JP6409518B2 - Pattern forming device - Google Patents

Description

  The present invention relates to a pattern forming apparatus, a conveying apparatus, and a pattern forming method for forming a pattern for an electronic device on a sheet substrate while conveying a long flexible sheet substrate.

  Conventionally, in order to form a pattern of an electronic device (an organic EL or liquid crystal display panel or a printed circuit board on which an electronic component is mounted) on a flexible long sheet substrate, the sheet substrate is arranged in the longitudinal direction. A roll-to-roll manufacturing system is known in which a predetermined processing is performed on a sheet substrate by a plurality of processing devices arranged along the longitudinal direction.

  For example, Patent Document 1 below discloses a pattern drawing apparatus (exposure apparatus) for a roll-to-roll type printed circuit board used as one processing apparatus in such a manufacturing system. In the apparatus disclosed in Patent Document 1, a flexible printed wiring board fed from a supply reel is stretched in a plane by applying a constant tension, and the printed wiring board is stretched in a planar direction while being fed in the longitudinal direction at a predetermined speed. The exposed portion is exposed to a two-dimensional pattern by an exposure head unit composed of a DMD (digital micromirror device), and the exposed printed wiring board is wound around a take-up reel. Furthermore, in the apparatus of Patent Document 1, the mark formed on the printed wiring board is imaged by an alignment unit arranged on the upstream side of the exposure head unit, and the position of the image to be exposed on the printed wiring board is set to an appropriate position. The two-dimensional drawing pattern by DMD, the drawing start time, and the like are corrected so as to correct.

JP 2006-098718 A

  The substrate exposed as in the above-mentioned Patent Document 1 usually needs to be sent to a post-processing device (wet processing device) such as development or etching. In the above-mentioned Patent Document 1, the substrate is printed on a take-up reel. Only after all the wiring boards have been wound up, the subsequent processing steps cannot be performed. Therefore, a manufacturing line in which a processing apparatus for a post process is connected after a nip roller or the like located on the downstream side of the exposure head unit in Patent Document 1, and wet processing or the like is subsequently performed on the exposed substrate. Can be considered.

  In this case, the accuracy of pattern exposure (patterning accuracy) by the exposure apparatus may be deteriorated due to uneven tension of the substrate in the exposure apparatus or a change in the tendency of deformation or distortion of the substrate due to heat treatment in the previous process. When such a situation occurs, the operations of the exposure apparatus and the post-processing apparatus are both temporarily stopped, so that various conditions on the exposure apparatus side, such as pattern drawing data, It is necessary to correct or reset the substrate tension. Furthermore, when the tendency of deformation or distortion of the substrate greatly changes in one device region to be exposed, a large number of marks arranged two-dimensionally around the device region on the substrate are detected, and the substrate is detected. It is desirable to identify the tendency and amount of local deformation and distortion with high accuracy.

  However, when a large number of marks are sequentially detected while the substrate is moving in the longitudinal direction at the speed for the exposure operation, it is necessary to perform high-speed processing on the image signal obtained by imaging the mark or the waveform of the photoelectric signal. Therefore, the measurement accuracy of the mark position is lowered at the stage of image analysis and signal waveform processing, and as a result, the patterning accuracy may be deteriorated. Therefore, it is an object to prevent such deterioration of pattern accuracy as much as possible.

  A first aspect of the present invention is a pattern forming apparatus that forms a pattern for an electronic device on a sheet substrate while conveying the long flexible sheet substrate in a forward direction along the length direction. A transport unit capable of transporting the sheet substrate in a forward direction or a reverse direction along the longitudinal direction, and a detection unit that detects a plurality of detection objects formed on the sheet substrate along the longitudinal direction. A pattern forming portion for sequentially forming the pattern in each of a plurality of device forming regions arranged at predetermined intervals on the sheet substrate along the longitudinal direction, and the sheet substrate in the forward direction. In this state, the detection unit detects the plurality of detection objects, and then the sheet substrate is conveyed in the reverse direction, and then the sheet substrate is moved in the forward direction in the first direction. At a second speed faster than the speed In a state of being fed, and a control unit for detecting by thinning out the plurality of the detection object by the detection unit.

  According to a second aspect of the present invention, there is provided a transport apparatus that detects a transport state of the sheet substrate while transporting a long flexible sheet substrate in a forward direction along the long direction, the sheet substrate A transport unit capable of transporting a sheet in a forward direction or a reverse direction along the longitudinal direction, a detection unit that detects a plurality of detection objects formed along the longitudinal direction on the sheet substrate, and the detection unit The conveyance unit is controlled so that the sheet substrate is conveyed in the forward direction during the period of detecting the detected object by the above, and the sheet substrate is conveyed in the reverse direction during the period of suspending the detection of the detected object. A control unit.

  A third aspect of the present invention is a pattern forming method for forming a pattern for an electronic device on a sheet substrate while conveying the long flexible sheet substrate in a forward direction along the longitudinal direction. The sheet substrate is transported in the forward direction in the first processing apparatus, the first processing is performed on the sheet substrate, and the first processing apparatus is provided on the downstream side of the first processing apparatus with respect to the forward direction. A first mode in which the sheet substrate is transported to a second processing apparatus via a storage device, and the pattern is formed on the sheet substrate with a first accuracy in the second processing apparatus; and from the first mode Executing any one of the second modes in which the pattern is formed on the sheet substrate with a high second accuracy, and a second storage device provided downstream of the second processing device with respect to the forward direction. Through the third substrate. Performing the third process on the sheet substrate while transporting in the forward direction in the apparatus, and the length of the sheet substrate that can be newly accumulated in the first accumulation device is equal to or greater than a predetermined margin length, and Relative conveyance of the sheet substrate in each of the first to third processing devices so as to reach a first state in which the length of the sheet substrate accumulated in the second accumulation device is equal to or greater than a predetermined accumulation length. Adjusting the speed and reducing the sheet substrate conveyance speed in the second processing apparatus or returning the sheet substrate in the direction opposite to the forward direction during the first state. And executing the second mode over the length of the sheet substrate corresponding to the storage length of the second storage device.

  According to a fourth aspect of the present invention, a long flexible sheet substrate is conveyed in the forward direction along the long direction, and a pattern for electronic devices is sequentially formed on the sheet substrate at a predetermined interval. In the forming method, the sheet substrate is transported in the forward direction in the first processing apparatus, the first processing is performed on the sheet substrate, and the downstream side of the first processing apparatus is provided with respect to the forward direction. The sheet substrate is transferred to the second processing device via the first storage device, and the pattern is sequentially transferred at a predetermined interval on the sheet substrate transferred in the forward direction in the second processing device. Forming and conveying the sheet substrate in the forward direction in the third processing apparatus via a second storage device provided downstream of the second processing apparatus with respect to the forward direction, Applying a third process to the first storage In a first state, the length of the sheet substrate that can be newly accumulated in the apparatus is equal to or greater than a predetermined margin length, and the length of the sheet substrate that has been accumulated in the second accumulation apparatus is equal to or greater than a predetermined accumulation length. Adjusting the relative conveyance speed of the sheet substrate in each of the first to third processing devices so as to reach, and forming accuracy of the pattern in the second processing device under the first state Is not within the allowable range, the correction operation for stopping the pattern forming operation and carrying the sheet substrate in the forward direction to return the forming accuracy to the allowable range is performed, and the correction is performed. After the preparatory operation, returning the sheet substrate to the direction opposite to the forward direction to the vicinity of the position where the pattern forming operation is stopped in the second processing apparatus, and restarting the stopped pattern forming operation. , Including.

  According to a fifth aspect of the present invention, there is provided a pattern forming apparatus for transporting a long flexible sheet substrate along a longitudinal direction and sequentially forming a pattern for an electronic device on the sheet substrate. A substrate transport section capable of switching between a first transport state for transporting a sheet substrate in a forward direction along the longitudinal direction and a second transport state for transporting in a reverse direction along the longitudinal direction; A pattern forming portion for forming the pattern in each of a plurality of device forming regions arranged at predetermined intervals along the longitudinal direction on the sheet substrate under a first transport state; and the pattern forming portion In contrast, a mark detection unit that is arranged upstream or downstream in the conveyance direction of the sheet substrate and detects position information of a plurality of marks formed on the sheet substrate for alignment of the device formation region; , The inspection When the pattern formation unit tends to deviate from the predetermined allowable range on the basis of the position information, the mark detection unit obtains the position information again. For this purpose, a control unit is provided for switching the substrate transfer unit from the first transfer state to the second transfer state over a predetermined time.

It is a figure which shows the structure of the device manufacturing system of 1st Embodiment. It is a figure which shows the structure of the device manufacturing system of 1st Embodiment. It is a figure which shows the scanning line of the spot light scanned on a board | substrate by the exposure head of FIG. 2, and the alignment mark formed on the board | substrate. It is a figure which shows the structure of the drawing unit of FIG. It is a flowchart which shows operation | movement of the processing apparatus which is an exposure apparatus of FIG. FIG. 6 is a time chart showing a transport operation of a substrate transported by the operation shown in the flowchart of FIG. 5, and a time chart showing a length of a substrate stored by the first storage unit and the second storage unit of FIG. 2. FIG. 7 is a diagram showing a relative movement direction and a movement range of the alignment microscope of FIG. 3 with respect to the substrate conveyed by the operation shown in the time chart of FIG. 6. It is a graph which shows the increase amount of the accumulation length of the 1st accumulation part at the time of return conveyance. It is a figure which shows the structure of the pattern formation apparatus in 2nd Embodiment. It is a flowchart which shows operation | movement of the alignment detection apparatus in 2nd Embodiment. It is a flowchart which shows an example of the manufacturing process of electronic devices, such as a thin-film transistor (TFT), using the pattern formation apparatus in 1st or 2nd embodiment. It is a figure which shows schematic structure of the pattern formation apparatus in 4th Embodiment. It is a figure which shows schematic structure of the auxiliary | assistant illumination mechanism applied to the pattern formation apparatus of FIG.

  DESCRIPTION OF EMBODIMENTS A pattern forming apparatus, a transport apparatus, and a pattern forming method according to an aspect of the present invention will be described in detail below with reference to the accompanying drawings. In addition, the aspect of this invention is not limited to these embodiment, What added the various change or improvement is included. That is, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same elements, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the scope of the present invention.

[First Embodiment]
The pattern forming apparatus according to the first embodiment forms a pattern for an electronic device on a substrate while conveying the substrate, and the pattern forming apparatus performs various processes on the substrate to manufacture an electronic device. Built into device manufacturing systems. First, a device manufacturing system will be described.

  1 and 2 are diagrams showing a configuration of a device manufacturing system 10 according to the first embodiment. The device manufacturing system 10 shown in FIGS. 1 and 2 is, for example, a line (flexible display manufacturing line) for manufacturing a flexible display as an electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display. The device manufacturing system 10 sends out a substrate P from a supply roll FR1 obtained by winding a flexible sheet substrate (hereinafter referred to as a substrate) P into a roll, and performs various processes on the delivered substrate P. After the continuous application, a so-called roll-to-roll system is adopted in which the processed substrate P is wound up by a recovery roll FR2. The substrate P has a strip shape in which the moving direction (conveying direction) of the substrate P is long and the width direction is short. In the device manufacturing system 10 according to the first embodiment, the substrate P that is a film-like sheet is sent out from the supply roll FR1, and the substrate P sent out from the supply roll FR1 is processed by the processing apparatuses PR1, PR2, PR3, The example of winding up to the collecting roll FR2 through PR4 and PR5 is shown. First, the substrate P to be processed by the device manufacturing system 10 will be described.

  For the substrate P, for example, a foil (foil) made of a metal or an alloy such as a resin film or stainless steel is used. Examples of the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. You may use what contained 1 or 2 or more. In addition, the thickness and rigidity (Young's modulus) of the substrate P may be in a range that does not cause folds or irreversible wrinkles due to buckling in the substrate P when it is transported. When making a flexible display panel, a touch panel, a color filter, an electromagnetic wave prevention filter, or the like as an electronic device, a resin sheet such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is used.

  As the substrate P, for example, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that deformation amounts due to heat received in various processes applied to the substrate P can be substantially ignored. Further, when an inorganic filler such as titanium oxide, zinc oxide, alumina, silicon oxide or the like is mixed into the base resin film, the thermal expansion coefficient can be reduced. Further, the substrate P may be a single layer of ultra-thin glass having a thickness of about 100 μm manufactured by a float process or the like, and the ultra-thin glass may be made of the above resin film or a metal such as aluminum or copper. It may be a laminate in which layers (foil) or the like are bonded together.

  By the way, the flexibility of the substrate P means the property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. In addition, flexibility includes a property of bending by a force of about its own weight. The degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure formed on the substrate P, the environment such as temperature and humidity, and the like. In any case, when the substrate P is correctly wound around various transport rollers, rotary drums and other members for transport direction change provided in the transport path in the device manufacturing system 10 according to the present embodiment, the substrate P buckles and folds. If the substrate P can be smoothly transported without being damaged or broken (breaking or cracking), it can be said to be in the range of flexibility.

  The substrate P thus configured becomes a supply roll FR1 by being wound in a roll shape, and this supply roll FR1 is mounted on the device manufacturing system 10. The device manufacturing system 10 to which the supply roll FR1 is mounted repeatedly executes various processes for manufacturing an electronic device on the substrate P sent out from the supply roll FR1. For this reason, the processed substrate P is in a state in which a plurality of electronic devices are connected. That is, the substrate P sent out from the supply roll FR1 is a multi-sided substrate. The substrate P may be activated by modifying the surface in advance by a predetermined pretreatment, or may be formed with a fine partition structure (uneven structure) for precise patterning on the surface.

  The electronic device is configured by superimposing a plurality of pattern layers (layers on which patterns are formed), and one pattern layer is generated through each of the processing apparatuses PR1 to PR5 of the device manufacturing system 10. In order to generate an electronic device, the processing of the processing apparatuses PR1 to PR5 of the device manufacturing system 10 as shown in FIGS. 1 and 2 must be performed at least twice.

  The processed substrate P is recovered as a recovery roll FR2 by being wound into a roll. The collection roll FR2 may be mounted on a dicing device (not shown). The dicing apparatus to which the collection roll FR2 is mounted divides the processed substrate P for each electronic device (dicing) to form a plurality of electronic devices. Regarding the dimensions of the substrate P, for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more. In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

  With reference to FIGS. 1 and 2, the device manufacturing system 10 will be described. In FIG. 1 and FIG. 2, it is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is a transport direction of the substrate P in the horizontal plane, and is a direction connecting the supply roll FR1 and the recovery roll FR2. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

  The device manufacturing system 10 includes a substrate supply device 12 that supplies a substrate P, processing devices PR1 to PR5 that perform various processes on the substrate P supplied by the substrate supply device 12, and processing devices PR1 to PR5 that perform processing. The substrate recovery apparatus 14 that recovers the processed substrate P and the host controller 16 that controls each device of the device manufacturing system 10 are provided. The host controller 16 includes a computer and a storage medium in which a program is stored, and the computer executes the program stored in the storage medium, whereby the host controller 16 in the first embodiment is used. Function.

