JP6171749B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light-emitting device including a covering member that covers a side surface of a light-emitting element, a light-transmitting member on the upper surface of the light-emitting element and the covering member, and an adhesive layer that bonds the covering member and the light-transmitting member, and It relates to a manufacturing method.

  Light-Emitting Diodes (LEDs) have many features such as low power consumption, long life, and high reliability, and various types of lighting and backlights have been developed through the practical use of white LEDs that combine blue LEDs and phosphors. Widely used in various applications such as light sources. In recent years, with the spread of demand, further improvement in light emission output and light emission efficiency of LEDs is expected, and a light source with high output and high reliability is required.

  For example, a light-emitting device disclosed in Patent Document 1 includes a light-transmitting member that is disposed to face a light-emitting element, and a light-reflective coating that exposes an emission surface of the light-emitting element and covers the side surfaces of the light-emitting element and the light-transmitting member. And a member. In this light emitting device, by providing a gap and a first reflecting surface in a separation region between the light emitting element and the light transmitting member, the return light is rereflected while preventing deterioration of the adhesive and the light transmitting member for fixing the LED chip. This suppresses a decrease in the optical coupling efficiency to the light transmitting member.

  The light emitting device obtained from the manufacturing method of Patent Document 2 is an LED die having a connection electrode on the bottom surface, the reflective layer on the side surface extends downward, and the phosphor layer is the top surface of the LED die. And covers the top of the reflective layer. With such a configuration, the extended portion of the reflective layer after the mounting blocks light leaking from the side and bottom, so that an LED die with high mass productivity and high light extraction efficiency can be manufactured.

  In addition, the semiconductor light-emitting element disclosed in Patent Document 3 includes a reflective portion provided on the side of the semiconductor layer, a region that does not substantially contain phosphor on the side of the semiconductor layer, and at least an upper surface of the semiconductor layer. A sealing member having a region containing a body layer. That is, a portion where light is directly irradiated upward in the semiconductor layer and a portion which is emitted in the lateral direction and reflected by the reflecting portion and emitted upward are covered with a sealing member containing a phosphor. Therefore, the light conversion efficiency and output are improved.

JP 2010-283281 A JP 2012-253223 A JP 2009-43764 A

  As described in Patent Documents 2 and 3, a reflective portion is provided on the side of the light emitting element, and the upper surface thereof is covered with a phosphor layer or a sealing member, thereby reducing light color unevenness and brightness unevenness and high light extraction efficiency. A light-emitting device can be obtained. However, if the end faces of the constituent members are substantially on the same plane, there is a concern that the members arranged on the upper surface will be peeled off. Patent Document 1 discloses a configuration in which a light-transmitting member and a light-transmitting member having a wavelength conversion member are bonded with an adhesive, but the separation distance between both members is increased by using the adhesive. Therefore, it is difficult to keep the light emitting device thin, and the light extraction efficiency and the wavelength conversion efficiency of the emitted light from the light emitting element are lowered.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that is thin and has high light extraction efficiency while improving the adhesion between the translucent member and the covering member.

  A light-emitting element, a covering member that covers a side surface so as to expose a light-emitting surface of the light-emitting element, and a transparent surface that has an end face that is substantially flush with the end face of the covering member on the upper surface in the light-emitting direction of the light-emitting element and the covering member. A light-emitting device comprising: a light-sensitive member; and an adhesive layer that adheres the covering member and the translucent member, wherein the covering member has a recess on the upper surface, and the adhesive layer is provided at least in the recess. Thus, at least a part of the translucent member and the covering member is bonded.

  A light-emitting element; a covering member that covers a side surface of the light-emitting element; a light-transmitting member on an upper surface of the light-emitting element and the light-emitting direction of the covering member; an adhesive layer that bonds the covering member and the light-transmitting member; And a first step of forming a recess on the upper surface of the covering member so as to be substantially flush with the light emitting surface of the light emitting element, and at least a recess. A second step of disposing the adhesive layer, a third step of forming the translucent member so that at least part of the translucent member adheres to the adhesive layer of the recess, and an end face of the covering member and the translucent member. And a fourth step of cutting so as to be substantially on the same plane.

  By setting it as such a structure, an adhesive layer can be hold | maintained at a recessed part and the thickness of the adhesive layer on a light emitting element can be adjusted. Therefore, it is possible to obtain a light-emitting device that is thin and has high light extraction efficiency while improving the adhesion between the translucent member and the covering member.

FIG. 1A is a plan view of a light emitting device according to Embodiment 1 of the present invention. However, Fig.1 (a) is the state before translucent member arrangement | positioning. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 1C is a partially enlarged view of the vicinity of the recess and the adhesive layer. 2A is a cross-sectional view showing an example in which the concave portion and the adhesive layer are different from those in FIG. 1B, and FIG. 2B is a partially enlarged view of the vicinity of the concave portion and the adhesive layer. FIG. 3A is a plan view of a light-emitting device according to Embodiment 2 of the present invention. However, Fig.3 (a) is the state before translucent member arrangement | positioning. 3B is a cross-sectional view taken along the line AA of FIG. 3A, and FIG. 3C is a partially enlarged view of the vicinity of the recess and the adhesive layer. FIG. 4A is a schematic diagram showing a manufacturing process according to the first embodiment of the present invention. FIG. 4B is a partially enlarged view of the vicinity of the recess and the adhesive layer. FIG. 5 is a cross-sectional view of the light emitting device taken along the dotted line in FIG. 6A to 6E are partial enlarged views of the vicinity of the concave portion and the adhesive layer of the light emitting device according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are merely illustrative examples, and are not intended to limit the scope of the present invention unless otherwise specified. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. Similarly, the embodiments described below can be applied by appropriately combining the components and the like unless otherwise specified.

<Embodiment 1>
FIG. 1A is a plan view of a light emitting device according to Embodiment 1 of the present invention. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 1C is a partially enlarged view of the vicinity of the recess and the adhesive layer. The light emitting device 100 of the example shown in FIG. 1 mainly includes a light emitting element 1, a conductive wiring 2, a covering member 3, a translucent member 5, an adhesive layer 6 that bonds the covering member and the translucent member, Consists of The light emitting element 1 is flip-chip mounted on the conductive wiring 2. Further, a covering member 3 that covers the side surface so as to expose the light emitting surface of the light emitting element 1 and has the concave portion 4 on the upper surface that contacts the translucent member 5 is disposed. At least a part of the light emitting surface of the light emitting element and the upper surface of the covering member other than the recess are substantially on the same surface. Furthermore, the translucent member 5 continuously covers the upper surfaces of the light emitting element 1 and the covering member 3 in the light emitting direction, and the end surfaces of the covering member 3 and the translucent member 5 are formed on substantially the same plane. Has been. In the present embodiment, the translucent member 5 contains a phosphor capable of converting the wavelength of at least part of light emitted from the light emitting element, and the covering member 3 contains a light reflective material.

