JP6277780B2 - Manufacturing method of resin molding - Google Patents

Description

The present invention relates to a method for producing a resin molded body in which a part of the surface of a thermosetting resin member is sealed with a thermoplastic resin member and the remainder of the surface of the thermosetting resin member is exposed from the thermoplastic resin member. .

  Conventionally, as this type of resin molded body, a sealed component made of a substrate on which the component is mounted, a thermosetting resin member made of a thermosetting resin that seals the sealed component, and thermosetting There has been proposed a resin molded body including a thermoplastic resin member made of a thermoplastic resin that seals the surface of the resin member (see, for example, Patent Document 1). Here, the thermoplastic resin member seals the sealing surface which is a part of the surface of the thermosetting resin member, and exposes the exposed surface which is the remaining part of the surface.

  Such a resin molded body is preferable for the thermosetting resin in terms of high adhesion and low stress to the sealed component, and for the thermoplastic resin, each of the dimensional accuracy and toughness of the molded product is good. It takes advantage of it. For example, an epoxy resin etc. are mentioned as a thermosetting resin, PPS (polyphenylene sulfide), PBT (polybutylene terephthalate) etc. are mentioned as a thermoplastic resin.

  The general manufacturing method of such a resin molding is as follows. First, the part to be sealed is covered with a thermosetting resin material that is a raw material of the thermosetting resin member, and this is heated to complete the curing to form a thermosetting resin member, that is, primary molding. I do.

  Next, the thermoplastic resin member is heated by performing injection molding so as to cover the sealing surface of the surface of the thermosetting resin member with the thermoplastic resin material that is a raw material of the thermoplastic resin member. The plastic molding process for forming the film, that is, secondary molding is performed. Thus, a resin molded body is completed.

Japanese Patent No. 3620184

  However, in such a resin molding, since the adhesiveness of the thermoplastic resin to the thermosetting resin is poor, peeling is likely to occur at the interface between the thermosetting resin member and the thermoplastic resin member.

  In this type of resin molded body, as described above, the sealing surface that is a part of the surface of the thermosetting resin member is sealed with the thermoplastic resin member, but the exposed surface that is the remainder of the surface. Is exposed from the thermoplastic resin member.

  Therefore, when peeling occurs at the interface, for example, from the portion exposed to the outside of the interface, that is, from the end located at the boundary between the sealing surface and the exposed surface of the thermosetting resin member of the interface, External moisture, contaminants, and the like enter the resin molded body along the interface.

  In order to deal with such a problem of peeling at the interface, in the conventional publication, after the thermoplastic molding process, another filling material is provided at the end located at the boundary between the sealing surface and the exposed surface of the interface. Is arranged so as to cover the end portion of the interface and prevent peeling of the interface. However, in this case, since it is necessary to use a filling material separately, there is a problem in terms of restrictions on the shape of the resin molded body and cost increase.

  The present invention has been made in view of the above-described problems. In a resin molded body formed by sealing a part of the surface of a thermosetting resin member with a thermoplastic resin member, the thermosetting resin member and the thermoplastic resin are obtained. It aims at improving the adhesiveness with a resin member.

In order to achieve the above object, in the inventions according to claims 1 to 4 , a thermosetting resin member (10) made of a thermosetting resin and a sealing surface (a part of the surface of the thermosetting resin member) 11) and a thermoplastic resin member (20) made of a thermoplastic resin for sealing, and the exposed surface (12) which is the remaining part of the surface of the thermosetting resin member is exposed from the thermoplastic resin member. It is a manufacturing method of a body, Comprising: Furthermore, the following processes are provided.

That is, in the manufacturing method of Claims 1 thru | or 4, a thermosetting resin member is used by using the thermosetting resin material which is a raw material of a thermosetting resin member, heating the thermosetting resin material, and complete | finishing hardening. In at least a part of the sealing surface in the thermosetting resin member and the hardening mold step for forming the functional group, at least a part of the sealing surface is present by removing the surface layer (13) located at the outermost surface. The surface layer removing step of forming the new surface (14) and the thermosetting resin member on which the new surface is formed are chemically bonded to the functional group present on the new surface as a thermoplastic resin material that is a raw material of the thermoplastic resin member. By injection molding the material containing the functional group-containing additive (20a) containing the functional group, the functional group present on the new surface and the functional group-containing additive added to the thermoplastic resin material are present. While the a is chemically bonded functional group, the sealing surface in the thermosetting resin member, characterized in that it comprises a plasticizer molding step of sealing with a thermoplastic resin member.

