JP6385971B2 - Electronic device substrate - Google Patents

Description

  The present invention relates to an electronic element substrate that has an electronic element formed on its surface and serves as a component of an electronic device, and in particular, peeling in which useful information is written in the form of, for example, a two-dimensional barcode. The present invention relates to an electronic device substrate having a metal layer that is difficult to be formed.

  Patent Document 1 below discloses an invention of a projected capacitive touch panel. According to this invention, the column electrode extending in the first direction and the column electrode extending in the second direction, which is a direction intersecting the first direction, are formed on one surface of one transparent substrate. Yes. In the periphery of the transparent substrate, a black mask portion made of a material having a shielding property covers the electrode wiring formed on the periphery of the transparent substrate and the signal processing connection portion from the viewing side. Is provided. According to the present invention, it is possible to reduce the manufacturing cost while ensuring or further improving the design.

JP 2011-90443 A

  The inventors of the present application have conducted intensive research and development on a touch panel having a basic structure as disclosed in Patent Document 1. In this touch panel, one of the main components is an insulating substrate on which various electronic elements including fine wirings are formed. And for this substrate, from the necessity for manufacturing management to be described later, there is a demand for a technique for providing a metal layer on a portion other than the electronic elements on the surface and writing information using a laser printing device. The inventors have already developed such a technique. Since the insulating substrate is manufactured by cutting out from a large material glass plate, lot information of the material glass plate may be recorded for each substrate for product management during the manufacturing process or after completion. Therefore, a technique for directly writing information for each substrate is required. Such information is formed in the metal layer in the form of a two-dimensional barcode, for example. For example, if it is a material glass plate managed as one lot with several tens of sheets, the lot number of the material glass plate from which the specific substrate is cut out, and the corresponding material glass plate in the lot from which the specific substrate is cut out And the cut-out position in the material glass plate of the number from which the specific substrate was cut out are written as lot information on the metal layer in the form of the two-dimensional barcode.

  7 and 8 are cross-sectional views of an electronic device substrate that functions as a touch panel developed by the inventors of the present application. According to the electronic device substrate, lot management or the like is performed on the surface of the insulating substrate 100. A two-dimensional barcode used for this purpose is written. That is, an ITO (Indium Tin Oxide) layer 101 is formed on the surface of the insulating substrate 100, and a MAM (Molybdenum Aluminum Molybdenum) layer 102 is formed thereon. Note that the ITO layer 101 is provided under the MAM layer 102 because, when soda glass is employed as the insulating substrate 100, the alkaline component in the substrate 100 affects the MAM layer 102 at high temperature and high humidity. This is to block this. The MAM layer 102 formed on the ITO layer 101 is used as a base, and a two-dimensional barcode is formed using a laser printing apparatus.

  As shown in FIG. 7, when the overcoat layer 103 is formed so as to cover the ITO layer 101 and the MAM layer 102 during printing, the overcoat layer 103 absorbs energy and reaches the MAM layer 102. It can be considered that a normal two-dimensional barcode cannot be formed due to weakness of the laser and variation in energy depending on the position.

  Therefore, the inventors of the present application form an overcoat layer 103 avoiding the ITO layer 101 and the MAM layer 102 as shown in FIG. 8, and directly irradiating the MAM layer 102 with a laser to generate a two-dimensional barcode. Developed a writing method.

However, the electronic device substrate shown in FIGS. 7 and 8 developed by the inventors of the present application has the following problems.
First, the internal stress directions of the MAM layer and the ITO layer are opposite to each other. That is, since tensile stress acts in the MAM layer and compressive stress acts in the ITO layer, the mutual adhesion is not so high when both layers are stacked. For this reason, when a two-dimensional barcode is printed on the MAM layer with a laser printing device, the MAM layer may be peeled off from the ITO layer during printing due to the impact, or may be peeled off after the printing is finished. . In addition, if the MAM layer floats from the surface of the ITO layer or the substrate due to poor adhesion, the laser irradiated to the MAM layer spreads to a large range without concentrating on a minute range, so that the energy is reduced. Even if printing is performed, the processing state is incomplete and reading may be impossible even when printing is performed. Furthermore, as described above, since the substrate is cut out from a large-sized material glass plate and used, fine glass debris may adhere to the surface of the substrate, and it may be generated by workers involved in the process. Since dust is also considered, it is necessary to clean the surface of the substrate with an adhesive roller in a later process, but the MAM layer may be peeled off at that time, and there is a problem that sufficient cleaning may not be performed. It was.

