JP6211359B2 - Flip chip bonder and bonding method - Google Patents

Description

  The present invention relates to a flip chip and a bonding method, and more particularly to a flip chip bonder and a bonding method with high productivity.

A part of the process of assembling a package by mounting a semiconductor die having bumps (hereinafter simply referred to as a die) on a work such as a wiring board, and a process of dividing the die from a semiconductor wafer (hereinafter simply referred to as a wafer) There is a bonding process in which a die is picked up from a wafer, the die is inverted, and is stacked on a die such as a die mounted on a substrate or already bonded.
As a conventional technique for performing the bonding process (Patent Document 1), as shown in FIG. 14, the die picked up from the wafer is inverted, the inverted die is transferred to the bonding head 41, and the bump is exposed on the lower surface. In Patent Document 1, bumps exposed for each die are immersed in a coating device 8, flux is applied to the bumps, and bonded to the solder portion of the substrate P.

JP 2010-504633 A

  However, the above-described conventional technique immerses the dies one by one in the coating apparatus, and accordingly, it takes much time, resulting in poor throughput and poor productivity. Further, it is necessary to switch the coating apparatus depending on the die size to be used.

  Accordingly, an object of the present invention is to provide a flip chip bonder and a bonding method that are highly productive or do not require changing the coating device for each die size to be used. is there.

In order to achieve the above object, the present invention has at least the following features.
The present invention is a flip chip bonder in which a die having bumps is picked up by a pick-up head, the die thus picked up is inverted, and the bonding head receives the die and bonds the bumps coated with flux to a solder part of a workpiece. The pickup head has a plurality of suction holes for sucking the die, and a flux application part for applying the flux to the bumps.

  The present invention also provides a bonding method in which a die having a bump is picked up by a pickup head, the picked-up die is inverted, and the bonding head receives the die and bonds the bump coated with a flux to a solder portion of a workpiece. The pickup head includes a flux to be applied to the bump, adsorbs the die, and applies the flux to the bump.

Further, the flux application unit stores an application material in which the flux is mixed in a flexible gel-like substance in a region around the adsorption hole, and applies the application material to the adsorption surface of the die. You may have.
The flux application unit includes a compression communication chamber that stores compressed air that applies pressure over the entire area of the coating material, supplies the compressed air to the compression communication chamber, and supplies the coating material from the application port. You may have an air compression means to discharge | release and apply | coat to the said bump.

Further, the flux application part contains and holds a flux, and includes a storage part having an application port for applying the application material to the adsorption surface of the die, an elastic body part for contracting the storage part, and the elastic body part. An air compressing unit that contracts with compressed air, supplying the compressed air to the air compressing unit, discharging the coating material from the coating port, and coating the bumps.
Further, the elastic body part may be made of a flexible gel substance, or the storage part may be made of carbon nanotubes.
Further, the application may be performed between immediately before the adsorption and before passing the die to the bonding head.

  Therefore, according to the present invention, it is possible to provide a flip chip bonder and a bonding method that are highly productive or do not require changing the coating apparatus for each die size to be used.

It is a schematic top view of the flip chip bonder which is one Embodiment of this invention. It is a figure explaining operation | movement of a pick-up head and a bonding head when it sees from the arrow A direction in FIG. It is a schematic sectional drawing which shows the principal part of the die | dye supply part which is one Embodiment of this invention. It is a figure which shows a control block in order to control the structure of the pickup head which has a flux application part of this embodiment, and flux application | coating of a pickup head, adsorption | suction operation | movement of a die | dye, and raising / lowering operation | movement. It is the schematic which looked at the collet provided with the flux application part and adsorption hole in Example 1 from the lower side. It is a figure which shows the state of a collet when the application | coating process progressed in Example 1. FIG. It is a figure which shows the bonding process mainly having the time of the pickup operation | movement in Example 1. FIG. It is the schematic of the structure of the pick-up head which has the flux application part of the 2nd Example which is the characteristics of this embodiment. It is the schematic which looked at the collet provided with the flux application part and adsorption hole in Example 2 from the lower side. It is a figure which shows the structure of the flux application part in Example 2. FIG. It is the schematic of the structure of the pick-up head which has the flux application part of 3 Examples which are the characteristics of this embodiment. It is the schematic of the structure of the pick-up head which has the flux application part of 4 Examples which are the characteristics of this embodiment. It is the schematic of the structure of the pick-up head which has the flux application part of 5 Examples which are the characteristics of this embodiment. It is a figure which shows the structure of the flip chip bonder in a prior art, and the operation | movement of a pick-up head and a bonding head.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic top view of a flip chip bonder 10 according to an embodiment of the present invention. FIG. 2 is a diagram for explaining the operation of the pickup head 21 and the bonding head 41 when viewed from the direction of arrow A in FIG.
The die bonder 10 broadly monitors the operations of the die supply unit 1, the pickup unit 2, the reversing mechanism unit 3, the bonding unit 4, the transport unit 5, the substrate supply unit 6K, and the substrate carry-out unit 6H. And a control unit 7 for controlling.

