JP6164148B2 - Power supply - Google Patents

Description

  The present invention relates to a power supply device including a transformer.

  Some power supply devices such as a DC-DC converter include a transformer having a primary coil and a secondary coil. The transformer has a plurality of lead terminals drawn from the primary coil and the secondary coil, and is connected to other components at the lead terminals. As a configuration of such a transformer, for example, Patent Document 1 discloses a configuration in which extraction terminals of a primary coil and a secondary coil are drawn from the same side of the transformer. As a result, the plurality of lead terminals can be concentrated on the same side of the transformer, and the power supply device can be easily downsized.

JP 2012-164928 A

  However, when a plurality of lead terminals are pulled out from the same side of the transformer, the distance between the plurality of lead terminals can be easily approached. Therefore, depending on how the lead terminals are arranged, it is difficult to sufficiently secure insulation between the plurality of lead terminals of the transformer.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power supply device that can easily be reduced in size while ensuring insulation between a plurality of lead terminals in a transformer.

One aspect of the present invention is a transformer having a primary coil and a secondary coil;
A primary-side semiconductor component constituting a primary-side circuit connected to the primary coil side of the transformer;
A secondary side semiconductor component constituting a secondary side circuit connected to the secondary coil side of the transformer;
A choke coil connected to the secondary semiconductor component;
A base plate on which the transformer, the primary side semiconductor component, the secondary side semiconductor component, and the choke coil are mounted,
A plurality of lead terminals respectively drawn from the primary coil and the secondary coil are drawn from the same side of the transformer,
At least one of the plurality of lead terminals is offset in the lateral direction perpendicular to both the lead direction and the axial direction of the transformer with respect to at least one other lead terminal, and also in the axial direction. It ’s out of place ,
The primary semiconductor component or the secondary semiconductor component is a laminated semiconductor component laminated adjacent to the transformer in the axial direction,
Of the plurality of lead terminals, a lead terminal connected to the multilayer semiconductor component is disposed closer to the multilayer semiconductor component in the axial direction than the other lead terminals. In the device.

  In the power supply device, a plurality of lead terminals respectively drawn from the primary coil and the secondary coil are drawn from the same side of the transformer. As a result, the plurality of lead terminals can be concentrated on the same side of the transformer, and the power supply device can be easily downsized.

  At least one of the plurality of lead terminals is shifted in the lateral direction and also in the axial direction with respect to at least one other lead terminal. Thereby, it is easy to ensure a wide interval between the plurality of lead terminals. As a result, sufficient insulation between the lead terminals can be ensured. That is, the configuration in which the plurality of lead terminals are pulled out from the same side of the transformer is also a configuration in which the plurality of lead terminals are easily accessible. However, by disposing at least one of the plurality of extraction terminals in the axial direction and the lateral direction with respect to at least one other extraction terminal, it becomes easy to secure a distance between the extraction terminals. Insulation between the lead terminals can be ensured.

  As described above, according to the present invention, it is possible to provide a power supply device that can easily be miniaturized while ensuring insulation between a plurality of lead terminals in a transformer.

FIG. 3 is an explanatory diagram of the power supply device viewed from a direction parallel to the base plate in the first embodiment. FIG. 3 is an explanatory diagram of the power supply device viewed from a direction perpendicular to the base plate in the first embodiment. FIG. 3 is a front view of a transformer in the first embodiment. FIG. 3 is a side view of a transformer in the first embodiment. FIG. 3 is a plan view of a transformer in the first embodiment. 1 is a circuit diagram of a power supply device according to Embodiment 1. FIG. Explanatory drawing which shows the state which arranged the some extraction terminal in the horizontal direction, without shifting in an axial direction. The front view of a transformer in Example 2. FIG. Explanatory drawing of the power supply device seen from the direction parallel to a baseplate in Example 3. FIG. Explanatory drawing of the power supply device seen from the direction perpendicular | vertical to a baseplate in a reference example . Explanatory drawing of arrangement | positioning of several extraction terminal in Example 4. FIG. Explanatory drawing of other arrangement | positioning of the several extraction terminal in Example 4. FIG.

