JP6432243B2 - Heat transport system - Google Patents

Description

  The present invention relates to a heat transport system that performs heat transport using a liquid heat medium.

  A vehicle or the like is provided with a heat transport system that transports heat generated during energy conversion and dissipates the heat from the heat radiating portion to the outside of the system. In this heat transport system, a plurality of cooling circuits are often provided for different temperature zones.

  For example, a heat transport system mounted on a vehicle includes a first circuit for high temperature and a second circuit for low temperature as a cooling circuit. In the first circuit, heat generated in the inverter, the engine, or the like is transported to the radiator via the first heat medium. In the second circuit, the heat absorbed by the evaporator of the vehicle air conditioner is transported to the condenser via the second heat medium. Thereby, both apparatus cooling and air conditioning can be achieved in one system.

  In such a heat transport system, a liquid is often used as the first heat medium, but this liquid needs to have antifreezing properties. For this reason, the antifreezing property is ensured by using the liquid which added about 50% of ethylene glycol which is a freezing point depressant with respect to water as a 1st heat medium (for example, refer patent document 1).

  In such a heat transport system, heat is radiated to the outside air in both the first circuit and the second circuit, that is, in both the radiator and the condenser. At this time, by arranging the radiator and the condenser in series with the outside air flow, heat exchange between the heat medium and the outside air is performed in both the radiator and the condenser (for example, see Patent Document 1). ).

JP 2014-02080 A

  However, when the radiator and the condenser are arranged in series with the outside air flow as in the system described in Patent Document 1, the vehicle mounting space increases, and the mounting space of other components in the engine room is pressed. There is. Thereby, the design freedom of other parts will become low.

  On the other hand, a method of releasing heat from the second circuit to the first circuit is conceivable. As a result, there is no need to arrange a condenser in series with the radiator, so the mounting space in the engine room can be reduced.

  However, in the system described in Patent Document 1, since the thermal properties such as the specific heat and thermal conductivity of the first heat medium are poor, the size of the radiator increases, eventually increasing the mounting space, and the other in the engine room. It puts pressure on the component mounting space.

  In view of the above-described points, an object of the present invention is to reliably reduce the mounting space of a heat radiating unit that releases heat to the outside of a system in a heat transport system including a plurality of heat medium circuits.

In order to achieve the above object, according to the first aspect of the present invention, the first circuit (1) in which the liquid first heat medium circulates and the second circuit (2, 3) in which the second heat medium circulates, The first circuit (1) includes a first heat source (11) that generates heat and a first heat radiating part (12) that releases heat to the outside of the system, and the second circuit (2, 3) Dissipates heat from the evaporation units (24, 31) that generate cold by evaporation of the liquid second heat medium and the gaseous second heat medium evaporated in the evaporation units (24, 31). In the heat transport system having the second heat radiating part (22, 32, 36), the second heat radiating part (22, 32, 36) releases heat from the second heat medium to the first heat medium. The first circuit (1) is configured to heat the first heat medium, and the first circuit (1) is the first heat medium heated in the second heat radiating part (22, 32, 36). The first heat medium is composed of a solution having a solvent and at least one kind of solute (60), and is configured to release heat to the outside of the system from the first heat radiating portion (12). One kind of solute (60) is adsorbed selectively in close proximity to the solid-liquid interface (70) of the solvent when the temperature of the first heat medium becomes equal to or lower than a predetermined reference temperature. A molecule comprising a first site (61) that inhibits the growth of coagulation nuclei and a second site (62) that is connected to the first site (61) and has a sparse relationship with the solvent (however, (Except for hexadecyltrimethylammonium bromide, polyoxyethylene (10) octylphenyl ether, polyoxyethylene sorbitan oleate and sodium cholate) .

  According to this, since the second heat radiating portion (22, 32, 36) is configured to release heat from the second heat medium to the first heat medium, the second heat radiating portion (22, 32, 36). ) To release the heat of the second heat medium out of the system, it is not necessary to arrange the second heat radiating part (22, 32, 36) in series with the first heat radiating part (12).

  In the present invention, the first heat medium is constituted by a solution having a solvent and at least one kind of solute (60). In addition, the at least one kind of solute (60) includes a first portion (61) that is selectively close to the solid-liquid interface (70) of the solvent when the temperature of the heat medium is equal to or lower than a predetermined reference temperature. And a second portion (62) that is connected to the first portion (61) and has a sparse relationship with the solvent.

  For this reason, when the temperature of the 1st heat carrier falls and becomes below standard temperature, the 1st site | part (61) of a solute (60) adsorb | sucks close to the solid-liquid interface of a solution selectively. Thereby, since the growth of the solidification nucleus of a solvent is inhibited by the 1st part (61) adsorbed to the solid-liquid interface (70) of a solvent, progress of freezing can be controlled. Furthermore, since the second portion (62) having a sparse relationship with the solvent prevents the solvent from approaching the solid-liquid interface (70), the progress of freezing can be further suppressed.

