JP6176716B2 - Input device and portable device using the same - Google Patents

Description

  The present invention relates to an input device, a manufacturing method thereof, and a portable device, and more particularly to an input device in which a surface panel and a film sensor are bonded together with an adhesive, a manufacturing method thereof, and a portable device.

  In a display unit of a mobile device such as a mobile phone or a smartphone, an input device is used so as to overlap with a display device such as a liquid crystal display. In recent years, with the evolution and diversification of designs in mobile devices and the like, a surface panel having a three-dimensional shape such as a curved surface may be used in an input device used for a display unit. The following Patent Document 1 describes a capacitance type input device in which a surface panel having a curved shape and a film sensor are bonded together with an adhesive.

  FIG. 16 is a process diagram showing a conventional method of manufacturing an input device described in Patent Document 1. In the step of FIG. 16A, a film sensor 121 that is preformed and curved in a convex shape is prepared, and the outer edge portion 121a is cut and removed. In the step of FIG. 16B, the adhesive 141 is applied to the surface panel 131 having a curved surface. A photo-curing adhesive, a thermosetting adhesive, or the like is used as the adhesive 141, and the adhesive 141 is applied by the printing roller 162 as shown in FIG.

  Next, in the process of FIG. 16C, the film sensor 121 is overlaid on the front panel 131. Then, in the step of FIG. 16D, the adhesive 141 is cured. Through the processes as described above, the input device 110 is manufactured by bonding the film sensor 121 and the front panel 131 via the adhesive 141.

US Patent Application Publication No. 2010/0103138

  In the process of FIG. 16C, in order to prevent air bubbles from being mixed between the film sensor 121 and the front panel 131 and to uniformly bond the entire surface of the front panel 131, the film is applied while applying a predetermined pressure. A sensor 121 is bonded to the front panel 131. However, when a liquid material is used as the adhesive 141, there is a problem that the adhesive 141 is pushed out to the outside of the front panel 131 in the step shown in FIG.

  When the adhesive 141 protrudes to the outside of the front panel 131, the appearance quality deteriorates, and when the input device 110 is incorporated into a portable device or the like, the adhesive 141 that protrudes may be incorporated at a predetermined position. There may be a problem that it becomes difficult. Therefore, it is necessary to remove the protruding adhesive 141 in a subsequent process, and the addition of such an adhesive removing process leads to an increase in manufacturing cost of the input device 110.

  Also, the step of cutting and removing the outer edge portion 121a shown in FIG. 16A is omitted, and after bonding the film sensor 121 and the front panel 131, the outer edge portion 121a is bent toward the back side of the film sensor 121. Forming was considered. Thereby, the cutting process can be omitted, the manufacturing cost can be reduced, and the occurrence of defects associated with the cutting process can be eliminated.

  However, as shown in FIG. 16 (d), since the adhesive 141 is applied to the entire surface of the front panel 131, it is not easy to form a shape that bends the outer edge 121a to the back side of the film sensor 121, and the outer edge 121a. The bent portion protrudes outward from the front panel 131 greatly. Therefore, when the outer edge portion 121a of the film sensor 121 is formed, there arises a problem that the planar size of the entire input device 110 is increased or the height of the input device 110 is increased.

  The present invention solves the above problems, and provides an input device that can prevent the adhesive from protruding and can easily form the shape of the film sensor after the film sensor and the front panel are bonded together. With the goal.

Input device of the present invention includes a front panel, and a film sensor facing the surface panel, said front panel and said film sensor is an input device to be bonded via an adhesive, said surface panels Has a front surface and a back surface, the front panel has a top plate and a side plate extending to the back surface side of the top plate, and the front panel is curved to be convex to the front side by the top plate and the side plate. the shape, between the film sensor and the surface panel is provided with a first wall and a second wall, together with the first wall is provided at a position overlapping with the peripheral edge portion of the side plate, The second wall is provided at a position that overlaps the side plate inward of the first wall with a space from the first wall, and the height of the first wall is the second wall. formed higher than the height of the wall, it inward of said first wall The film sensor Te is over the top plate and the side plate following the curved shape of the back surface of the surface panel, the are bonded together with an adhesive, said film sensor extends outward from the front panel An extension part extending out, the extension part extending to the back side from the lower end part of the first wall and the side plate, and the film sensor includes a plurality of electrodes and a plurality of the electrodes. Each of the plurality of electrodes is provided at a position overlapping the top plate and the side plate, and the plurality of lead wires are provided to extend to the extension portion, and the film sensor or the A first wall and a second wall are provided on one of the front panels, and the second wall is bonded to the other of the film sensor or the front panel via an adhesive, and the first wall is No contact with the other And characterized in that.

  According to this, when the adhesive is applied to the front panel or when the front panel and the film sensor are bonded together, the flow of the adhesive toward the outside of the front panel is suppressed by the second wall, The adhesive beyond the second wall is accumulated between the first wall and the second wall and is blocked by the first wall. This prevents the adhesive from protruding to the outside of the front panel.

