JP6275965B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device.

  Conventionally, lighting devices for various applications have been devised. For example, indoor lighting, outdoor lighting, studio lighting, stage equipment, and the like are known. In particular, studio lighting and stage equipment demanded brighter light, and halogen bulbs and discharge lamps were often used as light sources.

  On the other hand, the performance of LED as a new light source is improved day by day, and various types of light sources that realize a white light source in combination with a phosphor have been devised. In recent years, a white light source combining a blue LED and a yellow phosphor has been devised as a light source for studio lighting or the like (see Patent Document 1).

JP 2012-89394 A

  However, since the LED has directivity, the luminous intensity in the central axis direction is high, and the luminous intensity tends to decrease as the distance from the central axis increases. On the other hand, the phosphor emits Lambertian light when excited by light emitted from the LED. Therefore, in a white LED chip in which a blue LED and a yellow phosphor are combined, the ratio of the yellow component increases as the distance from the front of the chip increases, and color unevenness occurs.

  In addition, when the above-described white LED chip is used as a large light source for studio lighting or the like, a plurality of LED chips are arrayed to form a module, but the gap between adjacent chips becomes a striped streak. And uneven brightness (light unevenness) occurs.

  This invention is made | formed in view of such a condition, The place made into the objective is to provide the illuminating device which can implement | achieve high quality illumination light.

  In order to solve the above problems, an illumination device according to an embodiment of the present invention is excited by at least one light-emitting element that emits ultraviolet light or short-wavelength visible light, and light emitted from the light-emitting element, and is included in visible light. A first phosphor that emits light in a first wavelength region, and a second phosphor that is excited by light emitted from the light emitting element and emits light in a second wavelength region included in visible light that is different from the first wavelength region. A light emitting module having a phosphor, a light wavelength conversion member containing a first phosphor and a second phosphor, a light transmitting member for transmitting light emitted from the light emitting module forward, and a light emitting module A heat radiating member that radiates heat generated; and a housing that houses the light emitting module and the light transmitting member. The light wavelength conversion member is integrally disposed at a position spaced from each light emitting surface of at least one or more light emitting elements arranged.

  According to this aspect, since the wavelength range of the light emitted from the light emitting element is not included in the visible light range, for example, the first wavelength range emitted by the first phosphor and the second phosphor emitted by the second phosphor. By realizing the illumination light by color mixing with light in the wavelength range of 2, the color unevenness caused by the irradiation direction can be reduced. The light emitted from the first phosphor and the light emitted from the second phosphor may be in a complementary color relationship, and in that case, white light is realized by color mixture. Further, light emitted from at least one light emitting element spreads to some extent before entering the light wavelength conversion member. Therefore, on the incident surface side of the light wavelength conversion member, the light of the light emitting element is also irradiated to a region facing the gap between the light emitting elements. Therefore, the unevenness of the excitation light incident on the light wavelength conversion member is reduced, and the light emission is made uniform.

  The light wavelength conversion member may be provided on the light incident side surface of the light transmission member. Thereby, since light is diffused by the light wavelength conversion member, the light transmitting member itself need not have a function for diffusing light.

  You may further provide the optical member which condenses the light radiate | emitted from a light emitting element toward an optical wavelength conversion member, and the transparent member in which an optical wavelength conversion member is provided. The transparent member may be made of a material higher than the thermal conductivity of the light wavelength conversion member. Thereby, a light wavelength conversion member can be reduced in size. Moreover, it becomes easy to discharge | release the heat | fever which arises in a light wavelength conversion member outside.

  The light transmission member may be made of a material having a higher thermal conductivity than the light wavelength conversion member. Thereby, it becomes easy to discharge | release the heat | fever which arises in a light wavelength conversion member outside.

  The light emitting element may be arranged on the same side as the light transmitting member with respect to the light wavelength converting member, and may be configured to irradiate light toward the light emitting surface of the light wavelength converting member. Thus, the excitation light emitted from the light emitting element does not excite the phosphor while passing through the light wavelength conversion member, but excites the phosphor near the surface of the light wavelength conversion member, and the phosphor emits. Light is suppressed from being absorbed inside the light wavelength conversion member or scattered by other phosphors.

  The light wavelength conversion member may be configured to move within a predetermined range so that a region where light is incident is changed in the middle of the optical path between the light emitting element and the light transmission member. Thereby, the local heat_generation | fever of a light wavelength conversion member is relieve | moderated.

  At least one of the first phosphor and the second phosphor may be a single crystal or a translucent ceramic. Thereby, deterioration of the light wavelength conversion member is suppressed.

  According to the present invention, high-quality illumination light can be realized.

