JP6318836B2 - Substrate for transfer and transfer sheet - Google Patents

Description

  The present invention relates to a transfer substrate and a transfer sheet produced using the same. More specifically, the present invention relates to a transfer base material that constitutes a transfer sheet that is suitably used for manufacturing semiconductors and various electronic components.

Nanoimprint technology that allows nanoscale processing at a simpler and lower cost than conventional lithography, which is the core technology of semiconductor lithography, and electron beam direct writing, has attracted attention.
The nanoimprint technology is a molding technique in which a transfer sheet on which a nanoscale uneven pattern is formed is pressed against a substrate coated with a resin thin film, and the uneven pattern is transferred to the resin thin film.

Nanoimprint technology can be broadly divided into thermal cycling and photocuring. The thermal cycle method is also called thermal nanoimprint, and is a method in which a transfer sheet (mold) having a concavo-convex pattern made of a metal such as nickel is hot pressed onto a thermoplastic resin.
On the other hand, in the photocuring method, a transparent sheet such as polyethylene terephthalate (PET) is used as a transfer base material, and a transfer sheet in which a nanoscale uneven pattern is formed on the base material is applied onto the substrate. An uneven pattern can be obtained by transferring to a thin film of a photocurable resin (see Patent Documents 1 and 2).

International Publication No. 2009/148138 Pamphlet International Publication 2012/018043 Pamphlet

  However, the nanoimprint technology used for the manufacture of precision parts such as semiconductors requires extremely high transfer accuracy, and even a slight transfer deviation causes a failure. Therefore, when continuous transfer by roll-to-roll is performed between the transfer sheet and the substrate by the photocuring method, if the resin such as PET having a large linear expansion coefficient or elongation is used as the transfer substrate, the transfer sheet is tensioned and stretched. When this occurs, an increase in the defect rate due to transfer misalignment and a resulting decrease in yield are problems.

  On the other hand, a glass film exists as a transparent material having a small linear expansion coefficient and elongation. However, if a glass film is used as a transfer substrate, there is a concern that the glass film is easily damaged when peeled off after transfer, and handling properties are poor.

In addition, among transparent resins, it is conceivable to use a resin having a relatively small linear expansion coefficient, such as polyimide, as a transfer substrate. Depending on the degree, there is a possibility that a transfer deviation similarly occurs.
In addition, such special engineering plastics are considerably more expensive than general-purpose resins such as PET, and it is considered that there is a great need for cheaper materials as a base material for transfer sheets consumed in the process.

As a result of intensive studies in view of the above problems, the inventors of the present invention have a specific transfer substrate having a thermoplastic resin layer and a glass film layer, which is excellent in peel resistance and transparency, and no transfer deviation occurs. The present inventors have found that the substrate for transfer has good handling properties and have completed the present invention.
That is, the present invention is as follows.

[1] A thermoplastic resin layer having a thermoplastic resin as a main component and a concavo-convex pattern for transfer on the outer surface and a glass film layer, and a thickness ratio of the thermoplastic resin layer to the glass film layer (= Thermoplastic resin layer / glass film layer) is 0.15 or more and 10 or less, and the transfer substrate has a total thickness of 45 μm or more and 500 μm or less.
[2] The transfer substrate according to [1], which has an adhesive layer between the thermoplastic resin layer and the glass film layer.
[3] The substrate for transfer according to [1] or [2], wherein the thermoplastic resin layer has a tensile elongation at break of 50% or more and 400% or less and a tensile strength at break of 20 MPa or more.
[4] The substrate for transfer according to any one of [1] to [3], wherein the thermoplastic resin layer contains a polyester resin as a main component.
[5] The transfer substrate according to any one of [1] to [4], wherein the thermoplastic resin layer has a total light transmittance of 80% or more and a total haze of 5% or less.
[6] The transfer substrate according to any one of [1] to [5], wherein the thermoplastic resin layer has an ultraviolet transmittance of 70% or more.
[7] A transfer sheet provided with a transfer uneven pattern on the outer surface of the thermoplastic resin layer of the transfer substrate according to any one of [1] to [6].

  According to the present invention, it is possible to provide a transfer substrate that is excellent in peel resistance and transparency, does not cause transfer deviation, and has good handling properties. According to the transfer sheet using this, a semiconductor or electronic Precise continuous transfer by roll-to-roll is possible for parts and the like.

