JP6063253B2 - Manufacturing method and manufacturing apparatus for packaged injection molded product - Google Patents

Description

  The present invention relates to a method for manufacturing a packaged injection molded article and a manufacturing apparatus.

  Conventionally, sterilized medical instruments (for example, resin chips) are used in medical sites. Such a resin chip may be individually packaged and shipped by a packaging film or the like.

  Patent Document 1 describes a deep-drawing packaging machine for packaging cooked food. The deep-drawing packaging machine described in Patent Document 1 includes a forming mechanism that forms a housing recess in a packaging film, a supply mechanism that supplies a packaged product (cooked food) to the housing recess, and a package that houses the packaged product. It has a steam slash mechanism that injects high-temperature steam into the recess, and a seal mechanism that heat-seals the opening of the housing recess using a lid material film. In this deep-drawing packaging machine, the housing recess is formed by vacuum forming a heated packaging film. Next, after the article to be packaged is accommodated in the accommodation recess, the lid material film is covered and heat sealed.

JP 2007-189995 A

  In medical settings, for the purpose of improving the survival rate of patients, medical instruments and pharmaceuticals that ensure the endotoxin adherence amount to a specified value or less, and ensure hygiene, are used. There is a case. For inspection of such endotoxin contamination, an inspection instrument such as a resin chip that is manufactured in an endotoxin-free clean environment and in which an endotoxin-free clean state is ensured by individual packaging or the like is used.

  Generally, in a deep-drawing packaging machine as described in Patent Document 1, a heating unit that heats a packaging film is disposed on the upper side of the packaging film, and a molding unit that forms an accommodation recess is located below the packaging film. Arranged on the side. In such a case, the upper part of the packaging film is brought into contact with the heating unit disposed on the upper side to heat the packaging film, and the packaging film is vacuum-formed with the molding unit disposed on the lower side, thereby forming the housing recess. .

  Therefore, when packaging a resin chip that requires an endotoxin-free clean state as described above with a deep-drawing packaging machine as described in Patent Document 1, the upper surface of the packaging film comes into contact with the heating unit. The inner surface of the housing recess may be contaminated. Thereby, there exists a possibility that a resin chip may be contaminated.

  This invention is made | formed in view of this point, and it aims at providing the manufacturing method and manufacturing apparatus of the packaged goods which can ensure the cleanliness of the packaged goods.

  The method for manufacturing a packaged article to be packaged according to the present invention includes a heating step of heating a bottom film formed of one layer or two or more resin layers, and the packaged article is accommodated in the heated bottom film. A molding process for forming a pocket; a housing process for housing the packaged article in the pocket; and a sealing process for sealing an opening of the pocket containing the packaged article with a top film. In the heating step, without bringing a heat source into contact with the bottom film, the region of the bottom film where the pockets are formed is heated to at least the glass transition temperature of at least one layer of the resin layer forming the bottom film. In the molding step, vacuum forming is performed from the side serving as the outer surface of the pocket, or pressure forming is performed using clean air from the side serving as the inner surface of the pocket. And in, there is a room temperature or higher, the allowed modeled after the inner surface of the mold concave controlled to below the glass transition temperature of the bottom film, to form the pocket on the bottom film, a configuration.

  An apparatus for manufacturing a packaged article to be packaged according to the present invention includes a heating unit including a heat source for heating a bottom film formed of one layer or two or more resin layers, and the packaged article on the heated bottom film. A molding part having a mold for forming a pocket for storing the package, a storage part for storing the packaged product in the pocket, and an opening of the pocket in which the packaged product is stored is sealed with a top film. A sealing portion, and the heating portion has a region where the pocket of the bottom film is formed without bringing a heat source into contact with the bottom film, and at least a glass transition temperature of at least one layer of the resin layer. The molded part is at room temperature or higher by vacuum forming from the side that becomes the outer surface of the pocket, or by pressure forming with clean air from the side that becomes the inner surface of the pocket. The so modeled after the type of the inner surface of the concave controlled to below the glass transition temperature of the bottom film, to form the pocket on the bottom film, a configuration.

  ADVANTAGE OF THE INVENTION According to this invention, the packaged to-be-packaged product with which the cleanliness was ensured can be provided.

It is a schematic diagram of the manufacturing apparatus which concerns on Embodiment 1 of this invention. 3 is a schematic diagram of a heating unit and a molding unit according to Embodiment 1. FIG. It is a schematic diagram of the manufacturing apparatus which concerns on Embodiment 2 of this invention. 6 is a schematic diagram of a forming part according to Embodiment 2. FIG.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

[Embodiment 1]
(Configuration of manufacturing equipment for packaged products)
FIG. 1 is a schematic diagram of an apparatus 100 for manufacturing a packaged product P (hereinafter also simply referred to as “manufacturing apparatus”) 100 according to the first embodiment. FIG. 2 is a schematic diagram of a heating unit and a molding unit according to the first embodiment.

