泡体を必要に応じて架橋する方法が好ましい。 The method for producing the polyolefin foam is not particularly limited, but a foamable resin composition containing a polyolefin resin and a foaming agent is prepared, and the foamable resin composition is extruded into a sheet using an extruder. In this case, it is preferable to foam the foaming agent and crosslink the obtained polyolefin foam as necessary.
上記シート状発泡体の厚みは特に限定されないが、60〜300μmが好ましい。厚みが60μm未満であると、上記基材は、強度が低下し、強い衝撃が加わった場合に破壊することがある。厚みが300μmを超えると、上記基材は、柔軟性が低下し、強い衝撃が加わった場合に上記粘着剤層との界面で剥離することがあり、また、両面粘着テープを被着体の形状に沿って密着させて貼り合わせることが困難になることがある。 Although the thickness of the said sheet-like foam is not specifically limited, 60-300 micrometers is preferable. When the thickness is less than 60 μm, the substrate may be broken when strength is lowered and a strong impact is applied. When the thickness exceeds 300 μm, the base material is reduced in flexibility and may peel off at the interface with the pressure-sensitive adhesive layer when a strong impact is applied. It may be difficult to adhere and adhere together.
本発明の両面粘着テープは、幅1mmの額縁状に打ち抜き、70℃でアルミ板に加熱圧着した後の常温におけるプッシュ粘着力が120N以上であることが好ましい。
上記プッシュ粘着力が上記範囲内であれば、通常の感圧粘着剤からなる両面粘着テープの2mm幅における粘着力と同等以上の粘着力を、半分の幅(1mm幅)で達成していることになり、細幅化した場合であっても電子機器設計メーカーでの粘着力試験、落下衝撃試験等において両面粘着テープが合格基準値に達しやすくなる。また、両面粘着テープが強接着することにより、経時での被着体(例えば、前面板(カバーパネル)又は部品)の浮き又は剥がれを抑制できる。上記プッシュ粘着力は125N以上がより好ましく、130N以上が更に好ましい。
なお、幅1mmの額縁状に打ち抜き、70℃でアルミ板に加熱圧着した後の常温におけるプッシュ粘着力とは、次に説明するような図2に示す方法により測定した値である。The double-sided pressure-sensitive adhesive tape of the present invention preferably has a push adhesive strength at room temperature of 120 N or more after being punched into a frame shape having a width of 1 mm and thermocompression bonded to an aluminum plate at 70 ° C.
If the push adhesive strength is within the above range, the adhesive strength equal to or better than the adhesive strength in the 2 mm width of the double-sided adhesive tape made of a normal pressure-sensitive adhesive is achieved with a half width (1 mm width). Thus, even when the width is reduced, the double-sided adhesive tape easily reaches the acceptable standard value in an adhesive strength test, a drop impact test or the like at an electronic device design manufacturer. Further, when the double-sided pressure-sensitive adhesive tape is strongly bonded, it is possible to suppress the floating or peeling of the adherend (eg, front plate (cover panel) or component) over time. The push adhesive force is more preferably 125N or more, and further preferably 130N or more.
The push adhesive strength at room temperature after punching into a frame shape with a width of 1 mm and thermocompression bonding to an aluminum plate at 70 ° C. is a value measured by the method shown in FIG. 2 as described below.