  Further, the surface panel and the film sensor are bonded to each other inside the first wall via an adhesive, and the first wall and the film sensor or the first wall and the surface panel are not bonded. For this reason, the film sensor can be bent with the position inside the outer edge of the front panel as a base point. Therefore, since the film sensor can be bent with a margin in the planar direction or height direction of the input device, it is easy to form the shape of the film sensor.

  Therefore, according to the input device of the present invention, it is possible to prevent the adhesive from protruding, and to easily form the shape of the film sensor after the film sensor and the front panel are bonded together.

According to the input device of the present invention, the height of the first wall is formed higher than the height of the second wall . According to this, when the surface panel and the film sensor are bonded together, the flow of the adhesive toward the outside of the surface panel is suppressed by the second wall, and the adhesive spreads evenly inside the second wall. And allowing the adhesive to protrude outside the second wall. Therefore, the surface panel and the film sensor can be securely bonded inside the second wall, and the adhesive can be prevented from sticking out by the first wall.

  In the input device of the present invention, it is preferable that the first wall and the second wall are provided in an annular shape. According to this, it is possible to prevent the adhesive from protruding over the entire outer periphery of the front panel.

  It is preferable that a plurality of the second walls are provided, and the plurality of the second walls are arranged with an interval in the peripheral direction of the surface panel. Even in such an embodiment, the flow of the adhesive is suppressed by the plurality of second walls, and the adhesive is allowed to protrude from the interval between the second walls. Therefore, the surface panel and the film sensor can be securely bonded inside the second wall, and the adhesive can be prevented from sticking out by the first wall.

  The first wall and the second wall are preferably provided in the film sensor. According to this aspect, since the film sensor can be bonded to the front panel after the first wall and the second wall are formed on the film sensor in a flat state, the first wall and the second wall Can be easily formed, and the degree of freedom in designing the first wall and the second wall can be improved.

  It is preferable that the film sensor has an extending portion that extends outward from the surface panel, and the first wall and the surface panel are not bonded. Since the film sensor is connected to an external circuit on which an IC or the like is mounted, it is possible to narrow the frame of the front panel and expand the input area by forming a lead-out wiring for connecting to the external circuit in the extension part. It becomes. Further, since the first wall and the front panel are not bonded, the film sensor can be bent with the inner side as a base point rather than the outer edge of the front panel.

  The first wall and the second wall are preferably provided on the surface panel. If it is such an aspect, since a surface panel has high rigidity compared with a film sensor, when bonding a surface panel and a film sensor, a load is certainly ensured between the 1st wall and the film sensor 21. It is possible to prevent the adhesive from protruding beyond the first wall.

  In the input device according to the aspect of the invention, it is preferable that the film sensor has an extending portion that extends outward from the surface panel, and the first wall and the film sensor are not bonded. Since the film sensor is connected to an external circuit on which an IC or the like is mounted, it is possible to narrow the frame of the front panel and expand the input area by forming a lead-out wiring for connecting to the external circuit in the extension part. It becomes. Further, since the first wall and the film sensor are not bonded, the film sensor can be bent with the inner side as a base point rather than the outer edge of the surface panel.

  In the input device of the present invention, the adhesive is preferably a UV resin. According to this, by filling the UV resin as an adhesive between the front panel and the film sensor and then irradiating with UV, the adhesive is prevented from protruding and the front panel and the film sensor are reliably secured. Can be pasted together.

The portable device of the present invention is a portable device having the input device and a housing disposed on the back side of the input device, wherein the film sensor is based on a position inside the lower end portion of the side plate. And the extension part is bent inside the casing .

  According to this, it is possible to prevent the adhesive from protruding by the first wall and the second wall and to easily form the shape of the film sensor after the film sensor and the front panel are bonded together. Therefore, it is possible to reduce the size of the portable device by suppressing the bent portion formed by bending the film sensor from protruding outward from the front panel.

  According to the input device, the manufacturing method thereof, and the portable device of the present invention, it is possible to prevent the adhesive from protruding and to easily form the shape of the film sensor after the film sensor and the surface panel are bonded together.

