JP6359347B2 - Probe unit and contact probe - Google Patents

Description

  The present invention relates to a conductive contact probe used for a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor package or a liquid crystal panel, and a probe unit including the contact probe.

  Conventionally, when conducting a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor integrated circuit (package) or a liquid crystal panel, an electrical connection between the inspection target and a signal processing device that outputs an inspection signal is used. For the purpose of illustration, a probe unit that accommodates a plurality of contact probes is used. The probe unit can be applied to highly integrated and miniaturized inspection objects by narrowing the pitch between contact probes with the progress of high integration and miniaturization of semiconductor integrated circuits and liquid crystal panels in recent years. Possible technologies are progressing.

  Further, as the above-described probe unit, a contact probe that electrically connects the semiconductor integrated circuit and the circuit board by making contact with the electrode of the semiconductor integrated circuit and the electrode of the circuit board that outputs a test signal at both ends. (See, for example, Patent Documents 1 and 2).

  The contact probe disclosed in Patent Document 1 is connected to the first conductive member that contacts the electrode of the semiconductor integrated circuit, the second conductive member that contacts the electrode of the circuit board that outputs the inspection signal, and the second conductive member. And a guide tube that guides the moving direction of the first conductive member, and a conductive coil spring that connects the first conductive member and the guide tube in a telescopic manner. In the contact probe disclosed in Patent Document 1, an inspection signal is transmitted from the second conductive member to the first conductive member via the guide tube and the coil spring.

  In contrast, the contact probe disclosed in Patent Document 2 includes a first conduction member that contacts an electrode of a semiconductor integrated circuit, a second conduction member that contacts an electrode of a circuit board that outputs a test signal, and a first conduction member. A conductive pipe body that houses one end of each of the member and the second conductive member; a conductive coil spring that houses the pipe body therein and connects the first conductive member and the second conductive member in a telescopic manner; Have In the contact probe disclosed in Patent Document 2, an inspection signal is transmitted from the second conductive member to the first conductive member via the pipe body. The contact probe disclosed in Patent Document 2 has a stable electrical conductivity as compared with the contact probe disclosed in Patent Document 1 because an inspection signal is transmitted without passing through a coil spring.

JP 2006-208329 A JP2011-169595A

  However, since the thickness of the pipe body is limited to a small space between the coil spring and the first and second conducting members, the contact probe disclosed in Patent Document 2 has sufficient conductivity (particularly an allowable current value). ) Can not get. When the thickness of the pipe body is increased for the purpose of improving the conductivity, the inner diameter of the coil spring has to be increased, resulting in a problem that the contact probe is increased in size. For this reason, there has been a problem that the pitch between the contact probes cannot be reduced.

  This invention is made | formed in view of the above, Comprising: It aims at providing the probe unit and contact probe which can improve electroconductivity, suppressing enlargement.

  In order to solve the above-described problems and achieve the object, a probe unit according to the present invention includes conductive first and second contact members that are in contact with two different objects to be contacted, and the first and first contact members. A pipe body having a conductive hole portion that can be accommodated while contacting an end portion on a side different from an end portion of the two contact member in contact with the contacted body; and the first contact member and the pipe body. A plurality of contact probes, comprising: a first coil spring that is connectable and expandable in the connecting direction; and a second coil spring that connects the second contact member and the pipe body and is expandable and contractible in the connecting direction; And a probe holder for holding the contact probe.

  In the probe unit according to the present invention as set forth in the invention described above, the first contact member has a tapered tip shape, a first tip portion that contacts one contacted body, and a base of the first tip portion. A first flange portion extending from an end side and having a diameter larger than the diameter of the first tip portion; and extending from an end portion on a different side from the side connected to the first tip portion of the first flange portion, A first boss portion having a diameter smaller than that of the first flange portion and connected to the first coil spring; and an end portion on a side different from the side connected to the first flange portion of the first boss portion And a second tip part that has a tapered tip shape and contacts the other contacted body. A second furan extending from the base end side of the second tip portion and having a larger diameter than the diameter of the second tip portion. And extending from the end of the second flange portion on a side different from the side connected to the second tip portion, and having a smaller diameter than the diameter of the second flange portion, and is coupled to the second coil spring A second boss portion and a second housing portion that extends from an end portion of the second boss portion that is different from a side that is continuous with the second flange portion, and that can be accommodated in the hole portion, coaxially, The probe holder is connected to the first and second small diameter portions that can be inserted through the first and second tip portions, respectively, and is connected to the first small diameter portion at one end and to the second small diameter portion at the other end. A large-diameter portion having a diameter larger than the diameters of the first and second small-diameter portions, and the first flange portion abuts against a step portion formed by the first small-diameter portion and the large-diameter portion. The second flange portion is in contact with a step portion formed by the second small diameter portion and the large diameter portion.

  In the probe unit according to the present invention as set forth in the invention described above, the first contact member has a tapered tip shape, a first tip portion that contacts one contacted body, and a base of the first tip portion. A first flange portion extending from an end side and having a diameter larger than the diameter of the first tip portion; and extending from an end portion on a different side from the side connected to the first tip portion of the first flange portion, A first boss portion having a diameter smaller than that of the first flange portion and connected to the first coil spring; and an end portion on a side different from the side connected to the first flange portion of the first boss portion And a second tip part that has a tapered tip shape and contacts the other contacted body. A second furan extending from the base end side of the second tip portion and having a larger diameter than the diameter of the second tip portion. And extending from the end of the second flange portion on a side different from the side connected to the second tip portion, and having a smaller diameter than the diameter of the second flange portion, and is coupled to the second coil spring A second boss portion and a second housing portion that extends from an end portion of the second boss portion that is different from a side that is continuous with the second flange portion, and that can be accommodated in the hole portion, coaxially, The pipe body includes a main body part, a first connection part that is connected to one end of the main body part, and has an outer diameter equal to that of the first boss part, and is connected to the first coil spring, and the main body part And a second connecting portion connected to the second coil spring, the outer diameter of the probe holder being the same as the diameter of the second boss portion, Two first and second small diameter portions that can be respectively inserted through the two distal end portions, and one end connected to the first small diameter portion; A large-diameter portion having a diameter larger than that of the small-diameter portion, and is provided between the second small-diameter portion and the large-diameter portion, and is larger than the diameter of the second small-diameter portion and smaller than the diameter of the large-diameter portion. An intermediate diameter portion, wherein the first flange portion abuts on a step portion formed by the first small diameter portion and the large diameter portion, and the second flange portion includes the second small diameter portion and the intermediate diameter portion. The main body is in contact with a step formed by the large-diameter portion and the medium-diameter portion.

  Moreover, the probe unit according to the present invention is characterized in that, in the above-described invention, the first and second accommodating portions have different lengths in the connecting direction.

  In the probe unit according to the present invention as set forth in the invention described above, the first and second coil springs have different spring constants.

  Moreover, in the probe unit according to the present invention, in the above invention, the length of the first accommodation portion in the connection direction of the first and second accommodation portions is longer than the length of the second accommodation portion in the connection direction. When it is larger, the spring constant of the first coil spring is larger than the spring constant of the second coil spring, and the length of the second housing part in the connecting direction is larger than the length of the first housing part in the connecting direction. When it is larger, the spring constant of the second coil spring is larger than the spring constant of the first coil spring.

  The contact probe according to the present invention includes conductive first and second contact members that are in contact with two different objects to be contacted, and sides of the first and second contact members that are in contact with the contacted object. A pipe body having a conductive hole portion that can be accommodated while contacting an end portion on a side different from the end portion, and the first contact member and the pipe body are connected to each other, and can be expanded and contracted in the connecting direction. The coil spring includes a second coil spring that connects the second contact member and the pipe body and is extendable and contractible in the connecting direction.

  According to the present invention, there is an effect that conductivity can be improved while suppressing an increase in size.

