JP6065598B2 - Film pasting apparatus and film pasting method - Google Patents

Description

The present invention relates to a film sticking apparatus and a sticking method for sticking a film to a substrate, and more particularly to a film sticking apparatus and a sticking method for sticking a film to a substrate having a through hole.

In a manufacturing process of a semiconductor device used for an electronic device or the like, a wiring layer formed on a substrate may be protected with a protective film, or an insulating film may be attached to form an insulating layer. At this time, since there are irregularities due to the formed wiring layer on the surface of the substrate, air bubbles may enter between the substrate and the film, or the film may become wrinkles. Since such bubbles and wrinkles lead to defective products, various methods for attaching a film to a substrate without generating bubbles and wrinkles have been proposed.

For example, Patent Documents 1 and 2 describe a method in which a film (tape) is attached to a substrate having an uneven surface under reduced pressure. Further, in Patent Document 3, when an adhesive tape is applied to a concave substrate whose inner peripheral portion has been ground, the inner peripheral ground portion is bent by a support plate that holds the rib-shaped outer peripheral portion and floats by gas ejection. In other words, a method for preventing generation of wrinkles and bubbles by holding the substrate flat is described.

On the other hand, MEMS (Micro Electro Mechanical Systems) technology applying a semiconductor manufacturing process has been put into practical use because of the demand for downsizing electronic devices and the like. In MEMS, a structure such as a through-hole penetrating a substrate is frequently used, and the shape of the substrate surface is more complicated than a general semiconductor device.

JP 2010-135436 A JP 2005-529767 A Japanese Patent Application Laid-Open No. 2010-165962

A film used in a semiconductor device or MEMS manufacturing process generally includes a plurality of layers. For example, the film has a structure in which a material layer is laminated on a base film. In the case of forming an insulating layer, the material layer is a layer containing an insulating substance and is selected depending on a layer formed in a semiconductor device or a MEMS. The base film supports the material layer and prevents the material layer from being attached to a portion where pressure application is performed when the base film is attached to a base material or the like. Moreover, it may be a 3 layer structure which has arrange | positioned the protective film on the material layer. For example, when a film having a three-layer structure including a protective film is attached to a base material, the protective film is peeled off, attached to the base material, and then the base film is peeled off to form a material layer on the base material. . When a roll sheet film is used, there is usually no protective film, and the base film is peeled off from the material layer after being attached to the substrate.

In the MEMS having a more complicated surface shape, the generation of bubbles and wrinkles becomes more prominent when a film is attached. In addition, since a structure such as a through-hole has the purpose of utilizing the structure, for example, when an insulating layer is formed with an insulating film, the adhesive component of the insulating film or a part of the insulating film remains in the through-hole part. It is not preferable to end up. However, in the methods such as Patent Documents 1 to 3, although the adhesion of the film to the substrate surface is improved, the film member enters the inside of the through-hole at the time of pasting and cannot be completely removed even in the subsequent removal process. There was a problem that remained. In addition, the residue remaining in the through hole without being completely removed may have an adverse effect as an impurity in the subsequent process.

The present invention solves the above-mentioned problems, and prevents the generation of bubbles between the substrate and the film and the generation of film wrinkles at the time of attachment, and suppresses the remaining of the film residue in the through-holes. An object of the present invention is to provide a film pasting apparatus and a film pasting method.

According to an embodiment of the present invention, a film is disposed on the first surface of the substrate, the support unit supporting the substrate having a through hole, and a predetermined pressure and a predetermined temperature are applied to the film. A pressing portion that presses the substrate against the substrate, and a storage portion that stores the supporting portion and the pressing portion, wherein the supporting portion is a second surface of the substrate opposite to the first surface. A pressure part for introducing a fluid into the through-hole, and the pressing part presses the film against the substrate at a first pressure and a first temperature, and the pressure part causes the inside of the through-hole to Under the introduction of the fluid into the substrate, the film is pressed against the substrate at a second pressure higher than the first pressure and a second temperature higher than the first temperature, and the film is A film sticking device for fixing to one surface is provided.