  Thus, a new surface from which contaminants on the sealing surface are removed is formed at the interface between the sealing surface of the thermosetting resin member and the thermoplastic resin member that seals the sealing surface. Yes. And in this new surface, the chemical bond of the thermosetting resin member and the thermoplastic resin member through the functional group is realized. By this chemical bond, high adhesion can be obtained between the thermosetting resin member and the thermoplastic resin member. Therefore, it is possible to improve the adhesion between the thermosetting resin member and the thermoplastic resin member.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows an example of a corresponding relationship with the specific means as described in embodiment mentioned later.

It is a schematic sectional drawing which shows the semiconductor device as a resin molding concerning 1st Embodiment of this invention. It is the external appearance perspective view which showed typically the thermosetting resin member in the semiconductor device in FIG. It is the figure which expanded the area | region R in FIG. 1 among the cross sections in the manufacturing process of the semiconductor device shown by FIG. It is the figure which expanded the area | region R in FIG. 1 among the cross sections in the manufacturing process following FIG. It is the figure which expanded the area | region R in FIG. 1 among the cross sections in the manufacturing process following FIG. It is the figure which expanded the area | region R in FIG. 1 among the cross sections in the manufacturing process following FIG. It is a graph which shows the effect in the manufacturing method of the semiconductor device concerning the said 1st Embodiment. It is a graph which shows the effect in the manufacturing method of the semiconductor device concerning the said 1st Embodiment. It is a graph which shows the effect in the manufacturing method of the semiconductor device concerning the said 1st Embodiment. It is the external appearance perspective view which showed typically the thermosetting resin member contained in the semiconductor device as a resin molding concerning 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
The resin molded body according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. In FIG. 1, the uneven shape of the roughened surface 11a formed on the surface of the thermosetting resin member 10 to be described later and the height of the step 11b are greatly deformed for easy understanding. In FIG. 2, the roughened surface 11 a formed on the surface of the thermosetting resin member 10 is shown by hatching the surface.

  This resin molded body is mounted on a vehicle such as an automobile, and is applied as a semiconductor device for driving various electronic devices for the vehicle. The semiconductor device as the resin molded body of the present embodiment includes a thermosetting resin member 10 and a thermoplastic resin member 20 that seals a part of the surface of the thermosetting resin member 10.

  The thermosetting resin member 10 is made of a thermosetting resin such as an epoxy resin, and a filler made of an insulating material such as silica or alumina may be contained in the resin as necessary. Such a thermosetting resin member 10 is formed by performing transfer molding, compression molding, molding by a potting method, and thermosetting treatment.

  The thermoplastic resin member 20 is made of a thermoplastic resin such as PPS (polyphenylene sulfide) or PBT (polyphenylene terephthalate), and injection molding is performed so as to seal a part of the thermosetting resin member 10. Is formed. In this thermoplastic resin member 20, a functional group-containing additive 20a is added. The functional group-containing additive 20a is made of a polymer having one or more of a hydroxyl group, an epoxy group, an amino group, a carbonyl group, and the like. This functional group-containing additive 20a chemically reacts with a functional group present on the roughened surface 11a of the thermosetting resin member 10 to enable highly adhesive thermosetting resin-thermoplastic resin bonding.

  When the thermoplastic resin member 20 to which such a functional group-containing additive 20a is added seals a part of the surface of the thermosetting resin member 10, a part of the surface of the thermosetting resin member 10 is The sealing surface 11 is sealed with the thermoplastic resin member 20. And the remainder which is parts other than the sealing surface 11 among the surfaces of the thermosetting resin member 10 is the exposed surface 12 exposed from the thermoplastic resin member 20.

  Here, as shown in FIG. 1 and FIG. 2, the thermosetting resin member 10 is configured to have a rectangular parallelepiped block shape. A part of the surface of the thermosetting resin member 10 on the one end 10a side in the longitudinal direction of the thermosetting resin member 10 is used as a sealing surface 11, and the thermosetting resin on the other end 10b side in the longitudinal direction. The remainder of the surface of the member is an exposed surface 12.

