JP6312309B2 - Piezoelectric vibration element, piezoelectric device, and method of manufacturing piezoelectric vibration element - Google Patents

Description

  The present invention relates to a piezoelectric vibration element, a piezoelectric device, and a method for manufacturing a piezoelectric vibration element.

  As a piezoelectric vibrating element (piezoelectric vibrating piece) used for a piezoelectric vibrator or a piezoelectric oscillator, a piezoelectric element plate, a pair of excitation electrodes provided on both main surfaces of the piezoelectric element plate, and a pair of excitation electrodes are connected. One having a pair of extraction electrodes is known. Such a piezoelectric vibration element is, for example, disposed so as to face a mounting surface of an element mounting member constituting a part of a package of a piezoelectric vibrator or a piezoelectric oscillator, and a pair of pads provided on the mounting surface, and a piezoelectric vibration element The pair of lead electrodes are attached to the element mounting member by bonding with conductive bumps.

  In such a piezoelectric vibration element, each of the pair of extraction electrodes is provided over both main surfaces so that any main surface of the piezoelectric element plate can be mounted facing the mounting surface. In many cases, the pair of extraction electrodes have a 180 ° rotationally symmetric shape with respect to the center line of the piezoelectric element plate.

  According to Patent Document 1, when a pair of extraction electrodes is provided on both main surfaces of a piezoelectric element plate as described above, the electric field between the extraction electrode and the excitation electrode may reduce the characteristics relating to vibration. In view of the above, it is proposed that one of the pair of extraction electrodes is provided over both main surfaces and the other is provided only on one main surface.

JP 2012-186709 A

  However, in the technique of Patent Document 1, one extraction electrode is provided only on one main surface of the piezoelectric element plate, whereas the other extraction electrode is provided on both main surfaces of the piezoelectric element plate and Since it is provided over the side surface, the weights of the two extraction electrodes are different from each other. Accordingly, the mass distribution of the piezoelectric vibration element in plan view is not line symmetric with respect to the center line of the piezoelectric element plate. As a result, for example, the balance when vibrating is not good, and there is a possibility that CI (crystal impedance) becomes high. In particular, in a miniaturized piezoelectric vibration element, since the ratio of the mass of the extraction electrode to the mass of the piezoelectric vibration element increases, the asymmetry of the mass of the pair of extraction electrodes affects the characteristics of the piezoelectric vibration element. growing.

  Therefore, it is possible to provide a piezoelectric vibration element, a piezoelectric device, and a method for manufacturing the piezoelectric vibration element that can reduce the influence of the electric field between the excitation electrode and the extraction electrode and the mass of the extraction electrode on the characteristics relating to vibration. desired.

  A piezoelectric vibration element according to an aspect of the present invention includes a first piezoelectric element, a rectangular piezoelectric element plate having a first main surface, a second main surface on the back surface thereof, and four side surfaces positioned on the outer periphery of the main surface, and the first piezoelectric element. A first excitation electrode located on the center side of the main surface, a second excitation electrode located on the center side of the second main surface, a first extraction electrode extending from the first excitation electrode, and the second excitation A second extraction electrode extending from the electrode, wherein the first extraction electrode extends from the first excitation electrode on the first main surface and to the second main surface side via any one of the side surfaces. A first wiring portion extending on the second main surface, and a first pad portion connected to the first wiring portion, wherein the second lead electrode is formed on the second main surface by the first wiring portion. A second wiring portion extending from the two excitation electrodes; and located on the second main surface and connected to the second wiring portion. A portion that extends from the second pad portion and the second pad portion to the first main surface via any one of the side surfaces, and is located on the first main surface in a plan view of the first main surface A dummy portion whose distance from the first excitation electrode is longer than the distance between the second pad portion and the first excitation electrode.

  A piezoelectric vibration element according to another aspect of the present invention includes a rectangular piezoelectric element plate having a first main surface, a second main surface on the back surface thereof, and four side surfaces positioned on the outer periphery of the main surface; A first excitation electrode located on the center side of one main surface; a second excitation electrode located on the center side of the second main surface; a first extraction electrode extending from the first excitation electrode; and the second A second extraction electrode extending from the excitation electrode, wherein the first extraction electrode extends from the first excitation electrode on the first main surface and passes through one of the side surfaces to the second main surface side. A first wiring portion extending to the second main surface, and a first pad portion connected to the first wiring portion, wherein the second lead electrode is formed on the second main surface. A second wiring portion extending from the second excitation electrode; and located on the second main surface and connected to the second wiring portion. And the second pad portion extends from the second pad portion to the first main surface via any one of the side surfaces, and the area of the portion located on the first main surface is the second pad portion. And a dummy portion smaller than the area.

  Preferably, the first wiring portion extends from the first excitation electrode to the one side surface side on the first main surface, extends to the second main surface side via the one side surface, and One pad is positioned on the one side surface side of the second main surface and is connected to the first wiring portion, and the second wiring portion is connected to the second excitation electrode from the second excitation electrode. The second pad portion extends to one side surface, is located on the one side surface side of the second main surface, and is connected to the second wiring portion, and the dummy portion is the second pad portion To the first main surface via the one side surface.

  Preferably, the dummy portion extends from the second main surface side to the first main surface side on one side surface and is narrower than the second pad when viewed in a direction orthogonal to the one side surface. A side dummy portion and a main surface that is located on the one side surface side of the first main surface, is connected to the side surface dummy portion, and is wider than the side surface dummy portion when viewed in a direction orthogonal to the one side surface And a dummy part.

  Preferably, the first wiring portion includes a first wiring configuration portion extending from the first excitation electrode to the one side surface on the first main surface, and the one side surface side of the first main surface. A second wiring configuration portion extending from the first wiring configuration portion along the one side surface to a center side of the one side surface, and the second side surface from the second wiring configuration portion on the one side surface. The width of the first wiring configuration portion does not overlap with the width of the first wiring configuration portion on the side opposite to the side on which the second wiring configuration portion extends, as viewed in a direction perpendicular to the one side surface. And the width of the connection portion of the first wiring configuration portion with the second wiring configuration portion is closer to the side where the second wiring configuration portion extends toward the second wiring configuration portion side. The reverse taper portion is formed so as to be wide.

