JP6045926B2 - Grinding and polishing equipment - Google Patents

Description

  The present invention relates to a grinding and polishing apparatus capable of grinding and polishing a work set in which a plate-like work is bonded to a substrate.

  In a semiconductor device manufacturing process, after a plate-like workpiece is thinned to a predetermined thickness by grinding, polishing processing is performed in order to remove grinding distortion and improve the flatness of the plate-like workpiece (for example, Patent Documents). 1). In this polishing process, a polishing pad (D-pad, E-pad) containing abrasive grains is mounted on a polishing spindle above a holding table that holds a plate-like workpiece. Then, the polishing pad is also rotated together with the holding table, and the upper surface of the plate-like workpiece is polished by rotating and contacting the polishing pad from above with respect to the plate-like workpiece on the holding table.

  At this time, if the rotation center of the plate-like workpiece on the holding table coincides with (or close to) the rotation center of the polishing pad, the friction near the center of the plate-like workpiece becomes small and the polishing is not properly performed. For this reason, in the above grinding and polishing apparatus, by using a polishing pad having a diameter larger than that of the plate-shaped workpiece, polishing is performed by shifting the rotation center of the polishing pad with respect to the rotation center of the plate-shaped workpiece. The polishing amount is made uniform.

JP 2010-251524 A

  By the way, in a semiconductor device manufacturing process, for example, a plate-like workpiece may be stuck on a substrate (another plate-like workpiece) like a TSV (Through Silicon Via) process for connecting plate-like workpieces. is there. Generally, a bonding member such as a resin is used for bonding the plate-shaped workpiece and the substrate, but it is difficult to apply the bonding member to a uniform thickness. Slight undulation occurs on the workpiece. Since the plate-like workpiece is peeled off from the substrate by grinding and polishing of the plate-like workpiece having the undulations, it is not flat, and it is necessary to obtain a polished surface along the thickness of the bonded member.

  This invention is made | formed in view of this point, and can plate-finish the plate-shaped workpiece | work stuck on the substrate via the bonding member by uniform thickness according to the thickness of the bonding member. An object is to provide a grinding and polishing apparatus.

  The grinding and polishing apparatus of the present invention includes a holding table having a holding surface for holding a work set bonded to a substrate serving as a base by a bonding member, and the work set held on the holding table. Grinding means for grinding, a grinding wheel in which a grinding wheel is disposed in an annular shape rotatably mounted on the grinding means, positioning means for positioning the holding table at a grinding position corresponding to the grinding wheel, and holding on the holding table A polishing means for polishing the workpiece set, a polishing pad rotatably mounted on the polishing means, and a parallel movement of the polishing means with respect to the holding surface of the holding table positioned by the positioning means. A polishing moving means positioned at a predetermined polishing position; an inclination adjusting means for adjusting the relative inclination of the holding table and the grinding means; And a control means for controlling the operation and the polishing operation, the control means adjusting the inclination using the inclination adjusting means and then grinding by the grinding means to change the thickness of the work set in the radial direction. A grinding pattern generating unit that generates a pattern, a polishing pattern generating unit that generates a polishing pattern that changes the thickness in the radial direction of the work set after the polishing unit is positioned using the polishing moving unit, and Based on the measurement data of the bonding member recognized by the recognition unit that recognizes the measurement data obtained by measuring the upper surface height of the bonding member from above with the substrate of the work set down, A selection unit that selects a grinding pattern that can be generated by the grinding pattern generation unit and a polishing pattern that can be generated by the polishing pattern generation unit;

  According to this configuration, a grinding pattern and a polishing pattern are selected based on measurement data obtained by measuring the upper surface height of the bonded member between the substrate and the plate-like workpiece, taking into account variations in the thickness of the bonded member. Is done. By this grinding pattern and polishing pattern, grinding and polishing are performed along the undulations of the plate-like workpiece caused by the variation in the thickness of the bonded member. Therefore, the polishing surface along the thickness of the bonding member can be obtained on the plate-like workpiece, and the plate-like workpiece peeled from the substrate can be formed flat.