  A supply roll FR1 is rotatably mounted on the substrate supply device 12. The substrate supply device 12 includes a drive roller R1 that sends out the substrate P from the mounted supply roll FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction). The driving roller R1 rotates while pinching both front and back surfaces of the substrate P, and sends the substrate P in the transport direction (+ X direction) from the supply roll FR1 to the recovery roll FR2, thereby causing the substrate P to be processed by the processing apparatuses PR1 to PR5. To supply. At this time, the edge position controller EPC1 sets the substrate P so that the position of the substrate P at the end (edge) in the width direction is within a range (allowable range) of about ± 10 μm to several tens μm with respect to the target position. The position of the substrate P in the width direction is corrected by moving P in the width direction.

  A recovery roll FR2 is rotatably mounted on the substrate recovery apparatus 14. The substrate recovery apparatus 14 includes a drive roller R2 that draws the processed substrate P toward the recovery roll FR2, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction). The substrate collection device 14 pulls the substrate P by rotating the substrate P while holding both the front and back surfaces of the substrate P by the driving roller R2, and winds the substrate P by rotating the collection roll FR2. At this time, the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the end portion (edge) in the width direction of the substrate P does not vary in the width direction. . The supply roll FR1, the collection roll FR2, and the drive rollers R1 and R2 rotate by receiving a rotational torque from a rotational drive source (not shown).

  The processing apparatus PR1 is a coating apparatus that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply apparatus 12. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling agent, a UV curable resin liquid, a photosensitive plating reducing solution, or the like is used. The processing apparatus PR1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side (−X direction side) in the transport direction of the substrate P. The coating mechanism Gp1 includes a pressure drum DR1 around which the substrate P is wound, and a coating roller DR2 facing the pressure drum DR1. The coating mechanism Gp1 sandwiches the substrate P between the pressure drum roller DR1 and the coating roller DR2 in a state where the supplied substrate P is wound around the pressure drum roller DR1. Then, the application mechanism Gp1 applies the photosensitive functional liquid by the application roller DR2 while rotating the impression cylinder DR1 and the application roller DR2 to move the substrate P in the transport direction (+ X direction). The drying mechanism Gp2 blows drying air such as hot air or dry air, removes the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid. A photosensitive functional layer is formed on the substrate P. The impression cylinder roller DR1 and the application roller DR2 rotate when a rotational torque from a rotational drive source (not shown) is applied.

  In order to stabilize the photosensitive functional layer formed on the surface of the substrate P, the processing apparatus (first processing apparatus) PR2 moves the substrate P transported from the processing apparatus PR1 to a predetermined temperature (for example, several tens of degrees Celsius to 120 degrees Celsius). It is a heating device that heats to the extent. The processing apparatus PR2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars therein, and the plurality of rollers and the plurality of air turn bars constitute a transport path for the substrate P. The plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided in a non-contact state on the surface side of the substrate P. The plurality of rollers and the plurality of air turn bars are arranged to form a meandering transport path so as to lengthen the transport path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along a meandering transport path. The cooling chamber HA2 cools the substrate P to the environmental temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the environmental temperature of the subsequent process (processing apparatus PR3). The cooling chamber HA2 is provided with a plurality of rollers, and the plurality of rollers are arranged in a meandering manner in order to lengthen the conveyance path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the cooling chamber HA2 is cooled while being transferred along a meandering transfer path. A driving roller R3 is provided on the downstream side in the transport direction of the cooling chamber HA2, and the driving roller R3 rotates while sandwiching the substrate P that has passed through the cooling chamber HA2, thereby directing the substrate P toward the processing apparatus PR3. Supply. The drive roller R3 rotates when a rotational torque from a rotational drive source (not shown) is applied.

  In the processing apparatus (second processing apparatus) PR3, the substrate P, which is supplied from the processing apparatus PR2 through the first storage unit (first storage apparatus) BF1 and has a photosensitive functional layer formed on the surface thereof, is the length of the substrate P. The exposure apparatus exposes a pattern such as a circuit or wiring for a display panel on the substrate P while being transported in a transport direction along the direction (+ X direction). The processing apparatus PR3 transports the exposed substrate P toward the processing apparatus PR4 via the second storage unit (second storage apparatus) BF2. The first accumulation unit BF1 and the second accumulation unit BF2 can accumulate the substrate P over a predetermined length in a state where a tension is applied to the substrate P. The processing device PR3, the first storage unit BF1, and the second storage unit BF2 constitute a pattern forming device 18. The pattern forming device 18 will be described later.

  The processing apparatus (third processing apparatus) PR4 is a wet processing apparatus that performs wet development processing, electroless plating processing, and the like on the exposed substrate P conveyed from the processing apparatus PR3 via the second storage unit BF2. It is. The processing apparatus PR4 includes a processing tank BT and a plurality of rollers that transport the substrate P. The plurality of rollers are arranged so that the substrate P becomes a transport path through the inside of the processing tank BT. A driving roller R4 is provided on the downstream side (+ X direction side) in the transport direction of the processing tank BT. The driving roller R4 processes the substrate P by rotating while sandwiching the substrate P that has passed through the processing tank BT. Supply toward the device PR5. The drive roller R4 rotates when a rotational torque from a rotational drive source (not shown) is given.

  Although not shown, the processing apparatus PR5 is a drying apparatus that dries the substrate P transported from the processing apparatus PR4. The processing apparatus PR5 adjusts the moisture content adhering to the substrate P wet-processed in the processing apparatus PR4 to a predetermined moisture content. The substrate P dried by the processing apparatus PR5 is wound up on the collecting roll FR2 of the substrate collecting apparatus 14.

  The host control device 16 performs overall control of the substrate supply device 12, the substrate recovery device 14, the plurality of processing devices PR1 to PR5, the first accumulation unit BF1, and the second accumulation unit BF2. The host control device 16 controls each device of the device manufacturing system 10 so that the substrate P is transported from the substrate supply device 12 toward the substrate recovery device 14. Further, the host control device 16 controls the plurality of processing apparatuses PR1 to PR5 to execute various processes on the substrate P while synchronizing with the transport of the substrate P.

  In the device manufacturing system 10 according to the first embodiment, the substrate P sent out from the supply roll FR1 is sequentially wound up on the collection roll FR2 through the five processing apparatuses PR1 to PR5. Although an example is shown, the present invention is not limited to this configuration. That is, the number of processing apparatuses PR provided between the supply roll FR1 and the collection roll FR2 may be one, may be six or more, and the number is arbitrarily changed. be able to.

  Next, the pattern forming apparatus 18 will be described. The first accumulation unit BF1 of the pattern forming apparatus 18 includes drive rollers R5 and R6 and a plurality of dancer rollers 20. The drive roller R5 rotates while sandwiching the front and back surfaces of the substrate P sent from the processing apparatus PR2, and carries the substrate P into the first accumulation unit BF1. The driving roller R6 rotates while sandwiching both the front and back surfaces of the substrate P, and supplies the substrate P in the first accumulation unit BF1 to the processing apparatus PR3. The plurality of dancer rollers 20 are provided between the drive roller R5 and the drive roller R6 and apply a predetermined tension to the substrate P. The plurality of dancer rollers 20 are movable in the Z direction, the upper dancer roller 20 (20a) is biased in the + Z direction, and the lower dancer roller 20 (20b) is biased in the -Z direction. ing. The dancer rollers 20a and dancer rollers 20b are alternately arranged in the X direction. When the conveyance speed of the substrate P carried into the first accumulation unit BF1 becomes relatively higher than the conveyance speed of the substrate P carried out from the first accumulation unit BF1, the length of the substrate P accumulated in the first accumulation unit BF1. It increases. When the length of the substrate P accumulated in the first accumulation unit BF1 becomes longer, the dancer roller 20a moves in the + Z direction and the dancer roller 20b moves in the -Z direction by the urging force. Thereby, the first accumulation unit BF1 can accumulate the substrate P in a state where a predetermined tension is applied to the substrate P. Conversely, when the length of the substrate P stored in the first storage unit BF1 is shortened, the dancer roller 20a moves in the -Z direction and the dancer roller 20b moves in the + Z direction against the biasing force. In any case, the first storage unit BF1 can store the substrate P in a state where a predetermined tension is applied to the substrate P. The drive rollers R5 and R6 rotate when a rotational torque from a rotational drive source (not shown) is applied.

  The second accumulation unit BF2 of the pattern forming apparatus 18 includes driving rollers R7 and R8 and a plurality of dancer rollers 22. The driving roller R7 rotates while sandwiching both front and back surfaces of the substrate P sent from the processing apparatus PR3, and carries the substrate P into the second accumulation unit BF2. The driving roller R8 rotates while pinching both front and back surfaces of the substrate P, and supplies the substrate P in the second accumulation unit BF2 to the processing device PR4. The plurality of dancer rollers 22 are provided between the driving roller R7 and the driving roller R8 and apply a predetermined tension to the substrate P. The plurality of dancer rollers 22 are movable in the Z direction, the upper dancer roller 22 (22a) is biased in the + Z direction, and the lower dancer roller 22 (22b) is applied in the -Z direction. It is energized. The dancer rollers 22a and the dancer rollers 22b are alternately arranged in the X direction. By having such a configuration, the second storage unit BF2 can store the substrate P in a state where a predetermined tension is applied to the substrate P, similarly to the first storage unit BF1. The drive rollers R7 and R8 rotate when a rotational torque from a rotational drive source (not shown) is applied. The first storage unit BF1 and the second storage unit BF2 have the same configuration.

  In a normal time, the first accumulation unit BF1 accumulates the substrate P so that the length of the substrate P that can be newly accumulated is equal to or greater than a predetermined margin length. That is, the first accumulation unit BF1 shortens the length of the accumulated substrate P so that the substrate P having a length longer than a predetermined margin length can be newly accumulated. For example, when the length of the substrate P that can be stored in the state where the first storage unit BF1 applies a predetermined tension to the substrate P is 5 m and the predetermined margin length is 4 m, the first storage unit BF1 is normally used. The length of the substrate P in which is accumulated is less than 1 m. Further, in normal times, the second storage unit BF2 stores the substrate P so that the length of the stored substrate P is equal to or longer than a predetermined storage length. For example, when the length of the substrate P that can be stored in the state where the second storage unit BF2 applies a predetermined tension to the substrate P is 5 m and the predetermined storage length is 4 m, the second storage unit BF2 stores The length of the substrate P is 4 m or more.

  The processing apparatus PR3 of the pattern forming apparatus 18 is a direct drawing type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus, and applies to the substrate P supplied from the processing apparatus PR2 via the first accumulation unit BF1. Then, a pattern is formed by exposing a pattern such as a display circuit or wiring. The display circuit and wiring pattern include a TFT (thin film transistor) gate electrode and a wiring pattern associated with the display, or a TFT source and drain electrode and a wiring pattern associated therewith. Can be mentioned. The processing apparatus PR3 carries out the one-dimensional scanning of the spot light SP of the laser beam LB for exposure on the substrate P in the predetermined scanning direction (Y direction) while transporting the substrate P in the X direction, and the intensity of the spot light SP. The pattern is drawn and exposed on the surface (photosensitive surface) of the substrate P by high-speed modulation (on / off) according to the pattern data (drawing data). That is, the spot light SP is relatively two-dimensionally scanned on the substrate P by carrying the substrate P in the + X direction (sub-scanning) and scanning the spot light SP in the main scanning direction. These patterns are drawn and exposed. This pattern data may be recorded on a recording medium of the host controller 16 or may be recorded on a recording medium in the processing device PR3.

  The processing apparatus PR3 includes a transport unit 30, a light source device 32, and an exposure head (pattern forming unit). The processing apparatus PR3 is stored in the temperature control chamber ECV. This temperature control chamber ECV suppresses a shape change due to a temperature change of the substrate P transported inside by keeping the internal temperature at a predetermined temperature. The temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via passive or active vibration isolation units SU1, SU2. The installation surface E may be a surface on the installation base or a floor. Other processing apparatuses PR1, PR2, PR4, PR5, the substrate supply apparatus 12, and the substrate recovery apparatus 14 other than the processing apparatus PR3 are also arranged on the installation surface E.

  The transport unit 30 transports the substrate P transported from the processing apparatus PR2 via the first accumulation unit BF1 to the processing apparatus PR4 side. The transport unit 30 includes, in order from the upstream side (−X direction side) along the transport direction of the substrate P, the edge position controller EPC3, the tension adjustment roller RT1, the rotary drum 36, the tension adjustment roller RT2, and the edge position controller EPC4. Have.

  Similarly to the edge position controller EPC1, the edge position controller EPC3 corrects the position in the width direction of the substrate P so that the end portion (edge) in the width direction of the substrate P does not vary in the width direction. For example, the edge position controller EPC3 adjusts the position of the substrate P in the width direction so that the longitudinal direction of the substrate P carried into the rotating drum 36 is orthogonal to the axial direction of the rotation axis AX of the rotating drum 36. The edge position controller EPC3 has driving rollers R9 and R10, and the driving rollers R9 and R10 give slack (play) to the substrate P in the edge position controller EPC3. The driving rollers R9 and R10 rotate while sandwiching both front and back surfaces of the substrate P conveyed from the processing apparatus PR2 side, and convey the substrate P toward the rotating drum 36 side. The drive roller R9 is provided on the upstream side (−X direction side) in the transport direction with respect to the drive roller R10. The drive rollers R9 and R10 rotate when a rotational torque from a rotational drive source (not shown) is applied.

  The rotating drum 36 supports a portion of the substrate P where the pattern is exposed on its circumferential surface. The rotating drum 36 rotates around a rotation axis AX extending in the Y direction, thereby transporting the substrate P in the + X direction following the outer peripheral surface (circumferential surface) of the rotating drum 36, and an edge position controller. Send to EPC4 side. The rotating drum 36 (rotating shaft AX) rotates by receiving a rotating torque from a rotating drive source (not shown).