FIG. 1 is a perspective view showing a schematic configuration of the probe unit according to the first embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing a configuration of a main part of the probe unit according to the first embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing a configuration of a main part of the probe unit at the time of inspection of the semiconductor package according to the first embodiment of the present invention, and shows a state in which the contact probe is connected to the circuit board. FIG. 4 is a partial cross-sectional view showing a configuration of a main part of the probe unit at the time of inspection of the semiconductor package according to the first embodiment of the present invention, and shows a state in which the contact probe is connected to the circuit board and the semiconductor package. It is. FIG. 5 is a perspective view illustrating an example of a configuration of a main part of the contact probe according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating an example of a configuration of a main part of the contact probe according to the first embodiment of the present invention. FIG. 7 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the modification of the first embodiment of the present invention. FIG. 8 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view showing the configuration of the main part of the contact probe according to the second embodiment of the present invention. FIG. 10 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor package according to the second embodiment of the present invention, in which the contact probe is connected to the circuit board and the semiconductor package. It is. FIG. 11 is a partial cross-sectional view illustrating a configuration of a main part of a probe unit according to a modification of the second embodiment of the present invention. FIG. 12 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the third embodiment of the present invention. FIG. 13: is sectional drawing which shows the structure of the principal part of the contact probe concerning Embodiment 3 of this invention. FIG. 14 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor package according to the third embodiment of the present invention, and shows a state in which the contact probe is connected to the circuit board and the semiconductor package. It is. FIG. 15 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the fourth embodiment of the present invention. FIG. 16 is a schematic diagram illustrating another example of the configuration of the main part of the contact probe according to the first to fourth embodiments of the present invention. FIG. 17 is a schematic diagram illustrating another example of the configuration of the main part of the contact probe according to the first to fourth embodiments of the present invention. FIG. 18 is a schematic diagram illustrating another example of the configuration of the main part of the contact probe according to the first to fourth embodiments of the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for implementing the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment. The drawings referred to in the following description only schematically show the shape, size, and positional relationship so that the contents of the present invention can be understood. That is, the present invention is not limited only to the shape, size, and positional relationship illustrated in each drawing.

(Embodiment 1)
FIG. 1 is a perspective view showing the configuration of the probe unit according to the first embodiment of the present invention. A probe unit 1 shown in FIG. 1 is a device that is used when an electrical characteristic test is performed on a semiconductor integrated circuit 100 that is an object to be tested, and a circuit that outputs a test signal to the semiconductor integrated circuit 100 and the semiconductor integrated circuit 100. This is an apparatus for electrically connecting the substrate 200.

  The probe unit 1 includes a conductive contact probe 2 (hereinafter simply referred to as “probe 2”) that contacts two electrodes of the semiconductor integrated circuit 100 and the circuit board 200 that are different from each other at both ends in the longitudinal direction. The probe holder 3 that accommodates and holds the plurality of probes 2 according to a predetermined pattern, and the semiconductor integrated circuit 100 that is provided around the probe holder 3 and contacts the plurality of probes 2 at the time of inspection is displaced. And a holder member 4 that suppresses this.

  FIG. 2 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the first embodiment, and shows the detailed configuration of the probe 2 accommodated in the probe holder 3. The probe 2 shown in FIG. 2 is mainly formed using a conductive material. When the semiconductor integrated circuit 100 is inspected, the probe 2 is connected to the first plunger 21 (first contact member) that contacts the connection electrode of the semiconductor integrated circuit 100 and the electrode of the circuit board 200 provided with the inspection circuit. The second plunger 22 (second contact member) that comes into contact, the pipe body 23 that can accommodate one end of the first plunger 21 and the one end of the second plunger 22, and the first plunger 21 and the pipe body 23 are provided. A first coil spring 24 that connects the first plunger 21 and the pipe body 23 in a telescopic manner and a second plunger 22 and the pipe body 23 that are provided between the second plunger 22 and the pipe body 23 in a telescopic manner. And a second coil spring 25. The first plunger 21, the second plunger 22, the pipe body 23, the first coil spring 24, and the second coil spring 25 constituting the probe 2 have the same axis. When the probe 2 is brought into contact with the semiconductor integrated circuit 100, the first coil spring 24 and the second coil spring 25 expand and contract in the axial direction, so that the impact on the connection electrode of the semiconductor integrated circuit 100 is reduced. A load is applied to the integrated circuit 100 and the circuit board 200.

  The first plunger 21 has a distal end portion 21a (first distal end portion) having a tapered distal end shape, and a flange portion 21b extending from the proximal end side of the distal end portion 21a and having a diameter larger than the diameter of the distal end portion 21a ( A first flange portion), and a boss portion 21c (first boss portion) extending from an end portion on a side different from the side continuous with the tip portion 21a of the flange portion 21b and having a smaller diameter than the diameter of the flange portion 21b, A housing portion 21d (first housing portion) that extends from the end of the boss portion 21c that is different from the side that is continuous with the flange portion 21b, has a smaller diameter than the diameter of the boss portion 21c, and can be housed in the pipe body 23. On the same axis.

  The second plunger 22 has a distal end portion 22a (second distal end portion) having a tapered distal end shape, and a flange portion 22b extending from the proximal end side of the distal end portion 22a and having a diameter larger than the diameter of the distal end portion 22a ( A second flange portion), a boss portion 22c (second boss portion) extending from an end portion different from the side connected to the tip end portion 22a of the flange portion 22b and having a smaller diameter than the diameter of the flange portion 22b, and a boss portion An accommodating portion 22d (second accommodating portion) that extends from the end portion on the side different from the side continuous with the flange portion 22b of 22c, has a smaller diameter than the diameter of the boss portion 22c, and can be accommodated in the pipe body 23. Have on the same axis. The length of the accommodating part 22d in the extending direction is smaller than the length of the accommodating part 21d in the extending direction.

  The pipe body 23 is formed using a conductive material, for example, a metal material. The pipe body 23 has a cylindrical main body portion 23a, a cylindrical main body portion 23a that is connected to one end of the main body portion 23a, and an outer peripheral diameter equal to the diameter of the boss portion 21c. Therefore, it has the 2nd connection part 23c which follows the other end of the main-body part 23a, and the outer periphery diameter is equivalent to the diameter of the boss | hub part 22c on the same axis | shaft. The first connecting portion 23b and the second connecting portion 23c have a stepped shape in which the diameter of the outer periphery on the distal end side (the end on the side different from the end connected to the main body 23a) is reduced. The inner peripheral diameters of the main body 23a, the first connecting part 23b, and the second connecting part 23c are equal to the diameters of the accommodating parts 21d and 22d, and the pipe body 23 has a cylindrical shape with the diameters of the accommodating parts 21d and 22d. A hole 23d, which is a hollow space formed, is formed. In the first embodiment, it is assumed that the outer diameter of the first connecting portion 23b is the same as the outer diameter of the second connecting portion 23c. That is, the diameters of the boss portions 21c and 22c, the outer diameter of the first connecting portion 23b, and the outer diameter of the second connecting portion 23c are the same.

  The first coil spring 24 is formed by winding a wire at a predetermined pitch. For example, when the inner diameter of the coil spring 24 is substantially the same as the boss portion 21c, the one end portion is press-fitted into the boss portion 21c and is in contact with the flange portion 21b. On the other hand, the other end portion of the first coil spring 24 is press-fitted into the first connecting portion 23b and is in contact with a step portion formed by the main body portion 23a and the first connecting portion 23b. The inner diameter of the first coil spring 24 may be a length that can contact the flange portion 21b and the step portion formed by the main body portion 23a and the first connecting portion 23b. The first coil spring 24 may be joined to the first plunger 21 and / or the pipe body 23 by soldering.

  The second coil spring 25 is formed by winding a wire at a predetermined pitch. For example, when the inner diameter of the second coil spring 25 is substantially equal to the boss portion 22c, the one end portion is press-fitted into the boss portion 22c and is in contact with the flange portion 22b. On the other hand, the other end portion of the coil spring 25 is press-fitted into the second connecting portion 23c and is in contact with a step portion formed by the main body portion 23a and the second connecting portion 23c. The inner diameter of the second coil spring 25 may be a length that can contact the flange portion 22b and the step portion formed by the main body portion 23a and the second connecting portion 23c. The second coil spring 25 may be joined to the second plunger 22 and / or the pipe body 23 by soldering.

