JP6218658B2 - Laser processing method - Google Patents

Description

  The present invention relates to a laser processing method for laser processing a plate-like workpiece having a plurality of regions defined by a plurality of division lines formed on a surface in a grid pattern along the division lines.

  A plate-like workpiece such as a semiconductor wafer in which a plurality of regions are defined by a plurality of division lines called streets formed in a lattice pattern on the surface of a plate-like substrate and the like, and devices are formed in the divided regions. Objects are divided into individual devices along the street, and the divided devices are widely used in various electronic devices such as mobile phones and personal computers.

  In recent years, as a method of dividing a plate-like workpiece along the street, a laser beam is formed on the surface of the plate-like workpiece by irradiating a pulsed laser beam along the street, or inside the plate-like workpiece. A method has been proposed in which a modified layer is formed on the plate-like workpiece and an external force is applied to the plate-like workpiece to cleave the plate-like workpiece along the laser processing groove or the modified layer (for example, Japanese Patent Laid-Open No. Hei 10). -305420).

  The plate-like workpiece has various sizes depending on the material and application, and there is a relatively small one having a diameter of about 50 mm. On the other hand, the chuck table of a laser processing apparatus is generally configured to have a size corresponding to a semiconductor wafer having a diameter of 200 to 300 mm.

  Therefore, in order to effectively utilize the holding surface of the chuck table, a plurality of plate-like workpieces are attached to a dicing tape, which is an adhesive tape having an outer peripheral portion attached to an annular frame, and attached to the dicing tape. The productivity is improved by carrying out laser processing by sucking and holding a plurality of plate-like workpieces that are sucked by a chuck table.

  In the conventional laser processing method, when a plurality of plate-like workpieces are pasted and processed on a dicing tape mounted on an annular frame, for example, as disclosed in JP 2009-146949 A, a plate is used. Laser processing was performed on all streets for each workpiece.

JP-A-10-305420 JP 2009-146949 A

  However, in the conventional laser processing method disclosed in Patent Document 2, since laser processing is performed on all streets for each plate-like workpiece, the processing feed mechanism is accelerated, decelerated, stopped, and stopped during processing. It was necessary to repeatedly rotate the chuck table, which was not always satisfactory in terms of productivity.

  The present invention has been made in view of the above points, and an object of the present invention is to perform laser processing by sucking and holding a plurality of plate-like workpieces attached to a dicing tape with a chuck table. Reduces operations such as acceleration, deceleration, stop and rotation of the chuck table during machining, and efficiently divides a plurality of plate-like workpieces adhered to dicing tape along the street It is to provide a laser processing method.

  According to the first aspect of the present invention, the holding means having a holding surface for holding a plate-like workpiece in which a plurality of regions are partitioned by a plurality of divided division lines formed in a lattice shape on the surface, and the divided division lines Alignment means for detecting, laser processing means for irradiating a plate-like workpiece held by the holding means with a laser beam, and processing for relatively moving the laser processing means and the holding means in the X-axis direction A feed means, an index feed means for moving the laser processing means and the holding means relative to each other in the Y-axis direction orthogonal to the X-axis direction; and the holding means rotated about a rotation axis perpendicular to the holding surface A laser of a plate-like workpiece that is laser-processed by irradiating a laser beam along the line to be divided of the plate-like workpiece using a laser processing apparatus comprising: A processing method, a plate-like workpiece support step of attaching a plurality of plate-like workpieces including the first and second plate-like workpieces to the surface of a dicing tape mounted on an annular frame; After the step of supporting the plate-like workpiece, a holding step of placing and holding the plurality of plate-like workpieces on the holding means via the dicing tape, and a plurality of holdings held by the holding means An alignment step of detecting a position of the division target line of the plate-like workpiece; a laser processing step of irradiating a laser beam along the division division line of a plurality of plate-like workpieces after the alignment step is performed; The alignment step includes a coordinate detection step for detecting and storing the coordinates of the start point and the end point of the scheduled division line of the first and second workpieces, respectively, and the dividing line in the laser machining step. Laser bee The laser processing means moves on the first and second plate-like workpieces when processing by irradiation, and the first plate-like workpiece arranged extending in the X-axis direction. A trajectory when the laser processing means moves between the workpiece and the second plate workpiece, the coordinates of the start and end points of the division line of the first plate workpiece and the second A trajectory calculation step that calculates from the coordinates of the start point and end point of the division-scheduled line of the plate-like workpiece, and in the laser processing step, the laser processing means is moved along the trajectory calculated in the trajectory calculation step. Laser processing is continuously performed on the scheduled division lines extending in the process feed direction of the first and second plate-like workpieces without moving and stopping the process feed by the process feed means. A laser processing method for a plate-like workpiece characterized by the above is provided.