  A piezoelectric device according to an aspect of the present invention includes the above-described piezoelectric vibration element and an element mounting member having a pair of element mounting pads connected to the first pad portion and the second pad portion by a pair of bumps. ,have.

  The method for manufacturing a piezoelectric vibration element according to one aspect of the present invention includes an etching process for etching a piezoelectric wafer, an electrode formation process for forming an electrode on the etched piezoelectric wafer, and the piezoelectric vibration element after the electrode formation is inspected. And an isolation step for separating the piezoelectric wafer after the inspection. In the etching step, the first main surface, the second main surface on the back surface thereof, and the outer periphery of these main surfaces are located. A rectangular piezoelectric element plate having four side surfaces, a frame part positioned on the outer periphery of the piezoelectric element plate, and a support part having a connection part for connecting any one of the side surfaces of the piezoelectric element plate and the frame part In the electrode forming step, the first excitation electrode located on the center side of the first main surface, the second excitation electrode located on the center side of the second main surface, and the first The first extending from one excitation electrode An extraction electrode; a second extraction electrode extending from the second excitation electrode; a first inspection electrode connected to the first extraction electrode and located on the surface of the support; and a surface of the support A second inspection electrode connected to the second extraction electrode, and in the inspection step, a probe is brought into contact with the first inspection electrode and the second inspection electrode, and the inspection is performed. In the separation step, the piezoelectric element plate and the connection portion are separated, and the first extraction electrode extends from the first excitation electrode on the first main surface, and passes through the side surface to the second second electrode. A first wiring portion extending to the main surface side; and a first pad portion located on the second main surface and connected to the first wiring portion, wherein the second extraction electrode is the second main electrode. A second wiring portion extending from the second excitation electrode on the surface, and the second wiring portion located on the second main surface. A second pad portion connected to the portion, and extends from the second pad portion to the first main surface via any one of the side surfaces, and the first main surface in a plan view of the first main surface A dummy portion having a distance between a portion of the second pad portion and the first excitation electrode that is longer than a distance between the first excitation electrode and the first excitation electrode. The inspection electrode is located on a surface of the support portion on the first main surface side, and the second inspection electrode extends from the frame portion to the piezoelectric element plate side via the connection portion, and the dummy Connected to the department.

  According to said structure or procedure, the influence which the electric field between an excitation electrode and an extraction electrode and the mass of an extraction electrode has on the characteristic which concerns on a vibration can be reduced.

1 is an exploded perspective view showing a schematic configuration of a crystal resonator according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the crystal resonator taken along line II-II in FIG. 1. The perspective view which looked at the vibration element of the crystal oscillator of FIG. 1 from the cover member side. The perspective view which looked at the vibration element of the crystal oscillator of FIG. 1 from the bottom face side of the element mounting member. FIG. 2 is a development view of a vibration element of the crystal resonator of FIG. 1. 6A is an enlarged view of a region VI in FIG. 5, and FIG. 6B is a diagram showing a modification of FIG. 6A. FIG. 4 is a flowchart showing a procedure of a method for manufacturing the vibration element of FIG. 3. FIG. FIG. 8 is a plan view showing a part of a wafer etched in the manufacturing method of FIG. 7. FIG. 8 is a plan view showing a part of a wafer on which electrodes are formed in the manufacturing method of FIG. 7.

  Hereinafter, an oscillator according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  The piezoelectric vibrator may be either upward or downward, but in the following, for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is upward, and the upper surface, the lower surface, etc. The following terms shall be used.

  FIG. 1 is an exploded perspective view showing a schematic configuration of a crystal resonator 1 according to an embodiment of the present invention. 2 is a cross-sectional view of the crystal unit 1 taken along the line II-II in FIG.

  For example, as shown in FIG. 1, the crystal resonator 1 is roughly composed of three members. That is, the crystal unit 1 includes the element mounting member 3 in which the recess 3a is formed, the vibration element 5 accommodated in the recess 3a, and the lid member 7 that closes the recess 3a.

  For example, the crystal unit 1 is substantially rectangular parallelepiped in a state where the recess 3 a is closed by the lid member 7, and the dimensions thereof may be set appropriately. For example, in a relatively small one, the length of one side in the x direction or the y direction is 1 to 2 mm, and the length of one side in the z direction is 0.2 to 0.4 mm. The recess 3a is sealed by the lid member 7, and the inside thereof is, for example, evacuated or sealed with nitrogen.

  The element mounting member 3 may be the same as a known one. The element mounting member 3 includes, for example, a base 9 that is a main body of the element mounting member 3, an element mounting pad 11 for mounting the vibration element 5, and a crystal resonator 1 for mounting on a circuit board (not shown). And an external terminal 13.

  The substrate 9 is made of an insulating material. The insulating material is, for example, ceramic or resin. The base 9 may be composed of a plurality of members, or may be integrally formed as a whole. The base body 9 may have an appropriate shape as long as the vibration element 5 can be mounted and sealed. For example, the base body 9 is formed in a substantially rectangular parallelepiped box shape whose upper surface side is open, and has the above-described recess 3a.

  The element mounting pad 11 is provided on the bottom surface of the recess 3a, for example. More specifically, for example, a pair of element mounting pads 11 is provided on one side of the bottom surface of the recess 3a in the longitudinal direction (positive side in the x direction). The pair of element mounting pads 11 are arranged in the short side direction (y direction) of the bottom surface of the recess 3a. The element mounting pad 11 is made of, for example, a conductive material (for example, metal) formed in a layer shape (including a plate shape, the same applies hereinafter). The planar shape may be set appropriately. The element mounting pad 11 may be configured by laminating two or more metal layers. Other layered conductors (13, 17, 18, 19, 20, etc.) to be described later may also be composed of two or more types of metal layers, similar to the element mounting pad 11.

