JP6063470B2 - Viscous fluid supply apparatus and viscous fluid supply method - Google Patents

Description

  The present invention relates to a viscous fluid supply apparatus that supplies viscous fluid to an object and a viscous fluid supply method that supplies viscous fluid.

  Patent Document 1 discloses a screen printing machine that supplies solder contained in a solder discharge device onto a mask, scrapes the solder by moving a squeegee, and prints the solder on a circuit board from a through hole provided in the mask. Is described. In the screen printer, the height of the solder rolled by the squeegee is detected by a laser-type solder height sensor, and when the detected solder height is lower than the set value, the solder discharge device moves. (The supply operation is performed again) and the solder is replenished. As a result, a shortage of solder supply is suppressed.

Japanese Patent Laid-Open No. 05-261892

  An object of the present invention is to stabilize the amount of a viscous fluid such as a printing agent such as cream solder (hereinafter abbreviated as solder) or an adhesive supplied to an object.

Means and effects for solving the problem

In the viscous fluid supply apparatus according to the present invention, the viscous fluid supply operation of the viscous fluid container (hereinafter sometimes simply referred to as supply operation) is controlled based on the remaining amount.
Viscous fluid is contained in the viscous fluid container, but the amount of viscous fluid supplied to the object is the same even when the same supply operation is performed depending on whether the remaining amount of viscous fluid is large or small. It is known to vary. For example, as shown by a solid line A in FIG. 13, when solder that is not sufficiently stirred is used as the viscous fluid, one supply operation is performed as the remaining amount of the viscous fluid in the viscous fluid container decreases. In this case, the amount of viscous fluid supplied to the object (hereinafter sometimes abbreviated as one supply amount) increases. When the stirring is not sufficient, the viscosity and density are non-uniform, and the portion having high viscosity and high density is present at the bottom of the container. For this reason, it is presumed that when the supply is started (when the remaining amount is large), the amount of one supply decreases, and when the number of times of supply increases (when the remaining amount decreases), the supply amount increases. In addition, when a viscous fluid having a relatively low viscosity other than solder is used, the supply amount may decrease as the number of supply increases. On the other hand, when the same viscous fluid is used and the stroke (movement distance) of the viscous fluid container is the same, when the moving speed of the viscous fluid container is fast, the supply amount of one time is less than when it is slow. Less.
Therefore, if solder with insufficient stirring is used, if the moving speed is made faster than when there is a large amount when the remaining amount is small, it is possible to suppress an increase in the amount of supply once and make it almost constant. Is possible. In addition, when a viscous fluid having a relatively low viscosity is used, if the moving speed is made slower than when the remaining amount is small, it is possible to suppress a decrease in the amount of supply once, and make it almost constant. It becomes possible.

Patentable invention

In the following, the invention recognized as being able to be claimed in the present application will be described.
(1) A viscous fluid supply device that supplies a viscous fluid to an object by moving the viscous fluid container containing the viscous fluid while discharging the viscous fluid from the viscous fluid container,
The viscous fluid supply operation including at least one of discharge of the viscous fluid from the viscous fluid container and movement of the viscous fluid container is controlled based on the remaining amount of the viscous fluid accommodated in the viscous fluid container. The viscous fluid supply apparatus characterized by including the operation control apparatus which performs.
The viscous fluid includes printing agents such as solder, adhesives, and the like.
(2) An operation condition change in which the operation control device changes at least one of one or more operation conditions defining the viscous fluid supply operation depending on whether the residual amount of the viscous fluid is large or small. The viscous fluid supply device according to item (1) including a section.
(3) The operation control device includes: (a) a remaining amount acquisition unit that acquires the remaining amount of viscous fluid in the viscous fluid container; and (b) a decrease in the remaining amount acquired by the remaining amount acquisition unit. The viscous fluid supply device according to item (1) or (2), further including a remaining amount-dependent operation gradual change unit that gradually changes the viscous fluid supply operation.
The remaining amount acquisition unit may include, for example, one or more level sensors that acquire the remaining amount based on the level of the fluid level (piston position) of the viscous fluid stored in the viscous fluid container. . The remaining amount acquisition unit may detect the remaining amount continuously or stepwise, and the remaining amount-dependent operation gradually changing unit performs supply operation as the remaining amount decreases. It may be changed continuously or in stages.
(4) In the operation control device, the viscous fluid accommodated in the viscous fluid container is consumed by a plurality of viscous fluid supply operations, and the viscosity is determined based on the number of times of supply that is the number of viscous fluid supply operations. The viscous fluid supply apparatus according to any one of (1) to (3), including a number-of-times control unit that controls the fluid supply operation.
When the number of times of supply is large, the remaining amount is less than when the number of times of supply is small, and the viscous fluid supply operation is controlled.
(5) The number-based operation gradual change unit that causes the number-of-times-dependent control unit to gradually change at least one of the one or more operating conditions that define the viscous fluid supply operation as the number of supply increases. The viscous fluid supply device according to any one of (1) to (4).
One viscous fluid supply operation refers to a series of operations when the viscous fluid container is moved while discharging the viscous fluid from the discharge start position to the discharge end position. For example, the viscous fluid container is moved (started). And a plurality of operations such as discharge (including discharge start and discharge end). The viscous fluid stored in the viscous fluid container is consumed by a plurality of supply operations, and the remaining amount of the viscous fluid decreases as the number of supply operations increases.
The operating conditions are often the same during one viscous fluid supply operation, but the operating conditions can be changed even during one viscous fluid supply operation.
(6) Supply amount holding type control for controlling the viscous fluid supply operation in a state where the amount of viscous fluid supplied to the object is constant in the viscous fluid supply operation in one time. The viscous fluid supply device according to item (4) or (5), including a section.
The state where the supply amount at one time is constant means a state where the supply amount is constant.