The film sticking apparatus according to the present embodiment temporarily fixes the film on the surface of the substrate having the through holes at the first pressure lower than the second pressure and the first temperature lower than the second temperature. The fluid is introduced into the through-hole from the opposite side of the substrate and pressed at the second pressure higher than the first pressure and the second temperature higher than the first temperature while pressurizing the film from the back side. As a result, the film is fixed to the substrate. Thereby, the generation | occurrence | production of the bubble between a board | substrate and a film and the generation | occurrence | production of the wrinkle of a film can be prevented, and the residue of the residue of the film to a through-hole can be suppressed.

In the film pasting apparatus, a structure is formed on the first surface of the substrate, the storage unit includes a decompression unit that decompresses the inside, and the decompression of the substrate under the decompression by the decompression unit The film may be disposed on a first surface and pressed against the substrate with the first pressure and the first temperature.

When a structure such as a wiring layer is formed on the surface and the film is attached to the substrate, the film attaching device according to the present embodiment temporarily reduces the inside of the storage unit and temporarily fixes the film on the surface of the substrate. Generation of air bubbles between the substrate and the film and generation of wrinkles of the film can be prevented.

In the film sticking apparatus, a cooling gas may be introduced as the fluid.

When fixing the film to the substrate after temporary fixing, the film bonding apparatus according to the present embodiment introduces a cooling gas lower than the first temperature into the through hole from the opposite side of the substrate, and cools the film while cooling. By applying pressure from the back side, the film can be prevented from entering the through-hole, and the residue of the film residue in the through-hole can be suppressed.

In the film sticking apparatus, the second temperature is a temperature range suitable for fixing the film to the substrate, and the second pressure is suitable for fixing the film to the substrate. It may be a range of pressure.

The film affixing apparatus according to the present embodiment temporarily fixes the film at a low pressure and temperature, thereby preventing the film from entering the through hole and at a temperature range and pressure suitable for fixing the film to the substrate. The film can be reliably fixed to the substrate within the range of.

In the film pasting apparatus, the pressing unit includes a first pressing unit that presses the film against the substrate at the first pressure and the first temperature, and the second pressure and the second temperature. And a second pressing part that presses the film against the substrate.

The film sticking apparatus according to the present embodiment includes at least two pressing portions having different temperatures, thereby omitting the switching operation of the temperature of the pressing portion and the time required for the pressing portion, and efficiently sticking the film to the substrate. it can.

According to one embodiment of the present invention, a film is disposed on a first surface of a substrate having a through hole, and the film is pressed against the substrate at a first pressure and a first temperature, and the first Fluid is introduced into the through hole from the second surface of the substrate opposite to the surface of the substrate, the film positioned on the through hole is pressurized in the first surface direction, and a second pressure is applied. And pressing the film against the substrate at a second temperature to fix the film to the first surface of the substrate, the first pressure being lower than the second pressure, and the first pressure A method for attaching a film is provided in which the temperature is lower than the second temperature.

The film sticking method according to the present embodiment temporarily fixes the film on the surface of the substrate having a through hole at a first pressure lower than the second pressure and a first temperature lower than the second temperature, The film is fixed to the substrate by introducing a fluid into the through hole from the opposite side of the substrate and pressing the film located on the through hole from the back side at the second pressure and the second temperature. To do. Thereby, the generation | occurrence | production of the bubble between a board | substrate and a film and the generation | occurrence | production of the wrinkle of a film can be prevented, and the residue of the residue of the film to a through-hole can be suppressed.

In the film pasting method, a structure is formed on the first surface of the substrate, the film is disposed on the first surface of the substrate under reduced pressure, and the first pressure and the first The film may be pressed against the substrate at a temperature of 1.

When a structure such as a wiring layer is formed on the surface and the film is attached to the substrate, the film attaching method according to the present embodiment is reduced in pressure to temporarily fix the film on the surface of the substrate. It is possible to prevent the generation of air bubbles and the generation of film wrinkles.

In the film attaching method, a cooling gas may be introduced as the fluid.

In the film attaching method according to the present embodiment, when the film is fixed to the substrate after temporary fixing, a cooling gas lower than the first temperature is introduced into the through hole from the opposite side of the substrate to cool the film while cooling. By applying pressure from the back side, the film can be prevented from entering the through-hole, and the residue of the film residue in the through-hole can be suppressed.

In the film attaching method, the second temperature is a temperature range suitable for fixing the film to the substrate, and the second pressure is suitable for fixing the film to the substrate. It may be a range of pressure.