図2に、両面粘着テープのプッシュ試験の模式図を示す。まず、両面粘着テープを外径が幅46mm、長さ61mm、内径が幅44mm、長さ59mmに打ち抜き、幅1mmの額縁状の試験片を作製する。次いで、図2(a)に示すように、中央部分に幅38mm、長さ50mmの四角い穴のあいた厚さ2mmのポリカーボネート板3に対して離型紙を剥がした試験片1を四角い穴がほぼ中央に位置するように貼り付けた後、試験片1の上面から幅55mm、長さ65mm、厚さ2mmのアルミ板5を試験片1がほぼ中央に位置するように貼り付け、試験装置を組み立てる。
その後、試験装置の上面に位置するアルミ板5側から70℃で30kgfの圧力を10秒間加えて上下に位置するアルミ板及びポリカーボネート板と試験片とを加熱圧着し、常温で24時間放置する。
上記プッシュ試験の判定は、図2(b)に示すように、作製した試験装置を裏返して支持台に固定し、開口部側から10mm/minの速度で下面のアルミ板5を押していき、アルミ板5が剥がれたときの荷重を測定することで行うことができる。測定温度は常温であれば特に限定されず、例えば、23℃等が挙げられる。In FIG. 2, the schematic diagram of the push test of a double-sided adhesive tape is shown. First, a double-sided adhesive tape is punched into an outer diameter of 46 mm, a length of 61 mm, an inner diameter of 44 mm, and a length of 59 mm to produce a frame-shaped test piece having a width of 1 mm. Next, as shown in FIG. 2 (a), the square hole is approximately in the center of the
Thereafter, a pressure of 30 kgf is applied at 70 ° C. for 10 seconds from the side of the
As shown in FIG. 2 (b), the push test is determined by turning the manufactured test apparatus upside down and fixing it to the support base, and pushing the
本発明の両面粘着テープは、両面粘着テープの総厚みが100〜400μmであることが好ましい。総厚みが100μm未満であると、両面粘着テープは、耐衝撃性が低下することがある。総厚みが400μmを超えると、両面粘着テープは、電子機器を構成する部品を機器本体に接着固定する用途に適さないことがある。 As for the double-sided adhesive tape of this invention, it is preferable that the total thickness of a double-sided adhesive tape is 100-400 micrometers. When the total thickness is less than 100 μm, the impact resistance of the double-sided pressure-sensitive adhesive tape may be lowered. When the total thickness exceeds 400 μm, the double-sided pressure-sensitive adhesive tape may not be suitable for use in bonding and fixing components constituting the electronic device to the device main body.
本発明の両面粘着テープの製造方法として、例えば、以下のような方法が挙げられる。
まず、アクリル共重合体、粘着付与樹脂、必要に応じて架橋剤等に溶剤を加えて粘着剤Aの溶液を作製して、この粘着剤Aの溶液を離型フィルムの離型処理面に塗布し、溶液中の溶剤を完全に乾燥除去して粘着剤層Aを形成する。次に、形成された粘着剤層Aの表面に対して基材を貼り合わせる。
次いで、上記離型フィルムとは別の離型フィルムを用意し、この離型フィルムの離型処理面に粘着剤Bの溶液を塗布し、溶液中の溶剤を完全に乾燥除去することにより、離型フィルムの表面に粘着剤層Bが形成された積層フィルムを作製する。得られた積層フィルムを粘着剤層Aが形成された基材の裏面に、粘着剤層Bが基材の裏面に対向した状態に重ね合わせて積層体を作製する。そして、上記積層体をゴムローラ等によって加圧することによって、基材の両面に粘着剤層を有し、かつ、粘着剤層の表面が離型フィルムで覆われた両面粘着テープを得ることができる。As a manufacturing method of the double-sided adhesive tape of this invention, the following methods are mentioned, for example.
First, a solution of adhesive A is prepared by adding a solvent to an acrylic copolymer, a tackifier resin, and a cross-linking agent as necessary, and this adhesive A solution is applied to the release treatment surface of the release film. Then, the solvent in the solution is completely removed by drying to form the pressure-sensitive adhesive layer A. Next, a substrate is bonded to the surface of the formed pressure-sensitive adhesive layer A.
Next, a release film different from the above release film is prepared, the adhesive B solution is applied to the release treatment surface of the release film, and the solvent in the solution is completely removed by drying, thereby releasing the release film. A laminated film in which the pressure-sensitive adhesive layer B is formed on the surface of the mold film is produced. The obtained laminated film is laminated on the back surface of the base material on which the pressure-sensitive adhesive layer A is formed, with the pressure-sensitive adhesive layer B facing the back surface of the base material to produce a laminate. And by pressing the said laminated body with a rubber roller etc., the double-sided adhesive tape which has an adhesive layer on both surfaces of a base material, and the surface of the adhesive layer was covered with the release film can be obtained.
また、同様の要領で積層フィルムを2組作製し、これらの積層フィルムを基材の両面のそれぞれに、積層フィルムの粘着剤層を基材に対向させた状態に重ね合わせて積層体を作製し、この積層体をゴムローラ等によって加圧することによって、基材の両面に粘着剤層を有し、かつ、粘着剤層の表面が離型フィルムで覆われた両面粘着テープを得てもよい。 In addition, two sets of laminated films are produced in the same manner, and a laminated body is produced by superposing these laminated films on both sides of the base material with the adhesive layer of the laminated film facing the base material. By pressing the laminate with a rubber roller or the like, a double-sided pressure-sensitive adhesive tape having an adhesive layer on both surfaces of the base material and having the surface of the adhesive layer covered with a release film may be obtained.
