JP6207192B2 - Adhesive sheet for semiconductor processing - Google Patents

Description

  In the present invention, when a workpiece such as a semiconductor wafer (hereinafter sometimes referred to as “work”) is subjected to temporary surface protection, polishing, dicing, or the like, the workpiece is stuck and held. The present invention relates to an adhesive sheet for semiconductor processing.

  Semiconductor wafers such as silicon and gallium arsenide are manufactured in a large diameter state. After the semiconductor wafer is cut and separated (diced) into element pieces (semiconductor chips), the semiconductor wafer is transferred to the next bonding process. At this time, after the semiconductor wafer is subjected to dicing, cleaning, drying, expanding and pick-up processes in a state of being adhered to an adhesive sheet composed of an adhesive layer and a base film in advance, the bonding process of the next process is performed. It is conveyed to.

In the dicing process and conveyance between processes, the adhesive sheet may be fixed to a metal jig. If the adhesive layer of the adhesive sheet does not have sufficient tack, an adhesive layer is provided between the adhesive sheet and the metal jig because the adhesive sheet may peel off from the metal jig during the process. A technique for fixing an adhesive sheet and a metal jig is known (see, for example, Patent Document 1 and Patent Document 2).
In Patent Document 1, as a pressure-sensitive adhesive layer between the adhesive sheet and the metal jig, a double-sided pressure-sensitive adhesive sheet in which the adhesive strength of the pressure-sensitive adhesive layer on the metal jig side and the pressure-sensitive adhesive layer on the adhesive sheet side is different, Prevents adhesive residue on metal jigs.
In Patent Document 2, a UV curable pressure-sensitive adhesive layer is used as the pressure-sensitive adhesive layer between the adhesive sheet and the metal jig, and the peeling force between the pressure-sensitive adhesive layer and the metal jig is determined based on By making it smaller than the peeling force between the material film and the adhesive layer, the adhesive residue on the metal jig is prevented.

JP 2008-66336 A JP 2005-203749 A

Such a pressure-sensitive adhesive sheet for semiconductor processing in which a pressure-sensitive adhesive layer intended for sticking to a metal jig is laminated is manufactured as follows.
That is, the second release sheet is peeled off from the pressure-sensitive adhesive layer formed between two release sheets (hereinafter referred to as the first release sheet and the second release sheet), and the first release sheet is removed. The pressure-sensitive adhesive layer is cut into a circle having substantially the same shape as the inner diameter of the metal jig, the cut circular pressure-sensitive adhesive layer is removed, and a pressure-sensitive adhesive layer having an opening is formed.
Next, the adhesive sheet having the adhesive layer prepared separately is bonded to the adhesive layer having the opening on the adhesive layer surface, and the adhesive sheet and the adhesive layer are die-cut to approximately the same diameter as the outer diameter of the ring frame. Then, by removing the excess portion, the adhesive sheet intended for semiconductor processing is formed on the first release sheet. This manufacturing process is carried out continuously in a role to role. At this time, the steps of bending, peeling and transferring are repeated for the pressure-sensitive adhesive layer.

As a result of intensive studies by the present inventors, when the double-sided pressure-sensitive adhesive sheet in Patent Document 1 is used to produce a semiconductor processing pressure-sensitive adhesive sheet by the above process, the double-sided pressure-sensitive adhesive sheet having an opening is peeled off when transferred to the adhesive sheet Air may be caught between the sheet and the adhesive sheet, and the adhesive layer may be deformed. When the adhesive layer is deformed, the adhesiveness to the workpiece may be lowered, and the adhesion to the chip may be lowered. As a result, the reliability of the semiconductor device may be inferior.
Moreover, when the adhesive sheet for semiconductor processing is manufactured by the said process using the adhesive layer of patent document 2, when removing a circular adhesive layer, an adhesive layer fractures | ruptures or extends | stretches, Production efficiency may be reduced.

  The present invention seeks to solve the problems associated with the prior art as described above. That is, the present invention can be efficiently manufactured by a roll to roll, and the semiconductor processing pressure-sensitive adhesive prevents air from being caught between the release sheet and the semiconductor processing pressure-sensitive adhesive sheet during the manufacturing process. The purpose is to provide a seat.

The gist of the present invention for solving the above problems is as follows.
[1] A pressure-sensitive adhesive sheet for semiconductor processing having an adhesive resin layer and a film-like pressure-sensitive adhesive on one side of a support sheet,
A film-like pressure-sensitive adhesive is formed on the outer periphery of the adhesive resin layer,
According to JIS Z0237; 2009, the adhesive force of the film adhesive to the silicon wafer (mirror surface) is 0.1 N / 25 mm or more,
According to JIS Z1528; 2009, the holding power by the creep test of the film adhesive is 70000 seconds or more,
A pressure-sensitive adhesive sheet for semiconductor processing, wherein the film-like pressure-sensitive adhesive comprises a pressure-sensitive adhesive composition containing a thermoplastic elastomer.

[2] The adhesive sheet for semiconductor processing according to [1], wherein the film-like adhesive has a thickness of 5 to 100 μm.

[3] The adhesive sheet for semiconductor processing according to [1] or [2], wherein the Young's modulus of the film adhesive is 0.1 to 20 MPa.

[4] The adhesive sheet for semiconductor processing according to any one of [1] to [3], wherein the breaking energy of the film adhesive is 0.2 J or more.

[5] The thermoplastic elastomer is a block copolymer composed of a soft segment obtained by polymerizing at least one selected from isoprene, ethylene or butadiene, and a hard segment obtained by polymerizing styrene. -The adhesive sheet for semiconductor processing in any one of [4].

[6] The pressure-sensitive adhesive sheet for semiconductor processing according to [5], wherein the ratio of the hard segment in the block copolymer is 28% by mass or less.

[7] The soft segment in the block copolymer is obtained by polymerizing butadiene,
The adhesive sheet for semiconductor processing according to [5] or [6], wherein a part or all of the soft segment is hydrogenated.

[8] The adhesive sheet for semiconductor processing according to any one of [1] to [7], wherein the film-like pressure-sensitive adhesive contains at least one selected from rosin, terpene, dye, pigment or filler.

[9] The adhesive sheet for semiconductor processing according to any one of [1] to [8], wherein the thermoplastic elastomer is soluble in a toluene solution.

[10] The adhesive sheet for semiconductor processing according to any one of [1] to [9], wherein the minimum value of the total light transmittance based on JIS K7361-1; 1997 is 80% or less.

  In the present invention, as a pressure-sensitive adhesive layer used for sticking to a metal jig, a film-like pressure-sensitive adhesive having predetermined physical properties is used, so that the film-like pressure-sensitive adhesive is broken or stretched during the manufacturing process, and air is bitten. Can be prevented. As a result, the manufacturing efficiency of the pressure-sensitive adhesive sheet for semiconductor processing is excellent, and the semiconductor device manufactured using the pressure-sensitive adhesive sheet has high reliability.