  In the grinding and polishing apparatus of the present invention, a first grinding method in which the grinding pattern generating unit of the control means adjusts the inclination using the inclination adjusting means and grinds the work set to a uniform thickness in the radial direction, and The outer periphery of the polishing pad is held by the holding table by the polishing pattern generating unit of the control means, and the work set ground by the first grinding method is held inside the outer periphery of the work set held by the holding table. And the first polishing method for polishing the work set by the polishing means, and the central portion can be formed thinner than the outer peripheral portion of the work set.

  In the grinding and polishing apparatus of the present invention, the polishing pad surrounds the central polishing portion and protrudes from the central polishing portion while forming a circular shape with an area covering the holding table at the rotation center portion. It is comprised with a ring-shaped outer periphery grinding | polishing part.

  In the grinding and polishing apparatus of the present invention, a first grinding method in which the grinding pattern generating unit of the control means adjusts the inclination using the inclination adjusting means and grinds the work set to a uniform thickness in the radial direction, and Using the polishing movement means by the polishing pattern generating section of the control means to position the outer peripheral polishing portion of the polishing pad on the outer peripheral portion of the work set after the work set ground by the first grinding method is used. And polishing the work set polished by the second polishing method with the polishing moving means such that the outer periphery of the central polishing portion of the polishing pad is placed inside the outer periphery of the work set. And a third polishing method of positioning and polishing by the polishing means is performed to form a convex portion within a radius range of the work set.

  In the grinding and polishing apparatus of the present invention, a first grinding method in which the grinding pattern generating unit of the control means adjusts the inclination using the inclination adjusting means and grinds the work set to a uniform thickness in the radial direction, and The work set ground by the first grinding method uses the polishing moving means by the polishing pattern generation part of the control means to position the outer peripheral polishing part of the polishing pad within the radius range of the work set and perform the polishing. A fourth polishing method for polishing by means, and the polishing moving means for moving the work set polished by the fourth polishing method so that the outer periphery of the central polishing portion of the polishing pad is inward from the outer periphery of the work set. And performing a third polishing method in which the polishing means is used for polishing and forming a recess within a radius range of the work set.

  In the grinding and polishing apparatus of the present invention, the measurement table for holding the work set with the substrate facing down, and the height of the bonding member in the radial direction for the work set held on the measurement table are measured. A measurement unit and a rotation mechanism for rotating the measurement table are provided, and the measurement unit outputs measurement data to the recognition unit.

  In the above grinding and polishing apparatus of the present invention, the selection unit adjusts the tilt using the tilt adjusting unit, and then grinds the work set held by the holding table by the grinding unit to generate a plurality of types. The grinding pattern and a plurality of types of the polishing patterns which can be generated by positioning the polishing means with respect to the holding table using the polishing moving means and polishing the work set held by the holding table with the polishing means. And a combination of a plurality of types of grinding and polishing that can be selected by selecting one pattern at a time.

  According to the present invention, since the grinding process and the polishing process are performed based on the grinding pattern and the polishing pattern in consideration of the variation in the thickness of the bonding member, the plate shape bonded to the substrate via the bonding member The workpiece can be polished to a uniform thickness according to the thickness of the bonded member.

It is a perspective view which shows an example of the grinding-polishing apparatus which concerns on this Embodiment. It is explanatory drawing of the polishing pad which concerns on this Embodiment. It is explanatory drawing of the other polishing pad which concerns on this Embodiment. It is explanatory drawing of the grinding pattern which concerns on this Embodiment. It is explanatory drawing of the grinding | polishing pattern which concerns on this Embodiment. It is explanatory drawing in the case of combining the some grinding | polishing pattern which concerns on this Embodiment. It is a flowchart of the grinding process and polishing process which concern on this Embodiment. It is explanatory drawing of the Example of the grinding process and polishing process which concern on this Embodiment. It is a figure which shows another example of the grinding operation | movement and polishing operation | movement which concern on this Embodiment.