It is sectional drawing which shows schematic structure of the illuminating device which concerns on this Embodiment. It is sectional drawing of the light transmissive member used for the illuminating device which concerns on this Embodiment. It is the figure which showed typically the light emission model of the light emitting module comprised by blue LED and YAG yellow fluorescent substance. It is the figure which showed typically the light emission model of the light emitting module which concerns on this Embodiment. 5A is a schematic diagram of an emission spectrum of the light emitting module shown in FIG. 3, and FIG. 5B is a schematic diagram of an emission spectrum of the light emitting module shown in FIG. It is a figure which shows schematic structure of the light emitting module which concerns on this Embodiment. It is a figure which shows schematic structure of the light emitting module which concerns on the other Example of this Embodiment. It is a figure which shows schematic structure of the light emitting module which concerns on the other Example of this Embodiment. It is a figure which shows schematic structure of the light emitting module which concerns on the other Example of this Embodiment.

  The present invention will be described below based on preferred embodiments with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate. Further, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

(Lighting device)
First, a schematic configuration of the illumination device will be described. FIG. 1 is a cross-sectional view illustrating a schematic configuration of the illumination device according to the present embodiment.

  Illumination apparatus 100 according to the present embodiment is used as a spotlight, floodlight, caster light, or the like used for illumination in a television studio or the like. A lighting device 100 shown in FIG. 1 radiates heat generated by a light emitting module 102 having at least one semiconductor light emitting element, a light transmitting member 104 that transmits light emitted from the light emitting module 102 forward, and heat generated by the light emitting module 102. And a housing 108 that houses the light emitting module 102 and the light transmitting member 104. When the lighting device 100 is used as a spotlight in a television studio or the like, it is possible to realize irradiation light of 3000 lumens or more by the light emitting module 102 having an emitted light flux of 5000 to 30000 lumens.

(Casing)
The casing 108 is a cylindrical member having a polygonal or circular cross section, and is a lightweight material having good thermal conductivity, such as aluminum, magnesium, titanium, iron, copper, stainless steel, silver, nickel, and the like. And high thermal conductive plastic materials mixed with fillers with good thermal conductivity, such as polyamide, PTFE (polytetrafluoroethylene), POM (polyacetal copolymer), PC (polycarbonate), PI (polyimide), PPE (polyphenylene ether) ), PSU (polysulfone), PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), PAI (polyamideimide), PAR (polyarylate), PES (polyether sulfone), PEEK (polyether ether ketone), PEI (poly) Etherimide) LCP (liquid crystal polymer), PEK (polyetherketone), epoxy resin, urethane resin, phenol resin, phenol aralkyl resin, furan resin, amino resin, unsaturated polyester resin, diallyl phthalate resin, ADC resin, vinyl ester resin, phenoxy resin , Silicone resin, and the like.

Fillers with good thermal conductivity include, for example, metal powder and metal fibers such as aluminum, magnesium, titanium, iron, copper, stainless steel, silver and nickel, or particles formed by plating or vapor deposition of these metals, Al ₂ Examples thereof include powders and fibers such as O ₃ , MgO, BN, AlN, SiC, TiO ₂ , YAG, and C.

  In addition, the housing 108 is formed with a front opening 108a through which light transmitted through the light transmission member 104 passes and a heat radiation opening 108b for releasing heat from the heat radiation mechanism 106 to the outside. Note that in order to more efficiently release the heat from the heat dissipation mechanism 106 to the outside, a configuration in which the heat dissipation mechanism 106 does not fit in the housing 108 or a configuration surrounded by a highly air-permeable mesh may be employed.

  A band 110 is provided on each side of the front opening 108a. The band door 110 can set the irradiation range of the illumination device 100 by adjusting the opening / closing angle. The inner surface 110a of the band door 110 may be formed of a mirror surface or a white surface having a high light reflectance. Thereby, since the light reflected by the inner surface 110a of the band door 110 can also be used as the irradiation light, a brighter irradiation light amount can be realized. Efficiency can be improved and light that can be used as irradiation light can be increased. In addition, in order to control the light irradiation range, the inner surface 110a may be formed of a surface with reduced light reflectance such as black. Or the structure which does not provide the band door 110 may be sufficient as the illuminating device 100. FIG.

  The casing 108 may have a reflecting portion (a mirror surface or a white portion) formed on the inner surface thereof. Thereby, out of the light emitted from the light emitting module 102, the light that has been absorbed by the inner surface of the housing 108 without being directed directly to the light transmitting member 104 is reflected by the inner surface and can be used as irradiation light. Therefore, the utilization efficiency of the light source in the illumination device 100 is improved, and a brighter illumination device can be realized, or irradiation light with the same brightness can be realized with low power consumption.

