JP6413388B2 - Electronic component package conveying apparatus and electronic component package conveying method - Google Patents

Description

  The present invention relates to an electronic component package conveying apparatus and an electronic component package conveying method.

  2. Description of the Related Art Conventionally, a peeling device that peels a tape from a tape to which a defective semiconductor chip is attached and a ring frame to which the tape is bonded is known (for example, see Patent Document 1).

  In the peeling apparatus described in Patent Document 1, a case where a semiconductor chip whose quality is unknown (hereinafter referred to as “new semiconductor chip”) is applied instead of a defective semiconductor chip. In this case, static electricity is generated when the tape with the new semiconductor chip is peeled off from the ring frame, and depending on the level of the static electricity, the new semiconductor chip may be defective due to the influence of the static electricity. is there. However, at this time, it was not possible to confirm that the new semiconductor chip was defective, and there was a possibility that it would be shipped as it was.

Japanese Patent Laid-Open No. 11-274186

  An object of the present invention is to provide an electronic component package transport apparatus and an electronic component package transport method capable of confirming that the influence of static electricity is prevented or suppressed on an electronic component after opening. It is in.

Such an object is achieved by the present inventions (1) to (10) below.
(1) An electronic component package transport apparatus for transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The electronic component package transport apparatus includes a transport unit that transports the unopened electronic component package from a transport source to a transport destination;
Peeling means for peeling the sealing material from the base material at the transport destination and opening the electronic component package;
After opening of the electronic component package, and a measuring means having a function for measuring the surface potential of the peel portion peeled from the base material of the sealing material,
The electronic component package transport apparatus according to claim 1, wherein the measuring means has a function of measuring a surface potential of a base material side peeling portion where the sealing material of the base material is peeled off .
(2) The electronic component package transport according to (1), wherein the measurement unit includes an auxiliary probe that is disposed in the vicinity of the base material side peeling portion and generates a potential difference with the base material side peeling portion. apparatus.
(3) An electronic component package transport apparatus for transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The electronic component package transport apparatus includes a transport unit that transports the unopened electronic component package from a transport source to a transport destination;
Peeling means for peeling the sealing material from the base material at the transport destination and opening the electronic component package;
A measuring means having a function of measuring the surface potential of the peeled portion peeled from the base material of the sealing material after opening the electronic component package;
The electronic component package transport apparatus according to claim 1, wherein the measuring means has a function of measuring a surface potential of the sealing material before being peeled from the base material in the unopened state.
(4) The electronic component packaging according to (3), wherein the measurement unit includes an auxiliary probe that is arranged in proximity to the sealing material in the unopened state and generates a potential difference with the sealing material. Body transport device.

(5) The electronic component package transport according to any one of (1) to (4), wherein the measurement unit includes a probe that is disposed in the vicinity of the peeling portion and generates a potential difference with the peeling portion. apparatus.

(6) The peeling means rotates while pressing the sealing material against the base material, and starts to peel off the sealing material, and a take-up roller that winds the peeled sealing material The electronic component package transporter according to any one of the above (1) to (5) .

(7) The base material has a band shape, and a plurality of the concave portions are arranged along the longitudinal direction thereof.
The electronic component package conveying apparatus according to any one of (1) to (6) , wherein the conveying means intermittently conveys the distance between the centers of the recesses adjacent in the longitudinal direction.

(8) The transport unit according to any one of (1) to (7) , wherein the transport unit includes an endless belt, and the electronic component package is placed and transported on the endless belt. Electronic parts package transport device.

(9) A method of transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The method for transporting the electronic component package includes transporting the unopened electronic component package from a transport source to a transport destination, and peeling the sealing material from the base material at the transport destination. The package is opened, and after opening, the surface potential of the part of the sealing material peeled from the base material is measured, and the surface potential of the part of the base material from which the sealing material is peeled is measured. A method for transporting a packaged electronic component, wherein:
(10) A method for transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The method for transporting the electronic component package includes transporting the unopened electronic component package from a transport source to a transport destination, and before peeling off the sealing material from the base material in the unopened state. The surface potential is measured, the sealing material is peeled off from the base material at the transport destination, the electronic component package is opened, and the part of the sealing material peeled off from the base material after the opening. A method for transporting a packaged electronic component, wherein the surface potential of the electronic component package is measured.