  First, the die supply unit 1 supplies a die D to be mounted on the workpiece W. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 indicated by a dotted line that pushes up the die D from the wafer 11. The die supply unit 1 is moved in the XY directions by a driving unit (not shown), and moves the die D to be picked up to the position of the push-up unit 13.

  The pickup unit 2 includes a collet unit 22 that attracts the die D from the die supply unit 1, a pickup head 21 that has the collet unit 22 at the tip and picks up the die, and a Y drive unit 23 that moves the pickup head 21 in the Y direction. Have. The pickup head 21 has driving units (not shown) that move the collet unit 22 up and down, rotate, and move in the X direction. Further, the collet portion 22 applies a flux to the bump Db (see FIG. 4) of the die D, which is a feature of the embodiment of the present invention, as will be described later. The flux prevents the bump Db from being oxidized and facilitates bonding with the solder on the workpiece W.

  With such a configuration, the pickup head 21 picks up the die, applies a flux to the bump Db, moves to the reversing mechanism unit 3, and is attracted to the reversing mechanism unit 3.

  As shown by a broken line in FIG. 2, the reversing mechanism unit 3 rotates the pickup head 21 by 180 degrees, reverses the pump of the die D, faces the lower surface, and puts the die D into the bonding head 41.

  As another method of the reversing mechanism unit, as shown in the drawing of FIG. 2, a reversing mechanism unit is provided on the pickup head 21 and moved together with the pickup head, or a stage unit that can rotate the front and back of the die is provided. There is a method of placing the die D once on the stage unit.

  The bonding unit 4 receives the inverted die D from the pickup head 21 and bonds it to the conveyed workpiece or the already bonded die. The bonding unit 4 includes a bonding head 41 including a collet unit 42 that sucks and holds the die D at the tip, the Y driving unit 43 that moves the bonding head 41 in the Y direction, and a workpiece W position recognition mark. A substrate recognition camera 44 that picks up an image (not shown) and recognizes the bonding position.

  With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the imaging data of the stage recognition camera 32, receives the inverted die D from the pickup head, and works based on the imaging data of the substrate recognition camera 44. Bond die D to W.

  The transport unit 5 includes a substrate transport pallet 51 on which one or a plurality of workpieces (four in FIG. 1) are placed, and a pallet rail 52 on which the substrate transport pallet 51 moves, and is provided in parallel. It has the 1st, 2nd conveyance part of the same structure. The substrate transfer pallet 51 is moved by driving a nut (not shown) provided on the substrate transfer pallet 51 with a ball screw (not shown) provided along the pallet rail 52.

  With this configuration, the substrate transport pallet 51 places the workpiece W on the substrate supply unit 6K, moves to the bonding position along the pallet rail 52, and moves to the post-bonding substrate unloading unit 6H. Give work W to 6H. The first and second transport units are driven independently from each other, and the other substrate transport pallet 51 unloads the workpiece W while bonding the die D to the workpiece W placed on one substrate transport pallet 51. Returning to the substrate supply unit 6K, preparations such as placing a new workpiece W are made.

