JP6131524B2 - Liquid discharge head manufacturing method, liquid discharge head, liquid discharge head unit, and image forming apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a liquid discharge head, a liquid discharge head, a liquid discharge head unit, and an image forming apparatus.

  As an image forming apparatus such as a printer, a facsimile, a copying machine, a plotter, or a complex machine of these, for example, a liquid discharge recording type image using a recording head composed of a liquid discharge head (droplet discharge head) for discharging ink droplets An ink jet recording apparatus or the like is known as a forming apparatus.

  This liquid discharge recording type image forming apparatus means that ink droplets are transported from a recording head (not limited to paper, including OHP, and can be attached to ink droplets and other liquids). Yes, it is also ejected onto a recording medium or a recording medium, recording paper, recording paper, etc.) to form an image (recording, printing, printing, and printing are also used synonymously). And a serial type image forming apparatus that forms an image by ejecting liquid droplets while the recording head moves in the main scanning direction, and a line type head that forms images by ejecting liquid droplets without moving the recording head There are line type image forming apparatuses using

  In this specification, the “image forming apparatus” of the liquid discharge recording method forms an image by discharging liquid onto a medium such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, etc. This means an apparatus that performs the process, and “image formation” not only applies an image having a meaning such as a character or a figure to the medium but also an image having no meaning such as a pattern to the medium. (Simply making the droplet land on the medium).

  “Ink” is not limited to ink, but is used as a general term for all liquids capable of image formation, such as recording liquid, fixing processing liquid, and liquid. DNA samples, resists, pattern materials, resins and the like are also included. In addition, the “image” is not limited to a planar one, but includes an image given to a three-dimensionally formed image, and an image formed by three-dimensionally modeling a solid itself.

  2. Description of the Related Art Conventionally, there is a liquid ejection head in which a part of each of a plurality of pressure generation chambers is configured by a diaphragm provided with a piezoelectric element. Each pressure generating chamber is arranged in parallel so as to individually correspond to a plurality of nozzle openings for ejecting ink droplets.

  In this liquid ejection head, the volume of each pressure generating chamber is changed by the displacement of the piezoelectric element to eject ink droplets. In this liquid discharge head, a piezoelectric element is individually arranged in each pressure generating chamber so that the volume of each pressure generating chamber can be changed, and the piezoelectric element has a plurality of electrodes corresponding to each pressure generating chamber. Are arranged in parallel.

  The piezoelectric element is connected to the control unit via a thin-film flexible wiring board for each electrode. And the flexible wiring board by which the circuit component was provided in the insulating film in which the wiring pattern was formed, and the electric circuit board which transmits the various signals supplied from the apparatus side to this flexible wiring board are connected. Thereby, the displacement of the piezoelectric element for every pressure generation chamber by a control part is controllable.

  Here, for example, Patent Document 1 and Patent Document 2 are known as conventional techniques for ensuring the reliability of connection between the flexible wiring board and the electric circuit board.

  In Patent Document 1, in order to reliably prevent the circuit pattern in the vicinity of the connection portion from being disconnected when bending stress is applied in the vicinity of the connection portion between the flexible printed circuit board and the flexible flat cable, And the structure which reinforces the solder junction part of a flexible flat cable with an insulating film is disclosed.

  Moreover, in patent document 2, in order to prevent generation | occurrence | production of the disconnection of the conductor of a flexible flat cable, and a circuit board, the side edge flat conductor edge part of the width direction side edge in the edge part of a flexible flat cable is exposed toward a side edge. A configuration is disclosed in which a flexible flat cable and a substrate are securely bonded in a longitudinal direction by soldering to a land on a circuit board.

  Here, there are the following other causes of bonding failure regarding solder bonding between electrodes. In joining the electrode of the flexible wiring board and the electrode of the electric circuit board, solder is applied to one of the electrodes, the two electrodes are overlapped, and a heater chip as a thermocompression bonding tool is pressed on the flexible wiring board. Then, heat is applied to the solder by a heater chip to apply pressure while melting the solder, and the solder is cured to join both electrodes. At this time, in order to melt the solder, it is necessary to set the heater chip to a temperature (about 400 ° C.) higher than the solder melting temperature (about 250 ° C.).

  When the heater chip is heated to a high temperature, the heating temperature suddenly rises at a part of the solder joint and solder balls are generated, causing a short circuit. Further, when the heater chip is heated to a high temperature, the phenomenon of copper peeling occurs. When such solder balls are generated or copper is peeled off, it causes a bonding failure between the flexible wiring board and the electric circuit board.