  ADVANTAGE OF THE INVENTION According to this invention, it can confirm that the influence by static electricity is prevented or suppressed with respect to the electronic component after opening.

FIG. 1 is a cross-sectional side view showing a first embodiment of an electronic component package conveying apparatus according to the present invention. FIG. 2 is a block diagram of the main part of the electronic component package conveying apparatus shown in FIG. FIG. 3 is a view for explaining the operating principle of the measuring means provided in the electronic component package conveying apparatus shown in FIG. FIG. 4 is a graph showing the surface voltage displayed on the display means provided in the electronic component package conveying apparatus shown in FIG. FIG. 5 is a graph showing the surface voltage displayed on the display means included in the electronic component package conveying apparatus shown in FIG. FIG. 6 is a sectional side view showing a second embodiment of the electronic component package conveying apparatus of the present invention. FIG. 7 is a graph showing the surface voltage displayed on the display means included in the electronic component package conveying apparatus shown in FIG. FIG. 8 is a cross-sectional side view showing a third embodiment of the electronic component package conveying apparatus of the present invention. FIG. 9 is a graph showing the surface voltage displayed on the display means included in the electronic component package conveying apparatus shown in FIG. FIG. 10 is a graph showing the surface voltage displayed on the display means included in the electronic component package conveying apparatus shown in FIG.

  Hereinafter, the electronic component package transport apparatus and the electronic component package transport method of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a cross-sectional side view showing a first embodiment of an electronic component package conveying apparatus according to the present invention. FIG. 2 is a block diagram of the main part of the electronic component package conveying apparatus shown in FIG. FIG. 3 is a view for explaining the operating principle of the measuring means provided in the electronic component package conveying apparatus shown in FIG. 4 and 5 are graphs showing the surface voltages displayed on the display means provided in the electronic component package conveying apparatus shown in FIG. In the following, for convenience of explanation, the upper side in FIG. 1 (the same applies to FIGS. 6 and 8) is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.

  1 is an apparatus for transporting an electronic component package (hereinafter simply referred to as “packaging”) 100, and the electronic component of the present invention. A method for transporting the package can be implemented.

  First, the packaging body 100 will be described before describing the conveyance device 1. The package 100 includes a packaging material 101 and a plurality of electronic components 104 packaged in the packaging material 101.

  The packaging material 101 includes a carrier tape (base material) 102 and a cover tape (sealing material) 103 detachably joined to the carrier tape 102.

  The carrier tape 102 is made of a resin member having a belt shape. On the upper surface of the carrier tape 102, a large number of recesses 102a for storing the electronic components 104 one by one are formed. These recesses 102 a are arranged at equal intervals along the longitudinal direction of the carrier tape 102. The center-to-center distance p between the recesses 102a adjacent to each other in the longitudinal direction of the carrier tape 102 is preferably 0.5 mm or more and 100 mm or less, for example, although it depends on the size of the electronic component 104. As mentioned above, it is more preferable that it is 16 mm or less.

  A cover tape 103 having a belt shape is joined to the upper surface of the carrier tape 102. And in this joining state, the cover tape 103 can cover each recessed part 102a collectively from the upper side. Thereby, the inside of each recessed part 102a can be sealed with the electronic component 104. FIG.

  The method for joining the carrier tape 102 and the cover tape 103 is not particularly limited, and for example, a method by heat sealing, a method by adhesion (adhesion with an adhesive or a solvent), or the like can be used.

  The cover tape 103 is a sheet material thinner than the carrier tape 102 and is peeled off from the carrier tape 102 during the conveyance by the conveyance device 1. Thereby, the electronic component 104 can be taken out from each recess 102a.

  Each of the carrier tape 102 and the cover tape 103 is made of a resin material, and the resin material is not particularly limited. For example, polystyrene, polyethylene, polypropylene, polyester (polyethylene terephthalate, etc.), polycarbonate, polyvinyl chloride, polyamide And various resins (various thermoplastic resins) such as polyacetal, and one or more of them can be used in combination. Examples of such carrier tape 102 include “Sumilite (registered trademark) CEL / FSL” manufactured by Sumitomo Bakelite, and examples of cover tape 103 include “Sumilite (registered trademark) CSL-Z” manufactured by Sumitomo Bakelite. .