  Preferably, in the alignment step, the planned dividing line formed on the first plate-like workpiece located upstream in the X-axis direction where laser processing is performed first in the laser processing step is parallel to the X-axis direction. A first rotation angle calculation step of calculating a rotation angle when rotating the holding unit to a position, and after rotating the holding unit by the rotation angle calculated in the first rotation angle calculation step, X A second rotation angle for calculating a rotation angle when the holding means is rotated to a position where the planned division line formed on the second plate-like workpiece positioned on the downstream side in the axial direction is parallel to the X-axis direction. A calculation step, and in the locus calculation step, the division plan on the first plate-like workpiece when the holding means is rotated by the rotation angle calculated in the first rotation angle calculation step The coordinates of the start and end points of the line, Based on the start point and end point coordinates of the scheduled division line on the second plate-like workpiece when the holding means is rotated by the rotation angle calculated in the second rotation angle calculation step, the laser A trajectory when the processing means moves is calculated. In the laser processing step, the holding means is rotated by the rotation angle calculated in the first rotation angle calculation step, and then the trajectory calculated in the trajectory calculation step. The laser processing means is moved along the laser beam to laser-process the scheduled division line formed on the first plate-shaped workpiece, and then the rotation angle calculated in the second rotation angle calculation step The laser processing means is moved along the trajectory calculated in the trajectory calculating step in a state where the holding means is rotated by the laser, and the division planned line formed on the second plate-like workpiece is laser Process.

  In an alternative embodiment, in the alignment step, the division line formed on the first plate-like workpiece located on the upstream side in the X-axis direction where laser processing is first performed in the laser processing step is the X-axis direction. A holding means rotating step for rotating the holding means by a predetermined angle to a parallel position, and the second plate-like workpiece formed on the downstream side in the X-axis direction when the holding means rotating step is performed. An angle calculating step for calculating an angle (θ) formed by the planned dividing line with respect to the X-axis direction, and the angle formed on the second plate-like workpiece from the angle (θ) obtained in the angle calculating step. A correction equation calculating step for obtaining a linear equation (y = tan θ · x) representing a division-scheduled line, and the trajectory calculating step is formed on the first plate-like workpiece after the holding means rotating step. The coordinates of the start and end points of the line to be divided; The laser processing means based on the coordinates of the start point and end point of the scheduled division line formed on the second plate-like workpiece and the linear equation (y = tan θ · x) calculated in the correction formula calculation step In the laser processing step, the laser processing means is moved along the trajectory calculated in the trajectory calculation step, and the laser beam is formed on the first plate-like workpiece. After performing laser processing on the planned division line, laser processing is performed on the planned division line formed on the second plate-shaped workpiece, and the correction is performed when the second plate-shaped workpiece is laser processed. Based on the linear equation (y = tan θ · x) calculated in the equation calculation step, the division line is laser processed while being indexed and fed by the indexing and feeding means along with the machining and feeding by the processing and feeding means.

  According to the laser processing method of the present invention, in the laser processing step, the laser processing means is moved along the trajectory calculated in the trajectory calculation step, and the processing feed by the processing feed means is stopped, and the X axis direction on the holding means is stopped. Efficiently dividing a plurality of plate-like workpieces along the scheduled division line in order to continuously laser-process the division-scheduled lines of the first and second plate-like workpieces held adjacent to each other. And productivity can be improved.

It is a perspective view of a laser processing apparatus. It is a block diagram of a laser beam generation unit. It is a perspective view explaining the laser processing method of the present invention. FIG. 4A is a view showing an example of the arrangement of four plate-like workpieces on a dicing tape, and FIG. 4B is a plate-like workpiece arranged as shown in FIG. It is a figure which shows the laser processing locus with respect to. It is a figure explaining the alignment process with respect to a plate-shaped workpiece. It is sectional drawing explaining a laser processing process. FIG. 7 (A) is a diagram showing another example of the arrangement of four plate-like workpieces on the dicing tape, and FIG. 7 (B) is a plate-like workpiece arranged as shown in FIG. 7 (A). It is a figure which shows the laser processing locus | trajectory of 1st Embodiment with respect to a workpiece. FIG. 8A is a view showing the same arrangement as FIG. 7A of the plate-like workpiece on the dicing tape, and FIG. 8B is a view showing the laser processing locus of the second embodiment of the present invention. is there.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a perspective view of a laser processing apparatus 2 suitable for carrying out the laser processing method of the present invention.