  The present invention has been made to solve the above-described problems of the prior art, and in an electronic device substrate, a metal layer having information written on the surface of the substrate is formed with sufficient strength. It is aimed.

The substrate for electronic devices according to claim 1 is:
An insulating substrate on which electronic elements are formed, and
A first metal layer deposited on the surface of the substrate and written with information;
A substrate for electronic devices you equipped with,
The first metal layer is characterized in that only the at least a portion of said information written excluding areas peripheral edges are we covered with a coating material.

The substrate for electronic devices described in claim 2 is :
An insulating substrate on which electronic elements are formed, and
A first metal layer deposited on the surface of the substrate and written with information;
An electronic device substrate comprising:
The first metal layer is covered with a second metal layer having a larger adhesion force to the substrate than the adhesion force of the first metal layer to the substrate.

Electronic device substrate according to claim 3, in the substrate for an electronic device according to claim 2,
It is characterized in that at least a part of the peripheral edge of the second metal layer is covered with a coating material.

According to the electronic device substrate described in claim 1, the first metal layer is directly formed on the surface of the insulating substrate other than the region where the electronic device is formed, without an intermediate layer. The first metal layer is written with useful information. For this reason, since the first metal layer in which information is written does not peel off from the surface of the substrate even after various processes, for example, lot information of an insulating substrate is written in the first metal layer. If so, the same information can be referred to at any time for product management during the manufacturing process or after completion of the electronic element substrate, which is extremely useful for industrial production. Then, the first metal layer, since the information is written excluding region peripheral edge, i.e. only the least part of the starting point will be part of the peeling are held down and covered with a coating material, coating material The first metal layer is more difficult to peel off from the substrate than in the case where there is no substrate.

  According to the electronic device substrate according to claim 3, the first metal layer in which information is written has the second metal layer having an adhesion force larger than the adhesion force of the first metal layer to the substrate. Therefore, the first metal layer is more difficult to peel off from the substrate as compared with the case where there is no second metal layer.

  According to the electronic device substrate according to claim 4, the first metal layer is covered with the second metal layer so that the first metal layer is not easily peeled off. By covering the peripheral edge portion that can be a starting point when the metal layer is peeled off with the coating material, the first metal layer is further hardly peeled off from the substrate.

It is the top view which looked at the board | substrate as a touchscreen which concerns on 1st Embodiment of this invention from the back surface side. It is sectional drawing at the time of cut | disconnecting the vicinity of a 1st metal layer with the cut surface perpendicular | vertical to a board | substrate in the board | substrate as a touchscreen which concerns on 1st Embodiment of this invention. It is a flowchart which shows the manufacturing process of the board | substrate as a touchscreen which concerns on 1st Embodiment of this invention. It is sectional drawing at the time of cut | disconnecting the vicinity of a 1st metal layer with the cut surface perpendicular | vertical to a board | substrate in the board | substrate as a touchscreen which concerns on 2nd Embodiment of this invention. It is the top view which expanded and showed the vicinity of the 1st metal layer in the board | substrate as a touchscreen which concerns on 2nd Embodiment of this invention. It is sectional drawing at the time of cut | disconnecting the vicinity of a 1st metal layer with the cut surface perpendicular | vertical to a board | substrate in the board | substrate as a touchscreen which concerns on 3rd Embodiment of this invention. It is sectional drawing at the time of cut | disconnecting the vicinity of the 1st and 2nd metal layer by the cut surface perpendicular | vertical to a board | substrate in the board | substrate as a touchscreen which concerns on 1st prior invention which this inventor invented this invention invented before this invention. It is sectional drawing at the time of cut | disconnecting the vicinity of the 1st and 2nd metal layer by the cut surface perpendicular | vertical to a board | substrate in the board | substrate as a touchscreen which concerns on 2nd prior invention which this inventor invented this invention invented before this invention.

  An embodiment of the present invention will be described with reference to FIGS. These embodiments relate to an electronic element substrate (hereinafter simply referred to as a substrate) that is a main component of a touch panel used for various applications as an electronic device, and particularly, such as lot information of a material glass substrate. Information useful in manufacturing processes and the like relates to a substrate having a metal layer written in the form of a two-dimensional barcode.

The first embodiment will be described with reference to FIGS.
The substrate 11 of the touch panel shown in FIG. 1 is a rectangular substrate having translucency and insulation, and for example, a glass type or a film type is used. As the glass substrate 11, for example, alkali-free glass, soda lime glass, aluminosilicate glass, or the like is used. Moreover, as the film-type substrate 11, for example, a resin film such as polyethylene terephthalate (PET) is used. In the embodiment, a glass substrate is used.