1 is a perspective view of an input device according to a first embodiment of the present invention. It is an exploded perspective view of the input device of a 1st embodiment. It is sectional drawing when it cut | disconnects by the III-III line | wire of FIG. 1, and it sees from the arrow direction. It is a partial expanded sectional view of the input device of a 1st embodiment. It is a top view of the film sensor which constitutes the input device of a 1st embodiment. It is process drawing for demonstrating the manufacturing method of the input device of 1st Embodiment. It is sectional drawing which shows the modification of the input device of 1st Embodiment. It is a top view of the film sensor which comprises the input device of 2nd Embodiment. It is a partial expanded sectional view of the input device of 3rd Embodiment. It is process drawing for demonstrating the manufacturing method of the input device of 3rd Embodiment. It is a partial expanded sectional view of the portable apparatus of 4th Embodiment. It is a perspective view of the input device in the reference example 1. FIG. It is a top view of the film sensor which comprises the input device of the reference example 1 . It is the elements on larger scale of an input device when it cut | disconnects by the XIV-XIV line | wire of FIG. 12, and it sees from the arrow direction. It is a partial expanded sectional view of the input device of the embodiment of reference example 2 . It is process drawing for demonstrating the manufacturing method of the input device of a prior art example.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. In addition, the dimension of each drawing is changed and shown suitably.

<First Embodiment>
FIG. 1 is a perspective view of an input device according to the first embodiment. FIG. 2 is an exploded perspective view of the input device according to the first embodiment. FIG. 3 is a cross-sectional view of the input device as viewed from the direction of the arrow cut along the line III-III in FIG.

  As shown in FIG. 1, the input device 10 according to the present embodiment includes a front panel 31 and a film sensor 21 that faces the front panel 31. As shown in FIG. 3, the front panel 31 and the film sensor 21 are bonded via an adhesive 41.

  As shown in FIG. 3, the front panel 31 has a top plate 32 and side plates 33 and 34 extending to the back surface 31 b side (Z2 direction) of the top plate 32, and the top plate 32 and the side plates 33 and 34 The curved shape is convex toward the surface 31a. The front panel 31 is made of a translucent glass material or resin material, and the top plate 32 and the side plates 33 and 34 are integrally formed. The operator can perform an input operation by bringing a finger or the like close to the surface 31a of the top plate 32 of the front panel 31 or the surface 31a of the side plates 33 and 34 without bringing them into contact therewith.

  As shown in FIG. 3, the film sensor 21 is bonded to the back surface 31 b side of the front panel 31 via an adhesive 41. The film sensor 21 is curved along the curved shape of the front panel 31 and is bonded to the top plate 32 and the side plates 33 and 34. The film sensor 21 has extending portions 21 a and 21 b extending outward from the front panel 31, and the extending portion 21 a extends in the Z2 direction from the lower end portion of the side plate 33, and extends. 21 b extends in the Z2 direction from the lower end of the side plate 34.

  The film sensor 21 is formed using a film-like resin material. For example, translucent resin materials such as polycarbonate resin (PC), polyethylene terephthalate resin (PET), polyethylene naphthalate resin (PEN), cyclic polyolefin (COP), and polymethyl methacrylate resin (PMMA) are used.

  As shown in FIG. 2, the film sensor 21 is provided with a plurality of rectangular electrodes 22. The plurality of electrodes 22 are formed at a position overlapping the top plate 32 and part of the position overlapping the side plates 33 and 34, and arranged in the X1-X2 direction and the Y1-Y2 direction of the film sensor 21 so as to be spaced from each other. Has been. When the operator brings a finger or the like into contact with the surface 31a of the front panel 31 or brings the finger close to the surface 31a, the capacitance between the electrode 22 and the ground, or the static between the electrodes 22 The capacitance fluctuates, and the input position information is detected by this capacitance change.

  The film sensor 21 is provided with a plurality of lead wires 23 at positions overlapping with the side plates 33 and 34 and at the extending portions 21a and 21b. The lead wires 23 are respectively connected to the electrodes 22 (the connection structure between the lead wires 23 and the electrodes 22 is omitted in FIG. 2), and the electrodes 22 are, for example, flexible printed boards (not shown) via the lead wires 23. Etc. are electrically connected. Thereby, the signal of the input position information detected by the electrode 22 is transmitted to the external circuit via the lead wiring 23.

In the present embodiment, the plurality of electrodes 22 are formed using a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , and ZnO, and are formed by a thin film method such as sputtering or vapor deposition. Alternatively, a conductive ink having any one of Ag nanowires, Ag nanotubes, carbon nanotubes, and PEDOT can be used for coating and forming by a printing method such as inkjet printing. The lead wire 23 can be made of a metal material such as Cu, Ag, or Au.

  As shown in FIG. 2, by providing the lead-out wiring 23 of the film sensor 21 in the extending portions 21 a and 21 b, the area where the electrode 22 can be formed can be enlarged, and the side plate 33 is added to the position overlapping the top plate 32. , 34 can be formed at the position overlapping with. Therefore, the input device 10 according to the present embodiment can narrow the frame of the input device 10 and can expand the area where the input operation can be performed, and the input operation can be performed on the top plate 32 and the side plates 33 and 34.

  In the present embodiment, a UV curable resin material is used as the adhesive 41 to be bonded to the curved surface panel 31 and the film sensor 21. When the front panel 31 and the film sensor 21 are bonded together, the adhesive 41 is in a liquid state, and after the front panel 31 and the film sensor 21 are superposed, UV is irradiated and the adhesive 41 is cured. Thereby, the film sensor 21 can be bonded to the front panel 31 according to the curved surface shape of the front panel 31.