  The adhesive layer 6 is disposed at least in the recess 4, and at least a part of the translucent member 5 and the covering member 3 is bonded by the adhesive layer 6 a in the recess. That is, the recess 4 and the translucent member 5 are not completely fitted, and the recess adhesive layer 6a is replenished in at least a part of the gap between the two members. The adhesive layer 6 is only required to be disposed at least in the recess 4, but in the first embodiment, the adhesive layer 6 b is also provided on the upper surface of the light emitting element and the covering member around the recess.

  As described above, the light-emitting device of the present invention includes a light-emitting element, a covering member that covers at least a part of the light-emitting surface of the light-emitting element and covering the side surface of the light-emitting element, and the light-emitting element and the covering member. The upper surface in the light emitting direction includes a translucent member having an end surface substantially flush with the end surface of the covering member, and an adhesive layer provided at least in the concave portion. At least a part of the member and the covering member is bonded. According to the configuration of the present invention, the translucent member and the covering member are bonded to each other by the adhesive layer of the concave portion, so that the covering member and the translucent member having the same end face are obtained without increasing the thickness of the light emitting device. Can be prevented from peeling. In particular, in the case where it is difficult to ensure the adhesion between the two members, such as disposing a hard translucent member in a relatively deep recess, the adhesion can be effectively improved. Furthermore, since the thickness of the adhesive layer (the separation distance between the light emitting element and the translucent member) can be adjusted by the recess, the light extraction efficiency or wavelength conversion efficiency of the emitted light from the light emitting element can be maintained.

  Next, each component of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
The light-emitting element 1 can be a known one, specifically a semiconductor light-emitting element. Particularly, when a GaN-based compound semiconductor is used for the light-emitting element structure, short-wavelength visible light or ultraviolet light that can efficiently excite the phosphor can be emitted. It is. A specific emission peak wavelength is about 240 nm to 560 nm, preferably about 380 nm to 470 nm. In addition, ZnSe-based, InGaAs-based, and AlInGaP-based semiconductor light emitting devices may be used.

(Light emitting element structure)
The light emitting element structure with a semiconductor layer is preferably composed of at least a first conductivity type (n-type) layer and a second conductivity type (p-type) layer and having an active layer therebetween. In addition, the electrode structure is preferably the same surface side electrode structure in which both the first conductivity type and the second conductivity type electrodes are provided on one main surface side, but the electrodes are provided to face each main surface of the semiconductor layer. A counter electrode structure may be used. In the same-surface electrode structure, flip-chip mounting is preferable in which the electrode formation surface is a mounting surface and the substrate side facing it is a main light emitting surface. When flip chip mounting is used, there is no electrode or wire on the surface of the light emitting element facing the phosphor layer, so that light extraction efficiency is good. Performance can be ensured and the mounting area can be reduced. Note that the growth substrate of the semiconductor layer may be removed, and a structure in which, for example, a conductive substrate or another translucent member or a substrate is bonded to the semiconductor layer from which the growth substrate has been removed may be employed. The growth substrate can be removed by peeling, polishing, or LLO (Laser Lift Off) while mounted or held on a support, an apparatus, or a submount. In addition, the light emitting element can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer facing each other, the other main surface facing the light emitting surface is the light reflecting side, and this light A light reflection structure is provided in the semiconductor layer on the reflection side or in an electrode. Examples of the light reflecting structure include a structure in which a multilayer reflective layer is provided in a semiconductor layer, or a structure in which an electrode having a highly light reflective metal film such as Ag or Al, a dielectric multilayer film, or a reflective layer is provided.

  An example of the light-emitting element 1 in FIG. 1 will be described. In the light-emitting element 1, an n-type semiconductor layer that is a first nitride semiconductor layer, a light-emitting layer that is an active layer, and a p-type semiconductor layer that is a second nitride semiconductor layer are sequentially formed on a light-transmitting sapphire substrate. Are stacked. An n-type pad electrode, which is a first electrode, is provided in a part of the n-type layer that is exposed, and a light-reflecting conductive layer such as Ag or the like is formed on almost the entire surface of the p-type layer. A p-type pad electrode as a second electrode is provided, a protective film is provided as an n-type, and a surface of the p-type pad electrode is exposed to cover the semiconductor layer. As the substrate of the light emitting element, an insulating substrate such as sapphire, or a semiconductor conductive substrate such as silicon carbide, Si, ZnS, ZnO, GaN, or AIN can be used. In the case where the substrate of the light emitting element serves as a light emitting surface, it is preferable that the substrate is light transmissive such as sapphire or SiN.

(Coating member)
The covering member 3 covers the side surface of the light emitting element 1 as shown in FIG. More specifically, the light emitting surface of the light emitting element 1 is exposed and covered so that the side surface of the light emitting element is embedded. That is, at least a part of the light emitting surface of the light emitting element 1 and the upper surface other than the concave portion of the covering member are substantially on the same surface, and the heights of both are substantially equal. However, they may not be completely the same height, and may have a slight height difference of about 10 to 30 μm. As shown in FIG. 2A, the covering member 3 may not cover all the side surfaces of the light emitting element 1.

  The covering member 3 has a recess 4 on the upper surface of the light emitting element in the light emitting direction. The recess 4 is not a gentle curve over the entire surface of the covering member 3, but a recess (such as a hole or groove formed on the upper surface of the covering member 3 that is substantially flush with the light emitting surface of the light emitting element 1). For example, the depth is about 30 to 70 μm, more preferably about 50 μm). To completely fit (adhere) the translucent member 5 to such a relatively deep recess, a flexible translucent member that is easily deformed is used, or the translucent member and the recess are Although it is necessary to form the convex part which fits, it is easy to join both members because a concave part has the contact bonding layer 6a, and adhesiveness can be ensured.