  As shown in FIG. 1, the manufacturing apparatus 100 includes a heating unit 110, a molding unit 120, a storage unit 130, a sealing unit 140, and a cutting unit 150.

  The manufacturing apparatus 100 forms the pocket 106 by drawing the bottom film BF that is intermittently fed in the horizontal direction from the first raw roll 102 wound in a roll shape, and the accommodated item P is placed in the pocket 106. It is an apparatus which continuously implements the process of sealing and cutting with the top film TF after housing. Although not particularly illustrated, the manufacturing apparatus 100 is provided with a feeding unit that intermittently feeds the bottom film BF fed from the first raw roll 102. The feed unit moves from the first raw roll 102 to the heating unit 110 (molding unit 120), moves from the molding unit 120 (heating unit 110) to the housing unit 130, and moves from the housing unit 130 to the sealing unit 140. The movement from the sealing unit 140 to the cutting unit 150 is performed.

  The material of the bottom film BF is not particularly limited, and is appropriately selected based on functions and characteristics required for packaging. Examples of the material of the bottom film BF include polymethyl methacrylate resin (PMMA), polycarbonate (PC), cycloolefin copolymer resin (COC), polyamide (PA), polyethylene (PE), and the like. Further, the configuration of the bottom film BF is not particularly limited, and is appropriately designed based on functions and characteristics required for packaging. The bottom film BF may have a single layer structure or a multilayer structure. For example, when the bottom film BF has a multilayer structure, the bottom film BF may have a base material layer and a sealant layer disposed on the base material layer. Moreover, the bottom film BF may further laminate | stack the 1st protective film on the sealant layer. Furthermore, the first protective film may also have a single layer structure or a multilayer structure.

  Although the film thickness of bottom film BF is not specifically limited, It is preferable to exist in the range of 1-300 micrometers. Further, the film thickness of the bottom film BF is more preferably in the range of 50 to 200 μm, and particularly preferably 80 to 160 μm. When the film thickness of the bottom film BF is less than 1 μm, it may be broken during the molding process. On the other hand, when the film thickness exceeds 300 μm, there is a possibility that the film 122 does not adhere to the inner surface of the mold 122 during the molding process.

  FIG. 2A is a schematic diagram of the heating unit 110. The heating unit 110 heats the bottom film BF. As shown in FIG. 2A, the heating unit 110 includes a heat source 112.

  The heat source 112 is arranged on the upper side of the bottom film BF so that the heat generating surface 114 and the bottom film BF face each other. The heat source 112 heats at least a region to be the pocket 106 of the bottom film BF to a glass transition temperature (Tg) or higher to soften the bottom film BF. More preferably, the heat source 112 heats a region wider than the region to be the pocket 106 of the bottom film BF to a glass transition temperature (Tg) or higher to soften the bottom film BF. The heating temperature by the heat source 112 is appropriately set according to the glass transition temperature of the selected bottom film BF. For example, the heating temperature is appropriately set depending on the relationship between the heating time and the distance between the heat source 112 (heat generating surface 114) and the bottom film BF. For example, the heating temperature by the heat source 112 is in the range of 60 to 200 ° C., and the distance between the heat generating surface 114 and the bottom film BF is in the range of 1 to 50 mm. In addition, as mentioned above, when the bottom film BF has a multilayer structure, in order to soften the bottom film BF, it is heated to a temperature equal to or higher than the glass transition temperature of the material forming at least one layer.

  The type of the heat source 112 is not particularly limited. Examples of the type of the heat source 112 include a block made of aluminum or stainless steel, an infrared irradiation device, or the like. The method for adjusting the temperature of the block includes an adjustment method using various heaters such as a band heater and a cartridge heater, and an adjustment method for circulating various heat media such as oil to the block.

  The size of the heat generating surface 114 of the heat source 112 is not particularly limited, but is preferably wider than the region serving as the pocket 106 from the viewpoint of reliably heating the region serving as the pocket 106. Moreover, it is preferable that the heat generating surface 114 of the heat source 112 emits heat from the whole from the viewpoint of uniformly heating the region that becomes the pocket 106.

  FIG. 2B is a schematic diagram of the forming unit 120. The forming unit 120 forms the pocket 106 in the bottom film BF by drawing. As illustrated in FIG. 2B, the molding unit 120 includes a mold 122 and a suction pump 124.