  More specifically, the thermosetting resin member 10 shown in FIGS. 1 and 2 has a rectangular parallelepiped shape having one end surface in the longitudinal direction, the other end surface facing the one end surface, and four side surfaces extending in the longitudinal direction. I am doing. The sealing surface 11 of the thermosetting resin member 10 is a portion on the one end 10a side in the longitudinal direction among the one end surface in the longitudinal direction and the four side surfaces. The exposed surface 12 is the other end surface in the longitudinal direction and a portion on the other end 10b side in the longitudinal direction among the four side surfaces.

  The thermosetting resin member 10 includes therein a semiconductor element 30 as a first sealed component sealed by the thermosetting resin member 10 and an electrical connection member 40 as a second sealed component. Have.

  The semiconductor element 30 which is the first sealed component is a sensor chip made of a silicon semiconductor or the like used for a magnetic sensor, an optical sensor, a pressure sensor, or the like. Such a semiconductor element 30 is formed by a normal semiconductor process.

  For example, in the case of the semiconductor element 30 for a magnetic sensor, the entire semiconductor element 30 is sealed with the thermosetting resin member 10, and the semiconductor element 30 detects external magnetism via the thermosetting resin member 10. Like to do.

  In the case of the semiconductor element 30 for an optical sensor or a pressure sensor, an opening (not shown) for opening a part of the semiconductor element 30 is formed in the thermosetting resin member 10, and the semiconductor element 30 is interposed through the opening. It detects light and pressure.

  On the other hand, the electrical connection member 40, which is the second sealed component, is for electrically connecting the semiconductor element 30 and a wiring member (not shown) outside the semiconductor device. Here, a part 41 of the electrical connection member 40 is covered with the thermosetting resin member 10, and the remaining part 42 protrudes from the sealing surface 11 of the thermosetting resin member 10. Further, the remaining part 42 of the electrical connection member 40 is sealed by the thermoplastic resin member 20 outside the thermosetting resin member 10, and the tip portion thereof is exposed from the thermoplastic resin member 20.

  Here, a part 41 of the electrical connection member 40 is electrically connected to the semiconductor element 30 in the thermosetting resin member 10. Although the connection method with this semiconductor element 30 is not specifically limited, Here, it connects with the bonding wires 50, such as Al and Au.

  On the other hand, the thermoplastic resin member 20 seals the remaining portion 42 of the electrical connection member 40, but the thermoplastic resin member 20 has an opening 21. In the opening 21, a part of the remaining portion 42 of the electrical connection member 40 is exposed to the outside of the thermoplastic resin member 20.

  The opening 21 of the thermoplastic resin member 20 is a portion to which an external wiring member (not shown) such as a connector member is inserted and connected, whereby the external wiring member and the electrical connection member 40 are connected to each other. It is designed to be electrically connected.

  That is, the electrical connection member 40 functions as a device for detecting and outputting the semiconductor element 30, and the semiconductor element 30 can be electrically exchanged with the outside of the apparatus via the electrical connection member 40. Yes. In this embodiment, a terminal terminal made of a rod-shaped member such as Cu or Al is used as such an electrical connection member 40, but a circuit board or the like may be used as the electrical connection member 40.

  In the semiconductor device of this embodiment, a part of the sealing surface 11 in the thermosetting resin member 10 is a roughened rough surface 11a. The roughened surface 11a is formed by a surface layer removing step in the manufacturing method described later, and the roughening degree (surface roughness Ra) of the roughened surface 11a is a sealing other than the roughened surface 11a. It is larger than the surface 11 and the exposed surface 12. Specifically, the surface roughness Ra of the roughened surface 11a is several μm or more (for example, 3 μm or more). In other words, the sealing surface 11 and the exposed surface 12 other than the roughened surface 11a correspond to surfaces on which a surface layer 13 (see FIG. 3) described later exists. The surface roughness Ra is an arithmetic average roughness Ra defined in JIS (abbreviation for Japanese Industrial Standards).

  Further, as described above, the remaining portion 42 of the electrical connection member 40 that is the second sealed component protrudes from the sealing surface 11 of the thermosetting resin member 10 and is sealed by the thermoplastic resin member 20. .

  In the sealing surface 11 located between the exposed surface 12 and the remaining portion 42 of the electrical connection member 40 in the thermosetting resin member 10, the roughened surface 11 a described above is continuous around the remaining portion 42 of the electrical connection member 40. It is provided to make a closed ring shape.