  Similarly to the edge position controller EPC1, the edge position controller EPC4 corrects the position in the width direction of the substrate P so that the end portion (edge) in the width direction of the substrate P does not vary in the width direction. The edge position controller EPC4 has driving rollers R11 and R12, and the driving rollers R11 and R12 give slack (play) to the substrate P in the edge position controller EPC4. The driving rollers R11 and R12 rotate while sandwiching the front and back surfaces of the substrate P conveyed by the rotating drum 36, and convey the substrate P toward the processing apparatus PR4. The drive roller R11 is provided on the upstream side (−X direction side) in the transport direction with respect to the drive roller R12. The drive rollers R11 and R12 rotate when a rotational torque from a rotational drive source (not shown) is applied. The tension adjusting rollers RT1 and RT2 are urged in the −X direction, and give a predetermined tension to the substrate P which is wound around and supported by the rotary drum.

  The light source device 32 has a laser light source and irradiates ultraviolet laser light (irradiation light, exposure beam) LB used for exposure. This laser beam LB may be ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less. The laser beam LB may be pulsed light emitted at the oscillation frequency Fs. The laser beam LB emitted from the light source device 32 is guided to the light introducing optical system 38 and enters the exposure head 34.

  The exposure head 34 includes a plurality of drawing units U (U1 to U5) on which the laser beams LB from the light source device 32 are respectively incident. That is, the laser beam LB from the light source device 32 is guided to the light introducing optical system 38 having a reflection mirror, a beam splitter, etc., and enters the plurality of drawing units U (U1 to U5). The exposure head 34 draws and exposes a pattern on a part of the substrate P supported by the circumferential surface of the rotary drum 36 by a plurality of drawing units U (U1 to U5). The exposure head 34 is a so-called multi-beam type exposure head 34 by having a plurality of drawing units U (U1 to U5) having the same configuration. The drawing units U1, U3, U5 are arranged on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the rotation axis AX of the rotary drum 36, and the drawing units U2, U4 are the rotation axes of the rotary drum 36. It is arranged on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to AX.

  Each drawing unit U converges the incident laser beam LB on the substrate P to be a spot beam SP, and scans the spot beam SP along the scan line L. As shown in FIG. 3, the scanning lines L of the drawing units U are set so as to be connected to each other without being separated from each other in the Y direction (the width direction of the substrate P). In FIG. 3, the scanning line L of the drawing unit U1 is represented by L1, and the scanning line L of the drawing unit U2 is represented by L2. Similarly, the scanning lines L of the drawing units U3, U4, U5 are represented by L3, L4, L5. In this way, each drawing unit U shares the scanning area so that all of the drawing units U1 to U5 cover the entire width direction of the device forming area W that becomes the exposure area. For example, if the drawing width in the Y direction (the length of the scanning line L) by one drawing unit U is about 20 to 50 mm, the odd-numbered drawing units U1, U3, U5 and the even-numbered drawing are used. By arranging a total of five drawing units U, two units U2 and U4, in the Y direction, the width in the Y direction that can be drawn is increased to about 100 to 250 mm.

  The drawing unit U is a known technique as disclosed in the pamphlet of International Publication No. 2013/146184 (see FIG. 36). The drawing unit U will be briefly described with reference to FIG. Since each drawing unit U (U1 to U5) has the same configuration, only the drawing unit U2 will be described, and description of the other drawing units U will be omitted.

  As shown in FIG. 4, the drawing unit U2 includes, for example, a condenser lens 50, a drawing optical element (light modulation element) 52, an absorber 54, a collimator lens 56, a reflection mirror 58, a cylindrical lens 60, a focus lens 62, A reflection mirror 64, a polygon mirror (light scanning member) 66, a reflection mirror 68, an f-θ lens 70, and a cylindrical lens 72 are included.

  The laser beam LB incident on the drawing unit U2 travels from the upper side to the lower side (−Z direction) in the vertical direction, and enters the drawing optical element 52 via the condenser lens 50. The condensing lens 50 condenses (converges) the laser light LB incident on the drawing optical element 52 so as to be a beam waist in the drawing optical element 52. The drawing optical element 52 is transmissive to the laser light LB, and for example, an acousto-optic element (AOM: Acousto-Optic Modulator) is used.

  When the drive signal (high-frequency signal) from the host controller 16 is off, the drawing optical element 52 transmits the incident laser beam LB to the absorber 54 side, and the drive signal from the host controller 16 ( When the high-frequency signal is on, the incident laser beam LB is diffracted and directed to the reflection mirror 58. The absorber 54 is an optical trap that absorbs the laser beam LB in order to suppress leakage of the laser beam LB to the outside. Thus, the laser beam LB is applied to the reflection mirror 58 by turning on / off the drawing drive signal (ultrasonic frequency) to be applied to the drawing optical element 52 at high speed according to the pattern data (black and white). Switching to or from the absorber 54 is switched. This means that when viewed on the substrate P, the intensity of the laser light LB (spot light SP) reaching the photosensitive surface is rapidly modulated to either a high level or a low level (for example, zero level) according to the pattern data. Means that

  The collimating lens 56 converts the laser beam LB from the drawing optical element 52 toward the reflection mirror 58 into parallel light. The reflection mirror 58 reflects the incident laser beam LB in the −X direction and irradiates the reflection mirror 64 via the cylindrical lens 60 and the focus lens 62. The reflection mirror 64 irradiates the polygon mirror 66 with the incident laser beam LB. The polygon mirror (rotating polygonal mirror) 66 rotates to continuously change the reflection angle of the laser beam LB, thereby changing the position of the laser beam LB irradiated on the substrate P in the scanning direction (width direction of the substrate P). To scan. The polygon mirror 66 is rotated at a constant speed by a rotation driving source (not shown) (for example, a motor or a speed reduction mechanism).

  A cylindrical lens 60 provided between the reflection mirror 58 and the reflection mirror 64 cooperates with the focus lens 62 to emit the laser beam LB in the non-scanning direction (Z direction) orthogonal to the scanning direction of the polygon mirror 66. Condensed (converged) on the reflective surface. The cylindrical lens 60 can suppress the influence even when the reflection surface is inclined with respect to the Z direction (inclination from the equilibrium state between the normal line of the XY surface and the reflection surface). The irradiation position of the laser beam LB irradiated on the substrate P is prevented from shifting in the X direction.

  The laser beam LB reflected by the polygon mirror 66 is reflected in the −Z direction by the reflection mirror 68 and enters the f-θ lens 70 having the optical axis AXu parallel to the Z axis. The f-θ lens 70 is a telecentric optical system in which the principal ray of the laser beam LB projected onto the substrate P is always normal to the surface of the substrate P during scanning. Can be scanned in the Y direction accurately at a uniform speed. The laser beam LB emitted from the f-θ lens 70 passes through a cylindrical lens 72 whose generatrix is parallel to the Y direction, and is formed on a substrate P with a minute circular shape having a diameter of about several μm (for example, 3 μm). The spot light SP is irradiated. Spot light (scanning spot light) SP is one-dimensionally scanned in one direction by a polygon mirror 66 along a scanning line L2 extending in the Y direction.

  Further, as shown in FIGS. 2 and 3, the processing apparatus PR3 includes three alignment microscopes AM (AM1 to AM1) for detecting alignment marks Ks (Ks1 to Ks3) as detection objects formed on the substrate P. AM3) is provided. A region on the substrate P detected by the alignment microscope AM (AM1 to AM3) is supported by the circumferential surface of the rotary drum 36. The alignment mark (mark) Ks is a reference mark for relatively aligning (aligning) the pattern drawn in the device formation region W on the substrate P with the substrate P. That is, the position of the substrate P can be detected by detecting the alignment mark Ks. The alignment marks Ks are formed on both ends in the width direction of the substrate P at regular intervals along the length direction of the substrate P, and device formation regions W aligned along the length direction of the substrate P. It is also formed between the device formation region W and the center of the substrate P in the width direction. Since the exposure head 34 repeatedly performs pattern exposure for electronic devices on the substrate P, the device formation region W is spaced at a predetermined interval Ls (see FIG. 7) along the longitudinal direction of the substrate P. A plurality are provided.

  The alignment microscope AM (AM1 to AM3) as a detection unit is provided on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the spot light SP irradiated from the exposure head 34. The alignment microscope AM (AM1 to AM3) detects the alignment mark Ks (Ks1 to Ks3) present in the detection region (detection visual field). The alignment microscopes AM1 to AM3 are provided along the Y direction, and the alignment microscope AM1 detects the alignment mark Ks1 formed on the + Y direction side end of the substrate P existing in the detection region, and the alignment microscope AM2 detects the alignment mark Ks2 formed on the end portion on the −Y direction side of the substrate P existing in the detection region. The alignment microscope AM3 detects the alignment mark Ks3 formed at the center in the width direction of the substrate P existing in the detection region. The size of the detection region on the substrate P is set according to the size of the alignment mark Ks (Ks1 to Ks3) and the alignment accuracy (position measurement accuracy), but is about 100 to 500 μm square. The alignment microscope AM projects alignment illumination light onto the substrate P, images the reflected light with an image sensor such as a CCD or CMOS, and detects the alignment mark Ks. The position information of the alignment mark Ks to be detected is sent to the host controller 16. The alignment illumination light is light in a wavelength region that has little sensitivity to the photosensitive functional layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

  Here, the alignment microscope AM (AM1 to AM3) detects the alignment mark Ks (Ks1 to Ks3) by imaging the substrate P in the detection region at a constant period. That is, the detection of the alignment mark Ks (Ks1 to Ks3) is performed at a constant cycle. Therefore, the alignment mark Ks is thinned and detected as the transport speed of the substrate P increases. That is, the faster the conveyance speed of the substrate P, the smaller the number of alignment marks Ks that are detected, and the lower the detection accuracy of the alignment marks Ks. Therefore, in order to increase the detection accuracy of the alignment mark Ks, it is necessary to transport the substrate P slowly.

  Although the device manufacturing system 10 according to the first embodiment has the above-described configuration, the substrate P can be transported also in the −X direction in the pattern forming apparatus 18. When the substrate P is transported in the −X direction (when performing return transport), the host controller 16 rotates the driving rollers R9 to R12 and the rotary drum 36 of the transport unit 30 of the processing apparatus PR3 in the reverse direction, The driving roller R6 of the first accumulation unit BF1 and the driving roller R7 of the second accumulation unit BF2 are also rotated in the opposite directions. A direction in which the substrate P is transported in the + X direction is referred to as a forward direction, and a direction in which the substrate P is transported in a direction opposite to the forward direction is referred to as a reverse direction.

  Before describing the operation of the pattern forming apparatus 18, the relationship between the substrate P transport state and the pattern data correction, which is the premise thereof, will be described. Although the position of the substrate P in the width direction is corrected by the edge position controllers EPC1 to EPC4 of the transport unit 30, since the substrate P is a film-like sheet substrate, its shape is easily deformed, and the substrate P transported to the rotary drum 36 In some cases, the position of the end portion in the width direction may deviate from the target position beyond the allowable range. Therefore, when the longitudinal direction of the substrate P conveyed to the rotary drum 36 is tilted beyond the allowable range with respect to the rotation axis AX of the rotary drum 36, or the substrate P is deformed (distorted or the like) beyond the allowable range. Therefore, the actual transport state of the substrate P to the rotary drum 36 is different from the ideal transport state of the substrate P to the rotary drum 36. As a result, the pattern cannot be properly exposed by the exposure head 34.

  Therefore, the host controller 16 recognizes the transport state (tilt, deformation, etc.) of the substrate P based on the position of the alignment mark Ks (Ks1 to Ks3) detected by the alignment microscope AM (AM1 to AM3), and the exposure head 34. However, by correcting the position and area where the pattern is exposed (formed) in accordance with the conveyance state, the exposure accuracy (formation accuracy) of the pattern is prevented from being lowered. Correction of the position and area where this pattern is exposed (formed) can be dealt with by correcting pattern data (drawing data) (including correction of drawing timing). That is, by correcting the pattern data of each drawing unit U, the positions of the scanning lines L1 to L5 are shifted in the Y direction (scanning direction), or the lengths (scanning lengths) of the scanning lines L1 to L5 are changed. Therefore, the position and area where the pattern is formed can be corrected in accordance with the deformation of the substrate P or the like.

  The correction of the position and region where this pattern is formed is performed, for example, so that the overlay error between the pattern formed on the base layer (lower layer) of the substrate P and the pattern to be formed is within an allowable range. Further, when there is no underlayer, that is, when a pattern is to be formed on the underlayer from now on, each drawing unit is exposed so that the pattern can be exposed within a permissible range in a predetermined device formation region W of the substrate P. The position and area of the pattern exposed by U are predicted and corrected based on the edge position detection information of the edge position controllers EPC3 and EPC4.

  When a new pattern is overlaid and exposed on the pattern formed on the underlayer, the respective drawing lines (L1 to L5) are used from the respective detection center positions on the substrate P of the alignment microscopes AM1 to AM3. Information on the relative positional relationship to the pattern drawing position, that is, a so-called two-dimensional baseline length (obtained in advance during calibration) is also used. Specifically, the center positions of the alignment marks Ks (Ks1 to Ks3) formed on the substrate P simultaneously with the underlayer are detected by the alignment microscopes AM1 to AM3, and the center positions of the alignment marks Ks (Ks1 to Ks3). Based on the two-dimensional shift amount (ΔX, ΔY) between the detection microscope and the detection center position of the alignment microscopes AM1 to AM3 and the two-dimensional baseline length obtained in advance. Each drawing line (L1) is calculated with reference to the measured value of the feed amount of the substrate P (measured value of the encoder that detects the rotation amount of the rotary drum 36) so that the error is accurately calculated and the error is within an allowable range. To L5) are corrected. Further, it is considered that the pattern formed on the base layer is formed in the predetermined device formation region W on the substrate P together with the alignment mark Ks. Therefore, by accurately measuring the positions of the plurality of alignment marks Ks (Ks1 to Ks3) formed on the substrate P, the position and shape of the device formation region W on the substrate P are deformed, that is, as a base layer. The position and deformation of the formed pattern (including primary error components such as rotation error, skew error, expansion and contraction error, and higher order error components such as a bow shape and a barrel shape) can be obtained.

  Next, the operation of the pattern forming apparatus 18 will be described. FIG. 5 is a flowchart showing the operation of the pattern forming apparatus 18, FIG. 6 is a time chart showing the transfer operation of the substrate P transferred by the operation shown in the flowchart of FIG. 5, and the first storage unit BF1 and the second storage. It is a time chart which shows the length (accumulation length) of substrate P accumulated by part BF2. In the operation shown in FIG. 5, it is assumed that the substrate P is always transported in the forward direction at the reference speed Vs in each of the processing apparatuses PR1, PR2, PR4, and PR5 other than the pattern forming apparatus 18. Further, the position in the width direction of the substrate P is corrected by the edge position controllers EPC1 to EPC4, and unless otherwise specified, the detection of the alignment microscope AM is continuously performed at a constant period. Further, in FIG. 6, the transport speed traveling in the forward direction is defined as positive, and the transport speed traveling in the direction opposite to the forward direction is defined as negative (−).