  The external terminals 13 are provided at the four corners of the lower surface of the element mounting member 3, for example. Each external terminal 13 is made of, for example, a conductive material (for example, metal) formed in a layer shape. The planar shape may be set appropriately. The crystal resonator 1 is mounted on a circuit board by, for example, joining the external terminals 13 and pads (not shown) of the circuit board with solder or the like.

  One external terminal 13 and one element mounting pad 11 are connected by a connection conductor (not shown), and the other one external terminal 13 and another one element mounting pad 11 are connected by a connection conductor (not shown). Yes. The connection conductor is constituted by, for example, a via conductor or an inner layer conductor provided inside the base body 9.

  The vibration element 5 is formed in a substantially rectangular plate shape, and is accommodated in the recess 3a with its main surface facing the bottom surface of the recess 3a. The vibration element 5 is bonded to the element mounting pad 11 by a conductive bump 21 (FIG. 2) at the end portion on the short side. Thus, the vibration element 5 is supported like a cantilever on the element mounting member 3 and is electrically connected to the element mounting pad 11.

  The bump 21 may be a known one used for mounting a vibration element or a known one used for mounting an electronic element. For example, the bump 21 is made of a conductive adhesive (for example, an Ag paste in which a silver filler is mixed with a resin).

  The configuration of the lid member 7 may be the same as a known one. For example, the lid member 7 is made of metal. The lid member 7 is formed, for example, in a substantially rectangular flat plate shape, and is overlapped on the upper surface of the frame portion of the element mounting member 3. The lid member 7 and the element mounting member 3 are fixed to each other, for example, by welding metal layers provided on both.

  3 is a perspective view of the vibration element 5 as viewed from the lid member 7 side, FIG. 4 is a perspective view of the vibration element 5 as viewed from the bottom surface side of the recess 3a, and FIG. FIG.

  The vibration element 5 includes, for example, a crystal piece 15, a first excitation electrode 17 and a second excitation electrode 18 for applying a voltage to the crystal piece 15, and a first for mounting the vibration element 5 on the element mounting pad 11. It has an extraction electrode 19 and a second extraction electrode 20. The first extraction electrode 19 is connected to the first excitation electrode 17, and the second extraction electrode 20 is connected to the second excitation electrode 18.

  The crystal piece 15 is formed, for example, in a substantially rectangular plate shape, and includes a first main surface 15a, a second main surface 15b on the back surface thereof, and first side surfaces 15c to 4 located on the outer periphery of these main surfaces. And a side surface 15f. The first main surface 15a is a surface facing the lid member 7, and the second main surface 15b is a surface facing the bottom surface of the recess 3a. The first side surface 15c and the second side surface 15d are surfaces located on the short side of the first main surface 15a, and the third side surface 15e and the fourth side surface 15f are surfaces located on the long side of the first main surface 15a. is there.

  In the drawings illustrating the present embodiment, the x direction is a direction orthogonal to the first side surface 15c and the second side surface 15d, and the y direction is a direction orthogonal to the third side surface 15e and the fourth side surface 15f. , Z direction is a direction orthogonal to the first main surface 15a and the second main surface 15b. 3 and 4, the center line CL is a line that extends parallel to the x direction and passes through the center of gravity of the crystal piece 15.

  The first excitation electrode 17, the second excitation electrode 18, the first extraction electrode 19, and the second extraction electrode 20 are made of a conductive material (for example, metal) formed on the surface of the crystal piece 15. In addition, these are formed with the mutually same material and thickness, for example.

  The 1st excitation electrode 17 and the 2nd excitation electrode 18 may be made the same with a well-known structure. For example, at least a part of the first excitation electrode 17 (the whole in the present embodiment) is located on the center side of the first main surface 15a. In addition, the second excitation electrode 18 is at least partially (in the present embodiment) located on the center side of the second main surface 15b. The first excitation electrode 17 and the second excitation electrode 18 are opposed to each other with the crystal piece 15 interposed therebetween. The first excitation electrode 17 and the second excitation electrode 18 have, for example, the same shape and size as each other and are completely overlapped in plan view. The shapes of the first excitation electrode 17 and the second excitation electrode 18 are, for example, a rectangle having four sides parallel to the four sides of the first major surface 15a.

  The first extraction electrode 19 and the second extraction electrode 20 are configured to be connected to the element mounting pad 11 only on the second main surface 15b side. On the other hand, the 1st extraction electrode 19 and the 2nd extraction electrode 20 are provided over both the 1st main surface 15a and the 2nd main surface 15b, respectively. Specifically, it is as follows.

  The first extraction electrode 19 extends from the first excitation electrode 17, is connected to the first wiring part 19 a that functions as a wiring, the tip of the first wiring part 19 a, and the first pad part 19 b that functions as a pad, And a first dummy portion 19c branched from the wiring portion 19a. The first pad portion 19b is connected to the element mounting pad 11 by the bump 21 (FIG. 2). Thus, the first excitation electrode 17 is connected to the external terminal 13 via the first extraction electrode 19, the bump 21, the element mounting pad 11, and a conductor (not shown) in the element mounting member 3.

  The first wiring portion 19a extends from the first excitation electrode 17 to the first side surface 15c side on the first main surface 15a, and extends to the second main surface 15b side via the first side surface 15c. More specifically, for example, the first wiring portion 19a includes a first wiring configuration portion 19aa extending from the first excitation electrode 17 toward the first side surface 15c on the first main surface 15a, and the first main surface 15a. On the first side surface 15c side, the second wiring configuration portion 19ab extending from the first wiring configuration portion 19aa along the first side surface 15c to the center side (center line CL side) of the first side surface 15c, and the first side surface 15c And a third wiring configuration portion 19ac extending from the second wiring configuration portion 19ab to the second main surface 15b side.