  Examples of the wire used for the first coil spring 24 and the second coil spring 25 include a material made of metal or resin. This material may be conductive or may be insulating. In the first embodiment, the first coil spring 24 and the second coil spring 25 are described as having the same spring constant. However, the first coil spring 24 and the second coil spring 25 may be different from each other. By adjusting the spring constant of the coil spring 25, the position of the pipe body 23 (within the probe holder 3) can be controlled. The adjustment of the spring constant can be performed, for example, by changing the wire diameter, wire, effective winding number, coil diameter, etc. of the coil spring.

  The first plunger 21 and the second plunger 22 are movable in the axial direction by the expansion and contraction action of the first coil spring 24 and the second coil spring 25. In a state where the probe 2 is held by the probe holder 3 and no external load (excluding gravity) is applied (see FIG. 2), a part of the accommodating portion 21d of the first plunger 21 is one end side of the hole portion 23d. The second plunger 22 is partly accommodated in the other end side of the hole 23d and in contact with the wall surface of the hole 23d.

  The probe holder 3 is formed using an insulating material such as resin, machinable ceramic, silicon, etc., and a first member 31 located on the upper surface side and a second member 32 located on the lower surface side in FIG. 2 are laminated. Become. The first member 31 and the second member 32 are formed with the same number of holder holes 33 and 34 as holding parts for receiving the plurality of probes 2, and the holder holes 33 and 34 for receiving the probes 2 are mutually connected. The axes are formed so as to coincide with each other. The formation positions of the holder holes 33 and 34 are determined according to the wiring pattern of the semiconductor integrated circuit 100.

  Both holder holes 33 and 34 have stepped hole shapes with different diameters along the penetration direction. That is, the holder hole 33 includes a small-diameter portion 33a (first small-diameter portion) having an opening on the upper end surface of the probe holder 3, and a large-diameter portion 33b having a larger diameter than the small-diameter portion 33a. The small-diameter portion 33a has a diameter that is smaller than the diameter of the flange portion 21b and slightly larger than the diameter of the tip portion 21a. The large diameter portion 33b has a diameter that is equal to or slightly larger than that of the flange portion 21b.

  On the other hand, the holder hole 34 includes a small diameter portion 34a (second small diameter portion) having an opening at the lower end surface of the probe holder 3, a large diameter portion 34b having a diameter larger than that of the small diameter portion 34a and equal to the large diameter portion 33b. Consists of. The small diameter portion 34a has a diameter that is smaller than the diameter of the flange portion 22b and slightly larger than the tip portion 22a. The large diameter portion 34c has the same diameter as the large diameter portion 33b.

  The flange portion 21b of the first plunger 21 has a function of preventing the probe 2 from being removed from the probe holder 3 by coming into contact with a step portion formed by the small diameter portion 33a and the large diameter portion 33b. The flange portion 22b of the second plunger 22 has a function of preventing the probe 2 from being removed from the probe holder 3 by abutting against a step portion formed by the small diameter portion 34a and the large diameter portion 34b. Each boundary wall surface of the holder holes 33, 34 may have a stepped shape corresponding to the diameter of the flange portions 21b, 22b.

  FIG. 3 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor package according to the first embodiment, and shows a state in which the contact probe is connected to the circuit board. FIG. 4 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor package according to the first embodiment, and shows a state in which the contact probe is connected to the circuit board and the semiconductor package. .

  When the circuit board 200 is attached to the holder member 4 (see FIG. 1), the tip 22a comes into contact with the electrode 201 of the circuit board 200 as shown in FIG. When a contact load is applied from the circuit board 200 to the tip 22a by the contact, the first coil spring 24 and the second coil spring 25 are compressed along the longitudinal direction. At this time, the accommodating portion 22d further enters the hole portion 23d and maintains a state where it is in contact with the wall surface of the hole portion 23d.

  At the time of inspection of the semiconductor integrated circuit 100, the tip 21a contacts the connection electrode 101, and the first coil spring 24 and the second coil spring 25 are further compressed along the longitudinal direction by the contact load from the semiconductor integrated circuit 100. It becomes a state. When the first coil spring 24 and the second coil spring 25 are compressed, as shown in FIG. 4, the accommodating portion 21d of the first plunger 21 enters the hole portion 23d and comes into sliding contact with the wall surface of the hole portion 23d. At the same time, the accommodating portion 22d of the second plunger 22 enters the hole 23d and is in sliding contact with the wall surface of the hole 23d. At this time, since the axes of the first plunger 21 and the second plunger 22 are not greatly shaken, the sliding contact of the wall surfaces of the housing portion 21d and the hole portion 23d and the sliding contact of the wall surfaces of the housing portion 22d and the hole portion 23d are performed. Therefore, the contact resistance between the housing portion 21d and the housing portion 22d and the pipe body 23 is stabilized, and reliable conduction is obtained.

  A test signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of inspection is transmitted from the electrode 201 of the circuit board 200 to the semiconductor integrated circuit 100 via the second plunger 22, the pipe body 23, and the first plunger 21 of the probe 2. The connection electrode 101 is reached. Thus, in the probe 2, since the 1st plunger 21 and the 2nd plunger 22 conduct | electrically_connect through the pipe body 23, the conduction | electrical_connection path | route of an electrical signal can be minimized.

  The pipe body 23 can increase the conducting current by increasing the thickness of the main body 23a. Thereby, the electrical characteristics of the probe 2 are improved, and for example, it is possible to cope with an increase in current.

  In addition, since the tip of the tip 21a has a plurality of tapered nails, even if an oxide film is formed on the surface of the connection electrode 101, the tip is pierced through the oxide film. The tip of 21a can be brought into direct contact with the connection electrode 101.

  FIG. 5 is a perspective view illustrating an example of a configuration of a main part (pipe body) of the contact probe according to the first embodiment. FIG. 6 is a cross-sectional view showing an example of the configuration of the main part (pipe body) of the contact probe according to the first embodiment, and a plane passing through the central axis N of the pipe body 23 shown in FIG. FIG. The pipe body 23 according to the first embodiment may be integrally molded, or may be formed by cutting one cylindrical member, as shown in FIGS. Thus, it may be formed using two cylindrical members.

  The pipe body 23 shown in FIGS. 5 and 6 includes a first tubular member 231 and a second tubular member 232. The first cylindrical member 231 is formed using a conductive material, and the outer diameter is the same as the outer diameter of the first connecting portion 23b and the second connecting portion 23c, and the inner diameter is a hole. It has a cylindrical shape equivalent to the diameter of the portion 23d. That is, the hollow space formed in the 1st cylindrical member 231 becomes the hole 23d mentioned above. The second cylindrical member 232 is formed using a conductive material, the outer diameter is equal to the outer diameter of the main body 23a, and the inner diameter is the first cylindrical member 231 (first connection member). The outer periphery of the part 23b and the 2nd connection part 23c) is made into the cylinder shape of a diameter equivalent to or a little smaller.

  The pipe body 23 is formed by press-fitting and joining the first tubular member 231 to the second tubular member 232. By forming the pipe body 23 using the first cylindrical member 231 and the second cylindrical member 232, the pipe body 23 can be easily manufactured. Note that the first cylindrical member 231 may be formed of a conductive material, and the second cylindrical member 232 may be formed of an insulating material. Alternatively, the first cylindrical member 231 may be formed using an insulating material, and the surface of the hole 23d may be plated.

  According to the first embodiment described above, the probe 2 transmits the inspection signal from the circuit board 200 to the semiconductor integrated circuit 100 via the first plunger 21, the pipe body 23, and the second plunger 22, and the first A first coil spring 24 that is disposed between the plunger 21 and the pipe body 23 so as to be elastically connected to each other, and a second coil that is disposed between the second plunger 22 and the pipe body 23 so as to be elastically connected therebetween. Since the spring 25 is provided and individually urged through the pipe body 23, the conductivity can be improved while suppressing an increase in size.

