JP6289880B2 - Thin film forming method and thin film forming apparatus - Google Patents

Description

  The present invention relates to a thin film forming method and a thin film forming apparatus for forming a thin film by discharging a thin film material formed into droplets toward a region where a thin film is to be formed on a surface of a substrate.

  A technique for forming a thin film on the surface of a substrate by discharging a liquid thin film material from a nozzle head (inkjet head) is known (for example, Patent Document 1). As the thin film material, a photocurable resin (for example, an ultraviolet curable resin) is used. By irradiating the thin film material attached to the substrate with light for curing, the thin film material is cured to form a thin film.

  In the method disclosed in Patent Document 2, first, an edge pattern is formed by landing a thin film material formed into droplets on the edge of a region where a thin film is to be formed. After forming the edge pattern, the thin film material is landed inside the region where the thin film is to be formed, thereby covering the region where the thin film is to be formed with the liquid thin film material. Thereafter, the thin film material is cured by irradiating the liquid thin film material with light for curing.

  The edge pattern blocks the flow of the liquid thin film material. Inside the region where the thin film is to be formed, the thin film material that has landed on the substrate surface continues in the lateral direction, and a liquid film having a flat surface is formed. Since the thin film material is cured after the surface becomes flat, a thin film with a flat surface can be formed.

Japanese Patent No. 3544543 International Publication No. 2013/011775

  When the edge pattern is formed, the thin film material lands at a plurality of points in the width direction of the edge pattern corresponding to the thickness of the edge pattern. According to the evaluation experiment of the present inventor, it was confirmed that the end face of the thin film was inclined and the inclination angle thereof varied depending on the location. An object of the present invention is to provide a thin film forming method and a thin film forming apparatus capable of increasing the inclination of the end face of the thin film and reducing the variation in the inclination angle depending on the location.

According to one aspect of the invention,
Forming an edge pattern along the edge of the thin film formation region by making the thin film material droplets and landing on the edge of the thin film formation region on the surface of the substrate, and curing the landed thin film material;
After the edge pattern is formed, the thin film material is landed on the frame area inside the edge of the thin film forming area extending from the edge pattern toward the inside of the thin film forming area, and the thin film material that has landed A step of forming a bank pattern by curing
After forming the bank pattern, landing the thin film material on the inner side of the bank pattern, and covering a region on the inner side of the bank pattern with the liquid thin film material;
Curing the liquid thin film material inside the bank pattern,
The shape of the thin film formation region is defined by image data consisting of a plurality of pixels arranged in a two-dimensional direction,
In the step of forming the edge pattern, the edge pattern is formed by one continuous pixel.
Thin film forming method to land the droplets before Symbol thin film material on the edge of the film forming region is provided that.

According to another aspect of the invention,
A stage for holding a substrate;
A nozzle head having a plurality of nozzle holes facing the substrate held on the stage and discharging droplets of a photocurable thin film material on the surface of the substrate;
A light source for irradiating the thin film material attached to the substrate with light for curing;
A moving mechanism for moving the substrate relative to the nozzle head and the light source;
Image data defining a thin film formation region is stored on the surface of the substrate by specifying a coating pixel on which a droplet of the thin film material is to be landed among a plurality of pixels arranged in a two-dimensional direction, A control device for controlling the nozzle head and the moving mechanism based on image data;
The controller is
One landed before Symbol thin film material the edges of the thin film forming region formed by a succession of said pixels, said thin film material is hardened edge pattern deposited are formed on the substrate,
After the edge pattern is formed, the thin film material has landed on the frame area inside the edge of the thin film forming area extending from the edge pattern toward the inside of the thin film forming area, and the thin film material that has landed The bank pattern is formed by hardening
After the bank pattern is formed, the thin film material lands on the inner side of the bank pattern, and the inner area of the bank pattern is covered with the liquid thin film material, and the inner area of the bank pattern. There is provided a thin film forming apparatus for controlling the nozzle head and the moving mechanism so that the liquid thin film material is cured.

  By causing the thin film material to land on the pixels arranged in a line along the edge of the thin film formation region and forming an edge pattern in advance, the variation in the inclination angle of the end face of the thin film can be reduced. Furthermore, it can suppress that the inclination of an end surface becomes gentle.