It is a figure which shows the state which temporarily fixed the adhesive sheet for semiconductor processing which concerns on the 1st structure of this invention, and the metal jig | tool. It is a figure which shows the state which temporarily fixed the adhesive sheet for semiconductor processing and metal jigs which concern on the 2nd structure of this invention.

Hereinafter, the present invention will be described more specifically, including its best mode.
As shown in FIG. 1 or FIG. 2, the pressure-sensitive adhesive sheet 100 for semiconductor processing according to the present invention can have a first or second configuration, and an adhesive resin layer 2 and a film are formed on at least one side of the support sheet 1. It has an adhesive 10. The adhesive resin layer 2 and the film-like pressure-sensitive adhesive 10 may be a single layer or a plurality of layers.

(Film adhesive)
As shown in FIG. 1 or FIG. 2, the film-like pressure-sensitive adhesive 10 in the present invention is formed on the outer peripheral portion of the adhesive resin layer 2 to temporarily fix the adhesive resin layer 2 and the metal jig 5. Used. In the present invention, “temporary fixing” means that the adhesive resin layer 2 is held on the metal jig 5 via the film-like pressure-sensitive adhesive 10 and each process for manufacturing a semiconductor device (for example, a dicing process, It is not peeled off during the pick-up process or conveyance between each process, but it can be easily peeled before and after the process.

The film adhesive has an adhesive strength to a silicon wafer (mirror surface) based on JIS Z0237; 2009 of 0.1 N / 25 mm or more, preferably 0.5 to 6 N / 25 mm, more preferably 1 to 5 N / 25 mm.
When the above adhesive strength is less than 0.1 N / 25 mm, the adhesiveness between the film adhesive and the metal jig (for example, a ring frame) becomes insufficient, and the metal jig is produced during the manufacturing process of the semiconductor device. And the film-like pressure-sensitive adhesive peel at the interface, and the process cannot be performed smoothly.
If the adhesive strength exceeds 6 N / 25 mm, the adhesion between the film adhesive and the metal jig is sufficient, but when the film adhesive is peeled from the metal jig, the metal adhesive The adhesive residue (residue of the adhesive composition which comprises a film adhesive) may generate | occur | produce on a jig | tool. If the residue is mixed into the semiconductor device, the reliability of the semiconductor device may be reduced, and the residue may contaminate a device such as a transfer arm used for transfer during the manufacturing process of the semiconductor device.

The film-like pressure-sensitive adhesive has a holding force by a creep test based on JIS Z1528; 2009 of 70000 seconds or more. The upper limit is not particularly limited.
When the holding force by the above creep test is less than 70000 seconds, the film adhesive is deformed during storage in a state where the film adhesive and the metal jig are temporarily fixed and placed vertically, and at a predetermined position. Misalignment occurs between the temporarily fixed adhesive sheet for semiconductor processing and the metal jig, which may cause problems in the subsequent manufacturing process of the semiconductor device, or the semiconductor processing adhesive sheet may be detached from the metal jig. is there.

Moreover, the Young's modulus of the film-like pressure-sensitive adhesive is preferably 0.1 to 20 MPa, more preferably 1 to 10 MPa, and particularly preferably 2 to 6 MPa.
By setting the Young's modulus of the film-like pressure-sensitive adhesive within the above range, cohesive failure of the film-like pressure-sensitive adhesive during the manufacturing process of the semiconductor processing pressure-sensitive adhesive sheet can be prevented. As a result, contamination of the processing machine used in the manufacturing process of the adhesive sheet for semiconductor processing is prevented, and the processability of the film adhesive is improved.

The breaking energy of the film-like pressure-sensitive adhesive is preferably 0.2 J or more, more preferably 1 to 8 J, and particularly preferably 2 to 6 J.
By setting the breaking energy of the film-like pressure-sensitive adhesive within the above range, cohesive failure of the film-like pressure-sensitive adhesive during the manufacturing process of the semiconductor processing pressure-sensitive adhesive sheet can be prevented. As a result, contamination of the processing machine used in the manufacturing process of the adhesive sheet for semiconductor processing is prevented, and the processability of the film adhesive is improved.

  The film-like pressure-sensitive adhesive in the present invention comprises a pressure-sensitive adhesive composition containing a thermoplastic elastomer. In particular, it is preferably made of a rubber elastomer. By forming a film-like pressure-sensitive adhesive using a pressure-sensitive adhesive composition containing a thermoplastic elastomer, the physical properties of the film-like pressure-sensitive adhesive can be easily adjusted. In the present invention, the acrylic copolymer is not included in the thermoplastic elastomer.

  The thermoplastic elastomer in the present invention is preferably soluble in an organic solvent, and particularly preferably soluble in a toluene solution. In the present invention, “soluble” means that no particles having a maximum particle size exceeding 1 μm are present in the solution at room temperature (temperature range of 18 to 28 ° C.). “Maximum particle diameter” refers to the particle diameter of the largest particle among the plurality of existing particles.

The thermoplastic elastomer constituting the film-like pressure-sensitive adhesive is not particularly limited, but is a block composed of a soft segment obtained by polymerizing at least one selected from isoprene, ethylene or butadiene, and a hard segment obtained by polymerizing styrene. A copolymer is preferred.
Moreover, the ratio of the hard segment in the said block copolymer becomes like this. Preferably it is 28 mass% or less, More preferably, it is 5-25 mass%, Most preferably, it is 10-22 mass%.
By using the block copolymer, the physical properties of the film-like pressure-sensitive adhesive can be easily adjusted.

  Moreover, it is preferable that the soft segment in the block copolymer is obtained by polymerizing butadiene, and part or all of the soft segment is hydrogenated. By adding hydrogen, the amount of energy beam-reactive carbon-carbon double bonds can be reduced. Therefore, even when the semiconductor device manufacturing process includes an energy beam irradiation (for example, ultraviolet irradiation) step. The change in composition can be suppressed, and the adhesive film can be prevented from sticking to the metal jig and the occurrence of adhesive residue on the metal jig.

  The weight average molecular weight (Mw) of such a block copolymer is preferably 10,000 to 500,000, more preferably 50,000 to 300,000.

  The thickness of the film-like pressure-sensitive adhesive composed of the pressure-sensitive adhesive composition as described above is preferably 5 to 100 μm, more preferably 20 to 80 μm, and particularly preferably 30 to 60 μm. By adjusting the thickness of the film adhesive to the above range, it becomes easy to adjust the adhesive force of the film adhesive to a predetermined range. Moreover, in the manufacturing process of the adhesive sheet for semiconductor processing mentioned later, the effect that the biting of the bubble between a peeling sheet and the adhesive sheet for semiconductor processing can be suppressed increases.

  Moreover, it is preferable that the adhesive composition which comprises a film adhesive contains at least 1 chosen from a rosin, a terpene, dye, a pigment, or a filler. When the film-like pressure-sensitive adhesive contains at least one selected from rosin, terpene, dye, pigment or filler, the physical properties of the film-like pressure-sensitive adhesive can be easily adjusted.