  FIG. 1 is a view of the substrate 11 as seen from the back side. On the back surface of the substrate 11, a sensor unit 2 as an electronic element composed of a first electrode 13 and a second electrode 14 is provided. When the substrate 11 is incorporated in the touch panel device, the surface of the substrate 11 serving as an operation surface with which the operator touches his / her finger is the opposite side (the back side of the drawing) facing the back surface shown in FIG. Although not shown, a casing portion (not shown) is attached to the outer peripheral edge of the substrate 11 so as to be sandwiched from both the front and back surfaces. A display device not attached is attached, and a transparent cover member (not shown) is attached to the front surface side (back side of the paper surface) of the substrate 11, thereby forming a touch panel device.

  The first electrode 13 of the electrode section 12 is formed by etching a transparent conductive film such as ITO (Indium Tin Oxide) after patterning a resist using a photolithography technique or the like, for example, in the vertical direction (X direction) of FIG. Formed as arrayed column electrodes.

  Similarly to the first electrode 13, the second electrode 14 is formed by etching a transparent conductive film such as ITO (Indium Tin Oxide) after patterning a resist using a photolithography technique or the like, for example, in the lateral direction (Y direction in FIG. 1). Are formed as a plurality of column electrodes.

  Further, a method for forming the electrode portion 12 will be described. First, the plurality of first electrodes 13 extending in the vertical direction (X direction) in FIG. 1 are divided with respect to the operation facing surface 11a which is the back surface of the substrate 11. In this state, a plurality of electrode films 14a arranged in the horizontal direction (Y direction) in FIG. 1 are formed. Next, the insulating layer 16 is formed on the first electrode 13 at the intersection 15 between the first electrode 13 and the second electrode 14. The insulating layer 16 electrically insulates between the 1st electrode 13 and the 2nd electrode 14, for example, consists of insulating materials, such as an acrylic resin. Next, a plurality of electrode films 14 a are connected by bridge wiring (jumper wiring) 17 in the lateral direction (Y direction) in FIG. 1 across the first electrode 13 to form the second electrode 14. At this time, the bridge wiring 17 that connects the electrode films 14 a that constitute the second electrode 14 is wired so as to pass over the insulating layer 16. In this example, a rectangular portion where the electrode portion 12 is formed by the first electrode 13 and the second electrode 14 is an operation region of the sensor portion 2.

  In the above-described method for forming the electrode portion 12, the bridge wiring 17 is used for the second electrode 14. However, the first electrode 13 and the second electrode 14 are reversed, and the first electrode 13 is connected to the bridge wiring 17. May be used. Moreover, since the 1st electrode 13 and the 2nd electrode 14 should just insulate the crossing part 15 at least, the insulating layer 16 is formed in the whole surface of one electrode (the 1st electrode 13 or the 2nd electrode 14), The other electrode (the second electrode 14 or the first electrode 13) may be formed on the insulating layer 16.

  As shown in FIG. 1, a lead-out wiring portion 18 is led out from each end portion of the first electrode 13 and the second electrode 14 formed on the substrate 11 by the above-described forming method. These lead-out wiring portions 18 are drawn out from the respective end portions of the first electrode 13 and the second electrode 14, and are led to one long side of a frame-like region surrounding the operation region of the sensor unit 2, not shown. Are connected to a control IC (control circuit).

  The lead-out wiring part 18 is formed into a predetermined pattern as described above by forming a metal layer such as MAM (Mo / Al / Mo), APC (Ag, Pd, Cu, etc.) by sputtering and etching. .

  Thus, in order to maintain the accuracy as the position sensor, the sensor unit 2 has an XY matrix shape on the substrate 11 in a state where the first electrode 13 and the second electrode 14 made of linear electrodes are electrically insulated. It is possible to independently detect which X direction electrode and which Y direction electrode, not where on which electrode, and calculate the position from the intersection.

  As shown in FIG. 1, on the other long side of the frame-shaped region surrounding the operation region of the sensor unit 2, that is, on the side opposite to the side where the lead-out wiring unit 18 is routed, One metal layer 21 is provided.

