JP6422726B2 - Heat sink with circuit board and manufacturing method thereof - Google Patents

Description

  The present invention relates to a heat sink with a circuit board and a manufacturing method thereof.

  A power conversion device such as an inverter or a converter incorporates a semiconductor module having a semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) or a diode. The semiconductor module has a circuit board on which a semiconductor element is mounted, and a heat sink that is bonded to the circuit board and dissipates heat generated from the semiconductor element.

  The heat sink is made of copper, copper alloy or the like having high thermal conductivity and excellent workability. The circuit board is formed by bonding metal plates to both surfaces of a ceramic plate, and a semiconductor element is mounted on the surface of one metal plate. The other metal plate of the circuit board is joined to the heat sink via a solder layer or the like.

  The conventional semiconductor module has a problem that the thermal expansion coefficient is greatly different between the ceramic plate and the heat sink, so that thermal stress is applied to the ceramic plate as the semiconductor element generates heat, and warping and cracking occur. In response to such problems, various techniques have been proposed to alleviate the thermal stress applied to the ceramic plate and reduce the occurrence of cracks and the like. For example, in Patent Document 1, in a ceramic circuit board in which a metal circuit board is bonded to the front surface side of the ceramic substrate and a back metal plate is bonded to the back surface side, the thickness of the metal circuit board is 10% to 90% of the thickness of the metal circuit board. A technique for providing a thermal stress relaxation portion having a depth has been proposed.

JP 2003-17627 A

  In recent years, there is an increasing demand for further cost reduction and weight reduction of semiconductor modules. Therefore, it has been studied to change the material of the heat sink and the metal plate to an aluminum material that is cheaper and lighter than copper.

  When the material of the heat sink and the metal plate is changed to an aluminum material, it is necessary to join the heat sink and the circuit board by brazing in order to ensure the reliability of the joining. However, since brazing has a higher bonding temperature than conventional soldering, it is necessary to relieve thermal stress applied to the ceramic substrate by forming more thermal stress relaxation portions than in the past. On the other hand, if a large number of thermal stress relaxation portions are formed, the bonding area between the heat sink and the circuit board decreases, resulting in a deterioration in heat dissipation performance.

  Moreover, when the thermal stress relaxation part recessed in the back metal plate like the ceramic circuit board described in patent document 1 is provided, there exists a possibility that a brazing may flow in in a thermal stress relaxation part in brazing operation | work. In this case, since the surface of the thermal stress relaxation portion is brazed and the wax is filled in the thermal stress relaxation portion, the effect of relaxing the thermal stress may be insufficient.

  As described above, when an aluminum material is used for the heat sink and the metal plate, there is a problem that it is difficult to achieve both the effect of relaxing the thermal stress and the heat dissipation performance. Therefore, there is a demand for a technique for improving the durability of the semiconductor module by ensuring the heat dissipation performance equivalent to or higher than that of the conventional one and reducing the occurrence of warpage and cracks in the ceramic substrate.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a heat sink with a circuit board having excellent heat dissipation performance and durability.

One aspect of the present invention is a ceramic plate, a first conductor plate made of an aluminum material joined to the front side surface of the ceramic plate, and a second conductor made of an aluminum material and made of a rectangular shape, joined to the back side surface of the ceramic plate. A circuit board having a board;
A heat sink body made of an aluminum material and joined via a brazing filler metal layer and the second conductor plate;
The heat sink body has a flat base portion to which the circuit board is joined,
The base portion is a clad plate in which either JIS A 6000 series aluminum alloy or JIS A 3000 series aluminum alloy is clad with JIS A 1000 series aluminum, and JIS A 1000 series aluminum is arranged on the circuit board side,
The brazing material layer has a non-joined portion that is depressed from the surrounding joining interface without joining to at least one of the second conductor plate and the heat sink body,
The outer periphery edge of the second conductor plate, the two first dividing lines parallel to any side of the outer edge, and the two second dividing lines orthogonal to the first dividing line. When the surface of the two-conductor plate is equally divided into nine virtual regions, the four corner virtual regions arranged in the corners are compared with the other virtual regions in that the non-joined portions are The heat sink with a circuit board is characterized in that the area ratio of the non-bonded region projected onto the two-conductor plate is large.