  In addition, if the heater chip is heated to bond the electrodes, there is a problem that the flexible wiring substrate that is in direct contact with the heater chip may be carbonized (for example, burnt) or the durability of the heater chip itself may be reduced. Arise.

  However, in Patent Documents 1 and 2 above, no measures have been taken for the cause of the bonding failure between the electrodes, and thus it cannot be said that the bonding reliability is sufficient.

  Accordingly, an object of the present invention is to provide a method for manufacturing a liquid discharge head, a liquid discharge head, a liquid discharge head unit, and an image forming apparatus capable of preventing the occurrence of solder balls and copper peeling and reducing poor bonding. It is what.

In order to solve the above problems, a method of manufacturing a liquid discharge head according to the present invention includes a pressure generating unit that generates a pressure for discharging a droplet, a flexible wiring board connected to the pressure generating unit, and the flexible wiring. A method of manufacturing a liquid ejection head that ejects droplets including an electrical circuit board connected to a substrate, wherein solder is applied to at least one of the electrode on the flexible wiring board and the electrode on the electrical circuit board, At least one of the side surfaces of the electrode on the electric circuit board in the first direction, which is the direction in which the flexible wiring board is drawn out on the electric circuit board, at a position facing the electrode on the flexible wiring board , The electrode on the electric circuit board is more flexible than the electrode facing the electrode on the flexible wiring board through the solder. As the electrode side does not protrude, are formed insulating resist member in the first direction, the resist member is formed on at least a position facing one of the electrodes at the both ends of the flexible wiring board And the solder is melted and hardened by applying heat from the electrode side on the flexible wiring board. The electrode on the substrate and the electrode on the electric circuit substrate are joined.

  According to the present invention, it is possible to prevent the occurrence of solder ball and copper peeling and to reduce the bonding failure.

It is an external perspective view of the liquid discharge head unit. FIG. 4 is an exploded perspective view of a liquid discharge head unit. It is a perspective explanatory view for explaining a frame member and an electric circuit board of a liquid discharge head unit. It is a perspective explanatory view used for description of the joining configuration of the flexible wiring board and the electric circuit board. It is the top view which planarly viewed FIG. 4 from the electric circuit board | substrate side. It is a cross-sectional schematic diagram which shows the joining structure of the electrode of the flexible wiring board which concerns on 1st Embodiment, and the electrode of an electric circuit board | substrate. It is a cross-sectional schematic diagram explaining a mode at the time of using a heater chip as a thermocompression bonding tool. It is a cross-sectional schematic diagram which shows the joining structure of the electrode of the flexible wiring board which concerns on 2nd Embodiment, and the electrode of an electric circuit board | substrate. It is a cross-sectional schematic diagram explaining a mode at the time of using a heater chip as a thermocompression bonding tool. It is a cross-sectional schematic diagram which shows the joining structure of the electrode of the flexible wiring board which concerns on 3rd Embodiment, and the electrode of an electric circuit board | substrate. It is a cross-sectional schematic diagram which shows the joining structure of the electrode of the flexible wiring board which concerns on 4th Embodiment, and the electrode of an electric circuit board | substrate. 1 is a schematic configuration diagram illustrating an overall configuration of a mechanism unit of an image forming apparatus. FIG. 2 is a plan view illustrating a main part of a mechanism unit of the image forming apparatus.

  Hereinafter, a configuration according to the present invention will be described in detail based on the embodiment shown in FIGS.

<Liquid discharge head unit>
FIG. 1 is an external perspective view of the liquid discharge head unit. FIG. 2 is an exploded perspective view of the liquid discharge head unit. FIG. 3 is a perspective explanatory view for explaining the frame member and the electric circuit board of the liquid discharge head unit.

  The liquid discharge head unit 1 includes a liquid discharge head 2 that discharges droplets, an electric circuit board 3 on which electronic components connected to the liquid discharge head 2 are mounted, and a tank 4 that stores ink to be supplied to the liquid discharge head 2. The frame member of the liquid discharge head 2, the electric circuit board 3 and the tank 4 are integrated in a laminated structure, and between the frame member 17 of the liquid discharge head 2 and the electric circuit board 3 and the electric circuit board. 3 and the tank 4 are respectively provided with spaces, and the electronic components 32 of the electric circuit board 3 are accommodated in the spaces. The liquid discharge head 2 may include the electric circuit board 3 without using the liquid discharge head 2 and the electric circuit board 3 as separate components of the liquid discharge head unit 1.