  According to the first embodiment described above, since the accommodating portions 21d and 22d are caused to enter the hole portion 23d in a state where no external load is applied, the contact between the first and second plungers and the pipe body. Can be ensured.

  According to the first embodiment described above, since the processing accuracy of the hole 23d can be managed with high accuracy by forming the pipe body 23 using a metal material, the first and second plungers ( The clearance between the housing portion) and the hole 23d can be managed with high accuracy, and the electrical resistance value can be stabilized.

  Here, conventionally, as disclosed in Patent Document 2, since the pipe body is not fixed to the plunger or the coil spring, the position of the pipe body is unstable, and the first and second plungers and the pipe body Contact may not be reliably made. In order to solve this problem, a method of sufficiently lengthening the shaft portions of the first and second plungers can be considered. However, this method causes a problem that the stroke length of the probe is shortened.

  On the other hand, in the first embodiment, the first and second coil springs are attached to both ends of the pipe body 23, respectively, so that the position of the pipe body 23 is stabilized and the first and second plungers are stabilized. And the pipe body can be reliably contacted.

  Further, according to the first embodiment described above, the first connecting portion 23b has a stepped shape in which the diameter of the outer periphery on the front end side is reduced, so that the first coil spring 24 is contracted by an external load. At this time, the first coil spring 24 is not pressed against the tip of the first connecting portion 23b. Thereby, the press-fitting amount (the number of turns) of the first coil spring 24 with respect to the first connecting portion 23b can be restricted, and the expansion and contraction operation of the first coil spring 24 can be stabilized. In addition, the same effect is show | played also about the 2nd connection part 23c.

  Although it has been described that the lengths of the accommodating portions 21d and 22d are different, the accommodating portions 21d and 22d do not come into contact with each other by the forward and backward movements of the first plunger 21 and the second plunger 22, and the accommodating portions 21d and 22d are hole portions. As long as it comes into contact with 23d, the lengths of the accommodating portions 21d and 22d may be the same.

(Modification of Embodiment 1)
FIG. 7 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the modification of the first embodiment, and shows the detailed configuration of the probe 2 accommodated in the probe holder 3. In the first embodiment described above, a part of the accommodation portion 22d of the second plunger 22 is accommodated in the pipe body 23 in a state where the circuit board 200 is not attached. In a state where the circuit board 200 is not attached, the accommodating portion 22e of the second plunger 22 is not accommodated in the pipe body 23 and is separated.

  In the case of this modification, when the circuit board 200 is attached to the holder member 4 and a contact load is applied from the circuit board 200 to the tip portion 22a by the contact between the tip portion 22a and the electrode 201, the first coil spring 24 and The second coil spring 25 is compressed along the longitudinal direction. At this time, the base end 22e enters the hole 23d for the first time, and comes into contact with the wall surface of the hole 23d.

  According to the modification of the first embodiment described above, since the accommodating portion 22e enters the hole portion 23d only when the circuit board 200 is attached to the holder member 4, the accommodating portion 21d in the hole portion 23d. The area in which can enter can be increased.

(Embodiment 2)
FIG. 8 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same component as the component mentioned above in FIG. In the first embodiment described above, the probe holder 3 has been described as having a retaining function by contacting the first plunger 21 and the second plunger 22, but the probe holder 5 according to the second embodiment has the probe 2a. The pipe body 26 is also held.

  The probe 2a according to the second embodiment includes a pipe body 26, a first coil spring 24a, and a second coil spring 25a instead of the pipe body 23, the first coil spring 24, and the second coil spring 25 of the probe 2 described above. Have. The first coil spring 24a and the second coil spring 25a have the same inner circumference diameter and different spring constants. The first coil spring 24a and the second coil spring 25a have different wire diameters or forming materials. When the spring constant of the first coil spring 24a is S1 and the spring constant of the second coil spring 25a is S2, S1> S2 holds.

  FIG. 9 is a cross-sectional view showing the configuration of the main part (pipe body) of the contact probe according to the second embodiment. The pipe body 26 is formed using a conductive material, for example, a metal material. The pipe body 26 includes a cylindrical main body portion 26a, a cylindrical first connection portion 26b that is connected to one end of the main body portion 26a, has an outer diameter equal to the diameter of the boss portion 21c, and has no cylindrical shape. And a second connecting portion 26c provided on the other end side of the main body portion 26a and having an outer diameter equal to the diameter of the boss portion 22c. The first connecting portion 26b and the second connecting portion 26c have a stepped shape in which the diameter of the outer periphery on the distal end side (the end portion different from the end portion connected to the main body portion 26a) is reduced. The inner peripheral diameters of the main body part 26a, the first connecting part 26b, and the second connecting part 26c are equal to the diameters of the accommodating parts 21d and 22d, respectively, and the pipe body 26 has the same diameter as the accommodating parts 21d and 22d. A hole 26d, which is a hollow space having a cylindrical shape with a diameter, is formed. In the second embodiment, the boss portions 21c and 22c, the outer diameter of the first connection portion 26b, and the outer diameter of the second connection portion 26c are assumed to be the same.

  The probe holder 5 is formed using an insulating material such as resin, machinable ceramic, or silicon, and a first member 51 located on the upper surface side and a second member 52 located on the lower surface side in FIG. 8 are laminated. Become. The first member 51 and the second member 52 are formed with the same number of holder holes 53 and 54 as holding parts for accommodating the plurality of probes 2a, and the holder holes 53 and 54 for accommodating the probes 2a are mutually connected. The axes are formed so as to coincide with each other. The formation positions of the holder holes 53 and 54 are determined according to the wiring pattern of the semiconductor integrated circuit 100.

  Both holder holes 53 and 54 have a stepped hole shape with different diameters along the penetration direction. That is, the holder hole 53 includes a small-diameter portion 53a (first small-diameter portion) having an opening on the upper end surface of the probe holder 5, and a large-diameter portion 53b having a larger diameter than the small-diameter portion 53a. The small-diameter portion 53a has a diameter that is smaller than the diameter of the flange portion 21b and slightly larger than the diameter of the tip portion 21a. The large-diameter portion 53b has a diameter that is equal to or slightly larger than the larger outer diameter of the flange portion 21b or the main body portion 26a.

On the other hand, the holder hole 54 has a small-diameter portion 54a (second small-diameter portion) having an opening at the lower end surface of the probe holder 5, a diameter larger than the small-diameter portion 54a, and a large-diameter portion 53b (the outer periphery of the protruding portion 26d). Medium diameter portion 54b having a diameter smaller than the diameter. The small-diameter portion 54a has a diameter that is smaller than the diameter of the flange portion 22b and slightly larger than the tip portion 22a.
Here, the diameter of the outer periphery of the main body portion 26a is smaller than the diameter of the large diameter portion 53b and larger than the diameter of the medium diameter portion 54b.

  In the probe 2a, the flange portion 21b of the first plunger 21 has a function of preventing the probe 2a from being removed from the probe holder 5 by coming into contact with a step portion formed by the small diameter portion 53a and the large diameter portion 53b. Further, the flange portion 22b of the second plunger 22 has a function of preventing the probe 2a from being removed from the probe holder 5 by coming into contact with a step portion formed by the medium diameter portion 54b and the small diameter portion 54a. Furthermore, in the second embodiment, since the spring constant of the first coil spring 24a is larger than the spring constant of the second coil spring 25a, the main body portion 26a of the pipe body 26 has a large diameter portion 53b, a medium diameter portion 54b, Is in contact with the stepped portion.

  FIG. 10 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor package according to the second embodiment, and shows a state in which the contact probe is connected to the circuit board and the semiconductor package. .

  In the inspection of the semiconductor integrated circuit 100, when the circuit board 200 is attached to the holder member 4 and the semiconductor integrated circuit 100 is placed, the tip end portion 21a comes into contact with the connection electrode 101 as shown in FIG. The tip 22a is in contact with the electrode 201. By this contact, contact loads are applied to the tip portions 21a and 22a, respectively, and the first coil spring 24a and the second coil spring 25a are compressed along the longitudinal direction. At this time, the accommodating portions 21d and 22d enter the hole portion 26d and are in contact with the wall surface of the hole portion 26d.