Another aspect of the present invention is a method of manufacturing a heat sink with a circuit board according to the above aspect,
A pre-coating agent for preventing the inflow of wax is applied in advance to at least one of the heat sink body or the second conductor plate,
Next, the brazing material and the circuit board are mounted on the heat sink body,
Thereafter, the heat sink body, the brazing material, and the circuit board are heated to be brazed, and the heat sink body and the circuit board are joined via the brazing material layer, and the joining prevention in the brazing material layer is performed. The non-joint portion is formed on the agent.

  The heat sink with a circuit board has a non-joined part which is depressed from the surrounding joining interface without joining to at least one of the second conductor plate and the heat sink body in a part of the brazing material layer. Therefore, unlike the case where the concave thermal stress relaxation portion is provided on the second conductor plate, there is no possibility that the thermal stress relaxation portion is filled with wax. As a result, it is possible to reliably obtain the effect of relaxing the thermal stress applied to the ceramic plate.

  In addition, the four corner virtual regions have a larger area ratio of the non-joined regions formed by projecting the non-joined portions onto the second conductor plate than the other virtual regions. That is, the non-joining part is formed more in the vicinity of the corner part of the brazing material layer. Since the thermal stress applied to the ceramic plate tends to increase as the distance from the central portion increases, as described above, by forming more non-joined portions near the corners of the brazing material layer, The applied thermal stress can be effectively relieved.

  Further, the temperature of the circuit board tends to increase as it approaches the center while the semiconductor element is operating. For this reason, if there are too many non-joined portions in the vicinity of the central portion of the brazing filler metal layer, the thermal resistance may increase and the heat dissipation performance may deteriorate. On the other hand, the non-joining part existing in the vicinity of the corner of the brazing filler metal layer has a smaller adverse effect on the heat dissipation performance than the non-joining part existing in the vicinity of the central part. Therefore, the heat sink with a circuit board can suppress deterioration of heat dissipation performance by forming more non-joined portions near the corners of the brazing material layer.

  As a result, the heat sink with a circuit board can suppress the occurrence of warpage and cracks in the ceramic plate while ensuring heat dissipation performance equivalent to or higher than that of the conventional heat sink. Therefore, the heat sink with a circuit board has excellent heat dissipation performance and durability.

  Moreover, the manufacturing method of said aspect has apply | coated beforehand the joining inhibitor which prevents the inflow of a solder | pewter to at least one of the said heat sink main body or the said 2nd conductor board. Thus, by using the said joining inhibitor, it can prevent that a solder | flow flows in on a joining inhibitor in a brazing operation | work, and can form the said non-joining part in the said brazing | wax material layer reliably. Moreover, the operation | work which apply | coats the said joining inhibitor can be performed comparatively simply, and can be easily integrated in the manufacturing process of the heat sink with a circuit board performed conventionally. Therefore, the manufacturing method has excellent productivity.

Sectional drawing of the heat sink with a circuit board in a reference example . The top view of the base part of the state which apply | coated the joining inhibitor in a reference example . 1 is a cross-sectional view of a heat sink with a circuit board in Embodiment 1. FIG. The top view of the base part of the state which apply | coated the joining inhibitor in a comparative example.

  The heat sink with a circuit board is used as a semiconductor module in which a semiconductor element is mounted on the surface of the first conductor plate. The non-joining portion in the brazing material layer may exist on the heat sink main body side or may exist on the second conductor plate side. Further, the non-joining portion may exist on both the heat sink side with the circuit board and the second conductor plate side. In any case, the presence of the non-bonded portion can provide an effect of relaxing the thermal stress applied to the ceramic plate.

  The first conductor plate, the second conductor plate, and the heat sink body are made of an aluminum material. Here, the above “aluminum material” includes pure aluminum and aluminum alloys. The materials of the first conductor plate, the second conductor plate, and the heat sink body can be appropriately selected from pure aluminum and aluminum alloy according to the required mechanical characteristics, corrosion resistance, workability, and the like.