  First, in step S <b> 1, the transport unit 30 transports the substrate P in the forward direction at the reference speed Vs under the control of the host control device 16. Since the reference speed Vs is a speed detected by the alignment microscope AM by thinning out the alignment mark Ks, the alignment mark Ks is thinned and detected while the substrate P is being transported at the reference speed Vs. Even if the conveyance speed of the substrate P is the same, the number of alignment marks Ks to be thinned differs depending on the formation position interval of the alignment marks Ks along the longitudinal direction of the substrate P. For example, when the formation position interval along the longitudinal direction of the alignment mark Ks is long, the number of thinning out is small (including zero), and when the formation position interval along the longitudinal direction of the alignment mark Ks is short The number drawn is increased. Therefore, the reference speed Vs is determined according to the formation position interval of the alignment marks Ks formed along the longitudinal direction of the substrate P.

  In step S2, the host controller 16 recognizes the position at which the pattern is formed on the substrate P based on the position of the alignment mark Ks that has been thinned out and detected, and moves the exposure head 34 using the pattern data. A pattern is drawn and exposed on the substrate P under control. As a result, the spot light SP irradiated onto the substrate P from each drawing unit U (U1 to U5) of the exposure head 34 is two-dimensionally scanned, and the pattern for the electronic device is placed on the substrate P at a predetermined interval Ls (FIG. 7). Are formed sequentially with reference to each other. When the pattern data is corrected according to the transport state of the substrate P, the pattern is drawn and exposed using the corrected pattern data. The substrate P is transported in the forward direction at the reference speed Vs, and a pattern is formed by thinning and detecting a plurality of alignment marks Ks formed on the substrate P along the longitudinal direction (steps S1 to S2). Is equivalent to the first mode of the aspect of the present invention.

  When the transport unit 30 transports the substrate P at the reference speed Vs, the lengths (accumulation lengths) of the substrates P stored in the first storage unit BF1 and the second storage unit BF2 are Le0 and Le1, respectively. It remains. That is, since the substrate P is loaded into the first accumulation unit BF1 and the second accumulation unit BF2 at the reference speed Vs and unloaded at the reference speed Vs, the accumulation length does not vary. The accumulation length Le1 is longer than the accumulation length Le0, and the first accumulation unit BF1 and the second accumulation unit BF2 can accumulate the substrate P having a length at least equal to or greater than the accumulation length Le1. Therefore, when the substrate P is transported at the reference speed Vs, the first accumulation unit BF1 can newly accumulate the substrate P having a length equal to or longer than the predetermined margin length (Le1-Le0).

  Next, in step S3, the host controller 16 determines whether or not a predetermined condition is satisfied. When the exposure to the substrate P is performed for the first time, or when the formation accuracy of the pattern formed by the exposure is out of the allowable range, it is determined that the predetermined condition is satisfied. This is because when the exposure to the substrate P is performed for the first time, it is not known in what state the substrate P is conveyed to the rotary drum 36, and the pattern formation accuracy may be out of the allowable range. As a case where the pattern formation accuracy is out of the allowable range, there is a case where the tendency of the transport state (deformation, inclination, etc.) of the substrate P transported so far changes beyond the allowable range. That is, the pattern data has been corrected so that the pattern can be formed properly in the transport state of the substrate P that has been transported so far, but suddenly the tendency of the transport state (deformation, inclination, etc.) of the substrate P is allowed. This is because if it changes beyond the range, the pattern data used up to now cannot be properly exposed. Based on the position of the alignment mark Ks detected in step S2, the host controller 16 determines whether or not the tendency of the transport state of the substrate P has exceeded an allowable range. That is, when the position of the detected alignment mark Ks shows a tendency to change significantly beyond the allowable range from the position detected so far, it is determined that the tendency of the transport state of the substrate P has changed beyond the allowable range. .

  If it is determined in step S3 that the predetermined condition is not satisfied, the process stays in step S3 as it is. If it is determined that the predetermined condition is satisfied, the process proceeds to step S4. In step S4, the transport unit 30 moves the substrate P slower than the reference speed Vs as part of the correction preparation operation for returning the pattern data formation accuracy to within the allowable range under the control of the host controller 16. It is conveyed at low speed in the forward direction at 1 speed V1. That is, the transport unit 30 reduces the transport speed of the substrate P from the reference speed Vs to the first speed V1, and transports the substrate P at a low speed in the forward direction. The conveyance at the first speed V1 is performed for a predetermined time. Since the first speed V1 is a speed at which the alignment microscope AM can accurately detect the alignment mark Ks without thinning out the alignment mark Ks, the alignment mark Ks is detected while the substrate P is being transported at the first speed V1 or less. Accuracy is improved. The first speed V1 is determined according to the formation position interval along the longitudinal direction of the alignment mark Ks. The first speed V1 may be a speed that is detected by thinning out the alignment mark Ks. In short, the first speed V1 is to detect more alignment marks Ks than the reference speed Vs. Any speed can be used.

  As shown in FIG. 6, when the timing at which the predetermined condition is determined to be satisfied is T1, the transport speed starts to gradually decelerate from the timing T1, and the transport speed becomes the first speed V1 at the timing T2. The forward conveyance at the first speed V1 ends at a timing T3 after a predetermined time has elapsed from the timing T2. Therefore, the alignment mark Ks is precisely detected by the alignment microscope AM during the period from the timing T2 to T3 when the substrate P is transported at the first speed V1. As described above, since the alignment mark Ks is accurately detected, the host controller 16 determines the tendency of the transport state of the substrate P (for example, the rotating drum of the substrate P) based on the detected position of the alignment mark Ks. The inclination of the rotation axis 36 with respect to the rotation axis AX, the position of the substrate P in the width direction, the deformation of the substrate P, etc.) can be recognized accurately and precisely. Although the alignment mark Ks is detected by the alignment microscope AM during the period from the timing T1 to the timing T2, the transfer speed of the substrate P is not less than or equal to the first speed V1, and therefore the alignment mark Ks cannot be detected accurately. In other words, it may be detected by thinning out.

  Next, in step S5, the host controller 16 controls the exposure head 34 to temporarily stop pattern drawing exposure. That is, the host control device 16 temporarily stops pattern drawing exposure when a predetermined condition is satisfied. Thereby, the pattern formation by each drawing unit U (U1 to U5) of the exposure head 34 is temporarily stopped from the timing T1.

  Next, in step S6, the host controller 16 as a part of the correction preparation operation, based on the position of the alignment mark Ks (and the two-dimensional baseline length information) precisely detected by the alignment microscope AM, The pattern data (drawing data) is corrected. By correcting the pattern data, the pattern formation accuracy can be maintained within an allowable range. That is, in order to correct the pattern data with high accuracy, the transport speed of the substrate P is decreased from the reference speed Vs to the first speed V1 in step S4, and the position of the alignment mark Ks is detected by the alignment microscope AM (the captured image is captured). Accuracy of image quality processing, mark edge extraction, mark center point determination, etc.), that is, measurement accuracy of the alignment mark Ks is not lowered. In step S6, the pattern data may be corrected when the conveyance of the substrate P at the first speed V1 is completed (at the timing T3), and the substrate P is being conveyed at the first speed V1. The pattern data may be corrected at any time (period T2 to timing T3).

  Even in step S1, if the transport speed of the substrate P is set to the first speed V1, it is not necessary to change the transport speed during the transport of the substrate P, and the control is simplified, but the transport speed of the substrate P is set to the first speed V1. If the speed is set to 1 speed V1, the transport time of the substrate P also becomes longer, resulting in a longer manufacturing time of the electronic device, which is inefficient. Therefore, in the first embodiment, only when a predetermined condition is satisfied, the manufacturing speed of the electronic device is prevented from increasing by reducing the transport speed from the reference speed Vs to the first speed V1. ing. Before the predetermined condition is satisfied, the alignment mark Ks is detected mainly for recognizing the position where the pattern is to be formed on the substrate P. Therefore, accurate detection up to that point is not necessary. Accordingly, in step S1, the substrate P is transported at a reference speed Vs that is faster than the first speed V1.

  Next, when the transport of the substrate P at the first speed V <b> 1 is completed, the transport unit 30 performs the transport of the substrate P back according to the control of the host controller 16 in step S <b> 7. That is, the substrate P is transported in the reverse direction. The reason why the substrate P is transported back is that the pattern is not formed while the substrate P is transported at a low speed in the forward direction (transported at the first speed V1 or less), and the substrate P is transported in the forward direction as it is. Because it will end up. Accordingly, in step S7, the substrate P is returned and conveyed in order to form a pattern with respect to the substrate P that has been conveyed without being formed. Note that the detection of the alignment mark Ks by the alignment microscope AM may be interrupted during the return conveyance.

  As shown in FIG. 6, at the time when the forward conveyance of the substrate P at the first speed V1 is completed (at the timing T3), the conveyance speed of the substrate P starts to gradually decrease from the first speed V1, At timing T5, the transport speed of the substrate P becomes the third speed V3. Timing T4 is a timing at which the conveyance speed becomes 0 [m / sec]. That is, the transport speed in the forward direction of the substrate P starts to gradually decelerate from the timing T3 and becomes 0 at the timing T4. Thereafter, the substrate P begins to be transported in the reverse direction, and the transport speed gradually increases, and at the timing T5. The conveyance speed of the substrate P in the reverse direction is the third speed V3. The conveyance in the reverse direction (return conveyance) at the third speed V3 ends at a timing T6 after a predetermined time has elapsed from the timing T5. The deceleration (acceleration in the − direction) of the substrate P between the timing T3 and the timing T5 is constant.

  Next, when the return conveyance of the substrate P at the third speed V3 is completed, in step S8, the conveyance unit 30 performs high-speed conveyance of the substrate P at the second speed V2 that is faster than the reference speed Vs according to the control of the host controller 16. Let That is, the conveyance speed in the forward direction of the substrate P is increased from the third speed V3 to the second speed V2. Since the second speed V2 is faster than the reference speed Vs, the alignment mark Ks is thinned out and detected by the alignment microscope AM.

  As shown in FIG. 6, at the time when the return conveyance of the substrate P at the third speed V3 is completed (at the timing T6), the conveyance speed of the substrate P starts to gradually increase from the third speed V3, and the timing T9. Thus, the transport speed of the substrate P becomes the second speed V2. Timing T7 is timing when the conveyance speed becomes 0 [m / sec]. That is, the transport speed in the reverse direction of the substrate P starts to gradually decelerate from the timing T6 and becomes 0 at the timing T7. Thereafter, the substrate P starts to transport in the forward direction, and the transport speed gradually increases, and at the timing T9. The conveyance speed in the forward direction of the substrate P is the second speed V2. Timing T8 indicates the timing at which the transport speed of the substrate P in the forward direction becomes the reference speed Vs. In the first embodiment, since the positional information of the alignment mark Ks is not necessary during the period from the timing T3 to the timing T9, the detection of the alignment mark Ks by the alignment microscope AM is interrupted, and the forward direction of the substrate P The detection of the alignment mark Ks is resumed when the transport speed to the second speed V2 is reached. Further, the acceleration of the substrate P between the timing T6 and the timing T9 is constant.

  Here, the reason why the substrate P is transported in the forward direction at the second speed V2 faster than the reference speed Vs in step S8 will be described. As shown in FIG. 6, in the period (timing T1 to T8) in which the transport speed of the substrate P is equal to or less than the reference speed Vs, the accumulation length of the substrate P accumulated by the first accumulation unit BF1 is the accumulation length with time. The accumulation length of the substrate P accumulated by the second accumulation unit BF2 decreases from the accumulation length Le1. Specifically, during the low-speed transport of the substrate P in the forward direction (timing T1 to T4, timing T7 to T8), the substrate P is carried from the processing apparatus PR2 toward the first accumulation unit BF1 at the reference speed Vs. On the other hand, since the speed at which the substrate P is carried out from the first storage unit BF1 toward the processing apparatus PR3 is lower than the reference speed Vs, the storage length of the first storage unit BF1 gradually increases. When the substrate P is transported in the reverse direction (timing T4 to T7), the substrate P is carried from the processing apparatus PR2 toward the first accumulation unit BF1 at the reference speed Vs, and also from the processing apparatus PR3. Is carried into the first storage unit BF1 at the third speed V3, the storage length of the first storage unit BF1 increases abruptly as compared with the low-speed transport. Since the second storage unit BF2 is the reverse of the first storage unit BF1, during the low-speed transport of the substrate P, the storage length of the second storage unit BF2 gradually decreases, and the substrate P is transported in the reverse direction. Sometimes, the accumulation length of the second accumulation unit BF2 is drastically reduced as compared with the low-speed conveyance. Therefore, in the first embodiment, in order to return the accumulation length of the first accumulation unit BF1 and the second accumulation unit BF2 to the original state (Le0, Le1), after transporting the substrate P in the reverse direction, The substrate P is transported at a high speed in the forward direction at a second speed V2 that is faster than the reference speed Vs.

  Therefore, in the first accumulation unit BF1, the accumulation length of the substrate P accumulated at the timing T8 becomes the longest, and after the timing T8, the accumulation length of the first accumulation unit BF1 gradually decreases. On the other hand, in the second accumulation unit BF2, the accumulation length of the substrate P accumulated at the timing T8 becomes the shortest, and after the timing T8, the accumulation length of the second accumulation unit BF2 gradually increases. In the first embodiment, at the timing T8, the first speed V1, the third speed V3, the accumulation length of the first accumulation unit BF1 becomes Le1, and the accumulation length of the second accumulation unit BF2 becomes Le0. Timings T2 to T8 and the like are determined in advance.

  When the substrate P starts to be transported at the second speed V2, the host controller 16 controls the exposure head 34 and resumes pattern formation in step S9. That is, the host controller 16 recognizes the position where the pattern is formed on the substrate P based on the position of the alignment mark Ks detected by thinning out, and uses the pattern data corrected in step S6 to expose the exposure head. 34 is controlled to draw and expose a pattern on the substrate P. Since the pattern formation in step S9 uses corrected pattern data, the pattern formation accuracy (second accuracy) in step S9 is within an allowable range and the pattern formation accuracy in step S2 (first accuracy). 1 accuracy).