  Due to the difference in spring constant between the first coil spring 24a and the second coil spring 25a, the main body portion 26a of the pipe body 26 is in contact with the step portion formed by the large diameter portion 53b and the medium diameter portion 54b. The coil spring 24a and the second coil spring 25a expand and contract independently depending on the contact load applied to the tip portions 21a and 22a, respectively. In other words, the first coil spring 24a expands and contracts according to the contact load applied to the tip end portion 21a, and the second coil spring 25a expands and contracts according to the contact load applied to the tip end portion 22a.

  A test signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of the test is sent from the electrode 201 of the circuit board 200 to the semiconductor integrated circuit 100 via the second plunger 22, the pipe body 26, and the first plunger 21 of the probe 2a. The connection electrode 101 is reached. Thus, in the probe 2a, since the first plunger 21 and the second plunger 22 are conducted through the pipe body 26, the conduction path of the electric signal can be minimized.

  According to the second embodiment described above, the probe 2a transmits the inspection signal from the circuit board 200 to the semiconductor integrated circuit 100 via the first plunger 21, the second plunger 22, and the pipe body 26, and the first A first coil spring 24a that is disposed between the plunger 21 and the pipe body 26 so as to be elastically connected therebetween, and a second coil that is disposed between the second plunger 22 and the pipe body 26 so as to be elastically connected therebetween. Since the spring 25a is provided and individually urged through the pipe body 26, the conductivity can be improved while suppressing an increase in size.

  Further, according to the second embodiment described above, the spring constants of the first coil spring 24a and the second coil spring 25a are different, and the main body portion 26a of the pipe body 26 is divided into a large diameter portion 53b and a medium diameter portion 54b. Since the first coil spring 24a and the second coil spring 25a are made to expand and contract independently according to the contact loads applied to the tip portions 21a and 22a, respectively, the first plunger 21 and the second plunger 22 can be set to have different contact loads.

  In general, the frequency of replacement of the circuit board 200 is not so high. Therefore, it is preferable that the contact load is low to some extent in view of damage to the electrodes due to long-term use. On the other hand, it is preferable that the inspection target (semiconductor integrated circuit) side has a certain high contact load in order to break through the oxide film of the electrode and obtain reliable conduction. In the case of the conventional probe, since one coil spring is used, it is impossible to set different contact loads for different upper and lower contact objects. On the other hand, since the probe 2a according to the second embodiment can be set to have different contact loads between the first plunger 21 and the second plunger 22, it is possible to adjust each to a preferable contact load. It is.

  Further, according to the second embodiment described above, the spring constants of the first coil spring 24a and the second coil spring 25a are different, and the main body portion 26a of the pipe body 26 is divided into a large diameter portion 53b and a medium diameter portion 54b. The position of the pipe body can be controlled in the extending and contracting directions of the first and second coil springs.

  Conventionally, when the position of the pipe body is not fixed as disclosed in Patent Document 2, the position of the pipe body at the time of inspection is unstable, so that the pipe body and the first and second plungers are reliably in contact with each other. In order to achieve this, it is necessary to lengthen the shaft portions (accommodating portions of the present invention) of the first and second plungers to some extent. However, if the shaft portion is lengthened, it becomes difficult to take a sufficient stroke length of the probe (the expansion and contraction range of the first and second plungers). On the other hand, in the second embodiment, the pipe body 26 is brought into contact with the step portion of the holder hole, or the spring constants of the first coil spring 24a and the second coil spring 25a are set to be different from each other. Thus, the position of the pipe body in the holder is controlled, so that the lengths of the first and second plungers (accommodating portions 21d and 22d) can be easily designed and the stroke length of the probe can be easily secured. Can do.

(Modification of Embodiment 2)
FIG. 11 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the modification of the second embodiment of the present invention, and is a diagram showing the detailed configuration of the probe 2 accommodated in the probe holder 3. . In the above-described second embodiment, the main body portion 26a of the pipe body 26 has been described as being brought into contact with the step portion formed by the large diameter portion 53b and the medium diameter portion 54b. One of the members may be in contact with the stepped portion formed on one of the members. In this modification, as an example, the protruding portion 26d has a large diameter portion and a medium diameter portion formed on the second member. Abuts on the stepped portion.

  The probe holder 5a according to this modification is formed by laminating a first member 51a located on the upper surface side in FIG. 11 and a second member 52 located on the lower surface side. The first member 51 has a holder hole 55 composed of a small diameter portion 55a and a large diameter portion 55b having the same diameter as the small diameter portion 53a and the large diameter portion 53c, and the second member 52a has the same diameter as the small diameter portion 54a. The same number of holder holes 56 each having a small diameter portion 56a having a diameter equal to that of the medium diameter portion 54b and a large diameter portion 56c having a diameter equivalent to that of the large diameter portion 55b are formed. Yes.

  In the probe 2a, the flange portion 21b of the first plunger 21 abuts on a step portion formed by the small diameter portion 55a and the large diameter portion 55b, and the flange portion 22b of the second plunger 22 is in contact with the medium diameter portion 56b and the small diameter portion. By contacting the step formed by 56a, the probe 2a has a function of preventing the probe 2a from being removed from the probe holder 5a. Further, the main body portion 26a abuts on a step portion formed by the medium diameter portion 54b and the large diameter portion 56c.

(Embodiment 3)
FIG. 12 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the third embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same component as the component mentioned above in FIG. In the second embodiment described above, the first coil spring 24a and the second coil spring 25a have been described as having the same inner diameter and different spring constants. However, the first coil spring 24a and the second coil spring 25a are different from each other in the first embodiment. The coil spring 24b and the second coil spring 25 have different inner diameters.

  In the probe 2c according to the third embodiment, instead of the first plunger 21, the pipe body 26, the first coil spring 24a and the second coil spring 25a of the probe 2a described above, the first plunger 28, the pipe body 29, the first The first coil spring 24b and the second coil spring 25 are provided. The first coil spring 24b and the second coil spring 25 have different inner diameters and spring constants. When the spring constant of the first coil spring 24b is S3 and the spring constant of the second coil spring 25 is S4, S3 > S4 holds.

  The first plunger 28 has a distal end portion 28a (first distal end portion) having a tapered distal end shape, and a flange portion 28b extending from the proximal end side of the distal end portion 28a and having a diameter larger than the diameter of the distal end portion 28a ( A first flange portion), and a boss portion 28c (first boss portion) extending from an end portion on a side different from the side continuous with the tip portion 28a of the flange portion 28b and having a diameter smaller than the diameter of the flange portion 28b, A housing portion 28d (first housing portion) that extends from an end portion of the boss portion 28c that is different from the side that is continuous with the flange portion 28b, has a smaller diameter than the diameter of the boss portion 28c, and can be accommodated in the pipe body 29. On the same axis. The diameter of the boss part 28c is larger than the diameter of the boss part 22c. The length of the accommodating portion 28d in the extending direction is larger than the length of the accommodating portion 22d in the extending direction. The diameter of the accommodating portion 28d is equal to the diameter of the accommodating portion 22d.

  FIG. 13 is a cross-sectional view illustrating a configuration of a main part of the contact probe according to the third embodiment. The pipe body 29 is formed using a conductive material, for example, a metal material. The pipe body 29 includes a cylindrical main body portion 29a, a cylindrical first connecting portion 29b that is continuous with one end of the main body portion 29a, and has an outer diameter equal to the diameter of the boss portion 27c, and a cylindrical shape. And a second connecting portion 29c provided on the other end side of the main body portion 29a and having an outer diameter equal to the diameter of the boss portion 22c. The diameter of the outer periphery of the main body portion 29a is smaller than the diameter of the large diameter portion 53b and larger than the diameter of the medium diameter portion 54b. The first connecting portion 29b and the second connecting portion 29c have a stepped shape in which the diameter of the outer periphery on the tip side (the end on the side different from the end connected to the main body 29a) is reduced. The inner peripheral diameters of the main body portion 29a, the first connecting portion 29b, and the second connecting portion 29c are equal to the diameters of the accommodating portions 28d and 22d, respectively, and the pipe body 29 has a cylindrical shape with the diameter of the accommodating portions 28d and 22d. A hole 29d that is a hollow space is formed.

