JP6252023B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device used for a backlight of a liquid crystal display, a panel meter, an indicator lamp, a surface emitting switch, and the like.

  Patent Document 1 discloses a semiconductor device including a semiconductor element and a support body having a recess for housing the semiconductor element and having a lead electrode connected to the semiconductor element, wherein the main surface of the support body is A semiconductor device having at least a first main surface and a second main surface from the recess side is described. Patent Document 1 describes a light emitting device as an example of a semiconductor device. Further, Patent Document 1 discloses flip chip mounting in which Au bumps are formed on each electrode of an LED chip and are electrically connected to each lead electrode exposed from the bottom of the package recess by ultrasonic bonding. It is described that a light emitting device is formed by performing.

JP 2004-363537 A

  However, when such a light-emitting device is manufactured, there is a problem that a bonding failure between the light-emitting element 4 and the lead electrode 5 occurs frequently and the light-emitting device does not emit light.

  In view of the above, an object of the present invention is to provide a light emitting device in which defective bonding between the light emitting element and the lead electrode is reduced.

  In order to solve the above problems, the present invention has the following configuration.

  The present invention includes a light emitting element, a molded body having a concave portion in which the light emitting element is accommodated on the front surface, embedded in the molded body, partly exposed at the bottom surface of the concave part, and partly the molded body. And a package having first and second lead electrodes disposed on the lower surface side of the first and second leads, wherein the light emitting element is exposed to the bottom surface of the recess. The first and second lead electrodes are mounted on the electrode mounting portion, and are provided side by side in the vertical direction of the molded body on the bottom surface of the concave portion, and both sides of the molded body in the lateral direction of the concave portion sandwiching the mounting portion. The light-emitting device is embedded in the molded body.

  According to the above configuration, in the side light emitting type light emitting device in which the light emitting element is flip-chip mounted, the problem that the electrical continuity to the light emitting element is lost can be solved.

  According to the present invention, it is possible to provide a light-emitting device that can suppress loss of electrical conduction to a light-emitting element in a side-emitting light-emitting device in which the light-emitting element is flip-chip mounted.

1A is a schematic front view showing an embodiment of a light emitting device according to the present invention, and FIG. 2B is a schematic cross-sectional view of a portion indicated by A-A ′ in the front view. FIG. 2 is a schematic front view (a) of a package used in the light emitting device according to the present invention shown in FIG. 1 and a schematic cross-sectional view (b) of a portion indicated by A-A ′ in the front view (a). FIG. 2 is a schematic front view (a) of a molded body used in the package shown in FIG. 2, and schematic cross-sectional views (b) and (c) of portions indicated as AA ′ and BB ′ in the front view (a). ). It is a schematic diagram of the lead electrode used for the light-emitting device according to the present invention shown in FIG. 1, and is a schematic diagram (a) showing the shape of the first and second lead electrodes, and the dimensions of the first and second lead electrodes. It is the schematic diagram (b) and (c) for demonstrating. It is typical front view (a) which shows another Example of the light-emitting device based on this invention, and typical sectional drawing (b) of the part shown as A-A 'in front view (a). FIG. 6 is a schematic front view (a) of a package used in the light emitting device according to the present invention shown in FIG. 5 and a schematic cross-sectional view (b) of a portion indicated as A-A ′ in the front view (a). FIG. 6 is a schematic front view (a) showing still another embodiment of the light emitting device according to the present invention, and a schematic cross-sectional view (b) of a portion indicated by A-A ′ in the front view (a). FIG. 8 is a schematic front view (a) of a package used in the light emitting device according to the present invention shown in FIG. 7 and a schematic cross-sectional view (b) of a portion indicated by A-A ′ in the front view (a). It is a typical top view which shows the light emitting element which can be used for the light-emitting device of this invention. It is typical sectional drawing which shows the light emitting element which can be used for the light-emitting device of this invention, Comprising: It is typical sectional drawing of the part shown as A-A 'in FIG. It is a typical perspective view which shows one Example of the light source using the light-emitting device which concerns on this invention. It is typical sectional drawing which shows one Example of the light source using the light-emitting device which concerns on this invention. It is a perspective schematic diagram of an example of the light-emitting device which concerns on this invention.

  In the conventional side light emitting type light emitting device, there is a case where the light emitting element does not light up frequently. When the present inventors investigated the cause of the problem, they found that at least one of the joint portions between the two light emitting elements and the lead electrode was not joined. Furthermore, the present inventors examined the reason, and when heating for mounting the light emitting element on the package, there was a difference in the coefficient of thermal expansion between the material of the molded body constituting the package and the material of the lead electrode. For this reason, it has been speculated that this is due to different thermal expansion between the molded body and the lead electrode. That is, when the molded body is heated, the molded body and the lead electrode have different thermal expansion coefficients, in particular, the linear thermal expansion coefficient. Therefore, mechanical force is applied to the lead electrode from the molded body, and the lead electrode is deformed. Accordingly, it is presumed that the lead electrode and the light emitting element do not contact and cannot be joined, or the joined portion of the lead electrode and the light emitting element or the light emitting element is destroyed after the joining.

  Therefore, the present inventors examined a solution method based on the reason for the occurrence of the above-described problem and the estimation. As a result, it has been found that the bonding failure between the lead electrode 2 and the light emitting element 4 can be reduced by mounting the light emitting element 4 on the package 1 as shown in FIG. Specifically, the first and second lead electrodes 2a and 2b of the light emitting device 80 of the present invention are disposed on both sides (first and second concave side surfaces) of the molded body 40 sandwiching the mounting portions 52a and 52b. 41, 42), the support portion of the molded body 40 for the first and second lead electrodes 2a, 2b is increased by having the structure of being embedded in the molded body 40. Therefore, deformation of the first and second lead electrodes 2a and 2b when the package 1 is deformed due to temperature change can be suppressed. Even if the first and second lead electrodes 2a and 2b have a predetermined shape, the first and second lead electrodes 2a and 2b are slightly deformed. Contact with the light emitting element 4 can be ensured.

  The light-emitting device 80 of the present invention can be suitably used for a side-emitting light-emitting device that can emit light in a direction substantially parallel to the mounting surface of the light-emitting device 80. In the case of this side-emitting type light emitting device, a thin light emitting device 80 is desired for uses such as a backlight of a liquid crystal display. Therefore, in the light emitting device 80 for these uses, it is necessary to make the short side of the shape of the light emitting surface as short as possible. The mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b of the light emitting device 80 of the present invention may have a structure in which each has a long side and is arranged substantially parallel to each other. Therefore, the light emitting device 80 of the present invention in which the light emitting element 4 is flip-chip mounted can be suitably used as a side light emitting type light emitting device capable of irradiating light in a direction substantially parallel to the mounting surface of the light emitting device 80. .

  Hereinafter, the light emitting device 80 of the present invention will be described with reference to the drawings.

  In FIG. 1, the schematic diagram of an example of the light-emitting device 80 of this invention is shown. FIG. 1A is a schematic front view, and FIG. 1B is a schematic cross-sectional view of a portion indicated by A-A ′ in the front view (a). As shown in FIG. 1, a light emitting device 80 of the present invention includes a light emitting element 4 and a package 1. In the present specification, a surface on the light emitting surface 84 side from which light from the light emitting element 4 is extracted out of the outer surface of the light emitting device 80 is referred to as a “main surface 82” of the light emitting device 80. That is, the surface illustrated as the front view of FIG. 1A is the “main surface 82” of the light emitting device 80. In the present invention, the shape of the light emitting surface 84 formed on the main surface 82 of the light emitting device 80 is not limited to the hexagonal shape as shown in FIG. Although not shown in FIG. 1, the light emitting device 80 includes a sealing member in the recess of the package as shown in FIG. The same applies to the following drawings.

