JP6204235B2 - プロセス強化マイクロ流体装置 - Google Patents
プロセス強化マイクロ流体装置 Download PDFInfo
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- B01F33/81—Combinations of similar mixers, e.g. with rotary stirring devices in two or more receptacles
- B01F33/811—Combinations of similar mixers, e.g. with rotary stirring devices in two or more receptacles in two or more consecutive, i.e. successive, mixing receptacles or being consecutively arranged
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- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
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- B01J2219/00819—Materials of construction
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
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- B01J2219/00851—Additional features
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- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
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- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
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- B01J2219/00781—Aspects relating to microreactors
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- B01L2400/00—Moving or stopping fluids
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Description
図4は、データ点が△で表された図3に示された本発明の実施の形態を、データ点が●で表された図2の装置と比較した、毎分のミリリットルで表された流量の関数としての平方メートルおよびケルビン毎のワットで表された、測定された全体の熱伝達係数のグラフである。図3に示された構造により生じた二次流動により、テストした全ての流量で約50から100W/m2Kの熱伝達の優位性が生じるのがこのグラフから分かる。テストした装置の両方とも、寸法と容量がほぼ同じであり、各場合における反応体通路の総内容積は5.6±0.1ミリリットルであった。それゆえ、熱交換性能は典型的に、流量と共に減少し、F1およびF2での反応体通路の分岐により、局部的な流量が2回、効果的に半分になるにもかかわらず、本発明の装置の優れた性能が明らかに確立されている。流量が少なくても改善された熱交換性能は、既にマイクロ流体装置である図2の比較の装置に対してさえ、本発明の装置により、プロセス強化が行われたことを示している。
いくつかの追加の実施の形態
図10A〜10Gは、特に、連続チャンバ34の他の採り得る形態を示す、本発明のいくつかの代わりの実施の形態による反応体通路の部分を画成する多数の代わりの壁構造の断面平面図である。先の実施の形態に示されたチャンバは、図10Fのものに概して対応し、ここで、支柱58が、潜在的に、図10Aの実施の形態におけるような大きな開放区域または「自由区域」を有するチャンバ34に対して、チャンバ34の圧力抵抗を増加させるように働くであろう。他方で、支柱58のない実施の形態は、支柱58の上流に小さな死空間(流体流パターンにおける遅く動く地点)を有する傾向が少ないであろう。図10Gの実施の形態は、分割・向直し壁44の下流側に三角形の受け構造60を含むことによって、死空間の全ての虞を実質的に避け、したがって、死空間の区域に収集して、反応体通路を詰まらせることのある、固体懸濁物などの固体または沈殿反応を取り扱うのに特に推奨される。
追加の比較テスト
図13は、単一の装置の一部として配列された、図9に示されたものにおおよそ対応する本発明の様々な代わりの実施の形態による多数のテスト反応通路の断面平面図である。上述した混合テストを、図に示されたテスト反応通路70〜82の各々に行った。その結果が、図2の装置の比較テストと共に、以下の表Iに示されている。
12,14,24 容積
16,18,20,22 水平壁
26 反応体通路
34 チャンバ
40 出口
42 入口
44 分割・向直し壁
58 支柱
Claims (1)
- (i)少なくとも1つの反応体通路と、(ii)複数の熱制御通路と、(iii)互いに平行であり、少なくとも第1、第2、第3および第4の順に位置する複数の略水平壁とを備えたマイクロ流体装置であって、
前記複数の熱制御通路のうち少なくとも1つは、前記第1および第2の略水平壁の間の容積内に位置し、配置され、前記複数の熱制御通路のうちの別の少なくとも1つは、前記第3および第4の略水平壁の間の容積内に位置し、配置され、前記少なくとも1つの反応体通路は、前記第2および第3の略水平壁の間に位置し、かつ該第2および第3の略水平壁と該第2および第3の略水平壁の間に延在する壁により画成され、前記反応体通路は多数の連続チャンバを備え、該チャンバの各々は、前記反応体通路を少なくとも2つの副通路に分割する分割部、および分割された前記副通路を合流させる合流部を備え、前記副通路の少なくとも一方の通路の方向の変化が90度より大きく、