  FIG. 3 is a schematic cross-sectional view showing the main part of the die supply unit 1. As shown in FIG. 3, the die supply unit 1 horizontally arranges an expanding ring 15 that holds the wafer ring 14 and a dicing tape 16 that is held by the wafer ring 14 and held by the wafer ring 14 to which a plurality of dies D are adhered. A support ring 17 for positioning and a push-up unit 13 for pushing the die D upward are provided. In order to pick up a predetermined die D, the push-up unit 13 is moved in the vertical direction by a drive mechanism (not shown), and the die supply unit 1 is moved in the horizontal direction.

  The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched, and the distance between the dies D is increased. In such a state, the die supply unit 1 improves the pickup property of the die D by pushing up the die D from below the die by the push-up unit 13.

  As the thickness is reduced, the adhesive is changed from a liquid to a film, and a film called a die attach film DAF is provided between the die D and the dicing tape 16. The die attach film DAF is attached with a film-like adhesive material and holds a plurality of dies D. In the wafer 11 having the die attach film DAF, dicing is performed on the wafer and the die attach film DAF.

  Hereinafter, the structure of the pickup head 21 provided with the flux application part 25 which is the characteristic of embodiment of this invention and the operation | movement of the pickup 21 are demonstrated.

By providing the pickup head 21 with the flux application unit 25, the flux application can be performed during a series of pickup operations such as an adsorption operation of the die D of the pickup head 21.
As a result, as shown in FIG. 2, the operation of immersing the bonding head 41 in the coating apparatus 8 is not required, the tact time can be improved, and a highly productive flip chip bonder and bonding method can be provided.

  Conventionally, the coating apparatus is changed for each die size, but this is not necessary.

Example 1
FIG. 4 is a diagram showing a control block for controlling the configuration of the pickup head 21 having the flux application unit 25 and the flux application of the pickup head 21, the adsorption operation of the die D, and the lifting and lowering operation, which are features of the present embodiment. is there. FIG. 5 is a schematic view of the collet 22D including the flux application unit 25 and the suction 22Da as viewed from below. FIG. 6 is a diagram showing the state of the collet 22 when the coating process has progressed.

As shown in FIG. 4, the pickup head 21 includes a collet 22 </ b> D that attracts the die D to the tip, and a collet holder 22 </ b> H that holds the collet.
The collet 22D has a plurality of suction holes 22Da for sucking the die D, a suction communication chamber 22Dr that communicates with the plurality of suction holes 22Da, and a flux coating provided in a surrounding area where the suction holes 22Da and the suction communication chamber 22Dr do not exist. Part 25.

  The flux application part 25 contains a coating material 25m in which a flux is mixed with a flexible gel material, for example, a very soft gel material mainly made of silicone. Moreover, the flux application part 25 has a plurality of application ports 25k on the suction surface of the die D as shown in FIG.

  In this embodiment, as shown in FIG. 4, the coating port 25k is provided on the entire surface, and is provided corresponding to the position of the bump Db as shown in FIG. However, the coating port 25k may be provided only at the position where the bump exists to prevent the coating material 25m from being wasted.

  The plurality of suction holes 22Da of the collet portion 22D are connected to the air suction / compression equipment 20 via the suction communication chamber 22Dr, the suction holes 22Ha, and the suction holes 21a of the pickup head 21.

  On the other hand, the collet holder 22H includes a compression communication chamber 22Hr that forms a compressed air space that presses the coating material 25m against the application port 25, a compression hole 22Hc that communicates with the compression communication chamber 22Hr, and an adsorption hole that communicates with the adsorption communication chamber 22Dr. 22 Ha.

By such a mechanism, the die D is sucked and held by sucking the suction hole 22Ha, and when compressed air flows into the compression communication chamber 22Hr, a flexible coating material 25m is discharged from the coating port to the bump Db. Applied. FIG. 6 shows the state of the collet 22 when the coating process has progressed, and the compression communication chamber 22Hr has expanded to the suction surface side of the die as the coating process has progressed.
The air suction / compression facility 20 controls these operations, and the control device 8 controls the air suction / compression facility 20.

  The air suction / compression facility 20 has a pump unit PO, a compressed air supply unit that supplies compressed air to the flux application unit 25 via a pressure sensor PS and an on-off valve 20cv, a flow rate sensor RS, and an on-off valve 20av. And an air suction part that evacuates the suction hole 22Ha of the collet part 22. The air suction / compression facility 20 is controlled by the control device 8 by monitoring the pressure sensor PS and the flow rate sensor RS.