  The electronic component 104 is large enough to be accommodated in the recess 102 a of the carrier tape 102, and is preferably a semiconductor package including a semiconductor element (semiconductor chip), for example.

  Next, the conveying apparatus 1 will be described. As shown in FIG. 2, the conveyance device 1 includes a conveyance unit 2, a peeling unit 3, a measurement unit 4, a display unit 5, and a control unit 6.

  The control means 6 is electrically connected to the conveying means 2, the peeling means 3, the measuring means 4, the display means 5, and the like, and has a function of controlling these operations. The control means 6 has a CPU (Central Processing Unit) 61 and a memory 62.

  The CPU 61 can execute programs for various processes such as a process for performing hole processing on the resin film 20.

  The memory 62 is a flash memory, for example, and can store various programs.

  The display means 5 is a display which has a liquid crystal panel, for example, is disposed in front of the transport device 1. By this display means 5, it is possible to display various information such as input information input by an operator who operates the transport device 1 and measurement results (output information) by the measurement means 4.

  As shown in FIG. 1, the transport unit 2 is a mechanism that transports the package 100. The transport unit 2 includes a driving roller 21, a driven roller (not shown), a plurality of idlers 22, and an endless belt 23. In the present embodiment, the transport direction of the package 100 is a horizontal direction.

  The drive roller 21 is connected to a motor 24 and can be rotated using the motor 24 as a drive source.

  A driven roller is spaced from the drive roller 21 on the upstream side in the transport direction of the package 100, that is, on the left side in FIG. An endless belt 23 is wound around the driving roller 21 and the driven roller. When the drive roller 21 rotates, this rotational force is transmitted to the driven roller via the endless belt 23. Thereby, it can convey reliably from a conveyance source to a conveyance destination, mounting the package 100 on the endless belt 23. FIG. At the “conveyance source”, the unopened package 100 is supplied and placed on the endless belt 23, and at the “conveyance destination”, the cover tape 103 is peeled off and the package 100 is opened.

  Further, an idler 22 is disposed between the driving roller 21 and the driven roller with an interval. With these idlers 22, the package 100 can be supported from below via the endless belt 23. Thereby, the package 100 can be conveyed stably.

  The peeling means 3 is a mechanism for peeling the cover tape 103 from the carrier tape 102. By this peeling, the package 100 is opened. The peeling means 3 includes a peeling roller (first roller) 31 and a winding roller (second roller) 32.

  The peeling roller 31 starts peeling from the cover tape 103. The peeling roller 31 can rotate while pressing the cover tape 103 against the carrier tape 102 from above. As a result, the cover tape 103 is wound around the peeling roller 31 in the middle of the longitudinal direction, and is turned toward the winding roller 32 above the peeling roller 31. By this change of direction, the cover tape 103 can be easily and reliably peeled off.

  And the package 100 is opened by this peeling, and the electronic component 104 can be taken out from the recessed part 102a of the carrier tape 102 after that.

  In addition, it does not specifically limit as peeling speed, For example, it is preferable to peel in the range of 0.4 mm or more and 200 mm or less per second, and it is more preferable to peel in the range of 20 mm or more and 160 mm or less.

  Further, one idler 22 (the idler 22a in FIG. 1) of the plurality of idlers 22 is disposed on the opposite side of the peeling roller 31 via the endless belt 23. By this idler 22a, the pressing force of the peeling roller 31 against the cover tape 103 can be received together with the cover tape 103, so that the cover tape 103 can be peeled stably.

  A winding roller 32 is disposed vertically above the peeling roller 31. The winding roller 32 winds the cover tape 103 peeled off by the peeling roller 31. The take-up roller 32 is connected to a motor 33 and can be rotated using the motor 33 as a drive source. By this rotation, the cover tape 103 can be reliably wound.

  In addition, the timing at which the transport unit 2 operates and the timing at which the peeling unit 3 operates are synchronized, and the transport speed of the package 100 and the winding speed of the cover tape 103 are the same.

  Now, when the cover tape 103 is peeled off from the carrier tape 102, static electricity is generated. Depending on the level of static electricity, the unused electronic component 104 may be defective due to the influence of the static electricity. In the transfer device 1, it is possible to measure the magnitude of the static electricity generated at the time of peeling by the measuring unit 4.