  The position where the formation of the pattern on the substrate P in step S9 is resumed is the position where the formation of the pattern on the substrate P in step S5 is temporarily stopped. That is, the drawing start position of the spot light SP irradiated on the substrate P from each drawing unit U in step S9 is the substrate of the spot light SP from each drawing unit U that is temporarily stopped by the temporary stop of pattern formation in step S5. This is the irradiation end position (drawing end position) for P. Therefore, drawing of the spot light SP can be started from the drawing end position of the spot light SP from each drawing unit U on the substrate P, and it is possible to prevent the exposure accuracy from being lowered. In order to keep the exposure accuracy constant, it is necessary that the transport speed of the substrate P be transported at a constant speed. Therefore, the pattern is formed until the transport speed of the substrate P reaches the second speed V2. Absent. After the substrate P is transported in the forward direction at a first speed V1 that is slower than the reference speed Vs, a plurality of alignment marks Ks are accurately detected, the substrate P is transported back in the reverse direction, and then the substrate The operation of transporting P in the forward direction at a second speed V2 that is faster than the reference speed Vs, detecting a plurality of alignment marks Ks by thinning out, and forming a pattern (operations in steps S4 to S9) is an aspect of the present invention. This corresponds to the second mode. The second mode is executed over the length of the substrate P corresponding to the accumulation length Le1 of the second accumulation unit BF2.

  Here, in order to start drawing of the spot light SP from the drawing end position of the spot light SP from each drawing unit U on the substrate P, the drawing end where the formation of the pattern on the substrate P is temporarily stopped in step S5. The position (end position of irradiation of the spot light SP on the substrate P) is on the −X direction side from the position on the substrate P where the spot light SP is irradiated by each drawing unit U of the exposure head 34 at the timing T9. There is a need. That is, the irradiation end position (drawing end position) on the substrate P of the spot light SP from each drawing unit U temporarily stopped by the temporary stop of pattern formation in step S5 is changed to the spot light by each drawing unit U of the exposure head 34. Before reaching the position on the substrate P where the SP is irradiated, the transport speed of the substrate P needs to be the second speed V2. Therefore, the length (return length) of the substrate P transported in the reverse direction during the period of the timings T4 to T7 is equal to the run-up length than the length of the substrate P transported in the forward direction during the period of the timings T1 to T4. This is ensured only by making it longer.

  Thereafter, in step S10, the host controller 16 determines whether or not the accumulation length of the first accumulation unit BF1 has reached a predetermined length. If it is determined in step S10 that the accumulation length of the first accumulation unit BF1 is not the predetermined length, the process stays in step S10 until the predetermined length is reached, and if it is determined that the predetermined length is reached, the process proceeds to step S11. move on. In step S11, the transport unit 30 transports the substrate P in the forward direction by returning the transport speed of the substrate P from the second speed V2 to the reference speed Vs according to the control of the host controller 16. More specifically, as shown in FIG. 6, at the timing T10 when it is determined that the length of the substrate P stored in the first storage unit BF1 has become a predetermined length, the transport speed of the substrate P gradually increases from the second speed V2. At time T11, the transport speed of the substrate P becomes the reference speed Vs. At this timing T11, the deceleration of the substrate P from the second speed V2 to the reference speed Vs is determined in advance so that the accumulation length of the first accumulation unit BF1 is Le0 and the accumulation length of the second accumulation unit BF2 is Le1. It has been. After the transport speed of the substrate P reaches the reference speed Vs, the process returns to step S1 again and the above operation is repeated. Even after timing T10, the alignment microscope AM (AM1 to AM3) detects by thinning out the alignment mark Ks.

  Here, whether or not the length of the substrate P stored in the first storage unit BF1 has reached a predetermined length may be determined based on whether or not a predetermined time has elapsed from the timing T9. . Since the length of the substrate P stored in the first storage unit BF1 before the timing T1 is Le0, the calculation is performed based on the relationship with the first to third speeds V1, V2, and V3 and the timings T2 to T9. This is because the predetermined time can be obtained in advance. Further, by providing a sensor for detecting the position of each dancer roller 20 in the first accumulation unit BF1, and by obtaining the accumulation length of the first accumulation unit BF1 based on the position of each dancer roller 20 detected by the sensor, It may be determined whether or not one storage unit BF1 has a predetermined length. In addition, a sensor that detects the speed of the substrate P carried into the first storage unit BF1 and the speed of the substrate P carried out of the first storage unit BF1 is provided, and the first is based on the speed difference detected by the sensor. It may be determined whether the first storage unit BF1 has reached a predetermined length by calculating the storage length of the storage unit BF1. In the first embodiment, it is determined whether or not the storage length of the first storage unit BF1 has become a predetermined length. However, has the storage length of the second storage unit BF2 become a predetermined length? You may decide whether.

  The pattern formation of the substrate P is performed not only while the substrate P is being transported at the second speed V2, but also after the return from the second speed V2 to the reference speed Vs. It is not preferable that the conveyance speed of the substrate P fluctuates during the formation of the pattern from the viewpoint of pattern formation accuracy. Therefore, the transport speed of the substrate P is reduced by reducing the transport speed during the period from the end of the pattern formation of the device formation area W by the exposure head 34 to the start of pattern formation in the next device formation area W. The speed may be gradually decreased from the second speed V2 to the reference speed Vs. If the distance Ls between the device formation region W and the device formation region W (see FIG. 7) is sufficiently long, the formation of the pattern of the device formation region W by the exposure head 34 is completed, and the next device formation region W is reached. In the period until the formation of the pattern starts, the conveyance speed may be decreased from the second speed V2 to the reference speed Vs all at once.

  FIG. 7 is a diagram showing a relative moving direction and moving range of the alignment microscope AM with respect to the substrate P transported by the operation shown in the time chart of FIG. An arrow A in FIG. 7 shows an example of the relative moving direction and moving range of the alignment microscope AM (AM1 to AM3) with respect to the substrate P when the substrate P is transported at low speed in the forward direction (timing T1 to T4). . The alignment marks Ks (Ks1 to Ks3) indicated by broken lines in FIG. 7 are examples of alignment marks Ks (Ks1 to Ks3) that are accurately detected by transporting the substrate P at the first speed V1. At this time, as shown in FIG. 7, it can be seen that the alignment marks Ks (Ks1 to Ks3) are detected without being thinned out. An arrow B in FIG. 7 indicates a relative moving direction and moving range of the alignment microscope AM (AM1 to AM3) with respect to the substrate P when the substrate P is transported in the reverse direction (timing T4 to T7). When the substrate P is transported in the direction opposite to the forward direction, the alignment mark Ks is not detected by the alignment microscope AM. An arrow C in FIG. 7 shows an example of the relative movement direction and movement range of the alignment microscope AM (AM1 to AM3) with respect to the substrate P when the substrate P is conveyed at high speed in the forward direction after the return conveyance (after timing T7). ing. Alignment marks Ks (Ks1 to Ks3) surrounded by a broken-line circle in FIG. 7 are thinned out (at intervals of every other one) by transporting the substrate P at the second speed V2, and are detected. An example of Ks1 to Ks3) is shown.

  As described above, in the first embodiment, the substrate P is transported in the forward direction at the first speed V1, thereby causing the alignment microscope AM to accurately detect the plurality of alignment marks Ks. Then, the substrate P is transported in the reverse direction, and then the substrate P is transported in the forward direction at the second speed V2 higher than the first speed V1, thereby causing the alignment microscope AM to detect a plurality of alignment marks Ks. Then, the exposure head 34 is caused to form a pattern. As a result, it becomes possible to continuously perform the formation of the pattern for the electronic device repeatedly formed on the substrate P in a state in which the pattern is maintained within a predetermined patterning accuracy range, and temporarily in the manufacturing line due to the deterioration in accuracy. Therefore, the manufacturing time of the electronic device can be shortened.

[Modification of First Embodiment]
The following modifications are possible for the first embodiment.

  (Modification 1) In Modification 1, the substrate P is transported at a low speed in the forward direction at the first speed V1, so that the alignment microscope AM accurately detects the alignment mark Ks (also at timings T2 to T3). ), A pattern is formed by the exposure head 34. At timings T2 to T3, the pattern data is sequentially corrected based on the position of the alignment mark Ks detected precisely, and a pattern is formed based on the corrected pattern data. In this case, not only during the transfer of the substrate P at the reference speed Vs, but also after the change from the reference speed Vs of the substrate P to the first speed V1, the pattern is continuously formed. However, it is not preferable that the conveyance speed of the substrate P fluctuates during pattern formation from the viewpoint of pattern formation accuracy. Therefore, the pattern formation is temporarily stopped during the period of the timings T1 to T2. For the area where the pattern could not be formed due to the temporary stop of the pattern formation, the pattern is formed when the substrate P is transported back and then transported in the forward direction at the second speed V2. Even in this case, it becomes possible to carry out the formation of the pattern for the electronic device repeatedly formed on the substrate P within a predetermined accuracy range, and the manufacturing time of the electronic device becomes long. Can be suppressed.

  (Modification 2) In Modification 2, even when the substrate P is transported in the direction opposite to the forward direction at the third speed V3 (at timings T5 to T6), the alignment mark Ks is detected by the alignment microscope AM. Further, a pattern may be formed by the exposure head 34. Even in this case, it becomes possible to carry out the formation of the pattern for the electronic device repeatedly formed on the substrate P within a predetermined accuracy range, and the manufacturing time of the electronic device becomes long. Can be suppressed. Even in reverse conveyance, a pattern is formed using pattern data corrected based on the position of the alignment mark Ks detected accurately.

  (Modification 3) In the first embodiment, when the substrate P is transported at the reference speed Vs, the length of the substrate P accumulated in the first accumulation unit BF1 is set to Le0, and the second accumulation is performed. Although the length of the substrate P accumulated in the part BF2 is Le1, an error may actually occur. Therefore, in Modification 3, when the substrate P is transported at the reference speed Vs, each processing apparatus is configured such that the accumulation length of the first accumulation unit BF1 is Le0 and the accumulation length of the second accumulation unit BF2 is Le1. You may adjust the relative speed of the board | substrate P in PR1-PR5. For example, when the accumulation length of the first accumulation unit BF1 is longer than Le0, the conveyance speed of the processing apparatuses PR3 to PR5 is set to the reference speed Vs, and the conveyance speed of the substrates P of the processing apparatuses PR1 and PR2 is slower than the reference speed Vs. Thus, the accumulation length of the first accumulation unit BF1 may be adjusted to be Le0. As described above, the accumulation lengths of the first accumulation unit BF1 and the second accumulation unit BF2 may be calculated based on the positions of the dancer rollers 20 and 22, or the first accumulation unit BF1 and the second accumulation unit BF2. Alternatively, the speed may be calculated based on the speed of the substrate P loaded into the first storage unit BF1 and the speed of the substrate P unloaded from the first storage unit BF1 and the second storage unit BF2.

  (Modification 4) In Modification 4, the transport speed of the substrate P at the timings T1 to T3 in FIG. 6 is set to the reference speed Vs. When the transport speed of the substrate P at the timings T1 to T3 is set to the reference speed Vs, thinning detection of the alignment mark Ks is performed by the alignment microscope AM at the timing T1 to timing T3. This is because the pattern data can be corrected. Therefore, also in the fourth modification, it is possible to carry out the formation of the pattern for the electronic device repeatedly formed on the substrate P in a state where the pattern is maintained within a predetermined accuracy range, and the manufacturing time of the electronic device becomes long. This can be suppressed. Further, since the substrate P is set to the reference speed Vs at the timings T1 to T4, the manufacturing time of the electronic device can be shortened as compared with the first embodiment.

  (Modification 5) In Modification 5, the relationship between the transport speed of the substrate P and the accumulable lengths of the first accumulation unit BF1 and the second accumulation unit BF2 will be described. In the fifth modification, the maximum accumulable length of the first accumulation unit BF1 and the second accumulation unit BF2 is Le1, and the transport speed in the forward direction of the substrate P is all the reference speed Vs. That is, the transport speed of the substrate P at the timings T1 to T3 and the timings T9 to T11 in FIG. 6 is the reference speed Vs. As described in the first embodiment, the accumulation length of the substrate P in the first accumulation unit BF1 is Le0 and the accumulation length of the substrate P in the second accumulation unit BF2 before the predetermined condition is satisfied. Is Le1.

Therefore, the accumulation condition of the first accumulation unit BF1 during the period ΔT (timing T4 to T7) in which the substrate P is transported in the direction opposite to the forward direction can be expressed by Equation (1), and the first condition during the period ΔT. The accumulation condition of the 2-accumulation unit BF2 can be expressed by Equation (2). In addition, in Formula (1) and Formula (2), it is not considered that the conveyance speed of the substrate P gradually changes from the reference speed Vs to the third speed V3 and from the third speed V3 to the reference speed Vs. That is, the transport speed of the substrate P at the timings T3 to T4 and the timings T7 to T9 is the reference speed Vs, and the transport speeds of the timings T4 to T5 and the timings T6 to T7 are the third speed V3.
(Le1-Le0)-(Vs + V3) ΔT> 0 (1)
Le1- (Vs + V3) ΔT> 0 (2)

Further, the length of the device formation region W in the X direction is set to LD (see FIG. 7), the interval Ls between the device formation regions W (see FIG. 7), and the device formation region to which the substrate P is to be returned by transport in the direction opposite to the forward direction When the number of W is n and the run-up length is Lu, the length Lr of the substrate P that is transported in the direction opposite to the forward direction can be expressed by Equation (3), and ΔT uses Lr. Can be expressed by Equation (4).
Lr = Lu + n (LD + Ls) (3)
ΔT = Lr / V3 (4)

Therefore, Formula (1) can be expressed by Formula (5) using Formula (3) and Formula (4).
(Le1-Le0)-(Vs / V3 + 1) Lr> 0
⇒ (Le1-Le0) − (Vs / V3 + 1) {Lu + n × (LD + Ls)}> 0 (5)

Moreover, Numerical formula (2) can be represented by Numerical formula (6) using Numerical formula (3) and Numerical formula (4).
Le1- (Vs / V3 + 1) Lr> 0
⇒Le1- (Vs / V3 + 1) {Lu + n × (LD + Ls)}> 0 (6)

  Therefore, Le1, Le0, Vs, V3, and Lr (Lu + n (LD + Ls)) may be determined so as to satisfy the relationship of Expression (5) and Expression (6).

  FIG. 8 is a graph showing an increase in the accumulation length of the first accumulation unit BF1 during return conveyance. Specifically, when the length LD in the X direction of the device formation region W and the speed ratio (Vs / V3) between the reference speed Vs and the third speed V3 are changed, the first accumulation unit BF1 during return conveyance is changed. The increase in accumulation length is shown. In FIG. 8, the interval Ls between the device formation regions W is 5 [cm], the number n of the device formation regions W that the substrate P is to be returned by transporting in the direction opposite to the forward direction is 2, and the run length Lu is 40 [ cm].