FIG. 1 is a schematic front view of a thin film forming apparatus according to an embodiment. FIG. 2A is a perspective view of a nozzle unit of the thin film forming apparatus according to the embodiment, and FIG. 2B is a bottom view of the nozzle unit. FIG. 3 is a plan view of the stage and the nozzle unit of the thin film forming apparatus according to the embodiment. FIG. 4 is a plan view of a substrate showing an example of a planar shape of a thin film to be formed on the substrate. FIG. 5A is a diagram showing a part of image data in a bitmap format that defines the shape of a thin film formation region, and FIG. 5B shows a pixel applied with a thin film material when an edge pattern is formed by a method according to a reference example. FIG. 6A to 6G are cross-sectional views of the substrate in each step when a thin film is formed by the thin film forming method according to the reference example. FIG. 7A is a plan view of a substrate on which an edge pattern is formed by the thin film forming method according to the embodiment, and FIG. 7B is a plan view of the substrate on which the edge pattern and the thin film are formed. FIG. 8 is a diagram showing a coating pixel when an edge pattern is formed by the thin film forming method according to the embodiment. 9A to 9F are cross-sectional views of the substrate in each process when a thin film is formed by the thin film forming method according to the embodiment. 10A is a plan view of a substrate on which an edge pattern and a bank pattern are formed by a thin film forming method according to another embodiment, and FIG. 7B is a plan view of the substrate on which an edge pattern, a bank pattern, and a thin film are formed. . 11A to 11D are cross-sectional views of the substrate in each step when a thin film is formed by the thin film forming method according to the embodiment shown in FIGS. 10A to 10B.

In FIG. 1, the schematic front view of the thin film forming apparatus by an Example is shown. A moving mechanism 21 on the base 20
The stage 22 is supported via An xyz orthogonal coordinate system is defined in which the x-axis and the y-axis are directed horizontally and the z-axis is directed vertically upward. The moving mechanism 21 is controlled by the control device 50 to move the stage 22 in the x direction and the y direction. The moving mechanism 21 may have a function of changing the posture of the stage 22 in the rotation direction with the direction parallel to the z-axis as the rotation center.

  A substrate 60 on which a thin film is to be formed is held on the upper surface (holding surface) of the stage 22. The substrate 60 is fixed to the stage 22 by, for example, a vacuum chuck. A nozzle unit 30 is supported above the stage 22 so as to be movable up and down. The nozzle unit 30 includes a plurality of nozzle heads. The nozzle head has a plurality of nozzle holes facing the substrate 60. From each nozzle hole, a photocurable (for example, ultraviolet curable) thin film material is formed into droplets and discharged toward the surface of the substrate 60. The discharge of the thin film material is controlled by the control device 50.

  FIG. 1 shows an example in which the nozzle unit 30 is stationary with respect to the base 20 and the substrate 60 is moved. Conversely, the substrate 60 is stationary with respect to the base 20 and the nozzle unit 30 is moved. May be. In this way, one of the substrate 60 and the nozzle unit 30 may be moved relative to the other.

  FIG. 2A shows a perspective view of the nozzle unit 30. A plurality of, for example, two nozzle heads 32 are attached to the base plate 31 side by side in the y direction. Each of the nozzle heads 32 has a plurality of nozzle holes 33 arranged in the x direction. Curing light sources 40 are respectively attached between two nozzle heads 32 adjacent in the y direction and further outside the nozzle heads 32 at both ends. The curing light source 40 irradiates the thin film material attached to the substrate 60 (FIG. 1) with curing light (for example, ultraviolet light).

  FIG. 2B shows a bottom view of the nozzle unit 30. Two nozzle heads 32 are arranged side by side in the y direction. A curing light source 40 is disposed between the two nozzle heads 32 and further outside the outermost nozzle head 32. The nozzle holes 33 of the nozzle head 32 are staggered in the x direction. Focusing on one nozzle head 32, as an example, nozzle holes 33 are arranged at a pitch corresponding to 300 dpi in the x direction. One nozzle head 32 is arranged with respect to the other nozzle head 32 so as to be shifted in the x direction by half the nozzle pitch. For this reason, the nozzle holes 33 of the two nozzle heads 32 as a whole are arranged at a pitch corresponding to 600 dpi in the x direction.

  FIG. 3 shows a plan view of the stage 22, the substrate 60, and the nozzle unit 30. The substrate 60 is held on the holding surface of the stage 22. The nozzle unit 30 is supported above the substrate 60. A nozzle head 32 and a curing light source 40 are attached to the nozzle unit 30. The moving mechanism 21 is controlled by the control device 50 to move the stage 22 in the x direction and the y direction. The control device 50 controls the discharge of the thin film material from the nozzle head 32.