(7) The viscous fluid supply device according to any one of (1) to (6), wherein the operation control device includes a movement pattern changing unit that changes a movement pattern of the viscous fluid container.
The movement pattern is determined by the movement stroke, the stop time at the supply start position, the movement speed, the idle time (idle distance), and the like.
(8) The operation control device is configured to (i) a moving speed changing unit that changes a moving speed of the viscous fluid container; and (ii) discharging the viscous fluid when the viscous fluid container is in a supply start position. A supply preparation time changing unit that changes the time during which the fluid is stopped, and (iii) a change unit that changes the moving time or moving distance of the viscous fluid container after the viscous fluid discharge end control. The viscous fluid supply device according to any one of (1) to (7), including at least one of them.

(9) The viscous fluid supply device includes a gain input unit capable of inputting a gain by a user, and the operation control device performs the viscous fluid supply operation based on the gain input via the gain input unit. The viscous fluid supply device according to any one of (1) to (8), including an input gain-dependent operation gradual change unit that gradually changes.
For example, the viscous fluid supply operation can be gradually changed at a ratio determined by the input gain.
(10) The viscous fluid supply apparatus includes an operation condition input unit capable of inputting at least one of one or more operation conditions defining the viscous fluid supply operation, and the gain input unit includes the operation condition. A gain for at least one of at least one operation condition input by the input unit can be input, and the input gain-dependent operation gradually changing unit is configured to input the gain by the gain input unit. The viscous fluid supply device according to (9), further including a gain-dependent operation condition gradual change unit that gradually changes the viscous fluid supply operation by gradually changing one operation condition based on a corresponding gain.
(11) The viscous fluid supply device associates the gain input by the gain input unit with the gain input by the gain input unit among the operating conditions input by the operating condition input unit. The viscous fluid supply device according to item (10), including a display for displaying.
The display can have a display function or can include both a display function and an input function.
(12) The first operating condition input unit capable of inputting a first operating condition that is at least one of one or more operating conditions that define the viscous fluid supplying operation, and the viscous fluid supply device; A second operating condition input unit capable of inputting a second operating condition that is at least one of the operating conditions excluding the first operating condition from two or more operating conditions, and can be input by the gain input unit The viscous fluid supply device according to item (10) or (11), wherein a special gain is a gain for at least one of the first operating conditions.
A keyboard, a mouse, one or more switches, a touch panel (display), and the like correspond to the first operating condition input unit, the second operating condition input unit, and the gain input unit. These may be the same or different from each other.
(13) The viscous fluid supply apparatus includes: (a) a first operating condition that is at least one of one or more operating conditions that define the viscous fluid supply operation; and at least one of the first operating conditions. A first screen capable of inputting a gain for each of the first part, and (b) a screen different from the first screen, the operating condition excluding the first operating condition from the one or more operating conditions And a second screen capable of inputting at least one second operating condition, and the first operating condition is other than cream solder even if the viscous fluid is cream solder Item (1) to Item (12) is a condition that can be input even if it is a viscous fluid, and the second operating condition is a condition that can be input when the viscous fluid is a viscous fluid other than cream solder. The viscous fluid supply device according to any one of .
(14) In the viscous fluid supply device, (a) when the number of times of supply that is the number of times of the viscous fluid supply operation reaches a set number of times, and (b) the remaining amount of viscous fluid in the viscous fluid container is Resets the operating condition entered by the user when the end condition is satisfied when at least one of the following is satisfied: (c) When a manual reset operation is performed. The viscous fluid supply device according to any one of (1) to (13), including an operating condition resetting unit.
When a predetermined condition for ending the supply operation is established, the input operation condition, gain, and the like are reset. In addition, the counter for counting the number of times of supply is also reset. Note that the set amount can be an amount that is considered empty.

