JP6411989B2 - Electronic device and control method thereof - Google Patents

Description

  The present invention relates to control of an electronic device, and particularly relates to a technique for controlling a substrate inside the electronic device from the outside.

  With the development of the information and communication society, portable information terminal devices and the like have come to be used frequently. These information terminal devices often have a structure in which components are mounted at a high density while suppressing the number of components in order to reduce the size and weight. However, in such an information terminal device, if an interface for performing external control is omitted, only a simplified inspection can be performed after assembly, and it is necessary to dismantle and perform control and inspection after maintenance. is there. Therefore, in order to perform inspection and maintenance after assembly, a small information terminal device often has an interface for external control. In addition, since a lot of devices need to be inspected in a production line or the like, it is desirable that the test by external control can be performed by a simplified operation as much as possible.

  If an interface for external control is arranged outside the apparatus to facilitate work, the design may be impaired. Further, since the user can touch the terminal of the interface, a connector having a high insertion / removal resistance is required, resulting in an increase in the size of components and an increase in cost. In addition, in the case of a device that requires waterproofness, packing for water stop is required, and the number of parts is increased and the mounting area of other parts is reduced by arranging the packing.

  Therefore, it is desirable that there is a technology capable of performing external control using an interface provided inside the device in an information terminal device or the like, and related technologies are being developed. As such a technology capable of performing external control using an interface provided inside the device in an information terminal device or the like, for example, a technology as disclosed in Patent Document 1 is disclosed.

  Patent Document 1 relates to a radiotelephone terminal apparatus having a test terminal. The wireless telephone terminal device of Patent Document 1 includes a test terminal on the main body side of the inner lid of the battery housing unit. The test terminal is connected to a substrate inside the apparatus. In the wireless telephone terminal device of Patent Document 1, it is possible to access the substrate inside the device from the outside via the test terminal by removing the battery and the inner lid. Patent Document 1 assumes that such a configuration prevents the user from touching or damaging the appearance when the inner lid is attached. Patent Document 1 states that a finished product can be tested by removing the inner lid during the test and exposing the test terminals.

Japanese Patent Laid-Open No. 08-19033

  However, the technique of Patent Document 1 is not sufficient in the following points. The wireless telephone terminal device of Patent Document 1 has a structure in which a battery and an inner lid can be removed in order to perform external control during a test. In the wireless telephone terminal device of Patent Document 1, since it is necessary to remove the inner lid and the battery at the time of the test, a power source other than the battery is required when performing the test. For this reason, it is necessary to connect the power cable from the outside to the radio telephone terminal apparatus, and the test cannot be performed under the same conditions as in normal use, and the test apparatus and work are complicated. Moreover, in the technique of patent document 1, parts, such as a screw for fixing an inner cover at the time of normal, are needed, and since the space for fixation is required, an apparatus enlarges. In addition, since it is necessary to remove and attach the inner lid before and after the test, the work for inspection and maintenance becomes complicated. Therefore, the technique of Patent Document 1 is not sufficient as a technique for performing external control while suppressing the enlargement of the apparatus and the complexity of work.

  In order to solve the above-described problems, an object of the present invention is to obtain an electronic device capable of performing external control while suppressing an increase in size of the device and a complicated operation.

  In order to solve the above-described problems, an electronic device of the present invention includes a housing, a substrate, a spring, and a connection terminal. The housing has a space in which the solid object is mounted. The substrate is provided inside the housing, and a circuit pattern is formed. The spring has a spiral shape, one end is fixed to the side surface inside the casing, expands and contracts in the direction of the horizontal plane of the substrate, and contracts when an individual is mounted inside the casing. The connection terminal is provided between the spring and the substrate, and connects the signal wiring of the circuit pattern of the substrate and the signal wiring of another substrate.

  According to the electronic device control method of the present invention, the first substrate-side terminal and the second terminal are arranged between the spiral springs, one end of which is fixed to the inner side surface of the housing having a space in which an object is mounted. The first substrate-side terminal of the film substrate having substrate-side terminals at both ends is passed. The first board side terminal and the second board side terminal are terminals connected to each other by a signal line. The method for controlling an electronic device according to the present invention is a connection in which an object is mounted inside a housing, and is electrically connected to a substrate on which a circuit pattern is formed, which is provided inside the housing by contraction of a spring. The terminal and the first substrate side terminal are electrically connected. According to the electronic device control method of the present invention, signals are transmitted to and received from the substrate via the second substrate side terminal that is opposite to the first substrate side terminal with respect to the spring.