(Light transmission member)
FIG. 2 is a cross-sectional view of a light transmission member used in the illumination device according to the present embodiment. The light transmitting member 104 shown in FIG. 2 is a Fresnel lens having a saw-like cross section. The light transmitting member 104 is provided so as to slide with respect to the housing 108 so that the relative position with the light emitting module 102 changes.

(Heat dissipation mechanism)
The heat dissipation mechanism 106 is configured to absorb heat generated by the light emitting module 102 and efficiently discharge the heat to the outside. Examples of the heat dissipation mechanism 106 include a heat sink and a heat dissipation fan. Further, in addition to or instead of the heat sink and the heat radiating fan, a Peltier element or a heat pipe may be provided in a mounting portion where the light emitting module 102 is directly mounted. More preferably, the heat dissipation mechanism may be a combination of a Peltier element, a large heat sink at least partially made of Cu, and a large heat dissipation fan. By adopting an efficient heat dissipation mechanism, the temperature of the light emitting module decreases and the light emitting efficiency of the light emitting module increases, so that power consumption can be suppressed. In addition, the heat dissipation mechanism can be reduced in size.

  A water cooling unit may be attached as the heat dissipation mechanism 106. Thereby, compared with the case where a large sized heat sink is employ | adopted, size reduction and weight reduction are achieved. Further, a heat radiation paint may be applied to the heat radiation portion of each member of the heat radiation mechanism 106. Thereby, the heat dissipation per unit area increases, for example, a heat sink can be reduced in size and weight.

(Light emitting module)
Next, the light emitting module will be described. For example, when the whitening method of the LED module employed in the lighting device is a combination of a blue LED and a YAG yellow phosphor, blue light is emitted from the blue LED in the vertical direction, but the blue light is absorbed. The phosphor emits light in Lambertian. FIG. 3 is a diagram schematically showing a light emission model of a light emitting module composed of a blue LED and a YAG yellow phosphor. As in the light emitting module shown in FIG. 3 (hereinafter sometimes referred to as a light emitting module according to a comparative example), pale light is emitted immediately above the dome, yellow light is emitted near the outer periphery of the dome, and the emission color varies depending on the irradiation direction. fluctuate.

  FIG. 4 is a diagram schematically showing a light emission model of the light emitting module according to the present embodiment. The light emitting module 102 illustrated in FIG. 4 includes a semiconductor light emitting element 112, an element mounting substrate 114 on which a plurality of semiconductor light emitting elements 112 are mounted, and an optical wavelength conversion member 22. The light wavelength conversion member 22 is integrally disposed at a position separated from each light emitting surface of the plurality of arranged semiconductor light emitting elements 112. The light wavelength conversion member 22 includes a yellow phosphor 116 and a blue phosphor 118, and a sealing member 120 in which appropriate amounts of the yellow phosphor 116 and the blue phosphor 118 are dispersed. The light wavelength conversion member 22 is formed in a plate shape. The light wavelength conversion member 22 is not limited to the plate shape shown in FIG. 4, and may have other shapes such as a columnar shape, a rectangular parallelepiped shape, a pyramid shape, a cone shape, and a lens shape. As shown in FIG. 4, in the whitening method of the light emitting module according to the present embodiment, the ultraviolet light or short wavelength visible light emitted from the nUV-LED that is the semiconductor light emitting device 112 is almost absorbed by the phosphor, The first phosphor (yellow phosphor 116) and the second phosphor (blue phosphor 118) emit Lambertian light. Therefore, the ratio of blue light to yellow light hardly changes between the dome and the vicinity of the outer periphery of the dome, and the emission color does not vary depending on the irradiation direction.

  5A is a schematic diagram of an emission spectrum of the light emitting module shown in FIG. 3, and FIG. 5B is a schematic diagram of an emission spectrum of the light emitting module shown in FIG. As shown in FIG. 5A, the light emitting module composed of a blue LED and a YAG yellow phosphor realizes blue light in the vicinity of 450 nm in the color of the LED itself, and the emission spectrum in that region is very sharp. It becomes. In peripheral vision, since it is highly sensitive to blue light, if such a light emitting module is used as a light source for studio lighting, the irradiated person will feel uncomfortable glare.

  However, as shown in FIG. 5B, the light emitting module according to the present embodiment realizes blue light in the vicinity of 450 nm with the Lambertian emission of the blue phosphor, and the emission spectrum in that region is broad. It has become. Therefore, the unpleasant glare as described above is reduced.