  Hereinafter, the transfer substrate of the present invention (hereinafter also referred to as “present substrate”), a transfer sheet produced using the present substrate (hereinafter also referred to as “present sheet”), and materials constituting them This will be described in detail.

<Thermoplastic resin layer>
The thermoplastic resin layer in the base material has a very important role of forming an uneven pattern for transfer on the outer surface thereof, and at the same time has a function of improving the peel resistance and handling properties of the base material. . Moreover, it is calculated | required that it has the function to hold | maintain transparency of this base material.
By forming a concavo-convex pattern for transfer on the outer surface of the thermoplastic resin layer of the base material and using it as the transfer surface of the transfer sheet, the transfer sheet is damaged when peeling after transfer without causing transfer displacement during transfer. There is nothing.

The thermoplastic resin that can be used for the thermoplastic resin layer is not particularly limited as long as it is highly transparent and has a suitable elongation and strength.
Specific examples include polyester resins, polyolefin resins, polycarbonate resins, acrylic resins, polystyrene resins, and polyamide resins. Among these resins, polyester resins, polyolefin resins, and polycarbonate resins are preferable from the viewpoint of higher transparency and more appropriate elongation and strength, and polyester resins are particularly preferable.

Polyester resins that can be used in the thermoplastic resin layer include copolymers of various polycarboxylic acids and polyhydric alcohols, homopolymers of various hydroxycarboxylic acids, polyhydric carboxylic acids, polyhydric alcohols, and hydroxycarboxylic acids. Preferred examples include acid copolymers.
Among them, from the viewpoint of high transparency and appropriate elongation and strength, a copolymer mainly composed of terephthalic acid and ethylene glycol (so-called polyethylene terephthalate) and a copolymer mainly composed of naphthalene dicarboxylic acid and ethylene glycol ( So-called polyethylene naphthalate is particularly preferred. Further, these copolymers may be copolymerized with a third component such as isophthalic acid, for example.

  Examples of polyolefin resins that can be used in the thermoplastic resin layer include homopolymers of various α-olefins such as ethylene, propylene, 1-butene, and 4-methyl-1-pentene, and combinations of two or more α-olefins. Examples thereof include a polymer and a copolymer of an α-olefin and another compound (for example, vinyl acetate, various acrylic esters, various methacrylic esters, etc.). In addition, those modified with acids, bases, etc., and so-called ionomers can also be used.

The polycarbonate resin that can be used for the thermoplastic resin layer is not particularly limited as long as it is a resin having a carbonate bond obtained by condensation polymerization of various diols (dihydric alcohol) and carbonic acid diester.
Here, various diols include aromatic diols such as bisphenol-A and various fluorene compounds, aliphatic diols such as 1,3-butanediol, 1,6-hexanediol, and diethylene glycol, cyclohexanedimethanol, isosorbide, and tricyclo Examples include alicyclic diols such as decanedimethanol and spiroglycol. These diols may be used alone or in combination of two or more.
Moreover, as a carbonic acid diester, a diphenyl carbonate is illustrated preferably.

The thickness of the thermoplastic resin layer is preferably 10 μm or more and 300 μm or less, more preferably 15 μm or more and 250 μm or less from the viewpoint that the thermoplastic resin layer has a function of improving the peel resistance and handling properties of the substrate. 20 μm or more and 200 μm or less is particularly preferable.
If the thickness of the thermoplastic resin layer is 10 μm or more, the transfer sheet prepared using the substrate is less likely to be damaged when it is peeled off after transfer. On the other hand, when the thickness of the thermoplastic resin layer is 300 μm or less, the flexural elasticity of the base material does not become too large, and the peelability becomes good when peeling after transfer.
In addition, it is preferable to adjust the thickness of a thermoplastic resin layer so that thickness ratio may become in the predetermined range mentioned later in relation to the thickness of the glass film layer mentioned later.

From the viewpoint that the thermoplastic resin layer has a function of maintaining the transparency of the substrate, the total light transmittance is preferably 80% or more, more preferably 85% or more, and 90% or more. It is particularly preferred.
Further, the total haze is preferably 5% or less, more preferably 4% or less, and particularly preferably 3% or less.
When the total light (visible light) transmittance of the thermoplastic resin layer is 80% or more and the total haze is 5% or less, the substrate is excellent in transparency, and is transferred with a transfer sheet prepared using the substrate. At this time, light can be transmitted so that the photocurable resin on the transfer side can be sufficiently cured in a short time.
The total light transmittance and the total haze are measured by the methods described in Examples described later.