本発明の両面粘着テープの用途は特に限定されないが、電子機器(例えば、携帯電話、携帯情報端末等)を構成する部品を機器本体に接着固定する用途が好ましい。具体的には、本発明の両面粘着テープは、例えば、電子機器(例えば、携帯電話、携帯情報端末等)の液晶表示パネルを機器本体に接着固定する両面粘着テープとして用いることができる。
また、これらの用途における本発明の両面粘着テープの形状は特に限定されないが、長方形、額縁状、円形、楕円形、ドーナツ型等が挙げられる。The application of the double-sided pressure-sensitive adhesive tape of the present invention is not particularly limited, but an application in which components constituting an electronic device (for example, a mobile phone, a portable information terminal, etc.) are bonded and fixed to the device body is preferable. Specifically, the double-sided pressure-sensitive adhesive tape of the present invention can be used as, for example, a double-sided pressure-sensitive adhesive tape for bonding and fixing a liquid crystal display panel of an electronic device (for example, a mobile phone, a portable information terminal, etc.) to the device body.
Moreover, the shape of the double-sided pressure-sensitive adhesive tape of the present invention in these applications is not particularly limited, and examples thereof include a rectangle, a frame shape, a circle, an ellipse, and a donut shape.
本発明によれば、細幅であっても、加熱圧着後の粘着力が高く、優れた耐衝撃性を発揮できる携帯電子機器用両面粘着テープを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, even if it is narrow, the adhesive force after thermocompression bonding is high, and the double-sided adhesive tape for portable electronic devices which can exhibit the outstanding impact resistance can be provided.
以下に実施例を挙げて本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されない。 EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited to these examples.
(実施例1)
(1)粘着剤溶液の調製
温度計、攪拌機、冷却管を備えた反応器に表1に示すモノマーと酢酸エチルとを加え、窒素置換した後、反応器を加熱して還流を開始した。続いて、上記反応器内に、重合開始剤としてアゾビスイソブチロニトリル0.1重量部を添加した。70℃、5時間還流させて、アクリル共重合体の溶液を得た。得られたアクリル共重合体について、カラムとしてWater社製「2690 Separations Model」を用いてGPC法により重量平均分子量を測定した。
得られたアクリル共重合体の溶液に含まれるアクリル共重合体の固形分100重量部に対して、表1に示す所定量の粘着付与樹脂を添加し、酢酸エチル125重量部を加え攪拌し、更に表1に示すイソシアネート系架橋剤(日本ポリウレタン工業社製「コロネート L−45」)を添加し、攪拌して、アクリル粘着剤が酢酸エチルに溶解した粘着剤溶液を得た。Example 1
(1) Preparation of pressure-sensitive adhesive solution To a reactor equipped with a thermometer, a stirrer, and a condenser, the monomers and ethyl acetate shown in Table 1 were added and purged with nitrogen, and then the reactor was heated to start refluxing. Subsequently, 0.1 part by weight of azobisisobutyronitrile was added as a polymerization initiator in the reactor. The mixture was refluxed at 70 ° C. for 5 hours to obtain an acrylic copolymer solution. About the obtained acrylic copolymer, the weight average molecular weight was measured by GPC method using "2690 Separations Model" made from Water as a column.
A predetermined amount of tackifying resin shown in Table 1 is added to 100 parts by weight of the solid content of the acrylic copolymer contained in the obtained acrylic copolymer solution, and 125 parts by weight of ethyl acetate is added and stirred. Furthermore, the isocyanate type crosslinking agent ("Coronate L-45" by Nippon Polyurethane Industry Co., Ltd.) shown in Table 1 was added and stirred to obtain a pressure-sensitive adhesive solution in which the acrylic pressure-sensitive adhesive was dissolved in ethyl acetate.
なお、実施例及び比較例で用いた粘着付与樹脂を以下に示した。
(軟化点が100℃以下の粘着付与樹脂(a))
・水添ロジンエステル樹脂A(荒川化学工業社製、商品名「エステルガムH」、軟化点68℃)
・不均化ロジンエステル樹脂B(荒川化学工業社製、商品名「スーパーエステルA−75」、軟化点75℃)
・水添ロジンエステル樹脂C(荒川化学工業社製、商品名「エステルガムHP」、軟化点80℃)
・水添ロジンエステル樹脂D(荒川化学工業社製、商品名「パインクリスタルKE−359」、軟化点100℃)The tackifying resins used in the examples and comparative examples are shown below.