  ADVANTAGE OF THE INVENTION According to this invention, external control can be performed, suppressing the enlargement of an apparatus and the complexity of an operation | work.

It is a figure which shows the outline | summary of a structure of the 1st Embodiment of this invention. It is the perspective view which showed the external appearance of the electronic device of the 2nd Embodiment of this invention. It is sectional drawing which showed the structure of the electronic device of the 2nd Embodiment of this invention. It is sectional drawing at the time of mounting a film substrate and a battery in the electronic device in the 2nd Embodiment of this invention. It is the figure which showed the outline | summary of the structure of the blindfold sheet | seat of the 2nd Embodiment of this invention. It is the figure which showed the outline | summary of the structure of the film substrate of the 2nd Embodiment of this invention. It is sectional drawing when a film substrate is inserted in the electronic device in the 2nd Embodiment of this invention. It is a top view in the state where the lid of the electronic device of a 2nd embodiment of the present invention was opened. It is a top view at the time of mounting | wearing with the battery in the state which opened the lid | cover of the electronic device of the 2nd Embodiment of this invention. It is sectional drawing which showed a part of structure before and behind mounting | wearing with the battery in the electronic device of the 2nd Embodiment of this invention. It is sectional drawing which showed a part of structure before and behind mounting | wearing with the battery in the electronic device of the 2nd Embodiment of this invention.

(First embodiment)
A first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an outline of the configuration of the electronic apparatus according to the present embodiment. The electronic device according to the present embodiment includes a housing 1, a substrate 2, a spring 3, and a connection terminal 4. The housing 1 has a space in which an individual is mounted. The substrate 2 is provided in the housing 1 and has a circuit pattern. The spring 3 has a spiral shape, one end is fixed to the inner side surface of the casing 1, expands and contracts in the direction of the horizontal plane of the substrate 2, and contracts when an object is mounted inside the casing 1. . The connection terminal 4 is provided between the spring 3 and the substrate 2 and connects the signal wiring of the circuit pattern of the substrate 2 to the signal wiring of another substrate.

  In the electronic device of the present embodiment, another substrate can be fixed by the spring 3 by inserting another substrate between the spirals of the spiral spring 3 and mounting the object in the housing 1. Further, since the connection terminal 4 is provided between the substrate 2 and the spring 3, a terminal of another substrate can be connected to the substrate 2 via the connection terminal 4. In such an arrangement, the electronic apparatus according to the present embodiment can transmit and receive signals to and from the substrate 2 by inputting and outputting signals from the other end of the other substrate.

  As described above, by using the electronic device of the present embodiment, it is possible to control the substrate 2 from the outside without requiring any special mechanism other than the connection terminal 4 on the electronic device side. For this reason, the size of the apparatus is not increased by controlling the substrate 2 from the outside. In addition, when performing control from the outside, it is only necessary to pass another board through a helix and to mount an individual, so that no complicated work is required. As a result, by using the electronic device of the present embodiment, external control can be performed while suppressing an increase in the size of the device and a complicated operation.

(Second Embodiment)
A second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 is a perspective view showing an external appearance of the electronic apparatus according to the present embodiment. FIG. 3 is a cross-sectional view showing the structure of the electronic device of this embodiment.

  The electronic device of this embodiment includes a device main body 10 and a lid 20. In addition, the electronic device according to the present embodiment includes a spring positive electrode 11, a spring negative electrode 12, an electronic substrate 13, a spring pin 14, and a blindfold sheet 15 inside the device main body 10. A slit 16 is formed in the blindfold sheet 15. In addition, the electronic device of this embodiment is further equipped with a film substrate 30 and a battery 40 as shown in FIG. FIG. 4 is a cross-sectional view showing a structure when the film substrate 30 and the battery 40 are mounted on the electronic device of the present embodiment.

  The apparatus main body 10 has a function as a casing that holds the electronic substrate 13 and the battery 40 therein. The apparatus main body 10 has a space in which the battery 40 can be attached and detached. The apparatus main body 10 protects the electronic substrate 13, the battery 40, and the like from impact, dust, and the like. The apparatus main body 10 may have a display function, an input / output function, a communication function, and the like. As the device main body 10, for example, a main body of an electronic device driven by a battery such as a mobile phone device or a portable information terminal device is applicable. The device body 10 may be a watch, a remote controller, an electronic toy, an audio device, and other small electronic devices. The apparatus main body 10 of the present embodiment corresponds to the housing 1 of the first embodiment.

