JP6400318B2 - Chip component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a chip component and a manufacturing method thereof, and more particularly to a chip component having a highly reliable soldered electrode portion without performing electroplating or the like and a manufacturing method thereof.

  In recent years, printed circuit boards, wafers, flexible boards, and the like (hereinafter, these are sometimes referred to as “mounting boards”) have increased in wiring density and mounting density. The mounting board has many electrodes for soldering electronic components. Solder such as solder bumps or solder paste (hereinafter also referred to as “connection solder”) for soldering the electronic component is provided on the electrode, and the electronic component is soldered to the connection solder and mounted on the mounting board. To be implemented.

  The electronic parts mounted on the mounting board are soldered to the electrode parts in order to facilitate mounting on the electrode pattern of the mounting board. For example, in the case of a multilayer ceramic capacitor, a paste for external electrodes is printed or transferred to the multilayer dielectric element body, and then fired to form a pair of external electrodes. Thereafter, solder plating is provided on the surface of the external electrode by electroplating.

  However, since the method of forming the external electrode of the multilayer ceramic capacitor has undergone the steps of paste, firing, and electroplating, further man-hour reduction and improved reliability are trained.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a chip component capable of performing low-cost, high-yield, high-reliability soldering, and a manufacturing method thereof. There is to do.

  In order to solve the above-described problems, a chip component manufacturing method according to the present invention includes a solder ball prepared in advance and an electrode portion of the chip component in a temperature atmosphere in which the solder ball can be soldered to the electrode portion of the chip component. It is characterized by pressing with.

  According to the present invention, the molten solder ball is soldered to the electrode portion with a uniform thickness. As a result, it is possible to perform soldering with low cost, high yield, and high reliability.

  In the chip component manufacturing method according to the present invention, the pressing may be performed in a recess that is slightly larger than the electrode portion of the chip component, and the solder ball may be placed in advance in the bottom of the recess.

  In the method of manufacturing a chip component according to the present invention, it is preferable that the solder balls are pre-purified with an organic fatty acid solution before the pressing, and the electrode part of the chip component is also the organic fatty acid solution. It is preferable that the solder ball is a solder material containing nickel.

  A chip component according to the present invention for solving the above-mentioned problems is manufactured by the chip component manufacturing method according to the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the chip component which can perform soldering with low cost, a high yield, and high reliability, and its manufacturing method can be provided.

It is a schematic diagram which shows an example of the manufacturing method of the chip component which concerns on this invention. It is a schematic diagram which shows another example of the manufacturing method of the chip component which concerns on this invention. It is a schematic diagram which shows a clipper plate and a chip component. It is a schematic diagram which shows the form which mounted | wore the chip | tip component to the clipper plate. It is a schematic diagram which shows the manufactured chip component.

  Hereinafter, a chip component and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

[Chip parts manufacturing method]
As shown in FIGS. 1 and 2, the chip component manufacturing method according to the present invention uses a solder ball 31a prepared in advance and the electrode portion 21 of the chip component 20 as an electrode portion of the chip component 20 using the solder ball 31a. 21 is characterized by being pressed in a temperature atmosphere that can be soldered. By such a method, the molten solder ball 31a is soldered to the electrode portion 21 with a uniform thickness. As a result, it is possible to perform soldering with low cost, high yield, and high reliability.

  The solder ball 31a is placed on the plate 11 as shown in FIG. Each solder ball 31a is partitioned by a plate 12 having recesses 13 formed in the same pattern as an array of chip parts to be pressed thereafter.

  As shown in FIG. 1A, the chip component 20 is inserted and mounted in a hole 23 of a plate (referred to as a clipper plate 22) on which the chip component is mounted. The clipper plate 22 is formed in such a size that only the electrode portions 21 and 21 protrude from both surfaces of the clipper plate 22 when the chip component 20 is mounted.

  In the state shown in FIG. 1A, a temperature atmosphere is set in which solder balls 31a can be soldered to the electrode portions 21 of the chip component 20. The temperature varies depending on the type of the solder ball 31a, but is about 250 ° C. Under the temperature atmosphere, as shown in FIG. 1B, the solder balls 31a and the electrode portions 21 of the chip component 20 are pressed against each other. Due to this pressing, the solder balls 31a wrap around the electrode portion 21 well and uniformly. As shown in FIG. 1B, the pressing is performed in the recess 13 that is slightly larger than the electrode portion 21 of the chip component 20, and a solder ball 31 a is placed in advance in the bottom of the recess 13.

  The size (volume) of the ball 31a may be an amount that allows the solder to wrap around the electrode portion 21 and uniformly wrap around. Therefore, when the area of the electrode portion 21 is large, a slightly larger solder ball 31a is applied, and when it is desired to increase the solder thickness of the electrode portion 21, a slightly larger solder ball 31a is applied. That is, when the size of the electrode portion 21 and the solder thickness are designed, the solder ball 31a necessary for the electrode portion 21 may be selected, and the process design is extremely simple.

  Although the environment at the time of pressing should just be said temperature atmosphere, Preferably it is the state immersed in the organic fatty acid solution. Heating in a solution has an advantage that heat conduction is good and a medium amount is smaller than heating in a gas (including air). Moreover, if it carries out in an organic fatty acid solution, it will not oxidize. Furthermore, the organic fatty acid solution is more preferable because it also has a role of taking in and generating impurities and oxides attached to the solder balls 31a and the electrode part 21.