  Also, when reading a manuscript written in black characters, it is said that it is easier to read when the background is white (achromatic) than when it is cream (chromatic). From such a viewpoint, as in the light emitting module shown in FIG. 5B, irradiation light having a wide wavelength region having a relative intensity of a certain degree or more is preferable as compared with the light emitting module shown in FIG. In this case, since the color rendering property is also improved, the skin of the person illuminated by the irradiation light looks beautiful. Therefore, an illumination device using such a light emitting module may be installed on a desk on which a caster or an announcer sits so as to irradiate the face.

  Below, each member, such as a semiconductor light emitting element with which the light emitting module which concerns on this Embodiment is equipped, fluorescent substance, is explained in full detail.

[Semiconductor light emitting device]
The semiconductor light emitting device 112 is, for example, an LED chip that emits ultraviolet light or short wavelength visible light. For example, an LED chip having a peak wavelength of 380 to 480 nm can be used. A purple LED chip having a peak wavelength of 380 to 430 nm is preferable. As long as it is a light emitting element that emits ultraviolet light or short wavelength visible light, it may be other than an LED, and may be an LD element or an EL element. Moreover, the semiconductor light emitting element 112 used for the light emitting module 102 may be plural in consideration of the light amount and the irradiation range.

[Phosphor combinations]
For example, when the semiconductor light emitting device 112 is a violet LED chip, basically, a yellow phosphor and a blue phosphor are combined. However, in consideration of the color temperature and color rendering required for the irradiation light, a red or green phosphor is appropriately used. You may combine fluorescent substance. All phosphors of each color may be dispersed in the sealing member 120. Alternatively, red and green phosphors may be disposed near the semiconductor light emitting element 112, and the yellow phosphor 116 and the blue phosphor 118 may be dispersed in the sealing member 120. When a blue LED chip is used as the semiconductor light emitting element 112, no blue phosphor is used, or the amount of blue phosphor may be relatively reduced. Furthermore, when a phosphor other than blue is disposed at a position close to the chip and the blue phosphor is disposed at the top, the appearance when not lit is improved.

[Sealing member]
The sealing member 120 is a transparent member that transmits light. For example, a dimethyl silicone resin is used. Other than this, silicones such as phenyl silicone and acrylic silicone, sol-gel (silica, titania, etc.), epoxy, acrylic, polyurethane, polyester, PET (polyethylene terephthalate), fluoropolymer, melamine, PVB (polyvinyl butyral) system, glass system (borosilicate system, aluminosilicate system, soda borosilicate system, etc.) or the like may be used as the sealing member 120. The thickness of the sealing member containing the phosphor is preferably about 0.01 to 30 mm. Further, the phosphor concentration dispersed in the sealing member 120 is preferably about 0.1 to 20 vol%.

  Examples of the method for forming the sealing member 120 include molding using a mold such as coating (dispenser coating, etc.), injection molding, casting, transfer molding, and printing methods such as screen printing, dipping, spraying, and inkjet methods.

[Element mounting board]
The element mounting substrate 114 includes a metal substrate (aluminum substrate, copper substrate, etc.), a ceramic substrate (alumina, aluminum nitride, etc.), a resin substrate (glass epoxy substrate, etc.), a lead frame, and a lead frame integrated with a resin frame. And a flexible substrate (FPC). The substrate is selected in consideration of thermal conductivity, electrical insulation, price, and the like.

[Yellow phosphor]
Examples of the yellow phosphor include the following phosphors that emit light when excited by ultraviolet light (ultraviolet light) or short-wavelength visible light.
^{_{(1) (Ca 1-x}} -y-z-w, Sr x, M II y, Eu z, M R w) 7 (SiO 3) 6 X 2 (M II is, Mg, at least one of Ba and Zn comprises one element, M ^R includes at least one element of rare earth elements and Mn, X includes a plurality of halogen element essentially including Cl or Cl. in addition, x, y, z, w is 0.1 <x <0.7, 0 ≦ y <0.3, 0 <z <0.4, 0 ≦ w <0.1.)
(2) CsM ¹ _1-a P ₂ O ₇ : Eu ²⁺ _a (M ¹ contains at least one element of Ca and Sr, and a is in the range of 0.001 ≦ a ≦ 0.5.)
(3) Ba _2-a MgSi ₂ O ₇ : Eu ²⁺ _a (a is in the range of 0.001 ≦ a ≦ 0.5)
Here, since the yellow phosphor of (1) does not absorb blue light so much, that is, there is little reabsorption of light emitted from the blue phosphor, light is emitted even if the thickness of the resin layer containing the phosphor varies. The color is hard to change. As a result, variation in the chromaticity distribution of the emission color can be suppressed. It should be noted that other than the above-described yellow phosphors may be used as long as the gist of the present invention is met.