(15) Any one of the items (1) to (14), wherein the operation control device includes a discharge amount gradually changing unit that gradually changes the discharge amount per unit time of the viscous fluid discharged from the viscous fluid container. The viscous fluid supply apparatus according to one.
(16) The viscous fluid supply device includes an air pressure control device that controls discharge of the viscous fluid by controlling an air pressure in the viscous fluid container. Any one of (1) to (15) The viscous fluid supply device according to any one of the above.
For example, if the air pressure is increased, the discharge amount per unit time can be increased. Further, when the discharge of the viscous fluid is terminated, the air pressure can be made negative.

(17) The viscous fluid container containing the viscous fluid is moved while discharging the viscous fluid from the viscous fluid container to supply the viscous fluid to the object, and the viscous fluid container from the viscous fluid container A viscous fluid supply apparatus for controlling a viscous fluid supply operation including at least one of discharge of a viscous fluid and movement of the viscous fluid container.
The technical feature described in any one of the items (1) to (16) can be employed in the viscous fluid supply device described in this item.
(18) An operation for controlling the viscous fluid supply operation in a state where the viscous fluid stored in the viscous fluid container is supplied a plurality of times and the amount of the viscous fluid supplied at a time is substantially constant. The viscous fluid supply device according to item (17), including a control device.
(19) The viscous fluid supply device according to item (17), including an operation control device that changes the viscous fluid supply operation for each viscous fluid supply operation.
(20) The viscous fluid supply device according to any one of (17) to (19), including a gain-based control device that changes the viscous fluid supply operation based on a gain.
The gain may be a gain input by the user or a gain determined based on the type of viscous fluid, the operating condition of the viscous fluid container, and the like.
(21) (a) a first operating condition that is at least one of one or more operating conditions defining the viscous fluid supply operation, and a gain for at least one of the first operating conditions; A first screen that can be input; and (b) a second screen that can input a second operating condition that is at least one of the operating conditions obtained by removing the first operating condition from the one or more operating conditions. Including display, including
The first operating condition is a condition that can be input regardless of whether the viscous fluid is cream solder or a viscous fluid other than cream solder, and the second operating condition is that the viscous fluid is cream-like. The viscous fluid supply device according to any one of items (17) to (20), which is a condition that can be input when the fluid is a viscous fluid other than solder.

(22) A viscous fluid supply method for supplying a viscous fluid to an object by moving the viscous fluid container containing the viscous fluid while discharging the viscous fluid from the viscous fluid container,
The viscous fluid accommodated in the viscous fluid container is supplied a plurality of times, and the viscous fluid supply operation is performed so that the amount of the viscous fluid supplied in one viscous fluid supply operation is substantially constant. A viscous fluid supply method characterized by controlling.
The technical feature described in any one of the items (1) to (21) can be employed in the viscous fluid supply method described in this item.
(23) A viscous fluid supply method for supplying a viscous fluid to an object by moving the viscous fluid container containing the viscous fluid while discharging the viscous fluid from the viscous fluid container,
The viscous fluid supply method, wherein the viscous fluid accommodated in the viscous fluid container is supplied a plurality of times, and the viscous fluid supply operation is gradually changed as the number of times of supply is increased.
The technical feature described in any one of the items (1) to (22) can be employed in the viscous fluid supply method described in this item.