  By moving the substrate 60 in the y direction and discharging the thin film material from the nozzle holes 33 (FIG. 2B), the thin film material can be landed on the substrate 60 with a resolution of 600 dpi in the x direction. The thin film material adhering to the substrate 60 is cured by the light emitted from the curing light source 40 located on the downstream side in the moving direction of the substrate 60. The process of making the thin film material into droplets from the nozzle holes 33 and ejecting them while moving the substrate 60 in the y direction is referred to as “scanning”. The thin film material can be landed on the substrate 60 with a resolution of 2400 dpi in the x direction by shifting the substrate 60 in the x direction by ¼ of an interval corresponding to 600 dpi. In the four scans, a unidirectional scan or a reciprocal scan may be performed.

  A region where the thin film material can be applied by four scans is referred to as one path. When the width of one path in the x direction is narrower than the dimension of the substrate 60 in the x direction, the thin film material can be applied to the entire area of the substrate 60 by dividing the surface of the substrate 60 into a plurality of paths.

  When the resolution required for the thin film is 600 dpi, processing of one path can be completed by one scan. Further, when the nozzle unit 30 having a nozzle pitch corresponding to 2400 dpi is used, the processing of one path can be completed by one scan.

  FIG. 4 shows an example of the planar shape of the thin film to be formed on the substrate 60. A region (thin film formation region) 61 in which a thin film is to be formed is defined on the surface of the substrate 60. In FIG. 4, the thin film formation region 61 is hatched. In the example shown in FIG. 4, one thin film formation region 61 includes a circular or rectangular opening 62 inside. The other thin film formation region 61 is circular or square. The substrate 60 corresponds to a core substrate of a build-up substrate, and the thin film corresponds to an interlayer insulating film.

  FIG. 5A shows part of image data in a bitmap format that defines the shape of the thin film formation region 61. This image data is stored in the control device 50 (FIG. 1). A plurality of pixels 63 are arranged in a matrix in the two-dimensional direction of the x direction and the y direction. The pixels 63 constituting the bitmap are defined to have a resolution of 2400 dpi. The shape of the thin film formation region 61 is defined by specifying a pixel on which the thin film material is to be landed (hereinafter referred to as “application pixel 63A”). In FIG. 5A, the application pixel 63A is hatched. The thin film material is not landed on the pixel 63 that at least partially overlaps the opening 62. Hereinafter, the pixel on which the thin film material does not land is referred to as “non-application pixel 63B”.

  A thin film forming method according to a reference example will be described with reference to FIGS. 5B and 6A to 6G. In the reference example, first, an edge pattern along the edge of the thin film formation region 61 is formed. Thereafter, a thin film material is applied to the inside of the thin film formation region 61.

  FIG. 5B shows image data defining a coating pixel 63C on which a thin film material is to be landed when forming an edge pattern among the coating pixels 63A defining the thin film formation region 61. The application pixel 63C is hatched. The application pixels 63 </ b> C for forming the edge pattern are arranged along the edge of the thin film formation region 61. In the width direction of the edge pattern, a plurality of, for example, about three coating pixels 63C are arranged.

  6A to 6E are cross-sectional views of the substrate in each step when a thin film is formed by the thin film forming method according to the reference example. 6A to 6E correspond to cross-sectional views taken along a dashed-dotted line 6-6 in FIG. 5B. 6A to 6G, the thin film material is applied while moving the substrate 60 in the positive y-axis direction (the right direction in FIGS. 6A to 6G).

  As shown in FIG. 6A, the thin film material 65 is landed on the application pixel 63 </ b> C on the substrate 60. The landed thin film material 65 spreads in the lateral direction and covers several pixels around the landed application pixel 63C. FIG. 6B shows a state in which the thin film material 65 is landed on the adjacent application pixel 63C. Since the thin film material 65 landed in the process shown in FIG. 6A has spread to the surrounding pixels, in the stage of FIG. 6B, a new thin film material is placed at a position partially overlapping with the thin film material 65 already applied. 66 will land. The upper surface of the thin film material 65 already attached is inclined so as to become lower from the center toward the outside. For this reason, the thin film material 66 that has landed on the thin film material 65 that has already adhered flows downward (to the left in FIG. 6B) along the inclination of the upper surface of the thin film material 65 below. In FIG. 6B, the boundary between the thin film material 65 that has already adhered and the thin film material 66 that has newly adhered is clearly shown, but in reality, the liquids are mixed and the boundary between the two cannot be distinguished.

