JP6208935B2 - connector - Google Patents

Description

  The present invention relates to a connector that is used for electrically interconnecting the inside and outside of an airtight chamber defined by a partition wall and blocks an opening formed in the partition wall that penetrates the inside and the outside of the airtight chamber.

Conventionally, there is a need to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition wall. For example, in a semiconductor chip process in which an integrated circuit is mounted, a vacuum chamber capable of reducing the pressure to near vacuum is used, and the inside and outside of the vacuum chamber are electrically connected. In addition, the inside of an airtight chamber partitioned by a partition wall is filled with a gas having a low molecular weight such as He gas to reduce the pressure. In the electrical connection between the inside and outside of the hermetic chamber whose pressure is adjusted, the airtightness inside the chamber is maintained, and at the same time, reliable electrical connectivity between the inside and outside of the chamber is required.
As a conventional electrical connection structure of this type, for example, an electrical connection structure described in Patent Document 1 shown in FIG. 10 is known. FIG. 10 is a schematic diagram of an electrical connection structure for electrically interconnecting the inside and the outside of a hermetic chamber, which is partitioned by a partition wall and adjusted in pressure, according to a conventional example.

An electrical connection structure 101 shown in FIG. 10 electrically connects the inside A side and the outside B side of a chamber (not shown) that is partitioned by a partition wall (not shown) and whose internal pressure is adjusted. .
In the chamber using the electrical connection structure 101 shown in FIG. 10, the partition wall has an opening (not shown) penetrating the inside A side and the outside B side of the chamber. The opening is closed by the connector 110.

  Here, the base material of the connector 110 is provided with a plurality of via holes 112. Each via hole 112 is formed by filling a through hole penetrating between an inner surface and an outer surface of a base material with a conductor. The through hole is formed by conducting conductive plating on the inner peripheral surface of the through hole that passes between the inner surface and the outer surface of the substrate. In addition, a pair of conductive pads 113 a and 113 b interconnected by the conductors of the via holes 112 are provided on the inner surface and the outer surface of the connector 110.

A plurality of first connectors 120 </ b> A are disposed inside the connector 110, and a plurality of second connectors 120 </ b> B are disposed outside the connector 110.
Each first connector 120A is disposed so as to extend in a direction orthogonal to the connector 110, and is disposed along the longitudinal direction (vertical direction in FIG. 10) of the connector 110. Each of the second connectors 120B is disposed so as to extend in a direction orthogonal to the connector 110, and is disposed along the longitudinal direction of the connector 110 so as to face the first connector 120A.

  Here, each of the first connectors 120A is arranged so as to extend in a direction orthogonal to the connector 110, and the width direction of the second substrate 121 (direction orthogonal to the paper surface in FIG. 10). And a plurality of contacts 123 arranged at a predetermined pitch along the line. On the surface of the second substrate 121 (upper surface in FIG. 10), a plurality of conductive patterns 124 are provided at a predetermined pitch along the width direction of the second substrate 121. Each contact 123 is connected to one end side of each conductive pattern 124. A signal line 122 is connected to the other end side of each conductive pattern 124. Each second connector 120B has the same configuration as each first connector 120A.

  In the electrical connection structure 101 having such a configuration, the first connector 120 </ b> A is advanced in the direction of arrow F in FIG. 10, and the contact 123 is brought into contact with the conductive pad 113 a provided on the inner surface of the connector 110. On the other hand, the second connector 120B is advanced in the direction of the arrow F ′ in FIG. 10, and the contact 123 is brought into contact with the conductive pad 113 b provided on the outer surface of the connector 110. Accordingly, the signal lines 122 and 122 on the chamber inner side A and the outer side B are connected to the conductive pattern 124 on the chamber inner side A, the contact 123, the conductive pad 113a on the inner surface of the connector 110, the via hole 112, and the outer surface of the connector 110. The conductive pads 113b, the contacts 123, and the conductive pattern 124 on the chamber outside B side are electrically connected.

Moreover, although not illustrated, what was described in patent document 2 is known as an airtight terminal which ensured the airtightness between an electrode pin and a package, for example.
In the hermetic terminal described in Patent Document 2, conductive plating is formed on the inner peripheral surface of the through hole formed in the package. In addition, a lid that covers the opening of the through hole is formed on the electrode pin disposed in the through hole. And this lid | cover is joined to electroconductive plating so that an opening part may be plugged up. In addition, the gap between the electrode pin in the through hole where the electrode pin is disposed and the conductive plating is filled with solder and sealed.