  For this reason, the progress of freezing of the first heat medium can be delayed without including a freezing point depressant such as ethylene glycol in the heat medium. Thereby, it is possible to sufficiently ensure the antifreeze performance while suppressing the deterioration of the thermophysical properties and the increase in viscosity of the first heat medium.

  Therefore, since the physique of the 1st heat radiating part (12) which radiates the heat which the 1st heat carrier has out of the system can be reduced in size, mounting space of the 1st heat radiating part (12) can be reduced reliably. It becomes possible.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a whole lineblock diagram showing the heat transportation system concerning a 1st embodiment. It is explanatory drawing for demonstrating the structure of the cooling water in 1st Embodiment. It is a whole lineblock diagram showing the heat transportation system concerning a 2nd embodiment. It is a whole lineblock diagram showing the heat transportation system concerning a 3rd embodiment. It is a whole lineblock diagram showing the heat transportation system concerning a 4th embodiment. It is a whole block diagram which shows the heat transport system which concerns on 5th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. In this embodiment, the heat transport system according to the present invention is mounted on a hybrid vehicle.

  As shown in FIG. 1, the heat transport system of the present embodiment includes a cooling water circuit 1 through which cooling water of a cooling system that cools an inverter 11 circulates, and a refrigerant of a vapor compression refrigeration cycle that constitutes a vehicle air conditioner. And a circulating refrigerant circuit 2. Here, the cooling water of the present embodiment corresponds to the first heat medium of the present invention, and the cooling water circuit of the present embodiment corresponds to the first circuit of the present invention. Further, the refrigerant of the present embodiment corresponds to the second heat medium of the present invention, and the refrigerant circuit of the present embodiment corresponds to the second circuit of the present invention.

  The cooling system is a system in which the cooling water of the inverter 11 is cooled by the radiator 12. That is, the cooling system of the present embodiment is a system that transports heat from the inverter 11 to the radiator 12 via the cooling water.

  The inverter 11 generates heat by energy conversion and corresponds to the first heat source of the present invention. Further, the radiator 12 exchanges heat with the cooling water that has become high temperature by exchanging heat with the exhaust heat of the inverter 11 and the outside air blown by the blower fan 12a, and releases heat that the cooling water has out of the system. It is an exchanger. Radiator 12 is equivalent to the 1st heat dissipation part of the present invention.

  The inverter 11 and the radiator 12 are connected by a cooling water circuit 1 that forms a closed circuit between the inverter 11 and the radiator 12. The cooling water circuit 1 is provided with a pump 13 that is a fluid machine that sucks and discharges cooling water. The pump 13 is an electric pump driven by an electric motor, and is a flow control unit that controls the flow of the cooling water in the cooling water circuit 1. Then, the cooling water in the cooling water circuit 1 is circulated from the cooling water outlet of the inverter 11 to the cooling water inlet of the inverter 11 via the radiator 12.

  The vapor compression refrigeration cycle functions to cool the blown air that is blown into the vehicle interior, which is the air-conditioning target space. The refrigerant circuit 2 of the refrigeration cycle is provided with a compressor 21, a condensing unit 22, an expansion valve 23, and an evaporation unit 24.

  The compressor 21 sucks, compresses and discharges the refrigerant in the refrigeration cycle. The compressor 21 of this embodiment is configured as an electric compressor that drives a fixed capacity type compression mechanism with a fixed discharge capacity by an electric motor.

  The condensing unit 22 is a heat exchanger that condenses the high-pressure refrigerant by exchanging heat between the high-pressure refrigerant discharged from the compressor 21 and the cooling water flowing through the cooling water circuit 1, and corresponds to the second heat radiating unit of the present invention. doing. The condensing unit 22 releases the condensation heat generated when condensing the high-pressure refrigerant (gas phase refrigerant) to the cooling water.

  The condensing part 22 of this embodiment is comprised so that the high pressure refrigerant | coolant discharged from the compressor 21 and the cooling water which flows through the cooling water circuit 1 may exchange heat directly. Further, the condensing unit 22 of this embodiment is disposed between the outlet side of the inverter 11 and the inlet side of the radiator 12 in the cooling water circuit 1.

  The expansion valve 23 is a decompression unit that decompresses and expands the liquid-phase refrigerant that has flowed out of the condensing unit 22. The evaporator 24 is a heat exchanger that evaporates the low-pressure refrigerant by exchanging heat between the low-pressure refrigerant decompressed and expanded by the expansion valve 23 and the blown air (third heat medium). The evaporation unit 24 generates cold heat by evaporation of the low-pressure refrigerant (liquid phase refrigerant), and releases the cold heat to the blown air. The gas-phase refrigerant evaporated in the evaporation unit 24 is sucked into the compressor 21 and compressed.

  Next, the cooling water used in the cooling system according to the present embodiment will be described. The cooling water of the present embodiment is composed of a solution having a solvent and one kind of solute 60.