  The thickness of the adhesive layer can be adjusted by the recess 4. More specifically, when the adhesive layer is provided only in the concave portion and adhered to the translucent member, peeling of the translucent member can be prevented, and the translucent member can directly cover the light emitting surface. Furthermore, even when the adhesive layer is disposed on the upper surface of the light emitting element, the extra adhesive layer on the light emitting element is caused to flow into the concave portion by the pressure when the light transmissive member is disposed, so that the light emitting element 1 and the light transmissive element are translucent. The adhesiveness of the light emitting element 1, the covering member 3, and the translucent member 5 can be improved while keeping the separation distance of the member 5 to a minimum. Therefore, the thin light emitting device 100 that can efficiently transmit or convert the wavelength of the light emitted from the light emitting element 1 can be obtained.

  From the above, it is preferable that the recess 4 is formed around the light emitting element, particularly along the light emitting element 1, which easily allows the excess adhesive layer 6 b on the upper surface of the light emitting element to flow and has a large amount of light emission and a remarkable progress of deterioration. By doing so, the adhesiveness of a structural member can be improved efficiently.

  The recesses 4 may be continuous as shown in FIG. 1A, divided, or non-uniformly distributed. Since it is not necessary to completely fit the concave portion 4 and the translucent member 5, it can be unevenly distributed in a complicated shape. As will be described later, when the adhesive layer is moved when the translucent member is disposed, the adhesive can be easily provided in the recess regardless of the shape of the recess. However, since it is necessary to provide the adhesive layer 6 in at least a part of the recess 4, the regular or periodic shape or arrangement is preferable because the adhesive layer 6 is easily arranged.

  By the way, the covering member 3 can be formed by compression molding using a mold. In that case, in order to make it easy to peel a metal mold | die, a light emitting element, and a covering member, a release sheet may be arrange | positioned between a metal mold | die, a light emitting element, and a covering member. If the concave portion of the covering member is formed using the slackness of the release sheet, the covering member and the concave portion can be formed simultaneously, which is efficient.

  When the release sheet is pressed against the light emitting element, the part of the release sheet pressed against the light emitting element and the mold is deformed and approaches the space filled with the covering member. Occurs. That is, a convex shape due to the looseness of the release sheet is formed on the surface of the substantially flat upper mold, and a concave portion is formed in the covering member by filling the covering member there. In this case, the concave portion is often along the light emitting element, but it is also possible to form a concave portion separated from the light emitting element. As described above, when a release sheet is used, it is possible to form a recess in the covering member even with an upper mold that does not have a convex shape, and the cost of mold formation and maintenance can be reduced. .

  The depth of the recess is often about twice the thickness of the release sheet, but the release sheet is twisted by using a thin release sheet and emits light in a deep recess with a relatively narrow opening surface. It is also possible to form it at a position separated from the element. Further, when a plurality of light emitting elements are arranged and the arrangement interval is narrowed (for example, about 100 to 1000 μm apart), the looseness of the release sheet pressed against the adjacent light emitting elements synergizes between the light emitting elements, Deeper recesses (for example, a depth of about 50 μm or more) are easily formed along the light emitting element.

  As shown in FIG. 2 (a), the slack of the release sheet is pressed in the direction of the light emitting element of the covering member, so that the concave portion 4 whose side surface is formed by the side surface of the light emitting element and the covering member may be formed. Is possible. Such a recess 4 is preferable because the adhesion of the three members of the light emitting element 1, the covering member 3, and the translucent member 5 can be improved even when the adhesive layer 6 is provided only in the recess 4. In addition to using the looseness of the release sheet, the concave portion can be formed in a desired position or shape by the convex structure of the upper mold, etching, cutting, blasting, or the like.

  In the first embodiment, one light-emitting element 1 having a rectangular shape in plan view is used, and a circumferential groove-shaped recess 4 is provided along the periphery of all four sides of the light-emitting element 1. The concave portion along the light emitting element indicates a state in which the concave portion 4 is in contact with the light emitting element 1 when seen in a plan view as shown in FIG. Since the recess 4 is along the entire periphery of the light emitting element, the close contact state of the covering member 3 and the translucent member 5 can be made uniform, and the emitted light from the light emitting element 1 can be transmitted uniformly. In particular, when the translucent member 5 contains a phosphor, it is possible to prevent uneven color emission. In addition, also when arrange | positioning a several light emitting element, the shape and position of the recessed part 4 are not specifically limited, What is necessary is just to be able to arrange | position the contact bonding layer 6 to at least one part.

  As a material of the covering member 3, for example, a light-transmitting base material containing a light reflective material can be used. It is preferable that the covering member 3 is a light-reflective member because the light emitted from the light-emitting element 1 can be reflected to the upper translucent member without leaking from the side surface. The covering member 3 may be composed of only a light-transmitting base material that does not have light reflectivity, and may contain a wavelength conversion member such as the phosphor described above. As long as the forming process is different, the material may be partially different from or completely the same as that of the translucent member 5. In addition, the wavelength conversion member is contained in one of the translucent member 5 and the covering member 3, and one is made translucent without containing the wavelength conversion member, thereby reducing light absorption during wavelength conversion. Thus, a light emitting device with high light extraction efficiency can be obtained.

  The substrate is, for example, a resin material, and a translucent silicone resin composition, a modified silicone resin composition, or the like can be used. In addition, an insulating resin composition having translucency such as an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition can also be used, and is excellent in weather resistance, such as a hybrid resin containing at least one of these resins. A sealing member can also be used. It is preferable that the base material is a resin as described above, because a recess can be easily formed on the upper surface of the covering member, and the controllability, sealing performance, and airtightness of the covering region (side surface of the light emitting element) can be improved. In addition, inorganic materials having excellent light resistance such as glass and silica gel can also be used. Furthermore, if the base material has high heat resistance, it can cope with heat from the light emitting element 1 and the translucent member 5. In the first embodiment, a silicone resin is used as a resin that is a base material constituting the covering member 3. Silicone resins have high heat resistance and light resistance and are preferably used.

The light reflective material has high light reflectivity, and the material is one oxide selected from the group consisting of Ti, Zr, Nb, Al, and Si, or at least one of AlN and MgF. Specifically, at least one selected from the group consisting of TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ can be used. When the light-reflective material particles are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, light absorption can be suppressed while having high light reflectivity, and refraction with the base material. This is preferable because the rate difference can be increased. The covering member 3 can also be formed of a molded body made of the light reflective material, and specifically, a porous material such as an aggregate obtained by agglomerating the particles or a sintered body. In addition, a molded body by a sol-gel method may be used.