The film attaching method according to the present embodiment prevents the film from entering the through hole by temporarily fixing the film at a low pressure and temperature, and is suitable for fixing the film to the substrate. The film can be reliably fixed to the substrate within the range of.

According to the present invention, a film sticking apparatus and a film sticking method that prevent the generation of bubbles between the substrate and the film and the occurrence of wrinkles of the film at the time of sticking and suppress the remaining of the film residue in the through holes. Can be provided.

It is a schematic diagram which shows the outline | summary of this invention, (a) shows the 1st process of temporarily fixing a film on a board | substrate, (b) shows the 2nd process of fixing a film on a board | substrate. The schematic diagram of the film sticking apparatus 1000 which concerns on one Embodiment of this invention is shown, (a) shows the whole figure of the film sticking apparatus 1000, (b) shows the top view of the support part 1100. FIG. It is a mimetic diagram showing layered product 200 concerning one embodiment of the present invention. The modification of the support part of this invention is shown, (a) shows sectional drawing of the support part 2100, (b) shows the top view of the support part 2100. The modification of the support part of this invention is shown, (a) shows sectional drawing of the support part 3100, (b) shows the top view of the support part 3100. It is a schematic diagram which shows the modification of the press part of this invention. It is a schematic diagram which shows the modification of the press part of this invention. It is a schematic diagram which shows the modification of the press part of this invention, (a) shows sectional drawing of the press part 5200, (b) shows the top view of the press part 5200. The modification of the storage part of this invention is shown, (a) is a schematic diagram which shows the film sticking apparatus 6000 in which the storage part was comprised by the double structure, (b) is a schematic diagram which shows the film sticking apparatus 7000. It is. It is a schematic diagram of the processed material which affixed the conventional film.

Hereinafter, a film sticking apparatus and a film sticking method according to the present invention will be described with reference to the drawings. However, the film sticking apparatus and the film sticking method of the present invention can be implemented in many different modes, and are not construed as being limited to the description of the embodiments described below. Note that in the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference numerals, and repetitive description thereof is omitted.

FIG. 10 is a schematic view of a workpiece on which a conventional film is attached. FIG. 10A shows a workpiece 800 having a through hole with a conventional film attached thereto, and FIG. 10B shows a conventional workpiece 900 with the film on the through hole removed. In the workpiece 800, the wiring 30 is formed on the upper surface of the substrate 10 having the through hole 90, and a film 850 is attached so as to cover the wiring 30. As described above, in the conventional workpiece 800, bubbles 860 remain at the corners between the upper surface of the substrate 10 having the through holes 90 and the side surfaces of the wiring 30, voids are generated, and the film 850 extends to the inside of the through holes 90. Enters.

When the film 950 located on the through hole 90 is removed by etching or the like, a film residue 955 remains on the side surface of the through hole 90 of the workpiece 900 as shown in FIG.

The present inventors diligently studied to solve the above problems. FIG. 1 is a schematic diagram showing an outline of the present invention. FIG. 1A shows a first step of temporarily fixing a film on the substrate, and FIG. 1B shows a second step of fixing the film on the substrate. A film 50 on which a base film 55 is laminated under a low pressure and low temperature conditions, which are lower than general conditions for fixing the film, is temporarily fixed on the substrate 10, and the base film is fluidized from the side where the film 50 of the through hole 90 is not formed. It was found that by fixing the film 50 laminated with 55 while pressing, it was possible to prevent the film 50 from entering the through-hole 90 and, as a result, it was possible to suppress residual residues. FIG. 1B shows an example in which a roller 1200 is used to fix the film 50 on which the base film 55 is laminated to the substrate 10. Further, by performing the first step under reduced pressure, generation of bubbles between the substrate 10 and the film 50 and generation of wrinkles of the film can be prevented even if the MEMS has a complicated surface structure.

FIG. 2 is a schematic diagram of a film sticking apparatus 1000 according to an embodiment of the present invention. 2A shows an overall view of the film sticking apparatus 1000, and FIG. 2B shows a top view of the support portion 1100. FIG. For example, the film pasting apparatus 1000 includes a support unit 1100 that supports a substrate 10 having a through hole, and a film 50 in which a base film 55 is laminated on a first surface (upper surface in the drawing) of the substrate 10. And a storage unit 1300 for storing the pressing unit 1200 that presses the film 50 against the substrate 10, and the support unit 1100 and the pressing unit 1200.