  As shown in FIG. 2, the solute 60 of the cooling water is composed of molecules including a head 61 that is a first part and a tail 62 that is a second part. The head 61 is a part that is selectively close to the solid-liquid interface 70 of the solvent when the temperature of the cooling water is equal to or lower than a predetermined reference temperature. The tail 62 is a part that is connected to the head 61 and has a sparse relationship with the solvent.

  In this embodiment, water is employed as the solvent. Further, as the head 61 of the solute 60, any one of a quaternary ammonium group, a sulfo group, an ester group, a carboxyl group, and a hydroxyl group is employed. Further, as the tail 62 of the solute 60, a tail having a plurality of carbons as a main chain and 4 or less hydrophilic groups bonded to each carbon is employed.

Specifically, a compound in which the head 61 is a trimethylammonium group and the tail 62 is a linear hydrocarbon group having 16 or less carbon atoms is employed as the solute 60 of the present embodiment. Specifically, hexadecyltrimethylammonium bromide (hereinafter also referred to as C ₁₆ TAB) is employed as the solute 60.

In addition, as the solute 60 of the present embodiment, in addition to C ₁₆ TAB, polyoxyethylene (10) octylphenyl ether (Triton (registered trademark) X-100), polyoxyethylene (25) octyldodecyl ether (emulgen ( (Registered trademark) 2025G), polyoxyethylene sorbitan oleate (Tween (registered trademark) 80), stearic acid PEG-150, myristyl sulfobetaine, sodium cholate can be employed.

  As described above, in the present embodiment, the condensing unit 22 is configured to release heat from the refrigerant to the cooling water. For this reason, in order to discharge | release the heat | fever which a refrigerant | coolant has from the condensation part 22 out of the system, it becomes unnecessary to arrange | position the condensation part 22 in series with the radiator 12 in an engine room. Thereby, the mounting space of the heat exchanger for heat dissipation in an engine room can be reduced.

  In the present embodiment, the solute 60 of the cooling water is connected to the head 61 and the head 61 that are selectively close to the solid-liquid interface 70 of the water when the cooling water temperature is equal to or lower than the reference temperature. And a molecule having a tail 62 having a sparse relationship with water.

  According to this, when the temperature of the cooling water is lowered to a reference temperature or lower, the head 61 of the solute 60 is adsorbed in close proximity to the solid-liquid interface 70 of the water. The head 61 adsorbed on the solid-liquid interface 70 of water inhibits the growth of water ice nuclei (solidification nuclei), so that the progress of freezing can be suppressed. Furthermore, since the tail 62 having a sparse relationship with water prevents water from approaching the solid-liquid interface 70, the progress of freezing can be further suppressed.

  For this reason, even if it does not contain a freezing point depressant (tylene glycol) in the cooling water, the progress of freezing of the cooling water can be delayed, that is, the freezing point of the cooling water can be lowered. Thereby, the antifreezing performance of the cooling water can be sufficiently ensured while suppressing the deterioration of the thermal properties of the cooling water and the increase in viscosity.

  Therefore, by using the cooling water of the present embodiment as the cooling water flowing through the cooling water circuit 1, the size of the radiator 12 that radiates the heat of the cooling water to the outside of the system can be reduced. Thereby, it is possible to reliably reduce the space for mounting the radiator 12 in the engine room.

  Moreover, since the increase in viscosity of the cooling water is suppressed, the power of the pump 13 can be reduced.

  By the way, as shown in FIG. 2, in the cooling water of this embodiment, when the head 61 of the solute 60 is adsorbed on the solid-liquid interface 70 of the water, the tail 62 moves around the head 61. At this time, tails 62 of adjacent solute molecules are prevented from contacting each other. Therefore, if the length of the tail 62 of the solute molecule is too long, the radius is also increased, and the distance d between adjacent solute molecules is increased, which makes it difficult to inhibit the growth of ice nuclei. Thereby, the progress inhibitory effect of freezing of cooling water will fall.

  On the other hand, as described above, when the tail 62 of the solute molecule is a linear hydrocarbon group having 16 or less carbon atoms, it is possible to prevent the tail 62 from becoming too long. For this reason, since the distance d between adjacent solute molecules can be shortened, it becomes easy to inhibit the growth of ice nuclei, and the progress of freezing of cooling water can be reliably suppressed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. The second embodiment is different from the first embodiment in that a chemical heat pump cycle is used instead of the vapor compression refrigeration cycle.

  As shown in FIG. 3, the heat transport system of the present embodiment includes a heat transfer fluid circuit 3 through which the heat transfer fluid of the chemical heat pump cycle flows. Here, the heat transfer fluid of the present embodiment corresponds to the second heat transfer medium of the present invention, and the heat transfer fluid circuit 3 of the present embodiment corresponds to the second circuit of the present invention.

  The heating medium fluid circuit 3 of the chemical heat pump cycle is provided with an evaporation unit 31, a reaction unit 32, and a first valve 33.

  The evaporator 31 is a heat exchanger that evaporates the heat medium fluid by exchanging heat between the heat medium fluid flowing through the heat medium fluid circuit 3 and the blown air. The evaporator 31 generates cold heat by evaporation of the heat transfer fluid, and releases the cold heat to the blown air.