  The liquid discharge head 2 forms a nozzle plate 12 on which nozzles 11 for discharging droplets are formed, a flow path plate 14 that forms a liquid chamber 13 that communicates with the nozzles 11, and a part of the wall surface of the liquid chamber 13. A diaphragm member 15 that forms a diaphragm, two piezoelectric actuators 16 that displace the diaphragm, and a common liquid chamber 18 that supplies ink to each liquid chamber 13 are formed, and the piezoelectric actuator 16 is housed inside. The nozzle plate 12, the flow path plate 14, and the vibration plate member 15 are provided with a frame member 17 that holds the front surface side.

  Each piezoelectric actuator 16 has a laminated piezoelectric element member 22 which is two rows of pressure generating means joined to a substrate 21. The piezoelectric element member 22 is slitted to drive corresponding to each liquid chamber 13. Piezoelectric element columns (not shown) are formed. A flexible wiring board 23 such as a flexible wiring (electrode) for electrically connecting each driving piezoelectric element column and the electric circuit board 3 is joined to and connected to each piezoelectric element member 22.

  In addition to the common liquid chamber 18 described above, the frame member 17 includes an opening 17 a that houses the piezoelectric actuator 16 and an opening 17 b that forms a space between the frame member 17 of the liquid ejection head 2 and the electric circuit board 3. Each is formed. The flexible wiring is formed of a thin film-like member that is flexible and can be greatly deformed, and a plurality of electric circuits are provided inward, although not shown. In addition, a filter unit 19 serving as a liquid supply port is formed between the common liquid chamber 18 and the liquid chamber 13 in the diaphragm member 15.

  On the electric circuit board 3, the piezoelectric actuator 16, the flexible wiring board 23, and an electronic component 32 connected via a wiring pattern on the board 3 are mounted on both surfaces of the board body 31. The liquid discharge head unit 1 And an FFC connector 33 for connecting to a control board of the image forming apparatus main body. Further, an opening 34 through which the flexible wiring board 23 is passed is formed.

  An insulating sheet 51 is interposed between the frame member 17 and the electric circuit board 3. Thereby, even when the frame member 17 is formed of a conductive member such as metal (for example, SUS), a wiring pattern can be formed on the surface of the substrate body 31 of the electric circuit substrate 3.

  Between the electric circuit board 3 and the tank 4, a shielding member 52 is provided that shields the liquid by shielding a gap remaining between the electric circuit board 3 and the tank 4 from the outside. The shielding member 52 is formed of a substantially L-shaped resin film member. Thereby, it is possible to more effectively prevent mist from entering from the gap between the electric circuit board 3 and the tank 4.

<Joint configuration of flexible wiring board and electric circuit board>
Next, an example of a connection configuration between the flexible wiring board 23 of the liquid discharge head 2 and the electric circuit board 3 will be described with reference to FIGS. 4 and 5.

  FIG. 4 is an explanatory perspective view for explaining the joining configuration of the flexible wiring board and the electric circuit board. FIG. 5 is a plan view of FIG. 4 as viewed from the electric circuit board side.

  As described above, the liquid ejection head 2 includes the piezoelectric element members 22 in which two rows of driving piezoelectric element columns (not shown) are formed on the two piezoelectric actuators 16, and each piezoelectric element member 22 includes two sheets. The flexible wiring board 23 is connected.

  In the electric circuit board 3, a plurality of connectors 33 and electronic components 32 are arranged on a board body 31, and a wiring pattern (electrode) (not shown) is formed.

  The flexible wiring board 23 is drawn out to the side connected to the wiring pattern of the electric circuit board 3 through the opening 34 formed in the electric circuit board 3, and the input terminal 23a side of each flexible wiring board 23 does not face each other in the facing direction. The plurality of connectors 33 of the electric circuit board 3 are arranged in the longitudinal direction of the electric circuit board 3 by being bent at the position and connected to the wiring pattern of the electric circuit board 3.

  Hereinafter, a method of joining the electrodes on the flexible wiring board and the electrodes on the electric circuit board will be described with reference to FIGS. 6 to 11 show the A-A ′ cross section of FIG. 5.

<First Embodiment>
First, a method for joining the electrode on the flexible wiring board and the electrode on the electric circuit board according to the first embodiment will be described. FIG. 6 is a schematic cross-sectional view showing a joint structure between the electrode of the flexible wiring board and the electrode of the electric circuit board.