  The laser processing apparatus 2 includes a first slide block 6 mounted on a stationary base 4 so as to be movable in the Y-axis direction. The first slide block 6 is indexed and fed along a pair of guide rails 14 extending in the Y-axis direction by an index feed mechanism (index feed means) 12 composed of a ball screw 8 and a pulse motor 10, that is, the Y-axis direction. Moved to.

  A second slide block 16 is mounted on the first slide block 6 so as to be movable in the X-axis direction. That is, the second slide block 16 is moved in the machining feed direction along the pair of guide rails 24 extending in the X-axis direction by the machining feed mechanism (machining feed means) 22 including the ball screw 18 and the pulse motor 20, that is, X It is moved in the axial direction.

  A chuck table 28 is mounted on the second slide block 16 via a cylindrical support member 26. The chuck table 28 is rotatable and can be moved in the Y-axis direction and the X-axis direction by the index feed mechanism 12 and the machining feed mechanism 22. The chuck table 28 is provided with a clamp 30 for clamping the frame of the frame unit sucked and held by the chuck table 28.

  A column 32 is erected on the stationary base 4, and a Z-axis slide block (third slide block) 34 is provided on the column 32, and a Z-axis moving mechanism including a ball screw and a pulse motor 35 (not shown). 37 is mounted so as to be movable in the Z-axis direction along a pair of guide rails 39 (only one shown) fixed in the column 32 and extending in the Z-axis direction.

  A laser beam irradiation unit (laser beam irradiation means) 36 is attached to the Z-axis moving block 34. The laser beam irradiation unit 36 includes a laser beam generation unit 40 shown in FIG. 2 housed in a cylindrical casing 38 fixed to the Z-axis slide block 34, and a condenser (laser) attached to the tip of the casing 38. Processing means) 42.

  As shown in FIG. 2, the laser beam generating unit 40 includes a laser oscillator 48 that oscillates a YAG pulse laser or a YVO4 pulse laser, a repetition frequency setting means 50, a pulse width adjusting means 52, and a power adjusting means 54. It is out.

  The pulse laser beam LB adjusted to a predetermined power by the power adjusting means 54 of the laser beam generating unit 40 is a plate-like workpiece 11 held on the chuck table 28 from a condenser 42 attached to the tip of the casing 38. Is irradiated.

  An alignment unit 44 is attached to the casing 38 of the laser beam irradiation unit 36. The alignment unit 44 has an imaging unit 46 that images a processing region to be laser processed. The image pickup unit 46 includes an image pickup device such as a normal CCD that picks up an image of a processing region of a plate-like workpiece by visible light.

  The imaging unit 46 further outputs an infrared irradiation means for irradiating the plate-shaped workpiece with infrared rays, an optical system for capturing infrared rays irradiated by the infrared irradiation means, and an electrical signal corresponding to the infrared rays captured by the optical system. Infrared imaging means including an infrared imaging device such as an infrared CCD is included, and the captured image signal is transmitted to a controller (control means) (not shown).

  In the laser processing method according to the embodiment of the present invention, first, a plate-like workpiece support step is performed in which a plurality of plate-like workpieces are attached to the surface of a dicing tape mounted on an annular frame. That is, in the plate-like workpiece support step, as shown in FIG. 3, a plurality of plate-like workpieces (four in this embodiment) are formed on the surface of the dicing tape T whose outer peripheral portion is bonded to the annular frame F. The plate-like workpieces 11 </ b> A to 11 </ b> D) are attached to form the frame unit 17.

  A plurality of regions 15 are defined on the surfaces of the respective plate-like workpieces 11A to 11D by a plurality of division lines 13 formed in a lattice shape, and devices such as semiconductor devices are formed in these regions 15, for example. Or an electronic component such as a capacitor is formed.