  Here, as shown in FIG. 2, the remaining portion 42 of the electrical connection member 40 protrudes from one end face of the rectangular parallelepiped thermosetting resin member 10. The arrangement pattern of the roughened surface 11a is a closed ring pattern continuous over the four side surfaces of the rectangular parallelepiped thermosetting resin member 10.

  In this embodiment, as shown in FIGS. 1 and 2, the roughened surface 11 a is formed only within the sealing surface 11 of the thermosetting resin member 10, that is, only inside the thermoplastic resin member 20. Has been. For this reason, the edge part of the roughening surface 11a is located inside the thermoplastic resin member 20.

  Here, as described above, the roughened surface 11a is a surface from which the surface layer 13 (see FIG. 3) of the sealing surface 11 has been completely removed, and the surface of the thermosetting resin member 10 other than the roughened surface 11a. A step 11b is formed between them so that the roughened surface 11a is recessed with respect to the portion. The height of the step 11b is several μm or more (for example, 5 μm or more).

  Next, the manufacturing method of the semiconductor device of this embodiment will be described with reference to FIGS. First, in the curing mold step shown in FIG. 3, a thermosetting resin material that is a raw material of the thermosetting resin member 10 is used, and the thermosetting resin material is heated to complete the curing. The member 10 is formed.

  Specifically, in this curing mold process, the semiconductor element 30 and the electrical connection member 40 connected by the bonding wire 50 are sealed by transfer molding, compression molding, potting, etc., and this is heated and cured. To do. Thus, the thermosetting resin member 10 is completed.

  On the outermost surface of the thermosetting resin member 10 formed in this curing mold process, there is a surface layer 13 made of contaminants. Contaminants are present in the constituent material of the thermosetting resin member 10, but are raised on the outermost surface at the time of thermoforming, and are not so much present inside. Here, the contaminant is, for example, a release agent or a foreign matter attached to the surface of the thermosetting resin member 10 during the process. The mold release agent is provided on the mold surface or mixed with the thermosetting resin material itself in order to ensure mold release in the molding, and is made of, for example, siloxane or fatty acid.

  Next, as shown in FIG. 4, a surface layer removing step is performed on the thermosetting resin member 10. In this step, a part of the sealing surface 11 in the thermosetting resin member 10, that is, a portion of the sealing surface 11 where the roughened surface 11 a is formed is removed by removing the surface layer 13 positioned at the outermost surface. This part is defined as a new surface 14.

  Specifically, the surface layer 13 is removed by using a method such as laser irradiation, shot blasting, and polishing with respect to the formation planned position of the roughened surface 11 a in the sealing surface 11. In these methods, the processing surface is cut to form irregularities, and laser irradiation is the most desirable method. The removal depth of the sealing surface 11 when forming the roughened surface 11a may be such that the surface layer 13 can be removed, and may be several μm or more (for example, 5 μm or more).

  By these methods, the surface layer 13 as a contaminant is removed, and the new surface 14 as a base of the surface layer 13 is roughened. As a result, the new surface 14 is provided with a roughened surface 11a to which an anchor effect is imparted and which has excellent adhesion to the thermoplastic resin member 20. Further, the new surface 14 as the roughened surface 11a is actually one or a plurality of hydroxyl groups, epoxy groups, etc. in the thermosetting resin constituting the thermosetting resin member 10, as shown in FIG. Exists as a functional group.

  In the surface layer removal step, particularly when laser irradiation is used, the functional group present in the portion where the new surface 14 is burned and oxidized can further promote the chemical reaction and achieve high adhesion. preferable. It is also desirable to subject the new surface 14 of the thermosetting resin member 10 to corona discharge treatment so that more functional groups such as OH groups are present on the new surface 14.

  Thus, after performing the surface layer removing step, the plastic molding step shown in FIG. 6 is performed. In this step, a thermoplastic resin material to which a functional group-containing additive 20a that is a raw material of the thermoplastic resin member 20 is added is injection-molded on the new surface 14 of the thermosetting resin member 10 in which a functional group exists. For example, a thermoplastic resin material to which the functional group-containing additive 20a is added can be obtained by kneading a polymer having a functional group that becomes the functional group-containing additive 20a into a thermoplastic resin material as a base material. Thereby, the sealing surface 11 in the thermosetting resin member 10 is thermoplastic while the functional group present on the new surface 14 and the functional group present in the functional group-containing additive 20a contained in the thermoplastic resin material are chemically bonded. Sealed with the resin member 20.