  An electrode 23e is formed on the flexible wiring board 23, and the electrode 23e is covered with a resist layer 23r. The electrode 23e is, for example, a copper electrode, and the flexible wiring board 23 is, for example, a polyimide material. The flexible wiring board 23, the electrode 23e, and the resist layer 23r pass through the opening 34 of the electric circuit board 3. The flexible wiring board 23 and the electrode 23 e are bent so as to penetrate the opening 34 and face the electric circuit board 3. Here, the resist layer 23r is not formed on the portion of the electrode 23e penetrating the opening 34, and the surface thereof is exposed to the electric circuit board 3 side.

  Further, in the junction structure between the electrodes shown in FIG. 6, the electrode 23e of the flexible wiring board 23 and the electric circuit are connected via the solder 24 applied to the electrode 3e of the electric circuit board 3 (or the electrode 23e of the flexible wiring board 23). The electrodes 3e of the substrate 3 are overlapped. Further, the end portions 23e1 and 23e2 of the electrode 23e of the flexible wiring board 23 are positioned outside the end portion 3e1 of the electrode 3e of the electric circuit board 3 on at least one side of the electrode longitudinal direction.

  In FIG. 6, since the length L23 of the electrode 23e of the bent flexible wiring board 23 in the longitudinal direction of the electrode is formed longer than the length L3 of the electrode 3e of the electric circuit board 3, the flexible wiring board 23 Each of the end portions 23e1 and 23e2 of the electrode 23e is located outside both sides of the end portion 3e1 of the electrode 3e of the electric circuit board 3 in the electrode longitudinal direction.

  When projecting both end portions 23e1, 23e2 of the electrode 23e outward from the end portion 3e1 of the electrode 3e, it is preferable that the projecting amounts are substantially the same at both end portions 23e1, 23e2. Thereby, when joining both electrodes with the thermocompression-bonding tool mentioned later, generation | occurrence | production of the joining defect by adding an excessive heat to one side can be reduced.

  FIG. 7 is a schematic cross-sectional view illustrating a state where the heater chip 50 is used as a thermocompression bonding tool.

  At the joint between the electrode 23e of the flexible wiring board 23 and the electrode 3e of the electric circuit board 3, the electrode 23e of the flexible wiring board 23 and the electrode 3e of the electric circuit board 3 are overlapped via the solder 24. The electrodes are joined by melting and hardening the solder 24 with the heater chip 50.

  The end face 50w of the heater chip 50 is located outside the end portion 3e1 of the electrode 3e of the electric circuit board 3 in the electrode longitudinal direction. With such a configuration, the heat capacity of the heater chip 50 can be increased.

  When the solder 24 applied to either the electrode 23e of the flexible wiring board 23 or the electrode 3e of the electric circuit board 3 is melted by the heat from the heater chip 50 from above the flexible wiring board 23, the flexible wiring board 23 is used. The heat from the heater chip 50 is also conducted to the portion of the electrical circuit board 3 where the electrode 23e is outside the electrode 3e.

  Since the heat conducted to this part also contributes to the melting of the solder, the heat transfer efficiency to the solder joint is improved. That is, by efficiently conducting the heat of the heater chip 50 to the solder joint portion, the solder 24 can be melted even if the heating temperature of the heater chip 50 is not as high as that of the prior art. As a result, the heating temperature does not rise suddenly at a part of the solder joint. As a result, generation of solder balls and copper peeling can be suppressed. In addition, since the heating temperature of the heater chip 50 does not have to be as high as that in the past, carbonization (generation of scorching) of the flexible wiring board 23 can be suppressed. Furthermore, the durability of the heater chip 50 itself is improved.

  On the other hand, in the conventional bonding of the electrode of the flexible wiring board and the electrode of the electric circuit board, in order to align the electrode of the flexible wiring board and the electrode of the electric circuit board, The positions of the end portions of the electrodes of the flexible wiring board are positioned substantially the same or inside. However, in this configuration, the heat capacity of the electrodes of the flexible wiring board is reduced, so when heat is applied by the heater chip, the heating temperature rises suddenly at a part of the solder joint, resulting in poor bonding such as solder balls. There is a problem that causes the problem.

  Furthermore, in this configuration, the area of the electrode 23e of the flexible wiring board 23 is larger than the area of the electrode 3e of the electric circuit board 3. For this reason, it is easy to form a good solder fillet from the electrode 3e of the electric circuit board 3 to the electrode 23e of the flexible wiring board 23, and the bonding reliability is improved.