  As shown in FIG. 3, a first wall 51 and a second wall 52 are provided on the surface of the film sensor 21 that faces the front panel 31. FIG. 4 is a partially enlarged cross-sectional view of the input device of this embodiment. FIG. 4 particularly shows an enlarged view of the first wall 51 and the second wall 52 provided in the film sensor 21. FIG. 5 shows a plan view of the film sensor 21, which is a plan view when the film sensor 21 is unfolded. In FIG. 5, the first wall 51 and the second wall 52 are indicated by hatching for easy viewing.

  As shown in FIG. 5, the first wall 51 is continuously provided in a ring shape on the film sensor 21, and the second wall 52 is provided in a ring shape inwardly of the first wall 51. It has been. As shown in FIG. 4, the first wall 51 is provided on the film sensor 21 so as to be positioned at the peripheral edge of the front panel 31, and the second wall 52 is spaced from the first wall 51. It is provided inward from the first wall 51. The height of the first wall 51 is formed higher than the height of the second wall 52. The front panel 31 and the film sensor 21 are bonded to each other with an adhesive 41 inside the first wall 51. Therefore, the adhesive 41 is not interposed between the first wall 51 and the front panel 31, the first wall 51 is provided, and the region where the first wall 51 and the front panel 31 face each other is not bonded. Region 53.

  As shown in FIG. 4, the space provided between the first wall 51 and the second wall 52 is an adhesive reservoir 55, and the adhesive 41 is filled in the adhesive reservoir 55. In addition, the adhesive 41 is not limited to a mode in which the adhesive reservoir 55 is filled without a gap, and a portion of the adhesive reservoir 55 is filled with the adhesive 41 to provide a space in the adhesive reservoir 55. It may be the case.

  In addition, in order to prevent the 1st wall 51 and the 2nd wall 52 being visually recognized from the outside, the colored decoration layer 35 is formed in the surface panel 31. As shown in FIG. The decoration layer 35 is provided in a region overlapping the first wall 51 and the second wall 52, and when viewed from the surface 31 a side of the top plate 32, there is a region where the decoration layer 35 is not provided. A region that is the light-transmitting region 18 and overlaps the decorative layer 35 is a non-light-transmitting region 19.

  By providing the first wall 51 and the second wall 52 as in this embodiment, when the front panel 31 and the film sensor 21 are bonded together, the flow of the adhesive 41 toward the outside of the front panel 31 is caused. It is restrained by the second wall 52. The height of the first wall 51 is formed higher than the height of the second wall 52, and a gap is formed between the second wall 52 and the surface panel 31, as shown in FIG. Is done. Therefore, the flow of the adhesive 41 toward the outside of the front panel 31 is suppressed by the second wall 52, and the adhesive 41 spreads evenly inside the second wall 52 and outwards from the second wall 52. The adhesive 41 is allowed to protrude. In addition, by providing the adhesive reservoir 55 between the first wall 51 and the second wall 52, the adhesive 41 beyond the second wall 52 is allowed to pass through the first wall 51 and the second wall 52. Is stored in the adhesive reservoir 55 between the first wall 51 and the first wall 51. Accordingly, the front panel 31 and the film sensor 21 are securely bonded inside the second wall 52, and the adhesive 41 is prevented from protruding to the outside of the front panel 31.

  In addition, the front panel 31 and the film sensor 21 are bonded to each other inside the first wall 51 via an adhesive 41, and the first wall 51 and the front panel 31 are not bonded. For this reason, when the extending part 21a of the film sensor 21 is bent inward to deform the shape, the film sensor 21 can be bent with the inner side as a base point of the outer edge of the front panel 31. Therefore, since the film sensor 21 can be bent with a margin in the planar direction or the height direction of the input device 10, the shape of the film sensor 21 can be easily formed.

  Therefore, according to the input device 10 of the present invention, it is possible to prevent the adhesive 41 from protruding and to easily form the shape of the film sensor 21 after the film sensor 21 and the front panel 31 are bonded together.

<The manufacturing method of the input device of 1st Embodiment>
FIG. 6 is a process diagram for explaining the manufacturing method of the input device according to the first embodiment. FIG. 6A and FIG. 6B are partial enlarged cross-sectional views of the film sensor 21 shown in an enlarged manner with respect to a place where the first wall 51 and the second wall 52 are provided. FIGS. 6C and 6D are partial enlarged cross-sectional views of the front panel 31 at positions facing the first wall 51 and the second wall 52. FIG. 6E is a partially enlarged cross-sectional view of the input device 10. In each drawing of FIG. 6, the input device 10 shown in FIGS. 1 to 4 is shown upside down.