  As the chemical bond in this plastic molding step, for example, when the thermosetting resin member 10 is an epoxy resin, the hydroxyl group or epoxy group in the epoxy resin is a hydroxyl group, epoxy group, amino group, It will be chemically bonded to the carbonyl group. And when it is set as the coupling | bonding of hydroxyl groups, the coupling | bonding of epoxy groups, etc., since it becomes a covalent bond, it becomes a chemical bond with higher intensity | strength. That is, as a constituent material of the functional group-containing additive 20a, a covalent bond can be realized by using a material containing at least one functional group that is the same as the functional group contained in the constituent material of the thermosetting resin member 10.

  And by this chemical bond, the high adhesiveness between the new surface 14 (namely, roughening surface 11a) and the thermoplastic resin member 20 in the thermosetting resin member 10 can be obtained. Thus, the semiconductor device as the resin molded body of this embodiment is completed.

  In addition, since each process after said surface layer formation process processes selectively with respect to a part of surface of the thermosetting resin member 10, masking etc. are suitably performed on the surface which does not process. After applying, each step is performed.

  By the way, according to the manufacturing method, contaminants on the sealing surface 11 are removed at the interface between the sealing surface 11 of the thermosetting resin member 10 and the thermoplastic resin member 20 that seals the sealing surface 11. The formed new surface 14 is formed. On this new surface 14, a chemical bond between the thermosetting resin member 10 and the thermoplastic resin member 20 is realized via the functional group.

  And by this chemical bond, high adhesiveness can be obtained between the thermosetting resin member 10 and the thermoplastic resin member 20. Therefore, according to the present embodiment, it is possible to improve the adhesion between the thermosetting resin member 10 and the thermoplastic resin member 20.

  Moreover, in the sealing form of the thermoplastic resin member 20 like this embodiment, it is located in the boundary of the sealing surface 11 and the exposed surface 12 among the interfaces of the thermosetting resin member 10 and the thermoplastic resin member 20. Intruding substances such as external moisture and contaminants may enter the apparatus along the interface from the end portion. In particular, in the case of an in-vehicle semiconductor device like this embodiment, there is a risk that contaminants such as moisture and oil existing in the use environment may enter.

  At this time, when the remaining part 42 of the electrical connection member 40 which is a part to be sealed protrudes from the sealing surface 11 of the thermosetting resin member 10 and is sealed with the thermoplastic resin member 20 as in the present embodiment. The above intruding substances may adhere to the remaining part of the electrical connection member 40 and adversely affect the characteristics and the like.

  In this respect, in the present embodiment, a portion of the sealing surface 11 of the thermosetting resin member 10 that is located between the exposed surface 12 and the remaining portion 42 of the electrical connection member 40 protruding from the sealing surface 11 is rough. The chemical surface 11a is provided so as to form the above-described closed ring shape.

  And this closed-ring-shaped part is the site | part from which peeling is prevented since the high adhesiveness is acquired as mentioned above. Therefore, according to the present embodiment, it is possible to prevent the intruding substance from reaching the remaining portion 42 of the electrical connection member 40 from the exposed surface 12 side through the interface between the two resin members 10 and 20 as much as possible.

  Here, the effect of improving the adhesion between the two resin members 10 and 20 by the removal of the surface layer 13 and the chemical bonding will be described more specifically with reference to FIGS. The examples shown in FIGS. 7 to 9 are merely examples showing the effect of improving the adhesion, and the effect is not limited to this.

  In the examples of FIGS. 7 to 9, a rectangular plate-shaped test piece made of a thermosetting resin corresponding to the thermosetting resin member 10 and a rectangular plate-shaped test made of a thermoplastic resin corresponding to the thermoplastic resin member 20. Based on the said manufacturing method, the resin molding was produced so that it might be in the state by which the piece was bonded together. And the shear strength (unit: MPa) of the bonding part of these both test pieces is measured.

  In the experiment in the example of FIG. 7, first, a general semiconductor sealing epoxy resin was transfer molded, and then the surface was irradiated with laser to form a new surface 14 constituted by the roughened surface 11 a. Then, the thermoplastic resin member 20 is formed by injection molding of PPS which becomes the thermoplastic resin material, and the case where the epoxy resin which becomes the functional group-containing additive 20a is added as the thermoplastic resin material is added. For each case, the shear strength was evaluated. FIG. 7 shows the evaluation result.