The power supply device can be, for example, a DC-DC converter that steps down high-voltage DC power from a DC power supply and converts the voltage to low-voltage DC power. The power supply device can be mounted on, for example, an electric vehicle or a hybrid vehicle.
In this specification, “axial direction” means the axial direction of the transformer unless otherwise specified, and means the direction of the winding axis of the primary coil and the secondary coil that constitute the transformer. Unless otherwise specified, the “drawing direction” means the drawing direction of the drawing terminal from the transformer, and the “lateral direction” means a direction orthogonal to both the axial direction and the drawing direction.

  Moreover, it is preferable that the said extraction terminal has a cross-sectional shape where the thickness of the direction parallel to the said axial direction is smaller than the width | variety of the said horizontal direction. In this case, in particular, there is a great advantage in that at least one of the plurality of lead terminals is disposed so as to be shifted in the axial direction with respect to at least one other lead terminal. That is, when a plurality of lead terminals having the cross-sectional shape as described above are arranged in the horizontal direction, it is difficult to secure a distance between adjacent lead terminals in the horizontal direction. Therefore, as described above, the space in the width direction of the lead terminals is secured by shifting at least one lead terminal in the axial direction, that is, the thickness direction of the lead terminals with respect to the other lead terminals. The distance can be secured.

  Further, when viewed from the axial direction, the plurality of lead terminals are preferably arranged side by side in the lateral direction. In this case, the distance between the plurality of lead terminals can be efficiently ensured by effectively using the space in the horizontal direction.

  Moreover, it is preferable that the said drawing terminals adjacent to the said horizontal direction seeing from the said axial direction are mutually arrange | positioned in the said axial direction. In this case, the distance between the lead terminals adjacent in the horizontal direction can be more effectively ensured.

Example 1
An embodiment of the power supply apparatus will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power supply device 1 of this example includes a transformer 2, a primary side semiconductor component 3, a secondary side semiconductor component 4, a choke coil 5, and a base plate 6.
As shown in FIG. 3, the transformer 2 includes a primary coil 21 and a secondary coil 22. As shown in FIG. 6, the primary side semiconductor component 3 constitutes a primary side circuit connected to the primary coil 21 side of the transformer 2. The secondary side semiconductor component 4 constitutes a secondary side circuit connected to the secondary coil 22 side of the transformer 2. The choke coil 5 is connected to the secondary semiconductor component 4. As shown in FIGS. 1 and 2, the base plate 6 is mounted with a transformer 2, a primary side semiconductor component 3, a secondary side semiconductor component 4, and a choke coil 5.

As shown in FIGS. 3 to 5, the plurality of lead terminals 23 drawn from the primary coil 21 and the secondary coil 22 are drawn from the same side of the transformer 2.
At least one of the plurality of lead terminals 23 is shifted in the lateral direction Y perpendicular to both the lead direction X and the axial direction Z of the transformer 2 with respect to at least one other lead terminal 23, and is axially Also shifted to Z.

  At least one of the lead terminals 23 extends from the base portion to the tip of the main body of the primary coil or the secondary coil, and is shifted in the lateral direction Y and the axial direction Z with respect to the other at least one lead terminal 23. Yes.

  In this example, as shown in FIG. 5, when viewed from the axial direction Z, the plurality of lead terminals 23 are arranged in the horizontal direction Y. Further, the lead terminals 23 adjacent to each other in the lateral direction Y when viewed from the axial direction Z are arranged so as to be shifted from each other in the axial direction Z as shown in FIG. As shown in FIGS. 3 and 5, when viewed from the axial direction Z, the plurality of lead terminals 23 are arranged in the lateral direction Y without overlapping each other.

  In addition, the lead terminal 23 has a cross-sectional shape in which the thickness in the axial direction Z is smaller than the width in the horizontal direction Y. More specifically, the lead-out terminal 23 is a flat conducting wire having a substantially rectangular shape in a cross-sectional shape orthogonal to the lead-out direction X, and the direction of the main surface thereof is directed in the axial direction Z. That is, the lead terminals 23 are arranged such that the width direction is the horizontal direction Y.

  3 to 5, the transformer 2 has a configuration in which a primary coil 21 and a secondary coil 22 stacked in the axial direction Z are sandwiched by cores 24 from both sides in the axial direction Z. . Further, the core 24 is also disposed on a part of the inner peripheral side and the outer peripheral side of the primary coil 21 and the secondary coil 22. The core 24 has a substantially rectangular parallelepiped shape, and the outer shape of the transformer 2 also has a substantially rectangular parallelepiped shape. A plurality of lead terminals 23 protrude in the same direction from one surface of the substantially rectangular parallelepiped shape.

