JP6213079B2 - Efem - Google Patents
Efem Download PDFInfo
- Publication number
- JP6213079B2 JP6213079B2 JP2013185987A JP2013185987A JP6213079B2 JP 6213079 B2 JP6213079 B2 JP 6213079B2 JP 2013185987 A JP2013185987 A JP 2013185987A JP 2013185987 A JP2013185987 A JP 2013185987A JP 6213079 B2 JP6213079 B2 JP 6213079B2
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- Japan
- Prior art keywords
- wafer transfer
- wafer
- transfer chamber
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- hand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
また、EFEMには、ウェーハのアライメントを行うアライナがウェーハ搬送室の一側面に配置されるのが通例であり、本発明に係るEFEMでも、ステーションは、ウェーハが仮置きされるバッファステーション又はアライナであり、ステーションの少なくとも1台がアライナであれば、アライナをウェーハ搬送室の何れか一方の側面に配置することができる。この場合、アライナはバッファステーション等の他のステーションに干渉しない位置に配置することが好ましく、ウェーハ搬送室の一方の側面にのみバッファステーションを配置した構成(第1レイアウト)、又はウェーハ搬送室の両側面にそれぞれバッファステーションを配置した構成(第2レイアウト)の何れにおいてもアライナをウェーハ搬送室の何れか一方の側面に配置することができる。
2…ロードポート
3…ウェーハ搬送室
31…側面
4…バッファステーション
5…ウェーハ搬送ロボット
6…ハンド
7…アーム
8…走行部
9…アライナ
M…半導体処理装置(ウェーハ処理装置)
Claims (4)
- ウェーハ搬送ロボットを内部空間に配置したウェーハ搬送室と、当該ウェーハ搬送室の前面に隣接して設けたロードポートと、ウェーハを一時的に収容可能なステーションとを備え、前記ウェーハ搬送室の後面に半導体処理装置を隣接して配置可能なEFEMであって、
前記ウェーハ搬送室の両側面のうち少なくとも何れか一方の側面に、前記ステーションを前記ウェーハ搬送室の前後方向に2台併設し、
前記ウェーハ搬送ロボットが、先端部に設けたハンドを進退移動させることが可能なアームと、前記アームの基端部を旋回可能に支持し且つ前記ウェーハ搬送室の幅方向に走行する走行部とを備えたものであり、
前記アーム及び前記走行部を前記ウェーハ搬送室の前記内部空間に配置したものであることを特徴とするEFEM。 - 前記ウェーハ搬送室の側面に併設した前記2台のステーションに対して前記ハンドが、前記走行部の走行経路上における所定の位置から前記各ステーションに向かう直線状の移動経路に沿って進退移動するように構成し、
前後方向に並ぶ前記各ステーションに対する前記ハンドの移動経路の起点が前記走行経路上に設定され、
前記起点に配置された前記ハンドが前記2台のステーションのうち相対的に前側のステーションに到達する直線状の移動経路と、前記走行経路とがなす交差角度は鋭角であり、
前記起点に配置された前記ハンドが前記2台のステーションのうち相対的に後側のステーションに到達する直線状の移動経路と、前記走行経路とがなす交差角度は鋭角であり、
前記走行経路の任意の位置から等距離となる位置に前記2台のステーションを配置している請求項1に記載のEFEM。 - 前記ステーションの少なくとも1台は前記ウェーハ搬送ロボットによるアクセスを許容するバッファ開口部を有するバッファステーションであり、当該バッファステーションは、高さ方向に所定ピッチで複数形成された保持用スロットを備え、且つ前後方向に並ぶ前記各ステーションに対する前記ハンドの移動経路の起点に向かって前記バッファ開口部の開口縁が開口している請求項1又は2に記載のEFEM。
- 前記ステーションは、ウェーハが仮置きされるバッファステーション又はアライナであり、前記ステーションの少なくとも1台はアライナである請求項1乃至3の何れかに記載のEFEM。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013185987A JP6213079B2 (ja) | 2013-09-09 | 2013-09-09 | Efem |
TW103130808A TWI631646B (zh) | 2013-09-09 | 2014-09-05 | 設備前端模組 |
TW107116163A TWI662645B (zh) | 2013-09-09 | 2014-09-05 | Wafer transfer system |
US14/479,842 US9786534B2 (en) | 2013-09-09 | 2014-09-08 | Efem |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013185987A JP6213079B2 (ja) | 2013-09-09 | 2013-09-09 | Efem |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015053413A JP2015053413A (ja) | 2015-03-19 |
JP6213079B2 true JP6213079B2 (ja) | 2017-10-18 |
Family
ID=52625791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013185987A Active JP6213079B2 (ja) | 2013-09-09 | 2013-09-09 | Efem |
Country Status (3)
Country | Link |
---|---|
US (1) | US9786534B2 (ja) |
JP (1) | JP6213079B2 (ja) |
TW (2) | TWI662645B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6450653B2 (ja) * | 2015-06-24 | 2019-01-09 | 東京エレクトロン株式会社 | 格納ユニット、搬送装置、及び、基板処理システム |
JP2017028209A (ja) | 2015-07-27 | 2017-02-02 | 東京エレクトロン株式会社 | 基板収納方法及び基板処理装置 |