  In FIG. 2, the schematic diagram of an example of the package 1 used for the light-emitting device 80 of this invention is shown. FIG. 2A is a schematic front view, and FIG. 2B is a schematic cross-sectional view of a portion indicated by A-A ′ in the front view (a). The package 1 has a concave portion 43 on the front side in which the light emitting element 4 is housed, and is embedded in the molded body 40, and a part thereof is exposed to the bottom surface of the concave portion (hereinafter referred to as the concave portion bottom surface 44). The first and second lead electrodes 2a and 2b are partially exposed from the molded body 40 and disposed on the lower surface side of the molded body 40. The light emitting element 4 is mounted on the mounting portion 52 of the first and second lead electrodes 2a and 2b exposed at the bottom surface 44 of the recess.

  The package 1 has a molded body 40. As shown in FIG. 3, the molded body 40 has a concave portion 43 that can accommodate the light emitting element 4 on the front surface. In this specification, the “front surface” of the package 1 refers to a surface corresponding to the “main surface 82” of the light emitting device 80. Specifically, the direction that appears as shown in FIG. In the present specification, the “front” of the package 1 is a term for indicating a relative arrangement relationship with other components of the light emitting device 80 of the present invention.

  Further, in this specification, the “concave bottom surface 44” of the molded body 40 refers to a substantially flat part at the back of the concave portion 43 of the molded body 40 shown as a front view in FIG. In this specification, “the concave bottom surface 44 of the molded body 40” is a term for indicating a relative positional relationship with other components of the light emitting device 80 of the present invention.

  As shown in FIG. 2, the package 1 of the light emitting device 80 of the present invention is formed such that one end portions of the first and second lead electrodes 2 a and 2 b are embedded in the molded body 40. One of the first and second lead electrodes 2 a and 2 b is a positive lead electrode 2, and the other is a negative lead electrode 2.

  As shown in FIG. 2, the first and second lead electrodes 2 a and 2 b are provided side by side in the vertical direction of the molded body 40 on the bottom surface 44 of the recess of the package 1. In the light emitting device 80 of the present invention, the first and second lead electrodes 2a and 2b are provided on both sides in the side surface direction of the concave portion of the molded body 40 sandwiching the mounting portions 52a and 52b, in the present embodiment, the first and second concave portions. The side surfaces 41 and 42 are embedded in the molded body 40. In this specification, the “mounting portions 52a, 52b” of the first and second lead electrodes 2a, 2b are exposed to the bottom surface 44 of the recess 40 of the molded body 40 of the first and second lead electrodes 2a, 2b. This is a portion for mounting the light emitting element 4. The first and second lead electrodes 2a and 2b are separated from each other, and a molded body is filled therebetween. As shown in FIG. 4A, the mounting portions 52 of the first and second lead electrodes 2a and 2b are denoted by reference numerals 52a and 52b, respectively. Similarly, the inner lead portion 50, the connecting portion 51, the electrode end portion 53, and the outer lead portion 60 described later correspond to the first and second lead electrodes 2a and 2b, respectively, with reference numerals 50a and 50b. Show. 1 and 2, the outer lead portion 60 protrudes from the bottom surface and extends without being bent. However, as shown in FIG. 13, the outer lead portion 60 of the light emitting device 80 is formed on the lower surface of the package 1. A side-emitting light emitting device 80 is formed by being bent toward the back side opposite to the main surface 82. The same applies to the following drawings.

  In the light emitting device 80 of the present invention, the first and second lead electrodes 2a, 2b are provided side by side in the vertical direction of the molded body 40 on the concave bottom surface 44, and the side surface of the molded body 40 sandwiching the mounting portions 52a, 52b. It is embedded in the molded body 40 on both sides in the direction (first and second recess side surfaces 41, 42). The first and second lead electrodes 2a, 2b are embedded in the molded body 40 on both sides of the molded body 40 sandwiching the mounting portions 52a, 52b in the concave side surface direction (first and second concave side surfaces 41, 42). As a result, deformation of the lead electrode 2 during heating or the like for mounting the light emitting element 4 can be suppressed. As a result, poor bonding between the lead electrode 2 and the light emitting element 4 can be suppressed.

  In the present specification, the “vertical direction of the molded body 40” refers to a direction facing the upper side and the lower side in the schematic front view of the molded body 40 shown in FIG. In the present specification, the “vertical direction of the molded body 40” corresponds to the vertical direction when the light emitting device 80 of the present invention is mounted, and indicates a relative positional relationship with other components and the like. Is the term. In the example shown in FIG. 2A, the first lead electrode 2a is arranged side by side so that the first lead electrode 2a is on the upper side and the second lead electrode 2b is on the lower side.

  In this specification, “the concave side surface direction of the molded body 40” is shown in FIG. 2A among the concave side surfaces (first and second concave side surfaces 41, 42) that form the concave portion 43 of the molded body 40. This is the direction from the right side surface (first concave side surface 41) to the left side surface (second concave side surface 42) (or the opposite direction). That is, “the concave side surface direction of the molded body 40” refers to the horizontal direction in FIG. In the present specification, “the direction of the concave portion side surface of the molded body 40” is a term for indicating a relative positional relationship with other components of the light emitting device 80 of the present invention.

  In the light emitting device 80 of the present invention, the light emitting element 4 is mounted on the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b exposed on the bottom surface 44 of the recess of the package 1. In the light emitting device 80 of the present invention, the light emitting element 4 is preferably flip-chip mounted. By mounting the light emitting element 4 by the flip chip method, mounting can be performed without using a wire, so that the concave portion can be shallowed, and a high output light emitting device can be obtained.

  Part of the first and second lead electrodes 2a, 2b (outer lead portions 60a, 60b) is exposed from the molded body 40 and disposed on the lower surface side of the molded body 40. The outer lead portions 60a and 60b are for example joined to a printed circuit board or the like having wiring using solder or the like, and are supplied with electric power from an external power source. In this specification, “the lower surface side of the molded body 40” refers to a surface in the lower direction in the schematic front view of the molded body 40 shown in FIG. As shown in FIG. 2A, a part of the first and second lead electrodes 2a and 2b is exposed from the molded body 40 in the lower direction of FIG. In the present specification, “the lower surface side of the molded body 40” is a term for indicating a relative positional relationship with other components of the light emitting device 80 of the present invention.

  In the example of the light emitting device 80 of the present invention shown in FIG. 1, one end of the first and second lead electrodes 2 a and 2 b (outer lead portions 60 a and 60 b) is molded so as to protrude from the lower surface of the package 1. Embedded in the body 40. “The lower surface of the package 1” is a surface corresponding to “the lower surface side of the molded body 40” and refers to an outer surface corresponding to the mounting surface of the light emitting device 80.

  FIG. 13 shows a schematic perspective view of an example of the light emitting device 80 of the present invention. As shown in FIG. 13, the outer lead portions 60 of the first and second lead electrodes 2 a and 2 b are bent along the lower surface of the package 1 toward the back surface facing the main surface 82. As shown in FIG. 13, the outer lead portion 60 has a branch portion at the tip, and at least one of the branch portions can be bent to the side surface side of the package 1. The light emitting device 80 of the present invention shown in FIGS. 1 and 13 is a side-emitting light emitting device 80 that emits light in a direction substantially parallel to the mounting surface with the lower surface of the package 1 as a mounting surface.

  Furthermore, with reference to FIGS. 1-4, the light-emitting device 80 of this invention is demonstrated concretely as follows.

  As shown in FIG. 2 and FIG. 4A, in this specification, a portion of the first lead electrode 2a that is embedded in the molded body 40 and a part of which is exposed to the recess bottom surface 44 is referred to as an inner lead portion 50a. That's it. In the present specification, a portion of the first lead electrode 2a that is exposed from the molded body 40 and disposed on the lower surface side of the package 1 is referred to as an outer lead portion 60a. The first lead electrode 2a of the light emitting device 80 of the present invention has an inner lead portion 50a and an outer lead portion 60a. Similarly to the first lead electrode 2a, the second lead electrode 2b also has an inner lead portion 50b and an outer lead portion 60b.