  The spring positive electrode 11 has a function of holding the battery 40 and a function as a connection terminal of the positive electrode of the battery 40. The spring positive electrode 11 is formed as a metal member having elasticity, and holds the battery 40 by elastic force when the battery 40 is mounted. The spring positive electrode 11 is electrically connected to a circuit formed on the electronic substrate 13 as a positive electrode connection terminal of the battery 40.

  The spring negative electrode 12 has a function of absorbing a dimensional error of the battery 40 and a function of holding the battery 40. Further, the spring negative electrode 12 has a function as a connection terminal for the negative electrode of the battery 40.

  The spring negative electrode 12 is formed as a metal spring wound in a spiral shape. When the battery 40 is attached to the apparatus main body 10, the spring pressure of the spring negative electrode 12 is adjusted so that there is no clearance between the windings of the spring due to contraction. Further, the spring negative electrode 12 holds the battery 40 by the spring pressure due to the elasticity of the spring. When the battery 40 is not mounted, there is a clearance for inserting the film substrate 30 between the springs.

  The spring negative electrode 12 is electrically connected to a circuit formed on the electronic substrate 13 as a negative electrode connection terminal of the battery 40. The spring negative electrode 12 of the present embodiment corresponds to the spring 3 of the first embodiment.

  The electronic board 13 has a function of performing signal processing and control necessary as an electronic device. For example, a printed circuit board is used as the electronic substrate 13. A predetermined circuit pattern is formed on the electronic substrate 13 and a semiconductor device or the like is mounted thereon. Further, the electronic board 13 operates by receiving power supply from the battery 40 via the spring positive electrode 11 and the spring negative electrode 12.

  The electronic board 13 operates based on a signal input from the test pad 32, and outputs a predetermined signal from the test pad 32. For example, the electronic board 13 performs a test operation based on the test signal input from the test pad 32 and outputs the result from the test pad 32. The electronic substrate 13 of the present embodiment corresponds to the substrate 2 of the first embodiment.

  The spring pin 14 has a function of electrically connecting the test pad 32 of the film substrate 30 and the electronic substrate 13. The spring pin 14 is provided so as to have the number of poles corresponding to the test pad 32. In addition to the number required for joining the signal wirings of the electronic substrate 13 and the film substrate 30, dummy spring pins 14 and test pads 32 for stabilizing the joining may be provided. The spring pin 14 applies a stress to the film substrate 30 in a horizontal direction, that is, in a horizontal direction with respect to the bottom surface of the apparatus main body 10 and the plane of the electronic substrate 13, and stabilizes the electrical connection with the connection terminal of the test pad 32. Let The spring pin 14 is electrically connected to a predetermined circuit of the electronic board 13. That is, the film substrate 30 transmits and receives signals to and from the electronic substrate 13 via the spring pins 14. The spring pin 14 of the present embodiment corresponds to the connection terminal 4 of the first embodiment.

  The blindfold sheet 15 has a function of preventing the electronic substrate 13 from being exposed on the surface. FIG. 5 is a diagram showing an outline of the configuration of the blindfold sheet 15 of the present embodiment. The blindfold sheet 15 is formed using a non-transparent film or the like. A slit 16 is formed in the blindfold sheet 15. Therefore, the film substrate 30 can be inserted from the upper part of the apparatus main body 10 to the electronic substrate 13 side through the slit 16. The slit 16 is formed so that the position of the film substrate 30 substantially coincides with the position of the spring pin 14 when the film substrate 30 is inserted into the slit 16 from above. The blindfold sheet 15 prevents the appearance of the electronic substrate 13 from being deteriorated, prevents the user of the electronic device from touching the electronic substrate 13, and prevents dust from adhering to the electronic substrate 13. It is provided for the purpose. The blindfold sheet 15 is affixed to the partition plate 17 at the outer periphery.