When the photocurable resin on the transfer side is an ultraviolet curable resin, the ultraviolet transmittance of the thermoplastic resin layer is preferably 70% or more, more preferably 75% or more, and 80 % Or more is particularly preferable.
The ultraviolet transmittance is measured by the method described in Examples described later.

  As described above, when the thermoplastic resin layer has an appropriate elongation and strength, the substrate can be excellent in peeling resistance and handling properties, and a transfer sheet free from transfer deviation can be formed. The moderate elongation and strength can be evaluated more quantitatively by tensile elongation at break and tensile strength at break.

That is, the tensile elongation at break of the thermoplastic resin layer at 23 ° C. is preferably 50% or more and 400% or less, more preferably 60% or more and 300% or less, and 70% or more and 200% or less. It is particularly preferred that
Further, the tensile strength at 23 ° C. of the thermoplastic resin layer is preferably 20 MPa or more, more preferably 50 MPa or more, further preferably 100 MPa or more, and particularly preferably 150 MPa or more.

If the elongation at break of the thermoplastic resin layer at 23 ° C. is 50% or more and 400% or less, it can be peeled well when it is peeled off after transfer with a transfer sheet prepared using this substrate. Misalignment can also be prevented.
Moreover, if the breaking strength at 23 ° C. of the thermoplastic resin layer is 20 MPa or more, the film can be peeled without breaking when it is peeled off after transfer by a transfer sheet produced using the substrate.
The tensile elongation at break and the tensile strength at break of the thermoplastic resin layer are measured according to JIS K7162 (1994) by the method described in the examples described later.

  The thermoplastic resin layer may contain various additives in addition to the above-described thermoplastic resin as long as the effects of the present invention are not impaired.

<Glass film layer>
The glass film layer on the base material has a function of preventing elongation when the transfer sheet is tensioned when transferring with a transfer sheet produced using the base material, and as a result, preventing transfer displacement. It is a layer which has. Moreover, it is calculated | required that it has the function to hold | maintain transparency of this base material.

  The glass that can be used for the glass film layer is not particularly limited as long as it has high transparency and can prevent elongation of the substrate. Specifically, soda lime glass, borosilicate glass, non-alkali glass and the like can be exemplified.

The thickness of the glass film layer is preferably 10 μm or more and 300 μm or less, more preferably 15 μm or more and 250 μm or less, and particularly preferably 20 μm or more and 200 μm or less.
When the thickness of the glass film layer is 10 μm or more, it is possible to prevent elongation when the transfer sheet is tensioned when performing transfer with a transfer sheet prepared using the present substrate, and as a result, transfer deviation. Can be prevented. On the other hand, if the thickness of the glass film layer is 300 μm or less, the flexural elasticity of the base material does not become too large, and the peelability becomes good when peeling after transfer.
In addition, it is preferable to adjust the thickness of a glass film layer so that thickness ratio may become in the predetermined range mentioned later in relation to the thickness of the said thermoplastic resin layer.

The glass film layer preferably has a total light transmittance of 80% or more, more preferably 85% or more, and 90% or more from the viewpoint of having a function of maintaining the transparency of the substrate. It is particularly preferred.
Further, the total haze is preferably 5% or less, more preferably 4% or less, and particularly preferably 3% or less.
When the total light (visible light) transmittance of the glass film layer is 80% or more and the total haze is 5% or less, the substrate is excellent in transparency, and is transferred with a transfer sheet prepared using the substrate. In addition, light can be transmitted so that the photocurable resin on the transfer side can be sufficiently cured in a short time.
The total light transmittance and the total haze are measured by the methods described in Examples described later.

Further, when the photocurable resin on the transfer side is an ultraviolet curable resin, the ultraviolet transmittance of the glass film layer is preferably 80% or more, more preferably 85% or more, and 90%. The above is particularly preferable.
The ultraviolet transmittance is measured by the method described in Examples described later.

  As the glass of the glass film layer, commercially available products can be used. Specifically, for example, a product name “Spool” manufactured by Asahi Glass Co., Ltd., a product name “Willow Glass” manufactured by Corning, and a product manufactured by Nippon Electric Glass Co., Ltd. An example of the product name is “OA-10G”.