  As shown in FIGS. 2 and 4A, the inner lead portion 50a of the first lead electrode 2a includes an electrode end portion 53a, a mounting portion 52a on which the light emitting element 4 is mounted, a mounting portion 52a, and an outer lead. And a connecting portion 51a between the portion 60a and the connecting portion 51a. As shown in FIG. 2, among these portions, at least a part of the electrode end portion 53 a and the connection portion 51 a are embedded in the molded body 40. Similarly, the inner lead portion 50b of the second lead electrode 2b includes an electrode end portion 53b, a mounting portion 52b on which the light emitting element 4 is mounted, and a connecting portion 51b between the mounting portion 52b and the outer lead portion 60b. And have. Among these portions, at least a part of the electrode end portion 53 b and the connection portion 51 b are embedded in the molded body 40. In the example shown in FIGS. 2 and 4A, the entire electrode end portions 53 a and 53 b are embedded in the molded body 40.

  In the light emitting device 80 of the present invention, the first lead electrode 2 a has the connection portion 51 a on the first concave side surface 41 side of the molded body 40, and the electrode end portion 53 a has the first concave side surface 41 of the molded body 40. The second lead electrode 2b has a connection portion 51b on the second recess side surface 42 side of the molded body 40 and an electrode end portion 53b on the molded body 40 side. It is preferable to have it on the first recess side surface 41 side. Since the electrode end portions 53a and 53b and the connection portions 51a and 51b of the first and second lead electrodes 2a and 2b are arranged in directions opposite to each other, the outer portions of the first and second lead electrodes 2a and 2b are arranged. The arrangement of the lead portions 60a and 60b can be an arrangement in which the light emitting device 80 can be easily mounted, and the bonding failure between the lead electrode 2 and the light emitting element 4 can be suppressed.

  5 and 6 show another example of the arrangement of the first lead electrode 2a and the second lead electrode 2b. In the example shown in FIGS. 5 and 6, the molded body 40 has an electrode embedding portion 45 provided in the recess 43, and the electrode end 53 a of the first lead electrode 2 a and the electrode end of the second lead electrode 2 b. A part of the portion 53b is embedded in the electrode embedded portion 45, but the most distal end portions of the electrode end portions 53a and 53b are exposed. Also in the example of the light-emitting device 80 of the present invention shown in FIG. 5, the side surfaces of the concave portion of the molded body 40 in which part of the electrode end portions 53a and 53b of the first and second lead electrodes 2a and 2b sandwich the mounting portions 52a and 52b. In the case of heating or the like for mounting the light emitting element 4 by being embedded in the molded body 40 by both sides of the direction, that is, the first recessed portion side surface 41 or the second recessed portion side surface 42 and the electrode embedded portion 45. The deformation of the lead electrode 2 can be reduced. As a result, poor bonding between the lead electrode 2 and the light emitting element 4 can be suppressed.

  7 and 8 show another example of the arrangement of the first lead electrode 2a and the second lead electrode 2b. In the example shown in FIGS. 7 and 8, the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b protrude from the longitudinal sides of the lead electrodes 2a and 2b when viewed from the front. The projecting portions of the mounting portions 52a and 52b are alternately arranged at the central portion of the bottom surface 44 of the recessed portion of the molded body 40. In the example shown in FIGS. 7 and 8, the protrusion of the mounting portion 52a of the first lead electrode 2a is protruded from the center of the bottom surface 44 of the recess on the side of the second recess side surface 42. Is disposed at the center of the concave bottom surface 44 on the first concave side surface 41 side. The protruding portions of the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b can be arranged at the center of the concave bottom surface 44 on the side opposite to the arrangement shown in FIGS. In the example shown in FIGS. 7 and 8, electrode end portions 53 a and 53 b including the most distal portions of the first and second lead electrodes 2 a and 2 b are embedded in the molded body 40.

  In the example of the light emitting device 80 of the present invention shown in FIG. 7, the positive and negative electrodes of the light emitting element 4 are formed so that the positive electrode and the negative electrode are separately arranged in the longitudinal direction of the light emitting element 4. In the example of the light emitting device 80 of the present invention shown in FIG. 7, the light emitting element 4 is mounted on the mounting portions 52 a and 52 b of the first and second lead electrodes 2 a and 2 b exposed on the bottom surface 44 of the recess of the package 1. Also in the example of the light emitting device 80 shown in FIG. 7, the molded body 40 (side surfaces of the first and second recesses) where the electrode end portions 53a and 53b of the first and second lead electrodes 2a and 2b sandwich the mounting portions 52a and 52b. 41, 42), by being embedded in the molded body 40, it is possible to reduce deformation of the lead electrode 2 when heating to mount the light emitting element 4 or the like. As a result, poor bonding between the lead electrode 2 and the light emitting element 4 can be suppressed.

  Furthermore, it demonstrates with reference to FIGS. In the light emitting device 80 of the present invention, the concave portion 43 of the molded body 40 is preferably narrower in the vertical direction of the molded body 40 than the length of the molded body 40 in the side surface of the concave portion. By having the shape of the concave portion 43 in which the length of the molded body 40 in the vertical direction is shorter than the side surface of the concave portion of the molded body 40, the shape of the light emitting device 80 can be made thin in the vertical direction. As a result, the light emitting device 80 can be thinned.

  In the light emitting device 80 of the present invention, the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b have long sides, respectively, and at least a part of the two long sides is arranged substantially parallel to each other. It is preferable. The mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b each have long sides, and the long sides are arranged substantially parallel to each other, so that the first and second lead electrodes 2a and 2b are connected. The light emitting element 4 can be easily fixed. 1 to 4, the intervals between the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b can all be the same interval. However, the intervals between the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b may be different intervals.

  In the light emitting device 80 of the present invention, it is preferable that one connection portion 51 of the first and second lead electrodes 2a and 2b and the other one electrode end portion 53 are arranged to face each other. As shown in FIG. 2 (a), “facing oppositely” means, for example, in the vicinity of the side surface 41 of the first recess, the connection portion 51a of the first lead electrode 2a and the electric current of the second lead electrode 2b. The extreme portion 53b means a state in which the extreme portions 53b are arranged close to each other in the vertical direction of the molded body. One connecting portion 51 of the first and second lead electrodes 2a, 2b and the other electrode end portion 53 are arranged to face each other, so that one of the first and second lead electrodes 2a, 2b is arranged. It becomes easy to embed the connecting portion 51 and the other electrode end portion 53 in the predetermined molded body 40. Since a pair of electrode end portions 53 can be embedded in each of the first and second recess side surfaces 41, 42, the light emitting device 80 of the present invention has the first and second lead electrodes 2a, 2b. It is preferable that one connection part 51 and the other one electrode end part 53 are arranged to face each other in the vertical direction. The facing direction is not limited to the vertical direction, and may be a side surface direction.

  In the light emitting device 80 of the present invention, the vertical widths of the connecting portions 51a and 51b of the first and second lead electrodes 2a and 2b are set to the electrode end portions 53b and 53a at the portions facing the electrode end portions 53b and 53a, respectively. It is preferably 0.8 to 1.2 times, and more preferably 0.9 to 1.1 times the width in the vertical direction at the portion of 53a facing the connecting portions 51a and 51b. By reducing the width of the connecting portion 51 and the electrode end portion 53 embedded in the molded body 40 to the same extent, the deformation of the lead electrode 2 during heating for mounting the light emitting element 4 is further reduced. Therefore, it is possible to reliably suppress a bonding failure between the lead electrode 2 and the light emitting element 4.