(Tackifying resin having a softening point of 100 ° C. or lower (a))
・ Hydrogenated rosin ester resin A (Arakawa Chemical Industries, trade name “Ester gum H”, softening point 68 ° C.)
Disproportionated rosin ester resin B (Arakawa Chemical Industries, trade name “Super Ester A-75”, softening point 75 ° C.)
・ Hydrogenated rosin ester resin C (Arakawa Chemical Industries, trade name “Ester gum HP”, softening point 80 ° C.)
・ Hydrogenated rosin ester resin D (Arakawa Chemical Industries, trade name “Pine Crystal KE-359”, softening point 100 ° C.)
(その他の粘着付与樹脂)
・不均化ロジンエステル樹脂E(荒川化学工業社製、商品名「スーパーエステルA−115」、軟化点115℃)
・重合ロジンエステル樹脂F(荒川化学工業社製、商品名「ペンセルD−135」、軟化点135℃)
・重合ロジンエステル樹脂G(荒川化学工業社製、商品名「ペンセルD−160」、軟化点160℃)
・テルペンフェノール樹脂H(ヤスハラケミカル社製、商品名「YSポリスターT130」、軟化点130℃)
・テルペンフェノール樹脂I(ヤスハラケミカル社製、商品名「マイティーエースG150」、軟化点150℃)(Other tackifying resins)
Disproportionated rosin ester resin E (Arakawa Chemical Industries, trade name “Super Ester A-115”, softening point 115 ° C.)
Polymerized rosin ester resin F (Arakawa Chemical Industries, trade name “Pencel D-135”, softening point 135 ° C.)
Polymerized rosin ester resin G (Arakawa Chemical Industries, trade name “Pencel D-160”, softening point 160 ° C.)
-Terpene phenol resin H (manufactured by Yasuhara Chemical Co., Ltd., trade name “YS Polystar T130”, softening point 130 ° C.)
-Terpene phenol resin I (manufactured by Yasuhara Chemical Co., Ltd., trade name “Mighty Ace G150”, softening point 150 ° C.)
(2)両面粘着テープの製造
離型処理が施された厚み75μmのPETフィルムの離型処理面に、得られた粘着剤溶液を塗布し、110℃で3分間乾燥させることにより、厚み90μmの粘着剤層を形成した。形成された粘着剤層の表面に対して基材であるフタムラ化学社製の厚み23μmのPETフィルム「FE2002」をシリコンローラーで貼り合わせ、基材の片面に粘着剤層を有する片面粘着テープを得た。
次いで、別の離型処理が施された厚み75μmのPETフィルムを用意し、このPETフィルムの離型処理面に粘着剤溶液を塗布し、110℃で3分間乾燥させることにより、厚み90μmの粘着剤層を形成した。この粘着剤層を上記で作製した片面粘着テープの基材(PETフィルム「FE2002」)側にシリコンローラーで貼り合わせた。これにより、基材の両面に粘着剤層を有し、かつ、粘着剤層の表面が離型処理が施された厚み75μmのPETフィルムで覆われた両面粘着テープを得た。
なお、粘着剤層について、アイティー計測制御社製のDVA−200により23℃、周波数10Hzでせん断弾性率G’を測定した。また、形成された粘着剤層をW1(g)採取し、この粘着剤層を酢酸エチル中に23℃にて24時間浸漬して不溶解分を200メッシュの金網で濾過し、金網上の残渣を真空乾燥して乾燥残渣の重量W2(g)を測定し、下記式(1)により粘着剤層の架橋度(ゲル分率)を算出した。
架橋度(ゲル分率)(重量%)=100×W2/W1 (1)(2) Manufacture of double-sided pressure-sensitive adhesive tape The obtained pressure-sensitive adhesive solution was applied to a release-treated surface of a 75 μm-thick PET film that had been subjected to a release treatment, and dried at 110 ° C. for 3 minutes, whereby a thickness of 90 μm was obtained. An adhesive layer was formed. A 23 μm-thick PET film “FE2002” made by Phutamura Chemical Co., Ltd., which is a base material, is bonded to the surface of the formed adhesive layer with a silicon roller to obtain a single-sided adhesive tape having an adhesive layer on one side of the base material. It was.