(Adhesive resin layer)
The adhesive resin layer in the present invention is appropriately selected from resins having various functions such as a pressure-sensitive adhesive layer, a film-like pressure-sensitive adhesive layer, an adhesive layer, and a protective film-forming layer, which will be described later, depending on the use of the sheet. Selected.

Adhesive layer When the adhesive sheet for semiconductor processing of the present invention is used as a surface protective sheet such as a back grind sheet or a dicing sheet, the adhesive resin layer 2 may be composed of an adhesive layer having pressure-sensitive adhesiveness. preferable.

  Such a pressure-sensitive adhesive layer having pressure-sensitive adhesiveness can be formed of various conventionally known pressure-sensitive adhesives. The pressure-sensitive adhesive is not limited at all. For example, a rubber-based, acrylic-based, silicone-based, polyvinyl ether, or other pressure-sensitive adhesive is used. Among these, an acrylic pressure-sensitive adhesive that can easily control the adhesive force is particularly preferable.

  The acrylic pressure-sensitive adhesive mainly comprises a (meth) acrylic acid ester copolymer. Examples of (meth) acrylic acid ester copolymers include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, -2-ethylhexyl acrylate, decyl acrylate, dodecyl acrylate, lauryl acrylate, and myristyl acrylate. (Meth) acrylic acid alkyl esters consisting of alkyl groups having no functional groups such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, benzyl acrylate, cyclohexyl acrylate, isobornyl acrylate, etc. One or more monomers of, and, if necessary, acrylic acid-2-hydroxyethyl, acrylic acid-2-hydroxypropyl, acrylic acid-3-hydroxypropyl, acrylic acid-3-hydroxybutyl, acrylic acid- 4-hydroxybu Hydroxyl, such as 2-hydroxyethyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 3-hydroxybutyl methacrylate, 4-hydroxybutyl methacrylate, etc. (Meth) acrylic acid alkyl ester; carboxyl group-containing compound such as acrylic acid, methacrylic acid, maleic acid and fumaric acid; vinyl ester such as vinyl acetate and vinyl propionate; cyano group-containing compound such as acrylonitrile and methacrylonitrile; Examples thereof include amide group-containing compounds such as acrylamide; copolymers of one or more monomers selected from polymerizable monomers such as aromatic compounds such as styrene and vinylpyridine. In addition, although it is not a narrowly-defined copolymer when the polymerizable monomer is one kind, it is generically called a copolymer including such a case. Moreover, (meth) acryl is used in the meaning containing both acryl and methacryl.

  10-98 mass% is preferable, and, as for the content rate of the unit derived from the (meth) acrylic acid alkyl ester which consists of an alkyl group which does not have a functional group in a (meth) acrylic-acid alkylester copolymer, 20-95 mass% is 20-95 mass%. More preferred is 50 to 93% by mass. The weight average molecular weight of the (meth) acrylic acid ester copolymer is preferably 100,000 to 2,500,000, more preferably 200,000 to 1,500,000, and particularly preferably 300,000 to 1,000,000. In the present specification, the weight average molecular weight is a value in terms of standard polystyrene measured by gel permeation chromatography.

  These pressure-sensitive adhesives can be used alone or in combination of two or more. Of these pressure-sensitive adhesives, acrylic pressure-sensitive adhesives are preferably used. In particular, an acrylic resin obtained by crosslinking a (meth) acrylic acid ester copolymer with one or more of a crosslinking agent such as a polyisocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, or a chelating crosslinking agent. An adhesive is preferred.

  Epoxy crosslinking agents include 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, N, N, N ′, N '-Tetraglycidylaminophenyl methane, triglycidyl isocyanate, m-N, N-diglycidylaminophenyl glycidyl ether, N, N-diglycidyl toluidine, N, N-diglycidyl aniline, pentaerythritol polyglycidyl ether, 1, Examples include 6-hexanediol diglycidyl ether.

  Polyisocyanate-based crosslinking agents include tolylene diisocyanate (TDI), hexamethylene diisocyanate (HMDI), isophorone diisocyanate (IPDI), xylylene diisocyanate (XDI), hydrogenated tolylene diisocyanate, diphenylmethane Examples thereof include diisocyanates and hydrogenated products thereof, polymethylene polyphenyl polyisocyanates, naphthylene-1,5-diisocyanates, polyisocyanate prepolymers, and polymethylolpropane-modified TDI.

  A crosslinking agent may be used individually by 1 type, and may be used in combination of 2 or more type. As for the usage-amount of a crosslinking agent, 0.01-20 mass parts is preferable with respect to 100 mass parts of (meth) acrylic acid ester copolymers.

  Furthermore, the pressure-sensitive adhesive layer may be a pressure-sensitive adhesive whose adhesive force can be controlled by energy ray curing, heat foaming, water swelling, or the like. When the pressure-sensitive adhesive layer has energy-ray curable properties (energy-ray-curable pressure-sensitive adhesive layer), it is easier to peel off wafers and chips by irradiating the pressure-sensitive adhesive layer with energy rays and reducing the adhesive strength. Become. The energy ray-curable pressure-sensitive adhesive layer can be formed of various energy ray-curable pressure-sensitive adhesives that are cured by irradiation with energy rays such as conventionally known gamma rays, electron beams, ultraviolet rays, and visible light. It is preferable to use a mold adhesive.

  Examples of the energy ray curable pressure sensitive adhesive include a pressure sensitive adhesive obtained by mixing a polyfunctional energy ray curable resin with an acrylic pressure sensitive adhesive. Examples of the polyfunctional energy ray curable resin include low molecular weight compounds having a plurality of energy ray polymerizable functional groups, urethane acrylate oligomers, and the like. Moreover, the adhesive containing the (meth) acrylic acid ester copolymer which has an energy-beam polymerizable functional group in a side chain can also be used. Such an energy ray polymerizable functional group is preferably a (meth) acryloyl group.

  The glass transition temperature (Tg) of the pressure-sensitive adhesive layer is preferably −50 to 30 ° C., and preferably −25 to 30 ° C. Here, the Tg of the pressure-sensitive adhesive layer is the temperature at which the loss tangent (tan δ) shows the maximum value in the region of −50 to 50 ° C. in the dynamic viscoelasticity measurement at a frequency of 11 Hz of the sample on which the pressure-sensitive adhesive layer is laminated. Point to. In addition, when an adhesive layer is an energy ray hardening-type adhesive, the glass transition temperature before hardening an adhesive layer by energy ray irradiation is pointed out. When the pressure-sensitive adhesive layer is composed of the above-mentioned acrylic pressure-sensitive adhesive, the glass transition temperature of the pressure-sensitive adhesive layer regulates the type and polymerization ratio of the monomers constituting the above-mentioned acrylic pressure-sensitive adhesive, and is added in some cases. It can be controlled by estimating the influence of the ultraviolet curable compound and the crosslinking agent.

Film adhesive In the pressure-sensitive adhesive sheet for semiconductor processing of the present invention, the adhesive resin layer 2 may be a film adhesive. Such film adhesives are frequently used in the die bonding process of chips in recent years. Such a film adhesive is preferably an epoxy adhesive or polyimide adhesive formed into a film and semi-cured (B-stage state) on the support sheet of the pressure-sensitive adhesive sheet for semiconductor processing of the present invention. It is formed to be peelable.