  1 and 2, the transformer 2 is disposed on the base plate 6, but the winding axis direction of the primary coil 21 and the secondary coil 22 of the transformer 2 is the normal direction of the base plate 6. So that it is arranged. That is, in this example, the axial direction Z is the normal direction of the base plate 6.

  As shown in FIG. 3, at least one of the secondary lead terminals 232 that are the lead terminals 23 drawn from the secondary coil 22 is more than the primary lead terminal 231 that is the lead terminal 23 drawn from the primary coil 21. The base plate 6 is disposed at a position close to the base plate 6. In this example, all of the secondary lead terminals 232 are arranged at a position closer to the base plate 6 than the primary lead terminals 231.

  As shown in FIGS. 1 and 2, the power supply device 1 includes any two of the transformer 2, the primary side semiconductor component 3, the secondary side semiconductor component 4, and the choke coil 5 in the axial direction Z. And a second laminated body 12 in which the other two are laminated in the axial direction Z. In this example, the primary side semiconductor component 3 and the transformer 2 are stacked on each other to form a first stacked body 11. In addition, the secondary semiconductor component 4 and the choke coil 5 are stacked on each other to form a second stacked body 12.

  Both the stacking direction of the first stacked body 11 and the stacking direction of the second stacked body 12 coincide with the axial direction Z of the transformer 2 and also coincide with the normal direction of the base plate 6. The first stacked body 11 is stacked such that the primary-side semiconductor component 3 is disposed between the transformer 2 and the base plate 6, and the second stacked body 12 includes the secondary-side semiconductor component 4 including the choke coil 5 and the base plate 6. Are stacked so as to be disposed between the two.

  Further, the primary DC wiring 71dc that connects the primary-side semiconductor component 3 to the DC power source and the primary AC wiring 71ac that connects the primary-side semiconductor component 3 and the transformer 2 are opposed to different surfaces of the first stacked body 11. Arranged in position. Of the plurality of lead terminals 23 of the transformer 2, two primary lead terminals 231 drawn from the primary coil 21 constitute a part of the primary AC wiring 71ac.

  Of the plurality of lead terminals 23 of the transformer 2, two of the three secondary lead terminals 232 drawn from the secondary coil 22 are connected to the transformer 2 and the secondary-side semiconductor component 4. It constitutes a part of the next AC wiring 72ac. One of the three secondary lead terminals 232 is a ground terminal 233 that is grounded and connected to the base plate 6. The lead terminal 23 (ground terminal 233) may be directly connected to the base plate 6 or may be connected to the base plate 6 through another conductive member.

  Moreover, each lead terminal 23 and the primary side semiconductor component 3 or the secondary side semiconductor component 4 are connected by welding, screw fastening, etc., for example. Moreover, each extraction terminal 23 may be directly connected to the terminal of the primary side semiconductor component 3 or the secondary side semiconductor component 4, or may be connected via another conductive member.

As shown in FIGS. 3 to 5, the secondary lead terminal 232 is drawn from the same side as the primary lead terminal 231 in the transformer 2. That is, the two primary extraction terminals 231 and the three secondary extraction terminals 232 are all extracted from the same side of the transformer 2. These lead terminals 23 are arranged in parallel to each other.
Thereby, as shown in FIGS. 1 and 2, the primary AC wiring 71ac and the secondary AC wiring 72ac can be arranged on the same side of the first stacked body 11. The primary AC wiring 71ac and the secondary AC wiring 72ac are disposed between the first stacked body 11 and the second stacked body 12.

  Further, the secondary DC wiring 72 dc connecting the secondary semiconductor component 4 and the choke coil 5 constituting the second stacked body 12, the primary AC wiring 71 ac and the secondary AC wiring 72 ac are mutually connected in the second stacked body 12. It is arranged at a position facing different surfaces.

  As shown in FIGS. 1 and 2, an output DC wiring 73 dc connected to the output terminal of the power supply device 1 extends from the choke coil 5. The output DC wiring 73 dc is arranged on the same surface side as the secondary DC wiring 72 dc in the second stacked body 12.

Further, the drawing direction X of the drawing terminal 23 from the transformer 2 is a direction parallel to the base plate 6. The base plate 6 can be made of a metal such as aluminum.

