JP6485587B1 - Etching solution - Google Patents

Abstract

  The present invention provides an etching solution that suppresses damage to IGZO. The etching solution of the present invention comprises hydroxyethanediphosphonic acid (A), phosphonic acid (B), hydrogen peroxide (C), nitric acid (D), fluorine compound (E), azole (F) and alkali (G). An etching solution containing the phosphonic acid (B) selected from the group consisting of diethylenetriaminepentamethylenephosphonic acid, N, N, N ′, N′-ethylenediaminetetrakismethylenephosphonic acid and aminotrimethylenephosphonic acid. 1 or more types are contained, the ratio of the said hydroxyethane diphosphonic acid (A) is the range of 0.01-0.1 mass%, and the ratio of the said phosphonic acid (B) is 0.003-0.04 mass. % Range.

Description

  The present invention relates to semiconductor technology, and more particularly to a protective solution and an etching solution for IGZO.

Indium / gallium / zinc oxide (IGZO) has been studied as a useful material as an oxide semiconductor material. However, since IGZO is easily etched by acid or alkali, there has been a known problem that IGZO as a base is corroded when source / drain wiring is formed using these etching solutions.
In order to cope with this, an etch stopper type structure (see FIG. 1) in which a source / drain wiring is formed after forming a protective layer on the IGZO has been conventionally employed. Has led to an increase. Therefore, since a back channel etch type structure that does not require a protective layer (see FIG. 2) is employed, an etchant that can etch various wiring materials while suppressing damage to IGZO is desired (Non-patent Document 1). reference).
In recent years, as represented by 4K and 8K panels, the resolution of panels has been rapidly increasing. As the resolution of the panel increases, the wiring pattern for driving the pixels becomes dense. However, in order to suppress the loss of light emitted from the backlight, it is necessary to process the wiring width narrowly. On the other hand, in order to secure the amount of current flowing through the wiring, high-shaped wiring processing is required to increase the wiring cross-sectional area. That is, an etching solution that can process the taper angle of the wiring is desired.
Currently, chemical solutions characterized by low pH described in JP-A-2006-11342 (Patent Document 1) are known as etching solutions that suppress damage to IGZO, but sufficient anticorrosion and workability of IGZO. Cannot be achieved.

Japanese Patent Laid-Open No. 2006-11342

Kobe Steel Engineering Reports Vol. 65, no. 2, Sep. 2015, Shinya Morita et al. “Oxide semiconductor materials for BCE TFT”

  Under such circumstances, it is desired to provide an etching solution that enables etching of the wiring material while suppressing damage to IGZO.

The present invention is as follows.
[1] Etching solution containing hydroxyethanediphosphonic acid (A), phosphonic acid (B), hydrogen peroxide (C), nitric acid (D), fluorine compound (E), azole (F) and alkali (G) Wherein the phosphonic acid (B) is one or more selected from the group consisting of diethylenetriaminepentamethylenephosphonic acid, N, N, N ′, N′-ethylenediaminetetrakismethylenephosphonic acid and aminotrimethylenephosphonic acid. And the ratio of the hydroxyethanediphosphonic acid (A) is in the range of 0.01 to 0.1% by mass, and the ratio of the phosphonic acid (B) is in the range of 0.003 to 0.04% by mass. An etchant.

[2] The phosphonic acid (B) is diethylenetriaminepentamethylenephosphonic acid.
Etching liquid as described in [1].

[3] The etching solution according to [1] or [2], wherein the fluorine compound (E) is ammonium fluoride or acidic ammonium fluoride.

  According to a preferred embodiment of the present invention, by using the etching solution of the present invention, IGZO can be protected from acid and base, and the formation of a protective layer on IGZO becomes unnecessary, so that the manufacturing cost is reduced. It can be greatly reduced. Therefore, it is possible to manufacture a good substrate having a high taper angle wiring structure while preventing corrosion of IGZO in the etching process. In particular, in a configuration having a multilayer thin film including a copper layer and a titanium layer on IGZO, processing by particularly preferable etching becomes possible.