  The film adhesive is attached to a semiconductor wafer or a semiconductor chip. By dicing the semiconductor wafer or chip and the film adhesive into a chip size, a chip with an adhesive is obtained, which is picked up from a support sheet (for example, a base material or an adhesive sheet) to be described later, Then, the chip is fixed at a predetermined position. It is preferable to perform expansion when picking up the chip with adhesive.

Further, the pressure-sensitive adhesive layer for semiconductor processing of the present invention may be a dicing / die-bonding sheet having both a wafer fixing function during dicing and a die bonding function during die bonding.

  When the adhesive sheet for semiconductor processing is a sheet for both dicing and die bonding, the adhesive resin layer holds the semiconductor wafer and chips in the dicing process, and is cut with the wafer during dicing, and has the same shape as the cut chips A resin layer is formed. When the chip is picked up after the dicing is completed, the adhesive resin layer is peeled off from the support sheet together with the chip. The adhesive resin layer functions as an adhesive for fixing the chip during die bonding. A chip with an adhesive resin layer is placed on the substrate, heated, etc., and the chip and an adherend such as a substrate or another chip are bonded via the adhesive resin layer.

  When the pressure-sensitive adhesive sheet for semiconductor processing of the present invention is such a sheet for both dicing and die bonding, it has pressure-sensitive adhesiveness as an adhesive resin layer on the support sheet, and also has a die bonding function. An adhesive layer is formed. Such an adhesive resin layer having both a wafer fixing function and a die bonding function includes, for example, the above-mentioned acrylic pressure-sensitive adhesive and an epoxy adhesive, and, if necessary, an energy ray curable compound and a curing aid. including. In order to facilitate the transfer of the adhesive resin layer to the chip, the support sheet in the dicing / die-bonding sheet may be subjected to a peeling treatment. In addition, when picking up a chip with an adhesive layer, it is preferable to perform expansion in the same manner as described above.

Protective film forming layer Further, when the semiconductor processing adhesive sheets of the present invention is used as a protective film forming sheet for forming a protective film on the back surface of the chip, the adhesive resin layer, protective film on the back surface of the chip It may be a protective film forming layer for forming.
In this case, a semiconductor wafer is attached to the protective film forming layer, the protective film forming layer is cured to form a protective film, and then the semiconductor wafer and the protective film are diced to obtain a chip with a protective film. Also, a semiconductor wafer is attached to the protective film forming layer, the semiconductor wafer and the protective film forming layer are diced to obtain a chip with a protective film forming layer, and then the protective film forming layer is cured to obtain a chip with a protective film. May be.
Such a protective film forming sheet has an adhesive resin layer (protective film forming layer) serving as a protective film as an adhesive resin layer on the support sheet. Such an adhesive resin layer serving as a protective film contains the above-mentioned acrylic pressure-sensitive adhesive, an epoxy adhesive and a curing aid, and may contain a filler or the like as necessary.

  The thickness of the adhesive resin layer in the pressure-sensitive adhesive sheet for semiconductor processing of the present invention varies depending on its use, but is about 1 to 300 μm, preferably 10 to 200 μm, and particularly preferably about 20 to 100 μm.

  The adhesive resin layer may be formed by directly coating on one side of the support sheet, or after forming the adhesive resin layer on the release sheet, it may be transferred onto the support sheet.

  As a method for forming the adhesive resin layer, a known method may be selected and is not particularly limited. As such a method, the adhesive resin layer forming material such as a pressure-sensitive adhesive is used as it is without a solvent, or diluted or emulsified with a solvent, and applied with a gravure coater, Mayer bar coater, air knife coater, roll coater, etc. Alternatively, it may be formed on the substrate by heating or electron beam curing, wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like.

(Support sheet)
It does not specifically limit as a support sheet, A peeling sheet and an adhesive sheet can be used.

  Examples of release sheets include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film. , Ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film Etc. are used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.

  The surface tension of the surface in contact with the adhesive resin layer of the release sheet is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .

  As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used. In particular, alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.

  In order to release the surface of a film or the like as a substrate of a release sheet using the above release agent, the release agent can be used without any solvent, or can be diluted or emulsified in a solvent to obtain a gravure coater, Mayer bar coater, air knife coater. The release sheet coated with a release coater may be applied at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.

  Further, the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is in a preferable range as the surface in contact with the adhesive resin layer of the release sheet described above is set so that the surface is in contact with the adhesive resin layer. It is good also as a peeling sheet by manufacturing the laminated body laminated | stacked with this film.

When performing required processing such as dicing on an adherend such as a semiconductor wafer on an adhesive sheet for semiconductor processing, it is preferable to use an adhesive sheet in which an adhesive layer 12 is formed on a substrate 11 as the support sheet 1. (See FIG. 2).
In this embodiment, the adhesive resin layer is laminated on the pressure-sensitive adhesive layer 12. Examples of the base material 11 of the pressure-sensitive adhesive sheet include the above-described film exemplified as a release sheet. The pressure-sensitive adhesive layer may be a weak-adhesive layer having an adhesive strength sufficient to peel off the adhesive resin layer, an energy-ray curable one whose adhesive strength is reduced by energy beam irradiation, or heated foaming. Sexual ones may be used. The pressure-sensitive adhesive force between the pressure-sensitive adhesive layer and the adhesive resin layer is preferably smaller than the pressure-sensitive adhesive force between the pressure-sensitive adhesive layer and the substrate.

The pressure-sensitive adhesive layer 12 includes various conventionally known pressure-sensitive adhesives (for example, general-purpose pressure-sensitive adhesives such as rubber-based, acrylic-based, silicone-based, urethane-based, vinyl ether-based, etc., pressure-sensitive adhesives, and energy ray-curable pressure-sensitive adhesives. , Thermal expansion component-containing pressure-sensitive adhesive, etc.).
When the configuration of the semiconductor processing adhesive sheet is such a configuration, the adhesion between the support sheet and the adhesive resin layer when the semiconductor processing adhesive sheet functions as a dicing sheet for supporting the adherend in the dicing process. The effect of suppressing the peeling of the chip with the adhesive resin layer from the support sheet in the dicing process is obtained. When the pressure-sensitive adhesive sheet for semiconductor processing functions as a dicing sheet for supporting the adherend in the dicing process, there is no need for dicing by dicing the dicing sheet separately on the wafer with the adhesive resin layer in the dicing process. The manufacturing process of the device can be simplified.

(Semiconductor processing adhesive sheet)
The pressure-sensitive adhesive sheet for semiconductor processing has an adhesive resin layer and a film-like adhesive on one side of a support sheet, and is obtained by forming a film-like pressure-sensitive adhesive on the outer peripheral portion of the adhesive resin layer. The shape of the pressure-sensitive adhesive sheet for semiconductor processing is not limited to a single sheet, but may be a long strip, or may be rolled up.