  In the covering member 3 containing the light reflective material in the base material described above, the light leakage differs depending on the concentration of the light reflective material, and therefore, it may be appropriately adjusted according to the shape and size of the light emitting device. For example, when the width and thickness of the covering member are formed thin with a relatively small light emitting device (for example, the thickness of the light emitting device is about 50 μm or less), it is preferable to provide a high-concentration light reflecting material. On the other hand, the same particle size as that of a conventional filler or the like can be used so as to be suitable for manufacturing raw materials for the covering member 3, application, molding and the like. As an example, it is preferable that the concentration of the light reflecting material is 20 weight percent or more and the thickness of the covering member is about 20 μm or more. Within this range, productivity is good, and emission light with high brightness and high directivity can be obtained from the light exit surface. Furthermore, you may add another filler in the base material which is resin. For example, a heat conductive material can be added, heat generated by the light emitting element can be diffused efficiently, and reliability and output can be improved. Specifically, a thermal conductivity of 0.8 W / K · m or more is preferable as the thermally conductive material, and examples thereof include metal materials such as Ag and Cu, and ceramic materials such as diamond, alumina, and AlN. You may mix and contain. Further, pigments can be mixed and colored to absorb light of a specific wavelength.

  Although the covering region of the covering member 3 is as described above, it is preferable that the covering member 3 is also provided between the light emitting element and the pair of conductive wirings. More specifically, it is provided so as to fill a space between the p-pad electrode, the n-pad electrode and the conductive adhesive on the bottom surface of the light-emitting element 1 mounted with flip chip. Thereby, it is possible to insulate the pair of conductive wirings, further improve the light extraction efficiency and the wavelength conversion efficiency, and improve the heat dissipation.

(Adhesive layer)
The adhesive layer 6 is provided on at least a part of the recess, and at least a part of the translucent member 5 and the covering member 3 is bonded by the adhesive layer 6a of the recess. As a material, a translucent resin that can effectively guide the emitted light from the light emitting element 1 to the transmissive member side and optically connect both members is preferable. Furthermore, light extraction can be improved when the member has a lower refractive index than a member (for example, sapphire) used as a substrate (light emitting surface) of the light emitting element. As an example, a resin used for each of the above-mentioned members, and a silicone resin as an example is preferable. In order to maintain the thickness of the light emitting device and the light extraction efficiency, it is most preferable that the adhesive layer 6 is not disposed on the upper surface of the light emitting element or is formed thin with a minimum amount.

  The adhesive layer 6a of the recess is formed on the inner wall surface of the recess. The state in which at least a part of the translucent member 5 and the covering member 3 is adhered by the adhesive layer 6a of the recess is that the recess 4 and the translucent member 5 are bonded via the adhesive layer 6a of the recess. It refers to the state that part is also part. 6A, when the concave portion is filled with the adhesive layer 6 (the lower surface of the translucent member is a substantially flat surface), the adhesive layer 6 on the opening surface of the concave portion and the translucent property. When the member 5 is at least partially bonded, and the adhesive layer 6 overflows from the recess as shown in FIG. 6B (the lower surface of the translucent member has a concave shape), the adhesive layer 6 It is sufficient that at least a part of the upper surface (specifically, an adhesive layer integrated with the adhesive layer in the recess) and the translucent member 5 are adhered. In any case, the adhesive layer 6 may be bonded to such an extent that the adhesion between the translucent member 5 and the covering member 3 is improved.

  It is not always necessary to join between the adhesive layer 6a of the recess and the translucent member 5, and there may be a gap 7 as shown in FIG. Further, the adhesive layer 6 may be provided not only on the recess 4 but also on the upper surface of the covering member 3 other than the light emitting element 1 and the recess. By doing so, the adhesiveness of the light emitting element 1 and the translucent member 5 improves, and deterioration of the translucent member 5 on a light emitting element can be relieved. The state where the adhesive layer 6 extends over the upper surface of the light emitting element means that the adhesive layer 6b is arranged not only on the concave adhesive layer 6a as shown in FIG. In this case, the adhesive layer is disposed on the entire upper surface of the light emitting element 1 and the covering member 3 as shown in FIG. Note that the adhesive layer 6 does not necessarily have to be integrally formed inside and outside the recess, and may be arranged in an unevenly divided manner as shown in FIG.

  Although the concave portion depends on the fitting property of the translucent member, it is easy and sure if a wide range (for example, an area of about 50% or more in plan view) is covered or filled with the adhesive layer 6a of the concave portion. It can be bonded to the translucent member 5 and is preferable. In particular, it is preferable that the recess along the light emitting element is filled with an adhesive layer because the light extraction efficiency from the light emitting element is good. The adhesive layer may be provided as appropriate between other members or on the optical path.

  When the adhesive layer 6 is provided in addition to the concave portion 4, the concave adhesive layer 6a is formed to be thicker than other portions. The thickness of the adhesive layer in the recess is basically the thickness of the adhesive layer from the bottom of the recess to its upper surface, as shown in A of FIG. 1 (c) and FIG. 6 (c). As shown in FIG. 6D, when the adhesive layer is divided in the concave portion or formed with a non-uniform thickness, at least a part of the adhesive layer is formed thicker than the adhesive layer other than the concave portion. Good. The thickness of the adhesive layer on the upper surface of the light emitting element is defined as the thickness of the adhesive layer from the light emitting surface of the light emitting element to the upper surface thereof as shown in FIG. For example, when the thickness A of the adhesive layer 6a in the recess of FIG. 1C is about 30 to 70 μm, the thickness B of the adhesive layer 6b on the top surface of the light emitting element can be a thin film of about 1 to 10 μm.

  The adhesive layer can also be arranged as shown in FIG. That is, the adhesive layer 56 covers substantially the entire light emitting surface of the light emitting element 51 continuously from a part of the recess 54 along the light emitting element 51. In other words, when the transparent member of the completed light emitting device is transmitted from the upper surface, the adhesive layer 56 is disposed integrally and its area is larger than the upper surface of the light emitting element 51. In this way, the light-transmitting adhesive layer is disposed so as to cover at least part of the end portion of the light emitting element from the recess, so that the light emitted from the light emitting element 51 is also emitted from the adhesive layer of the recess. Become. Therefore, in the light-emitting device using the light-reflective coating member 53, the adhesive layer is not arranged so as to cover the light-emitting element, or compared with the case where the adhesive layer in the recess and the adhesive layer applied to the light-emitting element are separated. Thus, the light emitting area of the light emitting device is enlarged in a pseudo manner.