  Therefore, in the present embodiment, in the longitudinal direction of the electrode 23e, the solder 24 in a state where at least one of both ends of the electrode 23e on the flexible wiring board 23 is positioned outside the end of the electrode 3e on the electric circuit board 3 is used. The solder 24 is melted and cured from the electrode 23e side on the flexible wiring board 23 by the heater chip 50, and the electrode 23e on the flexible wiring board 23 and the electrode 3e on the electric circuit board 3 are joined together. Since the occurrence of solder balls and copper peeling can be prevented, a liquid discharge head or liquid discharge head unit with high bonding reliability can be manufactured.

<Second Embodiment>
Hereinafter, other embodiments of the method for manufacturing a liquid discharge head according to the present invention will be described. In addition, the description about the same point as the said embodiment is abbreviate | omitted.

  In the first embodiment, the electrode 3e is exposed on at least one of the both sides of the electrode 3e. For this reason, when the heater chip 50 is used as a heating tool, the heat transferred to the solder joint is easily escaped from the periphery of the electrode 3e. For this reason, heat transfer efficiency may be insufficient. In the method of manufacturing the liquid discharge head according to the second embodiment described with reference to FIGS. 8 and 9, the configuration for reducing the escape of the heat transferred to the solder joint from the periphery of the electrode 3 e is the first. Different from the embodiment.

  FIG. 8 is a schematic cross-sectional view illustrating a bonding structure between an electrode of a flexible wiring board and an electrode of an electric circuit board in the method for manufacturing a liquid ejection head according to the second embodiment.

  In the joint structure between the electrodes shown in FIG. 8, the solder 24 between the electrodes is melted and hardened, and the electrode 23e on the flexible wiring board 23 and the electrode 3e on the electric circuit board 3 are joined. The electrode 3e is opposed. In the longitudinal direction of the electrode 23e, at least one of both ends of the electrode 23e is located outside the end 3e1 of the electrode 3e, and an insulating resist member (solder resist member) 40 is disposed on at least one of both ends of the electrode 3e. Is formed.

  The solder resist member is generally applied to a portion of the printed circuit board where soldering is not performed, and is used to prevent a short circuit due to a solder bridge, or to prevent migration of solder over time. Utilize the heat storage properties.

  Note that resist members 40 are also formed on both sides of the electrode 3e of the electric circuit board 3 in the short-side direction of the electrode (the direction perpendicular to the above-described longitudinal direction of the electrode).

  FIG. 9 is a schematic cross-sectional view illustrating bonding between electrodes in the method of manufacturing a liquid ejection head according to the second embodiment when a heater chip 50 is used as a thermocompression bonding tool.

  Similarly to the first embodiment, the end face of the heater chip 50 is located outside the end portion 3e1 of the electrode 3e of the electric circuit board 3 in the electrode longitudinal direction. When the solder 24 applied to either the electrode 23e of the flexible wiring board 23 or the electrode 3e of the electric circuit board 3 is melted by heat from the heater chip 50 from above the flexible wiring board 23, the electrode 23e of the flexible wiring board 23 is melted. However, the heat from the heater chip 50 is also conducted to the portion of the electric circuit board 3 outside the electrode 3e.

  The conducted heat contributes to the solder melting of the electrode 23e and the electrode 3e. At this time, since the resist member 40 is formed at both ends of the electrode 3e, the heat is transferred to the solder joint by the heat storage effect of the resist member 40. It becomes difficult for the generated heat to escape to the surroundings.

  As a result, the amount of heating to the solder joint can be further suppressed as compared with the manufacturing method of the first embodiment. For this reason, generation | occurrence | production of the solder ball in a solder joint part and copper peeling are suppressed more.

  Moreover, since the amount of heating to the solder joint can be suppressed, the set temperature of the heater chip 50 can be further lowered. As a result, carbonization of the flexible wiring board 23 is further suppressed. Furthermore, since the set temperature of the heater chip 50 can be lowered, the life of the heater chip 50 becomes longer.

<Third Embodiment>
FIG. 10 is a schematic cross-sectional view showing a joint structure between an electrode of a flexible wiring board and an electrode of an electric circuit board according to the third embodiment of the present invention.