  The positions of the spring pin 14 and the slit 16 are set so that the positions of the test pad 32 and the terminal portion of the spring pin 14 are aligned when the film substrate 30 is inserted into the slit 16 from between the spirals of the spring negative electrode 12. . For example, by aligning the width of the slit 16 in the direction parallel to the plane of the film substrate 30 and the width of the film substrate 30, the test pad 32 and the spring pin 14 are aligned when the film substrate 30 is inserted into the slit 16. Is possible. In the case of such a configuration, the width of the slit 16 is formed slightly larger than the width of the film substrate 30.

  The partition plate 17 has a function of partitioning into a region where the battery 40 is mounted and a region where the electronic board 13 is installed inside the apparatus main body 10. The partition plate 17 partitions the inside of the apparatus main body 10 in parallel with the horizontal plane of the electronic substrate 13. The partition plate 17 is formed of a resin plate, for example. The presence of the partition plate 17 can protect the electronic substrate 13 from the outside. Further, the partition plate 17 has an opening near the spring negative electrode 12. The size of the opening is formed so that the lower side of the spiral portion of the spring negative electrode 12 is substantially opened. The opening has a width larger than the width of the film substrate 30. The opening is covered with a blindfold sheet 15. Further, alignment marks used when the blindfold sheet 15 is attached to the partition plate 17 may be formed. By forming the alignment mark, the position of the slit 16 with respect to the position of the spring pin 14 can be accurately aligned without requiring complicated work when the blindfold sheet 15 is attached.

  The lid | cover 20 is provided so that the apparatus main body 10 of an electronic device may be covered from upper part. One side of the lid 20 of the present embodiment is connected to the apparatus main body 10 with a hinge. The lid 20 is configured not to open in the closed state unless the user applies force to operate the lid 20. The lid 20 may be configured to be separable from the apparatus main body 10.

  The film substrate 30 has a function as a signal substrate for inputting and outputting signals for inspection of electronic devices. FIG. 6 is a diagram showing an outline of the configuration of the film substrate 30 of the present embodiment. The film substrate 30 further includes a connection portion 31, a test pad 32, and a reinforcing plate 33. For the film substrate 30, for example, FPC (Flexible Printed Circuits) is used.

  The connection unit 31 has a function as a connection terminal when connecting the test apparatus and the film substrate 30 to each other. The connection portion 31 includes a terminal that is formed at one end of the film substrate 30 and is connected to a connector such as a test apparatus. The signal wiring formed on the film substrate 30 is electrically connected to an input / output signal line of a test device or the like via a terminal of the connection portion 31.

  The test pad 32 has a function as a connection terminal when the film substrate 30 is connected to the spring pin 14 which is a connection terminal on the electronic substrate 13 side. The test pad 32 is made of metal and is electrically connected to the wiring pattern on the film substrate 30. In addition, when the battery 40 is mounted, the test pad 32 comes into close contact with the spring pin 14 by the elastic force of the spring pin 14, so that the film substrate 30 and the electronic substrate 13 can be stably connected. The test pad 32 is formed at one end of the film substrate 30 different from the connection portion 31, and includes a terminal for connecting to the electronic substrate 13 via the spring pin 14. The signal wiring formed on the film substrate 30 is electrically connected to the electronic substrate 13 through the terminals of the test pad 32 and the spring pins 14. The film substrate 30 is formed with signal wiring for connecting between the terminals of the connection portion 31 and the test pad 32.

  The reinforcing plate 33 has a function of improving the mechanical strength of the film substrate 30 and supporting the film substrate 30 so as to be able to cope with the contact pressure of the spring pins 14. The reinforcing plate 33 is formed on the surface opposite to the surface on which the terminals of the test pad 32 are formed, in the vicinity of the test pad 32 of the film substrate 30. The reinforcing plate 33 is made of, for example, a metal thin film or a resin plate. When using a metal thin film, the surface may be coated with an insulating material to avoid a short circuit between the electronic component mounted on the electronic substrate 13 and the metal thin film. By forming the reinforcing plate 33 in the vicinity of the test pad 32, the film substrate 30 can be prevented from being bent, and the bonding between the film substrate 30 and the spring pin 14 can be stabilized.

  The reinforcing plate 33 may also be formed in a portion located between the spirals of the spring negative electrode 12 when the film substrate 30 is attached to the apparatus main body 10. In the case where the reinforcing plate 33 is formed also in the portion located between the spirals, it may be formed only on one side of the film substrate 30 or may be formed on both sides. A portion of the reinforcing plate 33 located between the spirals is formed to be insulated from the spring negative electrode 12. By forming the reinforcing plate 33 in the portion located between the spirals, it is possible to prevent the wiring from being cut by the force when the spring negative electrode 12 contracts.