Next, a PET film having a thickness of 75 μm that has been subjected to another release treatment is prepared, and an adhesive solution is applied to the release treatment surface of this PET film, followed by drying at 110 ° C. for 3 minutes. An agent layer was formed. This pressure-sensitive adhesive layer was bonded to the base material (PET film “FE2002”) side of the single-sided pressure-sensitive adhesive tape prepared above with a silicon roller. Thereby, the double-sided adhesive tape which had an adhesive layer on both surfaces of the base material, and was covered with 75-micrometer-thick PET film by which the surface of the adhesive layer was given a mold release process was obtained.
In addition, about the adhesive layer, shear elastic modulus G 'was measured at 23 degreeC and the frequency of 10 Hz by DVA-200 made from IT measurement control company. Further, W1 (g) of the formed pressure-sensitive adhesive layer was collected, and this pressure-sensitive adhesive layer was immersed in ethyl acetate at 23 ° C. for 24 hours, and the insoluble matter was filtered through a 200-mesh wire mesh. Was dried in vacuo, the weight W2 (g) of the dry residue was measured, and the degree of crosslinking (gel fraction) of the pressure-sensitive adhesive layer was calculated from the following formula (1).
Cross-linking degree (gel fraction) (% by weight) = 100 × W2 / W1 (1)
(実施例2〜14、比較例1〜12)
表1及び2に記載のモノマー配合及び重量平均分子量のアクリル共重合体に、表1及び2に記載されている粘着付与樹脂及び架橋剤を添加した以外は実施例1と同様にして、両面粘着テープを得た。(Examples 2-14, Comparative Examples 1-12)
Double-sided adhesion in the same manner as in Example 1 except that the tackifier resins and crosslinking agents listed in Tables 1 and 2 were added to the monomer blends and weight average molecular weight acrylic copolymers listed in Tables 1 and 2. I got a tape.
(実施例15)
基材を積水化学工業社製のポリエチレン発泡体「ボラーラXLH−0180015」(厚み150μm)に変更し、かつ、粘着剤層の厚みを50μmに変更したこと以外は実施例1と同様にして、両面粘着テープを得た。(Example 15)
Both surfaces were changed in the same manner as in Example 1 except that the base material was changed to Sekisui Chemical Co., Ltd. polyethylene foam “Bollara XLH-0180015” (thickness 150 μm) and the thickness of the adhesive layer was changed to 50 μm. An adhesive tape was obtained.
<評価>
実施例、比較例で得られた両面粘着テープに対して下記の評価を行った。評価結果を表1及び2に示した。<Evaluation>
The following evaluation was performed with respect to the double-sided pressure-sensitive adhesive tapes obtained in Examples and Comparative Examples. The evaluation results are shown in Tables 1 and 2.
(1)落下衝撃試験
(試験装置の作製)
図1に、両面粘着テープの落下衝撃試験の模式図を示す。得られた両面粘着テープを外径が幅46mm、長さ61mm、内径が幅44mm、長さ59mmに打ち抜き、幅1mmの額縁状の試験片を作製した。次いで、図1(a)に示すように、中央部分に幅38mm、長さ50mmの四角い穴のあいた厚さ2mmのポリカーボネート板3に対して離型紙を剥がした試験片1を四角い穴がほぼ中央に位置するように貼り付けた後、試験片1の上面から幅55mm、長さ65mm、厚さ1mmのポリカーボネート板2を試験片1がほぼ中央に位置するように貼り付け、試験装置を組み立てた。
その後、試験装置の上面に位置するポリカーボネート板2側から110℃で30kgfの圧力を10秒間加えて上下に位置するポリカーボネート板と試験片とを加熱圧着し、常温で24時間放置した。(1) Drop impact test (production of test equipment)
In FIG. 1, the schematic diagram of the drop impact test of a double-sided adhesive tape is shown. The obtained double-sided pressure-sensitive adhesive tape was punched into an outer diameter of 46 mm, a length of 61 mm, an inner diameter of 44 mm and a length of 59 mm to produce a frame-shaped test piece having a width of 1 mm. Next, as shown in FIG. 1 (a), the square hole is approximately in the center of the
Thereafter, a pressure of 30 kgf was applied at 110 ° C. for 10 seconds from the side of the
(落下衝撃試験の判定)
図1(b)に示すように、作製した試験装置を裏返して支持台に固定し、四角い穴を通過する大きさの300gの重さの鉄球4を四角い穴を通過するように落とした。鉄球を落とす高さを徐々に高くしていき、鉄球の落下により加わった衝撃により試験片とポリカーボネート板とが剥がれた時の鉄球を落した高さを計測した。
◎:60cm以上
○:50cm以上60cm未満
△:40cm以上50cm未満
×:40cm未満(Drop impact test judgment)
As shown in FIG. 1 (b), the produced test apparatus was turned over and fixed to the support base, and an iron ball 4 weighing 300 g passing through the square hole was dropped so as to pass through the square hole. The height at which the iron ball was dropped was gradually increased, and the height at which the iron ball was dropped when the test piece and the polycarbonate plate were peeled off by the impact applied by the dropping of the iron ball was measured.