  In the process of FIG. 6A, the flat film sensor 21 is prepared, and the base 51 a and the second wall 52 of the first wall 51 are formed on the film sensor 21. The base 51a and the second wall 52 can be formed by screen printing using an ink containing a resin material. Thereby, the base 51a and the 2nd wall 52 are formed in the same height by the same process. As the ink used for printing, for example, a material similar to the ink used for forming the decorative layer 35 (not shown in FIG. 6) or a transparent resist material can be used.

  Next, in the process of FIG. 6B, screen printing is repeatedly performed, and the raised portion 51b is printed on the base portion 51a. Thereby, the 1st wall 51 which consists of the base 51a and the raising part 51b can be printed and formed. That is, the number of times of printing for forming the first wall 51 (FIGS. 6A and 6) is larger than the number of times of printing for forming the second wall 52 (number of times of printing in the step of FIG. 6A). The raised portion 51b is formed by increasing the total number of times of printing (b). According to the method for manufacturing the input device 10 of the present embodiment, the first wall 51 can be reliably formed higher than the second wall 52. Moreover, it is easy to form the 1st wall 51 and the 2nd wall 52 in predetermined height and a shape by forming by a printing method.

  6 (a) and 6 (b) show partially enlarged cross-sectional views. As shown in FIG. 5, the first wall 51 and the second wall 52 are peripheral portions of the surface panel 31. It is formed in an annular shape in plan view so as to be located at 6A and 6B, printing is performed once each to form the first wall 51 and the second wall 52. However, the present invention is not limited to this, and the number of times of printing is not limited to this. Can be increased as appropriate.

  In the step of FIG. 6C, the surface panel 31 is bent to form the surface panel 31 in a curved shape. In FIG. 6C, the front panel 31 and the side plates 33 and 34 are formed by bending the front panel 31 by bending the front panel 31 to the back surface 31b side while applying predetermined pressure and heat. . Note that a three-dimensional shape can also be formed by injection molding using a translucent resin material as the front panel 31.

  In the step of FIG. 6D, a liquid UV resin is applied as the adhesive 41 to the back surface 31 b of the top plate 32 of the front panel 31. An appropriate amount of adhesive 41 is applied to a plurality of locations by a dispenser (not shown).

  6E, the film sensor 21 provided with the first wall 51 and the second wall is prepared by the steps of FIGS. 6A and 6B, and the film sensor 21 is attached to the front panel 31. Is superimposed on the back surface 31b side. Then, a light load is applied to the film sensor 21 to deform the film sensor 21 so as to follow the curved shape of the front panel 31. At this time, the adhesive 41 applied in the step of FIG. 6D spreads to a uniform thickness between the film sensor 21 and the front panel 31 due to the fluidity of the adhesive 41. That is, the adhesive 41 spreads so as to be pushed out from the top plate 32 toward the side plate 33 and the side plate 34.

  According to the method for manufacturing the input device 10 of the present embodiment, the height of the first wall 51 is formed higher than the height of the second wall 52 by providing the raised portion 51b. As shown in e), a gap is formed between the second wall 52 and the front panel 31. Therefore, the flow of the adhesive 41 toward the outside of the front panel 31 is suppressed by the second wall 52, and the adhesive 41 spreads uniformly on the inside of the second wall 52 and outwards from the second wall 52. The adhesive 41 is allowed to protrude. In addition, by providing the adhesive reservoir 55 between the first wall 51 and the second wall 52, the adhesive 41 beyond the second wall 52 is allowed to pass through the first wall 51 and the second wall 52. Is stored in the adhesive reservoir 55 between the first wall 51 and the first wall 51. Thereby, the protrusion of the adhesive 41 to the outside of the front panel 31 is prevented. Further, since the first wall 51 and the second wall 52 are provided in an annular shape, the adhesive 41 can be prevented from protruding over the entire outer periphery of the surface panel 31.

  After the process of FIG. 6E, the liquid UV resin is cured by irradiating the film sensor 21 and the surface panel 31 superimposed via the liquid UV resin. By using a liquid UV resin as the adhesive 41, it is possible to prevent the adhesive from sticking out and securely bond the surface panel 31 and the film sensor 21 together. The input device 10 can be manufactured by the process as described above.

  In addition, when bonding the film sensor 21 to the curved surface panel 31, it was also considered to use a double-sided tape (adhesive layer) such as an OCA (Optical Clear Adhesive) film instead of the liquid adhesive 41. However, it is necessary to apply a large load and attach the film sensor 21 to the front panel 31 in order to prevent air bubbles from entering. When a transparent conductive material such as ITO is used as the electrode 22 (not shown in FIG. 6) of the film sensor 21, if a large load is applied to the film sensor 21 to deform it according to the curved shape of the front panel 31 Then, disconnection of the electrode 22 and the lead wiring 23 occurs. By using the liquid adhesive 41, it is not necessary to apply a large load to deform the film sensor 21 into a curved shape and can be bonded together with a light load, so that the occurrence of disconnection can be suppressed.