  The battery 40 is a dry battery or a secondary battery, and supplies power to the electronic board 13 of the electronic device.

  The operation of the electronic device of this embodiment will be described. First, the operation when the film substrate 30 and the battery 40 are attached to the electronic device and an electronic device that can be controlled from the outside is assembled will be described.

  First, in a state where the lid 20 is opened, the film substrate 30 is inserted into the slit 16 through the spring of the spring negative electrode 12 as shown in FIG. FIG. 7 is a cross-sectional view showing the structure when the film substrate 30 is inserted into the electronic apparatus of this embodiment. The film substrate 30 is inserted into the slit 16 from the test pad 32 side. The film substrate 30 is inserted so that the connection terminal side of the test pad 32 of the film substrate 30 is on the spring pin 14 side. The film substrate 30 is inserted to a position where the end surface of the film substrate 30 contacts the surface of the electronic substrate 13.

  FIG. 8 is a plan view showing a state in which the lid 20 is opened before the battery is mounted on the electronic device of the present embodiment. In FIG. 8, the spring negative electrode 12 is in an extended state. Therefore, the film substrate 30 can be inserted between the spirals of the spring negative electrode 12.

  When the film substrate 30 is inserted between the springs and into the slit 16, the battery 40 is attached to the apparatus main body 10 by an operator or the like. For example, the battery 40 is inserted into the apparatus main body while pushing the spring negative electrode 12 on the negative electrode side, and is attached to the apparatus main body 10 by pushing the positive electrode side to contact the positive electrode of the battery 40 and the spring positive electrode 11. FIG. 9 is a plan view showing a state in which the lid 20 is opened after the battery is mounted on the electronic device of the present embodiment. In FIG. 9, the battery 40 is mounted and the spring negative electrode 12 is contracted.

  As shown in FIG. 9, when the battery 40 is mounted, the spring negative electrode 12 is pushed in by the battery 40, and the spring negative electrode 12 contracts. At that time, the film substrate 30 is fixed by the spring negative electrode 12. When the spring negative electrode 12 contracts, the test pad 32 of the film substrate 30 is pressed against the spring pin 14 side, and the spring pin 14 and the terminal of the test pad 32 come into contact with each other. At this time, since the spring pin 14 pressed by the test pad 32 of the film substrate 30 applies stress to the test pad 32 side, the connection terminal of the test pad 32 and the spring pin 14 are in a stable contact state.

  When the connection terminal of the test pad 32 and the spring pin 14 are in stable contact with each other due to the mounting of the battery 40, the electronic substrate 13 of the electronic device can be connected externally via the film substrate 30. The state at this time is a state in which the film substrate 30 and the battery 40 are mounted on the electronic apparatus shown in FIG.

  With reference to FIG. 10 and FIG. 11, the state of the spring negative electrode 12, the film substrate 30, and the spring pin 14 before and after mounting the battery 40 on the electronic device will be described. FIG. 10 is an enlarged cross-sectional view of the vicinity of the contact portion between the film substrate 30 and the spring pin 14 before and after the battery 40 is attached to the electronic device. The left side of FIG. 10 shows a state before the battery 40 is mounted, and the right side of FIG. 10 shows a state after the battery 40 is mounted. FIG. 11 is a cross-sectional view of the vicinity of the contact portion between the test pad 32 and the spring pin 14 of the film substrate 30 further enlarged from FIG. The left side of FIG. 11 shows the state before the battery 40 is mounted, and the right side of FIG. 11 shows the state after the battery 40 is mounted.

  As shown in the left diagram of FIG. 10, the film substrate 30 is inserted between the spring negative electrode 12 and the slit 16 in an oblique direction before the battery 40 is mounted. In the state before the battery 40 is mounted, the film substrate 30 and the spring pin 14 are not in contact with each other or are in slight contact with each other. When the battery 40 is mounted on the electronic device, the spring negative electrode 12 contracts as shown in the right side of FIG. 10, and the film substrate 30 is in a substantially vertical state between the spirals of the spring negative electrode 12. In the state after the battery 40 is mounted, the film substrate 30 is pressed against the spring pin 14. When the film substrate 30 is pressed against the spring pin 14, the spring pin 14 applies a stress to the film substrate 30 side when pressed, so the contact state between the film substrate 30 and the spring pin 14 is stabilized. .