  In this example, the power supply device 1 is a DC-DC converter, which is mounted on an electric vehicle or a hybrid vehicle, for example, to step down high-voltage DC power of a DC power supply to low-voltage DC power and supply it to an auxiliary battery. Used for. That is, as shown in FIG. 6, the power supply device 1 is used by being connected between a DC power supply 131 and a load 132 (auxiliary battery or the like). And the primary side circuit comprised from the primary side semiconductor component 3 is connected to the direct-current power supply 131, and the secondary side circuit comprised from the secondary side semiconductor component 4 passes through the smoothing circuit including the choke coil 5, Connected to load 132.

  The primary side circuit constitutes a switching circuit, and the primary side semiconductor component 3 is composed of a semiconductor module incorporating a plurality of switching elements. As the switching element, for example, IGBT (insulated gate bipolar transistor) or MOSFET (MOS type field effect transistor) can be used. The primary-side semiconductor component does not necessarily need to be a semiconductor module, and may be a discrete semiconductor component, for example.

  The secondary side circuit constitutes a rectifier circuit, and the secondary side semiconductor component 4 is composed of a diode module incorporating a plurality of diodes. However, the secondary-side semiconductor component may be a semiconductor module incorporating a plurality of MOSFETs. Further, the secondary semiconductor component may be a discrete semiconductor component.

The choke coil 5 constitutes a smoothing circuit together with the capacitor 133.
The DC power input to the power supply device 1 of this example is converted into AC power in the primary side circuit (switching circuit) and input to the transformer 2. The input AC power is stepped down in the transformer 2 and then rectified in a secondary circuit (rectifier circuit) to become DC power. Then, the DC power after the step-down is output after being smoothed by the smoothing circuit.

Next, the function and effect of this example will be described.
In the power supply device 1, a plurality of lead terminals 23 drawn from the primary coil 21 and the secondary coil 22 are drawn from the same side of the transformer 2. Thereby, the several lead terminal 23 can be concentrated on the same side in the transformer 2, and it becomes easy to attain size reduction of the power supply device 1. FIG.

  The plurality of lead terminals 23 are shifted in the lateral direction Y and also in the axial direction Z. Thereby, it is easy to ensure a wide interval between the plurality of lead terminals 23. As a result, it is possible to sufficiently secure insulation between the lead terminals 23. That is, the configuration in which the plurality of lead terminals 23 are pulled out from the same side of the transformer 2 is also a configuration in which the plurality of lead terminals 23 are easily accessible. However, by arranging the plurality of lead terminals 23 so as to be offset from each other in the axial direction and the lateral direction, it becomes easy to secure the distance between the lead terminals 23 and to secure insulation between the lead terminals 23. it can.

  The lead terminal 23 has a cross-sectional shape in which the thickness in the axial direction Z is smaller than the width in the horizontal direction Y. Therefore, in particular, there is a great advantage by arranging the plurality of lead terminals 23 so as to be offset from each other in the axial direction Z. That is, if a plurality of lead terminals 23 having the above cross-sectional shape are arranged side by side in the lateral direction Y without shifting in the axial direction Z as shown in FIG. It is difficult to secure the distance. Thus, as described above, by shifting the plurality of lead terminals 23 in the axial direction Z, that is, in the thickness direction of the lead terminals 23, a space in the width direction (lateral direction Y) of the lead terminals 23 is secured as shown in FIG. Thus, the distance between the lead terminals 23 can be secured.

Further, as shown in FIG. 5, when viewed from the axial direction Z, the plurality of lead terminals 23 are arranged side by side in the horizontal direction Y. The distance between 23 can be efficiently secured. Furthermore, when viewed from the axial direction Z, the plurality of lead terminals 23 are arranged in the horizontal direction Y without overlapping each other, and thus the distance between the plurality of lead terminals 23 is more efficiently secured. be able to.
Further, since the lead terminals 23 adjacent to each other in the horizontal direction Y as viewed from the axial direction Z are arranged so as to be shifted from each other in the axial direction Z, the distance between the lead terminals 23 adjacent to each other in the horizontal direction Y is It can be secured more effectively.