<Modification of First Embodiment>
FIG. 7 is a cross-sectional view illustrating a modification of the input device according to the first embodiment. In the input device 10 of this modification, the shape of the front panel 31 is different, and the side plate 33 and the side plate 34 are inclined with respect to the top plate 32. Even in such an embodiment, by providing the film sensor 21 with the first wall 51 and the second wall 52, it is possible to prevent the adhesive 41 from protruding to the outside of the front panel 31.

  Further, when colored resin materials are used as the first wall 51 and the second wall 52, the front panel 31 is decorated so that the first wall 51 and the second wall 52 are not visually recognized from the outside. A layer 35 is provided. As shown in FIG. 7, in the input device 10 of the present modification, the side plate 33 and the side plate 34 are provided so as to be inclined, so that they are provided so as to cover the first wall 51 and the second wall 52. The area of the decoration layer 35 can be reduced. Therefore, it is possible to reduce the area of the non-translucent region 19 and increase the area of the translucent region 18.

<Second Embodiment>
FIG. 8 is a plan view when the film sensor constituting the input device of the second embodiment is shown, and the film sensor 21 is flattened without being curved. The input device 11 of the second embodiment is different in that a plurality of second walls 52 are provided on the film sensor 21. As shown in FIG. 8, the plurality of second walls 52 are arranged in an annular shape at intervals from each other in the outer edge direction of the surface panel 31 (not shown in FIG. 8). In FIG. 8, the first wall 51 and the second wall 52 are indicated by hatching for easy viewing.

  Even in such an aspect, when the front panel 31 and the film sensor 21 are bonded together, the flow of the adhesive 41 toward the outside of the front panel 31 is suppressed by the second wall 52, and the adhesive 41 Extends evenly inside the second wall 52. The adhesive 41 is allowed to protrude outside the second wall 52 through the interval between the second walls 52. The adhesive 41 exceeding the second wall 52 is accumulated in the adhesive reservoir 55 between the first wall 51 and the second wall 52 and is blocked by the first wall 51. Thereby, the protrusion of the adhesive 41 to the outside of the front panel 31 is prevented.

  Moreover, in this embodiment, even if it forms the height of the 1st wall 51 and the 2nd wall 52 equally, said effect can be acquired. Therefore, the multiple printing steps shown in FIGS. 6A and 6B are not necessary, and the first wall 51 and the second wall 52 can be formed by a single printing step. The manufacturing process can be simplified and the manufacturing cost can be reduced.

<Third Embodiment>
FIG. 9 is a partially enlarged cross-sectional view of the input device according to the third embodiment. As shown in FIG. 9, the input device 12 of the third embodiment is different in that a first wall 51 and a second wall 52 are provided on the front panel 31. Also in the present embodiment, the adhesive 41 protrudes outside the front panel 31 when the front panel 31 and the film sensor 21 are bonded together in the same manner as the input devices 10 and 11 of the first and second embodiments. Is prevented. Further, since the front panel 31 has higher rigidity than the film sensor 21, a load is surely applied between the first wall 51 and the film sensor 21 when the front panel 31 and the film sensor 21 are bonded together. The adhesive 41 can be reliably prevented from sticking out.

  Also in this embodiment, the surface panel 31 and the film sensor 21 are bonded to each other with the adhesive 41 inside the first wall 51. Therefore, the first wall 51 and the film sensor 21 are not bonded to each other with the adhesive 41, and the region where the first wall 51 is provided is a non-adhesive region 53. Therefore, when the extension part 21a of the film sensor 21 is bent and deformed inward, the film sensor 21 can be bent with the inner side as a base point from the outer edge of the surface panel 31. Therefore, since the film sensor 21 can be bent with a margin in the planar direction or the height direction of the input device 12, the shape of the film sensor 21 can be easily formed.

<Manufacturing Method of Input Device of Third Embodiment>
FIG. 10 is a process diagram for explaining the method of manufacturing the input device according to the third embodiment. FIG. 10A to FIG. 10E are partial enlarged cross-sectional views of the surface panel 31 and the input device 12 shown in an enlarged manner with respect to locations where the first wall 51 and the second wall 52 are provided. In each drawing of FIG. 10, the input device 12 shown in FIG. 9 is shown upside down.

  In the step of FIG. 10A, the flat surface panel 31 is prepared, and the base portion 51 a of the first wall 51 and the second wall 52 are formed on the peripheral portion of the surface panel 31. The base 51a and the second wall 52 can be formed by screen printing using an ink containing a resin material. Thereby, the base 51a and the 2nd wall 52 are formed in the same height by the same process. As the ink used for printing, for example, a material similar to the ink used for forming the decorative layer 35 (not shown in FIG. 10) or a transparent resist material can be used.