  The first wiring configuration portion 19aa is, for example, a direction orthogonal to the first side surface 15c from the end side (y direction positive side) portion of one side of the first excitation electrode 17 on the first side surface 15c side (x Direction). The width (y direction) of the first wiring component 19aa is, for example, substantially constant.

  For example, the second wiring configuration portion 19ab extends from the end portion of the first wiring configuration portion 19aa on the first side surface 15c side, and the side of the second wiring configuration portion 19ab on the first side surface 15c side is the first main surface. 15a coincides with the side on the first side surface 15c side. The width (x direction) of the second wiring configuration part 19ab is, for example, substantially constant and smaller than the width (y direction) of the first wiring configuration part 19aa.

  The third wiring component 19ac extends, for example, from the edge of the second wiring component 19ab on the first side surface 15c side in a direction (z direction) orthogonal to the main surface. The width (y direction) of the third wiring configuration portion 19ac is, for example, substantially constant, and is larger than the width (y direction) of the first wiring configuration portion 19aa. In addition, the width (y direction) of the third wiring configuration part 19ac is, for example, approximately the entire length (y direction) of the second wiring configuration part 19ab. However, the width (y direction) of the third wiring configuration portion 19ac is the second wiring configuration portion 19ab side of the width of the first wiring configuration portion 19aa when viewed in the direction orthogonal to the first side surface 15c (x direction). Does not overlap with the opposite side (the opposite side to the center line CL, the first dummy portion 19c side).

  The first pad portion 19b is located on the first side surface 15c side in the second main surface 15b and is connected to the third wiring configuration portion 19ac. The shape of the first pad portion 19b may be set as appropriate. For example, the first pad portion 19b is rectangular, and two sides thereof are one side of the second main surface 15b on the first side surface 15c side and one side on the third side surface 15e side. It matches the side. The width of the first pad portion 19b (the y direction, the direction along the first side surface 15c) is, for example, larger than the width of the first wiring portion 19a. Note that the width of the first wiring portion 19a referred to here is, for example, the maximum width relating to the current flow between the first excitation electrode 17 and the first pad portion 19b. It is equivalent to the width of the part 19ac. Further, the length (y direction) of the second wiring configuration portion 19ab is substantially equal to, for example, the width (y direction) of the first pad portion 19b.

  The first dummy part 19c is a part mainly used in the manufacturing process of the vibration element 5 as will be described later. The first dummy portion 19c is located on the first side surface 15c side of the first main surface 15a, along the first side surface 15c from the first wiring configuration portion 19aa (on the opposite side of the center line CL). Side). One side of the first dummy portion 19c on the first side surface 15c side coincides with one side of the first main surface 15a on the first side surface 15c side. The tip of the first dummy portion 19c reaches, for example, one side of the first main surface 15a on the third side surface 15e side. For example, the width (x direction) of the first dummy portion 19c is constant, and is equal to the width (x direction) of the second wiring configuration portion 19ab. In the first side surface 15c, the conductor layer (third wiring configuration portion 19ac) is not provided in a range overlapping with the first dummy portion 19c when viewed in the x direction.

  The second extraction electrode 20 extends from the second excitation electrode 18 and is connected to the second wiring part 20a that functions as a wiring, the second pad part 20b that functions as a pad, is connected to the tip of the second wiring part 20a, A second dummy portion 20c extending from the pad portion 20b. The second pad portion 20b is connected to the element mounting pad 11 by the bump 21 (FIG. 2). As a result, the second excitation electrode 18 is connected to the external terminal 13 via the second extraction electrode 20, the bump 21, the element mounting pad 11, and a conductor (not shown) in the element mounting member 3.

  The second wiring portion 20a extends from the second excitation electrode 18 to the first side surface 15c side on the second main surface 15b. More specifically, for example, the second wiring portion 20a is connected to the first side surface 15c from the end of the second excitation electrode 18 on the side opposite to the first extraction electrode 19 on the first side surface 15c side. It extends in the direction (x direction) orthogonal to. For example, the width (y direction) of the second wiring portion 20a is substantially constant.

  The second pad portion 20b is located on the first side surface 15c side in the second main surface 15b. The shape of the second pad portion 20b may be set as appropriate. For example, the second pad portion 20b is rectangular, and two sides thereof are one side of the second main surface 15b on the first side surface 15c side and the fourth side surface 15f side (first side). It coincides with one side of the side opposite to the one pad portion 19b. The width (y direction, the direction along the first side surface 15c) of the second pad portion 20b is, for example, larger than the width of the second wiring portion 20a.

  The second dummy portion 20 c is a portion that contributes to reducing the mass difference between the first extraction electrode 19 and the second extraction electrode 20. Note that the second dummy portion 20c is also preferably used in the manufacturing process of the vibration element 5 in the same manner as the first dummy portion 19c.

  The second dummy portion 20c extends from the second pad portion 20b to the first main surface 15a via the first side surface 15c. Specifically, for example, the second dummy portion 20c includes a side dummy portion 20ca extending from the second main surface 15b side to the first main surface 15a side on the first side surface 15c, and a first side surface 15c on the first main surface 15a. And a main surface dummy portion 20cb connected to the tip of the side surface dummy portion 20ca.

  The side dummy portion 20ca extends, for example, from an edge of the second pad portion 20b on the first side surface 15c side in a direction (z direction) orthogonal to the main surface. The width (y direction) of the side dummy portion 20ca is, for example, substantially constant and larger than the width (y direction) of the second wiring portion 20a. Further, the width (y direction) of the side dummy part 20ca is, for example, smaller than the width (y direction) of the second pad part 20b, and is located on the first extraction electrode 19 side with respect to the width of the second pad part 20b. ing.