It is an example of the TFT schematic diagram of the conventional etch stopper type | mold structure which provided the protective layer on IGZO. It is an example of the TFT schematic diagram of the back channel etch type structure which does not provide a protective layer. It is an example of the schematic diagram of the wiring cross section when using the etching liquid of this invention. It is an example of the cross-sectional observation of IGZO when using the etching liquid of an Example or a comparative example. It is an example of the surface observation of IGZO when using the etching liquid of an Example or a comparative example.

  The etching solution of the present invention can have anticorrosive properties against IGZO by containing hydroxyethanediphosphonic acid (A) and specific phosphonic acid (B). Moreover, by further containing hydrogen peroxide (C), nitric acid (D), fluorine compound (E), azole (F) and alkali (G), it is possible to etch wiring materials while having anticorrosive properties against IGZO. Can be obtained.

  Hereinafter, each component of the etching solution of the present invention will be described in detail.

[Hydroxyethanediphosphonic acid (HEDP) (A)]
Hydroxyethane diphosphonic acid (A) is a compound represented by the formula (1).

The ratio of HEDP (A) in the etching solution is in the range of 0.01 to 0.1% by mass, and preferably in the range of 0.03 to 0.08% by mass. When the concentration range of HEDP (A) is within this range, high anti-corrosion performance of IGZO can be provided, and roughening of the IGZO surface can be prevented.

[Phosphonic acid (B)]
By using phosphonic acid (B) together with HEDP (A), it is possible to provide high anti-corrosion properties of IGZO, and at the same time, the wiring shape can be processed into a high taper angle.
The phosphonic acid (B) in the present invention is one or more phosphonic acids selected from the group consisting of diethylenetriaminepentamethylenephosphonic acid, N, N, N ′, N′-ethylenediaminetetrakismethylenephosphonic acid and aminotrimethylenephosphonic acid. is there. Among these, N, N, N ′, N′-ethylenediaminetetrakismethylenephosphonic acid is preferable because of its high anticorrosive property to IGZO.
The ratio of the phosphonic acid (B) in the etching solution is in the range of 0.003 to 0.04% by mass, preferably 0.01 to 0.03, more preferably 0.015 to 0.03% by mass. It is. When the concentration range of phosphonic acid (B) is within this range, high anti-corrosion performance of IGZO can be achieved.

[Hydrogen peroxide (C)]
Hydrogen peroxide (C) has a function of oxidizing copper as an oxidizing agent.
The ratio of hydrogen peroxide (C) in the etching solution is preferably in the range of 4.0 to 8.0% by mass, more preferably 4.5 to 7.5, and particularly preferably 5.0 to 6.5% by mass. Range. When the concentration range of hydrogen peroxide (C) is within this range, the etching rate can be secured and the local corrosion of the wiring can be suitably suppressed.

[Nitric acid (D)]
Nitric acid (D) has an effect of dissolving copper oxidized by hydrogen peroxide.
The ratio of nitric acid (D) in the etching solution is preferably in the range of 0.8 to 7.0% by mass, more preferably 1.5 to 6.5, and particularly preferably 2.0 to 6.0. . When the concentration range of nitric acid (D) is within this range, a good etching rate can be secured and a good wiring shape can be obtained.

[Fluorine compound (E)]
The fluorine compound (E) has a function of etching a barrier layer made of a titanium-based metal.
The kind of fluorine compound (E) is not limited as long as it generates fluorine ions. Specific examples include hydrofluoric acid, ammonium fluoride, and acidic ammonium fluoride. Among these, ammonium fluoride and acidic ammonium fluoride are preferred because of their low toxicity. A fluorine compound (E) may be used by 1 type, and may use 2 or more types together.
The ratio of the fluorine compound (E) in the etching solution is preferably in the range of 0.2 to 0.8 mass%, more preferably 0.2 to 0.6 mass%, particularly preferably 0.2 to 0.5 mass%. % Range. When the concentration range of the fluorine compound (E) is within this range, a good etching rate of the barrier layer made of a titanium-based metal can be obtained.