  At the time of return conveyance, the substrate P is loaded into the first storage unit BF1 at the reference speed Vs from the processing apparatus PR2, and the substrate P is loaded from the processing apparatus PR3 at the third speed V3. As the speed ratio (Vs / V3) increases, the amount of increase in the substrate P accumulated in the first accumulation unit BF1 during return conveyance increases. Further, as the length LD in the X direction of the device formation region W becomes longer, the length Lr of the substrate P that is transported in the reverse direction to the forward direction by the return transport also becomes longer. Therefore, as the length LD becomes longer, the return becomes longer. The increase amount of the substrate P accumulated in the first accumulation unit BF1 during conveyance is also increased. In FIG. 8, the case where the length LD is 20, 40, 60, 80, 100 [cm] is compared as an example. In addition, when the length LD is 20 [cm], the length Lr is 0.9 [m] based on Equation (3). Similarly, when the length LD is 40, 60, 80, 100 [cm], the length Lr is 1.3, 1.7, 2.1, 2.5 [m] from Equation (3). ]. Since the second storage unit BF2 can be said to be the reverse of the first storage unit BF1, as the speed ratio (Vs / V3) increases, the substrate P stored in the second storage unit BF2 during return transport The amount of reduction also increases. Further, as the length LD becomes longer, the amount of decrease in the substrate P accumulated in the second accumulation unit BF2 during return conveyance increases.

[Second Embodiment]
Next, a second embodiment will be described. FIG. 9 is a diagram showing the configuration of the pattern forming apparatus 18 in the second embodiment. In the second embodiment, the pattern forming device 18 includes a processing device PR3, a first storage unit BF1, and a second storage unit BF2, and further includes an alignment detection device AMD. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and in principle, only different parts from the first embodiment will be described. .

  The processing device PR3 is provided between the second storage unit BF2 and the processing device PR4, and the alignment detection device AMD is provided between the first storage unit BF1 and the second storage unit BF2. That is, the alignment detection device AMD detects the alignment mark Ks or the like of the substrate P supplied from the processing device PR2 via the first storage unit BF1, and then the substrate toward the processing device PR3 via the second storage unit BF2. Transport P. The processing apparatus PR3 forms a pattern on the substrate P while transporting the substrate P supplied from the alignment detection apparatus AMD via the second accumulation unit BF2 in the forward direction (+ X direction), and then processes the substrate P to the processing apparatus. Transport toward PR4.

  The alignment detection device AMD includes a transport unit 80 and alignment microscopes AMa, AMb, AMc, AMd, and AMe (hereinafter abbreviated as AMa to AMe) as detection units. The transport unit 80 transports the substrate P transported from the processing apparatus PR2 via the first accumulation unit BF1 to the processing apparatus PR3 side. The transport unit 80 includes, in order from the upstream side (−X direction side) along the forward transport direction of the substrate P, the edge position controller EPC5, the tension adjustment roller RT3, the rotating drum 82, the tension adjustment roller RT4, and the edge position controller EPC6. Have

  The edge position controller EPC5 transports the substrate P transported from the processing apparatus PR2 via the first accumulation unit BF1 toward the rotary drum 82. Note that the configuration and function of the edge position controller EPC5 are the same as those of the edge position controller EPC3 of the processing apparatus PR3, and thus description thereof is omitted. The rotating drum 82 has the same configuration as the rotating drum 36 of the processing apparatus PR3, and supports the area on the substrate P detected by the alignment microscopes AMa to AMe on the circumferential surface. The rotating drum 82 rotates around a rotation axis AX1 extending in the Y direction, thereby transporting the substrate P in the + X direction following the outer peripheral surface (circumferential surface) of the rotating drum 36, and an edge position controller. Send to EPC6 side. The rotary drum 82 (rotary shaft AX1) rotates when a rotational torque from a rotational drive source (not shown) is applied. The edge position controller EPC6 transports the substrate P transported from the rotary drum 82 toward the second accumulation unit BF2. Note that the configuration and function of the edge position controller EPC6 are the same as those of the edge position controller EPC4 of the processing apparatus PR3, and thus description thereof is omitted. The transport unit 80 according to the second embodiment can transport the substrate P in the forward direction (+ X direction) and the reverse direction (−X direction) similarly to the transport unit 30 according to the first embodiment. is there.

  Alignment microscopes AMa to AMe are provided in order from the upstream side (−X direction side) in the forward conveyance direction of the substrate P. The alignment microscope AMa (AMa1 to AMa3) has the same configuration and function as the alignment microscope AM (AM1 to AM3) of the processing apparatus PR3, and is an alignment mark Ks (Ks1 to Ks1) formed on the substrate P. Ks3) is detected. That is, the alignment microscope AMa1 detects the alignment mark Ks1 formed at the + Y direction end of the substrate P, and the alignment microscope AMa2 detects the alignment mark Ks2 formed at the −Y direction end of the substrate P. To detect. The alignment microscope AMa3 detects an alignment mark Ks3 formed at the center in the width direction of the substrate P. The installation position of the alignment microscope AMa with respect to the rotary drum 82 is the same position as the installation position of the processing apparatus PR3 with respect to the alignment drum AM of the rotation drum 36.

  The alignment microscopes AMb to AMe detect an object to be detected having a specific shape among the patterns formed on the substrate P. Examples of the object to be detected include a TFT constituting a display or a metallic wiring portion such as a source electrode and a drain electrode of the TFT. The TFT and the source electrode and drain electrode of the TFT are formed in a matrix shape innumerably in the device formation region W. Therefore, a plurality of alignment microscopes AMb to AMe are provided along the width direction (Y direction) of the substrate P, and the plurality of alignment microscopes AMb to AMe are arranged so as to detect different regions. . With these alignment microscopes AMb to AMe, it is possible to more accurately recognize the transport state and shape deformation of the device formation region W of the substrate P, the arrangement state of the formed TFT, etc. It is possible to further reduce an overlay error when a pattern is formed and superimposed. The alignment microscopes AMa to AMe detect the detection object by imaging the substrate P in the detection region at a constant cycle, similarly to the alignment microscope AM.

  Next, the operation of the alignment detection device AMD will be described with reference to the flowchart of FIG. 10. The transport operation of the substrate P by the transport unit 80 is performed by the transport unit 30 illustrated in FIG. 6 described in the first embodiment. Since it is the same as the operation, the transfer operation of the substrate P will not be described in detail. Further, since the transport operation is the same as the time chart shown in FIG. 6, the accumulation lengths of the first accumulation unit BF1 and the second accumulation unit BF2 are also the same as the time chart shown in FIG. Although not particularly described in the operation shown in the flowchart of FIG. 10, the edge position controllers EPC5 and EPC6 adjust the position in the width direction of the substrate P. Unless otherwise specified, the alignment microscopes AMa to AMe It is assumed that the detection is continuously performed at a constant cycle. In the second embodiment, the transport speed and transport direction of the substrate P change in the alignment detection device AMD, but the transport speed of the substrate P transported from the second accumulation unit BF2 to the processing device PR3 is It is constant at the reference speed Vs, and the transport direction is never reversed. Therefore, the exposure head 34 continuously forms a pattern sequentially based on the positions of the detected alignment marks Ks (Ks1 to Ks3).

  In step S <b> 21, the transport unit 80 transports the substrate P in the forward direction at the reference speed Vs under the control of the host control device 16. Since the reference speed Vs is a speed that the alignment microscopes AMa to AMe detect by detecting the object to be detected (alignment mark Ks, source electrode, drain electrode, etc.), while the substrate P is being transported at the reference speed Vs, The detected object is detected by being thinned out.

  Thereafter, in step S22, the host controller 16 determines whether or not a predetermined condition is satisfied. The host controller 16 determines that the predetermined condition is satisfied when the exposure to the substrate P is performed for the first time or when the formation accuracy of the pattern formed by the exposure is out of the allowable range. When it is determined in step S22 that the predetermined condition is satisfied, in step S23, the transport unit 80 moves the substrate P to a first speed slower than the reference speed Vs as part of the correction preparation operation according to the control of the host controller 16. V1 is transported at low speed in the forward direction. That is, the transport unit 80 reduces the transport speed of the substrate P from the reference speed Vs to the first speed V1, and transports the substrate P at a low speed in the forward direction. The conveyance at the first speed V1 is performed for a predetermined time.

  By transporting the substrate P at a low speed in the forward direction at the first speed V1, the detection target is accurately detected by the alignment microscopes AMa to AMe, and the detection accuracy is improved. The detection accuracy of the alignment microscopes AMa to AMe when the substrate P is transported in the forward direction at the first speed V1 is the detection accuracy of the alignment microscopes AMa to AMe when the substrate P is transported in the forward direction at the reference speed Vs. What is necessary is just to be higher than accuracy, and it is not limited to detecting without thinning out at all. For example, because TFTs have a high arrangement density, in order to detect all objects to be detected without thinning out, the transport speed of the substrate P must be extremely slow, which is inefficient.

  Next, in step S24, the host controller 16 corrects the pattern data (drawing data) based on the position of the detected object precisely detected by the alignment microscopes AMa to AMe as part of the correction preparation operation. By correcting the pattern data, the pattern formation accuracy can be maintained within an allowable range. In step S24, the pattern data may be corrected when the conveyance of the substrate P at the first speed V1 is completed, and the pattern data is stored as needed while the substrate P is being conveyed at the first speed V1. Correction (including correction of drawing timing) may also be performed. Note that the position on the substrate P where it is determined that the deformation tendency of the substrate P in the transport state has changed beyond the allowable range is the position where the pattern is formed by the exposure head 34 of the processing apparatus PR3 (irradiated with the spot light SP). The upper control device 16 controls the exposure head 34 using the corrected pattern data to form a pattern on the substrate P.

  When the transport of the substrate P at the first speed V1 is completed, the transport unit 80 transports the substrate P back in accordance with the control of the host controller 16 in step S25. Specifically, the transport unit 80 transports the substrate P in a direction opposite to the forward direction at a third speed V3 for a predetermined time. In this return conveyance, detection of the alignment mark Ks by the alignment microscopes AMa to AMe may be interrupted. Thereafter, when the return conveyance of the substrate P is completed, in step S26, the conveyance unit 80 conveys the substrate P at a high speed in the forward direction at a second speed V2 that is faster than the reference speed Vs according to the control of the host controller 16. Since the second speed V2 is faster than the reference speed Vs, the detected object is detected by being thinned out by the alignment microscopes AMa to AMe.

  Thereafter, in step S27, the host controller 16 determines whether or not the accumulation length of the first accumulation unit BF1 or the second accumulation unit BF2 has reached a predetermined length. If it is determined in step S27 that the accumulation length of the first accumulation unit BF1 or the second accumulation unit BF2 has reached a predetermined length, in step S28, the transfer unit 80 performs the substrate P according to the control of the host controller 16. The transport speed is returned from the second speed V2 to the reference speed Vs to transport the substrate P in the forward direction, and the process returns to step S21. Note that the alignment microscopes AMa to AMe also detect the object to be detected while thinning the substrate P while the transport speed of the substrate P changes from the second speed V2 to the reference speed Vs.

  As described above, in the second embodiment, the alignment detection device AMD is provided between the first accumulation unit BF1 and the second accumulation unit BF2, and the processing device PR3 is placed on the + X direction side from the second accumulation unit BF2. Therefore, the deformation tendency of the transport state of the substrate P can be recognized without interrupting the pattern formation of the exposure head 34 of the processing apparatus PR3. Therefore, it becomes possible to carry out the formation of the pattern for the electronic device repeatedly formed on the substrate P in a state in which the pattern is maintained within a predetermined accuracy range, and the electronic device due to the temporary stop of the production line due to the accuracy deterioration Prolonging the manufacturing time can be suppressed. In addition, since it is not necessary to interrupt pattern formation, the pattern formation accuracy can be improved.

[Modification of Second Embodiment]
The following modification is also possible for the second embodiment.

  (Modification 1) In the second embodiment, the substrate P is returned and transported in step S25. However, the return transport may not be performed. That is, when the low-speed conveyance of the substrate P in step S23 is completed, the operation of step S25 is skipped and the process proceeds to step S26, where the conveyance unit 80 accelerates the substrate P in the forward direction at the second speed V2 that is faster than the reference speed Vs. Transport. That is, when the transport of the substrate P at the first speed V1 elapses for a predetermined time, the transport speed of the substrate P is increased from the first speed V1 to the second speed V2, and the substrate P is transported at high speed in the forward direction.

  (Modification 2) As in Modification 3 of the first embodiment, when the substrate P is transported at the reference speed Vs, the accumulation length of the first accumulation unit BF1 is Le0, and the second accumulation unit BF2 The relative speed of the substrate P in each of the processing apparatuses PR1 to PR5 may be adjusted so that the accumulation length of becomes equal to Le1. For example, when the accumulation length of the first accumulation unit BF1 is longer than Le0, the conveyance speed of the alignment detection apparatus AMD and the processing apparatuses PR3 to PR5 is set to the reference speed Vs, and the conveyance speed of the substrate P of the processing apparatuses PR1 and PR2 is set to The accumulation length of the first accumulation unit BF1 may be adjusted to be Le0 by making it slower than the reference speed Vs.

  In the first and second embodiments and the modifications thereof, the pattern is formed using the processing apparatus PR3 which is an exposure apparatus. For example, the processing apparatus PR3 is a flat mask or a cylindrical mask. May be a proximity type or projection type exposure apparatus using an ink jet printer, and may be an ink jet printer that applies ink. In short, the processing apparatus PR3 may be a patterning apparatus that can position and form a pattern on the substrate P. The gravure printing machine using a printing plate cylinder on which the pattern is formed, An imprint transfer machine or the like formed by a pressing method may be used.

[Third Embodiment]
By using the processing apparatus (exposure apparatus) according to the first and second embodiments, various electronic devices such as a flexible display panel (for example, an organic EL display), a touch panel, and a color filter are placed on a long substrate P. It can be manufactured continuously. In the third embodiment, a manufacturing process for manufacturing a thin film transistor (TFT) which is a kind of an electronic device used for a display panel will be described as an example with reference to the flowchart of FIG. Note that FIG. 11 is a flowchart showing both the manufacturing process of the bottom gate (BG) type TFT and the manufacturing process of the top gate (TG) type TFT.