The support unit 1100 includes a support structure 1110 that supports the substrate 10. In FIG.2 (b), the support part 1100 which has a circular edge part and a some cylindrical part is shown as an example. The shape of the support portion 1100 is not limited to a circular shape or a cylindrical shape, and may be an arbitrary shape such as a rectangle according to the shape of the substrate 10. When the structure is provided on both surfaces of the substrate 10, the support portion 1100 is preferably a structure that supports at least the peripheral edge portion of the substrate 10. The support part 1100 arranged along the peripheral edge of the substrate 10 may have a structure in which a space formed by the support part 1110 and the substrate 10 is sealed in a state where the substrate 10 is placed. The support 1100 may have a notch so that the space is opened. Further, the support portion 1100 includes a pressurizing portion 1130 that introduces fluid into the through hole from the second surface of the substrate 10 opposite to the first surface, that is, the lower surface side of the substrate 10. In FIG. 2 (b), as an example, a circular edge and an opening other than a plurality of cylindrical portions are shown, but the present invention is not limited to this. The support portion 1100 is disposed in a portion of the substrate 10 where the through hole 90 is formed, where the through hole 90 is avoided. A piping 1180 disposed inside the shaft portion 1170 of the support portion 1100 is connected to the pressurizing portion 1130, and fluid is supplied from an external piping 1150. The supply of fluid can be adjusted by connecting to the pipe 1150 and opening and closing a valve 1190 provided outside. Although not shown, the support unit 1100 may include a discharge unit that discharges the fluid supplied by the pressurization unit 1130 to the outside.

The fluid according to the present embodiment is not particularly limited as long as it is a fluid that can be introduced into the through-hole 90 and pressurize the film 50 from the back side. By supplying the fluid from the pressurizing unit, the back side of the film 50 can be pressurized with high uniformity within the substrate surface even if the substrate has a large number of through holes. The fluid according to the present embodiment may be gas or liquid. The gas or liquid may be used at room temperature, but it is preferable to use a cooled one that is lower than room temperature. This is because deformation of the film 50 due to heating of the pressing portion 1200 can be suppressed. When cooling gas is used as the fluid, the temperature of the gas may be set to 5 ° C to 15 ° C, for example. Examples of the gas include gases known in the semiconductor manufacturing field that do not exhibit reactivity, such as nitrogen, air, and rare gases (Ne, Ar, Xe). Examples of the liquid include water (ultra pure water) and liquids known in the semiconductor manufacturing field. When the storage unit 1300 is controlled under reduced pressure, it is preferable to use a gas as the fluid.

The pressing part 1200 has a heating element (not shown) inside, and is in contact with the film 50 on which the base film 55 is laminated by a surface or a line. In the present embodiment, a known pressure roller provided with a heating element such as a nichrome wire can be used as the pressing portion 1200, for example. The pressing unit 1200 presses the film 50 against the substrate 10 from the base film 55 side with a first pressure and a first temperature for temporarily fixing the film 50 to the substrate 10. The pressing unit 1200 presses the film 50 against the substrate 10 from the base film 55 side with a second pressure and a second temperature for fixing the film 50 to the substrate 10. Here, the first pressure is lower than the second pressure, and the first temperature is lower than the second temperature. As the first temperature, it is preferable to select a temperature that is poor in fluidity and lower than the second temperature and does not enter the through hole. The first temperature can be set in consideration of the softening point of the material constituting the film. Moreover, as a 1st pressure, it is good to select the pressure of the grade which a film does not penetrate | invade in a through-hole by pressure. Therefore, the first pressure and the first temperature are pressures and temperatures at which the film 50 cannot be completely fixed to the substrate 10 and can be simply adhered. Here, the second pressure and the second temperature are determined by the physical properties of the film 50 to be used, and are a temperature range and a pressure range suitable for fixing the film 50 to the substrate 10. In general, the range of the second pressure and the second temperature is provided by the manufacturer of the film 50 as information.