  In the configuration of the second embodiment, since the resist member 40 is formed at both ends of the electrode 3e, when the heater chip 50 is pressed against the flexible wiring board 23 and the solder 24 between the electrodes is melted, the resist member 40 is melted. There is a possibility that the solder 24 moves on the resist member 40 and leaks onto the opening 34 of the flexible wiring board 23 or the electric circuit board 3.

  Therefore, in the present embodiment, the recess 41 is provided on the surface of the resist member 40 facing the flexible wiring board 23. As a result, the solder 24 that moves the resist member 40 is guided to the concave portion 41, and leakage of the solder 24 onto the opening 34 of the flexible wiring board 23 and the electric circuit board 3 can be reduced.

<Fourth Embodiment>
FIG. 11 is a schematic cross-sectional view showing a joint structure between an electrode of a flexible wiring board and an electrode of an electric circuit board according to the fourth embodiment.

  The flexible wiring board 23 passes through the opening 34 provided in the electric circuit board 3 and is bent so that the electrode 23e on the flexible wiring board 23 and the electrode 3e on the electric circuit board 3 face each other. The angle is 90 ° or less.

  In this case, when the heater chip 50 is used as a heating tool, the contact area between the heater chip 50 and the flexible wiring board 23 increases if the bending angle θ of the flexible wiring board 23 is equal to or less than a right angle. As a result, the heat transfer efficiency of the solder joint is improved, and the occurrence of solder balls and copper peeling can be suppressed at the solder joint. Moreover, carbonization of the flexible wiring board 23 can be suppressed.

<Description of Image Forming Apparatus>
FIG. 12 is a schematic configuration diagram illustrating the overall configuration of the mechanism unit of the image forming apparatus. FIG. 13 is an explanatory plan view of a main part of a mechanism unit of the image forming apparatus.

  An example of an ink jet recording apparatus as an image forming apparatus provided with the liquid discharge head unit 1 will be described with reference to FIGS.

  In this image forming apparatus, a carriage 133 is slidably held in a main scanning direction by a guide rod 131 and a stay 132, which are guide members horizontally mounted on the left and right side plates 101A and 101B constituting the frame 101. A scanning motor moves and scans in the direction indicated by the arrow (carriage main scanning direction).

  The carriage 133 is provided with a recording head 134 composed of four ink jet heads for discharging ink droplets of each color of yellow (Y), cyan (C), magenta (M), and black (Bk). They are arranged in a direction crossing the main scanning direction, and are mounted with the ink droplet ejection direction facing downward. As described above, the driver IC is mounted on the recording head 134 and is connected to a control unit (not shown) via a harness (flexible print cable) 102.

  In addition, the carriage 133 is equipped with a sub tank 135 for each color for supplying ink of each color to the recording head 134. Each color sub-tank 135 is supplementarily supplied with ink of each color from the ink cartridge 120 (120k, 120c, 120m, 120y) mounted on the cartridge loading unit 114 via the ink supply tube 136 of each color. The cartridge loading unit 114 is provided with a supply pump unit 115 for feeding the ink in the ink cartridge 120, and the ink supply tube 136 is attached to the rear plate 101C constituting the frame 101 in the middle of turning. It is held by the locking member 105. On the other hand, as a paper feeding unit for feeding the paper 142 stacked on the paper stacking unit (pressure plate) 141 of the paper feeding tray 112, a half-moon roller (feeding) is separately fed from the paper stacking unit 141 one by one. A separation pad 144 made of a material having a large friction coefficient is provided to face the paper roller 143 and the paper feed roller 143. The separation pad 144 is biased toward the paper feed roller 143 side.

  In order to feed the sheet 142 fed from the sheet feeding unit to the lower side of the recording head 134, a guide member 145 for guiding the sheet 142, a counter roller 146, a transport guide member 147, and a tip pressure roller. And a holding belt 148 that is a conveying means for electrostatically attracting the fed paper 142 and conveying it at a position facing the recording head 134.

  The conveyor belt 151 is an endless belt, and is configured to wrap around the conveyor roller 152 and the tension roller 153 and circulate in the belt conveyance direction (sub-scanning direction). The transport belt 151 is, for example, a surface layer that is a sheet adsorbing surface formed of a pure resin material having a thickness of about 40 μm that is not subjected to resistance control, such as ETFE pure material, and resistance control by carbon using the same material as the surface layer. And a back layer (medium resistance layer, ground layer).