  Hereinafter, a grinding and polishing apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing an example of a grinding and polishing apparatus according to the present embodiment. Note that the grinding and polishing apparatus according to the present embodiment is not limited to the configuration shown in FIG. The grinding and polishing apparatus may have any configuration as long as it can grind and polish the plate-like workpiece with a uniform thickness in accordance with the bonding state of the plate-like workpiece to the substrate serving as the base.

  As shown in FIG. 1, the grinding and polishing apparatus 1 is a fully automatic type processing apparatus, and performs a series of processes including rough grinding, finish grinding, polishing and cleaning operations on the plate-like workpiece W1 fully automatically. Is configured to do. The plate-like workpiece W1 is stacked on a substrate W2 serving as a base, and is carried into the grinding and polishing apparatus 1 as a workpiece set W. The plate-like workpiece W1 is bonded to the surface of the substrate W2 via a bonding member 99 such as a resin. A protective tape (not shown) is attached to the back surface of the substrate W2, that is, the back surface of the work set W.

In the present embodiment, as the plate-like workpiece W1 and the substrate W2, a semiconductor substrate such as a silicon wafer (Si), gallium burrow (GaAs), or silicon carbide (SiC), ceramic, glass, sapphire (Al ₂ O ₃₎ ) -Based inorganic material substrates, ductile materials such as plate-like metals and resins, and various processing materials requiring flatness (TTV: total thickness variation) from the micron order to the submicron order may be used. The flatness here refers to the difference between the maximum value and the minimum value among the heights measured in the thickness direction with the surface to be ground of the wafer W as a reference surface.

  The grinding / polishing apparatus 1 has a substantially rectangular parallelepiped base 11. A pair of cassette tables 13 and 14 are provided on the front surface 12 of the base 11. On the cassette base 13, a loading cassette 15 in which a work set W before processing is accommodated is placed. An unloading cassette 16 in which the processed work set W is accommodated is placed on the cassette base 14. Thus, the cassette table 13 functions as a carry-in port for the grinding and polishing apparatus 1, and the cassette table 14 functions as a carry-out port for the grinding and polishing apparatus 1. The carry-in cassette 15 and the carry-out cassette 16 on the pair of cassette stands 13 and 14 have their front surfaces open so that the work set W can be taken in and out.

  On the upper surface of the base 11, a robot 17 is provided behind the cassette stands 13 and 14 for loading and unloading the work set W with respect to the carry-in cassette 15 and the carry-out cassette 16. Further, on both diagonally rear sides of the robot 17, a measuring mechanism 21 that measures the upper surface height of the bonding member 99 of the workpiece set W before processing and a cleaning mechanism 25 that cleans the processed workpiece set W are provided. ing. Between the measurement mechanism 21 and the cleaning mechanism 25, a supply mechanism 31 that supplies the work set W before processing to the holding table 43 and a recovery mechanism 36 that recovers the processed work set W from the holding table 43 are provided. It has been.

  The robot 17 has a multi-node link portion 18 composed of a plurality of arms, and a hand portion 19 provided at the tip of the multi-node link portion 18. The robot 17 drives the multi-node link portion 18 to transfer the unprocessed work set W from the loading cassette 15 to the measurement mechanism 21 and also transfers the processed work set W from the cleaning mechanism 25 to the unloading cassette 16. Transport. The measurement mechanism 21 includes a measurement table 22 on which the work set W is placed, a rotation mechanism (not shown) that rotates the measurement table 22, and a non-contact measurement unit 23 that is supported above the measurement table 22. Have. The height of the upper surface of the bonding member 99 is measured by irradiating the work set W with light having a wavelength having transparency.

  The supply mechanism 31 includes a shaft portion 32 extending vertically, a turning arm 33 supported on the upper end of the shaft portion 32, and a transport pad 34 provided at the tip of the turning arm 33. The shaft portion 32 is configured to be vertically movable and rotatable. The supply mechanism 31 sucks and holds the work set W from the measurement table 22 by the transport pad 34 and lifts it, and rotates the transport pad 34 and transports it to the holding table 43. At this time, since the center of the measurement table 22 and the center of the holding table 43 are positioned on the turning locus of the transport pad 34, the center of the work set W is aligned with the center of the holding table 43.