  The minimum value of the total light transmittance of the pressure-sensitive adhesive sheet for semiconductor processing according to JIS K7631-1; 1997 is preferably 80% or less, more preferably 0 to 75%, particularly preferably 1 to 70%, particularly Preferably it is 10 to 65%. By setting the value of the portion where the total light transmittance in the adhesive sheet for semiconductor processing is minimized within the above range, the detectability of the adhesive sheet by the apparatus used in each step for manufacturing a semiconductor device is improved. In addition, the total light transmittance in this invention is a measured value in the part by which the support sheet 1, the adhesive resin layer 2, and the film adhesive 10 in FIG.1 and FIG.2 were laminated | stacked. The total light transmittance of the pressure-sensitive adhesive sheet for semiconductor processing can be adjusted by coloring the support sheet 1, the adhesive resin layer 2 or the film-like pressure-sensitive adhesive 10 with a dye or a pigment. In particular, the film-like pressure-sensitive adhesive 10 is preferably colored by containing a dye or a pigment.

  The adhesive resin layer 2 of the semiconductor processing pressure-sensitive adhesive sheet 100 can have the same shape as the support sheet 1 as shown in FIGS. 1 and 2, and the film-like pressure-sensitive adhesive 10 is the outer periphery of the adhesive resin layer 2. And is temporarily fixed to the metal jig 5 in the manufacturing process of the semiconductor device.

  The thickness of the support sheet is usually 10 to 500 μm, preferably 15 to 300 μm, and particularly preferably 20 to 250 μm. When using the adhesive sheet which formed the adhesive layer on the base material as a support sheet, 3-50 micrometers in the support sheet is the thickness of an adhesive layer.

  A cover film may be temporarily attached to the surface of the adhesive resin layer. The same cover film as the above-described release sheet can be used.

  The film thickness of the cover film is usually about 5 to 300 μm, preferably about 10 to 200 μm, and particularly preferably about 20 to 150 μm.

Moreover, although the manufacturing method of the adhesive sheet for semiconductor processing is not specifically limited, it demonstrates concretely, giving the structure of FIG. 1 as an example.
First, a pressure-sensitive adhesive composition for forming a film-like pressure-sensitive adhesive is prepared. The pressure-sensitive adhesive composition is obtained by mixing each of the above components in an appropriate ratio in an appropriate solvent, and the pressure-sensitive adhesive composition is applied onto a release sheet and dried to form a pressure-sensitive adhesive layer. Then, another release sheet is bonded to the pressure-sensitive adhesive layer, and the state is held between two release sheets (release sheet / pressure-sensitive adhesive layer / release sheet).

The release sheet plays a role of protecting the pressure-sensitive adhesive layer and providing support. If the release sheet laminated on both sides of the pressure-sensitive adhesive layer is configured to have a difference in peel force as in the light release type and the heavy release type, the adhesive resin layer 2 and the film formed on the support sheet 1 The workability at the time of bonding the adhesive 10 is improved.
As the release sheet, a light release type release sheet and a heavy release type release sheet are used to sandwich the adhesive layer, the light release type release sheet is peeled off, and the light release type release sheet is attached. Using a punching die, the pressure-sensitive adhesive layer is cut into a circle, the pressure-sensitive adhesive layer cut into a circle is removed to form an opening, and a film-like pressure-sensitive adhesive is obtained on a heavy release type release sheet.

  Next, the adhesive resin layer 2 is formed on the support sheet 1. The method for forming the adhesive resin layer 2 on the support sheet 1 is not particularly limited, and may be formed by applying and drying a composition constituting the adhesive resin layer 2 on the support sheet 1, You may form by providing the adhesive resin layer 2 on a peeling sheet, and transferring this to a support sheet.

  And the film-like adhesive obtained above and the adhesive resin layer 2 are laminated | stacked, and it is set as a laminated body.

Thereafter, the entire laminate is die-cut concentrically with the opening in accordance with the outer diameter of the margin for the metal jig 5 such as a ring frame, and the periphery of the die-cut laminate is removed. Finally, the pressure-sensitive adhesive sheet for semiconductor processing of the present invention can be obtained by peeling the heavy release type release sheet and exposing the film-like pressure-sensitive adhesive. In addition, if a film adhesive is affixed on the metal jig | tool 5, it can be set as the state temporarily fixed to the metal jig | tool 5 shown in FIG.
The film-like pressure-sensitive adhesive 10 obtained by the above production method is an annular pressure-sensitive adhesive layer, and the inner diameter of the annular pressure-sensitive adhesive layer (the diameter of the opening) is substantially the same as the inner diameter of the metal jig 5. The width of the annular pressure-sensitive adhesive layer is preferably 1 to 50 mm.
The pressure-sensitive adhesive sheet for semiconductor processing of the present invention obtained by such a manufacturing process has a film-like pressure-sensitive adhesive having predetermined physical properties, and in the step of laminating the film-like pressure-sensitive adhesive and the adhesive resin layer, a release sheet And air (bubbles) can be suppressed from being caught between the semiconductor processing pressure-sensitive adhesive sheet and the semiconductor processing pressure-sensitive adhesive sheet. Therefore, deformation of the adhesive resin layer due to bubbles can be prevented, and as a result, a smooth adhesive resin layer can be obtained. According to such a pressure-sensitive adhesive sheet for semiconductor processing of the present invention, since it can be adhered and stuck to a workpiece such as a semiconductor wafer, the reliability of a semiconductor device manufactured using the pressure-sensitive adhesive sheet is excellent.

  As described above, the composition and configuration of the film-like pressure-sensitive adhesive, the typical composition and use of the adhesive resin layer, and the configuration of the pressure-sensitive adhesive sheet for semiconductor processing have been outlined, but the adhesive resin layer in the pressure-sensitive adhesive sheet for semiconductor processing of the present invention is the above The application is not particularly limited.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. The measurement and evaluation methods employed in the present invention are as follows.

<Adhesion measurement>
In accordance with JIS Z 0237; 2009, using a universal tensile testing machine (Autograph manufactured by Shimadzu Corporation), affixed to a silicon wafer (mirror surface) as an adherend, and measured at a temperature of 23 ° C. after 30 minutes. The adhesive force of the film-like pressure-sensitive adhesive by a 180 ° peeling method at a humidity of 50% was measured. The tensile speed was 300 mm / min, and the size of the film adhesive was 250 mm × 25 mm. Moreover, about Examples 1-8 and Comparative Examples 2-5, it lined and measured PET25 (A) PL thin 11BL by Lintec Corporation to a film-like adhesive.

<Steel residue on metal ring frame>
The film-like pressure-sensitive adhesive is laminated with the adhesive resin layer in the embodiment shown in FIG. 1, and an Rinch2700 (full auto mode) manufactured by Lintec Corporation is used to attach an 8-inch silicon wafer (thickness 100 μm) to the adhesive resin layer. A state where the semiconductor processing pressure-sensitive adhesive sheet and the metal ring frame were temporarily fixed was prepared with the shaped pressure-sensitive adhesive.
Thereafter, the metal ring frame and the film-like pressure-sensitive adhesive were peeled off, and the presence or absence of adhesive residue on the surface of the metal ring frame was confirmed visually.
Note that LE5000 manufactured by Lintec Corporation was used as an adhesive sheet having an adhesive resin layer formed on a support sheet.