  In the probe 2c, the flange portion 28b of the first plunger 28 has a function of preventing the probe 2c from being removed from the probe holder 5 by coming into contact with the step portion formed by the small diameter portion 53a and the large diameter portion 53b. Further, since the spring constant of the first coil spring 24b is larger than the spring constant of the second coil spring 25, the main body portion 29a of the pipe body 29 is in contact with the step portion formed by the large diameter portion 53b and the medium diameter portion 54b. It touches.

  FIG. 14 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor package according to the third embodiment, and shows a state in which the contact probe is connected to the circuit board and the semiconductor package. .

  In the inspection of the semiconductor integrated circuit 100, when the circuit board 200 is attached to the holder member 4 and the semiconductor integrated circuit 100 is placed, the tip 27a comes into contact with the connection electrode 101 as shown in FIG. The tip 22a is in contact with the electrode 201. Due to the contact, a contact load is applied to the tip portions 28a and 22a, and the first coil spring 24b and the second coil spring 25 are compressed along the longitudinal direction. At this time, the accommodating portions 28d and 22d enter the hole 29d and are in contact with the wall surface of the hole 29d.

  Due to the difference in spring constant between the first coil spring 24b and the second coil spring 25, the main body portion 29a of the pipe body 29 is in contact with the step portion formed by the large diameter portion 53b and the medium diameter portion 54b. The coil spring 24b and the second coil spring 25 expand and contract independently from each other in accordance with contact loads applied to the tip portions 28a and 22a. In other words, the first coil spring 24b expands and contracts according to the contact load applied to the tip portion 28a, and the second coil spring 25 expands and contracts according to the contact load applied to the tip portion 22a.

  A test signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of the test is sent from the electrode 201 of the circuit board 200 to the semiconductor integrated circuit 100 via the second plunger 22, the pipe body 28, and the first plunger 27 of the probe 2c. The connection electrode 101 is reached. Thus, in the probe 2b, since the first plunger 28 and the second plunger 22 are conducted through the pipe body 29, the conduction path of the electric signal can be minimized.

  According to the above-described third embodiment, the probe 2c transmits the inspection signal from the circuit board 200 to the semiconductor integrated circuit 100 via the first plunger 28, the second plunger 22, and the pipe body 29, and the first A first coil spring 24b that is disposed between the plunger 27 and the pipe body 28 so as to be elastically connected therebetween, and a second coil that is disposed between the second plunger 22 and the pipe body 29 so as to be elastically connected therebetween. Since the spring 25 is provided and individually urged through the pipe body 29, conductivity can be improved while suppressing an increase in size.

  Further, according to the third embodiment described above, the spring constants of the first coil spring 24b and the second coil spring 25 are different, and the main body portion 29a of the pipe body 29 is divided into a large diameter portion 53b and a medium diameter portion 54b. Since the first coil spring 24b and the second coil spring 25 are made to expand and contract independently according to contact loads applied to the tip portions 28a and 22a, respectively, the first plunger 21 and the second plunger 22 can be set to have different contact loads, and the position of the pipe body can be controlled in the expansion and contraction directions of the first and second coil springs.

  In the second and third embodiments described above, the first coil spring 24a and the second coil spring 25a have been described as having different spring constants. However, the main body portions 26a and 29a of the pipe bodies 26 and 29 have a large diameter. The spring constant may be equivalent as long as the step is adjusted so as to contact the step formed by the portion 53b and the medium diameter portion 54b.

(Embodiment 4)
FIG. 15 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the fourth embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same component as the component mentioned above in FIG. In the first to third embodiments described above, the first plunger and the second plunger have different shapes, and the first and second coil springs have different shapes (diameters) and spring constants. In the probe 2d according to the fourth embodiment, the shapes of the first plunger and the second plunger and the shapes (spring constant) of the first and second coil springs are the same.

  The probe 2d according to the fourth embodiment includes a first plunger 61 (first contact member) that contacts a connection electrode of the semiconductor integrated circuit 100 and an inspection circuit when the semiconductor integrated circuit 100 is inspected. A second plunger 62 (second contact member) that contacts the electrode of the circuit board 200, a pipe body 63 that can accommodate one end of the first plunger 61 and one end of the second plunger 62, and the first plunger 61 and the pipe body. 63, the first coil spring 64 provided between the first plunger 61 and the pipe body 63 so as to be extendable and contracted, and the second plunger 62 and the pipe provided between the second plunger 62 and the pipe body 63. And a second coil spring 65 for connecting the body 63 in a telescopic manner. The first plunger 61, the second plunger 62, the pipe body 63, the first coil spring 64, and the second coil spring 65 constituting the probe 2d have the same axis.

  The first plunger 61 has a distal end portion 61a (first distal end portion) having a tapered distal end shape, and a flange portion 61b extending from the proximal end side of the distal end portion 61a and having a diameter larger than the diameter of the distal end portion 61a ( A first flange portion), and a boss portion 61c (first boss portion) extending from an end portion on a side different from the side continuous with the tip portion 61a of the flange portion 61b and having a smaller diameter than the diameter of the flange portion 61b, A housing portion 61d (first housing portion) that extends from the end of the boss portion 61c that is different from the side that is connected to the flange portion 61b, has a smaller diameter than the diameter of the boss portion 61c, and can be housed in the pipe body 63. On the same axis.

  The second plunger 62 has a distal end portion 62a (second distal end portion) having a tapered distal end shape, and a flange portion 62b extending from the proximal end side of the distal end portion 62a and having a diameter larger than the diameter of the distal end portion 62a ( A second flange portion), a boss portion 62c (second boss portion) extending from an end portion different from the side connected to the tip end portion 62a of the flange portion 62b and having a smaller diameter than the diameter of the flange portion 62b, and a boss portion An accommodating portion 62d (second accommodating portion) that extends from an end portion on a side different from the side continuous with the flange portion 62b of 62c and has a smaller diameter than the diameter of the boss portion 62c and can be accommodated in the pipe body 63. Have on the same axis. The second plunger 62 is formed using the same material as the first plunger 61 and has the same shape as the first plunger 61.

  The pipe body 63 is formed using a conductive material, for example, a metal material. The pipe body 63 includes a cylindrical main body portion 63a, a cylindrical main body portion 63a that is connected to one end of the main body portion 63a, and an outer peripheral diameter equal to the diameter of the boss portion 21c. Therefore, it has a second connecting portion 63c that is connected to the other end of the main body portion 63a and whose outer diameter is the same as that of the boss portion 62c. The inner peripheral diameters of the main body 63a, the first connecting part 63b, and the second connecting part 63c are equal to the diameters of the accommodating parts 61d and 62d, and the pipe body 63 has a cylindrical shape with the diameters of the accommodating parts 61d and 62d. A hole 63d, which is a hollow space formed, is formed. The diameter of the outer periphery of the first connecting portion 23b is the same as the diameter of the outer periphery of the second connecting portion 63c. That is, the diameters of the boss portions 61c and 62c, the outer diameter of the first connecting portion 63b, and the outer diameter of the second connecting portion 63c are the same. Moreover, the length of the axial direction of the 1st connection part 63b and the 2nd connection part 63c is equal. In other words, the pipe body 63 has a shape that is orthogonal to the axial direction and symmetrical with respect to a plane that passes through the center. In addition, the pipe body 63 may not only be made of a material having conductivity, but may be made of a part of an insulating material. The pipe body 63 only needs to have conductivity at least on the surface of the hole 63d by plating or the like.

  The first coil spring 64 is formed by winding a wire at a predetermined pitch. One end portion of the coil spring 64 is press-fitted into the boss portion 61c and is in contact with the flange portion 61b. On the other hand, the other end of the first coil spring 64 is press-fitted into the first connecting portion 63b and is in contact with a stepped portion formed by the main body 63a and the first connecting portion 63b. The inner diameter of the first coil spring 64 may be a length that can contact the flange portion 61b and the step portion formed by the main body portion 63a and the first connecting portion 63b. The first coil spring 64 may be joined to the first plunger 61 and / or the pipe body 63 by soldering.