  The collection mechanism 36 includes a shaft portion 37 extending vertically, a turning arm 38 supported on the upper end of the shaft portion 37, and a transport pad 39 provided at the tip of the turning arm 38. The shaft portion 37 is configured to be vertically movable and rotatable. The recovery mechanism 36 sucks and holds the work set W from the holding table 43 by the transport pad 39 and lifts it, and rotates the transport pad 39 to transport it to the spinner table 26 of the cleaning mechanism 25. At this time, since the center of the holding table 43 and the center of the spinner table 26 are located on the turning locus of the transport pad 39, the center of the work set W is aligned with the center of the spinner table 26.

  The cleaning mechanism 25 includes a disk-shaped spinner table 26 having a smaller diameter than the work set W. When the processed work set W is placed on the spinner table 26, the spinner table 26 is lowered into the base 11 through the opening 27. Then, the spinner table 26 rotates at a high speed, and the work set W is cleaned by spraying cleaning water toward the spinner table 26. Subsequently, in a state where the spinner table 26 is rotated, the work set W is dried by blowing dry air instead of cleaning water.

  A turntable 41 as a positioning means is provided behind the supply mechanism 31 and the recovery mechanism 36. Around the turntable 41, support columns 47, 48, and 49 are erected. Grinding means 51 for rough grinding is supported on the support column 47, grinding means 61 for finishing is supported on the support column 48, and polishing means 71 is supported on the support column 49. Four holding tables 43 are arranged at equal intervals in the circumferential direction on the turntable 41, and the turntable 41 rotates intermittently at intervals of 90 degrees. Therefore, each holding table 43 is in the order of a transfer area to which the work set W is transferred, a rough grinding area facing the grinding means 51, a finish grinding area facing the grinding means 61, and a polishing area facing the polishing means 71. Positioned.

  Each holding table 43 is rotatably provided on the upper surface of the turntable 41. A holding surface 44 is formed on the upper surface of the holding table 43 by a porous ceramic material. The holding surface 44 of the holding table 43 is formed in a slowly inclined conical shape having the rotation center of the holding table 43 as a vertex (see FIG. 4). When the work set W is sucked and held on the holding surface 44, the work set W also has a gently inclined conical shape along the holding surface 44. The inclination of the holding table 43 with respect to the grinding means 51 and 61 is adjusted by the inclination adjusting means 45. The inclination adjusting means 45 includes two movable support portions and one fixed support portion, and supports the holding table 43 at three points.

  In the tilt adjusting means 45, the holding table 43 is tilted with the fixed support portion as a fulcrum by the vertical movement of the two movable support portions. The holding table 43 is inclined according to the gradient of the conical holding surface 44 of the holding table 43, and the inclination of the work set W is adjusted with respect to the grinding surfaces of the grinding means 51 and 61. For example, by adjusting the work set W so that a part of the work set W is parallel to the grinding surfaces of the grinding means 51 and 61, the processed part reaches from the center of the work set W (plate-like work W1) to the outer peripheral edge. The area is adjusted (see FIG. 4A).

  The support portions 47 and 48 are provided with grinding moving means 52 and 62 for moving the grinding means 51 and 61 for rough grinding and finish grinding up and down. The grinding moving means 52, 62 are a pair of guide rails 53, 63 arranged in front of the support pillars 47, 48 and parallel to the Z-axis direction, and a motor drive installed on the pair of guide rails 53, 63 so as to be slidable. Z-axis bases 54 and 64. Grinding means 51 and 61 are supported on the front surfaces of the Z-axis bases 54 and 64 via housings 55 and 65. Nut portions (not shown) are formed on the back surfaces of the Z-axis bases 54 and 64, and ball screws 56 and 66 are screwed into the nut portions. The ball screws 56 and 66 are rotationally driven by drive motors 57 and 67 connected to one end portions of the ball screws 56 and 66, and the grinding means 51 and 61 are moved along the guide rails 53 and 63 in the Z-axis direction.