  The mold 122 is disposed on the lower side of the bottom film BF so as to face the heating unit 110. The material of the mold 122 is not particularly limited, but is formed of a metal that does not deform even when the heated bottom film BF contacts. The shape of the mold 122 is appropriately designed according to the shape of the pocket 106 to be formed. The inner surface of the mold 122 is controlled to be equal to or higher than normal temperature and lower than the glass transition temperature (Tg) of the bottom film BF during molding and standby. Here, when the bottom film BF has a multilayer structure, the “glass transition temperature (Tg) of the bottom film BF” is the glass transition temperature of the material forming the at least one layer. More specifically, the inner surface of the mold 122 is controlled within a temperature range lower by about 0.1 to 50 ° C. than the glass transition temperature of the bottom film BF. For example, the temperature of the inner surface of the mold 122 is controlled within a range of 40 to 180 ° C. Here, “normal temperature” is a temperature within the range of 20 ° C. ± 15 ° C. as defined in JIS Z 8703.

  The heated region of the bottom film BF is vacuum-sucked by the suction pump 124, so that the drawing process is performed according to the mold 122 to form the pocket 106.

  The accommodating portion 130 moves the pocket 106 to a position where the accommodated product P (for example, a resin molded product such as a resin chip) is accommodated, and then accommodates the accommodated product P in the pocket 106. The method for accommodating the article to be accommodated P in the pocket 106 is not particularly limited. Examples of the method of storing the product P in the pocket 106 include a method in which the product P is gripped by the transport arm and stored in the pocket 106, or the product P is transported by the belt conveyor and stored in the pocket 106. Including methods.

  The sealing part 140 seals the opening part of the pocket 106 which accommodated the to-be-contained goods P with the top film TF. The sealing unit 140 includes a roller 142 and a sealer 144. The roller 142 is disposed on the upstream side in the feed direction of the bottom film BF. The sealer 144 includes a sealing base 146 and a heat sealer 148.

  The roller 142 is disposed at a position where the top film TF intermittently fed from the second raw fabric roll 104 can cover the opening of the pocket 106 formed into the bottom film BF, and the feeding direction of the top film TF is changed. Change in the same direction as the bottom film BF. The top film TF is intermittently fed together with the bottom film BF to cover the opening immediately after the injection molded product P is accommodated. Further, the roller 142 is in contact with the top film TF on the surface facing the outside of the pocket 106 in order to prevent contamination of the surface facing the inside of the pocket 106. Thereby, the foreign material which falls naturally can prevent entering the pocket 106, and the packaged to-be-contained goods P with which the cleanliness was ensured can be manufactured.

  The material of the top film TF is not particularly limited, and is appropriately selected based on functions and characteristics required for packaging. Further, the configuration of the top film TF is not particularly limited, and is appropriately designed based on functions and characteristics required for packaging. For example, the second protective film may be laminated on the top film TF.

  The sealer 144 is disposed on the lower side of the bottom film BF so as to be movable up and down, and is disposed on the upper side of the top film TF so as to face the sealing table 146 with a slightly larger opening than the pocket 106. And a heat sealer 148 that surrounds the opening of the pocket 106. In the sealing part 140, after the intermittently fed bottom film BF and top film TF move to the sealing position, the sealing base 146 rises so that the pocket 106 is inserted into the opening. Then, the sealing base 146 further rises, the bottom film BF and the top film TF are sandwiched between the heat sealer 148, and the bottom film BF is pressed against the top film TF to be heat-sealed and sealed.

  In the cutting part 150, the bottom film BF and the top film TF are cut between products. The cutting unit 150 includes a cutter 152 that cuts the top film TF and the bottom film BF from the upper side or the lower side of the package. The cutting position of the top film TF and the bottom film BF may be on the seal as long as the sealed state by the pocket 106 and the top film TF is maintained. Through the above steps, the injection molded body P is packaged by the bottom film BF and the top film TF.

(Operation of manufacturing equipment)
Next, operation | movement of the manufacturing apparatus 100 of the packaged to-be-contained goods P is demonstrated.

  In the manufacturing apparatus 100, first, the bottom film BF is intermittently fed by the feeding unit and moved to a heating position. Next, the region where the pocket 106 of the bottom film BF is formed is heated to the glass transition temperature or higher by the heating unit 110 (heating process). Then, the bottom film BF heated by the suction pump 124 is sucked to form the pocket 106 in the heated bottom film BF by drawing (molding process). Next, after the pocket 106 is moved to a position for accommodating the article to be accommodated P, the article to be accommodated P is accommodated in the pocket 106 (accommodating step).