  As shown in FIG. 1, the measuring means 4 has a probe (first probe) 41A. As shown in FIG. 3, the measuring means 4 also has a main body part (control part) 42.

  The probe 41A is disposed close to the peeling portion (sealing material side peeling portion) 103a peeled from the carrier tape 102 of the cover tape 103 from the downstream side in the transport direction. Accordingly, the probe 41A generates a potential difference with the peeling portion 103a immediately after the cover tape 103 is peeled from the carrier tape 102 and the package 100 is opened, and the surface potential of the peeling portion 103a is measured. can do.

  The measuring means 4 is not particularly limited, and for example, the one shown in FIG. 3 (“Surface Potential Meter MODEL 541A-1” manufactured by Trek Japan Co., Ltd.) can be used. As shown in FIG. 3, the probe 41 </ b> A includes a sensor electrode 411, a tuning fork 412, and an amplifier 413. The main body 42 includes an amplifier 421, an integrator 422, a high voltage generator 423, an oscillator 424, a synchronous detector 425, and an impedance matching circuit 426.

  As an operation principle of the measuring means 4, first, a capacitance c is generated between the sensor electrode 411 and the peeling portion 103a in a state where the sensor electrode 411 is close to the peeling portion 103a. This capacitance c varies with the tuning fork 412. Due to this change, a signal obtained by alternating-modulating the surface potential is induced in the sensor electrode 411. The AC signal is amplified by the amplifier 413 and the amplifier 421. An output signal is obtained by synchronously detecting the amplified signal and the signal from the tuning fork 412 via the oscillator 424 by the synchronous detector 425. Then, the output signal is sequentially input to the integrator 422 and the high voltage generator 423 to generate a high potential and feed back to the probe 41A. As a result, the potential of the probe 41A increases and eventually becomes the same potential as that of the peeling portion 103a. In a state where the potential of the probe 41A is the same as that of the peeling portion 103a, the capacitance c is canceled. At this time, the voltage can be divided and output as output impedance by the impedance matching circuit 426.

  With the measuring means 4 configured as described above, the surface potential of the peeling portion 103a can be accurately and reliably measured. And, for example, if the measured surface potential is less than the threshold value, the electronic component 104 is regarded as being “good” (or expected), and if the measured surface potential is equal to or greater than the threshold value, The electronic component 104 there can be considered (or expected) to be a “defective product”. The electronic component 104 regarded as “defective” is discarded.

  As described above, the surface potential measured by the measuring unit 4 can be used as a criterion for judging whether the electronic component 104 is good or bad. Thereby, it can be confirmed that the influence of static electricity is prevented or suppressed on the electronic component 104 after the package 100 is opened, and the quality of the electronic component 104 can be guaranteed.

  In addition, when the electronic device 104 after opening is taken out using the suction device, the suction force of the suction device can be adjusted according to the measured surface potential. When the surface potential is “large”, the electronic component 104 can be reliably lifted from the carrier tape 102 by increasing the suction force. On the other hand, when the surface potential is “small”, the electronic component 104 can be reliably pulled up from the carrier tape 102 even if the suction force is reduced, which contributes to power saving of the suction device.

  Note that the surface potential also varies depending on the combination of the constituent material of the carrier tape 102 and the constituent material of the cover tape 103.

  In the transport apparatus 1, the transport unit 2 may transport the package 100 continuously, but intermittent transport that repeats transport and stop is preferable. In this case, when the carrier tape 102 is conveyed by the distance p between the centers of the recesses 102a, the carrier tape 102 is stopped once and the surface potential can be measured during that time. By such intermittent conveyance, every time the cover tape 103 is peeled once in order to take out one electronic component 104, the surface potential of the peeled peeling portion 103a can be stably and reliably measured. 4 and 5, as an example, a graph showing how large the surface potential is at each measurement point by setting 30000 measurement points for each peeling portion 103a. Is drawn. For example, the average value of the surface potential at each measurement point can be used as the surface potential at the peeling portion 103a, or the surface potential that becomes the maximum value of the surface potential at each measurement point can be used as the peeling portion 103a. It can be used as the surface potential at The graph is displayed by the display means 5.