  Similarly, in the right-side view of FIG. 11 in which FIG. 10 is enlarged, the film substrate 30 is inserted between the spring negative electrode 12 and the slit 16 in an oblique direction before the battery 40 is mounted. Before the battery 40 is mounted, the test pad 32 of the film substrate 30 and the spring pin 14 are not in contact with each other or are in slight contact. When the battery 40 is mounted on the electronic device, the test pad 32 of the film substrate 30 is pressed against the spring pin 14 as shown in the left side of FIG. In the state shown on the left side of FIG. 11, the contact state between the test pad 32 and the spring pin 14 is stabilized, so that signals can be stably transmitted and received between the test pad 32 and the spring pin 14.

  Next, the operation when the film substrate 30 and the battery 40 are mounted on the apparatus main body 10 and the electronic substrate 13 is controlled from the outside will be described.

  When the electronic substrate 13 is in an externally connectable state via the film substrate 30, the operator connects the connection portion 31 of the film substrate 30 to the connector of the test apparatus. When the electronic device and the test device are connected, the control device can be operated to test and control the electronic device by operating the test device. A test signal or the like is sent from the test device to the electronic substrate 13 of the electronic device via the film substrate 30, and the electronic substrate 13 sends each data back to the test device via the film substrate 30. By attaching the film substrate 30 to the electronic device of this embodiment by such a method, the film substrate 30 is externally provided even after the electronic device is completed or after assembly up to an intermediate process is completed. The signal can be transmitted to and received from the electronic substrate 13 via the. By transmitting and receiving signals to and from the electronic substrate 13 through the film substrate 30 from the outside, the electronic device is inspected even after the completion of the electronic device or after the assembly up to the intermediate process. It becomes possible. As a result, it is possible to easily confirm the operation of the finished product or a product in the middle of manufacture, the presence or absence of abnormality, and the like.

  In the electronic device of the present embodiment, the film substrate 30 is passed through the spiral of the spring negative electrode 12 and between the slits 16 of the blindfold sheet 15, and the film substrate 30 is contracted by the spring negative electrode 12 when the battery 40 is mounted on the apparatus body. Is fixed. Further, when the spring negative electrode 12 contracts, the test pad 32 of the film substrate 30 is pressed against the spring pin 14 side. At that time, since the spring pin 14 applies stress to the test pad 32 side of the film substrate 30, the test pad 32 and the spring pin 14 are in a stable contact state. Since the test pad 32 is electrically connected to the circuit of the electronic substrate 13 via the spring pin 14, it is possible to transmit and receive signals to and from the electronic substrate 13 from the connection portion 31 outside the spring negative electrode 12. . Therefore, the electronic board 13 inside the apparatus main body 10 can be controlled from the outside of the apparatus main body 10.

  In the electronic device of this embodiment, the film substrate 30 is inserted between the spring negative electrode 12 and the battery 40 is attached, so that the connection portion of the film substrate 30 on the outside of the apparatus main body 10 is not required without complicated operations. The electronic substrate 13 can be controlled via 31. In addition, since the film substrate 30 is inserted and fixed via the spring negative electrode 12 which is a connection terminal on the negative electrode side of the battery 40, the size of the apparatus does not increase in order to control the electronic substrate 13 from the outside. As a result, the electronic device of the present embodiment can perform external control while suppressing the increase in size of the device and the complexity of work.

  In the second embodiment, the flexible film substrate 30 is mounted between the spring negative electrodes 12, but a rigid substrate may be used. When a rigid substrate is used, the thickness is such that it can be inserted into the spiral portion of the spring negative electrode 12. In the second embodiment, the flexible film substrate 30 is mounted between the spring negative electrodes 12, but the film substrate 30 may be mounted on the spring positive electrode 11 side. Further, the positive electrode and the negative electrode may be on the same side.

  In the second embodiment, the partition plate 17 and the blindfold sheet 15 are separate members, but the partition plate 17 and the blindfold sheet 15 may be formed as an integral member. In such a configuration, a slit is formed at a position where the film substrate 30 is inserted. Further, when the film substrate 30 is not inserted, the slit portion may be covered with a sheet.