  The reaction unit 32 contains a reaction medium that chemically reacts with the heat transfer fluid evaporated in the evaporation unit 31. The reaction unit 32 is configured to heat the cooling water flowing through the cooling water circuit 1 by reaction heat generated when the gas phase heat transfer fluid and the reaction medium are reacted to generate a compound. For this reason, the reaction part 32 of this embodiment is equivalent to the 2nd thermal radiation part of this invention.

  The reaction unit 32 of the present embodiment is configured so that the gas phase heat transfer fluid and the cooling water directly exchange heat. In addition, the reaction unit 32 of the present embodiment is disposed between the outlet side of the inverter 11 and the inlet side of the radiator 12 in the cooling water circuit 1.

  The first valve 33 is provided between the evaporation unit 31 and the reaction unit 32 in the heat transfer fluid circuit 3. The first valve 33 is first opening degree adjusting means for adjusting the opening degree of the heat transfer fluid circuit 3.

  Here, as the heat transfer fluid, a fluid in which hydrogen bonds are expressed between a plurality of molecules can be employed. As the reaction medium, a solid having an alkali metal or alkaline earth metal and halogen or oxygen can be employed. In the present embodiment, a fluid having the same configuration as the cooling water flowing through the cooling water circuit 1 is employed as the heat medium fluid, and magnesium oxide (MgO) is employed as the reaction medium.

  That is, in this embodiment, the heat transfer fluid is configured by a solution having a solvent and one kind of solute 60. The solute 60 of the heat transfer fluid is connected to the head 61 that is selectively close to the solid-liquid interface 70 of the water when the temperature of the heat transfer fluid falls below the reference temperature, and to the water. It is comprised by the molecule | numerator provided with the tail 62 which has a sparse relationship with respect to. For this reason, in this embodiment, antifreeze performance can be sufficiently ensured while suppressing deterioration in the thermal properties and increase in viscosity of the heat transfer fluid.

  Other configurations are the same as those in the first embodiment. Therefore, according to the heat transport system of the present embodiment, the same effect as that of the first embodiment can be obtained.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. The third embodiment is different from the second embodiment in the configuration of the chemical heat pump cycle.

  As shown in FIG. 4, the reaction unit 32 of this embodiment includes a reaction main body unit 321 and a condensing unit 322.

  The reaction main body 321 contains a reaction medium. The reaction main body 321 is configured to generate a compound by reacting the gas phase heat transfer fluid and the reaction medium. Further, the reaction main body 321 is configured to separate, that is, regenerate the compound into a gas phase heat transfer fluid and a reaction medium by external heat that is heat generated outside the system.

  The reaction main body 321 is connected to the inlet side of the radiator 12 in the cooling water circuit 1. Specifically, the reaction main body 321 is disposed between the outlet side of the inverter 11 and the inlet side of the radiator 12 in the cooling water circuit 1.

  The condensing part 322 is connected to the reaction main body part 321. The condensing unit 322 is a heat exchanger that condenses the gas phase heat medium fluid generated in the reaction main body 321. The condensing unit 322 is configured to heat the cooling water flowing through the cooling water circuit 1 by the condensation heat generated when the vapor phase heat transfer fluid is condensed. The condensing part 322 of this embodiment is comprised so that a gaseous-phase heat-medium fluid and cooling water may heat-exchange directly.

  The condensing part 322 of this embodiment is connected to the outlet side of the radiator 12 in the cooling water circuit 1. Specifically, the condensing unit 322 is disposed between the outlet side of the radiator and the suction side of the pump 13 in the cooling water circuit 1.

  A second valve 34 is provided between the outlet side of the reaction main body 321 and the inlet side of the condensing unit 322 in the heat transfer fluid circuit 3. The second valve 34 is a second opening degree adjusting means for adjusting the opening degree of the heat transfer fluid circuit 3.

  The heat transfer fluid circuit 3 has a connection flow path 35 that connects the outlet side of the condensing unit 322 and the inlet side of the evaporation unit 31. Thereby, the heat-medium fluid circuit 3 is comprised by the cyclic | annular form.

  By the way, in this embodiment, the exhaust heat of the engine (internal combustion engine) 41 is employ | adopted as external heat which heats the compound in the reaction main-body part 321. FIG.

  The engine 41 is a second heat source that generates heat higher than the heat generated by the inverter 11 that is the first heat source. The engine 41 is configured to release the high-temperature heat into the high-temperature cooling water.

  The heat transport system of the present embodiment includes a high-temperature cooling water circuit 4 through which high-temperature cooling water flows while connecting the engine 41 and the reaction main body 321. Here, the high temperature cooling water of the present embodiment corresponds to the fourth heat medium of the present invention, and the high temperature cooling water circuit 4 of the present embodiment corresponds to the third circuit of the present invention.

  The reaction main body 321 is configured to exchange heat with the high-temperature cooling water flowing through the high-temperature cooling water circuit 4. The reaction main body 321 is configured to separate the compound into a gas phase heat transfer fluid and a reaction medium by the heat of the high-temperature cooling water.