◎: 60 cm or more ○: 50 cm or more and less than 60 cm Δ: 40 cm or more and less than 50 cm x: less than 40 cm
(2)プッシュ試験
(試験装置の作製)
図2に、両面粘着テープのプッシュ試験の模式図を示す。得られた両面粘着テープを外径が幅46mm、長さ61mm、内径が幅44mm、長さ59mmに打ち抜き、幅1mmの額縁状の試験片を作製した。次いで、図2(a)に示すように、中央部分に幅38mm、長さ50mmの四角い穴のあいた厚さ2mmのポリカーボネート板3に対して離型紙を剥がした試験片1を四角い穴がほぼ中央に位置するように貼り付けた後、試験片1の上面から幅55mm、長さ65mm、厚さ2mmのアルミ板5を試験片1がほぼ中央に位置するように貼り付け、試験装置を組み立てた。
その後、試験装置の上面に位置するアルミ板5側から70℃で30kgfの圧力を10秒間加えて上下に位置するアルミ板及びポリカーボネート板と試験片とを加熱圧着し、常温で24時間放置した。(2) Push test (production of test equipment)
In FIG. 2, the schematic diagram of the push test of a double-sided adhesive tape is shown. The obtained double-sided pressure-sensitive adhesive tape was punched into an outer diameter of 46 mm, a length of 61 mm, an inner diameter of 44 mm and a length of 59 mm to produce a frame-shaped test piece having a width of 1 mm. Next, as shown in FIG. 2 (a), the square hole is approximately in the center of the
Thereafter, a pressure of 30 kgf was applied at 70 ° C. for 10 seconds from the side of the
(プッシュ試験の判定)
図2(b)に示すように、作製した試験装置を裏返して支持台に固定し、開口部側から10mm/minの速度で下面のアルミ板5を押していき、アルミ板5が剥がれたときの荷重を測定した。測定は23℃にて行った。
◎:130N以上
○:120N以上130N未満
△:110N以上120N未満
×:110N未満(Push test judgment)
As shown in FIG. 2 (b), the prepared test apparatus was turned over and fixed to the support base, and the
◎: 130N or more ○: 120N or more and less than 130N Δ: 110N or more and less than 120N ×: less than 110N
本発明によれば、細幅であっても、加熱圧着後の粘着力が高く、優れた耐衝撃性を発揮できる携帯電子機器用両面粘着テープを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, even if it is narrow, the adhesive force after thermocompression bonding is high, and the double-sided adhesive tape for portable electronic devices which can exhibit the outstanding impact resistance can be provided.
1 試験片(額縁状)
2 ポリカーボネート板(厚さ1mm)
3 ポリカーボネート板(厚さ2mm)
4 鉄球(300g)
5 アルミ板(厚さ2mm)1 Test piece (frame shape)
2 Polycarbonate plate (thickness 1mm)
3 Polycarbonate plate (thickness 2mm)
4 Iron balls (300 g)
5 Aluminum plate (thickness 2mm)
Claims (3)
少なくとも一方の粘着剤層が、ブチルアクリレートに由来する構造単位45〜90重量%と、2−エチルヘキシルアクリレートに由来する構造単位5〜40重量%とを含み、重量平均分子量が40万〜100万のアクリル共重合体100重量部と、粘着付与樹脂40〜60重量部とを含有し、23℃でのせん断弾性率G’が1.0×106〜8.0×106Paであり、
前記粘着付与樹脂40〜60重量部は、軟化点が100℃以下の粘着付与樹脂(a)を5〜30重量部含有し、
前記軟化点が100℃以下の粘着付与樹脂(a)は、軟化点が80℃以下である
ことを特徴とする携帯電子機器用両面粘着テープ。 A double-sided pressure-sensitive adhesive tape for portable electronic devices having a pressure-sensitive adhesive layer on both sides of the substrate,
At least one pressure-sensitive adhesive layer contains 45 to 90% by weight of structural units derived from butyl acrylate and 5 to 40% by weight of structural units derived from 2-ethylhexyl acrylate, and has a weight average molecular weight of 400,000 to 1,000,000. Containing 100 parts by weight of an acrylic copolymer and 40-60 parts by weight of a tackifying resin, and having a shear elastic modulus G ′ at 23 ° C. of 1.0 × 10 6 to 8.0 × 10 6 Pa,
40 to 60 parts by weight of the tackifying resin contains 5 to 30 parts by weight of a tackifying resin (a) having a softening point of 100 ° C. or less ,
The double-sided pressure-sensitive adhesive tape for portable electronic devices, wherein the tackifying resin (a) having a softening point of 100C or lower has a softening point of 80C or lower .