[Azole (F)]
Azole (F) is used for adjusting the etching rate by pH. Specific examples of azole (F) include 1,2,4-triazole, 1H-benzotriazole, triazoles such as 5-methyl-1H-bentotriazole, 3-amino-1H-triazole; 1H-tetrazole, 5- Examples include tetrazole such as methyl-1H-tetrazole, 5-phenyl-1H-tetrazole, and 5-amino-1H-tetrazole; and thiazoles such as 1,3-thiazole and 4-methylthiazole. Of these, tetrazoles are preferable, and 5-amino-1H-tetrazole is particularly preferable in that it does not form an insoluble salt with copper ions in the liquid. An azole (F) may be used by 1 type and may use 2 or more types together.
The ratio of azole (F) in the etching solution is preferably in the range of 0.05 to 0.35% by mass, more preferably 0.05 to 0.30% by mass, and particularly preferably 0.08 to 0.25% by mass. %. When the concentration range of azole (F) is within this range, the etching rate can be suitably adjusted, and a favorable wiring shape can be obtained.

[Alkali (G)]
Alkali (G) is used for adjusting the etching rate by pH. The alkali (G) is not limited as long as it is usually used as an etching solution, and examples thereof include ammonia, potassium hydroxide, quaternary ammonium hydroxide, and amine compounds.
Examples of the amine compound include alkylamines such as ethylamine and isopropylamine; alkanolamines typified by N-propanolamine and N-methylethanolamine; diamines typified by ethylenediamine. Among these, quaternary ammonium hydroxide, N-propanolamine, and N-butylethanolamine are preferable in that the stability of hydrogen peroxide is not deteriorated. Alkali (G) may be used alone or in combination of two or more.
The ratio of alkali (G) in the etching solution is preferably in the range of 0.6 to 10% by mass, preferably in the range of 1.0 to 9.0% by mass, particularly preferably in the range of 2.0 to 8.0% by mass. is there. When the concentration range is within this range, the etching rate can be suitably adjusted.

[Other ingredients]
The etching solution of the present invention may contain additives, hydrogen peroxide stabilizers, surfactants, colorants, antifoaming agents, and the like conventionally used in the etching solution within a range not impairing the object of the present invention. it can.

[Method of preparing etching solution]
The etching solution of the present invention includes HEDP (A), phosphonic acid (B), hydrogen peroxide (C), nitric acid (D), fluorine compound (E), azole (F), alkali (G), and as necessary. It is prepared by adding water (preferably ultrapure water) to other components and stirring until uniform.
The pH range of the composition liquid is not particularly limited, but is usually 1.5 to 2.8, and preferably 1.8 to 2.5. By being in this range, it is possible to etch the wiring material while suitably preventing corrosion of IGZO.

[Using Etching Solution]
The object can be etched by bringing the etching solution of the present invention into contact with the object.
There is no particular limitation on the method of bringing the etching solution of the present invention into contact with the object. For example, a method of bringing the etching solution into contact with the object in the form of dripping (single wafer spin treatment) or spraying, or the object to the etching solution of the present invention. A dipping method can be employed.
The temperature range which uses the etching liquid of this invention is 10-70 degreeC normally, Preferably it is 20-50 degreeC. The time for using the etching solution is usually 0.2 to 60 minutes. As the rinsing liquid after etching, either an organic solvent or water can be used.

[Semiconductor substrate]
The substrate targeted by the etching solution of the present invention preferably has IGZO, and IGZO is not particularly limited as long as it is a semiconductor that contains indium, gallium, zinc, and oxygen. The oxide may have an amorphous structure or crystallinity.
When IGZO is used as an electronic element such as a thin film transistor (TFT), the IGZO is formed on a substrate such as glass by using a film forming process such as a sputtering method. Next, an electrode pattern is formed by etching using a resist or the like as a mask. Furthermore, copper (Cu), titanium (Ti) or the like is formed thereon using a film forming process such as sputtering, and then source / drain electrodes are formed by etching using a resist or the like as a mask.