As shown in FIG. 2, the first metal layer 21 is a rectangular film formed on the surface of the substrate 11, and the material thereof is, for example, MAM (Mo / Al / Mo). The thickness is about 350 nm, and lot information of the substrate 11 is written in the form of a two-dimensional barcode by a laser printer. Illustration of the written two-dimensional barcode is omitted.
In addition, it is stated that the first metal layer 21 is deposited on the “front surface” of the substrate 11, and this expression will be used hereinafter, but this is one of the front and back surfaces of the corresponding name pair. This is a surface as a term that generally refers to the surface of the plate material instead of the surface of the substrate, and in the substrate 11 of the embodiment shown in FIG.

  As shown in FIG. 2, an overcoat 23 layer is formed on the surface of the substrate 11 around the first metal layer 21 (not shown in FIG. 1). The overcoat layer 23 is a covering material that covers components other than the first metal layer 21 among the components on the surface of the substrate 11. Specifically, the overcoat layer 23 includes the first electrode 13 and the second electrode 14 described above. The sensor unit 2 and the lead-out wiring unit 18 are covered. The overcoat layer 23 is made of an organic resin such as acrylic or frit glass, and has a thickness of about 2 to 10 μm. The overcoat layer 23 has a function of protecting these electrodes when the display device is attached to the surface of the substrate 11. There is.

  Next, a manufacturing process of the substrate 11 as the touch panel configured as described above will be described with reference to a process flow of FIG. In FIG. 3, the number given to the left side of the block indicating each process is the process number.

  In the first step, in a large material glass plate, sensor portions 2 each composed of a first electrode 13 and a second electrode 14 are formed of ITO in each region to be an individual substrate 11 in a later step (“Sensor ITO formation "process).

  In the second step, an insulating layer 16 is formed on the first electrode 13 at the intersection 15 between the first electrode 13 and the second electrode 14 in the region of each substrate 11 (“insulating layer forming” step).

  In the third step, the first metal layer 21 is formed by MAM in the region of each substrate 11. In this step, the lead-out wiring portion 18 is also formed using MAM which is the same material as the first metal layer 21. The bridge wiring 17 may be formed so as to pass over the insulating layer 16 with the same material (“metal wiring formation (printing portion formation)” step).

  In the fourth step, an overcoat layer 23 is formed on the surface of the substrate 11 so as not to cover the first metal layer 21 in the region of each substrate 11 (“overcoat formation” step).

  In the fifth step, a two-dimensional barcode necessary for the laser printing apparatus is formed on the first metal layer 21 in the region of each substrate 11 (“two-dimensional barcode printing” step).

  In the sixth step, the material glass plate is cut at the boundary of each substrate 11 to separate each substrate 11 (“substrate cut” step).

  In the seventh step, the cut surface is polished for each substrate 11 and cleaning is performed to remove fine glass debris (“polishing / cleaning” step).

  In the eighth step, the surface of each substrate 11 is cleaned with an adhesive roller in consideration of the possibility that glass waste cannot be completely removed and dust generation from the workers involved in the process (“adhesive roller cleaning” step) ).

  In the ninth step, a protective film is pasted on the overcoat layer 23 to complete a substrate as a touch panel (“film pasting” step).

  After that, a casing unit is attached to the substrate as the touch panel, a display device is attached to the sensor unit 2 side of the substrate 11, and a transparent cover member is attached to the opposite surface of the substrate 11, thereby the touch panel device. Will be completed.

  According to the substrate as the touch panel according to the first embodiment described above, the surface of the insulative substrate 11 has a conventional area other than the area where the electronic elements such as the sensor unit 2 and the lead-out wiring unit 18 are formed. Thus, the MAM layer which is the first metal layer 21 was directly deposited without using an intermediate layer such as an ITO film.

  As described in the section “Problems to be Solved by the Invention”, the ITO layer is provided under the MAM layer for writing the two-dimensional bar code when soda glass is used as the substrate. This was in order to eliminate the possibility of the alkali component being deposited and affecting the MAM layer. However, according to the verification by the inventors of the present application, such an event occurs and has a substantial adverse effect on the MAM layer. Could not prove the possibility. Actually, when the product is completed, the first metal layer 21 such as a protective film attached in the ninth step is covered and protected by various protective films, so that the ITO layer is provided as an alkali component blocking layer. The necessity is considered small in practice. On the contrary, the MAM layer and the glass plate are considered to have good adhesion. Therefore, when the ITO layer of the first layer, which was conventionally essential, was omitted, a good result was obtained. That is, the MAM layer which is the first metal layer 21 exhibits good adhesion to the glass substrate 11 and does not peel off in any of the steps described with reference to FIG. A two-dimensional barcode in a written state could be formed. Here, “peeling” includes not only that the metal layer is completely separated from the substrate but also a state where the metal layer is partially lifted from the surface of the substrate. In addition, defects due to alkali components from the substrate were not particularly observed during the manufacturing and after a considerable time after completion.