  Next, in the process of FIG. 10B, screen printing is repeatedly performed to print the raised portion 51b on the base portion 51a. Thereby, the 1st wall 51 which consists of the base 51a and the raising part 51b can be printed and formed. That is, the number of times of printing for forming the first wall 51 (FIGS. 10A and 10) is larger than the number of times of printing for forming the second wall 52 (number of times of printing in the step of FIG. 10A). The raised portion 51b is formed by increasing the total number of times of printing (b). According to the method for manufacturing the input device 12 of the present embodiment, the first wall 51 can be reliably formed higher than the second wall 52. Moreover, it is easy to form the 1st wall 51 and the 2nd wall 52 in predetermined height and a shape by forming by a printing method.

  10 (a) and 10 (b) show partially enlarged cross-sectional views, but the first wall 51 and the second wall 52 are surfaces as in the first embodiment shown in FIG. In the peripheral part of the panel 31, it is formed cyclically | annularly by planar view. In addition, in the steps of FIGS. 10A and 10B, the number of times of printing can be appropriately increased.

  In the process of FIG. 10C, the surface panel 31 on which the first wall 51 and the second wall 52 are formed is bent to form the surface panel 31 in a curved shape. In FIG. 10C, the front panel 31 and the side plates 33 and 34 are formed by bending the front panel 31 by bending the front panel 31 toward the back surface 31b while applying predetermined pressure and heat. .

  In the step of FIG. 10D, a liquid UV resin is applied as the adhesive 41 to the back surface 31 b of the top plate 32 of the front panel 31. An appropriate amount of adhesive 41 is applied to a plurality of locations by a dispenser (not shown).

  10E, the film sensor 21 is prepared, and the film sensor 21 is overlaid on the back surface 31b side of the front panel 31. Then, a light load is applied to the film sensor 21 to deform the film sensor 21 so as to follow the curved shape of the front panel 31. At this time, the adhesive 41 applied in the step of FIG. 10D spreads to a uniform thickness between the film sensor 21 and the front panel 31 due to the fluidity of the adhesive 41. That is, the adhesive 41 spreads so as to be pushed out from the top plate 32 toward the side plate 33 and the side plate 34.

  According to the method for manufacturing the input device 12 of the present embodiment, the first wall 51 and the second wall 52 are provided on the front panel 31, so that the adhesive 41 is applied to the front panel 31 or the front panel 31. And the film sensor 21 are bonded together, the flow of the adhesive 41 toward the outside of the front panel 31 is suppressed by the second wall 52. In addition, by providing the adhesive reservoir 55 between the first wall 51 and the second wall 52, the adhesive 41 beyond the second wall 52 is allowed to pass through the first wall 51 and the second wall 52. Is stored in the adhesive reservoir 55 between the first wall 51 and the first wall 51. Thereby, the protrusion of the adhesive 41 to the outside of the front panel 31 is prevented. Further, since the first wall 51 and the second wall 52 are provided in an annular shape, the adhesive 41 can be prevented from protruding over the entire outer periphery of the surface panel 31.

  After the process of FIG. 10E, the liquid UV resin is cured by irradiating the film sensor 21 and the front panel 31 superimposed via the liquid UV resin. The input device 12 is manufactured by the process as described above.

<Fourth Embodiment>
FIG. 11 is a partially enlarged cross-sectional view of a mobile device according to the fourth embodiment. As illustrated in FIG. 11, the mobile device 13 of the present embodiment is configured as the mobile device 13 by incorporating the input device 12 of the third embodiment into a housing 60. As shown in FIG. 11, the front panel 31 and the housing 60 are integrally joined, and a circuit board 61 for controlling the mobile device 13 and the like are disposed inside the housing 60. When the input device 12 is incorporated in the housing 60, the extending portion 21a of the film sensor 21 is bent inward and deformed as shown in FIG.

  In the input device 12, a region where the first wall 51 and the film sensor 21 overlap is a non-bonded region 53 where the first wall 51 and the film sensor 21 are not bonded. For this reason, the film sensor 21 can be bent from the inner side of the outer edge of the front panel 31 (the lower end of the side plate 33) as a base point, and the film sensor 21 can be bent with a margin in the height direction of the input device 12. . Therefore, the shape of the film sensor 21 can be easily formed. Moreover, since the height dimension inside the housing 60 can be reduced as compared with the case where the non-adhesion region 53 is not provided, it is effective for reducing the size and thickness of the portable device 13.

< Reference Example 1 >
12 is a perspective view of the input device of Reference Example 1. FIG. FIG. 13 is a plan view of a film sensor constituting the input device of Reference Example 1 . 14 is a cross-sectional view of the input device as viewed from the direction of the arrow cut along the line XIV-XIV in FIG. .