  FIG. 3 is an example of a schematic diagram of a wiring cross section when the etching solution of the present invention is used. A multilayer thin film having a wiring layer (2) made of a copper layer containing copper on an IGZO layer (4) as shown in FIG. 3 via a barrier layer (3) such as a titanium layer containing titanium. The structure having it is preferably used for wiring of a display device such as a flat panel display, and the performance of the etching solution of the present invention is particularly effectively exhibited. According to a preferred embodiment of the present invention, a desired wiring structure can be formed by etching this multilayer thin film using the etching solution of the present invention using the resist layer (1) as a mask. In FIG. 3, twice the distance (a) from the end of the resist layer (1) to the end of the wiring layer (2) in contact with the resist layer (1) is called a top CD loss (a × 2). Double the distance (b) from the end of the layer (1) to the end of the wiring layer (2) in contact with the barrier layer (3) provided under the wiring (2) is referred to as bottom CD loss (b × 2). Further, twice (C × 2) the distance (c) from the end of the wiring layer (2) to the end of the barrier layer (3) is called tailing. The angle formed by the etching surface at the end of the wiring layer (2) and the underlying IGZO layer (4) is referred to as a taper angle (5).

EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, as long as there exists an effect of this invention, embodiment can be changed suitably.
Unless otherwise specified,% means mass%.

[Evaluation board]
<Substrate for IGZO etching rate and surface condition evaluation (1)>
IGZO having an element ratio of indium (In), gallium (Ga), zinc (Zn), and oxygen (O) of 1: 1: 1: 4 was formed on a glass substrate by a sputtering method with a thickness of 1000 mm (100 nm). (100 mm × 100 mm × 1 mm).

<Substrate for Evaluation of Etching Performance for Multilayer Thin Film Containing Copper Layer and Titanium Layer (2)>
Titanium was sputtered on a glass substrate to a thickness of 25 nm to form a titanium layer, and then copper was sputtered to a thickness of 600 nm to laminate a copper layer of a wiring material. Next, a resist was applied, and the pattern mask was exposed and transferred, followed by development to form a wiring pattern, and a multilayer thin film including a copper layer and a titanium layer was produced on a glass substrate (100 mm × 100 mm × 1 mm).

[Evaluation method]
[IGZO Etching Rate (E.R. (Å / sec))]
After preparing the composition which consists of (C), (D), (E), (F) and (G) component density | concentration of Table 1 or 2, copper powder 6000ppm and titanium powder 150ppm were added, respectively, Stir until dissolved. After confirming the dissolution of the metal, components (A) and (B) were added at a predetermined concentration to obtain an etching solution. Etching was performed by immersing the substrate (1) in each etching solution at 35 ° C. for 20 seconds. Thereafter, it was washed with water and dried using nitrogen gas.
The film thickness after etching was measured by n & k Analyzer 1280 (n & k Technology Inc.), and the etching rate was calculated by dividing the film thickness difference by the etching time, and judged by the following criteria.
E: Etching rate less than 5 Å / sec G: Etching rate from 5 Å / sec to less than 8 レ ー ト / sec P: Etching rate from 8 Å / sec to less than 10 Å / sec B: Etching rate of 10 Å / sec or more E, G and P are acceptable.

[IGZO surface condition]
The IGZO thin film after measuring the etching rate of IGZO was cut, and the roughness of the surface was magnified 50000 times (acceleration voltage 2 kV, acceleration current) using a scanning electron microscope (model number: S5000H type, manufactured by Hitachi, Ltd.). 10 μA) and judged according to the following criteria.
E: Smooth surface state G: Slight roughness on the surface, when the IGZO cross section is observed with a scanning electron microscope, the difference in unevenness is less than 25 nm or when the IGZO surface is observed with a scanning electron microscope, the unit area ( The number of void portions per 1200 nm × 1200 nm) is less than 20 locations. B: When the surface of the surface is markedly roughened or voids are observed with a scanning electron microscope, the difference in irregularities is 25 nm or more or the surface of the IGZO is scanned with electrons. When observed with a microscope, the number of voids generated per unit area (1200 nm × 1200 nm) is 20 or more, and E and G are acceptable.
An example of cross-sectional observation of IGZO is shown in FIG. 4, and an example of surface observation is shown in FIG.