Applications Claiming Priority (3)
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JP2014178235 | 2014-09-02 | ||
JP2014178235 | 2014-09-02 | ||
PCT/JP2015/074677 WO2016035747A1 (en) | 2014-09-02 | 2015-08-31 | Double-sided adhesive tape for portable electronic device |
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JPWO2016035747A1 JPWO2016035747A1 (en) | 2017-06-15 |
JP6499586B2 true JP6499586B2 (en) | 2019-04-10 |
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JP (1) | JP6499586B2 (en) |
KR (1) | KR20170052525A (en) |
CN (1) | CN106062113A (en) |
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JP6885247B2 (en) * | 2017-07-20 | 2021-06-09 | 三菱ケミカル株式会社 | Adhesive sheet |
JP7166092B2 (en) * | 2018-07-10 | 2022-11-07 | 日東電工株式会社 | Adhesive sheet and adhesive composition |
JP7534212B2 (en) * | 2018-07-10 | 2024-08-14 | 日東電工株式会社 | Adhesive sheet |
WO2020218430A1 (en) * | 2019-04-24 | 2020-10-29 | 積水化学工業株式会社 | Pressure-sensitive adhesive tape |
KR102524178B1 (en) * | 2021-03-22 | 2023-04-20 | 세키스이가가쿠 고교가부시키가이샤 | Method for fixing adhesive tape, electronic device parts or on-vehicle device parts, and manufacturing method for electronic devices or on-vehicle devices |
JP7567066B2 (en) | 2022-09-21 | 2024-10-15 | 積水化学工業株式会社 | Adhesive tape |
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JP3248998B2 (en) * | 1993-10-06 | 2002-01-21 | 積水化学工業株式会社 | Adhesive composition |
JPH1060392A (en) * | 1996-08-22 | 1998-03-03 | Nitto Denko Corp | Adhesive tape for holding electronic components in parallel with each other |
JP3765497B2 (en) * | 2004-03-17 | 2006-04-12 | 日東電工株式会社 | Acrylic adhesive composition and adhesive tape |
CN1563121A (en) * | 2004-04-14 | 2005-01-12 | 黑龙江龙新化工有限公司 | Thermoplastic resin of crylic acid |
JP2009167281A (en) * | 2008-01-15 | 2009-07-30 | Sekisui Chem Co Ltd | Double-sided adhesive tape and liquid crystal display device |
JP2010215906A (en) * | 2009-02-20 | 2010-09-30 | Sekisui Chem Co Ltd | Adhesive sheet for use in electronic device |
JP5578835B2 (en) * | 2009-11-16 | 2014-08-27 | 日東電工株式会社 | Adhesive tape |
CN103184030B (en) * | 2011-12-28 | 2014-11-12 | 上海轻工业研究所有限公司 | Novel polyamide adhesive |
JP6058016B2 (en) * | 2013-03-29 | 2017-01-11 | Dic株式会社 | Double-sided adhesive tape |
JP6204845B2 (en) * | 2013-07-26 | 2017-09-27 | 積水化学工業株式会社 | Adhesive sheet for electronic equipment |
JP6426887B2 (en) * | 2013-09-20 | 2018-11-21 | 積水化学工業株式会社 | Acrylic adhesive for portable electronic devices and double-sided adhesive tape for portable electronic devices |
-
2015
- 2015-08-31 WO PCT/JP2015/074677 patent/WO2016035747A1/en active Application Filing
- 2015-08-31 CN CN201580011143.5A patent/CN106062113A/en active Pending
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CN106062113A (en) | 2016-10-26 |
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