  Therefore, for example, if lot information of an insulating substrate is written in each first metal layer 21 of each substrate 11 by this two-dimensional barcode, a product in the middle of the manufacturing process of the substrate as a touch panel or after completion For management, the same information can be referred to at any time, and in the manufacturing process of the touch panel device, the same information of the touch panel (substrate) which is one of the components can be referred to, which is extremely useful in industrial production.

A second embodiment will be described with reference to FIGS. 4 and 5.
In the substrate 11 shown in FIGS. 4 and 5, the overcoat layer 23 not only covers the electronic elements such as the sensor unit 2 and the lead-out wiring unit 18 on the surface of the substrate 11 but also the first metal layer 21. It also covers at least a part of the peripheral edge. In FIG. 5, it is applied to two sides of the peripheral portion of the rectangular first metal layer 21, but the overcoat layer 23 may be a rectangular first metal layer depending on the arrangement of the first metal layer 21. It can also comprise so that it may cover 3 sides or 4 sides of 21. The state in which the overcoat layer 23 is applied to the four sides of the rectangular first metal layer 21 is that the rectangular first metal layer 21 is surrounded by the overcoat layer 23, and the overcoat layer 23 is formed on the four peripheral portions thereof. Is a state covered.

  As described above, the first metal layer 21 is composed of the MAM layer, and the adhesiveness with the glass substrate 11 is originally good, but the peripheral edge is covered with the overcoat layer 23. Further, it is difficult to peel off from the substrate 11. That is, at least a portion covered with the overcoat layer 23 in the peripheral portion of the first metal layer 21 does not become a starting point of peeling. Therefore, for example, even when the cleaning using the adhesive roller is performed in the eighth step described with reference to FIG. 3, the possibility of peeling is further reduced.

A third embodiment will be described with reference to FIG.
In the substrate 11 shown in FIG. 6, the first metal layer 21 made of MAM is entirely covered with the second metal layer 22 made of ITO, and the second metal layer 22 is formed of the first metal layer 21. It is attached to the surface of the substrate 11 at the periphery. As in the second embodiment, the overcoat layer 23 also covers at least a part of the peripheral edge of the second metal layer 22.

  Here, the adherence force of the second metal layer 21 to the substrate 11 is greater than the adherence force of the MAM that is the first metal layer 21 to the substrate 11. That is, the adhesion between ITO and glass (substrate 11) is higher than that between MAM and glass (substrate 11). Furthermore, since the ITO has the same configuration as that of the second embodiment, the overcoat layer 23 covers at least a part of the peripheral edge portion, so that the starting point at which the second metal layer peels is reduced accordingly. As described above, according to the present embodiment, the MAM pattern (first metal layer 21) is covered with the ITO pattern (second metal layer) and the periphery of the ITO pattern (second metal layer). By covering a part of the portion with the overcoat layer 23, the possibility that the first metal layer 21 is peeled off is further reduced as compared with the second embodiment.

  In the third embodiment, even if the overcoat layer 23 is omitted, the MAM that is the first metal layer 21 is covered with the ITO that is the second metal layer, so that the first embodiment is more than the first embodiment. The metal layer 21 is difficult to peel off.

DESCRIPTION OF SYMBOLS 2 ... Sensor part as an electronic element 11 ... Board | substrate as a touch panel which is a board | substrate for electronic elements 21 ... 1st metal layer 22 ... 2nd metal layer 23 ... Overcoat layer

Claims (3)

An insulating substrate on which electronic elements are formed, and
A first metal layer deposited on the surface of the substrate and written with information;
An electronic device substrate comprising:
The first metal layer, the peripheral portion of at least a part only substrate to that electronic elements and being covered with a coating material excluding the information is written region. An insulating substrate on which electronic elements are formed, and
A first metal layer deposited on the surface of the substrate and written with information;
A substrate for electronic devices you equipped with,
By a second metal layer having a deposition force relative to the substrate is greater than the adhesive strength with respect to the substrate of the first metal layer, the first for the features and to that electronic device that metal layer is covered substrate. The second electronic device substrate according to claim 2, wherein at least a part of the peripheral portion, characterized in that covered with the coating material of the metal layer.

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