  FIG. 6C shows a state in which the thin film material 65 is landed on the adjacent application pixel 63C. The thin film material 67 landed at the stage of FIG. 6C also flows in the left direction of the figure.

  As shown in FIG. 6D, when the thin film materials 65, 66, 67 pass below the curing light source 40 (FIG. 3), the thin film materials 65, 66, 67 are irradiated with curing light 70. Thereby, the thin film materials 65, 66, and 67 are cured, and the edge pattern 71 is formed.

  By repeating the landing and curing of the thin film material, as shown in FIG. 6E, the edge pattern 71 is also formed on the opposite side of the opening 62 as viewed from the edge pattern 71 shown in FIG. 6D. In one scan, the thin film material lands only on some of the application pixels 63C distributed at 600 dpi among the application pixels. By performing the scan four times, the thin film material lands on all the application pixels 63C corresponding to 2400 dpi. Thereby, the edge pattern 71 is completed.

  As shown in FIG. 6F, the thin film material is landed on the pixels inside the thin film formation region 61. At this time, no curing light is irradiated. Thereby, the inside of the thin film formation region 61 is covered with the liquid thin film material 68. The edge pattern 71 blocks the outflow of the thin film material.

  As shown in FIG. 6G, the liquid thin film material 68 is irradiated with curing light 72. Thereby, the thin film material 68 (FIG. 6F) is hardened, and the thin film 69 including the edge pattern 71 (FIG. 6F) is formed. In FIG. 6G, the inclination angle θ1 of the left edge of the thin film 69 (the edge facing the downstream side in the movement direction of the substrate 60) is greater than the inclination angle θ2 of the right edge (the edge facing the upstream side in the movement direction of the substrate 60). large. This is because, in the process shown in FIGS. 6B and 6C, the thin film materials 66 and 67 flow in the left direction in the drawing, so that the slope of the left slope becomes gentle.

  As described above, in the reference examples shown in FIGS. 6A to 6G, the inclination angle of the edge of the thin film 69 varies. Further, the inclination of the end surface facing the upstream side in the moving direction of the substrate 60 becomes gentle. In the embodiment described below, it is possible to reduce the variation in the inclination angle of the edge of the thin film 69 and to prevent the end surface from being gently inclined.

  Next, with reference to FIGS. 7A to 9F, the thin film forming method according to the embodiment will be described. 7A and 7B are plan views of the substrate 60. FIG. The thin film formation region 61 is the same as that shown in FIG. FIG. 8 shows image data defining the shape of the edge pattern along the edge of the thin film formation region 61, and FIGS. 9A to 9F show cross-sectional views of the substrate in each step of the thin film formation method according to the embodiment. 9A to 9F show cross sections taken along one-dot chain line 9-9 of FIGS. 7A to 7B and FIG.

  As shown in FIG. 7A, an edge pattern 75 is formed along the edge of the thin film formation region 61. FIG. 8 shows the application pixel 63D when the edge pattern 75 is formed. In FIG. 8, the application pixel 63D is hatched. The application pixels 63 </ b> D when forming the edge pattern 75 are arranged in a line along the edge of the thin film formation region 61. Of the application pixels 63A (FIG. 5A) that define the thin film formation region 61 (FIG. 7A), pixels that are in line contact with the non-application pixels 63B (FIG. 5A) are applied pixels 63D when the edge pattern 75 is formed. Extracted. The application pixel 63A that is in contact with the non-application pixel 63B only at the apex and the application pixel 63A that is not in contact with the non-application pixel 63B are not extracted as the application pixel 63D when the edge pattern 75 is formed.

The edge pattern 75 is formed by the steps from FIG. 9A to FIG. 9D. First, as shown in FIG. 9A, the thin film material 74 is landed on the application pixel 63D by the first scanning. As shown in FIG. 9B, when the thin film material 74 (FIG. 9A) attached to the substrate 60 passes below the curing light source 40 (FIG. 3), the curing light 73 is irradiated and the thin film material 74 is cured. The The cured thin film material forms part of the edge pattern 75.