<Adhesive layer>
In this substrate, the thermoplastic resin layer and the glass film layer can be directly laminated if they have good interlayer adhesion as described later, but the interlayer adhesion is further improved and this substrate is used. From the viewpoint of surely preventing transfer deviation when performing transfer using the transfer sheet prepared in this manner, it is preferable to provide an adhesive layer between the thermoplastic resin layer and the glass film layer.

The material that can be used for the adhesive layer is not particularly limited as long as it exhibits sufficient interlayer adhesion between the thermoplastic resin layer and the glass film layer and does not impair the transparency and handling properties of the substrate. For example, a known ultraviolet curable adhesive or a thermosetting adhesive can be used.
Moreover, as a form of the material used, even if it is a liquid form and is used by application | coating, it is shape | molded in the shape of a film of predetermined thickness beforehand, and may be used by laminating.

The thickness of the adhesive layer is preferably 1 μm or more and 30 μm or less, more preferably 3 μm or more and 28 μm or less, and particularly preferably 5 μm or more and 25 μm or less.
If the thickness of the adhesive layer is 1 μm or more, the interlayer adhesiveness between the thermoplastic resin layer and the glass film layer is sufficiently expressed, and transfer deviation at the time of performing transfer with a transfer sheet prepared using this substrate can be prevented. In addition, when peeling the base material after the transfer, the possibility that the base material is damaged due to peeling between the thermoplastic resin layer and the glass film layer is reduced. In addition, if the thickness of the adhesive layer is 30 μm or less, there is little risk of impairing the transparency of the base material, and warping or loosening of the base material due to curing shrinkage when the adhesive layer is cured can be suppressed.

<Transfer base material>
This base material has the thermoplastic resin layer for forming a concavo-convex pattern for transfer on the outer surface thereof and the glass film layer, and further, if necessary, between the thermoplastic resin layer and the glass film layer. Having the adhesive layer.

In this base material, the thickness ratio of the thermoplastic resin layer and the glass film layer is important, and the lower limit of the thickness ratio (= thermoplastic resin layer / glass film layer) is 0.15 or more. It is important that it is 0.4 or more, more preferably 0.8 or more. If the thickness ratio between the thermoplastic resin layer and the glass film layer is 0.15 or more, the glass can be peeled off without being damaged during peeling after the transfer with the transfer sheet prepared using the substrate.
On the other hand, it is important that the upper limit of the thickness ratio of the thermoplastic resin layer and the glass film layer is 10 or less, more preferably 7 or less, further preferably 5 or less, and further 3 or less. It is particularly preferred that If the thickness ratio between the thermoplastic resin layer and the glass film layer is 10 or less, transfer deviation due to elongation of the thermoplastic resin layer can be suppressed.

  Moreover, this base material may have other layers other than the above-mentioned three types of layers as needed, as long as the effect is not impaired. However, in this base material, it is preferable not to provide another layer on the outer surface of the thermoplastic resin layer.

  As other layers, for example, in order to protect the glass film layer, a protective layer provided on the outer surface of the glass film layer, or in order to improve the interlayer adhesion between the glass film layer and the adhesive layer, the glass Examples thereof include a primer layer provided between the film layer and the adhesive layer.

  The manufacturing method of this base material is not specifically limited. For example, a thermal laminating method in which a thermoplastic resin sheet prepared in advance for use as a thermoplastic resin layer and a glass film prepared in advance for use as a glass film layer are heated and laminated while directly laminated, or on a glass film In addition, there is an extrusion laminating method in which the thermoplastic resin is cooled and cooled by a cooling roll or the like while melt-extruding from the die, and at the same time, the thickness of the thermoplastic resin layer is adjusted.

  In the case where an adhesive layer is not provided on the base material, in order to improve interlayer adhesion between the thermoplastic resin layer and the glass film layer, for example, the surface of a thermoplastic resin sheet or glass film prepared in advance, Surface treatment such as plasma treatment or corona treatment may be performed to the extent that the effect of the substrate is not impaired.

  On the other hand, when an adhesive layer is provided on the base material, for example, after forming an adhesive layer on one side surface of a previously prepared thermoplastic resin sheet by coating or dry lamination, a glass film is further laminated, The method of manufacturing this substrate by curing the adhesive layer by drying and ultraviolet irradiation, and after forming the adhesive layer on one surface of the glass film, further laminating a thermoplastic resin sheet, heating and drying, ultraviolet irradiation etc. Examples thereof include a method for producing the substrate by curing the adhesive layer.