It is a perspective view which shows the whole electronic circuit assembly line containing the screen printer provided with the viscous fluid supply apparatus which concerns on Example 1 of this invention. It is a perspective view of the solder supply apparatus as said viscous fluid supply apparatus. It is a side view (partial sectional view) of the main part of the solder supply apparatus. It is a front view of the principal part of the said solder supply apparatus. It is a figure which shows the control apparatus contained in the said solder supply apparatus, and its periphery. It is a figure which shows supply operation | movement of the said solder container. It is the screen of the display of the screen printing machine (selection). It is another screen of the above display (gain, operating condition input). It is another screen of the said display (operation condition input). (a), (b) Another screen of the display (reset). It is a flowchart showing the solder supply program memorize | stored in the said memory | storage part. (a) It is a figure showing an example of the value of the input parameter and gain. (b) It is a figure which shows the state of a change with respect to the increase in the frequency | count of parameter supply. It is a figure which shows the change of the quantity of the solder supplied by execution of the said solder supply program compared with the conventional case. It is a flowchart showing the solder supply program memorize | stored in the memory | storage part of the control apparatus of the viscous fluid supply apparatus which concerns on Example 2 of this invention. It is a figure showing the relationship between the operating condition used for execution of the said solder supply program, and residual amount.

  Hereinafter, a solder supply apparatus as a viscous fluid supply apparatus according to an embodiment of the present invention will be described with reference to the drawings. The solder supply device is a component of a screen printer that prints cream-like solder (solder is an example of a viscous fluid) on a circuit board. In the solder supply apparatus, a solder supply method as a viscous fluid supply method according to an embodiment of the present invention is implemented.

FIG. 1 shows an electronic circuit assembly line including a screen printer 2. A display 4 and an operation unit 6 are provided on the front surface of the screen printing machine 2. The operation unit 6 includes a main switch and the like, and the display 4 has a function as a touch panel. By touching a predetermined portion of the screen displayed on the display 4, it is possible to input operating conditions and the like.
In FIG. 2, the solder supply apparatus which is a part of the screen printing machine 2 is shown. When the solder container 10 is moved in the x direction while extruding the solder, the solder is supplied to the mask 14 held on the screen frame 12 while extending in the x direction. Then, a squeegee (not shown) is moved in the y direction along the mask 14, so that the solder is scraped and printed on the circuit board 16 through the through hole formed in the mask 14. In the present embodiment, it can be considered that the mask is an object or the circuit board 16 is an object.
The solder supply device is a device for supplying solder to an object. The solder supply device main body 18, the solder container 10, an air pressure control device 20 (see FIG. 3) for controlling the air pressure in the solder container 10, solder An x-direction moving device 22 for moving the container 10 in the x direction, a rotating device 24 (see FIG. 3) for rotating the solder container 10 between a vertical posture and a horizontal posture, and the like are included.

As shown in FIGS. 3 and 4, the solder container 10 has a longitudinal shape, and is provided with a discharge port 30 at one end, and the opening at the other end is covered with a cap 32 in an airtight manner. A piston 34 is slidably provided inside, and a solder 40 is accommodated therein. Further, the cap 32 is provided with a connection portion 38 for connection with the air pressure control device 20.
The air pressure control device 20 is a device for controlling the air pressure in the solder container 10, and (a) an air source 42 having a positive pressure source (high pressure source) and a negative pressure source, and (b) a connecting portion 38. (B-1) one or more on-off valves 43 provided between the air source 42 and the air source 42, and (b-2) an air pressure adjusting valve 44 for controlling the air pressure. When pressurized air is supplied from the air pressure control device 20 through the connection portion 38, the solder 40 is discharged (extruded) from the discharge port 30. Further, when the discharge of the solder 40 is terminated, the air pressure is reduced to a negative pressure.
The solder container 10 is detachably attached to the rotating member 48 by the container holding device 46.

  The rotating device 24 moves the solder container 10 in a horizontal position in which the axis M parallel to the longitudinal direction extends substantially in the horizontal direction (in this embodiment, a position extending substantially parallel to the x direction) and in a substantially vertical direction. This is a device for rotating (turning) between the extended vertical posture (in this embodiment, a posture extending substantially parallel to the z direction), and includes a rotary member 48 and a rotary actuator 50. When the solder 40 is supplied from the solder container 10, the vertical position is set, and when the solder 40 is not supplied, the horizontal position is set.