  Moreover, it is preferable that the vertical width of the electrode end portions 53a and 53b of the light emitting device 80 of the present invention is narrower than the vertical width of the mounting portions 52a and 52b. The vertical width of the electrode end portions 53a and 53b of the first and second lead electrodes 2a and 2b is smaller than the vertical width of the mounting portions 52a and 52b, thereby increasing the vertical width of the light emitting device. The width of the mounting portion can be widened while preventing the light emitting element 4 from being easily mounted on 52a and 52b.

  In the light emitting device 80 of the present invention, the light emitting element 4 is preferably mounted on the mounting portions 52a and 52b using solder. When the light emitting element 4 is mounted by a flip-chip method using solder, the package 1 is heated at the time of mounting, so that the deformation of the lead electrode 2 and the like is increased, and the electrical continuity to the light emitting element 4 is lost. Sometimes. If the light-emitting device 80 of the present invention is used, deformation of the first and second lead electrodes 2a and 2b can be reduced even when the light-emitting element 4 is mounted by a flip-chip method using solder. Since it can do, it can suppress that the electrical continuity to the light emitting element 4 is lost.

  The light emitting device 80 of the present invention described above can have the following configuration. That is, the light-emitting device 80 of the present invention includes the light-emitting element 4, a molded body 40 having a recess 43 in which the light-emitting element 4 is accommodated in the front, and the first and second lead electrodes 2 a embedded in the molded body 40. A light emitting device 80 including a package 1 having 2b, wherein the first and second lead electrodes 2a, 2b are embedded in the molded body 40 and a part thereof is exposed to the bottom surface 44 of the recess. 50a, 50b and outer lead portions 60a, 60b exposed from the molded body 40 and disposed on the lower surface side of the package 1. The inner lead portions 50a, 50b include electrode end portions 53a, 53b, and a light emitting element. 4 are mounted, and connecting portions 51a and 51b are provided between the mounting portions 52a and 52b and the outer lead portions 60a and 60b, and are in contact with the electrode end portions 53a and 53b. Part 51a, are embedded in the molded body 40 and 51b, the light emitting element 4 is a light emitting device 80 which is characterized in that is flip-chip mounted on the mounting portion 52. The light emitting device 80 having this configuration preferably has the arrangement and shape of the first and second lead electrodes 2a and 2b as described above, the shape of the concave portion 43 of the molded body 40, and the like.

  The above-described light emitting device 80 of the present invention can be used for a backlight of a liquid crystal display, a panel meter, an indicator lamp, a surface emitting switch, an optical sensor and the like. Further, the structure of the lead electrode 2 and the mounting method of the light emitting element 4 described above can also be applied when manufacturing a semiconductor device other than the light emitting device 80. In that case, instead of the light emitting element 4, a predetermined semiconductor element, for example, a light receiving element, an electrostatic protection element (a zener diode, a capacitor, etc.), or a combination of at least two of them is used. It can be mounted on the package 1 having the first and second lead electrodes 2a, 2b.

  Next, the embodiment of the present invention will be specifically described with reference to the light emitting device 80 of the present invention described in FIGS.

  As shown in FIG. 3, the molded body 40 of the package 1 of the present embodiment has a recess 43 that can accommodate the light emitting element 4. The recess 43 has a recess bottom surface 44 on which the light emitting element is mounted, and an opening from which light emission is mainly extracted. The shape of the inner wall surface that forms the concave portion 43 is not particularly limited, but when the light emitting element 4 is mounted, it is preferable to have a tapered shape such that the inner diameter gradually increases toward the opening side. Thereby, the light emitted from the end face of the light emitting element 4 can be efficiently extracted in the direction of the emission observation surface. Further, in order to enhance the reflection of light, the inner wall surface of the recess 43 may have a light reflection function such as metal plating such as silver.

  The shape of the molded body 40 of the package 1 is preferably such that the taper angle in the side surface direction is shallower than the vertical direction. The shape of the molded body 40 can improve the light extraction efficiency. Further, in the case of such a shape of the molded body 40, the molded body 40 can be thinned and the wall surrounding the recess bottom surface 44 is extended, so that the first and second lead electrodes 2 a and 2 b are formed. It becomes easy to embed the electrode end portions 53a and 53b.

  The shape of the molded body 40 of the package 1 will be further described with reference to FIG. In FIG. 3, the schematic front view of the molded body used for the package shown in FIG. 2 is a schematic diagram of a portion shown as AA ′ and BB ′ in FIG. 3 (a) and the front view (FIG. 3 (a)). Typical sectional views are shown in FIGS. 3 (b) and 3 (c). The shape of the concave portion 43 of the molded body 40 needs to be a shape having such a size that the light emitting element 4 can be mounted in the concave portion 43.

  Specifically, the shape and the like of the recess 43 are preferably the following dimensions. That is, the vertical width H2 of the opening of the recess 43 is preferably 0.28 to 0.50 mm, and more preferably 0.35 to 0.4 mm. The width H3 in the vertical direction of the bottom surface 44 of the concave portion 43 is preferably 0.27 to 0.48 mm, and more preferably 0.32 to 0.39 mm. The length W2 of the opening of the recess 43 in the recess side surface direction is preferably 1.3 to 2.8 mm, and more preferably 2.0 to 2.5 mm. The length W3 of the recess bottom surface 44 in the recess side surface direction is preferably 0.5 to 1.5 mm, and more preferably 0.7 to 1.2 mm. Further, the depth L2 of the recess 43 is preferably 0.2 to 0.5 mm, and more preferably 0.29 to 0.35 mm.

  The outer shape of the molded body 40 needs to have such a size that the above-described recess 43 can be formed. Specifically, it is preferable that the outer shape of the molded body 40 has the following dimensions. That is, the vertical width H1 of the molded body 40 is preferably 0.4 to 0.7 mm, and more preferably 0.45 to 0.6 mm. Moreover, in another aspect, it is preferable that the vertical width H1 of the molded object 40 is 0.40-0.55 mm, and it is more preferable that it is 0.48-0.51 mm. The outer shape in the side surface direction of the molded body 40, that is, the distance W1 between the first molded body side surface 47 and the second molded body side surface 48 is preferably 2.5 to 4.0 mm, and preferably 2.8 to 2.8. More preferably, it is 3.2 mm. Further, the depth L1 of the molded body 40 is preferably 0.5 to 1.0 mm, and more preferably 0.6 to 0.8 mm.

  As shown in FIG. 2, the first and second lead electrodes 2 a and 2 b having a predetermined shape are provided side by side in the vertical direction of the molded body 40 on the bottom surface 44 of the recess of the package 1. In the light emitting device 80 of the present embodiment, the first and second lead electrodes 2a, 2b are arranged on both sides in the concave side surface direction of the molded body 40 sandwiching the mounting portions 52a, 52b (first and second concave side surfaces 41, 42), it is embedded in the molded body 40.

  In the light emitting device 80 of the present embodiment, the light emitting element 4 is mounted on the mounting portions 52a and 52b in the recess 43 of the package 1 configured as described above, and covers the light emitting element 4 in the recess 43. The sealing member is formed by filling the translucent resin. Next, the manufacturing process and each component of the light emitting device 80 according to the present embodiment will be described in detail.

[Step 1: Formation of lead electrode 2]
In the present embodiment, first, as a first step, a metal plate is punched to form a lead frame having a plurality of pairs of end portions to be the first and second lead electrodes 2a, 2b. Apply metal plating to the frame surface. It should be noted that the hanger leads for supporting the package 1 are provided on a part of the lead frame so as to engage with the hanger leads provided on the outer surface of the package 1 from the cut forming process of the lead electrode 2 to the separation process of the light emitting device 80. Can do.

(Lead electrode 2)
The lead electrode 2 in the present embodiment is a conductor capable of supplying power to the light emitting element 4 and mounting the light emitting element 4. Particularly, in the lead electrode 2 according to the present embodiment, one end portion (inner lead portion 50) is embedded in the molded body 40 from the lower surface of the package 1, and the other end portion (outer lead portion 60) is extended from the lower surface of the package 1. The molded body 40 is integrally molded so as to protrude. In addition, the mounting portion 52 of the lead electrode 2 embedded in the molded body 40 is integrally molded so as to be exposed from the concave bottom surface 44 of the package 1 by bringing a part of the molding die into contact with the lead electrode 2. Can do.