  The adhesive layer 6 as described above may be formed by adjusting the thickness in advance (thickly disposed in the concave portion and thinly disposed on the upper surface of the covering member other than the light emitting element and the concave portion), or the translucent member 5 is disposed. You may form using the pressure when doing. The pressure when the translucent member 5 is disposed is a pressure applied to the light emitting element and the covering member when the translucent member 5 is disposed. If this pressure is used, the excess adhesive layer 6 on the upper surface of the covering member 3 other than the light emitting element 1 and the concave portion is allowed to flow into the concave portion 4 or is disposed only in the concave portion 4 due to the convex shape of the lower surface of the translucent member. The adhered layer 6 can be crawled up on the upper surface of the covering member 3 other than the light emitting element 1 and the recess. Therefore, if the rough application amount and application position of the adhesive layer are adjusted, the thickness of the adhesive layer 6 can be adjusted simultaneously with the arrangement of the translucent member 5.

  The application method is not particularly limited, such as ejection using a dispenser or spin coating using a spin coater. When a spin coater is used, a wide range can be efficiently applied. However, in the present invention, it is necessary to adjust the application amount and application position of the adhesive layer 6 to some extent, so that ejection by a dispenser is also preferably used. The viscosity of the material of the adhesive layer is preferably low, and is preferably about 10 to 1000 mPa · s. By setting it to a low viscosity, it can be applied using a spin coater, and an excess adhesive layer on the upper surface of the covering member other than the light emitting element and the recesses can easily flow into the recesses 4.

(Translucent member)
The light emitting device 100 of FIG. 1 includes a light transmissive member 5 that transmits at least part of light from the light emitting element 1 on the upper surface of the light emitting element 1 and the covering member 3. At least a part of the translucent member 5 is adhered to the covering member 3 by the adhesive layer 6 of the recess 4, but the portion where the adhesive layer 6 is not disposed directly covers the upper surfaces of the light emitting element 1 and the covering member 3. Cover.

  The shape of the translucent member 5 is not particularly limited as long as the end surface thereof is substantially on the same plane as the end surface of the covering member and the lower surface thereof is at least partially bonded to the adhesive layer 6a of the recess. However, it is preferable that the concave portion 4 has a shape in which a part of the concave portion 4 enters, that is, has a convex shape downward in a region in contact with the concave adhesive layer 6a, because the concave layer 4a can be easily adhered. Further, when the translucent member has a convex shape on the lower surface, the upper surface, which is the back surface thereof, is gently depressed by the convex shape as shown in the partial enlarged view of FIG. When the layers are laminated in a flexible state, the lower surface of the translucent member may be deformed along the recesses and the adhesive layer of the covering member below the translucent member. A state in which the concave portion of the covering member is filled with the adhesive layer is preferable because the lower surface of the translucent member is substantially flat and emitted light is easily emitted uniformly.

  The light-transmitting member 5 is a thin light-emitting device with better light extraction efficiency when the distance from the light-emitting surface of the light-emitting element 1 is closer (the light-transmitting member directly covers the light-emitting surface of the light-emitting element). 100. Furthermore, it is preferable that the translucent member 5 contains a wavelength conversion member such as a phosphor as in the present embodiment because wavelength conversion can be performed efficiently.

  The number of the light-emitting elements 1 to be bonded to the translucent member 5 is not particularly limited, and may be one or more. A plurality of beams are preferable because the amount of light flux can be increased. In the case of a plurality, it is easy to obtain a preferable light distribution if they are arranged regularly or periodically such as in a line or a lattice at equal intervals.

  As the material of the translucent member 5, for example, glass, an inorganic material, a resin, or the like can be used. Specifically, a glass plate, a single crystal body, a polycrystal body, an amorphous body, a ceramic body, etc. are mentioned. In addition, it is composed of a sintered body, an aggregate, a porous body, a material in which a light-transmitting member such as a light-transmitting resin is mixed and impregnated, a molded body of the light-transmitting resin, and the like.

  From the viewpoint of heat resistance, the translucent member 5 is preferably an inorganic material such as glass rather than an organic material such as resin. In the present invention, since the translucent member 5 does not have to be completely fitted to the recess 4 of the covering member by the adhesive layer 6, it is relatively hard (for example, an elastic modulus of about 10 MPa or more) and has high heat resistance. The sex member 5 can be used. In other words, a highly reliable hard translucent member (for example, glass or ceramic, a sintered body of phosphor described later) is difficult to fit into the recess and has low adhesiveness, but the adhesive layer 6 is in the recess. By being, adhesiveness with the coating | coated member 3 is securable. For example, the lower surface of the desired sintered body is processed so that at least a part thereof is bonded to the adhesive layer 6a of the recess, and is disposed on the upper surfaces of the light emitting element 1 and the covering member 3, so that there is little deterioration over time. A long-life light emitting device 100 can be obtained.

  Further, as the material of the translucent member 5, a resin that can be easily deformed into a desired shape may be used. For example, if it is set as the sheet-like translucent member 5 comprised with a silicone resin, when it arrange | positions on the upper surface of the coating | coated member 3 in a semi-hardened flexible state (for example, elastic modulus about 1 MPa or less), it will become the shape of the recessed part. Therefore, the translucent member 5 and the adhesive layer 6 of the recess can be easily joined. When it is a translucent member having adhesiveness such as a sheet-like resin, it is easy to ensure adhesion with the covering member. In addition, it may be laminated as a film, or may be appropriately formed by spraying, potting, printing or the like.

  Although the translucent member 5 may be comprised only with said material, it contains the fluorescent substance which can carry out wavelength conversion of at least one part of the emitted light from the light emitting element 1 like this embodiment. The desired emission color can be obtained. In this case, the translucent member 5 becomes a base material containing a phosphor. Moreover, the translucent member 5 may be comprised only with fluorescent substance.

  The phosphor is, for example, a nitride-based phosphor / oxynitride-based phosphor mainly activated by a lanthanoid element such as europium or cerium, more specifically, an α or β sialon type phosphor activated by europium Bodies, various alkaline earth metal nitride silicate phosphors, lanthanoid elements such as europium, alkaline earth metal halogenapatite phosphors mainly activated by transition metal elements such as manganese, alkaline earth halosilicate phosphors, Alkaline earth metal silicate phosphor, alkaline earth metal halogen borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkali Rare earths mainly activated by lanthanoid elements such as earth metal silicon nitride, germanate, cerium Examples thereof include organic substances and organic complexes mainly activated by lanthanoid elements such as minates, rare earth silicates, and europium. In addition to the above, a phosphor having similar performance and effects can be used. Thus, a light emitting device that emits mixed light (for example, white light) of primary light and secondary light having a visible wavelength, or a light emitting device that emits visible light secondary light when excited by the primary light of ultraviolet light is used. Can do. The phosphor can be provided not only in the translucent member but also between the light emitting element 1 and the covering member 3 in an adhesive interposed between the constituent members, for example.