  The main surface dummy portion 20cb has, for example, a long shape extending along the first side surface 15c in the first main surface 15a. For example, one side of the main surface dummy portion 20cb on the first side surface 15c side coincides with one side of the first main surface 15a on the first side surface 15c side. The front end of the main surface dummy portion 20cb reaches, for example, one side of the first main surface 15a on the fourth side surface 15f side. The width (x direction) of the main surface dummy portion 20cb is, for example, substantially constant and smaller than the width (y direction) of the second wiring portion 20a. The width (y direction) of the side dummy portion 20ca is, for example, smaller than the length (y direction) of the main surface dummy portion 20cb, and the central side (center) of the first side surface 15c with respect to the length of the main surface dummy portion 20cb. (Line CL side). That is, on the first side surface 15c, the conductor layer (side surface dummy portion 20ca) is not provided on the side opposite to the center line CL within the width of the main surface dummy portion 20cb when viewed in the x direction.

  In a plan view (plan view) of the first main surface 15a, the distance between the main surface dummy portion 20cb and the first excitation electrode 17 is longer than the distance between the second pad portion 20b and the first excitation electrode 17. For example, the former is 1.5 times or more of the latter, or 2 times or more.

  Moreover, the area of the main surface dummy part 20cb is smaller than the area of the 2nd pad part 20b. For example, the former is less than half of the latter or less than ¼. More specifically, the main surface dummy portion 20cb is substantially the same size as the second pad portion 20b in the y direction, while being smaller than the second pad portion 20b in the x direction. The area of the main surface dummy part 20cb is smaller than the area of the second pad part 20b.

  The first wiring configuration portion 19aa of the first extraction electrode 19 and the second wiring portion 20a of the second extraction electrode 20 are, for example, approximately 180 ° rotationally symmetric with respect to the center line CL except for the length thereof. The shape and size. The second wiring configuration portion 19ab of the first extraction electrode 19 and the main surface dummy portion 20cb of the second extraction electrode 20 are, for example, generally symmetrical with respect to the center line CL in plan view of the first main surface 15a. The shape and size. For example, the third wiring configuration portion 19ac of the first extraction electrode 19 and the side dummy portion 20ca of the second extraction electrode 20 generally pass through the center of the first side surface 15c in the z direction in plan view of the first side surface 15c. The line is symmetrical with respect to a line (not shown) parallel to the line. However, in the present embodiment, the region of the first side surface 15c where the conductor layers on both sides in the y direction are not provided is slightly smaller in the region on the first extraction electrode 19 side than the region on the second extraction electrode 20 side. As a result, the width (y direction) of the third wiring component 19ac is slightly larger than the width (y direction) of the side dummy part 20ca. The first pad portion 19b of the first extraction electrode 19 and the second pad portion 20b of the second extraction electrode 20 are, for example, symmetrically shaped and large with respect to the center line CL in plan view of the second main surface 15b. It is said.

  FIG. 6A is an enlarged view of a region VI in FIG.

  The first wiring configuration portion 19aa is connected to the second wiring configuration portion 19ab at the second wiring configuration portion 19ab side (the first side surface 15c side, the lower side of FIG. 6A). A reverse tapered portion 19ae is provided so that the width increases toward the side on which 19ab extends (the center line CL side, the left side in FIG. 6A). In addition, the hypotenuse of the reverse taper part 19ae may be a straight line or a curved line. Further, the angle of the hypotenuse of the reverse taper portion 19ae may be set as appropriate.

  FIG. 6B is a diagram showing a modification of the first wiring portion 19a. Like this modification, the reverse taper part 19ae does not need to be provided.

  FIG. 7 is a flowchart showing the procedure of the method for manufacturing the vibration element 5.

  First, a wafer from which a large number of crystal pieces 15 are taken is prepared, and this wafer is etched (step ST1). Etching may be performed by a known method. For example, an etching mask made of a resist is formed on the wafer surface by photolithography, and then wet etching is performed using an appropriate chemical solution. Thereafter, the etching mask is removed.

  FIG. 8 is a plan view showing a part of the wafer 51 subjected to this etching.

  By etching, a plurality of crystal pieces 15 and a support portion 53 that supports the plurality of crystal pieces 15 are formed on the wafer 51. The support portion 53 includes a frame portion 55 positioned around the plurality of crystal pieces 15, and a first connection portion 57 and a second connection portion 59 that connect the crystal pieces 15 and the frame portion 55. The first connection portion 57 and the second connection portion 59 are connected to both side portions in the y direction of the first side surface 15 c of the crystal piece 15. It can be understood that the opening 61 is formed in the wafer 51 on the first side surface 15 c side of the crystal piece 15. In the present embodiment, the second connecting portion 59 has a slightly larger width in the y direction than the first connecting portion 57.

  Returning to FIG. After the etching, various electrodes are formed on the wafer 51 (step ST2). The electrode may be formed by a known method. For example, a resist mask is formed on the wafer 51 by photolithography, and a metal material is deposited by vapor deposition through the mask. The vapor deposition may be vacuum vapor deposition or sputtering. Thereafter, the resist mask is removed.

  FIG. 9 is a plan view showing a part of the wafer 51 on which this electrode is formed.

  In the crystal piece 15, a first excitation electrode 17, a second excitation electrode 18 (not shown in FIG. 9), a first extraction electrode 19, and a second extraction electrode 20 are formed. These shapes and the like are as already described.

  In the support portion 53, a first inspection electrode 63 and a second inspection electrode 65 are formed. The first inspection electrode 63 and the second inspection electrode 65 are formed on the surface of the support portion 53 on the first main surface 15a side.

  The first inspection electrode 63 includes, for example, a first inspection pad portion 63 a formed on the frame portion 55 and a first inspection wiring portion 63 b formed on the first connection portion 57. The first inspection wiring section 63 b connects the first inspection pad section 63 a and the first extraction electrode 19. For example, the first inspection wiring part 63b is formed on the entire surface of the first connection part 57 on the first main surface 15a side. Further, the first inspection wiring part 63b is, for example, the third side surface among the edge part on the first side surface 15c side of the first dummy part 19c and the edge part on the first side surface 15c side of the first wiring configuration part 19aa. It is connected to the part on the 15e side.