<Peeling of film adhesive>
The film-like pressure-sensitive adhesive is laminated with the adhesive resin layer in the embodiment shown in FIG. 1, and an Rinch2700 (full auto mode) manufactured by Lintec Corporation is used to attach an 8-inch silicon wafer (thickness 100 μm) to the adhesive resin layer. A state where the semiconductor processing pressure-sensitive adhesive sheet and the metal ring frame were temporarily fixed was prepared with the shaped pressure-sensitive adhesive. Note that LE5000 manufactured by Lintec Corporation was used as an adhesive sheet having an adhesive resin layer formed on a support sheet.
Then, it conveyed and confirmed the presence or absence of peeling in the interface of a film adhesive and a metal ring frame visually. Moreover, the presence or absence of peeling was confirmed at the interface between the film-like pressure-sensitive adhesive and the adhesive resin layer. If the film-like adhesive is not peeled off at both interfaces, it indicates that it is temporarily fixed to the metal ring frame in the manufacturing process of the semiconductor device.

<Creep test>
In accordance with JIS Z1528: 2009, a film-like adhesive cut into a width of 25 mm × 100 mm is applied to an adherend (SUS304) so that the application area is 25 mm × 25 mm, and then a holding sample is tested. The holding power of the film-like adhesive was measured by applying a load (9.8 N) with a 1 kg weight in a 40 ° C. environment. Moreover, about Examples 1-8 and Comparative Examples 2-5, it lined and measured PET25 (A) PL thin 11BL by Lintec Corporation to a film-like adhesive. The test time was 70000 seconds, and “70000 seconds or more” in Table 1 indicates that there was no displacement of the applied surface even at 70000 seconds.

<Young's modulus>
A film-like pressure-sensitive adhesive cut into a width of 15 mm and a length of 100 mm was pulled at a speed of 200 mm / min using a universal tensile tester (Autograph AG-IS manufactured by Shimadzu Corporation) in a 23 ° C. environment. The Young's modulus (MPa) was determined from the strain curve.

<Breaking energy>
A film-like pressure-sensitive adhesive cut into a width of 15 mm and a length of 100 mm was pulled at a speed of 200 mm / min using a universal tensile tester (Autograph AG-IS manufactured by Shimadzu Corporation) in a 23 ° C. environment. The breaking energy (J) was determined from the area under the strain curve.

<Total light transmittance>
From the support sheet side of the adhesive sheet for semiconductor processing, the total light transmittance measurement in the visible light region (based on JIS K7361-1: 1997) is performed using NDH-5000 manufactured by Nippon Denshoku, and the measured value of the smallest part Asked.

<Pre-cut aptitude>
(1) Processability The processability of the film-like pressure-sensitive adhesive was determined by observing whether or not the film-like pressure-sensitive adhesive was broken or stretched in the manufacturing process of the semiconductor processing pressure-sensitive adhesive sheet.
Specifically, the following manufacturing process was performed.
First, a pressure-sensitive adhesive composition for forming a film-like pressure-sensitive adhesive is applied on a release sheet (SP-PET382120 manufactured by Lintec Corporation) and dried (100 ° C., 1 minute) to form a pressure-sensitive adhesive layer. Another release sheet (SP-PET 381031 manufactured by Lintec Corporation) was bonded to the pressure-sensitive adhesive layer to obtain a pressure-sensitive adhesive layer sandwiched between two release sheets.
Thereafter, one release sheet is peeled, and then the exposed pressure-sensitive adhesive layer is cut into a circle (diameter 330 mm), the circular pressure-sensitive adhesive layer is removed to form an opening, and a film-like pressure-sensitive adhesive is obtained on the release sheet. It was.
When removing the circular pressure-sensitive adhesive layer, when 100 film-like pressure-sensitive adhesives were processed, the case where the film-like pressure-sensitive adhesive was not broken or stretched was evaluated as “A” as being excellent in precut accuracy (workability). . Moreover, the case where the number of the ruptured or extended film-like adhesives is 1-30 was evaluated as "B", and the case where the number of the ruptured or extended film-like adhesives was 30-100 was evaluated as "C".

(2) The film-like pressure-sensitive adhesive obtained by the visibility processability evaluation is laminated on the adhesive resin layer of an adhesive sheet (LE5000 manufactured by Lintec Corporation) in which an adhesive resin layer is formed on a support sheet, and a ring frame In accordance with the paste margin, a circular shape (diameter 370 mm) concentrically with the opening was punched to obtain a laminate of a release sheet and an adhesive sheet for semiconductor processing.
Visibility was evaluated on whether or not the obtained laminate could recognize the part having the film-like adhesive and the removed part (opening). The evaluation of visibility is “A” when 100 laminates can be processed without any problem by the processing apparatus, “B” when 1-2 cannot be recognized, and 3 or more cannot be recognized. The case was evaluated as “C”.

(3) Air biting In the air biting test, the laminate after die-cutting was observed, and the presence or absence of bubbles between the release sheet and the adhesive sheet for semiconductor processing was evaluated. Count the number of bubbles and evaluate as “A” when the bubbles are not visible, as “B” when 1-50 bubbles are visible, and as “C” when 51 or more bubbles are visible did.

Example 1
Preparation of pressure-sensitive adhesive composition for film-like pressure-sensitive adhesive Styrene / butadiene-based thermoplastic elastomer (Taftec H1052, manufactured by Asahi Kasei Co., Ltd., 20% by mass of styrene) with respect to 99 parts by mass of pigment (Toyo Ink Multilac A903B (carbon) Black)) A pressure-sensitive adhesive composition consisting of 1 part by mass was prepared.

Production of film-like pressure-sensitive adhesive The above pressure-sensitive adhesive composition was applied onto a silicone-treated release sheet A (SP-PET3811 (S) manufactured by Lintec Corporation) and dried (100 ° C. for 1 minute in an oven). In this way, an adhesive layer having a thickness of 50 μm was produced.
Next, another release sheet B (SP-PET3811 (S) manufactured by Lintec Corporation) is bonded to the above-mentioned pressure-sensitive adhesive layer, and a laminated sheet (release sheet A / pressure-sensitive adhesive layer / release) sandwiched between two release sheets. Sheet B) was obtained.
The release sheet B was removed from the obtained laminated sheet, and then the punching process was performed on the pressure-sensitive adhesive layer into a circle having a diameter of 330 mm. The punching process was performed so that the pressure-sensitive adhesive layer was completely cut and the release sheet A was not cut completely.
Thereafter, the pressure-sensitive adhesive layer cut into a circular shape was removed, an opening was formed, and a film-like pressure-sensitive adhesive was produced on the release sheet A. At this time, precut suitability (workability) was evaluated. Moreover, about the film adhesive, the adhesive force measurement, the Young's modulus, and the measurement of breaking energy were performed.