It is important that the total thickness of the base material is 45 μm or more and 500 μm or less, more preferably 55 μm or more and 400 μm or less, and particularly preferably 70 μm or more and 300 μm or less.
If the total thickness of the substrate is 45 μm or more, it is easy to handle at the time of transferring the concave / convex pattern. Moreover, if the total thickness of this base material is 500 micrometers or less, the precise transcription | transfer by a roll to roll will be attained.

The substrate is excellent in transparency, and the total light (visible light) transmittance is preferably 80% or more, more preferably 85% or more, and particularly preferably 90% or more. The total haze is preferably 10% or less, more preferably 8% or less, and particularly preferably 6% or less.
If the total light transmittance of the substrate is 80% or more and the total haze is 10% or less, the substrate is excellent in transparency, and is transferred when transferring with a transfer sheet prepared using the substrate. The light can be transmitted so that the photocurable resin on the side can be sufficiently cured in a short time.
The total light transmittance and the total haze are measured by the methods described in Examples described later.

When the photocurable resin on the transfer side is an ultraviolet curable resin, the ultraviolet transmittance of the substrate is preferably 70% or more, more preferably 75% or more, and 80%. The above is particularly preferable.
The ultraviolet transmittance is measured by the method described in Examples described later.

Since the base material is provided with a concave / convex pattern on the outer surface of the thermoplastic resin layer to form a transfer surface, the base material is excellent in peel resistance when it is peeled off after being transferred by a transfer sheet prepared using the base material. Peel resistance is evaluated by the maximum peel strength (peel strength) at which the substrate is not damaged in a 90 ° peel test after transfer, and is preferably 0.2 N / cm or more, preferably 0.5 N / cm or more. More preferably, it is 1.0 N / cm or more. On the other hand, the upper limit of the peel resistance is not particularly limited, and is preferably as high as possible.
In addition, measurement / evaluation of peeling-resistant strength is implemented by the method as described in the below-mentioned Example.

The peel strength between the thermoplastic resin layer and the glass film layer of the substrate is preferably 1 N / cm or more, more preferably 3 N / cm or more, and particularly preferably 5 N / cm or more. On the other hand, the upper limit of the delamination strength is not particularly limited and is preferably as high as possible.
When the delamination strength between the thermoplastic resin layer and the glass film layer is 1 N / cm or more, there is no transfer misalignment when transferring with a transfer sheet prepared using the base material, and the base material is There is little risk of damage.
In addition, the delamination strength of a thermoplastic resin layer and a glass film layer is measured by the method as described in the below-mentioned Example.

<Transfer sheet>
In this sheet, an uneven pattern for transfer is provided on the outer surface of the thermoplastic resin layer of the substrate.
The formation method of the uneven | corrugated pattern for transcription | transfer is not specifically limited. Specifically, for example, a layer of a photocurable resin or a thermosetting resin is first provided on the outer surface of the thermoplastic resin layer by coating or laminating.

  Next, a master sample for forming an uneven pattern for transfer is prepared. The master sample may be a flat plate shape or a roll shape. The master sample may be made of any material such as resin or metal, but is preferably a material having high shape stability. For example, if this sheet is a transfer sheet relating to the manufacture of a semiconductor wafer, it is preferably a crystal silicon original plate relating to the semiconductor wafer.

By using this master sample, the uneven pattern for transfer can be obtained by transferring the uneven pattern to the photo-curing resin or thermosetting resin layer provided on the outer surface of the thermoplastic resin layer as described above and curing it quickly. Form a pattern.

  Thus, precise continuous transfer by roll-to-roll can be efficiently performed using this sheet in which the uneven pattern for transfer is formed on the outer surface of the thermoplastic resin layer.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to the aspect as described in a following example.
In addition, measurement and evaluation in the examples were performed by the following methods and standards.

<Measurement / Evaluation>
(1) Total light (visible light) transmittance and total haze According to JIS K7136 (2000) and JIS K7361-1 (1997), using a haze meter “NDH5000” manufactured by Nippon Denshoku Industries Co., Ltd. Total haze and total light transmittance were measured.

(2) Ultraviolet transmittance The ultraviolet transmittance at a wavelength of 360 nm was measured using Hitachi High-Technologies Hitachi Spectrophotometer “U-3900H”.