  The second inspection electrode 65 includes, for example, a second inspection pad portion 65 a formed on the frame portion 55 and a second inspection wiring portion 65 b formed on the second connection portion 59. The second inspection wiring portion 65 b connects the second inspection pad portion 65 a and the second extraction electrode 20. For example, the second inspection wiring portion 65b is formed on the entire surface of the second connection portion 59 on the first main surface 15a side. The second inspection wiring portion 65b is connected to, for example, a portion of the second lead electrode 20 on the fourth side surface 15f side of the edge portion on the first side surface 15c side of the main surface dummy portion 20cb. .

  Returning to FIG. After the electrode formation, the characteristic inspection of the vibration element 5 is performed (step ST3). Specifically, for example, a pair of probes 67 (FIG. 9) of the electrical characteristic test apparatus are brought into contact with the first inspection pad portion 63a and the second inspection pad portion 65a. That is, the electrical characteristic test apparatus includes the first excitation electrode 17 and the second excitation electrode 18 through the first inspection electrode 63 and the second inspection electrode 65, and the first extraction electrode 19 and the second extraction electrode 20. Connect to. Then, a voltage is applied to the first excitation electrode 17 and the second excitation electrode 18 via the pair of probes 67, and, for example, the oscillation frequency and the crystal impedance value (CI value) of the vibration element 5 are measured. The inspection result is used for adjustment of the oscillation frequency of the vibration element 5, for example.

  Thereafter, the vibration element 5 is separated from the support portion 53. For example, the first connection part 57 and the second connection part 59 are removed by etching similar to step ST1. A portion of the first side surface 15c where the first connection portion 57 and the second connection portion 59 are connected is a portion of the first side surface 15c where the outer conductor layer in the y direction is not provided.

  As described above, in the present embodiment, the first extraction electrode 19 extends from the first excitation electrode 17 on the first main surface 15a and extends to the second main surface 15b side via the first side surface 15c. 19a and a first pad portion 19b located on the second main surface 15b and connected to the first wiring portion 19a. The second lead electrode 20 includes a second wiring portion 20a extending from the second excitation electrode 18 on the second main surface 15b, and a second pad portion 20b located on the second main surface 15b and connected to the second wiring portion 20a. And a second dummy portion 20c extending from the second pad portion 20b to the first main surface 15a via the first side surface 15c.

  Then, in the plan view of the first main surface 15a, the distance (for example, the shortest distance) between the portion of the second dummy portion 20c located on the first main surface 15a (main surface dummy portion 20cb) and the first excitation electrode 17 is: It is longer than the distance between the second pad portion 20 b and the first excitation electrode 17. From another viewpoint, the area of the main surface dummy part 20cb is smaller than the area of the second pad part 20b.

  Therefore, compared with the case where the second dummy portion 20c is not provided, the mass of the first extraction electrode 19 and the mass of the second extraction electrode 20 become closer, and as a result, the mass distribution of the vibration element 5 in plan view is It approaches symmetry with respect to the center line CL. As a result, the vibration element 5 has a good balance when vibrating, and for example, a reduction in CI is expected. On the other hand, the main surface dummy portion 20cb has a longer distance from the first excitation electrode 17 and / or a smaller area than the second pad portion 20b. Compared with the case where a pad portion similar to the pad portion 20b is formed, the intensity of the electric field between the second extraction electrode 20 and the first excitation electrode 17 becomes smaller, or the range of the electric field becomes narrower. As a result, the occurrence of vibration (spurious) different from vibration (thickness shear vibration) to be excited by the first excitation electrode 17 and the second excitation electrode 18 is reduced, and for example, a reduction in CI is expected. As described above, in the present embodiment, the mechanical influence (mass influence) and the electromagnetic influence that the extraction electrode exerts on the characteristics of the vibration element 5 are suitably adjusted.

  In the present embodiment, the first wiring portion 19a extends from the first excitation electrode 17 to the first side surface 15c side on the first main surface 15a, and extends to the second main surface 15b side via the first side surface 15c. The first pad 19b is located on the first side surface 15c side of the second main surface 15b, and is connected to the first wiring portion 19a. The second wiring portion 20a extends from the second excitation electrode 18 to the first side surface 15c side on the second main surface 15b, and the second pad portion 10b is located on the first side surface 15c side on the second main surface 15b. The second dummy part 20c is connected to the two wiring parts 20a and extends from the second pad part 20b to the first main surface 15a via the first side face 15c.

  That is, the first extraction electrode 19 and the second extraction electrode 20 extend from the excitation electrode toward the same side surface (first side surface 15c), and extend from one main surface to the other main surface via the side surface. ing. Therefore, it is easy to design to balance the mass distribution of the vibration element 5. In addition, since the electrodes need only be formed on one of the four side surfaces, the manufacturing process is simplified.

  In the present embodiment, the second dummy portion 20c extends from the second main surface 15b side to the first main surface 15a side on the first side surface 15c and is viewed in a direction (x direction) orthogonal to the first side surface 15c. The side dummy portion 20ca is narrower than the second pad portion 20b (y direction; for example, the maximum width if the width is not constant), and the first main surface 15a is positioned on the first side surface 15c side, and the side dummy portion 20ca And a main surface dummy portion 20cb that is wider than the side dummy portion 20ca as viewed in the x direction (y direction; for example, the maximum width when the width is not constant).

  That is, the main surface dummy portion 20cb has a relatively large width when viewed in the x direction. Accordingly, it is easy to increase the area of the main surface dummy portion 20cb while increasing the distance (x direction) between the first excitation electrode 17 and the main surface dummy portion 20cb. As a result, the mass of the second extraction electrode 20 can be made closer to the mass of the first extraction electrode 19 while reducing the strength of the electric field between the main surface dummy portion 20 cb and the first excitation electrode 17.