The x-direction moving device 22 is a device that moves the solder container 10 in the x-direction, and (a) a movable member 80 that holds the rotating device 24, (b) a drive source 84, and (c) a drive of the drive source 84. A drive transmission mechanism 86 for transmitting force to the movable member 80; and (d) a guide 88 fixedly provided on the solder supply apparatus main body 18.
The guide 88 extends in the x direction, and the movable member 80 is engaged with the guide rail 90 so as to be relatively movable. Reference numeral 91 denotes a solder dripping prevention tray.
The drive source 84 is an electric motor in this embodiment, and the rotation speed of the electric motor 84 is detected by a rotation speed sensor 92 (see FIG. 5). The drive transmission mechanism 86 includes (i) a plurality of pulleys 94, (ii) a drive belt 96 that is stretched over the plurality of pulleys 94 and engaged with the output shaft of the electric motor 84, and (iii) the drive belt 96. Includes an engagement device 98 for engaging the movable member 80 so as to be integrally movable. The drive belt 96 is moved by the rotation of the electric motor 84, and the movable member 80 is moved in the x direction. Further, as the movable member 80 moves in the x direction, the solder container 10 is moved in the x direction. In addition, when the rotational speed of the electric motor 84 is fast, the moving speed of the solder container 10 in the x direction is faster than when the electric motor 84 is slow, so that the moving speed of the solder container 10 in the x direction approaches the target value for speed control. In addition, the electric motor 84 is controlled based on the detection value of the rotation speed sensor 92.

As shown in FIG. 5, the present solder supply apparatus is provided with a control device 150 mainly composed of a computer. The control device 150 includes an input / output unit 152, a storage unit 153, an execution unit 154, and the like. The input / output unit 152 is connected to a rotation speed sensor 92, a level sensor 160, an operation unit 6 and the like, and an electric motor 84. , The air pressure control device 20, the display 4, etc. are connected.
The level sensor 160 is attached to the solder container 10 and continuously detects the remaining amount of solder in the solder container 10 by detecting the position of the piston. A manual reset can be instructed by operating the touch panel (display 4). The manual reset operation is an operation performed when the solder supply operation is interrupted or terminated by the user's intention. For example, the manual reset operation is performed when the solder container 10 is replaced or when the posture is changed. The storage unit 153 stores a solder supply control program and the like.

The solder supply operation will be described with reference to FIG.
(1) Supply of pressurized air is started when the solder container 10 is at the discharge start position. The solder container 10 is stopped during the supply preparation time ta while the pressurized air is supplied at the discharge start position. When the supply preparation time ta is long, the amount of the solder 40 supplied near the start position is larger than when the supply preparation time ta is short.
(2) After the supply preparation time ta elapses, the solder container 10 is moved at the moving speed v in the x direction by a predetermined stroke s (mm). When the moving speed v is fast, the amount of solder 40 supplied by one operation is smaller than when the moving speed v is slow. Further, when the moving speed v is fast, the time required for a series of solder supply operations is shorter than when the moving speed v is slow. In these meanings, the moving speed v can be referred to as a supply speed. The stroke s and the like are determined in advance when the solder 40 is supplied to the circuit board 16 and need not be input. However, when the viscous fluid other than the solder is supplied, the stroke s and the like can be input. Is done.
(3) Before reaching the discharge end position (stroke end), the movement of the solder container 10 in the x direction is not stopped, the air pressure in the solder container is reduced (negative pressure), and the pressure is reduced. After the time tc elapses, solder cutting is performed. This pressure reduction and solder cutting is referred to as discharge end control. Even after the discharge end control is performed, the supply of the solder 40 often continues.
(4) After the soldering is performed, the solder container 10 is moved in the x direction during the idle running time td and reaches the discharge end position. If the idle running time td is increased, then the solder 40 is less likely to drip, but the supply amount of the solder 40 near the discharge end position is reduced.

A series of operations (1) to (4) is a solder supply operation, which is a single solder supply operation. After (4), the solder container 10 is turned to the horizontal posture, and the discharge port 30 is moved to a position above the drooping prevention tray 91 (standby state). Then, before (1) is executed, the vehicle is swung to a vertical posture and moved to the discharge start position.
Further, after the solder container 10 is filled with the solder 40, a plurality of solder supply operations are performed. That is, when the solder supply operation is performed a set number of times from a state where the solder 40 is accommodated in a set amount (for example, full state), the remaining amount of the solder 40 is reduced (for example, empty state). By the time the empty state is reached, the number of feasible supplies is roughly determined.
Furthermore, the solder supplied onto the mask 14 by one solder supply operation is usually printed on a plurality of circuit boards 16 by the movement of the squeegee.