JP2018000126A (ja) * | 2016-07-05 | 2018-01-11 | シンフォニアテクノロジー株式会社 | 細胞搬送装置 |
KR101980437B1 (ko) * | 2017-07-28 | 2019-06-24 | 오션브릿지 주식회사 | 관리효율이 향상된 웨이퍼 자동 관리 장치용 챔버 |
JP6853396B2 (ja) * | 2019-03-29 | 2021-03-31 | 平田機工株式会社 | ロードポート |
JP7628048B2 (ja) | 2021-04-01 | 2025-02-07 | ニデックインスツルメンツ株式会社 | ワーク搬送システム及びその制御方法 |
US20220399219A1 (en) * | 2021-06-11 | 2022-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer alignment apparatus and method for multi-cassette load port |
KR20230045765A (ko) * | 2021-09-29 | 2023-04-05 | 삼성전자주식회사 | EFEM(Equipment Front End Module) 및 이를 포함하는 파괴 분석 자동화 설비 |
KR102395665B1 (ko) * | 2021-11-23 | 2022-05-09 | 한국야스카와전기(주) | 웨이퍼의 공정장치 |
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JP2001274221A (ja) * | 2001-03-21 | 2001-10-05 | Tokyo Electron Ltd | 板状体の搬送装置および搬送方法、ならびに処理装置 |
US7223323B2 (en) * | 2002-07-24 | 2007-05-29 | Applied Materials, Inc. | Multi-chemistry plating system |
US7695231B2 (en) * | 2004-03-08 | 2010-04-13 | Jusung Engineering Co., Ltd. | Vacuum pumping system, driving method thereof, apparatus having the same, and method of transferring substrate using the same |
JP2005268264A (ja) * | 2004-03-16 | 2005-09-29 | Hitachi Kokusai Electric Inc | 基板処理装置 |
US8353986B2 (en) * | 2005-03-31 | 2013-01-15 | Tokyo Electron Limited | Substrate processing apparatus |
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JP2007251090A (ja) * | 2006-03-20 | 2007-09-27 | Tokyo Electron Ltd | 真空処理装置の搬送位置合わせ方法、真空処理装置及びコンピュータ記憶媒体 |
JP2008027937A (ja) * | 2006-07-18 | 2008-02-07 | Hitachi High-Technologies Corp | 真空処理装置 |
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JP5401089B2 (ja) * | 2008-12-15 | 2014-01-29 | 東京エレクトロン株式会社 | 異物除去方法及び記憶媒体 |
JP5139253B2 (ja) * | 2008-12-18 | 2013-02-06 | 東京エレクトロン株式会社 | 真空処理装置及び真空搬送装置 |
JP5433290B2 (ja) * | 2009-04-20 | 2014-03-05 | 東京エレクトロン株式会社 | 基板収納方法及び制御装置 |
JP5463758B2 (ja) * | 2009-06-26 | 2014-04-09 | 村田機械株式会社 | 保管庫 |
TWI458612B (zh) * | 2009-11-10 | 2014-11-01 | Intevac Inc | 可作z軸運動並具多關節手臂之線性真空機械手 |
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JP6003011B2 (ja) * | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5456804B2 (ja) * | 2012-02-06 | 2014-04-02 | 株式会社日立ハイテクノロジーズ | 搬送容器 |
JP6002312B2 (ja) * | 2012-03-28 | 2016-10-05 | クックジェ エレクトリック コリア カンパニー リミテッド | 選択的エピタキシャル成長のための装置およびクラスター設備 |
US10424498B2 (en) * | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
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2013
- 2013-09-09 JP JP2013185987A patent/JP6213079B2/ja active Active
-
2014
- 2014-09-05 TW TW107116163A patent/TWI662645B/zh active
- 2014-09-05 TW TW103130808A patent/TWI631646B/zh active
- 2014-09-08 US US14/479,842 patent/US9786534B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015053413A (ja) | 2015-03-19 |
US20150071739A1 (en) | 2015-03-12 |
TWI631646B (zh) | 2018-08-01 |
US9786534B2 (en) | 2017-10-10 |
TWI662645B (zh) | 2019-06-11 |
TW201528420A (zh) | 2015-07-16 |
TW201832311A (zh) | 2018-09-01 |
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