  First, the process device in the previous process activates the surface of the substrate P serving as the base of the display panel by irradiating any one of ultraviolet rays, atmospheric pressure plasma, electron beams, X-rays and the like (surface modification). Is performed (step S40). Then, the process apparatus (the processing apparatuses PR1, PR2, etc. in FIG. 1) uniformly or selectively coats the surface of the substrate P with the photosensitive functional liquid, and the substrate P is below the glass transition temperature. The photosensitive functional layer is formed through a drying furnace (step S41). As described above, the photosensitive functional layer includes a photosensitive silane coupling material, a photosensitive plating reducing material, and the like, which are properly used depending on the process. In the case of using a photolithography method in which a general photoresist layer is applied as the photosensitive functional layer and the resist layer (liquid repellency) is etched (etched) according to the pattern shape by development after exposure, In step S41, a photoresist is applied. In that case, before applying the photoresist, for example, a step of making the surface of the substrate P lyophilic or applying a plating reducing material in step S40 is required.

  The substrate P on which the photosensitive functional layer is formed is sent to an exposure apparatus (such as the processing apparatus PR3 in FIG. 2), and the gate electrode or source / drain electrode of the TFT and the wiring (bus line or the like) connected thereto. ) Is exposed (drawn) on the photosensitive functional layer, corresponding to the pattern shape for the first layer (step S42). In the case of a bottom gate (BG) type TFT, the pattern for the first layer is a gate electrode and a wiring connected thereto, and in the case of a top gate type TFT, the pattern for the first layer is a source / drain electrode and Wiring to be connected. At this time, when a plurality of alignment marks Ks (Ks1 to Ks3) are formed on the substrate P in advance, each position of the alignment mark Ks is detected by the alignment microscope AM of the exposure apparatus, and the detection result (position shift information). ), Pattern exposure is performed while correcting the exposure position. If the alignment mark Ks is not formed on the substrate P during the exposure of the first layer pattern, the alignment mark Ks is obtained when the exposure apparatus exposes (draws) the first layer pattern. The mark pattern may be exposed on the substrate P together with the pattern for the first layer, the alignment mark Ks may be formed on the substrate P, and used after the formation (exposure) of the pattern for the second layer.

  The substrate P thus exposed by the exposure apparatus is sent to a subsequent process apparatus and the next process is performed. Depending on the type of the photosensitive functional layer formed in step S41, steps S44A and S45A are performed. And any one of the steps S44B and S45B is performed. When a photoresist is used as the photosensitive functional layer, a resist layer development and cleaning process is performed before step S44A or step S44B.

  When a photosensitive silane coupling material whose lyophobic property is modified is used as the photosensitive functional layer, the portion corresponding to the gate electrode exposed to ultraviolet rays on the substrate P and the wiring connected thereto, Alternatively, the portion corresponding to the source / drain electrode and the wiring connected to the source / drain electrode is modified from the liquid repellency to the lyophilic property, and thus the process proceeds to step S44A. In step S44A, the process apparatus selectively coats (patterns) conductive ink on the lyophilic portion (exposed portion) to form a pattern (gate electrode and wiring or source / drain electrode). And wiring). The selective application of the conductive ink may be an ink jet method, gravure printing, offset printing, or the like. As the conductive ink, for example, an ink containing conductive nanoparticles such as silver or copper is used. The electrode and wiring pattern layer formed of this conductive ink is referred to as a first layer.

  Then, the process device in the post-process is applied to the substrate P in order to strengthen the electrical coupling between the nanoparticles contained in the conductive ink selectively applied to the substrate P and remove the solvent of the conductive ink. An annealing process and a drying process are performed (step S45A). As an annealing process for strengthening the electrical coupling between the nanoparticles, a method of irradiating the substrate P with high-intensity pulsed light from a strobe lamp may be employed.

  On the other hand, in the case where a photosensitive plating reducing material in which a plating reducing group is exposed in a portion subjected to ultraviolet rays as a photosensitive functional layer, it corresponds to the gate electrode exposed to ultraviolet rays on the substrate P and wiring connected thereto. Since the plating reducing group is exposed at the portion corresponding to the source / drain electrode and the wiring connected thereto, the process proceeds to step S44B. In step S44B, a post-process apparatus (such as the processing apparatus PR4 in FIG. 2) performs electroless plating on the substrate P. Specifically, the post-process apparatus immerses the substrate P in a plating solution containing palladium ions or the like for a certain period of time, and forms a pattern of palladium that serves as an electrode or wiring from a portion where the plating reducing group is exposed (exposed portion). ).

  In this plating process, a palladium pattern layer is used as a base, and a plating process using another metal (NiP, gold, copper, etc.) is performed thereon. This electrode and wiring pattern layer deposited by palladium is referred to as the first layer. This first layer includes the layer in the case where the plating process is further performed using the palladium pattern layer as a base. Then, the post-process apparatus cleans the substrate P subjected to the plating treatment with pure water, and then sends it to a drying furnace having a glass transition temperature or lower, so that the moisture content of the substrate P becomes a predetermined value or lower. (Step S45B).

  In addition, when a photoresist is used as the photosensitive functional layer, after development and washing, the conductive ink is selectively applied to a portion etched according to the pattern shape in the resist layer (a portion where the base is exposed). (Step S44A) or a plating layer (palladium or a metal layer thereon) is deposited (step S44B).

  After step S45A or step S45B, it is determined in step S46 whether or not it is a bottom gate (BG) type TFT. If it is a bottom gate type, the process proceeds to step S47A. If it is a top gate type, the process proceeds to step S47B. move on. Note that when the type of electronic device to be formed on the substrate P is determined, since the TFT is normally determined to be either a bottom gate type or a top gate type, step S46 is clearly indicated in the actual production line. However, for the sake of explanation, the determination in step S46 is provided here.

  If it is determined in step S46 that it is a bottom gate type TFT, it is determined whether or not the second layer is to be formed (step S47A). Immediately after the formation of the first pattern layer (here, the gate electrode and the wiring connected thereto), it is determined in step S47A that the second layer is formed. In the actual process, after the first layer is formed, the second layer forming process is naturally performed, and thus the determination process in step S47A is not necessary.

  When it is determined in step S47A that the second layer is to be formed, the insulating layer film forming apparatus, which is a process device in a subsequent process, uses the first layer pattern (gate electrode and wiring connected thereto) as a reference. By selectively applying (patterning) a solution (insulating solution) of the gate insulating layer to be laminated thereon, a pattern to be the gate insulating layer is formed (step S48A). In this gate insulating layer forming step, an insulating solution is selectively applied using a printing method using a plate, an ink jet method, or the like. In step S48A, after the solution is applied, the substrate P is dried at a temperature equal to or lower than the glass transition temperature. The solvent component is evaporated and cured. In the case of a bottom gate type TFT, the formed gate insulating layer is the second layer. When the gate insulating layer is applied to the entire surface of the substrate P, in addition to slit coating with a die coater and coating with a roll plate for microgravure printing, a solution serving as an insulating material is misted to form a surface of the substrate P. A mist deposition method of spraying on the surface, a method of spraying a solution to be an insulating material, and the like can also be used.

  Furthermore, in order to selectively form the gate insulating layer on the substrate P, a light-assisted patterning method using an exposure apparatus similar to the previous steps S41, S42, S44A, and S45A may be used. Patterning using an exposure apparatus has an advantage that a high-performance TFT can be manufactured because the formation position of the gate insulating layer of the TFT can be accurately set and the formation region can be miniaturized.

  The substrate P on which the pattern of the insulating layer as the second layer is formed in step S48A has the photosensitive functional layer on the entire surface of the substrate P or selectively so as to cover the second layer by the same process apparatus as in step S41. A film is formed. Then, the pattern for the third layer having a shape corresponding to the source electrode and drain electrode of the TFT and the wiring connected thereto is exposed (drawn) on the photosensitive functional layer by the exposure apparatus similar to step S42. At this time, the pattern for the third layer needs to be precisely aligned with the pattern (gate electrode and wiring) of the first layer. Therefore, the exposure position (drawing position) of the pattern by the exposure head is corrected to match the pattern of the first layer on the substrate P based on the position information of the alignment mark Ks detected by the alignment microscope AM or the like of the exposure apparatus. The pattern for the third layer is exposed. As a result, the pattern for the third layer (source electrode and drain electrode and wiring associated therewith) is precisely aligned with the pattern for the first layer (gate electrode and wiring associated therewith) formed on the underlying layer. Can be formed.

  Next, when a photosensitive silane coupling material is used as the photosensitive functional layer, the conductive ink is formed on the lyophilic portion (exposed portion) by a process apparatus similar to steps S44A and S45A. Is selectively applied to form a pattern (a source electrode and a drain electrode and wiring associated therewith), and then an annealing process and a drying process are performed. On the other hand, when a photosensitive reducing material is used as the photosensitive functional layer, palladium, NiP, gold or the like is formed on a portion where the plating reducing group is exposed (exposed portion) by a process apparatus similar to steps S44B and S45B. A pattern (source electrode and drain electrode and associated wiring) is deposited by (Au), and then a drying process is performed. In the case of the bottom gate type TFT, the pattern layer of the source electrode and the drain electrode and the accompanying wiring becomes the third layer.

  In the case of using a photoresist as the photosensitive functional layer when forming the pattern of the third layer, similarly to the above description, the portion etched according to the pattern shape of the third layer in the resist layer (the base is exposed). The conductive ink can be selectively applied (step S44A) or a plating layer (palladium or a metal layer thereon) can be deposited (step S44B).

  If it is determined in the next step S46 that it is a bottom gate (BG) TFT, it is determined in step S47A whether or not the second layer is to be formed. Here, since the second layer is also formed, the process proceeds to step S49A. In step S49A, a pattern that becomes a semiconductor layer of the TFT is formed between the channel lengths of the source electrode and the drain electrode by the semiconductor layer forming apparatus. This semiconductor layer is formed by a technique suitable for a semiconductor material (for example, an organic semiconductor, an oxide semiconductor, a carbon nanotube, etc.). This semiconductor layer forming step is performed, for example, by a method of selectively applying an ink of a semiconductor material using a printing method using a plate, an ink jet method, or the like.

  In addition, the local region including the channel length portion between the source electrode and the drain electrode is made lyophilic, and the other region is covered with an insulating film (such as a resist layer) having high liquid repellency, and the channel length portion. Alternatively, the semiconductor layer may be selectively formed using a mist deposition method in which a liquid mist containing a semiconductor material is sprayed on a local region including. As described above, since the semiconductor layer formation in step S49A is performed by a wet process, the semiconductor layer forming apparatus performs an annealing process (for example, for removing the solvent of the applied or formed semiconductor material solution or for aligning the semiconductor crystal). It also has a function of performing thermal annealing, light annealing, electromagnetic wave annealing, and the like. The semiconductor layer formed in this manner is the fourth layer in the case of a bottom gate type TFT.

  As described above, when the patterns of the first to fourth layers are stacked on the substrate P, a pixel driving element (backplane layer) that functions as a bottom gate type TFT is completed. In order to laminate the organic EL light emitting layer on the fourth layer, the substrate P is sent to the next manufacturing process (steps such as forming an insulating film on the entire surface of the substrate P and forming the light emitting layer).

  On the other hand, when a top gate TFT is manufactured by the manufacturing method of FIG. 11, the first layer pattern formed on the substrate P is a source / drain electrode and wirings connected thereto. The layer formation process is the same as the process of steps S40 to S42, S44A, and S45A in FIG. 11, or the process of steps S40 to S42, S44B, and S45B. In the case of the top gate type TFT, the process proceeds to step S47B in which it is determined whether or not the second layer is formed based on the determination in step S46. In the actual process, immediately after the pattern layer (here, the source / drain electrode and the wiring connected thereto), which is the first layer, is formed, the formation process of the second layer is naturally performed. This judgment is unnecessary.

  If it is determined in step S47B that the second layer is to be formed, the semiconductor layer forming apparatus similar to that in step S49A described above is arranged between the channel length of the source electrode and the drain electrode that are the patterns of the first layer. A pattern to be a semiconductor layer is formed (step S49B). As described in the previous step S49A, the semiconductor layer forming process is, for example, a method of selectively applying ink of a semiconductor material to a channel length portion using a printing method using a plate, an ink jet method, or the like. To be implemented. Alternatively, the local region including the channel length portion between the source electrode and the drain electrode is made lyophilic, and the other region is covered with an insulating film (such as a resist layer) having high liquid repellency, and the channel length portion It is carried out by a mist deposition method in which a liquid mist containing a semiconductor material is sprayed on a local region including Also in the formation of the semiconductor layer in step S49B, the semiconductor layer forming apparatus performs annealing treatment (for example, thermal annealing, optical annealing, electromagnetic wave annealing, etc.) for removing the solvent of the solution of the applied or formed semiconductor material and for aligning the semiconductor crystal. The function to perform. The semiconductor layer formed in this manner is the second layer in the case of a top gate TFT.

  When the semiconductor layer is formed, gate insulation to be stacked on the first layer pattern (source / drain electrodes, wiring thereof, and the like) using the same insulating layer deposition apparatus as in step S48A. The layer solution (insulating solution) is selectively applied (patterned) or applied over the entire surface to form a pattern to be a gate insulating layer (step S48B). Since the gate insulating layer is formed by a wet process in which an insulating solution is applied using a printing method using a plate, an ink jet method, or the like, even in step S48B, the temperature of the substrate P after the solution application is lower than the glass transition temperature. And drying to evaporate the solvent component and cure.

  In the case of a top gate type TFT, the formed gate insulating layer is the third layer. In addition, when apply | coating a gate insulating layer to the whole surface of the board | substrate P, the mist deposition method, the spray method, etc. can be utilized other than the slit coating by a die coater, the coating by the roll plate for micro gravure printing. Further, in the case where the gate insulating layer is selectively formed in the local region on the substrate P in accordance with the TFT formation region, a light-assisted patterning method using an exposure apparatus similar to the previous steps S41, S42, S44A, and S45A. May be used.

  When the gate insulating layer is formed in step S48B, film formation of the photosensitive functional layer in step S41 and pattern exposure in step S42 are performed again. Here, the exposure function irradiates the photosensitive functional layer of the substrate P with ultraviolet light having a pattern shape corresponding to the gate electrode of the top gate TFT and the wiring connected thereto. Thereafter, the pattern formation by the conductive ink described in the previous steps S44A and S45A or the pattern formation by plating deposition described in the previous steps S44B and S45B is performed, and the gate electrode and wirings connected thereto are formed. The In the case of a top gate type TFT, the gate electrode and the wiring connected thereto are the fourth layer.