  As shown in this figure, when the functional group-containing additive 20a is added as in this embodiment, compared with the case where the functional group-containing additive 20a is not added, the shear strength is greatly improved, that is, It was confirmed that the adhesion of both the resin members 10 and 20 was dramatically improved. Specifically, when the functional group-containing additive 20a is not added, the shear strength remains at about 5 MPa, whereas when added, the shear strength increases to 27 MPa. As described above, when the functional group-containing additive 20a is not added, chemical bonding by the functional group is not performed and adhesion improvement is not realized, but when added, the chemical bonding by the functional group is performed and the adhesion is not achieved. It is thought that the improvement was made.

  Next, FIG. 8 and FIG. 9 respectively show the relationship between the surface roughness Ra (unit: μm) of the roughened surface 11a and the shear strength when laser irradiation is used as a method used in the surface layer removal step, and the processing depth. The relationship between the thickness Z (unit: μm) and the shear strength is investigated. In the figure, circles represent the results of individual experiments, and bars represent the average values of the results of experiments when the surface roughness Ra or machining depth Z is the same. The processing depth Z corresponds to the height of the step 11b. In laser irradiation, the surface layer 13 was removed by scanning the surface of the laser.

  As shown in FIGS. 8 and 9, it is estimated that sufficient adhesion strength can be obtained if processing is performed in the surface layer removing step so that Ra ≧ 3 μm and Z ≧ 5 μm when laser irradiation is performed. it can.

  In addition to laser irradiation, similar experiments were performed by shot blasting and polishing. In shot blasting, the surface layer 13 was removed by spraying alundum (alumina powder # 80) on the surface. In the polishing, the surface layer 13 was removed by manual polishing (manual polishing by hand) with polishing paper (# 80). Even in these cases, it was confirmed that sufficient adhesion strength can be obtained by performing the same processing as in the case of laser irradiation in the surface removal step.

  Further, according to the experimental results, the adhesion was in the order of laser irradiation> shot blast> polishing. This is presumably because, when laser irradiation is used, the functional group present in the portion where the new surface 14 is burned and oxidized can further promote the chemical reaction and achieve high adhesion. Therefore, the method is not limited as long as the surface layer 13 can be removed, but it can be said that laser irradiation is preferable if high adhesion strength is required. Of course, shot blasting and polishing can be employed as long as surface roughness Ra and processing depth Z equivalent to laser irradiation can be realized.

(Second Embodiment)
The principal part of the semiconductor device as a resin molded body according to the second embodiment of the present invention will be described with reference to FIG. This embodiment is different from the first embodiment in that the arrangement pattern of the roughened surface 11a in the thermosetting resin member 10 is changed, and here, the difference will be mainly described. To do.

  In the said 1st Embodiment, as shown in the said FIG. 2, the arrangement pattern of the roughening surface 11a is made into the closed annular pattern which continues over four side surfaces in the rectangular parallelepiped thermosetting resin member 10. FIG. It was.

  On the other hand, in this embodiment, as shown in FIG. 10, the roughened surface 11 a is arranged only on the end surface on the one end 10 a side, that is, on one end surface of the rectangular parallelepiped thermosetting resin member 10.

  Also in this case, the arrangement pattern of the roughened surface 11a has a closed ring shape surrounding the remaining portion 42 of the electrical connection member 40 protruding from the one end surface which is the sealing surface 11. In this case as well, the effect of the closed ring pattern is exhibited as in the first embodiment.

(Other embodiments)
In each of the above-described embodiments, the roughened surface 11a is provided on a part of the sealing surface 11 of the thermosetting resin member 10 as shown in FIGS. 1, 2, and 10. The sealing surface 11 may be provided on the entire surface. That is, the roughened surface 11 a may be provided on at least a part of the sealing surface 11.

  Further, there is no problem even if the roughened surface 11 a is formed up to the exposed surface 12 in addition to the sealing surface 11. Furthermore, the roughened surface 11 a may be formed on the entire surface of the thermosetting resin member 10.

  Moreover, when providing the roughening surface 11a in a part of the sealing surface 11, the continuous closed ring arrangement pattern as described above is preferable, but in addition, the roughening surface 11a is disposed on the sealing surface 11. It may be arranged in an island shape.

  Further, in FIG. 1, since the roughened surface 11 a is provided within the range of the sealing surface 11, the step 11 b is sealed inside the thermoplastic resin member 20. On the other hand, the roughened surface 11a may have a structure formed continuously from the sealing surface 11 in the thermosetting resin member 10 to a part of the exposed surface 12, and in this case, the step 11b. Is exposed from the thermoplastic resin member and is visible.