The storage unit 1300 engages with the pair of bases 1350 to decompress the internal space in which the support unit 1100 and the pressing unit 1200 are stored. The storage unit 1300 can be depressurized by, for example, operating a vacuum pump (not shown) connected to the pipe 1381 and the valve 1391. The storage unit 1300 can return the pressure by closing the valve 1391 and opening the valve 1393 connected to the pipe 1383 to introduce air or the like into the interior.

The film 50 is continuously supplied by a pair of rollers 1410 and 1430 arranged outside the storage unit 1300. The film 50 according to the present embodiment is a known film in the field of semiconductor manufacturing processes such as a protective film, an insulating film, and a dry film resist, and MEMS. The film 50 is formed of a material that can be in close contact with the substrate 10 by being pressed and heated by the pressing unit 1200.

The protruding film is removed from the substrate 10 to which the film 50 is attached. The removal of the protruding film can be performed by a known method, for example, by cutting along the edge of the substrate 10 with a cutter. Then, the layer can be formed by peeling the base film 55 from the film 50.

In the present embodiment, the substrate 10 is a substrate having a through-hole 90 and may have a structure 30 such as a wiring on the first surface (upper surface).

(Film pasting method)
The film sticking method using the film sticking apparatus 1000 will be described below. The substrate 10 having the through hole 90 is disposed on the support portion 1100. By rotating the roller 1410 and the roller 1430, the film 50 laminated with the base film 55 is sent out, and the film 50 laminated with the base film 55 is disposed on the first surface (upper surface) of the substrate 10. The pressing unit 1200 is operated to press the film 50 against the substrate 10 at a first pressure and a first temperature lower than the second pressure and the second temperature for fixing the film 50 on which the base film 55 is laminated to the substrate 10. To do. Thereby, the film 50 is temporarily fixed to the substrate 10.

Next, a fluid is supplied to the pressurizing unit 1130 from the pipe 1150, and the fluid is introduced into the through hole 50 from the second surface of the substrate 10 opposite to the first surface, that is, from the lower surface side. The introduced fluid is pressurized in the first surface direction. When the introduced fluid is cooled, the film 50 is cooled. The pressing unit 1200 is operated at the second pressure and the second temperature, and the film 50 is pressed against the 10 substrate from the base film 55 side to fix the film 50 to the first surface of the substrate 10. Thereby, the residue of the residue of the film to a through-hole can be suppressed.

Here, the temperature of the fluid to be introduced is preferably room temperature or lower. When the pressing part 1200 is pressed at the second temperature, the film 50 is softened and the fluidity is increased, so that the film 50 can easily enter the through hole 90. However, by supplying a low-temperature fluid to the back side of the film 50, it is possible to suppress the film 50 from being cooled and increasing its fluidity. Thereby, the residue of the film 50 in the through hole 90 can be suppressed.

In particular, when the film 50 is attached to the substrate 10 having the structure 30 such as wiring, the storage unit 1300 is decompressed by a vacuum pump or the like. By placing the film 50 having the base film 55 side laminated on the upper surface of the substrate 10 under reduced pressure and pressing the film 50 against the substrate 10 from the base film 55 side at the first pressure and the first temperature, the substrate and the film Generation of air bubbles between them and generation of wrinkles of the film can be prevented. After temporary fixing, the inside of the storage unit 1300 may be released from the decompression condition.

The protruding film is removed from the substrate 10 to which the film 50 is attached. The removal of the protruding film can be performed by a known method, for example, by cutting along the edge of the substrate 10 with a cutter. Then, the layer can be formed by peeling the base film 55 from the film 50. Thus, the laminated body 200 by which the film 50 was affixed on the board | substrate 10 can be manufactured. FIG. 3 is a schematic view showing a laminate 200 according to an embodiment of the present invention. Here, the film 50 may be removed after the predetermined processing on the substrate 10 is completed. For example, the film 50 remains on the substrate 10 even after the predetermined processing is completed like a permanent insulating film. Also good.

As described above, according to the film sticking apparatus and the film sticking method according to the present embodiment, it is possible to prevent generation of bubbles between the substrate and the film and sticking of the film at the time of sticking, and to the through hole. The remaining of the film residue can be suppressed.