  The control device 8 includes a control unit 8C that controls the pickup head 21 together with the air suction / compression equipment 20, a memory 8M that stores a control program and data necessary for the control, and a Z drive shaft 47 of the bo-pickup head 21. A driver 47D and a motor 47M are provided.

When the pickup head 21 controls the pickup of the die D, the control unit 8c detects the flow rate flowing through the suction hole 22Da of the collet unit 22 with the flow rate sensor RS, and when the flow rate becomes a predetermined flow rate or less, the collet 22D It is determined that D is adsorbed. Further, the control unit 8c changes the pressure of the compression communication chamber 22Hr of the flux application unit 25 in a pulsed manner when flux is applied by the pickup head 21, detects the maximum pressure on the pulse by the sensor RS, and the maximum pressure is predetermined. If it is determined that the flux is applied to the bump Db.
Furthermore, the control unit 8c drives the driver 47D based on the position information of the pickup head 21, the flow sensor RS, the pressure sensor PS, and the like, and controls the raising and lowering of the pickup head 21. The motor 47M may be a pulse motor or a servo motor.

Next, with reference to FIG. 7, a bonding process mainly performed during the pickup operation in the first embodiment will be described.
First, immediately before the pickup head 21 places the collet portion 22 on the die D, the control portion 8c controls the air suction / compression equipment 20 to apply the coating material 25m containing flux on the bump Db (S1). . Thereafter, the pickup head 21 completely sucks and holds the die D (S2). Next, the pickup head 21 separates the die D from the dicing film tape DCF and picks up (S3). Thereafter, the pickup head 21 moves to the position of the reversing mechanism 3 and reverses (S4). Next, the bonding head 41 receives from the pickup head 21 the die D that is inverted and the bump Db faces the lower surface (S5). The bonding head 41 moves to the position for bonding and bonds to the workpiece W (S6). A predetermined number of processes from S1 to S6 are performed (S7).
In the next step, unnecessary flux Fp may be washed, or undercoating may be performed to protect the die D.

  In the flow of FIG. 7, the flux is applied immediately before the pickup head 21, that is, the collet 22 is placed on the die D. This is for avoiding the adsorption holding force and the application of the flux because the forces in the opposite directions act on the die D.

  On the other hand, in the present embodiment, the flack application port 25k is aligned with the position of the bump Db. Accordingly, the pressure of the compressed air can be reduced, and in an extreme case, if the bump Db is in contact with the coating material 25m of the coating port 25k and the flux can be applied to the bump Db, the adsorption and the coating may be performed simultaneously. In this case, flux application can be performed before the die D is delivered to the bonding head 41.

  According to the bonding method described above, it is not necessary to provide a special time for applying the flux, the processing time can be shortened, and the throughput can be improved.

(Modification 1)
In Example 1, pressure was applied by compressed air, but in Modification 1, flux or a coating material containing flux is applied to the bumps Db without applying pressure by compressed air. In the first modification, the suction surface of the collet 22 is made of a soft material. For example, since the thickness (amount) of the coating material 25m applied to the bump Db is about 50 μm, if the coating material has a predetermined viscosity, the coating material oozes out without contact with the pressure, and comes into contact with it. It can be applied to the die D (bump Db).

  According to the first modification, the related configuration for supplying the compressed air, for example, the compression communication chamber 22Hr of the collet 22 and the compression hole 22Hc become unnecessary, and the configuration of the pickup head 21 and the air suction / compression facility 20 can be simplified.

(Example 2)
FIG. 8 is a schematic diagram of the configuration of the pickup head having the flux application part of the second example which is a feature of the present embodiment. FIG. 9 is a schematic view of the collet 22D including the flux application part 25 and the suction hole 22Da in the second embodiment as viewed from below. FIG. 10 is a diagram illustrating the configuration of the flux application unit 25 according to the second embodiment.

  In Example 1, the flux was applied to the bump Db by applying pressure to the coating material 25m obtained by immersing the flux in a very soft gel-like material made mainly of silicone. On the other hand, in Example 2, pressure is applied to a very soft gel material made mainly of silicone, and flux is applied to the bumps Db by deformation of the gel material. The material to which pressure is applied may be an elastic body having a predetermined deformation amount regardless of the gel material. Hereinafter, different points will be mainly described.