  After the plate-like workpiece support step is performed to form the frame unit 17, the plurality of plate-like workpieces 11 </ b> A to 11 </ b> D are placed and held on the chuck table (holding means) 28 via the dicing tape T. A holding step is performed. Next, an alignment process for detecting the positions of the division lines 13 of the plurality of plate-like workpieces 11A to 11D held on the chuck table 28 is performed.

  This alignment process will be described with reference to FIGS. 4A shows a state where four plate-like workpieces 11A to 11D are aligned in the X-axis direction and the Y-axis direction and are attached to the dicing tape T. FIG.

  In the alignment step, the chuck table 28 that sucks and holds the frame unit 17 is moved directly below the imaging unit 46, and the four plate-like workpieces 11 </ b> A to 11 </ b> D are imaged by the imaging unit 46. When all the plate-like workpieces 11A to 11D cannot be imaged by one imaging, the chuck table 28 is moved in the X-axis direction and the Y-axis direction and imaged in multiple times.

  By this imaging, as shown in FIG. 5, two alignment marks 21a and 21b formed on the plate-like workpiece 11A are detected. In the present embodiment, the two alignment marks 21a and 21b are formed at the intersection of the planned dividing lines 13, but the position of the alignment mark is not limited to this, and a plurality of alignment marks are arranged at other locations. A mark may be provided.

  When the two alignment marks 21a and 21b are detected, the distance from the alignment marks 21a and 21b to the start point 13a of each scheduled division line 13 extending in the first direction of the plate-like workpiece 11A and the end point 13b. Since the distance is known from the design data in advance, the controller detects the coordinate position of the start point 13a and the coordinate position of the end point 13b of each scheduled dividing line 13 extending in the first direction of the plate-like workpiece 11A, respectively. Is stored in the memory (coordinate detection step).

  Also for the plate-like workpieces 11B, 11C, and 11D, the two alignment marks 21a and 21b are detected from the captured image, and the coordinate positions and end points of the start points 13a of all the division lines 13 that similarly extend in the first direction. The coordinate position 13b is detected and stored in the memory of the controller.

  After the coordinate detection process of the start point 13a and the end point 13b of the planned dividing line 13 extending in the first direction for all the plate-like workpieces 11A to 11D is completed, the chuck table 28 is rotated by 90 °, and then the imaging unit 46 is rotated. Then, the four plate-like workpieces 11A to 11D are imaged again, and the coordinates of the start point position 13a and the end point position 13b of all the planned division lines 13 extending in the second direction orthogonal to the first direction are respectively shown. Detect and save to controller memory.

  After performing the coordinate detection process, the laser processing means (concentrator) 42 is placed on the plate-like workpiece 11A and the plate-like workpiece 11B when the laser beam LB is irradiated to the division planned line 13 in the laser machining step. And a locus when the laser processing means (condenser) 42 moves between the plate-like workpiece 11A and the plate-like workpiece 11B arranged extending in the X-axis direction. Is calculated from the coordinates of the start point 13a and the end point 13b of the planned division line 13 of the plate-like workpiece 11A and the coordinates of the start point 13a and the end point 13c of the planned division line 13 of the plate-like workpiece 11B. To do.

  The four plate-like workpieces 11A to 11D shown in FIG. 4A are arranged in alignment in the X-axis direction and the Y-axis direction, respectively, and the division line 13 is parallel to the X-axis and Y-axis. The state is stuck on the dicing tape T.

  Therefore, in this case, the locus 19 along which the laser processing means (condenser) 42 moves is a straight line as shown in FIG. Therefore, in the laser processing step, as shown in FIGS. 4B and 6, the laser processing means (condenser) 42 is moved along the trajectory 19 calculated in the trajectory calculation step, and the processing feed means 22 performs the processing. Without stopping the processing feed, the division lines 13 extending in the processing feed direction of the plate-like workpieces 11A and 11B are continuously laser processed. Note that the irradiation of the laser beam LB is stopped between the end point 13b of the planned division line 13 of the plate-like workpiece 11A and the start point of the planned division line 13 of the plate-like workpiece 11B.

  Next, the laser processing method in the case where the four plate-like workpieces 11A to 11D are attached to the dicing tape T in the arrangement state shown in FIG. 7A will be described. Here, it is assumed that the plate-like workpiece 11A and the plate-like workpiece 11B are arranged so as to be shifted in the Y-axis direction, and the respective division lines 13 are parallel to the X-axis direction and the Y-axis direction. .