  The high-temperature cooling water circuit 4 is provided with a bypass channel 42 that allows the cooling water to flow around the reaction main body 321. A flow path switching valve 43 for adjusting the flow rate of the high temperature cooling water flowing through the bypass flow path 42 is provided at a branch point between the high temperature cooling water circuit 4 and the bypass flow path 42.

  Next, the operation of the heat transport system according to this embodiment will be described.

  When the chemical heat pump cycle is driven, that is, when the blown air is cooled, the first valve 33 is opened and the second valve 34 is closed. Further, the flow path switching valve 43 is switched so as to close the reaction main body 321 side and open the bypass flow path 42 side.

  Thereby, as shown by the solid line arrow in FIG. 4, in the evaporation unit 31, heat exchange is performed between the heat transfer fluid and the blown air, and the heat transfer fluid is evaporated. At this time, in the evaporation part 31, the cold heat produced | generated by evaporation of a heat-medium fluid is discharge | released to blowing air, and blowing air is cooled.

  Then, the gas phase heat transfer fluid evaporated in the evaporation section 31 flows into the reaction main body section 321. Thereby, in the reaction main body 321, the gas phase heat transfer fluid and the reaction medium react to generate a compound. At this time, the reaction heat generated in the reaction main body 321 is released to the cooling water flowing through the cooling water circuit 1, and the cooling water is heated. Heat of the cooling water heated by the reaction main body 321 is released to the outside air through the radiator 12.

  On the other hand, when the chemical heat pump cycle is stopped, that is, when the compound in the reaction main body 321 is regenerated, the first valve 33 is closed and the second valve 34 is opened. Further, the flow path switching valve 43 is switched so as to open the reaction main body 321 side and close the bypass flow path 42 side.

  Thereby, as shown by the broken line arrow in FIG. 4, the high-temperature cooling water flows through the reaction main body 321, and the compound is heated by the heat of the high-temperature cooling water. The compound is then separated into a gas phase heat transfer fluid and a reaction medium.

  The gas phase heat transfer fluid generated in the reaction main body 321 flows into the condensing unit 322. And in the condensation part 322, heat exchange is performed between the gaseous-phase heat-medium fluid which flowed into the condensation part 322, and the cooling water which flows through the cooling water circuit 1, and a heat-medium fluid condenses. At this time, the heat of condensation generated in the condensing unit 322 is released to the cooling water flowing through the cooling water circuit 1, and the cooling water is heated. Heat of the cooling water heated by the condensing unit 322 is released to the outside air via the radiator 12.

  Then, the liquid-phase heat transfer fluid condensed in the condensing unit 322 flows into the evaporating unit 31 through the connection channel 35.

  Here, in this embodiment, the fluid of the structure similar to the cooling water which distribute | circulates the cooling water circuit 1 is employ | adopted as high temperature cooling water. That is, in this embodiment, the high-temperature cooling water is constituted by a solution having a solvent and one kind of solute 60. The solute 60 of the heat transfer fluid is connected to the head 61 that is selectively close to the solid-liquid interface 70 of the water when the temperature of the heat transfer fluid falls below the reference temperature, and to the water. It is comprised by the molecule | numerator provided with the tail 62 which has a sparse relationship with respect to. For this reason, in this embodiment, antifreeze performance can be sufficiently ensured while suppressing deterioration of the thermal properties of high-temperature cooling water and an increase in viscosity.

  Other configurations are the same as those of the second embodiment. Therefore, according to the heat transport system of this embodiment, the same effect as that of the second embodiment can be obtained. Furthermore, the compound can be regenerated by configuring the reaction main body 321 so that the compound is heated by the exhaust heat of the engine 1, that is, the heat of the high-temperature cooling water.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. The fourth embodiment is different from the second embodiment in that an absorption heat pump cycle is used instead of the chemical heat pump cycle. That is, in the fourth embodiment, an absorption unit 36 is provided instead of the reaction unit 32 of the second embodiment, and other configurations are the same as those of the second embodiment.

  As shown in FIG. 5, the heat transport system of the present embodiment includes a heat transfer fluid circuit 3 through which the heat transfer fluid of the absorption heat pump cycle flows. Here, the heat transfer fluid of the present embodiment corresponds to the second heat transfer medium of the present invention, and the heat transfer fluid circuit 3 of the present embodiment corresponds to the second circuit of the present invention.

  The heat transfer fluid circuit 3 of the absorption heat pump cycle is provided with an evaporation unit 31, an absorption unit 36, and a first valve 33.

  The absorption unit 36 accommodates an absorption medium that absorbs the heat medium fluid evaporated by the evaporation unit 31. The absorption unit 36 is configured to heat the cooling water flowing through the cooling water circuit 1 by absorption heat generated when the gas phase heat transfer fluid is absorbed by the absorption medium. For this reason, the absorption part 36 of this embodiment is equivalent to the 2nd thermal radiation part of this invention.