JP 2004-349073 A Japanese Patent Laid-Open No. 11-40223

However, the electrical connection structure 101 described in Patent Document 1 and the airtight terminal described in Patent Document 2 shown in FIG. 10 have the following problems.
That is, in the case of the electrical connection structure 101 described in Patent Document 1 shown in FIG. 10, when the via hole 112 is formed in the base material of the connector 110, a step of filling the conductor into the through hole formed in the base material. Is required. This conductor filling step is an additional step to the normal step of forming a through hole in the base material, and also requires special equipment for filling the conductor, resulting in poor productivity. .

Further, in the case of the hermetic terminal described in Patent Document 2, a step of filling solder as an additional step into the through hole in which the conductive plating is formed on the inner peripheral surface is necessary.
Therefore, the present invention has been made to solve these problems, and its purpose is to achieve airtightness inside the chamber without filling a through hole formed in the base material with a conductor such as solder. It is another object of the present invention to provide a connector that can ensure reliable electrical connection between the inside and the outside of a chamber.

To achieve the above object, a connector according to an aspect of the present invention is used to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition, and is formed in the partition. A connector for closing an opening penetrating the inside and the outside of the housing, comprising a multilayer substrate for closing the opening, the multilayer substrate comprising a flat plate-like first base material and an inner surface side of the first base material A flat plate-like second base material that is disposed on the opening and closes the opening, and a flat plate-like third base material that is arranged on the outer surface side of the first base material, While having a first through hole formed by applying a first conductive plating extending between the inner surface and the outer surface on the inner peripheral surface of the through hole penetrating between the inner surface and the outer surface of the first substrate, Provided on the inner surface of the first base material, connected to the inner surface side of the first conductive plating. A conductive layer; and a second conductive layer provided on an outer surface of the first base material and connected to an outer surface side of the first conductive plating, wherein the second base material is the second base material. And having a second through hole formed by applying second conductive plating extending between the inner surface and the outer surface of the second base material on the inner peripheral surface of the through hole penetrating between the inner surface and the outer surface of the second base material A third conductive layer provided on the inner surface of the second base material and connected to the inner surface side of the second conductive plating, wherein the third base material includes an inner surface of the third base material and A third through hole formed by applying third conductive plating extending between the inner surface and the outer surface of the third base material on the inner peripheral surface of the through hole penetrating between the outer surface and the third surface; A fourth conductive layer provided on the outer surface of the base material and connected to the outer surface side of the third conductive plating; and an outer surface of the second base material The inner surface side of the first through hole is closed by the second base material so as to be in contact with the inner surface of the first base material, and the outer surface side of the first conductive layer and the second conductive plating Are connected so that the inner surface of the third base material is in contact with the outer surface of the first base material, the outer surface side of the first through hole is closed by the third base material, and the second A conductive layer is connected to the inner surface side of the third conductive plating, and the first base material, the second base material, and the third base material are made of glass-filled epoxy .
In this connector, it is preferable that the first through hole is filled with a resin.

  The connector according to the present invention includes a multilayer board that closes an opening that penetrates the inside and the outside of the hermetic chamber, and in this multilayer board, the outer surface of the second base is in contact with the inner surface of the first base. The inner surface side of the first through hole formed in the first substrate is closed by the second substrate, and the inner surface of the third substrate is in contact with the outer surface of the first substrate. Since the outer surface side of the first through hole is closed by the third base material, the inner surface side of the first through hole of the first substrate and the second base material and the third base material constituting the multilayer substrate The outer surface side can be closed, and the airtightness inside the chamber can be maintained.

  Moreover, the 1st base material was provided in the inner surface of the 1st base material, the 1st conductive layer connected to the inner surface side of the 1st conductive plating of the 1st through hole, and the outer surface of the 1st base material And a second conductive layer connected to the outer surface side of the first conductive plating, and a second base material provided on the inner surface of the second base material. Provided with a third conductive layer connected to the inner surface side of the conductive plating, the third base material connected to the outer surface side of the third conductive plating of the third through hole provided on the outer surface of the third base material Since the fourth conductive layer is provided, the first conductive layer is connected to the outer surface side of the second conductive plating, and the second conductive layer is connected to the inner surface side of the third conductive plating. From the inner surface side to the outer surface side, the third conductive layer, the second conductive plating, the first conductive layer, the first conductive plating, the second conductive layer, the third conductive plating, and the like. It is connected in order of the fourth conductive layer. For this reason, reliable electrical connectivity between the inside and outside of the chamber can be obtained.