As shown in FIG. 12, the input device 14 of Reference Example 1 includes a flat surface panel 36 and a film sensor 26 facing the surface panel 36. As in the first embodiment, the film sensor 26 includes a plurality of electrodes 27 and lead wires 28, and can detect input position information based on a change in capacitance. The film sensor 26 has extending portions 26a and 26b extending outward from the surface panel 36, the electrode 27 is formed at a position overlapping the surface panel 36, and the lead-out wiring 28 has an extending portion 26a. , 26b.

Also in the reference example 1 , as shown in FIGS. 13 and 14, the film sensor 26 is provided with a first wall 56 and a second wall 57. In FIG. 13, the first wall 56 and the second wall 57 are hatched for easy viewing.

  As shown in FIG. 13, the first wall 56 is annularly provided on the film sensor 26 so as to be positioned at the periphery of the front panel 36, and the second wall 57 is spaced from the first wall 56. Thus, the first wall 56 is provided inward. As shown in FIG. 14, the height of the first wall 56 is formed higher than the height of the second wall 57.

  The first wall 56 and the second wall 57 can be formed by a screen printing method, similarly to the steps shown in FIGS. 6 (a) and 6 (b). The film sensor 26 and the front panel 36 are bonded together using a liquid UV resin as the adhesive 42.

  By providing the first wall 56 and the second wall 57 in this way, when the front panel 36 and the film sensor 26 are bonded together, the flow of the adhesive 42 toward the outside of the front panel 36 is the second. It is suppressed by the wall 57. Further, by providing an adhesive reservoir 59 between the first wall 56 and the second wall 57, the adhesive 42 beyond the second wall 57 is allowed to pass through the first wall 56 and the second wall 57. Is stored in the adhesive reservoir 59 between the first wall 56 and the first wall 56. This prevents the adhesive 42 from protruding to the outside of the front panel 36.

< Reference Example 2 >
FIG. 15 is a partial enlarged cross-sectional view of the input device of Reference Example 2 . Input device 15 of Example 2, except that Reference Example 1 is constructed by using the same flat surface panel and the first wall 56 and second wall 57 is formed on the surface panel 36 .

Even in such an example , by providing the first wall 56 and the second wall 57 on the surface panel 36, the adhesive 42 is prevented from protruding to the outside of the surface panel 36 .

10, 11, 12, 14, 15 Input device 13 Portable device 21, 26 Film sensor 21a, 21b, 26a, 26b Extension part 22, 27 Electrode 23, 28 Lead-out wiring 31, 36 Surface panel 31a, 36a Surface 31b, 36b Back surface 32, 37 Top plate 33, 34 Side plate 41, 42 Adhesive 51, 56 First wall 51a Base 51b Raised part 52, 57 Second wall 53, 58 Non-adhesive region 55, 59 Adhesive reservoir 60 Case

Claims (7)

An input device having a front panel and a film sensor facing the front panel, wherein the front panel and the film sensor are bonded together with an adhesive,
The front panel has a front surface and a back surface,
The front panel has a top plate and a side plate extending to the back side of the top plate, and the front panel has a curved shape that is convex to the front side by the top plate and the side plate,
A first wall and a second wall are provided between the front panel and the film sensor,
The first wall is provided at a position overlapping the peripheral edge of the side plate, and the second wall is spaced from the first wall and overlaps the side plate inside than the first wall. In the position ,
The height of the first wall is formed higher than the height of the second wall;
Inside the first wall, the film sensor is bonded to the top plate and the side plate through the adhesive, following the curved shape of the back surface of the front panel,
The film sensor has an extending part that extends outward from the front panel, and the extending part extends to the back side from the lower end of the first wall and the side plate,
The film sensor has a plurality of electrodes and lead wires connected to the plurality of electrodes, respectively, the plurality of electrodes are provided at positions overlapping the top plate and the side plate, and the plurality of lead wires are Provided to extend to the extension,
The first wall and the second wall are provided on one of the film sensor or the front panel, and the second wall is bonded to the other of the film sensor or the front panel via an adhesive. The input device is characterized in that the first wall is not bonded to the other wall . Input device according to claim 1, wherein said first wall and said second wall, characterized in that provided in the annular. The said 2nd wall is provided with two or more, The several said 2nd wall is arrange | positioned at intervals in the peripheral direction of the said surface panel, The Claim 1 or Claim 2 characterized by the above-mentioned. Input device. Said first wall and said second wall, said provided a film sensor, any of claims 1 to 3, wherein said first wall and the front panel is a non-adhesive The input device according to item 1. Said first wall and said second wall is provided on the front panel, one of claims 1 to 3, characterized in that said first wall and said film sensor is a non-adhesive The input device according to item 1. Input device according to any one of claims 1 to 5, wherein the adhesive is a UV resin. A portable device having the input device and a housing disposed on the back side of the input device, wherein the film sensor is bent with a position on the inner side of the lower end portion of the side plate as a base point, and the extension The portable device using the input device according to any one of claims 1 to 6, wherein the protruding portion is bent inside the casing.