  The opening part of the pocket 106 which accommodated the to-be-contained goods P sent to the sealing position is sealed with the top film TF (sealing process). Finally, the top film TF and the bottom film BF sealed by the cutting unit 150 are cut between products (cutting step).

  In general, an apparatus for continuously packaging the articles to be stored P shortens the packaging cycle and increases the productivity. For example, in the case of using the manufacturing apparatus 100 described above, the heating time is shortened by increasing the temperature of the heat source 112 and heating the bottom film BF by bringing the bottom film BF into contact with the heat source 112. Alternatively, the cooling time is shortened by setting the temperature of the inner surface of the mold 122 to around room temperature. As described above, the apparatus for continuously packaging the products to be accommodated P shortens the packaging cycle by shortening the time from the start of heating the bottom film BF to the end of the drawing process.

  However, such a method may not meet the performance required for the accommodated product P. For example, in a resin chip (contained product P) that requires an endotoxin-free clean state, the inner surface of the pocket 106 may be contaminated by contact between the heat source 112 and the bottom film BF. Therefore, the present inventors have found that the above-described problems can be solved by indirectly heating the bottom film BF and supplementing the heat with the mold 122.

  Specifically, the heat source 112 heats the bottom film BF without bringing the heat generating surface 114 into contact with the bottom film BF. That is, the heat source 112 heats the bottom film BF in a non-contact manner. Thereby, the bottom film BF is not contaminated.

  Then, drawing is performed on the bottom film BF in a state where the inner surface of the mold 122 is controlled at a temperature equal to or higher than normal temperature and equal to or lower than the glass transition temperature of the bottom film BF. Thereby, even if the heating process by the heat source 112 is completed and the temperature of the bottom film BF is lowered, the reduced amount of heat can be supplemented by the mold 122.

(effect)
As described above, since the manufacturing apparatus 100 and the manufacturing method according to Embodiment 1 heat the bottom film BF in a non-contact manner, the inner surface of the pocket 106 can be maintained in a clean state. Moreover, since the temperature of the inner surface of the mold 112 is controlled to be equal to or higher than normal temperature and lower than the glass transition temperature of the bottom film BF, the drawability can be improved. Thereby, the packaged to-be-contained goods P in which the clean state was ensured can be manufactured.

[Embodiment 2]
(Configuration of equipment for manufacturing packaged injection molded products)
FIG. 3 is a schematic diagram of a manufacturing apparatus 200 for packaged articles P according to the second embodiment. FIG. 4 is a schematic diagram of the forming unit 220 according to the second embodiment.

  As shown in FIGS. 3 and 4, the manufacturing apparatus 200 according to the second embodiment is different from the manufacturing apparatus 100 according to the first embodiment in the configuration of the molding unit 220. Therefore, the same components as those of manufacturing apparatus 100 according to Embodiment 1 are denoted by the same reference numerals, and the description thereof is omitted.

  The forming unit 220 forms the pocket 106 in the bottom film BF by pressure forming. The forming unit 220 is disposed downstream of the heating unit 110 in the bottom film BF feeding direction.

  As shown in FIG. 4, the molding unit 220 includes a compressed air container 226, a compressed air device 228, and a mold 122.

  The compressed air container 226 keeps the inside sealed, and blows compressed clean air onto the area where the pocket 106 of the bottom film BF is formed. Clean air is purified by external air with a filter in the compressed air device 228 and then compressed and supplied into the compressed air container 226. The compressed air container 226 includes a first container 226a serving as a container body and a second container 226b serving as a lid.

  The first container 226a is disposed below the bottom film BF. A mold 122 is accommodated in the first container 226a. The second container 226b is disposed on the upper side of the bottom film BF. A pneumatic device 228 is connected to the second container 226b. The compressed air container 226 sandwiches the bottom film BF between the first container 226a and the second container 226b, and seals the region above the bottom film BF. Next, clean air compressed by the compressed air device 228 is supplied into the second container 226b. Thereby, the pressure of the space comprised by the bottom film BF and the 2nd container 226b becomes high, and it pressurizes the bottom film BF so that the inner surface of the type | mold 122 may be followed.

(Operation of manufacturing equipment)
In the molding unit 220 in the manufacturing apparatus according to Embodiment 2, the first container 226a is lowered during molding, and the edge of the opening and the outside of the heated region of the bottom film BF come into contact with each other. Thereby, the space above the bottom film BF is in a sealed state.