Further, as shown in FIG. 1, since the axial direction Z is a normal direction of the base plate 6, the transformer 2 can be stably mounted on the base plate 6.
The power supply device 1 also includes a first stacked body 11 in which the transformer 2 and the primary semiconductor component 3 are stacked, and a second stacked body 12 in which the secondary semiconductor component 4 and the choke coil 5 are stacked. Thereby, size reduction of the power supply device 1 can be achieved. Further, as the transformer 2 constituting the first stacked body 11 together with the primary-side semiconductor component 3, a plurality of lead terminals 23 drawn from the same side of the transformer 2 are used, so that wiring (primary AC wiring 71ac and secondary The AC wiring 72ac) can be shortened. As a result, the power supply device 1 can be reduced in size, noise, and manufacturing cost.

  The secondary lead terminal 232 is disposed closer to the base plate 6 than the primary lead terminal 231. Therefore, the ground terminal 233 that is one of the secondary lead terminals 232 can be easily connected to the base plate 6. Accordingly, the heat of the secondary coil 22 can be efficiently radiated to the base plate 6.

  In this example, all of the secondary lead terminals 232 are arranged closer to the base plate 6 than the primary lead terminals 231, but only the ground terminal 233 that is one of the secondary lead terminals 232 is provided. Also, it may be configured to be disposed at a position closer to the base plate 6 than the primary lead terminal 231. Also in this case, it is easy to connect the ground terminal 233 to the base plate 6 and to efficiently dissipate the heat of the secondary coil 22 to the base plate 6.

  As described above, according to this example, it is possible to provide a power supply device that can be easily downsized while ensuring insulation between a plurality of lead terminals in a transformer.

(Example 2)
In this example, as shown in FIG. 8, the transformer 2 is configured by arranging the primary coil 21 on both sides in the axial direction Z of the secondary coil 22.
The two primary coils 21 are electrically connected in series with each other. And one lead-out terminal 23 (primary lead-out terminal 231) is drawn out one by one from one primary coil 21 and the other primary coil 21. The two primary lead terminals 231 are arranged at positions shifted from each other in the axial direction Z.

Also, one of the three lead terminals 23 (secondary lead terminals 232) drawn from the secondary coil 22 is in the axial direction Z with the other two lead terminals 23 (secondary lead terminals 232). It is arranged at a shifted position.
The ground terminal 233, which is one of the secondary lead terminals 232, is disposed at a position farther from the base plate 6 than the other one secondary lead terminal 232 and one primary lead terminal 231.

Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.
In the case of this example, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIG. 9, the stacking order of the transformer 2 and the primary-side semiconductor component 3 in the first stacked body 11 is reversed.
That is, the first stacked body 11 is mounted on the base plate 6 in a state where the transformer 2 is disposed between the base plate 6 and the primary-side semiconductor component 3.

  Others are the same as in the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

In the case of this example, since the transformer 2 can be brought close to the base plate 6, the heat dissipation of the transformer 2 can be improved. In addition, the same effects as those of the first embodiment are obtained.
Incidentally, the combination of the first laminate 11 is not limited to the combination of the transformer 2 and the primary-side semiconductor component 3, for example, it may be Seto Awa set of the transformer 2 and the secondary-side semiconductor component 3. Similarly, the combination of the second stacked bodies 12 is not limited to the combination of the secondary-side semiconductor component 4 and the choke coil 5, and may be other combinations.

( Reference example )
In this example, as shown in FIG. 10, the transformer 2, the primary-side semiconductor component 3, the secondary-side semiconductor component 4, and the choke coil 5 are arranged on the base plate 6 without being stacked on each other.
In this example, the transformer 2 and the primary-side semiconductor component 3 are arranged to face each other in a direction parallel to the base plate 6. The transformer 2 pulls out all the lead terminals 23 from the transformer 2 to the primary semiconductor component 3 side. The plurality of lead terminals 23 are also arranged in a state shifted in the lateral direction Y and the axial direction Z.

  Others have the same configuration and effects as the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.

( Example 4 )
In this example, as shown in FIGS. 11 and 12, the arrangement of the plurality of lead terminals 23 is variously changed. 11 and 12 are explanatory views showing only the arrangement of the plurality of lead terminals 23 viewed from the lead direction X. FIG.

  The mode shown in FIG. 11 is a mode in which the lead terminals 23 adjacent to each other in the lateral direction Y as viewed from the axial direction Z are arranged in the axial direction Z while partially overlapping in the axial direction Z. . Further, the primary lead terminal 231 and the secondary lead terminal 232 are disposed at positions shifted from each other in the axial direction Z, but the primary lead terminal 231 and the secondary lead terminal 232 partially overlap in the axial direction Z. ing.