  As described above, when the fourth layer is formed by the process of step S45A or step S45B and it is determined in step S47B after step S46 that the second layer has been formed, the top is formed by the laminated structure of the first layer to the fourth layer. A pixel driving element (backplane layer) functioning as a gate TFT is completed, and the substrate P is sent to the next manufacturing process for laminating a light emitting layer such as an organic EL display.

  As described above, in the TFT manufacturing process shown in FIG. 11, the exposure apparatus used for patterning is configured so as to allow the substrate P shown in FIG. 2 or FIG. The production line can be operated stably over a long period of time while keeping the overlapping accuracy of the patterns that influence the performance and quality within an allowable range.

[Fourth Embodiment]
The exposure apparatus (drawing apparatus) described in the first and second embodiments is a maskless exposure machine equipped with a spot scanning type drawing unit U as shown in FIG. It may be a maskless exposure machine that performs pattern drawing using a device (DMD). FIG. 12 shows a schematic configuration of a maskless exposure apparatus using a DMD. Illumination light in the ultraviolet wavelength region emitted from the light source unit 500 is reflected by the mirror 501 so that the entire micromirror region of the DMD 502 is uniform. Illuminate with high intensity. The deflection angle of each of the two-dimensionally arranged micromirrors of the DMD 502 can be switched by the control circuit 503. The switching of the deflection angle is performed according to pattern data (CAD data) generated based on the movement position of the substrate P in the X direction, the displacement in the Y direction, or expansion / contraction or deformation of the substrate P. Of the many micromirrors of the DMD 502, the reflected light from the micromirror that is switched to the pattern drawing state in synchronization with the feed position of the substrate P in the X direction is projected onto the substrate P through the projection lens 504, A pattern having a shape corresponding to the CAD data is exposed on the substrate P.

  The substrate P is supported along a flat support surface of a support table 506 disposed below the projection lens 504. A gas ejection layer is formed on the support surface of the support table 506 so that an air bearing layer is formed with a thickness of about several μm to several tens of μm between the support surface of the support table 506 and the back surface side of the substrate P. An air pad portion in which many fine holes are formed is provided. The air pad portion may be a porous ceramic material having air permeability. As a result, the substrate P is transported in the X direction, which is the longitudinal direction, in a state in which the substrate P is supported flat on the support surface (flat surface) of the support table 506 in a non-contact state or in a low friction state. In FIG. 12, an arrow ARf directed in the + X direction represents a transport direction in the forward direction of the substrate P during pattern exposure, and an arrow ARb directed in the −X direction represents a transport direction in the reverse direction of the substrate P. Represents.

  For example, the alignment marks Ks (Ks1 to Ks3) formed on the substrate P as shown in FIG. 7 are arranged on the upstream side of the projection lens 504 in the movement of the substrate P in the forward direction (arrow ARf). It is detected by one or both of AMf (AMf1 to AMf3) and an alignment microscope AMg (AMg1 to AMg3) arranged on the downstream side of the projection lens 504. Here, the XY coordinates of each detection center position of the alignment microscope AMf (AMf1 to AMf3), each detection center position of the alignment microscope AMg (AMg1 to AMg3), and the projection center position of the pattern light from the DMD 502 by the projection lens 504 It is assumed that the relative positional relationship (two-dimensional baseline length) in the system is accurately measured and calibrated in advance.

  In that case, while the substrate P is reversely moved at low speed as indicated by the arrow ARb, it is attached to the exposed (or unexposed) device formation region W on the substrate P by the downstream alignment microscope AMg (AMg1 to AMg3). Each position information of the plurality of alignment marks Ks (Ks1 to Ks3) is accurately remeasured by conveying in the reverse direction at a low speed as in step S4 in FIG. P local deformation and distortion, underlayer pattern deformation and distortion, etc.) are reconfirmed. When the patterning accuracy tends to deviate from the allowable range, the pattern drawing timing by the DMD 502 and the CAD data for drawing are corrected from the correction state so far to the optimum correction state.

  12, the upstream side alignment microscope AMf (AMf1 to AMf3) is used in the same manner as the alignment microscopes AM1 to AM3 shown in FIG. 2 or the alignment microscopes AMa to AMe shown in FIG. Further, as shown in FIG. 12, alignment microscopes AMf and AMg are arranged on the upstream side and the downstream side in the feeding direction (X direction) of the substrate P with the projection area of the pattern light from the DMD 502 by the projection lens 504 interposed therebetween. When the positions of the alignment marks Ks (Ks1 to Ks3) are sequentially measured, partial expansion and contraction and deformation of the substrate P including the exposure area can be measured in real time during the pattern exposure operation by the projection lens 504. As described above, the configuration in which the two alignment microscopes AMf and AMg are provided on the upstream side and the downstream side in the transport direction of the substrate P across the exposure position (exposure region) is the same as the exposure apparatus of FIGS. Is equally applicable.

[Modification of Fourth Embodiment]
The fourth embodiment may be modified as follows. FIG. 13 shows a modification applied to the exposure apparatus of FIG. 12, from the back side of the substrate P through a small opening 506a (diameter of about 5 mm) formed in a part of the support surface of the support table 506. An auxiliary illumination mechanism that projects illumination light having an alignment wavelength region toward the alignment microscope AMf (or AMg) is provided in the support table 506. The auxiliary illumination mechanism includes a lens system GC1 arranged to be parallel to the optical axis of the alignment microscope AMf (or AMg), a beam splitter BS for amplitude division or wavefront division (polarization separation), a lens system GC2, a reference It comprises light sources LD1, LD2 such as a reticle RT, an optical fiber FB, and an LED, and a light source lighting control circuit LEC.

  In FIG. 13, the lens system GC1 and the lens system GC2 constitute an imaging optical system that optically conjugates the surface of the substrate P (the upper surface on which the alignment mark Ks is formed) and the reference reticle RT, and the light source LD2 After the light from the reference mark (cross mark or the like) on the reference reticle RT illuminated with the light of the light passes through the lens system GC2 and is reflected by the beam splitter BS and passes through the lens system GC1, the transparent portion of the substrate P is Through the alignment microscope AMf (or AMg). At that time, an image (aerial image) of the reference mark of the reference reticle RT is formed on the surface of the substrate P, and the alignment microscope AMf (or AMg) can detect the image of the reference mark in the same manner as the alignment mark Ks. it can.

  The beam splitter BS is arranged near the pupil plane ep of the imaging optical system by the lens systems GC1 and GC2, and the light exit end FBo of the optical fiber FB is on the opposite side of the lens system GC1 across the beam splitter BS, It is arranged at a position corresponding to the pupil plane ep. Therefore, the light from the light source LD1 incident from the light incident end of the optical fiber FB and emitted from the light emitting end FBo irradiates the substrate P with Koehler illumination with a uniform illuminance distribution from the back surface side by the lens system GC1. The microscope AMf (or AMg) can detect the alignment mark Ks on the substrate P with transmitted illumination.

  Here, the base material of the reference reticle RT is, for example, a quartz plate elongated in the Y direction (width direction of the substrate P) in the support table 506, and three alignment microscopes AMf1 to AMf3 (or the same) arranged in the Y direction on the surface thereof. If a reference mark is provided in accordance with each arrangement of AMg1 to AMg3), the mutual positional relationship and relative positional error of the three alignment microscopes AMf1 to AMf3 (or AMg1 to AMg3) with the reference reticle RT as a reference. Precise measurement is possible. That is, it is possible to calibrate so that the overlay accuracy (patterning accuracy) does not deteriorate by sometimes measuring a change (drift or the like) of the attachment position of the alignment microscope AMf (or AMg) with time.

  For this reason, the light source lighting control circuit LEC is at a timing when the transparent portion where the alignment mark Ks or the underlying layer does not exist on the substrate P is directly under the alignment microscope AMf (or AMg) while the substrate P is being transported. The light source LD2 is turned on and the light source LD1 is turned off. In addition, the alignment microscope AMf (or AMg) usually detects the alignment mark Ks as a detected object or a specific pattern portion of the underlayer under epi-illumination, but depending on the material of the detected object, By detecting the alignment mark Ks or the specific pattern portion with transmitted illumination, the contrast of the captured image may be increased to improve the accuracy of position measurement. In that case, the light source lighting control circuit LEC turns on the light source LD1 and turns off the light source LD2. Of course, when the alignment mark Ks or the specific pattern portion of the underlayer is detected only by epi-illumination, the light source lighting control circuit LEC turns off both the light source LD1 and the light source LD2.

  Further, in the auxiliary illumination mechanism as shown in FIG. 13, the light source LD2 is switched to an ultraviolet light source that emits light in an ultraviolet wavelength region of, for example, a wavelength of 370 nm or less, and sharp pulse light with a very short emission time and a high emission peak intensity is generated. If generated, the image of the reference mark on the reference reticle RT can be back-exposed at an arbitrary timing on the photosensitive layer (the portion without the alignment mark Ks or the underlayer) coated on the surface of the substrate P. . Therefore, if the images of the reference marks (three places separated in the Y direction) on the reference reticle RT are sequentially exposed on the substrate P at regular intervals while the substrate P is fed in the X direction, By examining the arrangement state of the images, it is possible to grasp the position shift of the substrate P with respect to the support table 506, the inclination (meandering) in the XY plane, two-dimensional expansion and contraction, or speed fluctuation.

  Accordingly, in addition to the alignment marks Ks (Ks1 to Ks3) formed for each layer during the overlay exposure, the reference marks of the reference reticle RT transferred onto the substrate P by the auxiliary illumination mechanism during the exposure in the previous process. Are measured together with the alignment microscope AMf (or AMg), and the local deformation of the pattern of the underlayer on the substrate P and the change tendency in the longitudinal direction of the substrate can be predicted with higher accuracy.

DESCRIPTION OF SYMBOLS 10 ... Device manufacturing system 12 ... Substrate supply apparatus 14 ... Substrate collection | recovery apparatus 16 ... High-order control apparatus 18 ... Pattern formation apparatus 20, 22 ... Dancer roller 30, 80 ... Conveyance part 32 ... Light source device 34 ... Exposure head 36, 82 ... Rotation Drum 38 ... Light introducing optical system 500 ... Light source unit 501 ... Mirror 502 ... DMD
503 ... Control circuit 504 ... Projection lens 506 ... Support table 506a ... Aperture AM, AM1-AM3, AMa-AMe, AMa1-AMa3, AMf, AMf1-AMf3, AMg ... Alignment microscope BF1 ... First accumulator BF2 ... Second Accumulator BS ... Beam splitter ep ... Pupil planes EPC1 to EPC6 ... Edge position controller FB ... Optical fiber FBo ... Light exit end FR1 ... Supply roll FR2 ... Collection roll GC1, GC2 ... Lens system Ks, Ks1-Ks3 ... Alignment mark L , L1 to L5: scanning lines LD1, LD2 ... light source LEC ... light source lighting control circuit P ... substrate PR1-PR5 ... processing device RT ... reference reticle SP ... spot light U, U1-U5 ... drawing unit Vs ... reference speed V1 ... first 1st speed V2 ... 2nd speed V3 ... 3rd speed

Claims (8)

A pattern forming apparatus for forming a pattern for an electronic device on a sheet substrate while conveying a long flexible sheet substrate in a forward direction along the longitudinal direction,
A transport unit capable of transporting the sheet substrate in the forward direction or the reverse direction along the longitudinal direction;
A detection unit for detecting a plurality of detected objects formed along the longitudinal direction on the sheet substrate;
A pattern forming portion for sequentially forming the pattern in each of a plurality of device forming regions arranged at predetermined intervals on the sheet substrate along the longitudinal direction;
In a state where the sheet substrate is conveyed at the first speed in the forward direction, the detection unit detects a plurality of the detection objects, and then conveys the sheet substrate in the reverse direction. A control unit that causes the detection unit to thin out and detect a plurality of the objects to be detected in a state of being conveyed in the forward direction at a second speed higher than the first speed;
A pattern forming apparatus. The pattern forming apparatus according to claim 1,
The transport unit transports the sheet substrate in the forward direction at a reference speed that is faster than the first speed and slower than the second speed, and the control unit is configured to transfer the sheet when a predetermined condition is satisfied. A pattern forming apparatus that controls the transport unit so that the substrate is transported in the forward direction at the first speed, then transported in the reverse direction, and then transported in the forward direction at the second speed. The pattern forming apparatus according to claim 2,
The control unit has a tendency that the sheet substrate conveyance accuracy exceeds an allowable range based on a detection result of the detected object by the detection unit, or the pattern formation accuracy by the pattern forming unit is an allowable range. A pattern forming apparatus that determines that the predetermined condition is satisfied when the tendency is not met. The pattern forming apparatus according to claim 2 or 3,
The transport unit is
A first accumulator provided on the upstream side of the pattern forming unit with respect to the forward direction and capable of accumulating the sheet substrate over a predetermined length;
A second accumulator provided on the downstream side of the pattern forming unit with respect to the forward direction and capable of accumulating the sheet substrate over a predetermined length;
With
When the length of the sheet substrate accumulated in the first accumulation unit or the second accumulation unit reaches a predetermined length, the control unit changes the conveyance speed of the sheet substrate from the second speed. A pattern forming apparatus that controls to return to the reference speed and convey the sheet substrate in the forward direction. The pattern forming apparatus according to claim 4,
The control unit transports the sheet substrate during a period from the end of the formation of the pattern in the device formation region by the pattern formation unit to the start of the formation of the pattern in the next device formation region. A pattern forming apparatus that controls the transport unit so as to decrease the speed stepwise from the second speed to the reference speed. The pattern forming apparatus according to any one of claims 2 to 5,
When the sheet substrate is transported in the forward direction by the transport unit at a speed equal to or higher than the second speed or the reference speed, the pattern forming unit sequentially fills each of the plurality of device formation regions with the pattern Forming a pattern forming apparatus. It is a pattern formation apparatus of any one of Claims 1-5,
The pattern forming unit sequentially forms the pattern in each of the plurality of device formation regions when the sheet substrate is conveyed in the forward direction at a speed equal to or higher than the first speed by the conveyance unit. Pattern forming device. The pattern forming apparatus according to claim 2 or 3,
The transport unit is
A first accumulator provided on the upstream side of the pattern forming unit with respect to the forward direction and capable of accumulating the sheet substrate over a predetermined length;
A second storage unit provided upstream of the pattern forming unit and downstream of the first storage unit and capable of storing the sheet substrate over a predetermined length with respect to the forward direction; ,
With
When the length of the sheet substrate accumulated in the first accumulation unit or the second accumulation unit reaches a predetermined length, the control unit changes the conveyance speed of the sheet substrate from the second speed. A pattern forming apparatus that controls the transport unit so that the sheet substrate is transported in the forward direction by returning to the reference speed.

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