Preparation of pressure-sensitive adhesive sheet for semiconductor processing A dicing die-bonding sheet (Adwill LE5000 manufactured by Lintec Corporation) was prepared as an adhesive sheet having an adhesive resin layer formed on a support sheet.
The film-like pressure-sensitive adhesive and the adhesive resin layer were pasted at room temperature.
Next, it is punched into a circular shape having a diameter of 370 mm concentrically with the opening of the film-like pressure-sensitive adhesive, and a pressure-sensitive adhesive sheet for semiconductor processing to which a release sheet A is attached is prepared. Evaluation was performed.
Thereafter, the release sheet A was peeled off to prepare an adhesive sheet for semiconductor processing, and the adhesive residue of the metal ring frame, peeling of the film-like adhesive, creep test and total light transmittance were evaluated. Each evaluation result is shown in Table 1.

(Example 2)
In the preparation of the pressure-sensitive adhesive composition for film-like pressure-sensitive adhesive, a styrene / butadiene-based thermoplastic elastomer (Asaprene T412 manufactured by Asahi Kasei Co., Ltd., 20% by mass of styrene) was used instead of the hydrogenated styrene / butadiene-based thermoplastic elastomer. Except for the above, a semiconductor processing pressure-sensitive adhesive sheet was produced in the same manner as in Example 1. Each evaluation result is shown in Table 1.

(Example 3)
In adjusting the pressure-sensitive adhesive composition for a film-like pressure-sensitive adhesive, a hydrogenated styrene / butadiene-based thermoplastic elastomer (Taftec H1221, manufactured by Asahi Kasei Co., Ltd., 12% by mass of styrene) is used instead of the hydrogenated styrene / butadiene-based thermoplastic elastomer. A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that it was. Each evaluation result is shown in Table 1.

Example 4
In the preparation of the pressure-sensitive adhesive composition for a film-like pressure-sensitive adhesive, a hydrogenated styrene / butadiene-based thermoplastic elastomer [(Taftec H1041, manufactured by Asahi Kasei Co., Ltd., 30% by mass of styrene) instead of a hydrogenated styrene / butadiene-based thermoplastic elastomer A pressure-sensitive adhesive sheet for semiconductor processing was prepared in the same manner as in Example 1 except that (Mixed with Asahi Kasei Corporation Tuftec H1052, styrene ratio 20 mass%) (mixing ratio 1: 1)] was used. Each evaluation result is shown in Table 1.

(Example 5)
In adjusting the pressure-sensitive adhesive composition for a film-like pressure-sensitive adhesive, pigment (Toyo Ink Co., Ltd. Multirack A903B) is used with respect to 80 parts by mass of a hydrogenated styrene / butadiene-based thermoplastic elastomer (Asahi Kasei Co., Ltd. Tuftec H1052, styrene ratio 20% by mass). (Carbon black)) A semiconductor processing pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that a pressure-sensitive adhesive composition consisting of 20 parts by mass was prepared. Each evaluation result is shown in Table 1.

(Example 6)
In the production of the film-like pressure-sensitive adhesive, a semiconductor processing pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the thickness was 30 μm. Each evaluation result is shown in Table 1.

(Example 7)
In adjusting the pressure-sensitive adhesive composition for film-like pressure-sensitive adhesive, except that a pressure-sensitive adhesive composition consisting of 100 parts by mass of a hydrogenated styrene / butadiene-based thermoplastic elastomer (Asahi Kasei Corporation Tuftec H1052, styrene ratio 20% by mass) was adjusted. In the same manner as in Example 1, an adhesive sheet for semiconductor processing was produced. Each evaluation result is shown in Table 1.

(Example 8)
In the production of the film-like pressure-sensitive adhesive, a semiconductor processing pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the thickness was 10 μm. Each evaluation result is shown in Table 1.

(Comparative Example 1)
A double-sided PSA sheet was prepared using the following PSA composition for film-like PSA. A double-sided pressure-sensitive adhesive sheet was used instead of the film-like pressure-sensitive adhesive to produce a semiconductor processing pressure-sensitive adhesive sheet. Each evaluation result is shown in Table 1.

Adjustment of film-like pressure-sensitive adhesive composition α An aromatic polyisocyanate with respect to 100 parts by mass of an acrylic copolymer (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., Coponil N-3327) based on butyl acrylate (Coronate L manufactured by Nippon Polyurethane Industry Co., Ltd.) 2 parts by mass and 50 parts by mass of toluene were added to prepare an adhesive composition α.

Adjustment of film-like pressure-sensitive adhesive composition β An aromatic polyisocyanate (Soken Chemical Co., Ltd.) with respect to 100 parts by mass of an acrylic copolymer (manufactured by Soken Chemical Co., Ltd., SK Dyne 1811L) containing butyl acrylate as a main component Company-made TD-75) 5 parts by mass and toluene 30 parts by mass were added to prepare an adhesive composition β.

Preparation of double-sided pressure-sensitive adhesive sheet The pressure-sensitive adhesive composition α was applied onto a silicone-treated release sheet A (manufactured by Lintec Corporation, SP-PET3811 (S)) and dried (100 ° C. for 1 minute in an oven). In this way, an adhesive layer α having a thickness of 10 μm was produced. In addition, the pressure-sensitive adhesive composition β was applied onto a silicone-treated release sheet B (SP-PET3811 (S) manufactured by Lintec Corporation), dried (100 ° C. for 1 minute in an oven), and a pressure-sensitive adhesive having a thickness of 10 μm. The agent layer β was produced.

Next, an adhesive layer α was laminated as an adhesive layer for fixing the ring frame on one side of an ethylene-methacrylic acid copolymer film (thickness 80 μm, manufactured by Riken Vinyl Industry Co., Ltd., EN09-80T-M8) as a core film. Next, a pressure-sensitive adhesive layer β is laminated on the other side as a pressure-sensitive adhesive layer for lamination, and a double-sided pressure-sensitive adhesive sheet (release sheet A / pressure-sensitive adhesive layer α / core film / pressure-sensitive adhesive layer β) sandwiched between two release sheets. / Release sheet B) was obtained. The obtained double-sided pressure-sensitive adhesive sheet was punched into a circle having a diameter of 330 mm. The punching process was performed so that the release sheet B to the adhesive layer α were completely cut and the release sheet A was not cut completely.
Thereafter, the adhesive layer α was removed from the release sheet B cut into a circular shape, an opening was formed, and a double-sided adhesive sheet sandwiched between two release sheets was produced.

Preparation of pressure-sensitive adhesive sheet for semiconductor processing A dicing die-bonding sheet (Adwill LE5000 manufactured by Lintec Corporation) was prepared as an adhesive sheet having an adhesive resin layer formed on a support sheet.
About the double-sided pressure-sensitive adhesive sheet sandwiched between two release sheets, the release sheet B was peeled off to expose the pressure-sensitive adhesive layer β, and the pressure-sensitive adhesive layer β and the adhesive resin layer were stuck at room temperature.
Next, a punching process was performed in a circular shape with a diameter of 370 mm concentrically with the opening of the double-sided PSA sheet, and a PSA sheet for semiconductor processing to which the release sheet A was attached was produced.
Thereafter, the release sheet A was peeled off to produce an adhesive sheet for semiconductor processing.