(3) Peel resistance after transfer (90 ° peel test)
First, three types of adhesive sheets each having adhesive strengths of 0.15 N / cm, 0.30 N / cm, and 1.37 N / cm were prepared. Subsequently, this pressure-sensitive adhesive sheet was fixed on a 20 mm thick aluminum plate with a double-sided tape so that the pressure-sensitive adhesive surface was on top. The transfer surface of the produced transfer substrate was bonded to this adhesive surface so that air did not enter. Next, the transfer substrate was gently peeled by 90 ° by hand, and the presence or absence of breakage of the glass film at each adhesive strength was visually observed and evaluated according to the following criteria.
○: The glass film layer is not damaged.
X: The glass film layer is damaged.

(4) Interlaminar peel strength of transfer substrate (180 ° peel test)
In the produced substrate for transfer, the peel strength when the thermoplastic resin layer and the glass film layer were peeled by a 180 ° peel test was defined as the delamination strength. The 180 ° peel test was performed in accordance with JIS K6854-2 (1999), using an orientec Tensilon universal testing machine at an ambient temperature of 25 ° C. and a peel rate of 5 cm / min. The unit of delamination strength was N / cm.

(5) Tensile rupture elongation / tensile rupture strength A sample having a width of 10 mm and a length of 100 mm was cut out in the longitudinal direction and the width direction of the film. The sample was allowed to stand for 12 hours in an atmosphere of 23 ° C. and 35% RH, and then according to JIS K 7162 (1994), “Autograph AG5000A” manufactured by Shimadzu Corporation under an atmosphere of 23 ° C. and 35% RH. The test was conducted under the conditions of a distance between chucks of 40 mm and a pulling speed of 200 mm / min, and the elongation ratio and load when the sample broke were measured. This was repeated 5 times, and the average value of the measurement results of 10 times in the longitudinal direction and the width direction was taken as the tensile rupture elongation and tensile rupture strength of the sample.

[Example 1]
As a thermoplastic resin layer, a polyethylene terephthalate biaxially stretched film (“T100-38” manufactured by Mitsubishi Plastics, Inc., thickness: 38 μm, total light transmittance: 88%, total haze: 3%, ultraviolet transmittance: 83%, Tensile elongation at break: 114%, tensile strength at break: 192 MPa). Further, a glass film used for the glass film layer (“OA-10G” manufactured by Nippon Electric Glass Co., Ltd., thickness: 40 μm, total light transmittance: 92%, total haze: 0.2%, UV transmittance: 92%) Prepared. On one surface of the thermoplastic resin layer, an optical adhesive (“SK-1478” manufactured by Soken Chemical Co., Ltd.) was applied with a bar coater to a thickness of 25 μm to form an adhesive layer. A glass film layer was dry-laminated on this to produce a transfer substrate.
With respect to this transfer substrate, the above-mentioned characteristics were measured and evaluated. Further, the 90 ° peel test was performed on the assumption that the thermoplastic resin layer side is used for transfer. The results are shown in Table 1.

[Example 2]
In Example 1, instead of SK-1478, an ultraviolet curable adhesive (“R1213” manufactured by Daiichi Kogyo Seiyaku Co., Ltd. and a polymerization initiator “IRGACURE184” manufactured by Ciba Specialty Chemicals Co., Ltd.) was applied to one surface of the thermoplastic resin layer. A mixture of 100/3 ratio) was applied with a bar coater to a thickness of 10 μm to form an adhesive layer, and a transfer substrate was prepared in the same manner except that a glass film was laminated and irradiated with ultraviolet rays. Various measurements and evaluations were performed. The results are shown in Table 1.

[Example 3]
In Example 2, as a thermoplastic resin layer, a biaxially stretched film of polyethylene terephthalate (“Emblet PET” manufactured by Unitika Ltd., thickness: 12 μm, total light transmittance: 88%, total haze: 3%, ultraviolet transmittance) : 85%, tensile breaking elongation: 85%, tensile breaking strength: 270 MPa), a transfer substrate was prepared in the same manner, and various measurements and evaluations were performed. The results are shown in Table 1.

[Example 4]
In Example 2, as a thermoplastic resin layer, a biaxially stretched film of polyethylene terephthalate (“T100-100” manufactured by Mitsubishi Plastics, Inc., thickness: 100 μm, total light transmittance: 88%, total haze: 4%, ultraviolet light transmission) A transfer substrate was prepared in the same manner except that the rate: 82%, tensile elongation at break: 112%, and tensile strength at break: 190 MPa), and various measurements and evaluations were performed. The results are shown in Table 1.