  The material of the lead electrode 2 is not particularly limited as long as it is conductive. However, the lead electrode 2 is required to have good adhesion and electrical conductivity with the joining member 6 such as solder which is a member electrically connected to the semiconductor element. The specific electric resistance is preferably 300 μΩ-cm or less, more preferably 3 μΩ-cm or less. Suitable materials satisfying these conditions include iron, copper, iron-containing copper, tin-containing copper and copper, gold, silver plated aluminum, iron, copper and the like.

  In the portion corresponding to each package 1 of the long metal plate after press working, the first and second lead electrodes 2a and 2b are provided side by side in the vertical direction of the formed body 40 on the bottom surface 44 of the recessed portion after forming, It has a shape that is disposed so as to be embedded in the molded body 40 on both sides (first and second concave side surfaces 41, 42) of the molded body 40 sandwiching the mounting portion 52 in the concave side surface direction. Portions corresponding to the mounting portions 52a and 52b of the first and second lead electrodes 2a and 2b are separated from each other. In the present embodiment, the mounting portion 52 of the lead electrode 2 exposed on the recess bottom surface 44 is not specially processed, but is formed by providing at least one pair of through holes on the left and right with the longitudinal direction of the recess 43 as an axis. It is also possible to increase the bond strength with the resin.

  The shapes of the first and second lead electrodes 2a and 2b will be further described with reference to FIG. 4, the first lead electrode 2a used in the package shown in FIG. 2 is shown in FIG. 4 (b), and the second lead electrode 2b is shown in FIG. 4 (c). The shape and size of the first and second lead electrodes 2a and 2b can be selected according to the shape and size of the molded body 40 and the recess 43 described above.

  The shape of the inner lead portions 50a, 50b of the first and second lead electrodes 2a, 2b is preferably the following dimensions with reference to FIG. That is, the length Da1 of the first inner lead portion 50a is preferably 1.5 to 4.0 mm, and more preferably 2.5 to 3.5 mm. The length Db1 of the second inner lead portion 50b is preferably 1.2 to 3.8 mm, and more preferably 2.2 to 3.4 mm. The widths Da2 and Db2 of the first and second inner lead portions 50a and 50b are preferably 0.08 to 0.15 mm, and more preferably 0.11 to 0.14 mm.

  The shape and the like of the outer lead portions 60a and 60b of the first and second lead electrodes 2a and 2b are specifically as follows with reference to FIGS. 4B and 4C. Is preferred. That is, the length Da4 of the first outer lead portion 60a is preferably 0.5 to 1.0 mm, and more preferably 0.65 to 0.8 mm. The length Db4 of the second outer lead portion 60b is preferably 0.5 to 1.0 mm, and more preferably 0.65 to 0.8 mm. Further, the widths Da3 and Db3 of the first and second outer lead portions 60a and 60b are preferably 0.11 to 0.4 mm, and more preferably 0.28 to 0.33 mm. The shape of the tip of the outer lead portion 60 can be appropriately selected from any shape such as a T-shape, an L-shape, or a simple I-shape in consideration of the electrical connection method of the light emitting device 80. . In the example of the T-shape shown in FIGS. 4B and 4C, the widths Da5 and Db5 of the T-shape at the tip of the outer lead portion 60 are preferably 0.4 to 1.0 mm. More preferably, the thickness is 0.7 to 0.9 mm. Further, the vertical widths Da6 and Db6 of the T-shape are preferably 0.11 to 0.4 mm, and more preferably 0.15 to 0.3 mm.

  The thickness of the material of the first and second lead electrodes 2a and 2b is preferably 0.10 to 0.2 mm, and more preferably 0.11 to 0.13 mm. Further, in order to ensure the embedding in the molded body 40, the length da (see FIG. 4 (b)) of the portion embedded in the molded body 40 at the tip of the inner lead portion 50a of the first lead electrode 2a. 0.4 to 1.2 mm is preferable, and 0.6 to 0.8 mm is more preferable. Similarly, the length db (see FIG. 4C) of the portion embedded in the molded body 40 at the tip of the inner lead portion 50b of the second lead electrode 2b is 0.2 to 0.8 mm. Is preferable, and it is more preferable that it is 0.3-0.5 mm.

  In the light emitting device 80 of FIG. 1 using the lead electrode 2 shown in FIG. 4, the tips (electrode end portions 53 a and 53 b) of the inner lead portions 50 a and 50 b are embedded in the molded body 40. However, the position where the lead electrode 2 is embedded in the molded body 40 is not necessarily limited to the tip of the inner lead portions 50a and 50b. For example, as shown in FIGS. 5 and 6, at least a part of the inner lead portion 50 of the lead electrode 2 may be embedded in the molded body 40. Furthermore, a part of the inner lead part 50 can be embedded in the molded body 40 by changing the thickness of the inner lead part 50 of the lead electrode 2 or bending the inner lead part 50.

[Step 2: Formation of Package 1]
The package 1 according to the present embodiment can mount the light emitting element 4 and serves as a support body that fixes and holds the lead electrode 2 on which the light emitting element 4 is mounted.

  Subsequent to step 1, the long metal plate is placed between a convex mold and a concave mold which are forming molds, and these molds are closed. At this time, the connection part 51 and the electrode end part 53 of at least two lead electrodes 2 are arranged in the cavity part obtained by closing the convex type and the concave type. Next, a molding material is injected into the hollow portion from the gate provided on the concave back surface to cover the connection portion 51 and the electrode end portion 53 of the two lead electrodes 2. The hollow portion corresponds to the shape of the package 1. In the molding die, the long metal plate that has been pressed may be inserted and disposed between the convex die and the concave die so that the stamping direction of the press coincides with the direction of injecting the resin into the molding die. preferable. When the arrangement direction of the long metal plate is determined in this way, the space formed by the connection portion 51 and the electrode end portion 53 of the lead electrode 2 can be filled with no gap, and the injected molding resin is mounted. It is possible to prevent the portion 52 from flowing out to the surface on which the light emitting element 4 is mounted.

(Molding material)
The molding material of the package 1 used in the present invention is not particularly limited, and a thermoplastic resin such as liquid crystal polymer, polyphthalamide resin, polybutylene terephthalate (PBT), 6T nylon (registered trademark), and 9T nylon (registered trademark) is used. Can be used. In particular, when a semi-crystalline polymer resin containing a high melting point crystal such as polyphthalamide resin is used, the surface energy is large, and a sealing resin that can be provided inside the opening or a light guide plate that can be retrofitted The package 1 having good adhesion with 31 or the like is obtained. Thereby, in the process of filling and curing the sealing resin, it is possible to suppress the occurrence of peeling at the interface between the package 1 and the sealing resin in the cooling process. Further, in order to efficiently reflect the light from the light emitting element 4 chip, a material that efficiently reflects light of the light emitting element or a fluorescent material described later, such as titanium oxide, zinc oxide, It is preferable to mix a white pigment such as aluminum oxide to make the molded body white.

[Step 3: Semiconductor element mounting]
Next, the semiconductor element is fixed to the lead electrode 2 exposed on the bottom surface 44 of the recess provided in the package 1. In the present embodiment, the light-emitting element 4 is particularly described as a semiconductor element. However, the semiconductor element that can be used in the present invention is not limited to the light-emitting element 4, and a light-receiving element, an electrostatic protection element (a zener diode, a capacitor, or the like). ), Or a combination of at least two of them.

(Light emitting element 4)
As the light emitting element 4 used in the present embodiment, an LED chip can be used. A plurality of LED chips according to the present embodiment may be used in accordance with the size of the recess bottom surface 44, and various shapes may be used in accordance with the shape of the recess bottom surface 44.