  Further, the division line 13 of the plate-like workpiece 11C is parallel to the X-axis direction and the Y-axis direction, and the division line 13 of the plate-like workpiece 11D is arranged at an angle θ from the X-axis direction and the Y-axis direction. It shall be installed.

  When the plate-like workpiece 11A and the plate-like workpiece 11B are continuously laser-processed, the plate-like workpiece is obtained from the coordinates of the start point 13a and the end point 13b of the division line 13 of the plate-like workpiece 11A. A trajectory 19a for laser processing 11A is calculated to be parallel to the X-axis direction, and when the plate-like workpiece 11B is laser-machined from the coordinates of the start point 13a and the end point 13b of the division-scheduled line 13 of the plate-like workpiece 11B. The locus 19c is calculated to be parallel to the X-axis direction. The locus between the plate-like workpiece 11A and the plate-like workpiece 11B is calculated as a line segment 19b connecting the locus 19a and the locus 19c.

  Therefore, in the laser processing step of the plate-like workpieces 11A and 11B, the laser processing means (condenser) 42 is moved along the trajectories 19a, 19b, and 19c calculated in the trajectory calculation step, and the processing feed means 22 Without stopping the processing feed, the division-scheduled lines 13 extending in the processing feed direction of the plate-like workpieces 11A and 11B are continuously laser processed. Note that the irradiation of the laser beam LB is stopped while the locus 19b is moving.

  Next, the laser processing method of 1st Embodiment in the case of carrying out the laser processing of the plate-shaped to-be-processed objects 11C and 11D continuously is demonstrated. In the state shown in FIG. 7A, the planned division line 13 of the plate-like workpiece 11C is arranged so as to be parallel to the X-axis direction and the Y-axis direction, and the planned division line of the plate-like workpiece 11D. 13 is disposed with an angle θ with respect to the X-axis direction and the Y-axis direction.

  However, here, in order to generalize the laser processing method of the first embodiment, it is assumed that the angle of the plate-like workpieces 11C and 11D with respect to the X-axis of the division line 13 is unknown.

  In the alignment process of the first embodiment, the planned division line 13 formed on the plate-like workpiece 11C located on the upstream side in the X-axis direction where laser processing is first performed in the laser processing process is parallel to the X-axis direction. When the chuck table rotation process for rotating the chuck table 28 to a position by a predetermined angle and the chuck table rotation process are performed, the planned dividing line 13 formed on the plate-like workpiece 11D located on the downstream side in the X-axis direction is X An angle calculation step for calculating an angle (θ) to be formed with respect to the axial direction, and a linear equation representing the planned division line 13 formed on the plate-like workpiece 11D from the angle (θ) obtained in the angle calculation step. And a correction formula calculation step for obtaining (y = tan θ · x).

  In the example shown in FIG. 7, since the division line 13 of the plate-like workpiece 11C is arranged so as to be parallel to the X-axis direction, the predetermined angle rotated in the chuck table rotating step is 0 °. Become. Therefore, the linear equation representing the division line 13 formed on the plate-like workpiece 11D is y = tan θ · x.

  In the trajectory calculation step, the coordinates of the start point 13a and the end point 13b of the planned division line 13 formed on the plate-like workpiece 11C after the chuck table rotation step, and the planned division line 13 formed on the plate-like workpiece 11D. Based on the coordinates of the start point 13a and the end point 13b and the linear equation (y = tan θ · x) calculated in the correction formula calculation step, the trajectories 19a and 19d when the laser processing means (condenser) 42 moves are obtained. calculate.

  After the trajectory calculation step is performed, in the laser processing step, the laser processing means (condenser) 42 is moved along the trajectories 19a and 19d calculated in the trajectory calculation step to form the plate-like workpiece 11C. After the planned division line 13 is laser processed, the planned division line 13 formed on the plate-like workpiece 11D is laser processed.

  Here, when laser processing the plate-like workpiece 11D, the index feed means simultaneously with the work feed by the work feed means 22 based on the linear equation (y = tan θ · x) calculated in the correction formula calculation step. The dividing line 13 is laser-processed while performing the index feed by 12. Laser beam irradiation is stopped between the end point 13b of the planned division line 13 of the plate-like workpiece 11C and the start point 13a of the planned division line 13 of the plate-like workpiece 11D.