  A charging roller 156 is provided as charging means for charging the surface of the conveyor belt 151. The charging roller 156 is disposed so as to come into contact with the surface layer of the conveyor belt 151 and rotate following the rotation of the conveyor belt 151, and applies a predetermined pressing force to both ends of the shaft as a pressing force. The conveyance roller 152 also functions as an earth roller, and is in contact with the middle resistance layer (back layer) of the conveyance belt 151 and is grounded.

  In addition, a guide member 157 is disposed on the back side of the conveyance belt 151 so as to correspond to a printing area by the recording head 134. The guide member 157 has an upper surface that protrudes closer to the recording head 134 than the tangent line of the two rollers (the conveyance roller 152 and the tension roller 153) that support the conveyance belt 151, thereby maintaining high-precision flatness of the conveyance belt 151. Like to do. The conveyance belt 151 rotates in the belt conveyance direction when the conveyance roller 152 is rotationally driven via a drive belt by a sub-scanning motor (not shown).

  Further, as a paper discharge unit for discharging the paper 142 recorded by the recording head 134, a separation claw 161 for separating the paper 142 from the conveying belt 151, a paper discharge roller 162, and a paper discharge roller 163 are provided. A paper discharge tray 113 is provided below the paper discharge roller 162. Here, the height from the sheet discharge roller 162 and the sheet discharge roller 163 to the sheet discharge tray 113 is increased to some extent in order to increase the amount that can be stored in the sheet discharge tray 113.

  A double-sided unit 171 is detachably attached to the back surface of the apparatus main body. The duplex unit 171 takes in the paper 142 returned by the reverse rotation of the transport belt 151, reverses it, and feeds it again between the counter roller 146 and the transport belt 151. The upper surface of the duplex unit 171 is a manual feed tray 172.

  Further, a maintenance / recovery mechanism (subsystem) 181 for maintaining and recovering the state of the nozzles of the recording head 134 is disposed in a non-printing area on one side of the carriage 133 in the scanning direction. The maintenance / recovery mechanism 181 includes a cap member 182 for capping each nozzle surface of the recording head 134, a wiper blade 183 for wiping the nozzle surface, and idle discharge (discharge of droplets that do not contribute to image recording). And an empty discharge receptacle 184 for receiving droplets discharged when performing the operation. Similarly, in the non-printing area on the other side in the scanning direction of the carriage 133, an empty discharge receiver 185 for receiving droplets at the time of empty discharge is arranged.

  In the ink jet recording apparatus configured as described above, the paper 142 is separated and fed one by one from the paper feed tray 112, and the paper 142 fed substantially vertically upward is guided by the guide 145, and the conveyance belt 151 and the counter roller 146, and the leading end is guided by the conveying guide 147 and pressed against the conveying belt 151 by the leading end pressing roller 149, and the conveying direction is changed by approximately 90 °.

At this time, a positive output and a negative output are alternately repeated from the high voltage power source to the charging roller 156 by a control circuit (not shown), that is, an alternating voltage is applied, and a charging voltage pattern in which the conveying belt 151 alternates, that is, In the sub-scanning direction, which is the circumferential direction, plus and minus are alternately charged in a band shape with a predetermined width. When the sheet 142 is fed onto the conveying belt 151 that is alternately charged with plus and minus, the sheet 142 is attracted to the conveying belt 151, and the sheet 142 is conveyed in the sub-scanning direction by the circumferential movement of the conveying belt 151.

  Therefore, by driving the recording head 134 according to the image signal while moving the carriage 133, ink droplets are ejected onto the stopped paper 142 to record one line, and after the paper 142 is conveyed by a predetermined amount, Record the next line. Upon receiving a recording end signal or a signal that the trailing edge of the paper 142 has reached the recording area, the recording operation is finished and the paper 142 is discharged onto the paper discharge tray 113.

  As described above, the image forming apparatus includes the liquid discharge head unit 1 according to the present invention. Therefore, since the ink can be discharged at high density, the printing speed is high, the size is small, and the high-quality inkjet recording apparatus can be realized. . In the above embodiment, the present invention is applied to an ink jet head, but it is also applied to a liquid droplet other than ink, for example, a liquid discharge head that discharges a liquid resist for patterning, a liquid discharge head that discharges a gene analysis sample, and the like. I can.

  Although the embodiments have been described above, the present invention is not limited to the embodiments shown in the drawings. Other embodiments, additions, changes, deletions, and the like can be changed within a range that can be conceived by those skilled in the art. Any aspect is included in the scope of the present invention as long as the operations and effects of the present invention are exhibited.