  As a result, airtightness inside the chamber can be maintained without filling a through-hole formed in the base material with a conductor such as solder, and at the same time, reliable electrical connection between the inside and outside of the chamber is obtained. be able to. Therefore, a step of filling a conductor such as solder, which is an additional step to the normal step of forming a through hole in the base material, is not required, and the productivity of the connector can be improved.

It is a schematic diagram of the electrical connection structure using the connector which concerns on this invention. FIG. 2 is a cross-sectional view showing in detail the periphery of the connector in the electrical connection structure using the connector shown in FIG. 1. It is a top view of the connector shown in FIG. It is sectional drawing which follows the 4-4 line in FIG. It is a top view of the multilayer substrate used for the connector shown in FIG. It is sectional drawing which follows the 6-6 line in FIG. It is sectional drawing of the principal part of the 1st modification of a multilayer substrate. It is sectional drawing of the principal part of the 2nd modification of a multilayer substrate. It is sectional drawing of the principal part of the 3rd modification of a multilayer substrate. It is a schematic diagram of the electrical connection structure which electrically interconnects the inner side and the outer side of the airtight chamber in which the pressure was adjusted divided by the partition of a prior art example.

Embodiments of an electrical connection structure according to the present invention will be described below with reference to the drawings.
In the electrical connection structure shown in FIG. 1, the inside and outside of an airtight chamber C that is partitioned by a partition wall 90 and is kept airtight inside are electrically interconnected using a connector 1. The inside of the hermetic chamber C may be in a state close to a vacuum, or may be filled with a gas having a low molecular weight such as He gas to reduce the pressure to a state lower than the external pressure. Further, the inside of the airtight chamber C may be in a state of a pressure higher than the external pressure.

Here, as shown in FIG. 1, the partition wall 90 is formed with an opening 91 that penetrates the inside and the outside of the hermetic chamber C. In addition, the partition wall 90 is formed with a gas injection / discharge opening 92 for injecting gas into the airtight chamber C of the partition wall 90 (or exhausting gas from the airtight chamber C) . The partition wall 90 is made of metal.
Then, the opening 91 of the partition wall 90 is closed by the connector 1 as shown in FIGS. 1 and 2.

As shown in FIG. 2, the connector 1 includes a multilayer substrate (a four-layer substrate in this embodiment) 10 that closes the opening 91.
As shown in FIGS. 2 to 6, the multilayer substrate 10 includes a flat plate-like first base material 20 and a flat plate-like first base material 20 disposed on the inner surface 20 a side of the first base material 20 to block the opening 91. 2 base material 30 and the flat 3rd base material 40 arrange | positioned at the outer surface 20b side of the 1st base material 20 are provided.

  Here, as shown in FIG. 5, the first base material 20 is a substantially rectangular flat plate-like member extending in the width direction (left-right direction in FIG. 5) and the longitudinal direction (up-down direction in FIG. 5). The first base material 20 may be circular. As shown in FIGS. 2 to 6, the first base material 20 has an inner surface 20 a and an outer surface 20 b located on the inner side of the airtight chamber C. The inner surface 20a of the first base material 20 is formed with a notch 20c having a predetermined width that extends continuously and endlessly along the outer periphery of the first base material 20. The first base material 20 is made of glass-filled epoxy, for example.