  Next, with reference to FIG. 8, the laser processing method of 2nd Embodiment of this invention is demonstrated. In the alignment process of the present embodiment, the division line 13 formed on the plate-like workpiece 11C located upstream in the X-axis direction where laser processing is performed first in the laser processing process is a position where the division line 13 is parallel to the X-axis direction. A first rotation angle calculation step of calculating a rotation angle when rotating the chuck table 28 until the chuck table 28 is rotated by the rotation angle calculated in the first rotation angle calculation step, and then downstream in the X-axis direction A second rotation angle calculating step of calculating a rotation angle when the chuck table 28 is rotated to a position where the scheduled division line 13 formed on the plate-like workpiece 11D positioned on the side is parallel to the X-axis direction; Contains.

  Here, since the division line 13 of the plate-like workpiece 11C located on the upstream side in the X-axis direction where laser processing is performed is parallel to the X-axis direction, the angle calculated in the first rotation angle calculation step is 0. °. Therefore, the rotation angle calculated in the second rotation angle calculation step is θ.

  In the trajectory calculation step, the coordinates of the start point 13a and the end point 13b of the scheduled division line 13 on the plate-like workpiece 11C when the chuck table 28 is rotated by the rotation angle calculated in the first rotation angle calculation step, Based on the coordinates of the start point 13a and the end point 13b of the scheduled division line 13 on the plate-like workpiece 11D when the chuck table 28 is rotated by the rotation angle calculated in the second rotation angle calculation step, laser processing is performed. Trajectories 19a and 19e when the means (condenser) 42 moves are calculated.

  In the laser processing step, after the chuck table 28 is rotated by the rotation angle calculated in the first rotation angle calculation step, the laser processing means (condenser) 42 is moved along the locus 19a calculated in the locus calculation step. Is moved to laser-process the scheduled division line 13 formed on the plate-like workpiece 11C.

  Next, with the chuck table 28 rotated by the rotation angle calculated in the second rotation angle calculation step, the laser processing means (condenser) 42 is moved along the locus 19e calculated in the locus calculation step. Then, the dividing line 13 formed on the plate-like workpiece 11D is laser processed.

  In the laser processing step of the present embodiment, the chuck table 28 is rotated by the rotation angle calculated in the second rotation angle calculation step while performing processing feed between the plate-like workpiece 11C and the plate-like workpiece 11D. Laser beam irradiation is stopped between the end point 13b of the planned division line 13 of the plate-like workpiece 11C and the start point 13a of the planned division line 13 of the plate-like workpiece 11D.

  In the arrangement state of the plate-like workpieces 11C and 11D shown in FIG. 8, since the division line 13 of the plate-like workpiece 11C is parallel to the X-axis direction, in the first rotation angle calculation step. The calculated angle is 0 °. Therefore, since the angle calculated in the second rotation angle calculation step is θ, the chuck table 28 is rotated by θ so that the division line 13 of the plate-like workpiece 11D is parallel to the X-axis direction. Thereafter, the laser processing means (condenser) 42 is moved along the locus 19e (parallel to the X-axis direction) calculated in the locus calculating step, and the planned division line 13 formed on the plate-like workpiece 11D is moved. Laser processing.

11A to 11D Plate-like workpiece 12 Index feed mechanism (index feed means)
13 Line to be divided 13a Start point 13b End point 17 Frame units 19, 19a to 19e Trajectories 21a, 21b Alignment mark 22 Processing feed mechanism (processing feed means)
28 Chuck table 36 Laser beam irradiation unit (Laser beam irradiation means)
40 Laser beam generating unit 42 Condenser (laser processing means)

Claims (3)