  Further, the first sealed component and the second sealed component may be anything as long as they can be sealed with the thermosetting resin member 10, and the semiconductor element 30 and the electrical connection member described above. It is not limited to 40 or a circuit board.

  Moreover, the shape of the thermosetting resin member 10 is not limited to the above-mentioned rectangular parallelepiped shape, and may be spherical, other shapes, and the like. The thermoplastic resin member 20 may be sealed as long as a part of the surface of the thermosetting resin member 10 is sealed and the remaining part is exposed. The one end 10a side is not limited to the sealing surface 11 and the other end 10b side is an exposed surface.

  Moreover, in the said embodiment, the resin molding is a semiconductor device, The semiconductor element 30 etc. which become the to-be-sealed components sealed with the thermosetting resin member 10 etc. are provided in the thermosetting resin member 10 inside. It was what was done. However, the resin molded body is not limited to such a semiconductor device. For example, the thermosetting resin member 10 may have a configuration without a sealed component.

  Further, the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope described in the claims. The above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible, and the above embodiments are not limited to the illustrated examples. Absent. In each of the above-described embodiments, it is needless to say that elements constituting the embodiment are not necessarily indispensable except for the case where it is clearly indicated that the element is essential and the case where the element is clearly considered essential in principle. Yes. Further, in each of the above embodiments, when numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is clearly limited to a specific number when clearly indicated as essential and in principle. The number is not limited to the specific number except for the case. Further, in each of the above embodiments, when referring to the shape, positional relationship, etc. of the component, etc., the shape, unless otherwise specified and in principle limited to a specific shape, positional relationship, etc. It is not limited to the positional relationship or the like.

DESCRIPTION OF SYMBOLS 10 Thermosetting resin member 11 Sealing surface in thermosetting resin member 11a Roughening surface 12 Exposed surface in thermosetting resin member 13 Surface layer 14 New surface 20 Thermoplastic resin member 20a Functional group containing additive 30 Semiconductor element 40 Electricity Connecting member

Claims (4)

A thermosetting resin member (10) made of a thermosetting resin;
A thermoplastic resin member (20) made of a thermoplastic resin that seals a sealing surface (11) that is a part of the surface of the thermosetting resin member,
The exposed surface (12) which is the remaining part of the surface of the thermosetting resin member is a method for producing a resin molded body exposed from the thermoplastic resin member,
Using a thermosetting resin material that is a raw material of the thermosetting resin member, by heating the thermosetting resin material to complete the curing, a curing mold step for forming the thermosetting resin member;
In at least a part of the sealing surface in the thermosetting resin member, a surface layer (13) located at the outermost surface is removed to remove at least a part of the sealing surface as a new surface (14). A surface layer removing step,
A functional group-containing addition containing a functional group chemically bonded to a functional group present on the new surface as a thermoplastic resin material that is a raw material of the thermoplastic resin member to the thermosetting resin member on which the new surface is formed The material added with the agent (20a) is injection-molded to chemically bond the functional group present on the nascent surface and the functional group present in the functional group-containing additive added to the thermoplastic resin material. And a plastic molding step of sealing the sealing surface of the curable resin member with the thermoplastic resin member.   The said surface layer removal process is performed by irradiating a laser with respect to at least one part of the said sealing surface in the said thermosetting resin member, The resin molding of Claim 1 characterized by the above-mentioned. Production method. In the curing mold step, as a constituent material of the thermosetting resin member, a material including any one or more of a hydroxyl group and an epoxy group as a functional group is used.
2. The plastic molding step is characterized in that a material containing any one or more of a hydroxyl group, an epoxy group, an amino group, and a carbonyl group as a functional group is used as a constituent material of the functional group-containing additive. Or the manufacturing method of the resin molding of 2. In the curing mold step, as a constituent material of the thermosetting resin member, a material including any one or more of a hydroxyl group and an epoxy group as a functional group is used.
In the plastic molding step, as the constituent material of the functional group-containing additive, a material containing at least one functional group that is the same as the functional group contained in the constituent material of the thermosetting resin member is used. The method for producing a resin molded body according to claim 1, wherein the resin group is covalently bonded to a functional group contained in a constituent material of the resin member.

Images