  Further, as shown in FIG. 6, a plurality of first through holes 23 that electrically interconnect the inner surface 20 a and the outer surface 20 b of the first substrate 20 are formed in the first substrate 20. . The plurality of first through holes 23 are formed in two rows in the width direction of the first base material 20. Although not shown, the first through holes 23 in each row are formed at a predetermined pitch along the front-rear direction. And each 1st through hole 23 is the inner peripheral surface of the through-hole 21 which penetrates between the inner surface 20a and the outer surface 20b of the 1st base material 20, and the inner surface 20a and the outer surface of the 1st base material 20 An annular first conductive plating 22 extending between 20b is applied. The first conductive plating 22 is formed by, for example, tin plating or gold plating. Further, a resin 26 is filled in the central space of the annular first conductive plating 22. This space may be filled with a conductor instead of the resin 26, and the space 27 may not be filled with anything as shown in FIG. 7. A plurality of first conductive layers 24 connected to the inner surface 20 a side of the first conductive plating 22 are provided on the inner surface 20 a of the first base material 20. Each first conductive layer 24 is formed so as to include a portion surrounding the periphery of the first conductive plating 22 and a portion extending outward from the portion in the width direction. A plurality of second conductive layers 25 connected to the outer surface 20 b side of the first conductive plating 22 are provided on the outer surface 20 b of the first base material 20. Each second conductive layer 25 is also formed to include a portion surrounding the periphery of the first conductive plating 22 and a portion extending outward from the portion in the width direction.

  And the 2nd base material 30 is a substantially rectangular flat plate member extended in the width direction (left-right direction in FIG. 5) and a longitudinal direction (up-down direction in FIG. 5), as shown in FIG. The second base material 30 has the same width and length as the inner surface 20a of the cut first base material 20. And the 2nd base material 30 has the inner surface 30a and the outer surface 30b which are located in the inside of the airtight chamber C, as shown in FIG.2, FIG4 and FIG.6. The second substrate 30 is made of glass-containing epoxy, for example. As shown in FIGS. 5 and 6, the notch 20 c portion of the first base material 20, the outer peripheral end face portion of the second base material 30, and the outer peripheral portion of the inner surface 30 a of the second base material 30 are continuous. An endless soldering layer 11 is formed. The soldering layer 11 is formed by, for example, tin plating or gold plating.

  In addition, as shown in FIG. 6, the second base material 30 is formed with a plurality of second through holes 33 that electrically interconnect the inner surface 30 a and the outer surface 30 b of the second base material 30. . The plurality of second through holes 33 are formed in two rows at positions outside the first through holes 23 in the width direction of the second base material 30. The second through holes 33 in each row are formed at a predetermined pitch along the front-rear direction. And each 2nd through hole 33 is the inner peripheral surface of the through-hole 31 which penetrates between the inner surface 30a and the outer surface 30b of the 2nd base material 30, and the inner surface 30a and the outer surface of the 2nd base material 30 A second conductive plating 32 extending between 30b is applied. As shown in FIG. 6, the second conductive plating 32 is formed so as to completely fill the inside of the through hole 31. However, as shown in FIG. 7, the second conductive plating 32 may be formed in an annular shape extending between the inner surface 30a and the outer surface 30b, and a space 35 may be formed in the center. The second conductive plating 32 is formed by, for example, tin plating or gold plating. A plurality of third conductive layers 34 connected to the inner surface side of the second conductive plating 32 are provided on the inner surface 30 a of the second base material 30. As shown in FIGS. 5 and 6, each third conductive layer 34 is formed in a rectangular shape that covers the inner surface side end of the second conductive plating 32 and extends inward in the width direction.

  Furthermore, the 3rd base material 40 is a substantially rectangular flat plate-shaped member extended in the width direction (left-right direction in FIG. 5) and a longitudinal direction (up-down direction in FIG. 5). The third substrate 40 has the same width and length as the outer surface 20 b of the first substrate 20. And the 3rd base material 40 has the inner surface 40a and the outer surface 40b which are located in the inside of the airtight chamber C, as shown in FIG.2, FIG4 and FIG.6. The third base material 40 is made of glass-filled epoxy, for example.

Further, as shown in FIG. 6, a plurality of third through holes 43 that electrically connect the inner surface 40 a and the outer surface 40 b of the third substrate 40 are formed in the third substrate 40. . The plurality of third through holes 43 are formed in two rows at positions outside the first through holes 23 in the width direction of the third base material 40. The third through holes 43 in each row are formed at a predetermined pitch along the front-rear direction. And each 3rd through-hole 43 is the inner peripheral surface of the through-hole 41 which penetrates between the inner surface 40a and the outer surface 40b of the 3rd base material 40, and the inner surface 40a and the outer surface of the 3rd base material 40 A third conductive plating 42 extending between 40b is applied. As shown in FIG. 6, the third conductive plating 42 is formed so as to completely fill the inside of the through hole 41. However, as shown in FIG. 7, the third conductive plating 42 may be formed in an annular shape extending between the inner surface 40a and the outer surface 40b, and a space 45 may be formed in the center. The third conductive plating 42 is formed by, for example, tin plating or gold plating. A plurality of fourth conductive layers 44 connected to the outer surface side of the third conductive plating 42 are provided on the outer surface 40 b of the third base material 40. Each fourth conductive layer 44 is formed in a rectangular shape that covers the outer surface side end of the third conductive plating 42 and extends inward in the width direction.