  As the translucent member 5 containing a phosphor, a material containing the above-described material as a base material and containing the phosphor can be used. For example, a hard translucent member such as phosphor-containing ceramic, phosphor glass, or phosphor sintered body is preferably used, but a flexible translucent member 5 such as a phosphor sheet can also be used.

(Mounting board)
The mounting substrate is a substrate on which a light emitting element is mounted and is electrically connected. Examples of the mounting substrate include a substrate having a conductive wiring on a support substrate and a substrate made of only a conductive wiring. Furthermore, the mounting substrate consisting only of conductive wiring initially has a supporting substrate, but it is peeled off during the manufacturing process and finally becomes only conductive wiring, and one that is formed only from conductive wiring from the beginning ( For example, it is classified into a lead electrode and the like. In any case, a conductive adhesive such as solder, Ag paste, or Au bump may be used for mounting with the light emitting element.

First, a mounting substrate having conductive wiring on a support substrate will be described in detail. The conductive wiring on the support substrate is formed of a metal layer such as Au, Cu, or Al, and two or more layers of different metals may be stacked. The thickness of the conductive wiring is not particularly limited, but is preferably about 1 to 50 μm. The support substrate is preferably formed of a material having low light transmittance. Specific examples include ceramics (Al ₂ O ₃ , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA). Moreover, the metal substrate which formed the insulating layer on the surface may be sufficient. A mounting substrate having conductive wiring on the support substrate as described above is preferable because light emitted from the light-emitting element is less likely to escape below the substrate and the light extraction efficiency of the light-emitting device is improved. Therefore, when the conductive wiring is a thin film of about several μm, or when the covering member does not have light reflectivity, it is suitably used for preventing light leakage.

  Next, a mounting substrate made of only conductive wiring will be described. When the support substrate is removed during the manufacturing process, the conductive wiring is made of a metal such as Cu, Al, Au, Ag, W, Mo, Fe, Ni, Co, or an alloy thereof (Fe-Ni alloy, etc.), phosphor bronze, It is formed of Fe-containing Cu, ITO or the like. The film thickness is preferably about 25 to 200 μm, for example, and more preferably about 50 to 100 μm. The conductive wiring having such a thickness is particularly preferably a plating layer laminated with plating.

  As the support substrate to be removed, in addition to a conductive metal plate such as a SUS plate, a substrate in which a conductive film is formed by sputtering or vapor deposition on an insulating plate such as polyimide can be used. Alternatively, an insulating plate member that can be attached with a metal thin film or the like may be used. Further, since it is necessary to peel off the conductive wiring, it is necessary to use a bendable member, and it is preferable to use a plate-like member having a film thickness of about 10 to 300 μm depending on the material. Examples of the material for the support substrate include a metal sheet such as Fe, Cu, Ag, Co, and Ni, and a resin sheet made of polyimide to which a metal thin film can be attached, in addition to the SUS. In this manner, since there is no supporting substrate and the conductive wiring forms the outer surface of the light emitting device 100, a small light emitting device can be obtained.

  Here, it is preferable to control the difference between the linear expansion coefficients of the conductive wiring and the covering member to be small. The difference is preferably about 40% or less, more preferably about 20% or less. Thereby, peeling of a conductive wiring and a coating | coated member can be suppressed and it can be set as the light-emitting device excellent in reliability. Further, it is preferable that the difference in coefficient of linear expansion between the covering member and the support substrate to be removed is smaller. The difference is preferably about 30% or less, more preferably about 10% or less. When a SUS plate is used as the support substrate finally removed, the difference in linear expansion coefficient is preferably about 20 ppm or less, more preferably about 10 ppm or less. Thereby, the residual stress of a coating | coated member and a SUS board can be relieved, and the curvature of the aggregate | assembly of the light-emitting device after SUS board peeling can be relieve | moderated. By reducing the warpage, it is possible to reduce internal damage such as cutting of the wire, and to suppress the positional deviation at the time of singulation, and to manufacture with high yield.

  An example of the mounting substrate formed only from the conductive wiring from the beginning is a lead electrode. The lead electrode material is preferably Fe, Cu, Fe-containing Cu, Ti-containing Cu, Al or the like in consideration of electric resistance. By punching such a metal flat plate, it is possible to form a lead frame having a plurality of pairs of projecting portions serving as a pair of positive and negative lead electrodes. The surface of the lead electrode is preferably coated with a metal made of Ag, Au, or Pd by plating, sputtering, or the like, since the light reflectance can be improved.

(Frame)
The light emitting device may have a frame body that holds the covering member. The frame can be formed of ceramic or resin. As the material, alumina having high light reflectivity is preferably used, but the material is not limited to this as long as a reflective film is formed on the surface. In addition, you may form by screen-printing or adhere | attaching the molded object separately shape | molded on a support substrate. The frame may be colored according to the purpose. In addition, this frame can also be removed after filling or molding the covering member. When not removed, it functions as a light reflective member. When the covering member has light reflectivity, it has the same function and may be regarded as a part of the covering member. When the frame is also considered as a part of the covering member, the end face of the translucent member is formed so as to be substantially flush with the end face of the frame.

(Method for manufacturing light emitting device)
An example of a method for manufacturing the light emitting device 100 shown in FIG. 1 will be described below with reference to FIG. As shown in FIG. 4A, bumps are formed on the light emitting element 31, and the light emitting element 31 is flip-chip mounted on the conductive wiring 32 on the support substrate via the bumps. In this example, one light emitting element 31 is mounted side by side in a region corresponding to one light emitting device 300 (however, the number of light emitting elements 31 can be changed as appropriate). The support substrate 38 is removed during the manufacturing process, and the conductive wiring is used as a mounting substrate.

(First step)
In the first step, the upper surface of the covering member 33 is formed so as to be substantially flush with the light emitting surface of the light emitting element 31, and the recess 34 is formed on the upper surface. Specifically, the light emitting surface of the light emitting element 31 is sandwiched with an upper mold, the lower surface of the support substrate is sandwiched with a lower mold, and is coated with a resin containing light reflective particles by compression molding using the mold. The member 33 is formed.