  In the present embodiment, the first wiring portion 19a includes a first wiring configuration portion 19aa extending from the first excitation electrode 17 toward the first side surface 15c on the first main surface 15a, and the first main surface 15a. On the first side surface 15c side, the second wiring configuration portion 19ab extending from the first wiring configuration portion 19aa to the center side of the first side surface 15c along the first side surface 15c, and the second wiring configuration portion 19ab on the first side surface 15c. The side that extends to the second main surface 15b side, and the width of the second wiring configuration portion 19ab extends with respect to the width of the first wiring configuration portion 19aa when viewed in the direction orthogonal to the first side surface 15c (x direction). And a third wiring configuration portion 19ac that does not overlap on the opposite side (positive side in the y direction). The connection portion of the first wiring configuration portion 19aa with the second wiring configuration portion 19ab is wider toward the side where the second wiring configuration portion 19ab extends (the negative side in the y direction) toward the second wiring configuration portion 19ab side. Thus, a reverse taper portion 19ae is formed.

  Therefore, as can be understood from the comparison of the width w1 in FIG. 6A and the width w2 in FIG. 6B, it is possible to reduce the narrowing of the first wiring portion 19a. In another aspect, in the manufacturing process, the first wiring component 19aa and the second wiring component 19ab are moved closer to the outer peripheral side, and the strength of the electric field between them and the second excitation electrode 18 is reduced. A large area to be connected to the necessary first connection portion 57 (first inspection wiring portion 63b) can be secured.

  In the piezoelectric device according to the present embodiment, a piezoelectric vibration element that can reduce the influence of the electric field between the excitation electrode and the extraction electrode and the mass of the extraction electrode on the characteristics related to vibration is mounted on the element mounting member. ing. Therefore, the piezoelectric device according to the present embodiment can reduce the influence of the electric field between the excitation electrode and the extraction electrode and the mass of the extraction electrode on the characteristics relating to vibration.

  Moreover, in this embodiment, the crystal piece 15 and the support part 53 are formed in an etching process (step ST1). In the subsequent electrode formation step (step ST2), in addition to the first excitation electrode 17, the second excitation electrode 18, the first extraction electrode 19, and the second extraction electrode 20, the first inspection electrode connected to the first extraction electrode 19 is used. An electrode 63 and a second inspection electrode 65 connected to the second extraction electrode 20 are formed. In the subsequent inspection process (step ST3), the probe is brought into contact with the first inspection electrode 63 and the second inspection electrode 65 for inspection. In the subsequent separation step (step ST4), the crystal piece 15 is separated from the first connection portion 57 and the second connection portion 59. The second extraction electrode 20 has a second dummy portion 20c. The first inspection electrode 63 and the second inspection electrode 65 are located on the surface of the support portion 53 on the first main surface 5a side, and the second inspection electrode 65 passes from the frame portion 55 via the second connection portion 59. Then, it extends to the crystal piece 15 side and is connected to the second dummy portion 20c.

  Therefore, the second dummy portion 20c has not only the effect of bringing the mass of the second extraction electrode 20 close to the mass of the first extraction electrode 19 in the completed vibration element 5, but also in the manufacturing process of the vibration element 5. The second inspection electrode 65 provided on the 5a side can be connected to the second pad portion 20b and the second excitation electrode 18 provided on the second main surface 5b.

  In the above embodiment, the crystal resonator 1 is an example of a piezoelectric device, the vibration element 5 is an example of a piezoelectric vibration element, the crystal piece 15 is an example of a piezoelectric element plate, and the second dummy portion 20c is a dummy portion. It is an example.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The piezoelectric device is not limited to a piezoelectric vibrator such as a crystal vibrator, and may be, for example, a piezoelectric oscillator having an oscillation circuit. In addition, piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators may include electronic elements other than vibration elements, such as ICs (for example, including an oscillation circuit) and thermistors. Further, the piezoelectric body (piezoelectric element plate) is not limited to quartz, and may be ceramic.

  The entire structure including the package (element mounting member or lid) of the piezoelectric device can be changed as appropriate. For example, a piezoelectric vibration element may be mounted on a single layer substrate, and the piezoelectric vibration element may be covered with a metal cap. A recess may be formed on both the upper and lower surfaces of the element mounting member, a vibration element may be disposed in one recess, and a thermistor or IC may be disposed in the other recess.

  The first extraction electrode and the second extraction electrode do not need to extend toward the same side surface of the piezoelectric element plate in plan view of the main surface of the piezoelectric element plate, and do not need to extend on the same side surface of the piezoelectric element plate. Absent. Further, when the lead electrode extends from one main surface of the piezoelectric element plate toward one side surface, it does not need to extend to the other main surface via the one side surface.

  For example, the direction in which the first extraction electrode extends from the first excitation electrode and the direction in which the second extraction electrode extends from the second excitation electrode may be opposite to each other. In addition, the extraction electrode extends from one main surface toward one side surface, and in addition to or instead of the one side surface, passes through another side surface intersecting with the one side surface to the other main surface side. It may extend.

  However, from the viewpoint of making the balance of the vibration element suitable, the first extraction electrode (first wiring portion and first pad portion) and the second extraction electrode (second wiring portion and second pad portion) are piezoelectric. In the plane perspective of the main surface of the element plate, the shape is substantially line symmetrical with respect to the center line parallel to the long side (or short side) of the piezoelectric element plate, or rotated 180 ° with respect to the center of the piezoelectric element plate. A symmetrical shape is preferable.

  DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator (piezoelectric device), 5 ... Vibration element, 15 ... Crystal piece (piezoelectric element board), 15a ... 1st main surface, 15b ... 2nd main surface, 15c ... 1st side surface (side surface), 17 ... 1st excitation electrode, 18 ... 2nd excitation electrode, 19 ... 1st extraction electrode, 19a ... 1st wiring part, 19b ... 1st pad part, 20 ... 2nd extraction electrode, 20a ... 2nd wiring part, 20b ... 1st 2 pad part, 20c ... dummy part.