  The absorber 36 of the present embodiment is configured such that the gas phase heat transfer fluid and the cooling water directly exchange heat. Further, the absorption portion 36 of the present embodiment is disposed between the outlet side of the inverter 11 and the inlet side of the radiator 12 in the cooling water circuit 1.

  The first valve 33 of the present embodiment is provided between the evaporation unit 31 and the absorption unit 36 in the heat transfer fluid circuit 3. The first valve 33 is third opening degree adjusting means for adjusting the opening degree of the heat transfer fluid circuit 3.

  In this embodiment, water is used as the heat transfer fluid and lithium bromide is used as the absorption medium. Further, ammonia may be employed as the heat transfer fluid, and water may be employed as the absorption medium.

  In addition, you may use the fluid of the structure similar to the cooling water which distribute | circulates the cooling water circuit 1 as a heat-medium fluid. According to this, the antifreeze performance can be sufficiently ensured while suppressing the deterioration of the thermal properties of the heat transfer fluid and the increase in viscosity.

  Other configurations are the same as those of the second embodiment. Therefore, according to the heat transport system of this embodiment, the same effect as that of the second embodiment can be obtained.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG. The fifth embodiment is different from the third embodiment in that an absorption heat pump cycle is used instead of the chemical heat pump cycle. That is, the fifth embodiment is provided with an absorption main body 361 instead of the reaction main body 321 of the third embodiment, and the other configurations are the same as those of the third embodiment.

  As shown in FIG. 6, the absorption unit 36 of the present embodiment includes an absorption main body 361 and a condensing unit 322.

  The absorption main body 361 contains an absorption medium. The absorption main body 361 is configured to absorb the gas phase heat transfer fluid into the absorption medium. Further, the absorption main body 361 is configured to separate, that is, regenerate, the absorption medium that has absorbed the heat medium fluid into the gas phase heat medium fluid and the absorption medium by external heat that is heat generated outside the system. ing.

  The absorption main body 361 is connected to the inlet side of the radiator 12 in the cooling water circuit 1. Specifically, the absorption main body 361 is disposed between the outlet side of the inverter 11 and the inlet side of the radiator 12 in the cooling water circuit 1.

  The second valve 34 of the present embodiment is provided between the outlet side of the absorption main body 361 and the inlet side of the condensing unit 322 in the heat transfer fluid circuit 3. The second valve 34 is fourth opening degree adjusting means for adjusting the opening degree of the heat transfer fluid circuit 3.

  By the way, in this embodiment, the exhaust heat of the engine 41 is employ | adopted as external heat which heats the absorption medium which absorbed the heat transfer fluid in the absorption main-body part 361.

  The heat transport system of the present embodiment includes a high-temperature cooling water circuit 4 through which high-temperature cooling water flows while connecting the engine 41 and the absorption main body 361. The absorption main body 361 is configured to separate the absorption medium that has absorbed the heat medium fluid into the gas phase heat medium fluid and the reaction medium by the heat of the high temperature cooling water flowing through the high temperature cooling water circuit 4. Here, the high temperature cooling water of the present embodiment corresponds to the fourth heat medium of the present invention, and the high temperature cooling water circuit 4 of the present embodiment corresponds to the third circuit of the present invention.

  Next, the operation of the heat transport system according to this embodiment will be described.

  When driving the absorption heat pump cycle, that is, when cooling the blown air, the first valve 33 is opened and the second valve 34 is closed. Further, the flow path switching valve 43 is switched so that the absorption main body 361 side is closed and the bypass flow path 42 side is opened.

  Thereby, as shown by the solid line arrow in FIG. 6, in the evaporation unit 31, heat exchange is performed between the heat transfer fluid and the blown air, and the heat transfer fluid is evaporated. At this time, in the evaporation part 31, the cold heat produced | generated by evaporation of a heat-medium fluid is discharge | released to blowing air, and blowing air is cooled.

  The vapor phase heat transfer fluid evaporated in the evaporation unit 31 flows into the absorption main body 361. Thereby, in the absorption main body 361, the gas phase heat transfer fluid is absorbed by the absorption medium. At this time, the absorbed heat generated in the absorption main body 361 is released to the cooling water flowing through the cooling water circuit 1, and the cooling water is heated. Heat of the cooling water heated by the absorption main body 361 is released to the outside air via the radiator 12.

  On the other hand, when the absorption heat pump cycle is stopped, that is, when the absorption medium that has absorbed the heat transfer fluid in the absorption main body 361 is regenerated, the first valve 33 is closed and the second valve 34 is opened. Further, the flow path switching valve 43 is switched so that the absorption main body 361 side is opened and the bypass flow path 42 side is closed.

  Thereby, as shown by the broken line arrow in FIG. 6, the high-temperature cooling water flows through the absorption main body 361, and the absorption medium that has absorbed the heat transfer fluid is heated by the heat of the high-temperature cooling water. Then, the absorption medium that has absorbed the heat transfer fluid is separated into a gas phase heat transfer fluid and an absorption medium.