(Modification of support part)
FIG. 4 shows a modification of the support portion. FIG. 4A shows a cross-sectional view of the support portion 2100, and FIG. 4B shows a top view of the support portion 2100. The support part 2100 has a shower head shape. The pressurizing unit 2130 is a small hole for ejecting fluid. By using the pressurizing unit 2130 having such a small hole, the pressure when supplying the fluid to the through hole 90 can be increased. Further, the small holes of the pressurizing unit 2130 may be formed in the same pattern as the arrangement pattern of the through holes 90 of the substrate 10 to be processed. By arranging the small holes in such a pattern and aligning with the through holes 90, the fluid can be efficiently supplied to the through holes 90.

FIG. 5 shows a further modification of the support part. FIG. 5A shows a cross-sectional view of the support portion 3100, and FIG. 5B shows a top view of the support portion 3100. The support portion 3100 has the same configuration as the support portion 2100 in that it has a showerhead shape. The support part 3100 has a suction hole 3140 in addition to the pressure part 3130 on the surface on which the substrate 10 is placed. The suction hole 3140 is connected to a vacuum pump (not shown) provided outside, and the substrate 10 is brought into close contact with the support portion 3100 by reducing the pressure. By having such a configuration, it is possible to prevent the substrate 10 from being detached from the support portion 3100 due to the pressure when the fluid is supplied from the small hole. Note that the substrate 10 can be removed from the support portion 3100 by stopping the pressure reduction from the suction hole 3140 and setting the pressure to normal pressure.

(Modification of pressing part)
FIG. 6 shows a modification of the pressing portion. The film sticking apparatus 4000 is different from the film sticking apparatus 1000 in that it includes a first pressing part 4210 and a second pressing part 4230. Since the other configuration is the same as that of the film sticking apparatus 1000, detailed description is omitted. The first pressing portion 4210 presses the film 50 against the substrate 10 with a first pressure and the first temperature. Further, the second pressing portion 4230 presses the film 50 against the substrate 10 with the second pressure and the second temperature. In the film sticking apparatus 1000, it was necessary to control to two temperatures by one pressing part 1200. In this case, it takes time to raise the temperature from the first temperature to the second temperature. Further, when the film is continuously applied, it is necessary to separately provide a cooling means for lowering the temperature from the second temperature to the first temperature, and it takes a time for the temperature to drop. On the other hand, in the film sticking apparatus 4000, by providing the first pressing part 4210 and the second pressing part 4230, time and cooling means associated with temperature switching become unnecessary, and continuous film sticking can be performed. it can.

In FIG. 7, the further modification of a press part is shown. The film sticking apparatus 5000 is different from the film sticking apparatus 1000 in that the support part 3100 and the pressing part 5200 are provided. Since the other configuration is the same as that of the film sticking apparatus 1000, detailed description is omitted. FIG. 8 is a schematic diagram showing the pressing portion 5200. FIG. 8A shows a cross-sectional view of the pressing portion 5200, and FIG. 8B shows a top view of the pressing portion 5200. The small holes of the support portion 3100 are formed in the same pattern as the arrangement pattern of the through holes 90 of the substrate 10 to be processed. Further, the pressing portion 5200 has a concave portion 5210 corresponding to the arrangement pattern of the through holes 90 of the substrate 10 on the surface that presses the film 50, and has a heating wire 5130 inside. The pressing portion 5200 is heated by the heating wire 5230, but the concave portion 5210 does not heat or pressurize the film 50 because the thermal conductivity is lower than that of other portions. The film sticking device 5000 supplies a fluid from the pressurizing unit 3130 of the support unit 3100 to the through hole 90. At the same time, the film sticking device 5000 does not heat and press the film 50 in the recesses 5210 that match the arrangement pattern of the through holes 90 when pressing the film 50, so that the film 50 enters the through holes 90. Can be prevented.

(Modification of storage part)
FIG. 9 shows a modification of the storage unit. FIG. 9A is a schematic diagram showing a film sticking device 6000 having a double storage structure. The film pasting apparatus 6000 includes a storage unit 6330 connected to a pipe 6331 outside the storage unit 6310 similar to the storage unit 1300 of the film pasting apparatus 1000. A vacuum pump (not shown) is connected to the pipe 6331 and is opened and closed by a valve 6333. Since the other configuration is the same as that of the film sticking apparatus 1000, detailed description is omitted. In the film sticking apparatus 6000, by disposing the storage unit 6330 outside the storage unit 6310, it is possible to form a double reduced pressure state in which the space between them is reduced.