[Blue phosphor]
Examples of the blue phosphor include the following phosphors that emit light when excited by ultraviolet light (ultraviolet light) or short-wavelength visible light.
(1) M ¹ a (M ² O ₄ ) _b X _c : Re _d (M ¹ essentially includes one or more elements of Ca, Sr, and Ba, some of which are Mg, Zn, Cd, K, Ag , .M ² which can be replaced by an element of the group consisting of Tl is to replace as essential to P, and part V, Si, as, Mn, Co, Cr, Mo, W, the elements of the group consisting of B X represents at least one halogen element, Re represents Eu ²⁺ and at least one rare earth element or Mn, a is 4.2 ≦ a ≦ 5.8, and b is 2.5 ≦ b. ≦ 3.5, c is in the range of 0.8 <c <1.4, and d is in the range of 0.01 <d <0.1.)
(2) M ¹ _1-a MgAl ₁₀ O ₁₇ : Eu ²⁺ _a (M ¹ is at least one element selected from the group consisting of Ca, Sr, Ba and Zn, and a is 0.001 ≦ a ≦ 0. 5 range.)
(3) M ¹ _1-a MgSi ₂ O ₈ : Eu ²⁺ _a (M ¹ is at least one element selected from the group consisting of Ca, Sr, Ba and Zn, and a is 0.001 ≦ a ≦ 0. The range is 8.)
(4) M ¹ _2-a (B ₅ O ₉ ) X: Re _a (M ¹ is at least one element selected from the group consisting of Ca, Sr, Ba, and Zn, and X is at least one halogen element) Re represents at least one rare earth element or Mn essential for Eu ^2+, and a is in the range of 0.001 ≦ a ≦ 0.5.)
Note that other than the above-described blue phosphor may be used as long as the gist of the present invention is met.

[Red phosphor]
Examples of the red phosphor include the following phosphors that emit light when excited by ultraviolet light (ultraviolet light) or short-wavelength visible light.
(1) Y ₂ O ₂ S: Eu
(2) La ₂ O ₂ S: Eu
(3) (Sr, Ca) S: Eu
(4) CaS: Eu
(5) Ba ₂ Zn ₃ : Mn
(6) CaAlSiN ₃ : Eu
(7) Sr _0.95 Ca _0.95 Eu _0.1 SiO _{4
(8) Na 3 (Y 1} -x Eu x) Si 2 O 7
(9) Ca ₂ SiS ₄ : Eu
(10) Eu ₂ SiS ₄
(11) 3.5MgO.0.5MgF ₂ .GeO ₂ : Mn
_{(12) M (Ga 1-} x Eu x) 2 O 4 (M is Ca, Sr, at least one element of Ba)
Note that other than the above-described red phosphors may be used as long as the gist of the present invention is met.

[Green phosphor]
Examples of the green phosphor include the following phosphors that emit light when excited by ultraviolet light (ultraviolet light) or short-wavelength visible light.
(1) (Si, Al) ₆ (O, N) ₈ : Eu (β sialon)
(2) (Sr _1-xy , Ca _x ) Ga ₂ (Sz, Se _1-z ) 4: Eu ²⁺ _y (0 ≦ x <1, 0 <y <0.2, 0 <x + y ≦ 1, 0 <z ≦ 1)
_{(3) (Sr 1-x} -y-z, Ca x, Ba y, Mg z) 2 SiO 4: Eu 2+ w (0 <x <1,0.5 <y <1,0 <z <1, 0.03 <w <0.2, 0 <x + y + z + w <1)
(4) Y ₃ (Al _1-x , Ga _x ) ₅ O ₁₂ : Ce (0 <x ≦ 1)
(5) CaSc ₂ Si ₃ O ₁₂ : Ce
(6) CaSc ₂ O ₄ : Eu
(7) (Ba, Sr) ₃ Si ₂ O ₃ N: Eu ²⁺
(8) NaBaScSi ₂ O ₇ : Eu ²⁺
(9) ZnS: Cu, Al
(10) BaMgAl ₁₀ O ₁₇ : Eu, Mn
Note that other than the above-described green phosphor may be used as long as the gist of the present invention is met.

  In the light emitting module according to this embodiment described above, the emission color does not vary depending on the irradiation direction. Therefore, the lighting device including the light emitting module according to the present embodiment can realize high-quality irradiation light in which color unevenness on the irradiation surface is suppressed, and an illuminator (studio lighting) that requires high-quality irradiation light. It is suitable for a container etc.). In studio lighting, etc., illuminators with various light distribution patterns are required depending on the purpose of use. Therefore, an optical member such as a lens or a reflecting mirror may be provided for each semiconductor light emitting element included in the light emitting module to realize a light distribution pattern suitable for the purpose of use.