  Next, the compressed air device 228 is driven to bring the sealed space between the second container 226b and the bottom film BF into a pressurized state. Then, the pocket 106 is formed by causing the heated bottom film BF to follow the inner surface of the mold 122 with the supplied compressed clean air. At this time, the air in the space between the bottom film BF and the inner surface of the mold 122 is exhausted to the outside.

  In addition, although the heating part 110 of Embodiment 2 is arrange | positioned above the bottom film BF, you may arrange | position below the bottom film BF. Thereby, the cleanliness of the bottom film BF can be further improved.

(effect)
As described above, the manufacturing apparatus 200 and the manufacturing method according to the second embodiment have the pocket 106 formed by pressure forming in addition to the effects of the manufacturing apparatus 100 and the manufacturing method according to the first embodiment. The moldability of can be further improved.

  The bottom film BF and the top film TF may further have other layers or films as long as the cleanliness of the packaged product P can be ensured. For example, the bottom film BF may have another layer that enhances the adhesion between the base material layer and the sealant layer. Moreover, the top film TF may have another film in order to give rigidity.

  The packaged packaged product manufactured according to the present invention is excellent in cleanliness, and thus can be widely applied to various packaged products that are required to be endotoxin-free, for example.

DESCRIPTION OF SYMBOLS 100,200 Manufacturing apparatus 102 1st original fabric roll 104 2nd original fabric roll 106 Pocket 110 Heating part 112 Heat source 114 Heat generation surface 120,220 Molding part 122 Type 124 Suction pump 130 Housing part 140 Sealing part 142 Roller 144 Sealer 146 Sealing Stopper 148 Heat sealer 150 Cutting part 152 Cutter 226 Pneumatic container 226a First container 226b Second container 228 Pneumatic device BF Bottom film TF Top film P Packaged goods

Claims (6)

A heating step of heating a bottom film formed of one layer or two or more resin layers;
In the heated bottom film, a molding step for forming a pocket for accommodating a packaged product,
An accommodating step of accommodating the packaged item in the pocket;
A sealing step of sealing the opening of the pocket containing the packaged product with a top film,
In the heating step, without bringing a heat source into contact with the bottom film, the region of the bottom film where the pockets are formed is heated to at least the glass transition temperature of at least one of the resin layers forming the bottom film. ,
In the molding step, vacuum molding is performed from the outer surface side of the pocket, or pressure air molding is performed with clean air from the inner surface side of the pocket, so that the temperature is not lower than the room temperature and not higher than the glass transition temperature of the bottom film. Following the inner surface of the controlled concave mold, the pocket is formed in the bottom film,
Between the heating step and the sealing step, only the packaged product and the top film are in contact with the surface of the bottom film that accommodates the packaged product.
A method of manufacturing a packaged packaged product.   The method for manufacturing a packaged article to be packaged according to claim 1, wherein in the molding step, the temperature of the inner surface of the mold is controlled to be 0.1 to 50 ° C. lower than the glass transition temperature.   The method for manufacturing a packaged article to be packaged according to claim 1 or 2, wherein, in the heating step, an area wider than an area where the pocket of the bottom film is formed is heated. A heating unit including a heat source for heating a bottom film formed of one layer or two or more resin layers; and
In the heated bottom film, a molded part having a mold for forming a pocket for accommodating a packaged item,
An accommodating portion for accommodating the packaged article in the pocket;
A sealing portion that seals the opening of the pocket containing the packaged item with a top film;
Have
The heating unit heats a region where the pockets of the bottom film are formed without bringing a heat source into contact with the bottom film to at least a glass transition temperature of the resin layer,
The molding part is vacuum molded from the side that becomes the outer surface of the pocket, or pressure-air molding with clean air from the side that becomes the inner surface of the pocket, so that the temperature is normal temperature or higher and lower than the glass transition temperature of the bottom film. so modeled after the type of the inner surface of the controlled concave, the pockets formed in the bottom film,
During the heating by the heating part of the bottom film, the molding of the pocket by the molding part of the bottom film, and the sealing of the opening of the pocket by the sealing part using the top film, Only the packaged product and the top film are in contact with the surface of the bottom film that accommodates the packaged product,
Manufacturing equipment for packaged products.   The said shaping | molding part is a manufacturing apparatus of the packaged to-be-packaged goods of Claim 4 which controls the inner surface of the said type | mold to the temperature 0.1-50 degreeC lower than the said glass transition temperature. The said heating part is a manufacturing apparatus of the packaged goods of the package of Claim 4 or Claim 5 which heats the area | region wider than the area | region where the said pocket of the said bottom film is formed.

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