  When the mold is used as described above, the release sheet can be disposed so as to be in close contact with the upper mold. By doing so, the interference between the light emitting element and the mold is alleviated and not only the mold and the member are easily peeled, but also the release sheet is loosened in the direction of the covering member around the light emitting element by the pressure during pressing, A groove-like recess 34 along the light emitting element 31 can be formed simultaneously with the covering member 33. The concave portion 34 along the light emitting element 31 is preferable because the adhesive layer disposed on the upper surface of the light emitting element in the second step to be described later is easily flowed and held in the third step. The looseness of the release sheet increases as the pressure during pressing increases, and a deep recess can be formed. If the release sheet is used, the cost applied to the mold can be reduced, and the recess 34 along the light emitting element can be easily formed without fear of damaging the light emitting element 31.

(Second step)
In the second step, the adhesive layer 36 is disposed in at least a part of the recess 34 formed on the upper surface of the covering member 33. If the adhesive layer 36 is arranged so that the adhesive layer of the recess is at least partially bonded to the translucent member 35, the adhesive layer 36 is divided inside and outside the recess even if it is provided on the upper surface of the covering member other than the recess or the light emitting element. It may be done. The adhesive layer of the light emitting device 100 of Embodiment 1 is finally formed continuously over the recess 34, the light emitting element around the recess, and a part of the upper surface of the covering member.

(Third step)
In the third step, the translucent member 35, here a relatively hard translucent member 35 containing a phosphor (for example, an elastic modulus of about 10 MPa or more) is disposed on the upper surfaces of the light emitting element 31, the adhesive layer, and the covering member 33. When a translucent member having flexibility is used, a part thereof may be deformed along the recess. As shown in FIG. 4 (b), when a non-flexible translucent member 35 is used, it is processed in advance so as to have a convex shape so that the lower surface thereof can be bonded to the adhesive layer 36 of the concave portion. You may arrange after.

  Here, due to the pressure when the translucent member 35 is disposed, a part of the adhesive layer on the upper surface of the light emitting element disposed in the second step is caused to flow into the concave portion 34 and the translucent member 35 (convex shape of the translucent member 35 to be joined) is joined. A part of the adhesive layer of the concave portion pressed by (1) is crawled up to the upper surface of the covering member other than the concave portion. Therefore, the adhesive layer 36 of FIG. 4 arranged in the second step is continuously emitted from the recess 4 like the adhesive layer 6 of FIG. 1C after the translucent member is arranged. It becomes the shape over the upper surface of the covering member 3 other than the element 1 and the recess. The thickness of the adhesive layer is the thickest in the recess (about 50 μm), and the thickness of the adhesive layer on the upper surface of the covering member other than the light emitting element and the recess is about 1 μm. In this case, compared with the case where the covering member does not have a recess and the light emitting element and the upper surface of the covering member have a uniform adhesive layer of about 50 μm, the transmittance of light emitted from the light emitting element or the wavelength conversion efficiency is reduced. Without preferred.

(Fourth process)
Finally, if the support substrate 38 is peeled off from the conductive wiring 32 and diced into pieces at desired positions so that the end surfaces of the covering member 33 and the translucent member 35 are substantially on the same plane, A light emitting device 100 similar to that in FIG. 1 can be obtained. The dicing position may be in the middle of the recess as shown by the dotted line in FIG. 4A when the mounting interval of the light emitting elements is narrow or when there is a recess away from the light emitting element. In this case, it becomes the recessed part 44 as shown to the light-emitting device 300 of FIG. 5, and the recessed part becomes the shape cut | disconnected in the middle. If the concave portion is cut halfway, the adhesive layer 46 is arranged at the end portion of the light emitting device, so that peeling from the end portion of the translucent member 45 can be effectively prevented.

<Embodiment 2>
FIG. 3A is a plan view of the light-emitting device according to Embodiment 2 of the present invention, and FIG. 3B is a cross-sectional view taken along the line AA of FIG. The mounting substrate is a lead electrode 22, and a plurality of light emitting elements 21 (two in the figure) are arranged. Further, the recess 24 is formed at the same time as the covering member using a mold and a release sheet, and is relatively deep by arranging the intervals between the light emitting elements to be narrow (about 100 to 1000 μm) ( About 50 μm). Therefore, even if a translucent member (thickness of about 50 μm, elastic modulus of about 1 MPa or less), which is a phosphor sheet containing a YAG phosphor, is disposed, it is difficult to fit the concave portion 24 and the translucent member 25. The adhesive layer 26 is formed in the recess 24 to ensure adhesion. Since the translucent member 25 of Embodiment 2 is relatively soft and flexible, the upper surface side thereof is gently depressed so as to follow the concave portion of the covering member.

  The adhesive layer 26 is formed on substantially the entire upper surface of the light emitting element 21 and the covering member 23, and the thickness of the adhesive layer 26a in the recess is thicker than the adhesive layer 26b on the upper surface of the covering member other than the light emitting element and the recess, It is thickest near the bottom of the recess. Such an adhesive layer 26 is formed by the flow of at least a part of the adhesive layer 26b other than the concave portion out of the adhesive layer formed on the entire top surface of the light emitting element and the covering member with a spin coater or the like. It is formed. Except for the above-described configuration and formation method, the second embodiment is substantially the same as the first embodiment.

  In the light emitting device 200 of the second embodiment, since there are a plurality of light emitting elements 21, not only the amount of light flux is large, but also a concave portion due to the looseness of the release sheet can be formed deeply, so that a large number of adhesive layers can be held. Furthermore, the adhesive layer 26 over the entire upper surface of the light emitting element 21 and the covering member 23 can be formed relatively easily by spin coating or the like, and also has good adhesion due to its wide adhesion range. Moreover, since the translucent member 25 has flexibility at the time of arrangement | positioning, it is easy to make it adhere | attach with the contact bonding layer 26a of a recessed part.

<Example 1>
Hereinafter, a process of forming the light emitting device 200 of Example 1 will be described. First, a lead frame constituting a plurality of pairs of positive and negative lead electrodes is prepared. Here, a lead frame made of a Cu alloy containing Cu as a main component is used.

  In Example 1, a light emitting element 1 having a substantially rectangular light emitting shape (emission wavelength: about 455 nm, thickness: about 0.8 mm × 0.3 mm) is formed on a plurality of pairs of positive and negative lead electrodes spaced apart from each other. 120 μm) is flip-chip mounted.