  In the case of the light emitting module according to the comparative example, when a plurality of blue LED chips are arranged, the LED chip may have a grainy appearance due to color unevenness. For this reason, in order to reduce graininess, a diffusion sheet may be disposed around the LED chip, but this leads to an increase in cost and loss of light. On the other hand, since the light emitting module according to the present embodiment has little color unevenness and luminance unevenness, the diffusion sheet can be omitted.

  Next, a light emitting module suitable for the lighting device according to the present embodiment will be described in detail. FIG. 6 is a diagram showing a schematic configuration of the light emitting module according to the present embodiment.

  In the light emitting module 20, a plurality of semiconductor light emitting elements 112 are flip-chip mounted on the element mounting substrate 114 via gold bumps 128. The light emitting module 20 includes a light wavelength conversion member 22 in which a yellow phosphor 116 as a first phosphor and a blue phosphor 118 as a second phosphor are dispersed in a resin.

  The yellow phosphor 116 is excited by light emitted from the semiconductor light emitting element 112 and emits light in the first wavelength range included in visible light. The blue phosphor 118 is excited by light emitted from the semiconductor light emitting element 112 and emits light in a second wavelength range included in visible light, which is different from the first wavelength range. And white light is implement | achieved by the color mixture of the yellow light and blue light which have a complementary color relationship. The light wavelength conversion member 22 is integrally disposed at a position spaced from each light emitting surface 112a of the plurality of semiconductor light emitting elements 112 arranged. As the light wavelength conversion member 22, a material in which various phosphors are dispersed in resin or glass, a single crystal, or a translucent ceramic is suitable. The light wavelength conversion member 22 may be a plate or sheet.

  As described above, in the light emitting module 20, the wavelength range of the light emitted from the semiconductor light emitting element 112 that emits ultraviolet light or short wavelength visible light is not included in the visible light region so much, so the first wavelength emitted from the yellow phosphor 116. By realizing the illumination light by the color mixture of the light in the region and the light in the second wavelength region emitted by the blue phosphor 118, color unevenness caused by the irradiation direction can be reduced.

  In addition, light emitted from the plurality of semiconductor light emitting elements 112 spreads to some extent before entering the light wavelength conversion member 22. Therefore, on the incident surface side of the light wavelength conversion member 22, the light of the semiconductor light emitting element 112 is also irradiated to the region R facing the gap G of the semiconductor light emitting element 112. Therefore, the unevenness of the excitation light incident on the light wavelength conversion member 22 is reduced, and the light emission in the light wavelength conversion member 22 is made uniform. Further, since the light wavelength conversion member 22 and the semiconductor light emitting element 112 are separated from each other, deterioration of the light wavelength conversion member 22 due to ultraviolet rays or short wavelength visible light emitted from the semiconductor light emitting element 112 is suppressed.

The light wavelength conversion member 22 according to the present embodiment is provided on the light incident side surface of the light transmission member 104. The light transmission member 104 may be a transparent member such as a glass plate or a plastic plate for supporting the light wavelength conversion member in addition to the above-described Fresnel lens. Preferably, the light transmissive member 104 is made of a material higher than the thermal conductivity of the light wavelength conversion member 22. Thereby, the heat generated in the light wavelength conversion member 22 is easily released to the outside. Examples of the material having high thermal conductivity include Al ₂ O ₃ , YAG, MgO, BN, AlN, SiC, TiO _{2 and the} like.

  Moreover, since the excitation light emitted from the semiconductor light emitting device 112 becomes diffused light by the phosphor inside the light wavelength conversion member 22, the light transmitting member 104 itself may not have a function for diffusing light. That is, it is not necessary to apply a texture on the surface of the light transmitting member 104 or add a diffusion plate (diffusion film).

  The light wavelength conversion member 22 may be provided on the light exit surface side of the light transmission member 104. In addition, the light wavelength conversion member 22 may be formed by applying a phosphor dispersed in a resin to the incident surface or the emission surface of the light transmitting member 104. The light wavelength conversion member 22 may be formed in a plurality of layers in the first wavelength region and the second wavelength region. With this configuration, re-absorption of the converted light is suppressed, and light extraction efficiency is improved.

  The semiconductor light emitting device 112 shown in FIG. 6 is flip-chip mounted, but may be a surface mount type light emitting module (package). A surface-mounting type light emitting module (package) has, for example, a chip disposed in a white resin recess, and an inner surface of the recess as a reflection portion. Thereby, the light radiate | emitted from the light emitting element can be condensed ahead.