The heat sink body has a flat base portion to which the circuit board is bonded, and the base portion is made of either JIS A 6000 series aluminum alloy or JIS A 3000 series aluminum alloy with JIS A 1000 series aluminum. It consists cladded clad plate, JIS a 1000 series aluminum on the circuit substrate side that has been arranged. Therefore , the thermal stress applied to the ceramic plate can be reduced, and the warpage of the heat sink body can be suppressed.

  That is, since 1000 series aluminum has comparatively low material strength, when it is used alone for the heat sink body, the thermal stress applied to the ceramic plate can be reduced. However, since the heat sink body made of 1000 series aluminum is likely to undergo creep deformation, the heat sink body may be warped when used over a long period of time. On the other hand, since the 6000 series aluminum alloy and the 3000 series aluminum alloy hardly cause creep deformation, the occurrence of warping can be suppressed over a long period of time when used alone in the heat sink body. However, a heat sink body made of a 6000 series aluminum alloy or a 3000 series aluminum alloy tends to increase the thermal stress applied to the ceramic plate because of its high material strength.

  Therefore, by using 1000 series aluminum on the side on which the circuit board is mounted, the thermal stress applied to the ceramic plate can be reduced, and on the side opposite to the circuit board, a 6000 series aluminum alloy or 3000 series that hardly undergoes creep deformation. By using an aluminum alloy, it is possible to suppress warping of the heat sink body.

  It is preferable that the cladding ratio of 1000 series aluminum in the said base part, ie, the thickness of 1000 series aluminum with respect to the thickness of the said whole base part, is 3 to 40%. When the cladding rate is less than 3%, the effect of relaxing the thermal stress applied to the circuit board may be insufficient. On the other hand, when the cladding ratio exceeds 40%, the effect of suppressing warpage may be insufficient.

  The heat sink body having the above-described configuration is prepared in advance by, for example, preparing a clad plate in which 1000 series aluminum is clad on a 6000 series aluminum alloy or a clad plate in which 1000 series aluminum is clad on a 3000 series aluminum alloy, It can be produced by forging or cutting the clad plate.

  The heat sink body can take various forms according to required cooling performance and arrangement space. For example, the heat sink body may have a heat radiating fin erected from the base portion. As the heat radiation fin, a heat radiation fin having a known shape such as a pin fin, a plate fin, or a corrugated fin can be employed. These radiating fins can be formed integrally with the base portion by, for example, extrusion, forging, cutting, or the like. Moreover, after preparing a base part and a radiation fin separately, you may join both by brazing etc.

  Further, the heat sink body may be a cooling pipe having therein a coolant channel through which a cooling medium flows.

  In the production method of the above aspect, the bonding inhibitor can be applied by various methods such as a drawing method using a dispenser, a transfer method using a stamp, and a printing method such as screen printing.

  As said joining inhibitor, what exists stably in the temperature of about 600 degreeC which is the brazing temperature of an aluminum material is preferable. By using such a bonding inhibitor, it is possible to reliably prevent the inflow of the wax, and as a result, it is possible to reliably form the non-bonded portion. For example, as the bonding inhibitor, titanium oxide, a composition containing titanium oxide, or the like can be used.

  Moreover, in the manufacturing method of said aspect, it is preferable to braze without using a flux. In brazing of an aluminum material, a flux such as potassium fluoroaluminate is often used in order to break the oxide film on the surface of the aluminum material and improve the wettability of the brazing material. However, these fluxes may react with the bonding inhibitor and impair the effect of preventing the inflow of wax. Such a problem can be avoided by performing brazing without using a flux.

  When brazing without using a flux, for example, a vacuum brazing method in which brazing is performed under reduced pressure or a fluxless brazing method in an inert gas atmosphere can be employed.