DESCRIPTION OF SYMBOLS 1 Liquid discharge head unit 2 Liquid discharge head 3 Electric circuit board 3e Electrode 3e1 End 4 Tank 11 Nozzle 12 Nozzle plate 13 Liquid chamber 14 Flow path plate 15 Vibration plate member 16 Piezoelectric actuator 17 Frame member 17a, 17b Opening 18 Common liquid Chamber 19 Filter portion 21 Substrate 22 Piezoelectric element member (pressure generating means)
DESCRIPTION OF SYMBOLS 23 Flexible wiring board 23a Input terminal 23e Electrode 23e1, 23e2 End 23r Resist layer 24 Solder 31 Substrate main body 32 Electronic component 33 FFC connector 34 Opening 40 Resist member 41 Recess 50 Heater chip 50w End surface 51 Insulating sheet 52 Shielding member

JP 2010-027762 A JP 2006-179192 A

Claims (7)

Manufacture of a liquid discharge head for discharging liquid droplets, comprising pressure generating means for generating pressure for discharging liquid droplets, a flexible wiring board connected to the pressure generating means, and an electric circuit board connected to the flexible wiring board A method,
Applying solder to at least one of the electrodes on the flexible wiring board and the electric circuit board,
At least one of the side surfaces of the electrode on the electric circuit board in the first direction, which is the direction in which the flexible wiring board is drawn out on the electric circuit board, at a position facing the electrode on the flexible wiring board , An insulating resist member is formed so that the electrode on the electric circuit board does not protrude to the electrode side on the flexible wiring board from the surface facing the electrode on the flexible wiring board via the solder. And
In the first direction, the one in which the resist member is formed in at least the opposite position of both ends of the electrode on the flexible wiring board is positioned outside the end of the electrode on the electric circuit board. Overlapping in state
A method of manufacturing a liquid discharge head, comprising applying heat from an electrode side on the flexible wiring board to melt and cure the solder to join the electrode on the flexible wiring board and the electrode on the electric circuit board. The tool for applying heat is a thermocompression bonding tool,
The end face of the thermocompression bonding tool in the first direction of the electrode on the flexible wiring board is located outside the end part in the first direction of the electrode on the electric circuit board. 2. A method for manufacturing a liquid discharge head according to 1.   The method of manufacturing a liquid ejection head according to claim 1, wherein the resist member is provided with a recess on a surface facing the electrode on the flexible wiring board.   The method of manufacturing a liquid ejection head according to claim 1, wherein the resist member is formed on both sides of a second direction orthogonal to the first direction of the electrode on the electric circuit board. . A liquid ejection head for ejecting liquid droplets, comprising: a pressure generation means for generating a pressure for ejecting liquid droplets; a flexible wiring board connected to the pressure generation means; and an electric circuit board connected to the flexible wiring board. And
The electrode on the flexible wiring board and the electrode on the electric circuit board are joined with solder,
At least one of the side surfaces of the electrode on the electric circuit board in the first direction, which is the direction in which the flexible wiring board is drawn out on the electric circuit board, at a position facing the electrode on the flexible wiring board , An insulating resist member is formed so that the electrode on the electric circuit board does not protrude to the electrode side on the flexible wiring board from the surface facing the electrode on the flexible wiring board via the solder. And
In the first direction, the one in which the resist member is formed in at least a position facing both ends of the electrode on the flexible wiring board is positioned outside the end of the electrode on the electric circuit board. A liquid discharge head. A liquid generating head having a pressure generating means for generating a pressure for discharging a droplet, a flexible wiring board connected to the pressure generating means, an electric circuit board connected to the flexible wiring board, and supplying the liquid discharging head to the liquid discharging head A liquid discharge head unit comprising a tank for storing liquid,
The electrode on the flexible wiring board and the electrode on the electric circuit board are joined with solder,
At least one of the side surfaces of the electrode on the electric circuit board in the first direction, which is the direction in which the flexible wiring board is drawn out on the electric circuit board, at a position facing the electrode on the flexible wiring board , An insulating resist member is formed so that the electrode on the electric circuit board does not protrude to the electrode side on the flexible wiring board from the surface facing the electrode on the flexible wiring board via the solder. And
In the first direction, the one in which the resist member is formed in at least a position facing both ends of the electrode on the flexible wiring board is positioned outside the end of the electrode on the electric circuit board. A liquid discharge head unit.   An image forming apparatus comprising the liquid discharge head unit according to claim 6.

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