FIG. 9B illustrates a configuration in which the entire apparatus including the roller 1410 and the roller 1430 is covered with the storage unit 7300. Since the other configuration is the same as that of the film sticking apparatus 1000, detailed description is omitted. Thus, the film sticking apparatus 7000 can implement | achieve a higher pressure reduction effect by covering the whole.

(Modification of film processing)
In order to prevent the film 50 from entering the through hole 90 of the substrate 10 at the time of pasting and to suppress the residue of the residue of the film 50 in the through hole 90, for example, according to the pattern of the through hole 90, the through hole 90 The portion of the film 50 positioned above may be cured in advance. For example, by using a thermosetting resin or a photocurable resin for the film 50, it is also possible to perform panning using light or heat in advance.

10: Substrate, 30: Wiring, 50: Film, 90: Through-hole, 100: Electrode system, 200: Laminate, 800: Workpiece, 850: Film :, 860: Bubble, 900: Workpiece, 950: Film, 955: Residue, 1000: Film sticking device, 1100: Supporting part 1100: Supporting structure, 1130: Pressurizing part, 1170: Shaft part, 1180: Piping, 1190: Valve, 1200: Pressing part, 1300: Storage part, 1350 : Stand, 1381: piping, 1383: piping, 1391: valve, 1393: valve, 1410: roller, 1430: roller, 2100: support unit, 2130: pressurization unit, 3100: support unit, 3130: pressurization unit, 3140 : Suction hole, 4000: film sticking device, 4210: first pressing part, 4230: second pressing part, 5000: film sticking device, 5 00: pressing portion 5210: recess 5130: heating wire, 6000: Film applier, 6330: storage unit, 6331: piping 6333: valve, 7000: Film applier, 7300: storage unit

Claims (9)

A support part for supporting a substrate having a through hole;
Placing a film on the first surface of the substrate, applying a predetermined pressure and a predetermined temperature to the film, and pressing the film against the substrate;
A storage section for storing the support section and the pressing section;
Control means ,
The support portion includes a pressurizing portion that introduces a fluid into the through hole from the second surface of the substrate opposite to the first surface,
The control means includes
Controlling the pressing portion to a first pressure and a first temperature to press the film against the substrate;
Under the fluid introduction into the through-hole by the pressurizing unit, the pressing unit is controlled to a second pressure higher than the first pressure and a second temperature higher than the first temperature , A film sticking apparatus, wherein the film is pressed against the substrate to fix the film to the first surface of the substrate. A structure is formed on the first surface of the substrate;
The storage unit has a decompression unit for decompressing the inside,
Placing the film on the first surface of the substrate under reduced pressure by the decompression unit;
It said control means, said first pressure and by controlling the pressing portion to the first temperature, the film attaching device according to claim 1, characterized in that for pressing the film to the substrate. The film sticking apparatus according to claim 1, wherein a cooling gas is introduced as the fluid. The second temperature is a temperature range suitable for fixing the film to the substrate, and the second pressure is a pressure range suitable for fixing the film to the substrate. The film sticking apparatus according to claim 1, wherein the film sticking apparatus is a film sticking apparatus. The pressing portion includes a first pressing portion that presses the film against the substrate at the first pressure and the first temperature;
5. The film sticking device according to claim 1, further comprising a second pressing portion that presses the film against the substrate at the second pressure and the second temperature. Placing the film on the first surface of the substrate having a through hole, pressing the film against the substrate at a first pressure and a first temperature;
Introducing a fluid into the through-hole from the second surface of the substrate opposite to the first surface, and pressurizing the film located on the through-hole in the first surface direction;
Pressing the film against the substrate at a second pressure and a second temperature, fixing the film to the first surface of the substrate;
The method for attaching a film, wherein the first pressure is lower than the second pressure, and the first temperature is lower than the second temperature. A structure is formed on the first surface of the substrate,
The film according to claim 6, wherein the film is disposed on the first surface of the substrate under reduced pressure, and the film is pressed against the substrate at the first pressure and the first temperature. Pasting method. 8. The film sticking method according to claim 6, wherein a cooling gas is introduced as the fluid. The second temperature is a temperature range suitable for fixing the film to the substrate, and the second pressure is a pressure range suitable for fixing the film to the substrate. The film sticking method according to any one of claims 6 to 8, characterized in that

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