(Comparative Example 2)
Using the following adhesive composition for film adhesives, a film adhesive was prepared, and an adhesive sheet for semiconductor processing was prepared. Each evaluation result is shown in Table 1.

A mixed solution of n-butyl acrylate 128 g, 2-ethylhexyl acrylate 307 g, methyl methacrylate 67 g, methacrylic acid 1.5 g, and benzoyl peroxide as a polymerization initiator in 400 g of toluene as an adjustment solvent for the pressure-sensitive adhesive composition for a film-like pressure-sensitive adhesive. The solution of the compound (1) having a functional group was obtained by appropriately adjusting the dropping amount and adjusting the reaction temperature and reaction time.
Next, 2.5 g of 2-hydroxyethyl methacrylate synthesized separately from methacrylic acid and ethylene glycol as a compound (2) having a radiation curable carbon-carbon double bond and a functional group was added to this polymer solution, and hydroquinone as a polymerization inhibitor. Was added dropwise and reacted to obtain a solution of the compound (A) having a radiation curable carbon-carbon double bond. Subsequently, 100 parts by mass of the compound (A) in the compound (A) solution is added as a polyisocyanate (B) by Nippon Polyurethane Co., Ltd .: 1 part by mass of Coronate L, and as a photoinitiator by Nippon Ciba-Geigy Corporation: A radiation-curable pressure-sensitive adhesive composition was prepared by adding and mixing 0.5 parts by mass of Irgacure 184 and 150 parts by mass of ethyl acetate as a solvent to the compound (A) solution.

Production of a film-like adhesive A PET separator film having a thickness of 38 μm was prepared as a release sheet. The above pressure-sensitive adhesive composition was applied with a gravure coater so as to form an opening having a diameter of 330 mm in the center of the release sheet, and dried in a hot air drying furnace to prepare a film-like pressure-sensitive adhesive having a thickness of 10 μm after drying. .

Preparation of pressure-sensitive adhesive sheet for semiconductor processing Next, a copolymer of methyl acrylate and glycidyl methacrylate (solid content 35% by mass): 100 parts by mass (solid content), bisphenol glycidyl type epoxy resin (number average) Molecular weight = 500): 600 parts by mass, photopolymerizable epoxy acrylate oligomer (compound having two double bonds): 100 parts by mass, and photopolymerization initiator (2,2-dimethoxy-2-phenylacetophenone): 5 The adhesive (1) obtained by mixing parts by mass is applied to a polyolefin-based substrate film having a thickness of 100 μm that has not been surface-modified, heat-dried, and an adhesive having a thickness of 25 μm. A layer was formed to obtain tape (a).
The adhesive layer of this adhesive layer tape (a) and the film-like adhesive are bonded together, and are punched into a 370 mm diameter concentric with the opening of the film-like adhesive, and a release sheet A pressure-sensitive adhesive sheet for semiconductor processing was attached.
Thereafter, the release sheet was peeled off to prepare an adhesive sheet for semiconductor processing.

(Comparative Example 3)
In the adjustment of the pressure-sensitive adhesive composition for film-like pressure-sensitive adhesive, the film-like pressure-sensitive adhesive composition α prepared in Comparative Example 1 was used in place of the hydrogenated styrene / butadiene-based thermoplastic elastomer, and a film-like pressure-sensitive adhesive having a thickness of 100 μm was used. A semiconductor processing adhesive sheet was prepared in the same manner as in Example 1 except that the agent was prepared. Each evaluation result is shown in Table 1.

(Comparative Example 4)
In adjusting the pressure-sensitive adhesive composition for a film-like pressure-sensitive adhesive, a hydrogenated styrene / butadiene-based thermoplastic elastomer (Taftec H1041 manufactured by Asahi Kasei Co., Ltd., 30% by mass of styrene) is used instead of a hydrogenated styrene / butadiene-based thermoplastic elastomer. A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that it was. Each evaluation result is shown in Table 1.

(Comparative Example 5)
In adjusting the pressure-sensitive adhesive composition for a film-like pressure-sensitive adhesive, a hydrogenated styrene / butadiene-based thermoplastic elastomer (Taftec H1051, manufactured by Asahi Kasei Co., Ltd., 48% by mass of styrene) is used instead of a hydrogenated styrene / butadiene-based thermoplastic elastomer. A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that it was. Each evaluation result is shown in Table 1.

1: Support sheet 2: Adhesive resin layer 5: Metal jig 10: Film adhesive 11: Base material 12: Adhesive layer 100: Adhesive sheet for semiconductor processing

Claims (10)

On one side of the support sheet is an adhesive sheet for semiconductor processing in which an adhesive resin layer and a film-like adhesive are laminated in this order,
A film-like pressure-sensitive adhesive is formed on the outer peripheral portion of the adhesive resin layer, and has an opening,
According to JIS Z0237; 2009, the adhesive force of the film adhesive to the silicon wafer (mirror surface) is 0.1 N / 25 mm or more,
According to JIS Z1528; 2009, the holding power by the creep test of the film adhesive is 70000 seconds or more,
Film-like adhesive, Ri Do from the pressure-sensitive adhesive composition comprising a thermoplastic elastomer except acrylic copolymer,
A pressure-sensitive adhesive sheet for semiconductor processing , which is used by attaching a semiconductor wafer or a semiconductor chip to an adhesive resin layer .   The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1, wherein the film-like pressure-sensitive adhesive has a thickness of 5 to 100 μm.   The adhesive sheet for semiconductor processing according to claim 1 or 2, wherein the film-like adhesive has a Young's modulus of 0.1 to 20 MPa.   The adhesive sheet for semiconductor processing according to any one of claims 1 to 3, wherein the breaking energy of the film-like adhesive is 0.2 J or more.   The thermoplastic elastomer is a block copolymer composed of a soft segment obtained by polymerizing at least one selected from isoprene, ethylene or butadiene, and a hard segment obtained by polymerizing styrene. The adhesive sheet for semiconductor processing in any one.   The pressure-sensitive adhesive sheet for semiconductor processing according to claim 5, wherein the ratio of the hard segment in the block copolymer is 28% by mass or less. The soft segment in the block copolymer is formed by polymerizing butadiene,
The pressure-sensitive adhesive sheet for semiconductor processing according to claim 5 or 6, wherein a part or all of the soft segment is hydrogenated.   The pressure-sensitive adhesive sheet for semiconductor processing according to any one of claims 1 to 7, wherein the film-like pressure-sensitive adhesive contains at least one selected from rosin, terpene, dye, pigment or filler.   The adhesive sheet for semiconductor processing according to any one of claims 1 to 8, wherein the thermoplastic elastomer is soluble in a toluene solution. The adhesive sheet for semiconductor processing according to any one of claims 1 to 9, wherein the minimum value of the total light transmittance based on JIS K7361-1; 1997 is 80% or less.

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