As shown in FIG. 8, the pickup head 21 includes a collet 22D that attracts the die D to the tip, and a collet holder 22H that holds the collet.
The collet 22D includes a plurality of flat rectangular flux coating portions 25 provided corresponding to the bumps Db arranged in a plurality of rows (two rows in FIG. 8) on the two sides of the die D; A plurality of adsorption holes 22Da for adsorbing the die D and an adsorption communication chamber 22Dr communicating with the plurality of adsorption holes 22Da are provided.

  On the other hand, the collet holder 22H is formed on the lower surface thereof and communicates with a compression communication chamber 22Hr communicating with a plurality of compression holes 25C of the flux application section 25 described later, a compression hole 22Hc communicating with the compression communication chamber 22Hr, and an adsorption communication chamber 22Dr. It has the adsorbing hole 22Ha which communicates.

  As shown in FIG. 10, the flux application unit 25 includes a storage unit 25T that contains and holds a flux, surrounds the storage unit, and applies pressure to the elastic body unit 25J made of, for example, a gel material, and the elastic body unit. It has a compression hole 25C through which compressed air for applying air is blown.

  The storage unit 25T has an application port 25k that is open on the die D side for applying the flux, and the upper side of the collet unit is closed. The diameter of the storage portion 25T is set to a diameter at which the flux does not fall from the die-side opening due to its viscosity. In order to increase the storage portion diameter and increase the amount of flux that can be stored, the storage portion 25T may be made of carbon nanotubes.

  The elastic body portion 25J is closed on both the upper and lower portions. The elastic body portion 25J does not necessarily need to surround the entire periphery of the storage portion 25T, and may be provided so that the storage portion 25T can be contracted. The compression hole 25C is opened because the die D side is closed and compressed air is introduced from the upper side of the collet portion 22D, and communicates with the elastic body portion 25J.

  When compressed air flows into the compressed hole 25C by such a mechanism, the storage portion 25T is pressed through the elastic body portion 25J, and the flux is discharged in the direction of the arrow and applied to the bump Db.

In this embodiment, the flux application part 25 is formed in a flat shape, but the elastic part 25J and the compression hole 25C may be formed concentrically with the storage part 25T as an axis.
Further, the elastic body portion 25J and the flux may be applied by compressed air in the compression communication chamber 22Hr on the side opposite to the lower application port side of the storage portion 25T without providing the compression hole 25C.

The air suction / compression facility 20 controls these operations, and the control device 8 controls the air suction / compression facility 20.
The compression hole 25C of the flux application unit 25 is connected to the air suction / compression equipment 20 via the compression communication chamber 22Hr of the collet holder 22H, the compression hole 22Hc, and the compression hole 21c of the pickup head 21.

  The bonding process mainly in the pickup operation in the second embodiment is the same as that in the first embodiment. In the second embodiment, similarly to the first embodiment, the coating port 25k of the storage unit 25T is aligned with the position of the bump Db. Therefore, as in the first embodiment, if a certain condition is satisfied, the position where the flux is applied is not limited to step S1 shown in FIG. 7, but from when the die D is sucked to when the die D is delivered to the bonding head 41. You may go.

Example 3
FIG. 11 is a schematic view of a third example of the flux application unit 25 which is a feature of the present embodiment.
The difference of the flux application part 25 of Example 2 from Example 2 is that the application side surface has a recess 25d that is higher than the suction surface by H. The other points are the same as those in the second embodiment.

  For example, when the height of the bump Db is 30 μm, the height of H is set to about 50 μm. With this structure, the bump Db completely enters the concave portion 25d, so that the flux is applied to the bump Db everywhere between the time just before landing on the die D and the time when the die D is passed to the bonding head 41. Can be applied.

Example 4
FIG. 12 is a schematic view of a fourth example of the flux application unit 25 which is a feature of the present embodiment.