Moreover, although the parameter (operation condition) in solder supply operation | movement can be input by the user, a predetermined default value can also be used.
In the screen (selection screen) 200 shown in FIG. 7 displayed on the display 4, when a portion 200d where default is displayed is touched, the default is selected and the solder supply operation is executed using the default value. When the part 200c for displaying “Customize” is touched, customization is selected, and parameters and the like can be input. Input screens 202 and 204 shown in FIGS. 8 and 9 are displayed, and parameters and the like can be input.

In the input screen 202 of FIG. 8, the supply preparation time ta, the pressure reduction time tc, the idling time td, and the moving speed v (operation conditions, parameters) can be input. For example, a parameter can be selected and input by increasing or decreasing a numerical value. Further, since the stroke s is determined, the time point when the air pressure is reduced in (3) in FIG. 6 is the time ti {= from the start time of (1), that is, the start time of one solder supply operation. After ta + s / v− (tc + td)} has elapsed. During this time ti, since the solder 40 in the solder container 10 is in a pressurized state, it is referred to as a pressing time. In the present embodiment, the gain (value between -50% to + 50%) for the supply preparation time ta, the moving speed v, and the idling time td can be input. When the initial values tao, vo, tdo, and gains ka, kv, kd are input for the supply preparation time ta, the moving speed v, and the idling time td, It is gradually changed to a size expressed, that is, a ratio determined by a gain.
ta (n) = tao {1+ (n-1) ka} (1)
v (n) = vo {1+ (n−1) kv} (2)
td (n) = tdo {1+ (n−1) kd} (3)
As shown in the above equation, when the gain is a positive value, the supply preparation time ta, the moving speed v, the idling time td, etc. increase as the number of times of supply n increases, and the gain is a negative value. In this case, it decreases as the number of times of supply n increases. The amount of solder 40 supplied on the mask 14 in one solder supply operation is based on the operation principle (without being based on viscous fluid), and the supply preparation time ta is long, the moving speed v is low, and the idle running time When td is short, the supply preparation time ta is short, the moving speed v is fast, and the idle running time td is long.

Further, the pressurization time ti is displayed on the screen 202. If the pressurization time ti is short, solder is not supplied. Based on the pressurization time ti, it is possible to check whether the value of the parameter input by the user is a reasonable size.
In the screen 204 of FIG. 9, the movement stroke (x: Solder Supply Stroke), the discharge start position (xstart: Solder Supply Start Position) of the solder container (viscous fluid container) 10 and the remaining amount of viscous fluid reach empty. These parameters can be input when a resin other than solder is used as the viscous fluid. When the solder 40 is used, it is not necessary to input since it is determined in advance.
On the other hand, when the termination condition such as when the remaining amount of solder in the solder container 10 becomes empty, when a manual reset operation is performed, or when the number of times of supply reaches the set number of times, the solder supply operation is performed. The process is terminated and the gain, parameters, and the like input by the user are reset, and the counter is reset.

The solder supply program represented by the flowchart of FIG. 11 is executed at the supply start timing.
In step 1 (hereinafter abbreviated as S1. The same applies to other steps), it is determined whether or not a manual reset operation has been performed. In S2, it is determined whether or not the remaining amount of solder is empty. The If both determinations are NO, in S3, the current supply number n, the initial values tao, vo, tdo, and the gains ka, kv, kd according to the above formulas (1) to (3) The (n-th) supply start time ta, supply speed v, and idling time td are acquired, and in S4, a control command corresponding to the start time is generated and output. In S5, the number of times of supply n is increased by 1. While the determinations of S1 and S2 are NO, S3 to 5 are repeatedly executed. When S3 is executed first, the number of times of supply is an initial value (0).
On the other hand, when a manual reset operation is performed, or when an end condition is satisfied, such as when the remaining amount of solder becomes empty, the solder supply operation is terminated. When the remaining amount of solder becomes empty, a screen 206 in FIG. 10A is displayed. When a manual reset operation is performed, a screen 208 shown in FIG. 10B is displayed. On the screen 208, it is displayed that the count value of the counter that counts the number of times of supply is reset to zero.