  In the second embodiment, an example is shown in which an electronic device is controlled by an external test device or the like to perform inspection. However, firmware or the like stored on a storage element mounted on the electronic substrate 13 is updated by external connection. It is good also as composition to do.

  In the second embodiment, the configuration in which the film substrate 30 is fixed by contracting the spring negative electrode 12 by the battery 40 has been described. Instead of such a configuration, the film substrate may be fixed by contracting the spring by an object other than the battery. For example, a spring, a slit, and a connection terminal for a substrate are formed in a portion for attaching an attachment to an electronic device, and the spring is contracted by the attachment so that the film substrate is fixed and connected to the connection terminal. Also good.

DESCRIPTION OF SYMBOLS 1 Housing | casing 2 Board | substrate 3 Spring 4 Connection terminal 10 Apparatus main body 11 Spring positive electrode 12 Spring negative electrode 13 Electronic board 14 Spring pin 15 Blindfold sheet 16 Slit 17 Partition plate 20 Lid 30 Film board 31 Connection part 32 Test pad 33 Reinforcement board 40 Battery

Claims (9)

A housing having a space in which an individual is mounted;
A substrate provided inside the housing and having a circuit pattern formed thereon;
A spring having a spiral shape, one end fixed to the inner side surface of the housing, expanding and contracting in the direction of the horizontal plane of the substrate, and a spring that contracts when the object is mounted inside the housing;
A connection terminal provided between the spring and the substrate, for connecting the signal wiring of the circuit pattern of the substrate and the signal wiring of another substrate;
A film substrate having both terminals connected to each other by a signal line as a first substrate side terminal and a second substrate side terminal;
With
The film substrate is provided between the spring spirals so that the first substrate side terminal and the second substrate side terminal are opposite to each other on the spring,
The electronic device , wherein the first substrate-side terminal of the film substrate and the connection terminal are electrically connected when the solid object is attached to the housing .   The solid object mounted on the housing is a battery, and the spring is electrically connected to the signal wiring of the substrate as a terminal that contacts the negative electrode side of the battery, and the spring is connected to the battery. The electronic device according to claim 1, wherein the electronic device is compressed by being pushed by the negative electrode. The electronic device according to claim 1, wherein a reinforcing plate is formed in the vicinity of the first substrate side terminal of the film substrate. 4. The electronic device according to claim 1, wherein the connection terminal is formed as a spring pin that applies a stress in a horizontal direction of the substrate. 5. A partition plate provided between the spring inside the housing and the substrate, and having an opening near the connection terminal;
A blindfold sheet that covers the opening and has a slit formed in a direction parallel to a side surface of the housing to which the spring is fixed;
5. The electronic device according to claim 1, wherein the film substrate is provided so as to pass through the slit of the blindfold sheet. An electronic device according to any one of claims 1 to 5,
A terminal device that transmits and receives signals via the electronic device and the second substrate side terminal of the film substrate;
The terminal device transmits the signal to the electronic device through the film substrate to control the electronic device. Between the spiral springs, one end of which is fixed to the side of the inside of the housing that has a space for mounting an individual inside,
Passing through the first substrate side terminal of the film substrate having terminals connected to each other by signal lines at both ends as a first substrate side terminal and a second substrate side terminal,
Attaching the object inside the housing,
By the contraction of the spring, a connection terminal provided inside the housing and electrically connected to a substrate on which a circuit pattern is formed is electrically connected to the first substrate side terminal. An electronic device assembly method. When the spring contracts, the first substrate side terminal of the film substrate is moved closer to the connection terminal side, and the first substrate is caused by the stress that the first substrate side terminal receives from the connection terminal. The method for assembling an electronic device according to claim 7, wherein a side terminal and the connection terminal are brought into contact with each other. Between the spiral springs, one end of which is fixed to the side of the inside of the housing that has a space for mounting an individual inside,
Passing through the first substrate side terminal of the film substrate having terminals connected to each other by signal lines at both ends as a first substrate side terminal and a second substrate side terminal,
Attaching the object inside the housing,
Due to the contraction of the spring, a connection terminal that is provided inside the housing and is electrically connected to a substrate on which a circuit pattern is formed, and the first substrate side terminal are electrically connected,
A method for controlling an electronic device, comprising: transmitting and receiving signals to and from the substrate via the second substrate side terminal opposite to the first substrate side terminal with respect to the spring.

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