  As shown in FIG. 9C, the first scan is continued, and the thin film material 74 is landed on the other application pixel 63D. FIG. 9C shows a state in which the thin film material 74 has landed on the application pixel 63D on the side opposite to the opening 62 when viewed from the edge pattern 75 formed in the step of FIG. 9B. As shown in FIG. 9D, the thin film material 74 is cured by irradiating the thin film material 74 (FIG. 9C) with the curing light 79. The cured thin film material forms part of the edge pattern 75.

  In FIG. 8, numerals “1” to “4” given to the application pixels 63D mean that the application pixels 63D are application pixels 63D on which the thin film material has landed in the first to fourth scans, respectively. . In each scan, the thin film material is landed on the application pixel 63D and the landed thin film material is cured. In one scan, the thin film material lands on the application pixel 63D included in the pixel column selected every three columns in the x direction. By performing the scan four times, the pixel rows are selected without any defects, and the edge pattern 75 is completed.

  As shown in FIG. 7B, a thin film 76 is formed by applying a thin film material inside the thin film formation region 61 and curing it. The thin film 76 is formed by the processes of FIGS. 9E and 9F.

  As shown in FIG. 9E, while the thin film material 74 is landed on the application pixel 63A in the thin film formation region 61, the already landed thin film material 74 is cured. Here, the “internal coating pixel 63A” means that the coating material 63A (FIG. 5A) that defines the thin film formation region 61 is the target of landing of the thin film material 74 when the edge pattern 75 (FIGS. 9A to 9D) is formed. This means a pixel other than the applied pixel 63D (FIG. 8). By performing the scan four times, as shown in FIGS. 7B and 9F, a thin film 76 that has landed and hardened on the application pixel 63A inside the thin film formation region 61 and a thin film 77 including an edge pattern 75 are formed. .

  The effects of the embodiment will be described by comparing the reference example of FIGS. 6A to 6G with the embodiment of FIGS. 9A to 9F. In the embodiment, as shown in FIGS. 9A and 9C, when the thin film material 74 lands on the application pixel 63D (outermost pixel) that defines the edge of the thin film formation region 61, the inner side of the application pixel 63D is reached. No thin film material has landed on these pixels. For this reason, as shown in FIG. 6B, the newly landed thin film material 66 does not flow toward the outside of the thin film formation region 61 due to the inclination of the upper surface of the already landed thin film material 65. . For this reason, the variation in the inclination angle of the end face of the thin film 77 shown in FIG. 9F can be reduced. Furthermore, it is possible to prevent the inclination from becoming gentle.

  Next, another embodiment will be described with reference to FIGS. 10A to 11D. 10A and 10B are plan views of the substrate 60 in each step of the thin film forming method according to this embodiment, and FIGS. 11A to 11D are cross-sectional views of the substrate in each step until the thin film is formed. 11A to 11D each show a cross section taken along one-dot chain line 11-11 of FIGS. 10A and 10B. Also in this embodiment, the edge pattern 75 is formed by executing the steps from FIG. 9A to FIG. 9D.

  As shown in FIG. 10A, a frame region 78 that extends from the edge pattern 75 toward the inside of the thin film formation region 61 is defined on the surface of the substrate 60. A bank pattern 80 is formed by landing a thin film material on the frame region 78 and curing the landed thin film material.

  11A to 11B are cross-sectional views of the substrate 60 in each process until the bank pattern 80 is formed. As shown in FIG. 11A, an edge pattern 75 is formed by landing a thin film material on the application pixel 63D (FIG. 8) on the surface of the substrate 60 and curing it. As shown in FIG. 11B, the bank pattern 80 is formed by landing the thin film material on the application pixel 63A in the frame region 78 and curing the landed thin film material. The frame region 78 is continuous with the application pixel 63D when the edge pattern 75 is formed, and includes a part of the application pixel 63A located inside the thin film formation region 61. The width of the frame region 78 may be approximately equal to the pixel pitch or may be wider than the pixel pitch. The bank pattern 80 is formed by performing the same scanning as the formation of the edge pattern 75 after the edge pattern 75 is formed.

  As shown in FIG. 10B, a thin film 82 is formed in a region surrounded by the bank pattern 80 (FIG. 10A). 11C to 11D are cross-sectional views of the substrate 60 in each process of forming the thin film 82. FIG. As shown in FIG. 11C, the thin film material is landed on the application pixel 63 </ b> A inside the bank pattern 80. Thereby, the inside of the thin film formation region 61 is covered with the liquid thin film material 81. As shown in FIG. 11D, the liquid thin film material 81 (FIG. 11C) is cured. Thereby, the thin film 82 including the edge pattern 75 and the bank pattern 80 is formed.