( Reference example )
A reference example of the heat sink with the circuit board will be described with reference to the drawings. As shown in FIG. 1, the heat sink 1 with a circuit board has a circuit board 2 and a heat sink body 3, and the circuit board 2 and the heat sink body 3 are joined by brazing. The circuit board 2 includes a ceramic plate 21, a first conductor plate 22 made of an aluminum material joined to the front side surface of the ceramic plate 21, and a second conductor made of an aluminum material joined to the back side surface of the ceramic plate 21 and having a rectangular shape. And a plate 23. The heat sink body 3 is made of an aluminum material, and is joined to the second conductor plate 23 via the brazing material layer 4.

  As shown in FIG. 1, the brazing filler metal layer 4 has a non-joining portion 42 that is recessed from the surrounding joining interface 41 without joining to at least one of the second conductor plate 23 and the heat sink body 3. As is known from FIG. 2, the outer periphery edge 231 of the second conductor plate 23 and the two first dividing lines D1 and the first dividing line D1 that are parallel to either side of the outer edge 231 are orthogonal to each other. When the surface of the second conductor plate 23 is equally divided into nine virtual regions R along the two second dividing lines D2, the four corner virtual regions RE arranged at the corners are other than these. Compared with the virtual region R (RC, RM), the area ratio of the non-joint region formed by projecting the non-joint portion 42 onto the second conductor plate 23 is large. Hereafter, each part is explained in full detail with the manufacturing method of the heat sink 1 with a circuit board of this example.

  First, a heat sink body 3, a brazing material, and a circuit board 2 having the following configuration were prepared. The heat sink main body 3 is composed of JIS A 1050, and includes a flat plate-like base portion 31 and a radiating fin portion 32 erected from the base portion 31 as shown in FIG. The base portion 31 has dimensions of a length of 100 mm, a width of 100 mm, and a thickness of 3 mm. The radiating fin portion 32 is a plate fin in which a large number of fin plates 321 are arranged in the thickness direction. Moreover, the radiation fin part 32 is integrally formed with the base part 31 by the forging process.

  The ceramic plate 21 in the circuit board 2 is made of AlN (aluminum nitride) and has a square shape that is smaller in length and width than the base portion 31. Further, the first conductor plate 22 and the second conductor plate 23 are made of JIS A 1000 series aluminum and have a square shape whose length and width are smaller than those of the ceramic plate 21. Specifically, one side of the first conductor plate 22 and the second conductor plate 23 used in this example is 88 mm.

  As the brazing material, an aluminum alloy foil made of JIS A 4050 alloy was used. The thickness of the brazing material was 100 μm. Further, a flux containing potassium fluoroaluminate was previously applied to the surface of the brazing material.

  Next, the bonding inhibitor 5 for preventing the inflow of the solder was applied to the region where the second conductor plate 23 of the base portion 31 of the heat sink body 3 is bonded. In this example, as shown in FIG. 2, a lattice-like pattern composed of 10 coating lines L1 parallel to the length direction of the base portion 31 and 10 coating lines L2 parallel to the width direction is drawn. The line width of the coating lines L1 and L2 was 2.3 mm, and the coating thickness of the bonding inhibitor 5 was 5 μm. Further, as the bonding inhibitor 5, one containing titanium oxide was used.

  Further, in this example, the coating lines L1 and L2 are drawn so that the distance between the adjacent coating lines L1 and L2 becomes narrower as the distance from the center of the base portion 31 decreases, and the coating passes over each corner virtual region RE. The number of lines L1 and L2 was made larger than the number of coating lines L1 and L2 passing over the central virtual region RC (described later). Specifically, as shown in FIG. 2, the distance d1 between the adjacent coating lines L1 and L2 in the central portion of the base portion 31 is set to 17.7 mm, and the adjacent coating lines L1 and The distance between the coating lines L1 and L2 was gradually reduced so that the distance d2 between L2 was 7.7 mm and the distance d3 was 2.7 mm. As a result, a coating pattern in which four coating lines L1 and four coating lines L2 pass through each corner virtual region RE and two coating lines L1 and two coating lines L2 pass through the central virtual region RC is drawn. .