  The grinding means 51 and 61 for rough grinding and finish grinding are configured by providing mounts 59 and 69 at lower ends of cylindrical spindles 58 and 68, respectively. The spindles 58 and 68 are provided with flanges 60 and 70 extending in the radial direction, and the grinding means 51 and 61 are supported by the housings 55 and 65 via the flanges 60 and 70. Grinding wheels 86 and 88 in which a plurality of grinding wheels 85 and 87 are arranged annularly are mounted on the lower surfaces of the mounts 59 and 69. The grinding wheel 85 for rough grinding is composed of, for example, a diamond grinding stone in which diamond abrasive grains are hardened with a binder such as metal bond or resin bond. As the grinding wheel 87 for finish grinding, one having a finer particle size than the grinding wheel 85 for rough grinding is used.

  Further, the grinding means 51 and 61 for rough grinding and finish grinding are supported so as to be tiltable with respect to the housings 55 and 65. In this case, the inclination adjustment of the grinding means 51 and 61 is performed by a plurality of adjustment screws (not shown) provided between the housings 55 and 65 and the flanges 60 and 70. For example, the plurality of adjusting screws are arranged around the spindles 58 and 68 at equal intervals. The inclination of the grinding means 51 and 61 is adjusted by adjusting the height of at least one of the plurality of adjustment screws, and the inclination of the grinding wheels 85 and 87 is adjusted accordingly. As described above, the adjustment screw constitutes an inclination adjusting means in the same manner as the movable support portion and the fixed support portion of the holding table 43. Note that the adjustment screw may be adjusted manually or automatically.

  The support column 49 is provided with a polishing moving means 72 for positioning the polishing means 71 at a predetermined polishing position with respect to the holding surface 44 of the holding table 43. The polishing moving means 72 includes a pair of guide rails 73 arranged in front of the support column 49 and parallel to the Y-axis direction, and a motor-driven Y-axis base 74 slidably installed on the pair of guide rails 73. Have. The polishing moving means 72 includes a pair of guide rails 75 arranged in front of the Y-axis base 74 and parallel to the Z-axis direction, and a Z-axis base 76 slidably installed on the pair of guide rails 75. have. A polishing means 71 is supported on the front surface of the Z-axis base 76 via a housing 79.

  A nut portion is formed on the back side of each of the Y-axis base 74 and the Z-axis base 76, and a ball screw (not shown) is screwed into the nut portion. The ball screws are rotationally driven by drive motors 77 and 78 connected to one end of the ball screw, and the polishing means 71 is moved along the guide rails 73 and 75 in the Y-axis direction and the Z-axis direction. The polishing means 71 is configured by providing a mount 82 at the lower end of a cylindrical spindle 81. A polishing pad 89 formed of a foaming agent, fiber, or the like is attached to the lower surface of the mount 82. The spindle 81 is provided with a flange 83 extending in the radial direction, and the polishing means 71 is supported by the housing 79 via the flange 83.

  Further, in the base 11, a control means 90 is provided for overall control of each part of the grinding / polishing apparatus 1. The control means 90 executes various controls such as grinding control by the grinding means 51 and 61, polishing control by the polishing means 71, and measurement control of the upper surface height of the bonding member 99 of the work set W. The control unit 90 includes a grinding pattern generation unit 91, a polishing pattern generation unit 92, a recognition unit 93, and a selection unit 94. The grinding pattern generation unit 91 generates a grinding pattern that changes the radial thickness of the work set W by grinding. The polishing pattern generation unit 92 generates a polishing pattern that changes the radial thickness of the work set W by polishing.