Then, as shown in FIG. 6, the outer surface 30 b of the second base material 30 is disposed so as to contact the inner surface 20 a of the first base material 20, and is formed on the first base material 20 by the second base material 30. Further, the inner surface side of the first through hole 23 is closed. Further, the first conductive layer 24 and the outer surface side of the second conductive plating 32 are connected.
Further, the inner surface 40 a of the third base material 40 is disposed so as to be in contact with the outer surface 20 b of the first base material 20, and the first through hole 23 formed in the first base material 20 by the third base material 40. The outer surface side is blocked. Further, the second conductive layer 25 and the inner surface side of the third conductive plating 42 are connected.

In the multilayer substrate 10, in the layer direction of the second base material 30, the first base material 20, and the third base material 40 from the inner surface side to the outer surface side, a third conductive layer 34, a first conductive layer 24, Four conductive layers of the second conductive layer 25 and the fourth conductive layer 44 are arranged. For this reason, the multilayer substrate 10 constitutes a four-layer substrate.
Further, as shown in FIGS. 3 and 4, the connector 1 is disposed on the first connector 50 disposed on the inner surface 30 a side of the second substrate 30 and on the outer surface 40 b side of the third substrate 40. And a second connector 60.

Here, as shown in FIG. 4, the first connector 50 includes an insulating housing 51 and a plurality of electrical contacts 52 accommodated in the housing 51. The plurality of electrical contacts 52 are arranged in two rows in the width direction of the housing 51 as shown in FIG. 3 corresponding to the second through holes 33 and the third conductive layer 34 formed in the second base material 30. Has been. The electrical contacts 52 in each row are arranged at a predetermined pitch along the front-rear direction.
Each electrical contact 52 includes a connection portion 52a that is solder-connected to the third conductive layer 34 formed on the second base material 30, and an elastic contact portion 52b.

On the other hand, the second connector 60 includes an insulating housing 61 and a plurality of electrical contacts 62 accommodated in the housing 61 as shown in FIG. The plurality of electrical contacts 62 are arranged in two rows in the width direction of the housing 61 corresponding to the third through holes 43 and the fourth conductive layer 44 formed in the third base material 40. The electrical contacts 62 in each row are arranged at a predetermined pitch along the front-rear direction.
Each electrical contact 62 includes a connection portion 62a that is solder-connected to the fourth conductive layer 44 formed on the third base material 40, and an elastic contact portion 62b.

Next, when the inner side and the outer side of the hermetic chamber C are electrically interconnected using the connector 1, first, the first circuit board 70 is arranged in the hermetic chamber C as shown in FIG. . And as shown in FIG. 2, the inner surface 30a of the 2nd base material 30 which comprises the connector 1 is turned to the partition 90 side, and is turned to the opening part 91 side. Then, the soldering layer 11 is connected to the partition wall 90 by the solder S. Thereby, the connector 1 is fixed to the partition wall 90 and the opening 91 is closed by the connector 1. Further, the elastic contact portion 52 b in the electrical contact 52 of the first connector 50 contacts the first circuit board 70.
Then, as shown in FIG. 1, the second circuit board 80 is brought into contact with the elastic contact portion 62 c of the electrical contact 62 in the second connector 60. As a result, the first circuit board 70 and the second circuit board 80 are electrically interconnected via the connector 1.

Here, according to the connector 1 according to the present embodiment, the multilayer substrate 10 that closes the opening 91 that penetrates the inside and the outside of the airtight chamber C is provided. And in this multilayer substrate 10, the outer surface 30b of the 2nd base material 30 was arrange | positioned so that the inner surface 20a of the 1st base material 20 might be contacted, and it was formed in the 1st base material 20 by the 2nd base material 30 The inner surface side of the first through hole 23 is closed. Further, the inner surface 40 a of the third base material 40 is disposed so as to be in contact with the outer surface 20 b of the first base material 20, and the outer surface side of the first through hole 23 is blocked by the third base material 40. Therefore, the inner surface side and the outer surface side of the first through hole 23 of the first substrate 20 can be closed by the second base material 30 and the third base material 40 constituting the multilayer substrate 10, and the inside of the chamber C Airtightness can be maintained.