  After the bonding inhibitor 5 is applied as shown in FIG. 2, a brazing material is loaded on the base portion 31, and then the circuit board 2 is placed on the brazing material so that the second conductor plate 23 and the brazing material come into contact with each other. Loaded. Then, these were heated and brazed, and the heat sink 1 with a circuit board was obtained.

  The solder melted in the brazing operation wets and spreads in substantially the same shape as the second conductor plate 23 when viewed from the thickness direction of the brazing material layer 4, and becomes a brazing material layer 4 having a substantially rectangular shape. Further, a non-joining portion 42 that was not covered with the brazing filler metal layer 4 was formed in the portion of the base portion 31 to which the joining inhibitor 5 was applied. As shown in FIG. 1, the recess depth of the non-joining portion 42 is less than 0.1 mm, and the non-joining portion 42 was not formed between the second conductor plate 23 and the brazing material layer 4.

  The shape of the non-bonded region formed by projecting the non-bonded portion 42 onto the second conductor plate 23 was the same shape as the application pattern of the bonding inhibitor 5 shown in FIG. The area ratio of the non-bonded area projected onto the second conductor plate 23 was 45.4%, the same as the application area of the bonding inhibitor 5.

  Further, the outer peripheral edge 231 of the second conductor plate 23, two first dividing lines D1 parallel to the side extending in the length direction of the outer peripheral edge 231, and two second dividings orthogonal to the first dividing line D1. When the surface of the second conductor plate 23 is equally divided into nine virtual regions R along the line D2, the four corner virtual regions RE arranged at the corners are the other virtual regions R ( Compared to RC, RM), the area ratio of the non-bonded region was increased. Specifically, the area ratio of the non-joining region existing in the corner virtual region RE was 52.9%. Moreover, the area ratio of the non-joining area | region which exists in center virtual area | region RC distribute | arranged to the center among nine virtual area | regions R was 28.8%. Further, the area ratio of the non-joining regions existing in the five virtual regions RM excluding the corner virtual region RE and the central virtual region RC was 42.1%.

  A cooling medium at 60 ° C. containing 50% by volume of water and ethylene glycol was brought into contact with the radiation fin portion 32 of the heat sink 1 with circuit board obtained as described above at a flow rate of 0.96 m / s. In this state, a 700 W heat source having the same dimensions as the first conductor plate 22 was loaded on the first conductor plate 22 to reach a steady state. The maximum temperature of the surface of the first conductor plate 22 in a steady state was 93 ° C. In addition, after 6 hours from the time when the steady state was reached, the heat source was removed and the heat sink 1 with circuit board was cooled. Then, when the presence or absence of cracks or the like in the ceramic plate 21 was confirmed using an ultrasonic flaw detection method, generation of cracks or the like was not observed.

  Next, the function and effect of this example will be described. The heat sink 1 with a circuit board has a non-joining portion 42 that is recessed from the surrounding joining interface 41 without joining to the base portion 31 in a part of the brazing material layer 4. Therefore, the effect of relaxing the thermal stress applied to the ceramic plate 21 can be reliably obtained.

  As is known from FIG. 2, the heat sink 1 with circuit board has more non-joining portions 42 in the vicinity of the corners of the brazing material layer 4. Therefore, the thermal stress applied to the ceramic plate 21 can be effectively relieved, and deterioration of the heat dissipation performance can be suppressed.

  Further, in the heat sink 1 with a circuit board, the area ratio of the non-joining portion 42 existing in the central virtual region RC arranged in the center among the nine virtual regions R is in the other virtual regions R (RE, RM). It is smaller than the area ratio of the non-joining part 42 which faces. That is, the heat sink 1 with a circuit board is configured so that the area ratio of the bonding interface 41 with the brazing material layer 4 is increased in the vicinity of the center of the circuit board 2. As described above, the circuit board 2 tends to increase in temperature as it approaches the center while the semiconductor element is operating. Therefore, the heat dissipation performance can be further improved by reducing the area ratio of the non-joining portion 42 present in the central virtual region RC.