  In the example of FIG. 1, one electrode portion 21 of the chip component 20 is soldered, but the other electrode portion 21 may be soldered in the same manner.

  FIG. 2 shows a modified form of the plate 11 on which the solder balls 31a are placed. The plate 11 is provided with a recess 14 into which the solder ball 31a is inserted. The solder ball 31a is positioned in the recess 14. As a result, there is an advantage that the solder balls 31a can easily flow to the electrode portion 21 at the time of pressing. The plate 11 can be changed to such various forms.

  In FIGS. 1 and 2, the plate 12 having the recess 13 preferably has a tapered inner peripheral surface of the recess. As a result, it is easy to insert the electrode portion 21 and soldering is facilitated.

  FIG. 3 shows an example (A) of the clipper plate 22 and an example of the chip component 20. FIG. 4 shows an example in which the chip component 20 is mounted on the clipper plate 22. Since many chip components can be mounted by the clipper plate 22, the chip component 20 can be soldered efficiently.

  FIG. 5 shows a manufactured chip component. As shown in FIG. 5 (B), an electrode corrosion prevention layer (CuNiSn compound layer) 4 is formed on the electrode portions 2 provided on both sides of the chip component body 1. Further, a solder layer 5 is provided thereon, and a coating layer 6 of an organic fatty acid solution is further provided thereon.

  In the present invention, it is preferable that the solder ball 31a is purified in advance with an organic fatty acid solution before pressing. The organic fatty acid solution is preferably a solution containing an organic fatty acid having 12 to 20 carbon atoms. As a typical example, palmitic acid having 16 carbon atoms is preferable. As the organic fatty acid, it is particularly preferable to use only palmitic acid having 16 carbon atoms, and an organic fatty acid having 12 to 20 carbon atoms, such as stearic acid having 18 carbon atoms, may be included as necessary. The organic fatty acid-containing solution preferably contains 5% by mass or more and 25% by mass or less of organic fatty acid, and the balance is composed of ester synthetic oil. By using such an organic fatty acid-containing solution, the organic fatty acid-containing solution can selectively take in impurities such as oxides and flux components present on the surface of the electrode and clean the surface of the electrode.

  The chip component 20 can typically be a chip capacitor, but may be other semiconductor chips, chip resistors, chip coils, or the like.

  As the solder constituting the solder ball 31a, a molten lead-free solder containing tin as a main component and at least nickel as a subcomponent is preferably used. A low melting point molten solder containing at least nickel as an auxiliary component in a tin bismuth solder is also preferably used. Such molten lead-free solder may further optionally contain one or more selected from copper, germanium and phosphorus as subcomponents. Further, although silver may be further included, according to the present invention, it is possible to perform uniform soldering without including expensive silver, which is generally said to improve wettability. There is. As described above, a molten solder having a composition corresponding to the electrode component is arbitrarily selected and applied to an electrode other than a copper electrode or a copper alloy electrode.

  As the solder, for example, SnNi solder, SnCuNi solder, SnGeNi solder, SnPNi solder, SnCuGeNi solder, SnCuGePNi solder, SnAgCuNi solder, SnZnAlNi solder, SnAgCuGeNi solder, SnSbNi solder, etc. are used. Can do. Further, examples of the low melting point solder include SnBiNi solder, SnBiZnNi solder, SnBiAgInNi solder, and the like.

DESCRIPTION OF SYMBOLS 1 Base material 2 Electrode 4 Electrode corrosion prevention layer (CuNiSn compound layer)
5 Solder Layer 6 Coating Film 11 Plate 12 Plate 13 Recess 14 Recess 20 Chip Part 21 Electrode 22 Clipper Plate 23 Hole 31a Solder Ball

Claims (6)

A method of manufacturing a chip component having an electrode part,
(A) A plurality of the chip components are respectively inserted into the plurality of holes and attached to the first plate having a plurality of holes formed with a dimension in which only the electrode portions of the chip components are exposed,
(B) On the other hand, in the concave portion of the second plate formed by a plurality of concave portions that are slightly larger than the electrode portions in the same pattern as the arrangement of the plurality of chip components mounted on the first plate, Arrange the solder balls prepared in advance,
(C) In a temperature atmosphere in which the electrode parts of the chip components mounted on the first plate can be soldered to the electrode parts of the chip parts with the solder balls in the corresponding recesses of the second plate, respectively. A method of manufacturing a chip part, characterized by being pressed with. The manufacturing method of the chip component of Claim 1 with which the internal peripheral surface of the said recessed part is a taper .   The method of manufacturing a chip part according to claim 1 or 2, wherein the solder ball is purified in advance with an organic fatty acid solution before the pressing.   The manufacturing method of the chip component of any one of Claims 1-3 by which the electrode part of the said chip component is processed with the organic fatty acid solution previously before the said pressing.   The manufacturing method of the chip component of any one of Claims 1-4 whose said solder ball is a solder material containing nickel. Manufactured by the manufacturing method of the chip component according to claim 1 comprising, a chip component, characterized in that.

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