  Also in the embodiment shown in FIGS. 10A to 11D, as in the embodiment shown in FIGS. 7A to 9F, the variation in the inclination angle of the end face of the thin film 82 shown in FIG. 11D can be reduced. Furthermore, it can suppress that inclination becomes gentle. In this embodiment, the bank pattern 80 is higher than the edge pattern 75. As shown in FIG. 11C, when the thin film forming region 61 is covered with the liquid thin film material 81, the bank pattern 80 blocks the outflow of the liquid thin film material 81. Since the thin film material 81 is cured after the entire thin film forming region 61 is covered with the liquid thin film material 81, the thin film 82 having a flat surface can be formed.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

20 Base 21 Moving mechanism 22 Stage 30 Nozzle unit 31 Base plate 32 Nozzle head 33 Nozzle hole 40 Curing light source 50 Controller 60 Substrate 61 Thin film formation region 62 Opening 63 Pixel 63A, 63C, 63D Coating pixel 63B Non-coating pixel 65, 66 , 67, 68 Thin film material 69 Thin film 70 Curing light 71 Edge pattern 72, 73 Curing light 74 Thin film material 75 Edge pattern 76, 77 Thin film 78 Frame region 79 Curing light 80 Bank pattern 81 Liquid thin film material 82 Thin film θ1, θ2 Tilt angle

Claims (4)

Forming an edge pattern along the edge of the thin film formation region by making the thin film material droplets and landing on the edge of the thin film formation region on the surface of the substrate, and curing the landed thin film material;
After the edge pattern is formed, the thin film material is landed on the frame area inside the edge of the thin film forming area extending from the edge pattern toward the inside of the thin film forming area, and the thin film material that has landed A step of forming a bank pattern by curing
After forming the bank pattern, landing the thin film material on the inner side of the bank pattern, and covering a region on the inner side of the bank pattern with the liquid thin film material;
Curing the liquid thin film material inside the bank pattern,
The shape of the thin film formation region is defined by image data consisting of a plurality of pixels arranged in a two-dimensional direction,
In the step of forming the edge pattern, the edge pattern is formed by one continuous pixel.
Thin film forming method to land the droplets before Symbol thin film material on the edge of the thin film forming region that. The image data is composed of application pixels on which the thin film material is to be landed and non-application pixels on which the thin film material is not landed,
In the step of forming the edge pattern, the thin film material is landed on the application pixel that is in line contact with the non-application pixel among the application pixels, and is not in contact with the non-application pixel or is in contact with only the vertex. The thin film forming method according to claim 1, wherein the thin film material is not landed on the application pixel. A stage for holding a substrate;
A nozzle head having a plurality of nozzle holes facing the substrate held on the stage and discharging droplets of a photocurable thin film material on the surface of the substrate;
A light source for irradiating the thin film material attached to the substrate with light for curing;
A moving mechanism for moving the substrate relative to the nozzle head and the light source;
Image data defining a thin film formation region is stored on the surface of the substrate by specifying a coating pixel on which a droplet of the thin film material is to be landed among a plurality of pixels arranged in a two-dimensional direction, A control device for controlling the nozzle head and the moving mechanism based on image data;
The controller is
One landed before Symbol thin film material the edges of the thin film forming region formed by a succession of said pixels, said thin film material is hardened edge pattern deposited are formed on the substrate,
After the edge pattern is formed, the thin film material has landed on the frame area inside the edge of the thin film forming area extending from the edge pattern toward the inside of the thin film forming area, and the thin film material that has landed The bank pattern is formed by hardening
After the bank pattern is formed, the thin film material lands on the inner side of the bank pattern, and the inner area of the bank pattern is covered with the liquid thin film material, and the inner area of the bank pattern. A thin film forming apparatus for controlling the nozzle head and the moving mechanism so that the liquid thin film material is cured. When the edge pattern is formed, the control device lands the thin film material on the coated pixel that is in line contact with the non-coated pixel that does not land the thin film material, and contacts the non-coated pixel. 4. The thin film forming apparatus according to claim 3, wherein the nozzle head and the moving mechanism are controlled so that the thin film material does not land on the application pixel that is not touching or only touching the apex.

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