  As a result, the heat sink 1 with a circuit board can suppress the occurrence of warpage and cracks in the ceramic plate 21 while ensuring a heat dissipation performance equal to or higher than that of the conventional one. Therefore, the heat sink 1 with a circuit board has excellent heat dissipation performance and durability.

( Example 1 )
This example is an example of a heat sink 1b with a circuit board using a heat sink body 3b made of a clad plate material. The base portion 31b of the heat sink body 3b of this example is composed of a clad plate in which JIS A 1000 series aluminum (FIG. 3, reference B) is clad on a JIS A 6000 series aluminum alloy (FIG. 3, reference A). . As shown in FIG. 3, 1000 series aluminum is arranged on the circuit board 2 side of the base portion 31b. A heat radiating fin portion 32 made of a 6000 series aluminum alloy is erected on the opposite side of the base portion 31b from the circuit board 2.

  The thickness of the 6000 series aluminum alloy in the base portion 31b is 1.9 mm, the thickness of the 1000 series aluminum is 1.1 mm, and the cladding ratio of the 1000 series aluminum with respect to the entire thickness of the base portion 31b is 36.7%. The heat sink body 3b having such a configuration can be manufactured by forging a clad plate in which 1000 series aluminum is clad on a 6000 series aluminum alloy, for example.

Others are the same as the reference example . Of the symbols used in FIG. 3, reference numerals same as the that used in Reference Example, in particular represent like components such as in the reference example unless described.

As described above, by using a clad plate of 6000 series aluminum alloy and 1000 series aluminum for the heat sink body 3b, the thermal stress applied to the ceramic plate 21 can be reduced as described above, and the heat sink body 3b Warpage can be suppressed. Moreover, since 6000 series aluminum alloy and 1000 series aluminum are clad-joined, both are joined firmly compared with the case where the board | plate material which brazed these alloys is used, for example. Therefore, the heat sink with circuit board 1b having the heat sink body 3b of the present example has excellent reliability. In addition, the same effects as the reference example can be achieved.

(Comparative example)
This example is an example in which the coating pattern of the bonding inhibitor 5 is changed in the reference example . In this example, as shown in FIG. 4, on the base portion 31, a lattice shape including nine coating lines L <b> 1 parallel to the length direction of the base portion 31 and nine coating lines L <b> 2 parallel to the width direction. The pattern was drawn.

  In this example, the bonding inhibitor 5 is applied so that the distance between the adjacent coating lines L1 and L2 is constant, so that three coating lines L1 and L2 pass through all the virtual regions R. An application pattern was drawn. Specifically, the drawing was performed so that the distance d4 between the adjacent coating lines L1 and L2 was all 7.7 mm. The line width of the coating lines L1 and L2 was 2.3 mm, and the coating thickness of the bonding inhibitor 5 was 5 μm. Further, as the bonding inhibitor 5, one containing titanium oxide was used.

A heat sink with a circuit board was produced in the same manner as in the reference example except that the coating pattern of the bonding inhibitor 5 was changed. The non-joining part 42 in the obtained heat sink with a circuit board was formed in the part in which the joining inhibitor 5 was applied in the base part 31 as in the reference example .

  Moreover, the shape of the non-joining area | region formed by projecting the non-joining part 42 on the 2nd conductor board 23 became the same shape as the application pattern of the joining inhibitor 5 shown in FIG. The area ratio of the non-bonded area projected onto the second conductor plate 23 was 41.5%, the same as the application area of the bonding inhibitor 5.

Further, the outer peripheral edge 231 of the second conductor plate 23, two first dividing lines D1 parallel to the side extending in the length direction of the outer peripheral edge 231, and two second dividings orthogonal to the first dividing line D1. When the surface of the second conductor plate 23 is equally divided into nine virtual regions R along the line D2, in all the virtual regions R, the area ratio of non-joining regions existing in the regions is 41.5%. became. Others are the same as the reference example . Of the reference numerals used in FIG. 4, the same reference numerals as those used in the reference example represent the same components as in the reference example unless otherwise specified.