  The second coil spring 65 is formed by winding a wire at a predetermined pitch. One end portion of the second coil spring 65 is press-fitted into the boss portion 62c and is in contact with the flange portion 62b. On the other hand, the other end portion of the coil spring 65 is press-fitted into the second connecting portion 63c and is in contact with a step portion formed by the main body portion 63a and the second connecting portion 63c. The inner diameter of the second coil spring 65 may be a length that can abut on the flange portion 62b and the step portion formed by the main body portion 63a and the second coupling portion 63c. The second coil spring 65 may be joined to the second plunger 62 and / or the pipe body 63 by soldering.

  Examples of the wire used for the first coil spring 64 and the second coil spring 65 include a material made of metal or resin. This material may be conductive or may be insulating. In the fourth embodiment, the first coil spring 64 and the second coil spring 65 are formed using the same material, and the coil spring has the same wire diameter, effective number of turns, and coil diameter, and has a spring constant. Equal to each other.

  In the probe 2d, the first plunger 61 and the second plunger 62, and the first coil spring 64 and the second coil spring 65 have the same shape, and the pipe body 63 has symmetry. Therefore, the probe 2d is orthogonal to the axial direction. And it has a symmetrical shape with respect to a plane passing through the center.

  Further, since the first plunger 61 and the second plunger 62, and the first coil spring 64 and the second coil spring 65 are manufactured using the same one, the first and second plungers and the first and second coils are produced. The springs can be manufactured in the same manufacturing process and the same manufacturing line.

  The first plunger 61 and the second plunger 62 are movable in the axial direction by the expansion and contraction action of the first coil spring 64 and the second coil spring 65. In a state where the probe 2d is held by the probe holder 3 and no external load (excluding gravity) is applied (see FIG. 15), a part of the accommodating portion 61d of the first plunger 61 is one end side of the hole 63d. The second plunger 62 is partly housed in the other end side of the hole 63d and in contact with the wall surface of the hole 63d.

  According to the above-described fourth embodiment, the probe 2d transmits the inspection signal from the circuit board 200 to the semiconductor integrated circuit 100 via the first plunger 61, the pipe body 63, and the second plunger 62, and the first A first coil spring 64 that is disposed between the plunger 61 and the pipe body 63 and connects the two in a telescopic manner, and a second coil that is disposed between the second plunger 62 and the pipe body 63 and that couples the two in a telescopic manner. Since the spring 65 is provided and individually urged through the pipe body 63, the conductivity can be improved while suppressing an increase in size.

  According to the fourth embodiment described above, since the first plunger 61 and the second plunger 62, and the first coil spring 64 and the second coil spring 65 are the same, the first and second plungers and the first and second plungers are the same. Manufacturing with a two-coil spring can be facilitated, and the manufacturing cost can be reduced.

  According to the fourth embodiment described above, since the accommodating portions 61d and 62d are caused to enter the hole portion 63d in a state where no external load is applied, the contact between the first and second plungers and the pipe body. Can be ensured.

  In the fourth embodiment described above, the probe 2d has been described as having a shape that is orthogonal to the axial direction and symmetrical with respect to a plane passing through the center, but has no symmetry (asymmetry). ()) Shape. For example, one of the tip portions 61a and 62a may have a plurality of tapered claws like the tip portion 21a described above, or both of the tip portions 61a and 62a. May have a plurality of nails. Conversely, the tip portion 21a may have a weight shape like the tip portion 61a.

  Further, in the above-described fourth embodiment, it has been described that the accommodating portion 61d and the accommodating portion 62d are in contact with the wall surface of the hole 63d in a state where no external load is applied. As in the modified example of the first embodiment, the accommodation portion 62d may be separated without being accommodated in the pipe body 23. In this case, it can be realized by changing the length of the accommodating portion 62d or changing the length (effective number of turns or pitch) of the first coil spring 64 or the second coil spring 65 in the winding axis direction.

  Moreover, in Embodiment 1-4 mentioned above, although the accommodating parts 21d, 21e, 22d, and 28d demonstrated as what makes the column shape which has a uniform diameter, the shape by which the front-end | tip is chamfered, a weight shape, A hemispherical shape or the like having a diameter that decreases toward the tip is preferable in terms of stable insertion into the holes 23d, 26d, 27e, and 29d.

  FIG. 16 is a schematic diagram illustrating another example of the configuration of the main part of the contact probe according to the first to fourth embodiments of the present invention, and is a diagram illustrating a modified example of the accommodation unit. For example, like an accommodating portion 21f shown in FIG. 16, an extending portion 211 that extends from an end portion of the boss portion 21c that is different from the side continuous with the flange portion 21b and has a smaller diameter than the diameter of the boss portion 21c. The base portion 212 may extend from the end portion of the extending portion 211 that is different from the side that is connected to the boss portion 21c and has a larger diameter than the diameter of the extending portion 211. The base end portion 212 has a cylindrical shape and has a diameter substantially equal to that of the hole portion 23d. In the accommodating part 21f, since the distance between the extending part 211 and the inner periphery of the first coil spring 24 can be made larger than that in the accommodating part 21d, it is effective as a countermeasure against hysteresis.

  FIG. 17 is a schematic diagram illustrating another example of the configuration of the main part of the contact probe according to the first to fourth embodiments of the present invention, and is a diagram illustrating a modified example of the accommodation unit. For example, the accommodating portion 21g shown in FIG. 17 has a base end portion 213 whose side surface is spherical instead of the base end portion 212 described above. The base end portion 213 has a maximum diameter (a length in a direction perpendicular to the central axis of the accommodating portion 21g) substantially equal to the hole portion 23d. Even in the case where the first plunger 21 is inclined in the accommodating portion 21g, the side surface is spherical, so that the base end portion 213 can be brought into contact with the wall surface of the hole 23d, and countermeasures against hysteresis are taken. Also effective.

  FIG. 18 is a schematic diagram illustrating another example of the configuration of the main part of the contact probe according to the first to fourth embodiments of the present invention, and is a diagram illustrating a modified example of the housing unit. FIG. 18A shows a side view of the housing portion, and FIG. 18B shows a bottom view of the housing portion. In the modification shown in FIG. 18, for example, a notch C <b> 1 that is notched along the longitudinal direction from the tip is provided in the accommodating portion 21 g shown in FIG. 17. As a result, a spring property is imparted to the tip of the accommodating portion 21g so that it can be expanded and contracted in a direction orthogonal to the longitudinal direction, thereby improving the insertability of the pipe body into the hole and the contact with the inner wall surface of the hole. be able to.

  In addition, the shape of the accommodating parts 21f and 21g described above can also be applied to the accommodating parts 22d and 28d. In addition, each housing portion may be a combination of any of the shapes described above, for example, by replacing the housing portion 22d of the first embodiment with the shape of the housing portion 21f described above. Also good.

  In addition, the pipe bodies according to the first to fourth embodiments described above may be not only all made of a conductive material but also partly made of an insulating material. The pipe body should just have electroconductivity at least by the surface of a hole part by a plating process.

  In the first to fourth embodiments described above, the housing portions 21d and 28d of the first plungers 21 and 28 are described as being longer than the housing portion 22d of the second plunger 22, but the housing portion 22d of the second plunger 22 is used. However, it may be longer than the accommodating portions 21d, 28d of the first plungers 21, 28. In this case, the spring constants of the second coil springs 25 and 25a may be larger than the spring constants of the first coil springs 24a and 24b.

  In the above-described first to fourth embodiments, the diameters formed by winding the first and second coil springs are described as being uniform. However, some of the diameters may be different. For example, in the first coil spring, the diameters at both ends are slightly smaller than the outer diameter of the object to be connected (first connecting part or boss part), and the diameters other than both ends (center part) are set to the first connecting part or boss part. The diameter of the larger one is made larger. Thereby, the expansion / contraction operation of the first coil spring can be stabilized without reducing the diameter of the tip of the first connecting portion.