  The mode shown in FIG. 12 is a mode in which some of the lead terminals 23 overlap the other lead terminals 23 in the axial direction Z. Further, the primary lead terminal 231 does not shift in the lateral direction Y with respect to the secondary lead terminal 232, and the entire width direction (lateral direction Y) of the primary lead terminal 231 is axially Z to the secondary lead terminal 232. overlapping.

Others have the same configuration and effects as the first embodiment. Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment denote the same components as in the first embodiment unless otherwise specified.
Moreover, as an arrangement | positioning aspect of the some extraction terminal 23, a various aspect can be employ | adopted besides having mentioned above.

The present invention is not limited to the above-described embodiments. For example, a configuration in which the axial direction Z of the transformer is arranged parallel to the base plate, a configuration in which the width direction of the lead terminal is the axial direction, and the like are also employed. be able to. Moreover, it can also be set as the aspect which combined the above-mentioned Example suitably. For example, the arrangement of the plurality of lead terminals 23 disclosed in the second or fourth embodiment can be applied to the power supply device 1 having the configuration disclosed in the first or third embodiment.

DESCRIPTION OF SYMBOLS 1 Power supply device 2 Transformer 21 Primary coil 22 Secondary coil 23 Lead-out terminal 3 Primary side semiconductor component 4 Secondary side semiconductor component 5 Choke coil 6 Base plate X Pull-out direction Y Lateral direction Z-axis direction

Claims (8)

A transformer (2) having a primary coil (21) and a secondary coil (22);
A primary-side semiconductor component (3) constituting a primary-side circuit connected to the primary coil (21) side of the transformer (2);
A secondary side semiconductor component (4) constituting a secondary side circuit connected to the secondary coil (22) side of the transformer (2);
A choke coil (5) connected to the secondary side semiconductor component (4);
A base plate (6) on which the transformer (2), the primary semiconductor component (3), the secondary semiconductor component (4), and the choke coil (5) are mounted,
A plurality of lead terminals (23) drawn from the primary coil (21) and the secondary coil (22) are drawn from the same side of the transformer (2),
At least one of the plurality of lead terminals (23) is transverse to both the lead direction (X) and the axial direction (Z) of the transformer with respect to at least one other lead terminal (23). It is shifted in the direction (Y) and also in the axial direction (Z) ,
The primary semiconductor component (3) or the secondary semiconductor component (4) is a laminated semiconductor component laminated adjacent to the transformer in the axial direction.
Of the plurality of lead terminals, a lead terminal connected to the multilayer semiconductor component is disposed closer to the multilayer semiconductor component in the axial direction than the other lead terminals. Device (1).   The power supply device (1) according to claim 1, wherein the lead terminal (23) has a cross-sectional shape in which the thickness in the axial direction (Z) is smaller than the width in the lateral direction (Y). ).   3. The power supply device according to claim 1, wherein when viewed from the axial direction (Z), the plurality of lead terminals (23) are arranged side by side in the lateral direction (Y). 4. (1).   The lead terminals (23) adjacent to each other in the lateral direction (Y) when viewed from the axial direction (Z) are arranged so as to be shifted from each other in the axial direction (Z). The power supply device according to (1).   When viewed from the axial direction (Z), the plurality of lead terminals (23) are arranged side by side in the lateral direction (Y) without overlapping each other. The power supply device (1) described.   The power supply device (1) according to any one of claims 1 to 5, wherein the axial direction (Z) is a normal direction of the base plate (6).   At least one of the secondary lead terminals (232) which is the lead terminal (23) drawn from the secondary coil (22) is the lead terminal (23) drawn from the primary coil (21). The power supply device (1) according to claim 6, wherein the power supply device (1) is arranged closer to the base plate (6) than the primary lead terminal (231).   Any two of the transformer (2), the primary-side semiconductor component (3), the secondary-side semiconductor component (4), and the choke coil (5) are arranged in the axial direction (Z). It has a 1st laminated body (11) laminated | stacked, and a 2nd laminated body (12) which laminated | stacked the other two in the said axial direction (Z), It is any one of Claims 1-7 characterized by the above-mentioned. The power supply device according to (1).

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