Similarly to the reference example , a cooling medium at 60 ° C. containing 50% by volume of water and ethylene glycol was brought into contact with the radiation fin portion 32 of the heat sink with a circuit board of this example at a flow rate of 0.96 m / s. In this state, a 700 W heat source having the same dimensions as the first conductor plate 22 was loaded on the first conductor plate 22 to reach a steady state. The maximum temperature of the surface of the first conductor plate 22 in a steady state was 97 ° C. In addition, after 6 hours from the time when the steady state was reached, the heat source was removed and the heat sink with the circuit board was cooled. Then, when the presence or absence of cracks or the like in the ceramic plate 21 was confirmed using an ultrasonic flaw detection method, generation of cracks or the like was not observed.

Thus, the circuit board with the heat sink of the comparative example, despite the total area of the unbonded portion 42 is smaller than the reference example, the heat dissipation performance than Reference Example was deteriorated. From this result, it can be understood that in order to achieve the same heat dissipation performance as the reference example using the coating pattern of the comparative example, it is necessary to make the area ratio of the non-joint portion 42 smaller. On the other hand, if the area ratio of the non-joining portion 42 is reduced, the effect of reducing the thermal stress applied to the ceramic plate 21 may be insufficient, and cracks and the like are more likely to occur.

DESCRIPTION OF SYMBOLS 1 Heat sink with a circuit board 2 Circuit board 21 Ceramic board 22 1st conductor board 23 2nd conductor board 231 The outer periphery edge of 2nd conductor board 3 Heat sink main body 4 Brazing material layer 41 Joining interface 42 Non-joining part D1 1st dividing line D2 Second dividing line R Virtual region RE Corner virtual region

Claims (6)

A circuit board having a ceramic plate, a first conductor plate made of an aluminum material joined to the front side surface of the ceramic plate, and a second conductor plate made of an aluminum material and made of a rectangular shape, joined to the back side surface of the ceramic plate; ,
A heat sink body made of an aluminum material and joined via a brazing filler metal layer and the second conductor plate;
The heat sink body has a flat base portion to which the circuit board is joined,
The base portion is a clad plate in which either JIS A 6000 series aluminum alloy or JIS A 3000 series aluminum alloy is clad with JIS A 1000 series aluminum, and JIS A 1000 series aluminum is arranged on the circuit board side,
The brazing material layer has a non-joined portion that is depressed from the surrounding joining interface without joining to at least one of the second conductor plate and the heat sink body,
The outer periphery edge of the second conductor plate, the two first dividing lines parallel to any side of the outer edge, and the two second dividing lines orthogonal to the first dividing line. When the surface of the two-conductor plate is equally divided into nine virtual regions, the four corner virtual regions arranged in the corners are compared with the other virtual regions in that the non-joined portions are A heat sink with a circuit board, characterized in that the area ratio of a non-bonded region projected onto a two-conductor plate is large.   2. The circuit board according to claim 1, wherein a central virtual region arranged in the center of the nine virtual regions has a smaller area ratio of the non-bonded region than the other virtual regions. With heat sink.   The heat sink with a circuit board according to claim 1 or 2, wherein a depression depth of the non-joining portion is 0.1 mm or less. It is a manufacturing method of the heat sink with a circuit board given in any 1 paragraph of Claims 1-3 ,
A pre-coating agent for preventing the inflow of wax is applied in advance to at least one of the heat sink body or the second conductor plate,
Next, the brazing material and the circuit board are mounted on the heat sink body,
Thereafter, the heat sink body, the brazing material, and the circuit board are heated to be brazed, and the heat sink body and the circuit board are joined via the brazing material layer, and the joining prevention in the brazing material layer is performed. A method for producing a heat sink with a circuit board, comprising forming the non-bonded portion on an agent. The method for manufacturing a heat sink with a circuit board according to claim 4 , wherein the bonding inhibitor contains titanium oxide. 6. The method for manufacturing a heat sink with a circuit board according to claim 4 , wherein the brazing is performed without using a flux.

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