Second Embodiment
FIG. 6 is a sectional side view showing a second embodiment of the electronic component package conveying apparatus of the present invention. FIG. 7 is a graph showing the surface voltage displayed on the display means included in the electronic component package conveying apparatus shown in FIG.

  Hereinafter, the second embodiment of the electronic component package transport apparatus and the electronic component package transport method of the present invention will be described with reference to these drawings. Description of similar matters is omitted.

This embodiment is the same as the first embodiment except that the configuration of the measuring means is different.
As shown in FIG. 6, in this embodiment, the measurement means 4 has a probe (auxiliary probe) 41B having the same internal configuration as the probe 41A in addition to the probe 41A.

  The probe 41B is disposed close to the peeling portion (base material side peeling portion) 102b from which the cover tape 103 of the carrier tape 102 has been peeled, from vertically above. As a result, the probe 41B generates a potential difference with the peeling portion 102b immediately after the cover tape 103 is peeled from the carrier tape 102 and the package 100 is opened, and the surface potential of the peeling portion 102b is measured. can do.

  And the graph shown in FIG. 7 is displayed on the display means 5 as a measurement result. In FIG. 7, the surface potential of the peeling portion 103a measured from the probe 41A (indicated by “E1” in the drawing), the surface potential of the peeling portion 102b measured from the probe 41B (indicated by “E2” in the drawing), These average potentials (indicated by “E3” in the figure) calculated by the main body 42 of the measuring means 4 are mentioned. For example, this average potential can be used as a judgment criterion for judging whether the electronic component 104 is good or bad, and therefore it is possible to make an accurate quality judgment.

<Third Embodiment>
FIG. 8 is a cross-sectional side view showing a third embodiment of the electronic component package conveying apparatus of the present invention. 9 and 10 are graphs showing the surface voltages displayed on the display means provided in the electronic component package transport apparatus shown in FIG. 8, respectively.

  Hereinafter, a third embodiment of the electronic component package transport apparatus and the electronic component package transport method of the present invention will be described with reference to these drawings. The third embodiment of the present invention will be described with a focus on differences from the above-described embodiments. Description of similar matters is omitted.

This embodiment is the same as the first embodiment except that the configuration of the measuring means is different.
As shown in FIG. 8, in this embodiment, the measurement means 4 has a probe (auxiliary probe) 41C having the same internal configuration as the probe 41A in addition to the probe 41A.

  The probe 41 </ b> C is disposed in the vicinity of the cover tape 103 before being peeled from the carrier tape 102 in the vicinity of the upstream side in the transport direction from the peeling roller 31, close to the cover tape 103. Accordingly, the probe 41C generates a potential difference with the cover tape 103 before being peeled off from the carrier tape 102 in an unopened state, and the surface potential of the cover tape 103 can be measured.

  And the graph shown in FIG.9 and FIG.10 is displayed on the display means 5 as a measurement result. In FIG. 9, the surface potential of the cover tape 103 before peeling measured from the probe 41C (indicated by “E4” in the figure) and the surface potential of the peeling portion 103a measured from the probe 41A (indicated by “E5” in the figure). ). In FIG. 10, the difference (offset value (indicated by “ΔE” in the figure)) between the former surface potential (E4) and the latter surface potential (E5) is given. For example, this offset value can be used as a judgment criterion for judging whether the electronic component 104 is good or bad, and therefore it is possible to make an accurate quality judgment.

  As mentioned above, although the electronic component package transport apparatus and the electronic component package transport method of the present invention have been described with respect to the illustrated embodiment, the present invention is not limited to this and constitutes an electronic component package transport apparatus. Each part to be replaced can be replaced with one having any configuration capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component package transport apparatus and electronic component package transport method of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Further, the peeling roller may be supported so as to be movable up and down in accordance with the thickness of the package, and may be configured to be positioned at the moving destination.

  Further, the transport by the transport means is transport using a belt in each of the above embodiments, but is not limited to this. For example, when a plurality of holes are formed in advance along the longitudinal direction of the carrier tape. May be transport using sprockets (gears) that rotate while engaging the holes.