  The gas phase heat transfer fluid generated in the absorption main body 361 flows into the condensing unit 322. And in the condensation part 322, heat exchange is performed between the gaseous-phase heat-medium fluid which flowed into the condensation part 322, and the cooling water which flows through the cooling water circuit 1, and a heat-medium fluid condenses. At this time, the heat of condensation generated in the condensing unit 322 is released to the cooling water flowing through the cooling water circuit 1, and the cooling water is heated. Heat of the cooling water heated by the condensing unit 322 is released to the outside air via the radiator 12.

  Then, the liquid-phase heat transfer fluid condensed in the condensing unit 322 flows into the evaporating unit 31 through the connection channel 35.

  Other configurations are the same as those of the third embodiment. Therefore, according to the heat transport system of this embodiment, the same effect as that of the third embodiment can be obtained.

(Other embodiments)
The present invention is not limited to the above-described embodiment, and can be variously modified as follows, for example, within a range not departing from the gist of the present invention. Further, the means disclosed in each of the above embodiments may be appropriately combined within a practicable range.

  (1) Although the said 1st Embodiment demonstrated the example which comprised the condensation part 22 so that a high pressure refrigerant | coolant and cooling water might exchange heat directly, the structure of the condensation part 22 is not limited to this. For example, you may comprise the condensation part 22 so that a high pressure refrigerant | coolant and cooling water may heat-exchange through another heat medium.

  Similarly, in the said 2nd Embodiment, you may comprise the reaction part 32 so that a gaseous-phase heat-medium fluid and cooling water may heat-exchange through another heat medium. Moreover, in the said 3rd, 5th embodiment, you may comprise the condensation part 322 so that a gaseous-phase heat-medium fluid and cooling water may heat-exchange through another heat medium. Moreover, in the said 4th Embodiment, you may comprise the absorption part 36 so that a gaseous-phase heat-medium fluid and cooling water may heat-exchange through another heat medium.

  (2) In the above embodiment, the example in which the inverter 11 is employed as the first heat source has been described. However, the first heat source is not limited to this. For example, a fuel cell, a battery, or the like may be employed as the first heat source.

1 Cooling water circuit (first circuit)
2 Refrigerant circuit (second circuit)
11 Inverter (first heat source)
12 Radiator (first heat dissipation part)
22 Condensing part (second heat dissipation part)
24 Evaporating part 60 Solute 61 Head (first part)
62 Tail (second part)
70 Solid-liquid interface

Claims (14)