  In addition, the first base material 20 is connected to the inner surface side of the first conductive plating 22 of the first through hole 23, and the second conductive layer is connected to the outer surface side of the first conductive plating 22. And a conductive layer 25. The second base material 30 includes a third conductive layer 34 connected to the inner surface side of the second conductive plating 32 of the second through hole 33. Further, the third base material 40 includes a fourth conductive layer 44 connected to the outer surface side of the third conductive plating 42 of the third through hole 43. Then, the first conductive layer 24 and the outer surface side of the second conductive plating 32 were connected, and the second conductive layer 25 and the inner surface side of the third conductive plating 42 were connected. Therefore, in the multilayer substrate 10, from the inner surface side toward the outer surface side, the third conductive layer 34, the second conductive plating 32, the first conductive layer 24, the first conductive plating 22, the second conductive layer 25, the second The three conductive plating 42 and the fourth conductive layer 44 are connected in this order. For this reason, reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.

  As a result, the airtightness inside the chamber C is maintained without filling the inside of the through hole (first through hole 23) formed in the base material (first base material 20) with a conductor such as solder. , Reliable electrical connectivity between the inside and the outside of the chamber C can be obtained. Therefore, a step of filling a conductor such as solder, which is an additional step to the normal step of forming a through hole in the base material, is not necessary, and the productivity of the connector 1 can be improved.

Next, referring to FIG. 7, the multilayer substrate 10 of the first modification, the multilayer substrate 10 of the second modification with reference to FIG. 8, and the multilayer substrate 10 of the third modification with reference to FIG. explain. 7, 8 and 9, the same members as those in the multilayer substrate 10 shown in FIG. 6 are denoted by the same reference numerals, and the description thereof may be omitted.
First, the multilayer substrate 10 of the first modification shown in FIG. 7 is different from the multilayer substrate 10 shown in FIG. 6 in the space 27 in the center of the first conductive plating 22 of the annular first through hole 23 as described above. nothing is filled. Further, as described above, the second conductive plating 32 is formed in an annular shape extending between the inner surface 30a and the outer surface 30b of the second base material 30, and a space 35 is formed in the center. Further, the third conductive plating 42 is formed in an annular shape extending between the inner surface 40a and the outer surface 40b of the third substrate 40, and a space 35 is formed in the center.

Even in the multilayer substrate 10 of the first modified example, the chamber C can be formed without filling a conductor such as solder in the through hole (first through hole 23) formed in the base material (first base material 20). The internal airtightness of the can be maintained. At the same time, reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.
As shown in FIG. 6, when the space in the center of the annular first conductive plating 22 is filled with the resin 26 or the space is filled with a conductor, the airtightness inside the chamber C is maintained. The effect can be enhanced. Further, even if the second conductive plating 32 is formed so as to fill the entire inside of the through hole 31 as in the multilayer substrate 10 shown in FIG. 6, the effect of maintaining the hermeticity inside the chamber C can be enhanced. . Furthermore, similarly, even if the third conductive plating 42 is formed so as to completely fill the inside of the through hole 41, the airtightness maintaining effect inside the chamber C can be enhanced.

  Next, the multilayer substrate 10 of the second modified example shown in FIG. 8 differs from the multilayer substrate 10 shown in FIG. 6 in that the plurality of second through holes 33 and the first through holes 23 in the width direction of the second base material 30. They are formed at the same position. The plurality of third through holes 43 are also formed at the same position as the first through holes 23 in the width direction of the third base material 40. That is, the first through hole 23, the second through hole 33, and the third through hole 43 are linearly arranged from the inner side to the outer side of the multilayer substrate 10.

8 differs from the multilayer substrate 10 shown in FIG. 6 in that the first conductive layer 24 has an end on the inner surface side of the first conductive plating 22 formed in an annular shape. It is formed concentrically with the first conductive plating 22 so as to cover it. Moreover, the 2nd conductive layer 25 is formed concentrically with the 1st conductive plating 22 so that the outer surface edge part of the 1st conductive plating 22 formed in cyclic | annular form may be covered.