Claims (7)

A first main surface, a second main surface on the back surface thereof, and a rectangular piezoelectric element plate having four side surfaces located on the outer periphery of these main surfaces;
A first excitation electrode located on the center side of the first main surface;
A second excitation electrode located on the center side of the second main surface;
A first extraction electrode extending from the first excitation electrode;
A second extraction electrode extending from the second excitation electrode;
Have
The first extraction electrode is
A first wiring portion extending from the first excitation electrode on the first main surface and extending to the second main surface via any one of the side surfaces;
A first pad portion located on the second main surface and connected to the first wiring portion;
The second extraction electrode is
A second wiring portion extending from the second excitation electrode on the second main surface;
The first excitation electrode of the first pad portion is located on the second principal surface and connected to the second wiring portion, and the distance between the first excitation electrode and the first excitation electrode in a plan view of the first principal surface is A second pad portion equivalent to the distance between and
It extends to the first main surface through one of the side from the second pad part, in a plan fluoroscopic of the first major surface, the first excitation of the portion located on the first major surface And a dummy part having a distance from the electrode that is longer than a distance from the first excitation electrode of the second pad part. A first main surface, a second main surface on the back surface thereof, and a rectangular piezoelectric element plate having four side surfaces located on the outer periphery of these main surfaces;
A first excitation electrode located on the center side of the first main surface;
A second excitation electrode located on the center side of the second main surface;
A first extraction electrode extending from the first excitation electrode;
A second extraction electrode extending from the second excitation electrode;
Have
The first extraction electrode is
A first wiring portion extending from the first excitation electrode on the first main surface and extending to the second main surface via any one of the side surfaces;
A first pad portion located on the second main surface and connected to the first wiring portion;
The second extraction electrode is
A second wiring portion extending from the second excitation electrode on the second main surface;
A second pad portion located on the second main surface, connected to the second wiring portion and having an area equivalent to the area of the first pad portion;
A dummy portion extending from the second pad portion to the first main surface via any one of the side surfaces, and having an area of a portion located on the first main surface smaller than an area of the second pad portion; The piezoelectric vibration element. The first wiring portion extends from the first excitation electrode to the one side surface side on the first main surface, and extends to the second main surface side via the one side surface,
The first pad portion is located on the one side surface side of the second main surface, and is connected to the first wiring portion,
The second wiring portion extends from the second excitation electrode to the one side surface on the second main surface,
The second pad portion is located on the one side surface side in the second main surface, and is connected to the second wiring portion,
The piezoelectric vibration element according to claim 1, wherein the dummy portion extends from the second pad portion to the first main surface via the one side surface. The dummy part is
A side dummy portion extending from the second main surface side to the first main surface side in the one side surface and having a width narrower than that of the second pad when viewed in a direction orthogonal to the one side surface;
A main surface dummy portion located on the one side surface in the first main surface, connected to the side surface dummy portion, and having a width wider than the side surface dummy portion when viewed in a direction orthogonal to the one side surface; The piezoelectric vibration element according to claim 1 or 2. The first wiring part is
A first wiring component extending from the first excitation electrode to the one side surface in the first main surface;
A second wiring configuration portion extending from the first wiring configuration portion to the central side of the one side surface along the one side surface on the one side surface side of the first main surface;
The one side surface extends from the second wiring configuration part to the second main surface side, and the width of the one side surface is perpendicular to the one side surface with respect to the width of the first wiring configuration unit. A third wiring component that does not overlap on the side opposite to the side on which the second wiring component extends, and
A reverse taper portion is formed at the connection portion of the first wiring configuration portion with the second wiring configuration portion so that the width of the second wiring configuration portion becomes wider toward the side where the second wiring configuration portion extends. The piezoelectric vibration element according to claim 1 or 2. The piezoelectric vibration element according to any one of claims 1 to 5,
An element mounting member having a pair of element mounting pads connected to the first pad section and the second pad section by a pair of bumps;
A piezoelectric device having An etching process for etching the piezoelectric wafer;
Forming an electrode on the etched piezoelectric wafer; and
An inspection process for inspecting the piezoelectric wafer after electrode formation;
A separation step of separating the piezoelectric wafer after inspection;
Have
In the etching step,
A first main surface, a second main surface on the back surface thereof, and a rectangular piezoelectric element plate having four side surfaces located on the outer periphery of these main surfaces;
Forming a frame part positioned on the outer periphery of the piezoelectric element plate, and a support part having a connection part for connecting any one of the side surfaces of the piezoelectric element plate and the frame part;
In the electrode forming step,
A first excitation electrode located on the center side of the first main surface;
A second excitation electrode located on the center side of the second main surface;
A first extraction electrode extending from the first excitation electrode;
A second extraction electrode extending from the second excitation electrode;
A first inspection electrode located on the surface of the support and connected to the first extraction electrode;
Forming a second inspection electrode located on the surface of the support and connected to the second extraction electrode;
In the inspection step, a probe is brought into contact with the first inspection electrode and the second inspection electrode for inspection,
In the separation step, the piezoelectric element plate and the connection portion are separated,
The first extraction electrode is
A first wiring portion extending from the first excitation electrode on the first main surface and extending to the second main surface via any one of the side surfaces;
A first pad portion located on the second main surface and connected to the first wiring portion;
The second extraction electrode is
A second wiring portion extending from the second excitation electrode on the second main surface;
The first excitation electrode of the first pad portion is located on the second principal surface and connected to the second wiring portion, and the distance between the first excitation electrode and the first excitation electrode in a plan view of the first principal surface is A second pad portion equivalent to the distance between and
It extends to the first main surface through one of the side from the second pad part, in a plan fluoroscopic of the first major surface, the first excitation of the portion located on the first major surface A dummy portion having a distance from an electrode longer than a distance from the first excitation electrode of the second pad portion,
The first inspection electrode and the second inspection electrode are located on a surface of the support portion on the first main surface side,
The second inspection electrode extends from the frame portion to the piezoelectric element plate side via the connection portion, and is connected to the dummy portion.

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