Here, the light emitting element 4 is not particularly limited in the present invention, but when a fluorescent material is used together, the light emitting element 4 having the active layer 17 capable of emitting a wavelength capable of exciting the fluorescent material is preferable. Examples of such a light-emitting element 4 include various semiconductors such as GaN. Nitride semiconductors (In _X Al _Y Ga _1-XY N, 0 capable of emitting phosphors efficiently and capable of emitting short wavelengths) ≦ X, 0 ≦ Y, X + Y ≦ 1) are preferable. Examples of the semiconductor structure include a homostructure having a MIS junction, a PIN junction, and a pn junction, a heterostructure, and a double heterostructure. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal. Further, the single quantum well structure or the multiple quantum well structure in which the active layer 17 is formed in a thin film in which a quantum effect is generated can be used.

  When a nitride semiconductor is used, a material such as sapphire, spinel, SiC, Si, ZnO, or GaN is preferably used for the semiconductor substrate. In order to form a nitride semiconductor with good crystallinity with high productivity, it is preferable to use the sapphire substrate 14. A nitride semiconductor can be formed on the sapphire substrate 14 using MOCVD or the like. For example, a buffer layer of GaN, AlN, GaAIN or the like is formed on the sapphire substrate 14, and a nitride semiconductor having a pn junction is formed thereon. The substrate can also be removed by a method such as laser lift-off after stacking semiconductor layers or after flip-chip mounting. Thereby, it can be set as the light-emitting device with high light extraction efficiency.

  When the light-emitting element 4 having a substrate is flip-chip bonded, it is preferable to use a light-transmitting substrate, and for example, a substrate such as sapphire or silicon carbide can be suitably used.

  In the case where white light is emitted in the light emitting diode of the present invention, the light emission wavelength of the light emitting element 4 is 400 nm or more and 530 nm or less in consideration of the complementary color relationship with the light emission wavelength from the fluorescent material, deterioration of the translucent resin, or the like. It is preferable that it is 420 nm or more and 490 nm or less. In order to further improve the excitation and light emission efficiency of the light emitting element 4 and the fluorescent substance, the light emission wavelength of the light emitting element 4 is more preferably 450 nm or more and 475 nm or less. In addition, the light emitting element 4 which makes ultraviolet light shorter than 400 nm or the short wavelength area | region of visible light shorter than 400 nm by the combination with the member which cannot be easily deteriorated with an ultraviolet-ray can also be used.

(Joining member 6)
In the present embodiment, the light emitting element 4 is a flip-chip system in which a pair of electrodes provided on the same surface is opposed to a pair of lead electrodes 2 exposed from the recess 43 of the molded body 40 of the package 1. When there is no mounting, there is no light blocking member on the light emitting surface 84 side, and uniform light emission can be obtained. The material of the bonding member 6 is not particularly limited as long as it is conductive, but preferably contains at least one of the materials included in the positive and negative electrodes of the light emitting element 4 and the plating material of the lead electrode 2. Examples of the material of the bonding member 6 include Au—Sn, Sn—Ag—Cu, and Pb—Sn solders.

  The light emitting element 4 is preferably mounted with solder provided on the surface of the electrode of the light emitting element 4. In mounting with bumps 6 and the like described later, it is necessary to apply a load to the light emitting element 4, but there is a problem that the lead frame is unstable and difficult to apply a load. Moreover, since the recessed part 43 of the molded object 40 is narrow, mounting with the solder which can be joined only by mounting and reflowing the light emitting element 4 is preferable. In the case of mounting having such a reflow process, since the high-temperature heat is applied to the light emitting device 80, the effect of the present invention of suppressing loss of electrical conduction to the light emitting element is particularly high.

  In mounting the light emitting element 4, it is preferable that a solder material is provided on the surface of the electrode of the light emitting element 4 by sputtering or the like, and then the light emitting element 4 is joined to the lead electrode 2 through the solder material. In this case, the electrode of the light emitting element 4 and the lead electrode 2 are joined by applying a melting aid (flux) to the mounted lead electrode 2 side, mounting the light emitting element 4 thereon, and performing reflow. Can do.

  As another method for mounting the light-emitting element 4, bumps 6 made of Au are formed on the lead electrodes 2, and the electrodes of the light-emitting element 4 are opposed to the bonding members 6. A method of joining the bump 6 and the lead electrode 2 by applying a load can be employed. Alternatively, in another embodiment, first, the bonding members 6 are formed on the respective lead electrodes 2 of the light emitting element 4, and then the bumps 6 and the respective lead electrodes 2 are opposed to each other and similarly bonded by ultrasonic waves. The types of bumps differing in formation method include stud bumps obtained by bonding the ends of conductive wires and then cutting the wires to leave the ends, and after applying a desired mask pattern, There are bumps 6 obtained by depositing. Further, such a bump 6 can be provided first on the lead electrode 2 side, can be provided first on the electrode side of the light emitting element 4, or the lead electrode 2 and the electrode side of the light emitting element 4 can be provided. They can also be provided separately.

  The mounting of the light emitting element 4 is not limited to flip chip mounting, and can be mounted using die bonding and wire bonding. Since the concave portion 43 of the molded body 40, which is a space for mounting the light emitting element 4, is narrow, it is preferable to use flip chip mounting for mounting the light emitting element 4.

  The electrode shape of the light emitting element 4 is arranged so as to be suitable for mounting the first and second lead electrodes 2a, 2b of the package 1 on the mounting portions 52a, 52b. Even when the electrode shape of the light emitting element 4 is an arbitrary shape, when the light emitting element 4 is mounted on the package 1, the mounting portions 52a of the first and second lead electrodes 2a and 2b of the package 1 are used. , 52b, the electrode shape of the light-emitting element 4 can be rearranged through an insulating film or the like so as to be suitable for mounting on 52b. FIG. 9 shows a schematic plan view of the surface on which the electrodes of the light emitting element 4 that can be used in the light emitting device of the present invention are arranged. FIG. 10 is a schematic cross-sectional view taken along broken line A-A ′ of the light-emitting element 4 shown in FIG. 9. The shape of the first electrode (the n-side pad electrode 22 in the examples of FIGS. 9 and 10) and the second electrode (the p-side pad electrode 21 in the examples of FIGS. 9 and 10) of the light emitting element 4 is the semiconductor laminate. It can be set according to the shape of the laminated body (such as the n-type semiconductor layer 16, active layer 17, and p-type semiconductor layer 18 as shown in FIG. 10), the shape of the mounting portion of the lead frame to be mounted, and the like. For example, it is preferable that the first electrode and the second electrode have shapes corresponding to the mounting portions 52a and 52b of the first lead electrode 2a and the second lead electrode 2b, respectively. Each of the first electrode and the second electrode is preferably a square or a shape close to this. In this case, it is preferable that the planar shapes of the first electrode and the second electrode are substantially the same at least on the outermost surface of the light emitting element 4 connected to the mounting parts 52a and 52b. Moreover, it is preferable that the first electrode and the second electrode are arranged to face each other across the central portion of the semiconductor stacked body. In the example of the light emitting element 4 shown in FIGS. 9 and 10, the electrodes that are in contact with the semiconductor stacked body are the n-side electrode 20 and the p-side full surface electrode 19. The shapes of the n-side pad electrode 22 and the p-side pad electrode 21 are rearranged so as to be suitable for mounting on the package 1.