  Moreover, each boundary wall surface of the large diameter part and small diameter part of each front-end | tip part side of each flange part and a holder hole may make a taper shape. Thereby, positioning in the direction perpendicular to the axial direction of the probe when the probe is attached to the holder can be performed more reliably.

  In the first to fourth embodiments described above, the connection electrode has been described as having a hemispherical shape, but it may be a flat lead used in a QFP (Quad Flat Package) or the like.

  The first to fourth embodiments and the modifications described above are merely examples for carrying out the present invention, and the present invention is not limited to these. Further, the present invention can form various inventions by appropriately combining a plurality of constituent elements disclosed in the respective embodiments and modifications. It is obvious from the above description that the present invention can be variously modified according to specifications and the like, and that various other embodiments are possible within the scope of the present invention.

  As described above, the probe unit and the contact probe according to the present invention are useful for improving the conductivity while suppressing an increase in size.

1 Probe unit 2, 2a, 2b, 2c, 2d Contact probe (probe)
3, 5, 5a Probe holder 4 Holder member 21, 28, 61 First plunger 21a, 22a, 28a, 61a, 62a Tip portion 21b, 22b, 28b, 61b, 62b Flange portion 21c, 22c, 28c, 61c, 62c Boss Part 21d, 21e, 21f, 21g, 22d, 28d, 61d, 62d Housing part 22, 62 Second plunger 23, 26, 27, 29, 63 Pipe body 23a, 26a, 27a, 29a, 63a Body part 23b, 26b, 27b, 29b, 63b 1st connection part 23c, 26c, 27c, 29c, 63c 2nd connection part 23d, 26d, 27e, 29d, 63d Hole part 27d Protrusion part 24, 24a, 24b, 64 1st coil spring 25, 25a , 65 Second coil spring 31, 51, 51a First member 32, 52, 52a 2 member 33, 34, 53, 54, 55, 56 Holder hole 33a, 34a, 53a, 54a, 55a, 56a Small diameter part 33b, 34b, 53b, 55b, 56c Large diameter part 54b Medium diameter part 100 Semiconductor integrated circuit 101 Connection Electrode 200 Circuit board 201 Electrode 211 Extension part 212,213 Base end part

Claims (7)

Conductive first and second contact members that are in contact with two different contact bodies in the longitudinal direction, respectively, and end portions of the first and second contact members that are in contact with the contacted body Is a pipe body having a conductive hole that can be accommodated while contacting ends on different sides, one end connected to the outer periphery of the first contact member around the longitudinal axis, and the other end is one end of the pipe body. The first contact member and the pipe body are connected by connecting to an outer peripheral portion around a central axis on the side , and a first coil spring that is extendable and contractible in the connecting direction, and one end around the longitudinal axis of the second contact member The second contact member and the pipe body are connected by connecting the other end to the outer periphery around the central axis on the other end side of the pipe body, and the second contact member and the pipe body can be expanded and contracted in the connecting direction. Two coil springs; A plurality of contact probes having,
A probe holder for holding the contact probe;
A probe unit comprising: The first contact member is
A first tip having a tapered tip shape and contacting one of the contacted bodies;
A first flange portion extending from a proximal end side of the first distal end portion and having a diameter larger than a diameter of the first distal end portion;
The first flange portion extends from an end portion on a different side from the side connected to the first tip portion, has a smaller diameter than the diameter of the first flange portion, and is connected to the first coil spring. The boss,
A first accommodating portion that extends from an end of the first boss portion that is different from the side that is continuous with the first flange portion, and that can be accommodated in the hole portion;
On the same axis,
The second contact member is
A second tip portion having a tapered tip shape and in contact with the other contacted body;
A second flange portion extending from a proximal end side of the second tip portion and having a diameter larger than the diameter of the second tip portion;
The second flange portion extends from an end portion on a different side from the side connected to the second tip portion, has a smaller diameter than the diameter of the second flange portion, and is connected to the second coil spring. The boss,
A second accommodating portion that extends from an end of the second boss portion that is different from the side that is continuous with the second flange portion, and that can be accommodated in the hole portion;
On the same axis,
The probe holder is
First and second small diameter portions that can be inserted through the first and second tip portions, respectively;
A large diameter portion connected to the first small diameter portion at one end and connected to the second small diameter portion at the other end, and having a diameter larger than the diameters of the first and second small diameter portions;
Have
The first flange portion abuts on a step portion formed by the first small diameter portion and the large diameter portion,
The probe unit according to claim 1, wherein the second flange portion abuts on a step portion formed by the second small diameter portion and the large diameter portion. The first contact member is
A first tip having a tapered tip shape and contacting one of the contacted bodies;
A first flange portion extending from a proximal end side of the first distal end portion and having a diameter larger than a diameter of the first distal end portion;
The first flange portion extends from an end portion on a different side from the side connected to the first tip portion, has a smaller diameter than the diameter of the first flange portion, and is connected to the first coil spring. The boss,
A first accommodating portion that extends from an end of the first boss portion that is different from the side that is continuous with the first flange portion, and that can be accommodated in the hole portion;
On the same axis,
The second contact member is
A second tip portion having a tapered tip shape and in contact with the other contacted body;
A second flange portion extending from a proximal end side of the second tip portion and having a diameter larger than the diameter of the second tip portion;
The second flange portion extends from an end portion on a different side from the side connected to the second tip portion, has a smaller diameter than the diameter of the second flange portion, and is connected to the second coil spring. The boss,
A second accommodating portion that extends from an end of the second boss portion that is different from the side that is continuous with the second flange portion, and that can be accommodated in the hole portion;
On the same axis,
The pipe body is
The main body,
A first connecting part that is connected to one end of the main body part and has an outer diameter equal to the diameter of the first boss part and connected to the first coil spring;
A second connecting part that is connected to the other end of the main body part and has the same outer diameter as that of the second boss part and is connected to the second coil spring;
Have
The probe holder is
First and second small diameter portions that can be inserted through the first and second tip portions, respectively;
A large diameter portion connected to the first small diameter portion at one end and having a diameter larger than the diameters of the first and second small diameter portions;
A medium diameter portion provided between the second small diameter portion and the large diameter portion, larger than the diameter of the second small diameter portion, and smaller than the diameter of the large diameter portion;
Have
The first flange portion abuts on a step portion formed by the first small diameter portion and the large diameter portion,
The second flange portion abuts on a step portion formed by the second small diameter portion and the medium diameter portion,
2. The probe unit according to claim 1, wherein the main body abuts against a step formed by the large diameter portion and the medium diameter portion.   4. The probe unit according to claim 2, wherein the first and second receiving portions have different lengths in the connecting direction. 5.   The probe unit according to any one of claims 1 to 4, wherein the first and second coil springs have different spring constants.   When the length in the connecting direction of the first accommodating portion among the first and second accommodating portions is larger than the length in the connecting direction of the second accommodating portion, the spring constant of the first coil spring is the second. The spring constant of the second coil spring is greater than the spring constant of the coil spring, and the length of the second housing portion in the connecting direction is greater than the length of the first housing portion in the connecting direction. The probe unit according to claim 5, wherein the probe unit is larger than a spring constant of the coil spring. Conductive first and second contact members that are in contact with two different contact objects in the longitudinal direction, respectively,
A pipe body having a conductive hole portion that can be accommodated while contacting an end portion on a side different from an end portion on the side contacting the contacted body of the first and second contact members;
One end is connected to the outer peripheral portion around the longitudinal axis of the first contact member, and the other end is connected to the outer peripheral portion around the central axis on the one end side of the pipe body, thereby connecting the first contact member and the pipe body. A first coil spring that is extendable and contractible in the connecting direction;
One end is connected to the outer peripheral portion around the longitudinal axis of the second contact member, and the other end is connected to the outer peripheral portion around the central axis on the other end side of the pipe body, whereby the second contact member and the pipe body are A second coil spring that is connected and stretchable in the connecting direction;
A contact probe comprising:

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