  FIG. 7 is a diagram illustrating a schematic configuration of a light emitting module according to another example of the present embodiment. In the light emitting module 30 shown in FIG. 7, a plurality of semiconductor light emitting elements 112 are flip-chip mounted on the element mounting substrate 114 via gold bumps 128. The light emitting module 30 includes a light wavelength conversion member 22 in which a yellow phosphor 116 as a first phosphor and a blue phosphor 118 as a second phosphor are dispersed in a resin.

  The light wavelength conversion member 22 is integrally disposed at a position spaced from each light emitting surface 112a of the plurality of semiconductor light emitting elements 112 arranged. Further, between the semiconductor light emitting element 112 and the light wavelength conversion member 22, a convex lens as an optical member 24 that condenses the light emitted from the semiconductor light emitting element 112 toward the light wavelength conversion member 22, and the light wavelength conversion member. The transparent member 26 provided with 22 is disposed. Thereby, the optical wavelength conversion member 22 can be reduced in size.

  The transparent member 26 is made of a material higher than the thermal conductivity of the light wavelength conversion member 22. Thereby, the heat generated in the light wavelength conversion member 22 is easily released to the outside. The transparent member 26 is advantageous in terms of heat dissipation by having a larger area than the light wavelength conversion member 22. In addition, on the element mounting substrate 114, a reflective portion 28 is formed so as to surround the semiconductor light emitting element 112. Thereby, the light emitted from the semiconductor light emitting element 112 to the side can also be reflected forward.

  FIG. 8 is a diagram showing a schematic configuration of a light emitting module according to another example of the present embodiment. The light emitting module 40 shown in FIG. 8 includes a light wavelength conversion member 22 disposed on the mirror substrate 32, and a plurality of semiconductor light emitting elements 112 disposed on both sides of the optical path between the light wavelength conversion member 22 and the light transmission member 104. And a reflection member 34 that reflects part of the light emitted from the semiconductor light emitting element 112 toward the light wavelength conversion member 22. The semiconductor light emitting element 112 and the reflecting member 34 are mounted on the element mounting substrate 114. Note that a white substrate may be used instead of the mirror substrate 32.

  The semiconductor light emitting element 112 is disposed on the same side as the light transmitting member 104 with respect to the light wavelength conversion member 22 and is configured to irradiate light toward the light emitting surface 22 a of the light wavelength conversion member 22. Thereby, the excitation light emitted from the semiconductor light emitting device 112 does not excite the phosphor while passing through the light wavelength conversion member 22, but excites the phosphor near the surface of the light wavelength conversion member 22, Light emitted from the phosphor is suppressed from being absorbed inside the light wavelength conversion member 22 or scattered by other phosphors. As a result, a light emitting module with high luminous efficiency can be realized.

  Further, since the light traveling toward the mirror substrate 32 among the Lambertian light converted by the light wavelength conversion member 22 can be reflected, the light can be used effectively. Furthermore, if a material having high thermal conductivity is used for the mirror substrate 32 and a surface that reflects light is formed on the surface thereof, the light wavelength conversion member 22 is efficiently radiated. As a result, an increase in the temperature of the light wavelength conversion member 22 is suppressed, so that the light conversion efficiency is improved. The light reflecting surface can be, for example, a mirror surface formed by plating or vapor deposition of a metal or metal compound thin film such as Ag, Al, or Au on the surface in addition to a metal whose surface roughness is smoothed to 1 μm or less, or a refractive index. There are reflection surfaces on which at least one or more dielectric thin films are formed.

Such dielectrics include SiO ₂ , CaAl ₂ O ₄ , CaCO ₃ , TiO ₂ , SrTiO ₃ , Al ₂ O ₃ , LiF, MgF ₂ , Y ₂ O ₃ , MgO, MgF ₂ , CaF ₂ , As _2. S ₃ , ZnS, NaF, BaF ₂ , PbF ₂ , CdS, ZnSe, NaI, NaCl, KCl, AgCl, TlCl, KBr, AgBr, TlBr, KI, CsBr, CsI and the like.

These light reflecting surfaces may have a surface roughness rougher than 1 μm to diffuse the light irregularly. The light reflecting _{surface, SiO 2, CaAl 2 O 4} , CaCO 3, TiO 2, SrTiO 3, Al 2 O 3, LiF, MgF 2, Y 2 O 3, MgO, MgF 2, CaF 2, As 2 S 3 , ZnS, NaF, BaF ₂ , PbF ₂ , CdS, ZnSe, NaI, NaCl, KCl, AgCl, TlCl, KBr, AgBr, TlBr, KI, CsBr, CsI and other fillers with good thermal conductivity For example, polyamide, PTFE (polytetrafluoroethylene), POM (polyacetal copolymer), PC (polycarbonate), PI (polyimide), PPE (polyphenylene ether), PSU (polysulfone), PPS ( Polyphenylene sulfide), PBT (polybutylenete) Rephthalate), PAI (polyamideimide), PAR (polyarylate), PES (polyethersulfone), PEEK (polyetheretherketone), PEI (polyetherimide), LCP (liquid crystal polymer), PEK (polyetherketone), A coating film dispersed in epoxy resin, urethane resin, phenol resin, phenol aralkyl resin, furan resin, amino resin, unsaturated polyester resin, diallyl phthalate resin, ADC resin, vinyl ester resin, phenoxy resin, silicone resin, etc. May be.