  The upper surfaces of the first electrode and the second electrode (the surface opposite to the semiconductor layer such as the active layer 17) may have a step, but are preferably substantially flat. Here, the term “flat” refers to the surface of the n-type semiconductor layer 16 of the semiconductor stacked body from the side opposite to the side in contact with the active layer 17 to the surface of the first electrode (surface opposite to the semiconductor stacked body of the first electrode). Means that the height to the surface of the second electrode is substantially the same. Here, “substantially the same” allows a variation of about ± 10% of the height of the semiconductor stacked body. As described above, when the upper surfaces of the first electrode and the second electrode are substantially flat, that is, substantially flush with each other, it becomes easy to mount horizontally on the lead frame. In order to form such a first electrode and a second electrode, for example, a metal film is provided on the electrode by plating or the like, and thereafter, polishing and cutting are performed so as to be substantially flush with each other. .

  Further, between the electrode and the semiconductor stacked body (in the example shown in FIG. 10, between the p-side full surface electrode 19 and the p-type semiconductor layer 18 or between the n-side electrode 20 and the n-type semiconductor layer 16), A DBR (distributed Bragg reflector) may be disposed within a range that does not hinder the electrical connection between the two. The DBR has a multilayer structure in which a low refractive index layer and a high refractive index layer are laminated on an underlayer arbitrarily formed of an oxide film, for example, and selectively reflects light having a predetermined wavelength. Specifically, a predetermined wavelength can be reflected with high efficiency by alternately laminating films having different refractive indexes with a thickness of ¼ wavelength. As a material, it can be formed including at least one oxide or nitride selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al.

For example, the low refractive index layer can be made of SiO ₂ and the high refractive index layer can be made of Nb ₂ O ₅ , TiO ₂ , ZrO _2, Ta ₂ O ₅ or the like. Specifically, (Nb ₂ O ₅ / SiO ₂ ) ⁿ (n is 2 to 5) in order from the base layer side. The total film thickness of DBR is preferably about 0.2 to 1 μm. This DBR may be used as the insulating film described above. Thereby, the light extraction efficiency of the light emitting device can be increased.

  In order to improve the reliability of the light emitting device 80, an underfill is formed in a gap formed between the positive and negative electrodes of the light emitting element 4 mounted on the flip chip and the lead electrode 2 exposed on the bottom surface 44 of the recess 1 of the package 1. May be filled. As the underfill material, for example, a thermosetting resin such as an epoxy resin or a silicone resin can be used. In order to enhance light extraction from the light emitting element 4, the underfill may be mixed with a resin having a light reflective filler such as titanium oxide, zinc oxide, aluminum oxide, and a composite mixture thereof. The amount of underfill may be an amount that can fill the gap formed between the light emitting element 4 and the lead electrode 2, but may cover the lead electrode 2 widely, The part may be covered. In particular, the underfill preferably covers the boundary portion (corner portion) between the lead electrode 2 and the molded body 40 in the recess 43 of the molded body 40. By covering such corners with a light-reflective resin so as to have a curved shape, light extraction of the light-emitting element can be improved.

[Step 4: Sealing]
Next, a translucent sealing member is provided to protect the light emitting element 4 from the external environment. The recess 43 of the package 1 is filled with the material of the sealing member so as to cover the light emitting element 4 or the lead electrode 2 and the like, and the light emitting element 4 is covered by curing.

(Sealing member)
The material of the sealing member is not particularly limited as long as it is translucent. Silicone resin, epoxy resin, urea resin, fluororesin, and hybrid resin including at least one of those resins are excellent in weather resistance. A light resin can be used. A material with high light resistance (for example, dimethyl silicone) and a material with high gas barrier property (for example, phenyl silicone) are preferable. The sealing member is not limited to an organic material, and an inorganic material having excellent light resistance such as glass and silica gel can also be used. In the present embodiment, any member such as a viscosity extender, a light diffusing agent, a pigment, a fluorescent substance, and the like can be added to the sealing member depending on the intended use. Examples of the light diffusing agent include barium titanate, titanium oxide, aluminum oxide, silicon oxide, silicon dioxide, heavy calcium carbonate, light calcium carbonate, and a mixture containing at least one of them. Furthermore, by making the light emitting surface 84 side of the sealing member have a desired shape, a lens effect can be provided, and light emitted from the chip of the light emitting element 4 can be focused. Specifically, a convex lens shape, a concave lens shape, an elliptical shape as viewed from the light emission observation surface, or a shape obtained by combining a plurality of them can be used. The sealing member may be a single layer, but may be formed in two or more layers.

(Fluorescent substance)
In the light emitting device 80 of the present invention, various fluorescent materials such as an inorganic fluorescent material and an organic fluorescent material are arranged in and / or around each component member such as the light emitting element 4, the sealing member, the underfill, and the package 1. be able to. Further, the fluorescent material in the present embodiment is provided outside the sealing member so as to cover the light emission observation surface side surface of the sealing member, and is separated from the light emission observation surface side surface of the sealing member and the light emitting element 4. It can also be provided inside the sealing member as a layer containing a phosphor or a filter at the position.

  As an example of a fluorescent material that can be used in the light emitting device 80 of the present invention, when a gallium nitride-based light emitting element that emits blue light is used as the light emitting element 4, a YAG system or LAG system that absorbs blue light and emits yellow to green light. Further, SiAlON-based (β sialon) emitting green light, SCASN emitting red light, and CASN-based phosphors can be used alone or in combination.

[Step 5: Separate for each light emitting device 80]
Next, a connection portion with each lead electrode 2 is cut from the lead frame and separated into individual light emitting devices 80. In addition, when the hanger lead which supports the package 1 is provided, after performing the forming described below, the support by the hanger lead is removed to obtain the package 1 as shown in FIG. By using the hanger leads, the forming process can be performed collectively for each pair of lead electrodes 2, so that the number of steps for forming the light emitting device 80 can be reduced and the workability can be improved.

[Step 6: Forming of lead electrode 2]
Next, as shown in FIG. 13, the first and second lead electrodes 2 protruding from the end surface of the package 1 are bent along the lower surface of the package 1.

  In the present embodiment, when the first and second lead electrodes 2 a and 2 b protrude from the lower surface of the package 1 to form the outer lead portion 60, the outer lead portion 60 is the back side facing the front surface of the package 1. It is preferable to bend it toward. As a result, the light emitting device 80 can be mounted on the wiring board without adverse effects of mounting solder or the like on the light emitting surface 84 side. In addition, it is preferable that the structure of the connection terminal part of this invention has the part protruded from the lower surface of the package 1, and the part branched from there. The branch is preferably perpendicular to the protruding portion. The number of branches may be one (L-shaped) or two or more (T-shaped).

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

Example 1

  FIG. 9 is a schematic plan view of the surface on which the electrodes of the LED chip in this embodiment are arranged, and FIG. 10 is a schematic cross-sectional view taken along the broken line A-A ′ in FIG. 9. Here, 70:30 Au—Sn solder with a thickness of 30 μm is provided on the outermost surfaces of the electrodes of the LED chip (the surfaces of the p-side pad electrode 21 and the n-side pad electrode 22). This soldering can be performed simultaneously with the formation of the electrodes. Specifically, the solder can be formed into a film on the electrode by sputtering using a mask for forming the electrode of the LED chip.

  A long metal plate made of iron-containing copper having a thickness of 0.15 mm is punched to form a lead frame having a plurality of first and second lead electrodes 2 a and 2 b inserted into each package 1. Further, Ag plating is applied to the surface of the lead frame in order to improve the light reflectance.

  Next, the package 1 is placed in a molding die in which a lead frame formed in a state in which the first and second lead electrodes 2a and 2b having a shape as shown in FIG. A molten polyphthalamide resin is poured from a gate corresponding to the lower surface side of the resin and cured to form the package 1 having the structure shown in FIG. The package 1 has a recess 43 capable of accommodating the light emitting element 4, and a part of the first and second lead electrodes 2a and 2b is exposed from the bottom surface 44 of the recess as mounting portions 52a and 52b. 53 a and 53 b are molded so as to be embedded in the molded body 40. Each lead electrode 2 protruding from the lower surface of the package 1 is connected to a lead frame.