[Example 5]
In Example 4, as a glass film layer, a glass film (“OA-10G” manufactured by Nippon Electric Glass Co., Ltd., thickness: 100 μm, total light transmittance: 92%, total haze: 0.2%, ultraviolet transmittance: 92 %) Was used in the same manner, and various measurements and evaluations were performed. The results are shown in Table 1.

[Example 6]
In Example 5, as the thermoplastic resin layer, a polyethylene terephthalate biaxially stretched film (“T910” manufactured by Mitsubishi Plastics, Inc., thickness: 250 μm, total light transmittance: 91%, total haze: 1%, ultraviolet transmittance: 83%, tensile break elongation: 162%, tensile break strength: 166 MPa) were used in the same manner to produce a transfer substrate, and various measurements and evaluations were performed. The results are shown in Table 1.

[Comparative Example 1]
About the base material for transfer produced in Example 1, the said 90 degree peeling test was implemented on the assumption that the glass film layer side is used for transfer. The results are shown in Table 1.

[Comparative Example 2]
The 90 ° peel test described above was carried out on the assumption that the glass film layer side was used for transfer on the transfer substrate prepared in Example 2. The results are shown in Table 1.

[Comparative Example 3]
In Example 3, as a glass film layer, a glass film (“OA-10G” manufactured by Nippon Electric Glass Co., Ltd., thickness: 100 μm, total light transmittance: 92%, total haze: 0.2%, ultraviolet transmittance: 92 %) Was used in the same manner, and various measurements and evaluations were performed. The results are shown in Table 1.

[Comparative Example 4]
The 90 ° peel test was carried out using only the glass film used in Example 1. The results are shown in Table 1.

As is clear from Table 1, the transfer base materials of the present invention produced in Examples 1 to 6 are excellent in peel resistance because they do not break when the thermoplastic resin layer side is used as a transfer surface, and It has excellent transparency and ultraviolet transmittance, has an appropriate thickness, has sufficient interlayer adhesion between the thermoplastic resin layer and the glass film layer, and has good handling properties.
On the other hand, when the glass film layer side is used as the transfer surface as in Comparative Examples 1 and 2, it is important to use the thermoplastic resin layer side as the transfer surface in the transfer substrate because it is damaged during peeling after transfer. It can be confirmed that
In Comparative Example 3, since the thickness ratio between the thermoplastic resin layer and the glass film layer is small and the thermoplastic resin layer is thin, even if the thermoplastic resin layer side is used as the transfer surface, the base material is damaged, and the peeling resistance is reduced. It was inferior in performance and handling.
In Comparative Example 4, since the thermoplastic resin layer was not provided, it was easily damaged more than Comparative Example 3 and was inferior in peeling resistance and handling properties.

  The substrate for transfer of the present invention can be suitably used as a substrate for a transfer sheet used in photo-curing nanoimprint technology, particularly for the production of semiconductors and various electronic components that require precise continuous transfer by roll-to-roll. It can be suitably used.

Claims (6)

It has a thermoplastic resin layer as a main component, a thermoplastic resin layer for forming a concavo-convex pattern for transfer on the outer surface, and a glass film layer, and the thickness ratio of the thermoplastic resin layer to the glass film layer (= heat A base material for transfer having a plastic resin layer / glass film layer) of 0.15 or more and 10 or less, and a total thickness of 45 μm or more and 500 μm or less ,
The tensile elongation at break of the thermoplastic resin layer at a temperature of 23 ° C. is 50% or more and 400% or less, and the tensile break strength is 20 MPa or more,
A substrate for transfer, wherein the delamination strength between the thermoplastic resin layer and the glass film layer is 1 N / cm or more .   The transfer substrate according to claim 1, further comprising an adhesive layer between the thermoplastic resin layer and the glass film layer. The transfer substrate according to claim 1 or 2 , wherein the thermoplastic resin layer contains a polyester resin as a main component. The base material for transfer according to any one of claims 1 to 3 , wherein the thermoplastic resin layer has a total light transmittance of 80% or more and a total haze of 5% or less. The base material for transfer according to any one of claims 1 to 4 , wherein the thermoplastic resin layer has an ultraviolet transmittance of 70% or more. The transfer sheet which provided the uneven | corrugated pattern for transcription | transfer on the outer surface of the thermoplastic resin layer of the base material for transcription | transfer of any one of Claims 1-5 .