  The difference of the flux application part 25 of Example 3 from Example 2 is the following point, and the other points are the same. Example 4 is the point which has the flux accommodating part 25s which is provided in the upper part of each flux application part 25, and has the communication hole which is not shown in figure which mutually connects. The flux storage portion 25s communicates with the opening on the opposite side of the application port 25k of the storage portion 25T of each flux application portion 25. Further, when the length of the elastic body portion 25j or the like is short and a sufficient coating amount cannot be obtained, this is dealt with by increasing the height of the collet 22D.

  According to the fourth embodiment, since a large amount of flux can be held, it is possible to work for a long time without replenishing the flux or exchanging the collet 22D.

(Example 5)
FIG. 13 is a schematic view of a fifth example of the flux application unit 25 which is a feature of the present embodiment.

  The difference of the flux application part 25 of Example 5 from Example 1, 2 is the following point. In Examples 1 and 2, the flux application part 25 was provided according to the bump Db. On the other hand, in Example 5, as shown in FIG. 13, the flux application part 25 is provided irrespective of the position of the bump Db.

  In other words, depending on how the flux is applied, one collet 22D can be applied to the die D having various pumps Db. Therefore, in Example 4, it is desirable to apply the flux before placing the collet 22D on the die D as shown in step S1 in FIG.

  According to the fifth embodiment, there is no need to change the basic configuration of the flux application unit 25 depending on the pattern of the bump Db.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Die supply unit 2: Pickup unit 21: Pickup head 22: Collet unit 22D: Collet 22H: Collet holder 25: Flux application unit 25C: Compression hole 25J: Elastic body unit 25T: Storage unit 25d: Concave portion of flux application unit 25m : Coating material 25s: Flux storage part 3: Reversing mechanism part 4: Bonding part 41: Bonding head 42: Collet part 7: Control part 10: Flip chip bonder 11: Wafer 13: Push-up unit D: Die Db: Bump W: Workpiece

Claims (12)

A flip chip bonder having a pick-up head for picking up a die having bumps and inverting the die, and a bonding head for receiving the die and bonding the bumps coated with a flux to a solder part of a workpiece,
The pickup head has a plurality of suction holes for sucking the die, and a flux application part for applying the flux to the suction surface of the die.
Flip chip bonder characterized by that. The flip chip bonder according to claim 1,
The flux application unit has a coating port for storing a coating material in which the flux is mixed in a gel-like substance in a region around the suction hole, and coating the coating material on the suction surface of the die.
Flip chip bonder characterized by that. The flip chip bonder according to claim 2,
The flux application unit includes a compression communication chamber that stores compressed air that applies pressure to the application material,
Air compression means for supplying the compressed air to the compression communication chamber and discharging the coating material from the coating port and coating the bumps;
Flip chip bonder characterized by that. The flip chip bonder according to claim 2,
The coating port is provided corresponding to the bump, and the flux is applied to the bump by bringing the coating material into contact with the bump.
Flip chip bonder characterized by that. The flip chip bonder according to claim 1,
The flux application part contains and holds a flux, and a storage part having an application port for applying the application material made of the flux to the adsorption surface of the die, an elastic body part for shrinking the storage part, and the elastic body part An air compression section that contracts with compressed air,
Air compression means for supplying the compressed air to the air compressing unit, discharging the coating material from the coating port, and coating the bumps;
Flip chip bonder characterized by that. The flip chip bonder according to claim 5,
The elastic body portion is made of a gel material,
Flip chip bonder characterized by that. The flip chip bonder according to claim 5 or 6,
The storage part is composed of carbon nanotubes,
Flip chip bonder characterized by that. The flip chip bonder according to any one of claims 5 to 7,
The flux application part is provided corresponding to the position of the bump,
Flip chip bonder characterized by that. A pick-up head picks up a die having bumps, reverses the die, and a bonding head receives the die and bonds the bumps coated with flux to a solder part of a workpiece,
The pickup head contains the flux to be applied to the bump, adsorbs the die, and applies the flux to the bump.
A bonding method characterized by the above. The bonding method according to claim 9, wherein
The application is performed immediately before adsorbing the die,
A bonding method characterized by the above. The bonding method according to claim 9, wherein
The application is performed simultaneously with the adsorption of the die.
A bonding method characterized by the above. The bonding method according to claim 9, wherein
The application is performed after adsorption of the die and before passing the die to a bonding head.
A bonding method characterized by the above.

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