  The flux is provided by pin transfer on the mounting portion 52 of the lead electrode 2 exposed on the bottom surface 44 of the recess 1 of the package 1 formed in this way. And the electrode which provided the solder of the light emitting element 4 (LED chip) is arrange | positioned facing each lead electrode 2 exposed from the recessed part bottom face 44 of the package 1 so that a flux may be contacted. Then, heating at 270 ° C. is performed in a reflow furnace, the solder is melted, and flip chip mounting is performed to establish electrical continuity between the light emitting element 4 and each lead electrode 2.

  Next, a sealing member is formed. First, light calcium carbonate (refractive index) having YAG as a phosphor, an average particle diameter of 1.0 μm as a diffusing agent, and an oil absorption of 70 ml / 100 g with respect to 100 wt% of phenylmethyl silicone resin composition (refractive index of 1.53). A curable composition containing 3 wt% of 1.62) is prepared.

  The curable composition thus obtained is filled in the concave portion 43 of the package 1 up to the same plane line as the upper surfaces of both end portions of the concave portion 43. Finally, heat treatment is performed at 70 ° C. × 3 hours and 150 ° C. × 1 hour. As a result, a light emitting surface 84 having a smooth recess in a substantially parabolic shape from the upper surface to the center of both end portions of the recess 43 is obtained. In addition, the sealing member made of a cured product of the curable composition has a first layer having a high phosphor and diffusing agent content on the side closer to the light emitting element 4, and a first layer on the side away from the light emitting element 4. The content of the diffusing agent is less than that of one layer or is separated into two layers including a second layer not containing the diffusing agent, and the surface of the LED chip is covered with the first layer. Furthermore, the first layer is preferably formed continuously from the bottom surface 44 of the recess to the surface of the LED chip. Thereby, the light emitted from the LED chip can be efficiently extracted to the outside, and good light uniformity can be obtained.

  The light emitting device 80 obtained in this manner can suppress the loss of electrical continuity to the light emitting element 4.

(Example 2)
FIG. 11 is a schematic perspective view showing an embodiment of a planar light source using the light emitting device 80 of the present invention, and FIG. 12 is a cross-sectional view of the light emitting device 80 shown in FIG. Note that the shaded portion in FIG. 11 is indicated by a dotted line.

  The planar light source in the present embodiment includes a light emitting device 80 formed in the same manner as in the first embodiment, and a light guide plate 31 that is a translucent member made of acrylic resin. The light guide plate 31 has a mounting surface 33 for mounting a plurality of light emitting devices 80. In addition, the light guide plate 31 has a light incident portion 34 that introduces light from the plurality of light emitting devices 80 into the light guide plate 31 on one side, and uses the reflection on the inner wall surface of the light guide plate 31 to make another one. Light is irradiated in a planar shape from a light emitting surface 35 provided on the side surface. Note that a prism shape (not shown) may be provided on the wall surface of the light incident portion 34 so that light from the light emitting device 80 enters the light guide plate 31 in a wide range.

  The light emitting device 80 according to the present invention can be used for a backlight of a liquid crystal display, a panel meter, an indicator lamp, a surface emitting switch, an optical sensor, and the like that require a high luminous flux.

DESCRIPTION OF SYMBOLS 1 Package 2 Lead electrode 2a 1st lead electrode 2b 2nd lead electrode 4 Light emitting element 6 Joining member (bump)
14 Sapphire substrate 16 n-type semiconductor layer 17 active layer 18 p-type semiconductor layer 19 p-side full surface electrode 20 n-side electrode 21 p-side pad electrode (second electrode)
22 n-side pad electrode (first electrode)
23 Insulating layer 31 Light guide plate 33 Mounting surface 34 Light incident portion 35 Light emitting surface 40 Molded body 41 First concave portion side surface 42 Second concave portion side surface 43 Recess portion 44 Recessed portion bottom surface 45 Electrode embedded portion 47 First molded body side surface 48 First Side surface 50, 50a, 50b Inner lead portion 51, 51a, 51b Connection portion 52, 52a, 52b Mounting portion 53, 53a, 53b Electrode end portion 60, 60a, 60b Outer lead portion 80 Light emitting device 82 Main surface 84 Light emitting surface

Claims (9)

A light emitting element;
A molded body having a concave portion in the front for accommodating the light emitting element, and a portion that is embedded in the molded body, part of which is exposed on the bottom surface of the concave portion, and part of the molded body is disposed on the lower surface side of the molded body. A light emitting device comprising: a package having first and second lead electrodes,
The light emitting element is mounted on the mounting portion of the first and second lead electrodes exposed on the bottom surface of the recess,
Wherein the first and second lead electrodes are arranged in the vertical direction of the molded body at the bottom of the recess, first and second recess side of the mounting portion disposed Nde Hasa the the said molded body Embedded in the molded body on both sides of the surface ,
The entire electrode ends of the first and second lead electrodes are embedded in the molded body,
The mounting portions of the first and second lead electrodes each have a long side, and at least a part of each of the long sides is arranged substantially in parallel ;
The light emitting device according to claim 1, wherein the concave portion has a length in a vertical direction of the molded body shorter than a length in a direction connecting the side surfaces of the first concave portion and the second concave portion of the molded body .   The light emitting device according to claim 1, wherein the light emitting element is flip-chip mounted. The first and second lead electrodes have an inner lead portion embedded in the molded body and a part of the inner lead portion exposed on the bottom surface of the recess, and an outer lead portion disposed on the lower surface side of the package,
The inner lead portion includes an electrode end portion, a mounting portion on which the light emitting element is mounted, and a connection portion between the mounting portion and the outer lead portion, and at least a part of the electrode end portion. And the connection portion are embedded in the molded body, and the first lead electrode has the connection portion on the side of the first concave portion of the molded body, and the electrode end portion of the molded body. The second lead electrode has a connection portion on the second recess side surface side of the molded body, and the electrode end portion has the electrode end portion on the second recess side surface side opposite to the first recess side surface. the light emitting device according to claim 1 or 2, characterized in that it has a first recess side surface side of the molded body. 4. The light emitting device according to claim 3 , wherein one of the connection portions of the first and second lead electrodes and the other electrode end are disposed to face each other. The vertical width of the connecting portion of each of the first and second lead electrodes is 0.8 to 1.2 times the vertical width of the electrode end at a portion facing the electrode end. The light-emitting device according to claim 3 or 4 , wherein Vertical width of the electrode end portion, the light emitting device according to any one of 5 claims 3, characterized in that narrower than the vertical width of the mounting portion. The light emitting device, light emitting device according to any one of 6 claim 1, characterized in that mounted on the mounting portion using a solder. A light emitting element;
A light emitting device comprising: a molded body having a concave portion in which the light emitting element is housed on the front; and a package embedded in the molded body and having first and second lead electrodes,
The first and second lead electrodes have an inner lead portion embedded in the molded body and a part of the first lead electrode exposed at the bottom surface of the recess, and an outer lead portion disposed on the lower surface side of the package,
The inner lead portion includes an electrode end portion, a mounting portion on which the light emitting element is mounted, and a connecting portion between the mounting portion and the outer lead portion, and the electrode end portion and the connecting portion. Is embedded in the molded body, and the light-emitting element is flip-chip mounted on the mounting portion,
The entire electrode end portion of the inner lead portion is embedded in the molded body,
The first lead electrode has the connection portion on the side of the first recess side of the molded body, and the electrode end portion on the side of the second recess on the side opposite to the first recess side of the molded body. to a, the second lead electrode, the connection portion has a second recess side surface side of the molded body, possess the electrode end portion to the first recess side surface side of the molded body,
The light emitting device according to claim 1, wherein the concave portion is narrower in a vertical direction of the molded body than a direction connecting the side surfaces of the first and second concave portions of the molded body . The light emitting device according to claim 8 , wherein the first and second lead electrodes are provided side by side in a vertical direction of the molded body on a bottom surface of the concave portion.