For example, when initial values vo, tao, tco, tdo, gains ka and kv are input as shown in FIG. 12A according to the screen 202 in FIG. 7, as shown in FIG. The moving speed v as a parameter becomes faster as the number of times of supply n increases, and the supply preparation time ta becomes shorter as the number of times of supply n increases.
As a result, as shown by the alternate long and short dash line B in FIG. 13, even when a poorly stirred solder is used, the amount of one supply accompanying the increase in the number of times of supply n compared to the case indicated by the solid line A Is suppressed, and the amount of one supply can be made substantially constant, and the solder 40 can be supplied stably.

  Further, when a viscous fluid (resin or the like) other than solder is used, input on both the screens 202 and 204 is necessary, whereas when solder 40 is used, input on the screen 202 is performed. Often, there is no need to make an input on screen 204. As described above, since the input operation differs between the case where the solder 40 is used and the case where the solder 40 is not used, input errors can be reduced. Further, when the solder 40 is used, it is not necessary to perform an input on the next screen 204, and an input on the first screen 202 may be performed. As a result, the operation when solder is used is facilitated.

  The operation control device is configured by a portion for storing, executing, and the like of the automatic solder supply program represented by the flowchart of FIG. The operation condition changing unit, the number-based operation control unit, the number-based operation condition gradual changing unit, the movement pattern changing unit, the supply preparation time changing unit, and the gain dependency depending on the part that stores S3 and 5 in the operation control device, the part to execute, etc. An operation condition gradual change unit and an input gain-dependent operation gradual change unit are configured. The operation control device is also a supply amount holding type control unit. Further, the screen 202 of the display 4 corresponds to the first screen, and the screen 204 corresponds to the second screen. Further, the screen 202 and the like constitute a gain input unit, an operating condition input unit, and a first operating condition input unit, and the screen 204 and the like constitute a second operating condition input unit.

When a printing fluid other than solder or a viscous fluid such as an adhesive is used, input on the screens 202 and 204 is performed, and a viscous fluid supply operation is performed based on the input parameters and gain. . For example, the gain kv related to the moving speed v is set to a negative value, or the gain ka related to the supply preparation time ta is set to a positive value, so that the moving speed v is slowed as the number of times of supply increases, or supply preparation is performed. The time ta can be lengthened. As a result, the amount of one supply can be made substantially constant, and the supply can be stably performed.
Further, the air pressure in the solder container 10 can be input as a parameter. When the air pressure is high, the discharge amount per unit time of the solder 40 discharged from the discharge port 30 can be increased and the supply amount at one time can be increased as compared with the case where the air pressure is low.
Furthermore, when the solder 40 is used, parameters such as a supply start position, the number of times of supply, and a stroke can be input. In that case, it can be assumed that the end condition is satisfied when the number of times of supply reaches the set number of times.
Further, the relationship between the parameter and the number of times of supply can be stored in advance in a map or the like, and the parameter for each supply operation can be determined based on the map.

In the first embodiment, the parameter is changed at a ratio determined by the gain as the number of times of supply is increased. However, the gain is increased as the remaining amount of solder detected by the level sensor 160 is decreased. It can also be changed at a fixed ratio.
In the present embodiment, the automatic solder supply program represented by the flowchart of FIG. 14 is executed, and each parameter is calculated based on the remaining amount q at that time and the input gain. Determined according to 6). For example, when the input gain kv is a positive value and the gain ka is a negative value, as shown in FIG. 15, the moving speed v is increased as the remaining amount of solder decreases, and the supply preparation time ta Is shortened as the remaining amount of solder decreases. The solder remaining amount qo is the amount of the solder 40 accommodated in the solder container 10 at the start of supply, and (qo-q) is the amount of decrease in the solder remaining amount (solder usage amount).
ta = tao {1+ (qo-q) · ka} (4)
v = vo {1+ (qo−q) · kv} (5)
td = tdo {1+ (qo−q) · kd} (6)