  FIG. 9 is a diagram illustrating a schematic configuration of a light emitting module according to another example of the present embodiment. The light emitting module 50 shown in FIG. 9 includes a semiconductor light emitting element 112 mounted on the element mounting substrate 114, and a reflector 36 that reflects light emitted upward from the semiconductor light emitting element 112 forward (leftward in FIG. 9). And a light wavelength conversion member 22 disposed between the light transmission member 104 and the reflector 36. The light wavelength conversion member 22 is configured to move (vertically move or rotate) so that the light reflected by the reflector 36 does not concentrate in one place.

  In other words, the light wavelength conversion member 22 is configured to be movable within a predetermined range so that the light incident region changes in the middle of the optical path between the light emitting module 50 and the light transmission member 104. Thereby, the local heat_generation | fever of the light wavelength conversion member 22 is relieved. A short-pass filter 38 that reflects light having a wavelength of 440 nm or more is provided on the light incident surface 22b side of the light wavelength conversion member 22.

  As described above, the present invention has been described with reference to the above-described embodiment. However, the present invention is not limited to the above-described embodiment, and the present invention can be appropriately combined or replaced with the configuration of the embodiment. It is included in the present invention. Further, based on the knowledge of those skilled in the art, it is possible to appropriately change the combination and processing order in each embodiment and to add various modifications such as various design changes to the embodiment. Added embodiments may be included in the scope of the present invention.

  In each of the above-described embodiments, the light emitting module has been described by combining the blue phosphor and the yellow phosphor, but the color combination is not limited to these. Further, the lighting device may be used not only for a studio lighting device such as a spotlight, a floodlight, and a caster light, but also for a stage lighting device, a projector, a street light, a tunnel lighting, and the like.

  20 light emitting module, 22 light wavelength conversion member, 22a light emitting surface, 22b incident surface, 24 optical member, 26 transparent member, 28 reflecting portion, 30 light emitting module, 32 mirror substrate, 34 reflecting member, 36 reflector, 38 short pass filter, 40, 50 light emitting module, 100 lighting device, 102 light emitting module, 104 light transmitting member, 106 heat dissipation mechanism, 108 housing, 108a front opening, 108b heat dissipation opening, 110 band door, 110a inner surface, 112 semiconductor light emitting element, 112a light emitting surface, 114 element mounting substrate, 116 yellow phosphor, 118 blue phosphor, 120 sealing member.

Claims (5)

A plurality of light-emitting elements that emit ultraviolet light or short-wavelength visible light mounted on a substrate;
A first phosphor that is excited by light emitted from the light emitting element and emits light in a first wavelength range included in visible light;
A second phosphor that is excited by light emitted from the light-emitting element and emits light in a second wavelength range included in visible light, which is different from the first wavelength range;
A light wavelength conversion member in which a resin containing the first phosphor and the second phosphor is formed into a sheet shape;
A reflecting portion that is formed on the substrate so as to surround the plurality of light emitting elements, and reflects light emitted from the light emitting elements toward the light wavelength conversion member;
An optical member for condensing light emitted from the light emitting element toward the light wavelength conversion member having an incident surface smaller than an area of a light emitting surface of the plurality of light emitting elements;
A light emitting module having a transparent member provided with the light wavelength conversion member;
A light transmissive member that transmits light emitted from the light emitting module forward;
A heat dissipating member that dissipates heat generated by the light emitting module;
A housing for housing the light emitting module and the light transmissive member,
The illuminating device, wherein the light wavelength conversion member is integrally disposed at a position spaced from each light emitting surface of the plurality of light emitting elements arranged. The lighting device according to claim 1, wherein the light wavelength conversion member is provided on a light incident side surface of the light transmission member. The lighting device according to claim 2 , wherein the light transmission member is made of a material having a thermal conductivity higher than that of the light wavelength conversion member. The light wavelength conversion member is configured to be movable within a predetermined range so that a region in which light is incident is changed in the middle of an optical path between the light emitting element and the light transmission member. Item 4. The lighting device according to any one of Items 1 to 3 . Wherein the housing, the illumination device according to any one of claims 1 to 4, characterized in that it has an inner surface that reflects light emitted from the light emitting module.

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