A first circuit (1) through which the liquid first heat medium circulates and a second circuit (2, 3) through which the second heat medium circulates,
The first circuit (1) includes a first heat source (11) that generates heat, and a first heat radiating part (12) that releases heat to the outside of the system,
The second circuit (2, 3) includes an evaporation section (24, 31) that generates cold by evaporation of the liquid second heat medium, and a gaseous state evaporated in the evaporation section (24, 31). A heat transport system having a second heat radiating part (22, 32, 36) for releasing heat from the second heat medium,
The second heat radiating part (22, 32, 36) is configured to release heat from the second heat medium to the first heat medium to heat the first heat medium,
The first circuit (1) discharges the heat of the first heat medium heated in the second heat radiating part (22, 32, 36) from the first heat radiating part (12) to the outside of the system. Configured,
The first heat medium is composed of a solution having a solvent and at least one kind of solute (60),
The at least one solute (60) is:
When the temperature of the first heat medium becomes equal to or lower than a predetermined reference temperature, the solid-liquid interface (70) of the solvent is selectively adsorbed to inhibit the solidification nucleus growth of the solvent. A first part (61);
A molecule comprising a second site (62) connected to the first site (61) and having a sparse relationship with the solvent (however, hexadecyltrimethylammonium bromide, polyoxyethylene (10)) A heat transport system comprising octyl phenyl ether, polyoxyethylene sorbitan oleate and sodium cholate) . The said 2nd thermal radiation part is a condensing part (22) which discharge | releases the condensation heat which arises when condensing the said gaseous 2nd heat medium to a said 1st heat medium. Heat transport system. The said 2nd thermal radiation part is a reaction part (32) which discharge | releases the reaction heat which arises when carrying out a chemical reaction of the said gaseous 2nd heat medium to a said 1st heat medium. Heat transfer system. The said 2nd thermal radiation part is an absorption part (36) which discharge | releases to the said 1st heat medium the absorption heat produced when absorbing the said gaseous 2nd heat medium. Heat transport system. A compressor (21) that compresses and discharges the second heat medium between the outlet side of the evaporation section (24) and the inlet side of the condensing section (22) in the second circuit (2). Provided,
The second heat medium flowing out from the condensing unit (22) is depressurized between the outlet side of the condensing unit (22) and the inlet side of the evaporating unit (24) in the second circuit (2). Decompression means (23) is provided,
The condensing unit (22) is configured to heat-exchange the high-pressure second heat medium discharged from the compressor (21) and the first heat medium to condense the high-pressure second heat medium. Has been
The evaporating section (24) is configured to evaporate the low-pressure second heat medium by exchanging heat between the low-pressure second heat medium and the third heat medium decompressed by the decompression means (23). The heat transport system according to claim 2, wherein The reaction section (32) is configured to heat the first heat medium by reaction heat generated when the second heat medium and the reaction medium are reacted to generate a compound.
Between the evaporation part (31) and the reaction part (32) in the second circuit (3), a first opening degree adjusting means (33) for adjusting the opening degree of the second circuit (3) is provided. The heat transport system according to claim 3, wherein the heat transport system is provided. The reaction part (32)
A reaction main body (321) for separating the compound into the gaseous second heat medium and the reaction medium by external heat, which is heat generated outside the system;
A condensing part (322) for condensing the gaseous second heat medium generated in the reaction main body part (321),
The condensing unit (322) is configured to heat the first heat medium by condensation heat generated when the gaseous second heat medium is condensed.
The reaction main body part (321) is connected to the inlet side of the first heat radiation part (12) in the first circuit (1),
The condensing part (322) is connected to the outlet side of the first heat radiating part (12) in the first circuit (1),
Between the outlet side of the reaction main body (321) and the inlet side of the condensing part (322) in the second circuit (3), a second opening for adjusting the opening degree of the second circuit (3). Degree adjusting means (34) is provided,
The said 2nd circuit (3) has a connection flow path (35) which connects the exit side of the said condensation part (322), and the entrance side of the said evaporation part (31), It is characterized by the above-mentioned. 6. The heat transport system according to 6. Further, the second heat source (41) that releases heat higher than heat generated by the first heat source (11) to the fourth heat medium is connected to the reaction main body (321), and the fourth heat A third circuit (4) through which the medium circulates;
The reaction main body (321) is configured to exchange heat with the fourth heat medium flowing through the third circuit (4),
The said reaction main-body part (321) is comprised so that the said compound may be isolate | separated into the said gaseous 2nd heat medium and the said reaction medium with the heat | fever which the said 4th heat medium has. Heat transfer system as described in. The second heat medium is a fluid in which hydrogen bonds develop between a plurality of molecules,
9. The heat transport system according to claim 6, wherein the reaction medium is a solid having an alkali metal or an alkaline earth metal and halogen or oxygen. The second heat medium is composed of a solution having a solvent and at least one kind of solute (60),
The at least one solute (60) of the second heat medium is:
When the temperature of the second heat medium is below a predetermined reference temperature, the first portion for selectively proximity (61) to the solid-liquid interface (70) of the solvent of the second heat medium,
The second heat medium is connected to the first part (61) and includes a second part (62) having a sparse relationship with the solvent of the second heat medium. The heat transport system according to claim 9. The absorption part (36) is configured to heat the first heat medium by absorption heat generated when the second heat medium is absorbed by the absorption medium,
Between the evaporation part (31) and the absorption part (36) in the second circuit (3), there is a third opening degree adjusting means (33) for adjusting the opening degree of the second circuit (3). The heat transport system according to claim 4, wherein the heat transport system is provided. The absorption part (36)
Absorption main body (361) configured to separate the absorption medium that has absorbed the second heat medium into the gaseous second heat medium and the absorption medium by external heat that is heat generated outside the system. )When,
A condensing part (322) for condensing the gaseous second heat medium generated in the absorption body part (361),
The condensing unit (322) is configured to heat the first heat medium by condensation heat generated when the gaseous second heat medium is condensed.
The absorption main body (361) is connected to the inlet side of the first heat dissipation part (12) in the first circuit (1),
The condensing part (322) is connected to the outlet side of the first heat radiating part (12) in the first circuit (1),
Between the outlet side of the absorption main body (361) and the inlet side of the condenser (322) in the second circuit (3), a fourth opening for adjusting the opening degree of the second circuit (3). Degree adjusting means (34) is provided,
The said 2nd circuit (3) has a connection flow path (35) which connects the exit side of the said condensation part (322), and the entrance side of the said evaporation part (31), It is characterized by the above-mentioned. 11. The heat transport system according to 11. Furthermore, the second heat source (41) that releases heat higher than heat generated by the first heat source (11) to the fourth heat medium is connected to the absorption main body (361), and the fourth heat A third circuit (4) through which the medium circulates,
The absorption main body (361) is configured to exchange heat with the fourth heat medium flowing through the third circuit (4),
The absorption main body (361) is configured to separate the absorption medium that has absorbed the second heat medium into the gaseous second heat medium and the absorption medium by the heat of the fourth heat medium. The heat transport system according to claim 12, wherein The fourth heat medium is composed of a solution having a solvent and at least one kind of solute (60),
The at least one solute (60) of the fourth heat medium is:
When the temperature of the fourth heat medium is below a predetermined reference temperature, the first portion for selectively proximity (61) to the solid-liquid interface (70) of the solvent of the fourth heat medium,
The second heat medium is connected to the first part (61) and includes a second part (62) having a sparse relationship with the solvent of the fourth heat medium. The heat transport system according to claim 8 or 13, characterized in that

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