If the determinations at S1 and S2 are NO, the remaining amount of solder is detected by the level sensor 160 at S21. In S22 and S23, parameters are determined according to the above equations (4) to (6) and output.
Thus, in this embodiment, the parameter is gradually changed as the remaining amount of solder is reduced. Therefore, even when a poorly stirred solder is used or when a viscous fluid other than the solder is used, the variation in the amount of supply at one time can be reduced, and the viscosity is stable. Fluid can be supplied.
In the present embodiment, the operation control device is configured by a portion that stores, executes, and the like the automatic solder supply program represented by the flowchart of FIG. Of these, the remaining amount acquisition unit is configured by the portion that stores S21, the portion that executes S21, and the level sensor 160, and the like. The remaining amount-dependent operation gradually changing unit is also an input gain-dependent operation gradually changing unit, a movement pattern changing unit, a start / stop time changing unit, an operation condition gradually changing unit, and the like.

  The present invention can be practiced in various modifications and improvements based on the knowledge of those skilled in the art, in addition to the aspects described in Examples 1 and 2.

  2: Screen printer 4: Display 6: Operation unit 10: Solder container 20: Air pressure control device 22: X direction moving device 84: Electric motor 86: Drive transmission device 88: Guide 92: Rotational speed sensor 150: Control device 153: Storage unit 160: Level sensor

Claims (6)

A viscous fluid supply device that supplies a viscous fluid to an object by moving the viscous fluid container containing the viscous fluid while discharging the viscous fluid from the viscous fluid container,
The viscous fluid supply operation including at least one of discharge of the viscous fluid from the viscous fluid container and movement of the viscous fluid container is controlled based on the remaining amount of the viscous fluid accommodated in the viscous fluid container. the operation controller viewed free of, and the operation control apparatus, (i) the moving speed changing unit for changing a moving speed of the viscous fluid container, (ii) if the viscous fluid container is in the supply start position A supply preparation time changing unit that changes a time during which the viscous fluid is stopped while discharging, and (iii) at least a movement time and a movement distance of the viscous fluid container after the viscous fluid discharge end control. viscous fluid supply device comprising at least one Tsuo含 Mukoto of empty run hours, such as changing unit for changing one. The viscous fluid supply device includes a gain input unit capable of inputting a gain by a user, and the operation control device gradually changes the viscous fluid supply operation based on the gain input via the gain input unit. The viscous fluid supply device according to claim 1, further comprising an input gain-dependent operation gradual change unit. The viscous fluid supply device includes an operation condition input unit capable of inputting at least one of one or more operation conditions defining the viscous fluid supply operation, and the gain input unit is configured by the operation condition input unit. A gain for at least one of the input operating conditions can be input, and each of the at least one operating condition in which the gain is input by the gain input unit is input to the input gain-dependent operation gradually changing unit. The viscous fluid supply device according to claim 2, further comprising: a gain-dependent operation condition gradual change unit that gradually changes the gain based on each of the gains corresponding to the operation condition. The viscous fluid supply device displays a display in which the gain input by the gain input unit among the operating conditions input by the operating condition input unit and the gain input by the gain input unit are displayed in association with each other The viscous fluid supply device according to claim 3, comprising:   A viscous fluid supply device that supplies a viscous fluid to an object by moving the viscous fluid container containing the viscous fluid while discharging the viscous fluid from the viscous fluid container,
  The viscous fluid supply operation including at least one of discharge of the viscous fluid from the viscous fluid container and movement of the viscous fluid container is controlled based on the remaining amount of the viscous fluid accommodated in the viscous fluid container. An operation control device,
  (a) a first screen capable of inputting a first operating condition that is one or more operating conditions defining the viscous fluid supply operation and a gain for at least one of the first operating conditions; b) a display different from the first screen, the display including a second screen capable of inputting a second operating condition obtained by removing the first operating condition from the one or more operating conditions,
  The first operating condition is a condition that can be input regardless of whether the viscous fluid is cream solder or a viscous fluid other than cream solder, and the second operating condition is that the viscous fluid is cream solder. A viscous fluid supply apparatus characterized in that the input condition is a viscous fluid other than the above. In the viscous fluid supply device, (a) when the number of times of supply, which is the number of times of the viscous fluid supply operation, reaches a set number of times, and (b) the remaining amount of viscous fluid in the viscous fluid container is predetermined. An operating condition that resets the operating condition entered by the user when at least one of the following is satisfied and at least one of the case where the manual reset operation is performed and the end condition is satisfied. The viscous fluid supply device according to claim 5, comprising a reset unit.

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