[Etching performance for multilayer thin film including copper layer and titanium layer]
After preparing the composition which consists of (C), (D), (E), (F) and (G) component density | concentration of Table 1 or 2, copper powder 6000ppm and titanium powder 150ppm were added, respectively, Stir until dissolved. After confirming the dissolution of the metal, components (A) and (B) were added at a predetermined concentration to obtain an etching solution. The substrate (2) was immersed in each etching solution at 35 ° C. for 150 seconds for etching, then washed with water and dried using nitrogen gas.
The multilayer thin film sample containing the copper layer and the titanium layer obtained by the above etching method was cut, and the cross section was 50,000 times (acceleration voltage 2 kV) using a scanning electron microscope (model number: S5000H type, manufactured by Hitachi, Ltd.). And an acceleration current of 10 μA).
Based on the obtained SEM image, the taper angle 5 shown in FIG. 3 was measured, and the shape after etching was determined according to the following criteria.
Taper angle E: 60 ° or more and less than 70 °
G: 50 to less than 60 °
B: E and G are less than 50 ° or 70 ° or more.

  The evaluation results are shown in Tables 1 and 2.

In addition, the component in a table | surface is as follows.
B1: N, N, N ′, N′ethylenediaminetetrakismethylenephosphonic acid B2: diethylenetriaminepentamethylenephosphonic acid B3: aminotrimethylenephosphonic acid B4: phosphoric acid B5: phosphonic acid B6: pentaethyleneoctamethylenephosphonic acid E1: acid foot Ammonium fluoride F1: 5-amino-1H-tetrazole G1: quaternary ammonium hydroxide G2: potassium hydroxide G3: N-butylethanolamine G4: ammonia G5: 1-amino-2propanol

1. 1. Resist layer 2. Wiring layer 3. Barrier layer 4. IGZO layer Taper angle a: Top CD loss (a x 2)
b: Bottom CD loss (b × 2)
c; tailing (c × 2)

  The etching solution of the present invention can be suitably used for etching a wiring material on a substrate containing IGZO. According to a preferred aspect of the present invention, it is possible to produce a substrate having a high taper angle wiring structure while preventing corrosion of IGZO.

Claims (11)

An etching solution containing hydroxyethanediphosphonic acid (A), phosphonic acid (B), hydrogen peroxide (C), nitric acid (D), fluorine compound (E), azole (F) and alkali (G). ,
The phosphonic acid (B) contains one or more selected from the group consisting of diethylenetriaminepentamethylenephosphonic acid, N, N, N ′, N′-ethylenediaminetetrakismethylenephosphonic acid and aminotrimethylenephosphonic acid,
Content of the said hydroxyethane diphosphonic acid (A) is the range of 0.01-0.1 mass%,
Content of the said phosphonic acid (B) is the range of 0.003-0.04 mass%,
An etching solution for etching at least a wiring material formed on a layer containing indium, gallium, zinc and oxygen .   The etching solution according to claim 1, wherein the phosphonic acid (B) is diethylenetriaminepentamethylenephosphonic acid. The etching solution according to claim 1 or 2, wherein a content of the phosphonic acid (B) is in a range of 0.01 to 0.03% by mass. The etching liquid as described in any one of Claims 1-3 whose said fluorine compound (E) is ammonium fluoride and / or acidic ammonium fluoride. The etching liquid as described in any one of Claims 1-4 whose said azole (F) is 5-amino-1H-tetrazole. The alkali (G) is at least one selected from the group consisting of quaternary ammonium hydroxide, potassium hydroxide, N-butylethanolamine, ammonia, and 1-amino-2-propanol. The etching liquid as described in any one of -5. The hydrogen peroxide (C) content is in the range of 4.0 to 8.0 mass%, and the nitric acid (D) content is in the range of 0.8 to 7.0 mass%, The content of the fluorine compound (E) is in the range of 0.2 to 0.8% by mass, the content of the azole (F) is in the range of 0.05 to 0.35% by mass, The etching liquid as described in any one of Claims 1-6 whose alkali (G) is the range of 0.6-10 mass%. The etching solution according to claim 1, wherein the wiring material includes a copper layer containing copper. Furthermore, the etching liquid as described in any one of Claims 1-8 for etching a barrier layer. The etching solution according to claim 9, wherein the barrier layer includes a titanium-based metal layer containing titanium. The etching solution according to any one of claims 1 to 10, wherein an etching rate of the layer containing indium, gallium, zinc and oxygen at a temperature of 35 ° C is less than 10 Å / second.