前記多数のチャンバの別のものが直後に続くチャンバの各々が、前記連続したチャンバに対応して狭くなった入口を形成する徐々に狭くなる出口を備え、および前記分割部が、直ぐ上流の通路に交差するように向けられ、前記チャンバの入口の直ぐ下流に位置する分割・向直し壁をさらに備え、該分割・向直し壁が、前記反応通路を前記少なくとも2つの副通路に分割し、かつ前記反応通路の方向に対して少なくとも90度の方向に前記副通路の少なくとも1つを向直しさせ、該分割・向直し壁の上流側が窪んだ表面を有し、且つ前記多数のチャンバの別のものが直後に続くチャンバの各々が、前記連続するチャンバと共通壁をさらに共有し、該共通壁の上流側が前記出口を形成し、且つ前記共通壁の下流側が前記入口を形成するものであり、前記分割・向直し壁が複数の区画に分かれており、隣接する前記区画の間に補助的副通路が形成されていることを特徴とするマイクロ流体装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07301225A EP2017000B1 (en) | 2007-07-11 | 2007-07-11 | Process intensified microfluidic devices |
EP07301225.4 | 2007-07-11 |
Related Parent Applications (1)
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JP2010516065A Division JP2011508657A (ja) | 2007-07-11 | 2008-07-11 | プロセス強化マイクロ流体装置 |
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JP2017166629A Division JP6674933B2 (ja) | 2007-07-11 | 2017-08-31 | プロセス強化マイクロ流体装置 |
Publications (2)
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JP2014147930A JP2014147930A (ja) | 2014-08-21 |
JP6204235B2 true JP6204235B2 (ja) | 2017-09-27 |
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JP2010516065A Pending JP2011508657A (ja) | 2007-07-11 | 2008-07-11 | プロセス強化マイクロ流体装置 |
JP2014056426A Active JP6204235B2 (ja) | 2007-07-11 | 2014-03-19 | プロセス強化マイクロ流体装置 |
JP2017166629A Active JP6674933B2 (ja) | 2007-07-11 | 2017-08-31 | プロセス強化マイクロ流体装置 |
JP2020039661A Active JP7049381B2 (ja) | 2007-07-11 | 2020-03-09 | プロセス強化マイクロ流体装置 |
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JP2010516065A Pending JP2011508657A (ja) | 2007-07-11 | 2008-07-11 | プロセス強化マイクロ流体装置 |
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JP2017166629A Active JP6674933B2 (ja) | 2007-07-11 | 2017-08-31 | プロセス強化マイクロ流体装置 |
JP2020039661A Active JP7049381B2 (ja) | 2007-07-11 | 2020-03-09 | プロセス強化マイクロ流体装置 |
Country Status (13)
Country | Link |
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US (1) | US7939033B2 (ja) |
EP (1) | EP2017000B1 (ja) |
JP (4) | JP2011508657A (ja) |
KR (1) | KR101666635B1 (ja) |
CN (1) | CN101873890B (ja) |
AU (1) | AU2008275602A1 (ja) |
BR (1) | BRPI0813700A2 (ja) |
CA (1) | CA2693463A1 (ja) |
MX (1) | MX2010000485A (ja) |
RU (1) | RU2010104674A (ja) |
TW (1) | TWI363656B (ja) |
WO (1) | WO2009009129A1 (ja) |
ZA (1) | ZA201000944B (ja) |
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JP6674933B2 (ja) | 2020-04-01 |
TWI363656B (en) | 2012-05-11 |
US20090028763A1 (en) | 2009-01-29 |
MX2010000485A (es) | 2016-01-27 |
RU2010104674A (ru) | 2011-08-20 |
CA2693463A1 (en) | 2009-01-15 |
WO2009009129A1 (en) | 2009-01-15 |
CN101873890A (zh) | 2010-10-27 |
ZA201000944B (en) | 2010-10-27 |
EP2017000B1 (en) | 2012-09-05 |
CN101873890B (zh) | 2013-07-24 |
JP2018051553A (ja) | 2018-04-05 |
KR101666635B1 (ko) | 2016-10-14 |
BRPI0813700A2 (pt) | 2014-12-30 |
JP2011508657A (ja) | 2011-03-17 |
TW201107029A (en) | 2011-03-01 |
US7939033B2 (en) | 2011-05-10 |
EP2017000A1 (en) | 2009-01-21 |
JP2020114585A (ja) | 2020-07-30 |
JP7049381B2 (ja) | 2022-04-06 |
KR20100049060A (ko) | 2010-05-11 |
AU2008275602A1 (en) | 2009-01-15 |
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