1 Electronic parts packaging transport device (transport device)
2 Conveying means 21 Drive rollers 22, 22a Idler 23 Endless belt 24 Motor 3 Peeling means 31 Peeling roller (first roller)
32 Winding roller (second roller)
33 motor 4 measuring means 41A probe (first probe)
41B probe (auxiliary probe)
41C probe (auxiliary probe)
411 Sensor electrode 412 Tuning fork 413 Amplifier 42 Main unit (control unit)
421 Amplifier 422 Integrator 423 High voltage generator 424 Oscillator 425 Synchronous detector 426 Impedance matching circuit 5 Display means 6 Control means 61 CPU (Central Processing Unit)
62 Memory 20 Memory 100 Electronic component packaging (packaging)
101 Packaging material 102 Carrier tape (base material)
102a Concave part 102b Peeling part (base material side peeling part)
103 Cover tape (sealing material)
103a peeling part (sealing material side peeling part)
104 Electronic parts c Capacitance p Center-to-center distance

Claims (10)

An electronic component package transport apparatus for transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The electronic component package transport apparatus includes a transport unit that transports the unopened electronic component package from a transport source to a transport destination;
Peeling means for peeling the sealing material from the base material at the transport destination and opening the electronic component package;
After opening of the electronic component package, and a measuring means having a function for measuring the surface potential of the peel portion peeled from the base material of the sealing material,
The electronic component package transport apparatus according to claim 1, wherein the measuring means has a function of measuring a surface potential of a base material side peeling portion where the sealing material of the base material is peeled off . 2. The electronic component package conveying apparatus according to claim 1 , wherein the measurement unit includes an auxiliary probe that is disposed in the vicinity of the base material side peeling portion and generates a potential difference with the base material side peeling portion. An electronic component package transport apparatus for transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The electronic component package transport apparatus includes a transport unit that transports the unopened electronic component package from a transport source to a transport destination;
Peeling means for peeling the sealing material from the base material at the transport destination and opening the electronic component package;
A measuring means having a function of measuring the surface potential of the peeled portion peeled from the base material of the sealing material after opening the electronic component package;
The electronic component package transport apparatus according to claim 1, wherein the measuring means has a function of measuring a surface potential of the sealing material before being peeled from the base material in the unopened state . The electronic component package transport apparatus according to claim 3 , wherein the measuring unit includes an auxiliary probe that is disposed in proximity to the sealing material in the unopened state and generates a potential difference with the sealing material. 5. The electronic component package conveying apparatus according to claim 1 , wherein the measuring unit includes a probe that is disposed in the vicinity of the peeling portion and generates a potential difference with the peeling portion. The stripping means is rotated while pressing the sealant to the substrate, wherein with the flaking roller to initiate peel to sealing material, and a take-up roller for taking up said sealing member is peeled off Item 6. The electronic component package conveying apparatus according to any one of Items 1 to 5 . The base material has a strip shape, and a plurality of the concave portions are arranged along the longitudinal direction thereof,
The electronic component package transport apparatus according to any one of claims 1 to 6 , wherein the transport means intermittently transports the center-to-center distance between the recesses adjacent in the longitudinal direction. The electronic component package according to any one of claims 1 to 7 , wherein the conveying means has an endless belt, and the electronic component package is placed on the endless belt and conveyed. Conveying device. A method of transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The method for transporting the electronic component package includes transporting the unopened electronic component package from a transport source to a transport destination, and peeling the sealing material from the base material at the transport destination. The package is opened, and after opening, the surface potential of the part of the sealing material peeled from the base material is measured, and the surface potential of the part of the base material from which the sealing material is peeled is measured. A method for transporting a packaged electronic component, wherein: A method of transporting an electronic component package having an electronic component and a packaging material for packaging the electronic component,
The packaging material is a sheet having at least one recess for storing the electronic component, and a sheet-like shape that is detachably bonded to the substrate and seals the recess together with the electronic component in the recess. And a sealing material forming
The method for transporting the electronic component package includes transporting the unopened electronic component package from a transport source to a transport destination , and before peeling off the sealing material from the base material in the unopened state. The surface potential is measured, the sealing material is peeled off from the base material at the transport destination, the electronic component package is opened, and the part of the sealing material peeled off from the base material after the opening. A method for transporting a packaged electronic component, wherein the surface potential of the electronic component package is measured.

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