A holding means having a holding surface for holding a plate-like workpiece in which a plurality of regions are partitioned by a plurality of division lines formed in a lattice pattern on the surface; an alignment means for detecting the division lines; and the holding A laser processing means for irradiating a plate-like workpiece held by the means with a laser beam, a processing feed means for relatively moving the laser processing means and the holding means in the X-axis direction, and the laser processing means; A laser comprising: index feeding means for relatively moving the holding means in a Y-axis direction perpendicular to the X-axis direction; and a rotating means for rotating the holding means about a rotation axis perpendicular to the holding surface. A laser processing method for a plate-like workpiece, wherein the plate-like workpiece is laser-processed by irradiating a laser beam along the planned division line of the plate-like workpiece using a processing apparatus,
A plate-like workpiece support step of attaching a plurality of plate-like workpieces including the first and second plate-like workpieces to the surface of the dicing tape attached to the annular frame;
A holding step of placing and holding the plurality of plate-like workpieces on the holding means via the dicing tape after the plate-like workpiece support step is performed;
An alignment step of detecting the positions of the division lines of the plurality of plate-like workpieces held by the holding means;
A laser processing step of irradiating a laser beam along the division line of the plurality of plate-like workpieces after the alignment step is performed, and
The alignment step includes a coordinate detection step of detecting and storing the coordinates of the start point and the end point of the division planned lines of the first and second workpieces,
In the laser processing step, the laser processing means moves on the first and second plate workpieces when irradiating the laser beam to the division lines, and extends in the X-axis direction. The path when the laser processing means moves between the first plate-like work piece and the second plate-like work piece arranged in the above manner is divided into the division of the first plate-like work piece. A trajectory calculating step of calculating from the coordinates of the start point and end point of the planned line and the coordinates of the start point and end point of the divided planned line of the second plate-like workpiece,
In the laser processing step, the laser processing means is moved along the trajectory calculated in the trajectory calculation step, and the processing of the first and second plate-like workpieces is stopped without stopping the processing feed by the processing feed means. A laser processing method for a plate-like workpiece characterized by continuously laser processing the scheduled division lines arranged extending in the processing feed direction. The alignment step is performed until the division line formed on the first plate-like workpiece positioned upstream in the X-axis direction where laser processing is performed first in the laser processing step is parallel to the X-axis direction. A first rotation angle calculating step of calculating a rotation angle when rotating the holding means;
After the holding means is rotated by the rotation angle calculated in the first rotation angle calculation step, the planned dividing line formed on the second plate-like workpiece positioned downstream in the X-axis direction is the X-axis. A second rotation angle calculation step of calculating a rotation angle when rotating the holding means to a position parallel to the direction,
In the trajectory calculation step, the coordinates of the start point and end point of the division planned line on the first plate-like workpiece when the holding means is rotated by the rotation angle calculated in the first rotation angle calculation step. And the coordinates of the start point and the end point of the division line on the second plate-like workpiece when the holding means is rotated by the rotation angle calculated in the second rotation angle calculation step. , Calculating the trajectory when the laser processing means moves,
In the laser processing step, after rotating the holding means by the rotation angle calculated in the first rotation angle calculation step, the laser processing means is moved along the locus calculated in the locus calculation step, In the state where the dividing line formed on the first plate-shaped object is laser processed, and then the holding means is rotated by the rotation angle calculated in the second rotation angle calculation step, 2. The laser beam machining is performed on the planned division line formed on the second plate-like workpiece by moving the laser processing means along the trajectory calculated in the trajectory calculating step. Laser processing method. The alignment step is performed until the division line formed on the first plate-like workpiece positioned upstream in the X-axis direction where laser processing is performed first in the laser processing step is parallel to the X-axis direction. A holding means rotating step of rotating the holding means by a predetermined angle;
When the holding means rotating step is performed, an angle (θ) formed by the planned division line formed on the second plate-like workpiece positioned downstream in the X-axis direction with respect to the X-axis direction is calculated. An angle calculation step;
A correction equation calculating step for obtaining a linear equation (y = tan θ · x) representing the planned division line formed on the second plate-like workpiece from the angle (θ) obtained in the angle calculating step. ,
In the trajectory calculating step, the coordinates of the start and end points of the scheduled division line formed on the first plate-like workpiece after the holding means rotating step, and the coordinates formed on the second plate-like workpiece Calculate the trajectory when the laser processing means moves based on the coordinates of the start point and end point of the planned division line and the linear equation (y = tan θ · x) calculated in the correction formula calculation step,
In the laser processing step, the laser processing means is moved along the trajectory calculated in the trajectory calculating step, and the division planned line formed on the first plate-like workpiece is laser processed, Laser processing of the planned division line formed on the second plate workpiece is performed,
When laser machining the second plate-like workpiece, the indexing is performed in accordance with the machining feed by the machining feeding means based on the linear equation (y = tan θ · x) calculated in the correction formula calculation step. 2. The laser processing method according to claim 1, wherein the division-scheduled line is subjected to laser processing while performing indexing and feeding by a feeding means.

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