Even in the multilayer substrate 10 of the second modified example, the chamber C can be formed without filling a conductor such as solder in the through hole (first through hole 23) formed in the base material (first base material 20). The internal airtightness of the can be maintained. At the same time, reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.
8, the plurality of second through holes 33 and the plurality of third through holes 43 are formed at positions different from the first through holes 23 in the width direction of the second base material 30. In this way, the effect of maintaining the airtightness inside the chamber C can be enhanced.

  Furthermore, the multilayer substrate 10 of the third modified example shown in FIG. 9 has the same basic configuration as the multilayer substrate 10 shown in FIG. 8, but differs from the multilayer substrate 10 shown in FIG. It is formed in an annular shape extending between 30a and the outer surface 30b, and a space 35 is formed in the center. The third conductive plating 42 is formed in an annular shape extending between the inner surface 40a and the outer surface 40b, and a space 45 is formed in the center.

Even in the multilayer substrate 10 of the third modified example, the chamber C can be formed without filling a conductor such as solder in the through hole (first through hole 23) formed in the base material (first base material 20). The internal airtightness of the can be maintained. At the same time, reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.
As mentioned above, although embodiment of this invention was described, this invention is not limited to this, A various change and improvement can be performed.

For example, the first base material 20, the second base material 30, and the third base material 40 are each composed of a single layer, but may be composed of a plurality of layers.
Moreover, the multilayer substrate 10 may be composed of not only four layers but also four or more layers such as five layers and six layers.
Further, the connector 1 does not necessarily include the first connector 50 and the second connector 60.

DESCRIPTION OF SYMBOLS 1 Connector 10 Multilayer substrate 20 1st base material 20a Inner surface 20b Outer surface 21 Through-hole 22 1st electroconductive plating 23 1st through-hole 24 1st conductive layer 25 2nd conductive layer 30 2nd base material 30a Inner surface 30b Outer surface 31 Through hole 32 Second conductive plating 33 Second through hole 34 Third conductive layer 40 Third substrate 40a Inner surface 40b Outer surface 41 Through hole 42 Third conductive plating 43 Third through hole 44 Fourth conductive layer 90 Partition 91 Opening C Airtight chamber

Claims (2)

A connector used for electrically interconnecting the inside and outside of the hermetic chamber defined by the partition wall and closing the opening formed in the partition wall and penetrating the inside and the outside of the hermetic chamber,
A multilayer substrate that closes the opening;
The multilayer substrate includes a flat plate-like first base material, a flat plate-like second base material that is disposed on the inner surface side of the first base material and closes the opening, and an outer surface side of the first base material And a flat plate-like third base material disposed on
The first base material is formed by performing first conductive plating extending between the inner surface and the outer surface on an inner peripheral surface of a through hole penetrating between the inner surface and the outer surface of the first base material. A first conductive layer having a first through hole, provided on the inner surface of the first base material, connected to the inner surface side of the first conductive plating, and provided on the outer surface of the first base material And a second conductive layer connected to the outer surface side of the first conductive plating,
The second base material has a second conductivity extending between the inner surface and the outer surface of the second base material on an inner peripheral surface of a through-hole penetrating between the inner surface and the outer surface of the second base material. A third conductive layer having a second through hole formed by plating and connected to the inner surface side of the second conductive plating provided on the inner surface of the second substrate;
The third base material has third conductivity extending between an inner surface and an outer surface of the third base material on an inner peripheral surface of a through-hole penetrating between the inner surface and the outer surface of the third base material. A fourth conductive layer having a third through hole formed by plating and connected to the outer surface side of the third conductive plating provided on the outer surface of the third substrate;
The outer surface of the second substrate is disposed so as to be in contact with the inner surface of the first substrate, and the inner surface side of the first through hole is blocked by the second substrate, and the first conductive layer and the Connect the outer surface side of the second conductive plating,
The inner surface of the third substrate is disposed so as to be in contact with the outer surface of the first substrate, the outer surface side of the first through hole is blocked by the third substrate, and the second conductive layer and the Connect the inner surface side of the third conductive plating ,
The first base material, the second base material, and the third base material are made of glass-filled epoxy .   The connector according to claim 1, wherein the first through hole is filled with a resin.

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