Subsequently, a lead frame on which a plurality of light emitting elements are mounted is sandwiched in a mold composed of an upper mold and a lower mold, and the covering member 3 is formed by compression molding or the like. At this time, the release sheet is disposed so as to be in close contact with the upper mold, and then the covering member is filled. The release sheet has a thickness of about 50 to 100 μm, and ETFE (tetrafluoroethylene (C ₂ F ₄ ) and ethylene (C ₂ H ₄ )) are used in consideration of thermal durability, wettability, low cost, and the like. Polymer). The heating temperature, the heating time, the pressure, the thickness of the release sheet, and the like by the mold can be appropriately adjusted depending on the composition of the resin to be used, the desired recess of the covering member, and the like.

In Example 1, a covering member made of a silicone resin containing a light-reflecting material which is a fine particle of TiO _{2 having} a particle diameter of about 270 nm at a concentration of about 23 weight percent is formed. The covering member is formed so as to cover all the side surfaces of the light emitting element 1 and to expose the light emitting surface at substantially the same height (about 120 μm) as the light emitting element 1, and between the pair of electrodes and below the light emitting element 1. Is also provided. Further, a concave portion 4 along the light emitting element 1 is provided on the upper surface in the light emitting direction of the covering member due to the loosening of the release sheet deformed to the region where the covering member is formed by the press pressure of the mold. Specifically, the slack is convex when the release sheet in the region in contact with the light emitting element approaches the space before filling the covering member made of silicone resin, and the concave portion is filled with the covering member. Formed simultaneously. The concave portion is not a gentle curve over the surface of the covering member, but is provided in a groove shape (depth of about 50 μm and width of about 100 μm or less) along the entire periphery of the light emitting element.

  Next, a silicone resin is applied with a dispenser to the formed recess 4 and the upper surface of the light emitting element around it, and the adhesive layer 6 is disposed. Subsequently, the exposed surface of the light emitting element 1, the adhesive layer 6, and the upper surface of the covering member 3 are covered with glass (thickness: about 150 μm) containing the YAG phosphor that is the translucent member 5. A part of the adhesive layer on the upper surface of the light emitting element flows into the concave portion 4 by the pressure when the translucent member 5 is arranged, and a part of the adhesive layer in the concave portion crawls up to the upper surface of the covering member 3 other than the concave portion. . Finally, the adhesive layer 6 is continuously formed on the upper surface of the concave portion 4, the light emitting element 1 around the concave portion 4, and the covering member 3. The thickness of the concave portion 4 is greater than that of the light emitting element 1 and the upper surface of the covering member other than the concave portion, the thickness of the adhesive layer in the concave portion is about 50 μm, and the thickness of the adhesive layer on the upper surface of the light emitting element is about 1 μm. Subsequently, the adhesive layer is thermally cured using an oven or the like, and the covering member and the light transmissive member are fixed.

  Thereafter, the light emitting device 200 having a substantially rectangular thickness of about 0.36 mm is obtained by dicing so that the shape in plan view is about 2.2 mm × 0.5 mm and includes one light emitting element in the center.

  The light emitting device of the present invention can be suitably used for backlight light sources such as illumination light sources, LED displays, liquid crystal display devices, traffic lights, illumination switches, various sensors, various indicators, and the like.

100, 200, 300 ... Light-emitting devices 1, 21, 31, 41, 51 ... Light-emitting elements 2, 32, 42 ... Conductive wiring 22 ... Lead electrodes 3, 23, 33, 43, 53 ... Cover members 4, 24, 34, 44, 54 ... concave portions 5, 25, 35, 45 ... translucent members 6, 26, 36, 46, 56 ... adhesive layers 6a, 26a concave adhesive layers 6b, 26b ... top surfaces of light-emitting elements and covering members other than concave portions Adhesive layer A ... Recessed adhesive layer thickness B ... Light-emitting element or adhesive layer thickness 7 on the upper surface of the covering member other than the recessed part 7 ... Gap 38 ... Support substrate

Claims (8)

A light emitting element; a covering member that covers a side surface so as to expose a light emitting surface of the light emitting element; and an upper surface of the light emitting element and the covering member in a light emitting direction that is substantially flush with an end surface of the covering member. A light-emitting device comprising: a translucent member having an end surface; and an adhesive layer that adheres the covering member and the translucent member,
The covering member has a recess on the upper surface,
The adhesive layer is provided at least in the recess and extends over the top surface of the light emitting element,
The thickness of the adhesive layer of the recess is thicker than the thickness of the adhesive layer on the upper surface of the light emitting element,
At least a part of the translucent member and the covering member is bonded by the adhesive layer of the recess. The light-emitting device according to claim 1, wherein the translucent member contains a phosphor. A light emitting element, a covering member covering a side surface so as to expose a light emitting surface of the light emitting element, and a front
The upper surface of the light emitting element and the covering member in the light emitting direction is substantially flush with the end surface of the covering member.
A translucent member having an upper end surface; and an adhesive layer that adheres the covering member and the translucent member;
A light emitting device comprising:
The covering member has a recess on the upper surface,
The adhesive layer is provided at least in the recess,
By an adhesive layer before Symbol recess, at least a portion of the covering member and the translucent member is bonded,
In the recess, the light - emitting devices characterized in that the translucent member is arranged. The translucent member, the light emitting device according to claim 1 or 2, characterized in that the lower surface is substantially flat. The recess, the light emitting device according to any one of claims 1 to 4, characterized in that along said light emitting element. A light-emitting element; a covering member that covers a side surface of the light-emitting element; a translucent member on an upper surface of the light-emitting element and the covering member in a light emitting direction; and an adhesive that bonds the covering member and the translucent member A method of manufacturing a light emitting device comprising a layer,
Forming a top surface of the covering member so as to be substantially flush with a light emitting surface of the light emitting element, and forming a recess on the top surface;
A second step of disposing the adhesive layer in at least the recess;
A third step of forming the translucent member so that at least a part of the translucent member adheres to the adhesive layer of the recess;
And a fourth step of cutting the end faces of the covering member and the translucent member so as to be substantially on the same plane. The method for manufacturing a light emitting device according to claim 6 , wherein the adhesive layer is formed so as to be thicker than an upper surface of the light emitting element in the concave portion. The method for manufacturing a light-emitting device according to claim 6 or 7 , wherein in the third step, the translucent member is disposed after being processed in advance into a shape in which at least a part thereof is in contact with the adhesive layer of the recess.

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