  The recognition unit 93 recognizes measurement data indicating the upper surface height of the bonded member 99 from the measurement result of the measurement unit 23. The selection unit 94 selects a grinding pattern that can be generated by the grinding pattern generation unit 91 and a polishing pattern that can be generated by the polishing pattern generation unit 92 based on the measurement data. Note that the control unit 90 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. In addition, a grinding pattern and a polishing pattern may be stored in advance in the memory.

  In the grinding and polishing apparatus 1 configured as described above, the work set W before grinding is first taken out from the loading cassette 15 by the robot 17 and placed on the measurement table 22. The work set W on the measurement table 22 is measured by the measurement unit 23 for the upper surface height of the bonding member 99. Thereby, the undulation of the upper surface of the plate-like workpiece W1 due to the thickness of the bonding member 99 of the workpiece set W is measured. The measurement data of the measurement unit 23 is output to the recognition unit 93 of the control means 90. In the control unit 90, when the recognition data is recognized by the recognition unit 93, the selection unit 94 selects a grinding pattern and a polishing pattern corresponding to the upper surface height of the bonding member 99.

  Next, the work set W is conveyed to the holding table 43 by the supply mechanism 31, and the work set W on the holding table 43 is positioned by the turntable 41 in the order of the rough grinding area, the finish grinding area, and the polishing area. In the rough grinding area, the work set W is roughly ground by the grinding means 51. At this time, the selected grinding pattern is applied to the selection unit 94, and the inclination of the holding table 43 is adjusted by the inclination adjusting means 45. Similarly, in the finish grinding area, the selected grinding pattern is applied to the selection unit 94, and the work set W is finish-ground by the grinding means 61 in a state where the inclination of the holding table 43 is adjusted.

  In the polishing area, the work set W is polished by the polishing means 71. At this time, the selected polishing pattern is applied to the selection unit 94, and the polishing unit 71 is positioned at a predetermined polishing position by the polishing moving unit 72. Thus, the grinding control and the polishing control in consideration of the variation in the thickness of the bonding member 99 are performed by the grinding pattern and the polishing pattern. Therefore, the plate-like workpiece W1 of the workpiece set W is polished and finished with a uniform thickness. The processed work set W is transported to the spinner table 26 by the recovery mechanism 36 and cleaned by the cleaning mechanism 25. The cleaned work set W is accommodated in the carry-out cassette 16 by the robot 17.

  The polishing pad will be described in detail with reference to FIGS. FIG. 2 is an explanatory diagram of the polishing pad according to the present embodiment. FIG. 3 is an explanatory diagram of another polishing pad according to the present embodiment. 2A is a perspective view of the polishing pad as viewed from below, FIG. 2B is a perspective view of the polishing pad as viewed from above, and FIG. 2C is a cross-sectional view of the polishing pad. 3A is a perspective view of the polishing pad as viewed from below, and FIG. 3B is a cross-sectional view of the polishing pad.

  As shown in FIG. 2, the polishing pad 89 has a disk base 101 attached to the mount 82, a central polishing portion 102 is provided at the center of the lower surface of the disk base 101, and the lower surface outside of the disk base 101. Is provided with an outer peripheral polishing portion 103. On the lower surface of the disk base 101, the outer peripheral portion 105 projects downward from the central portion 104, and the central portion 104 is formed in a concave shape. The central polishing portion 102 is attached to the central portion 104 of the disk base 101, and the outer peripheral polishing portion 103 is attached to the protruding outer peripheral portion 105 of the disk base 101. Since the outer peripheral polishing portion 103 and the central polishing portion 102 have substantially the same thickness, the polishing surface of the outer peripheral polishing portion 103 protrudes downward from the central polishing portion 102.

  The center polishing portion 102 is formed in a circular plate shape with an area covering the holding table 43 at the rotation center portion (center portion 104) of the polishing pad 89. Since the work set W is formed to have a smaller diameter than the holding table 43, the entire surface of the work set W is polished by the central polishing unit 102. The outer peripheral polishing portion 103 is formed in a ring shape so as to surround the central polishing portion 102. The outer peripheral polishing unit 103 brings a part of the ring-shaped polishing surface into contact with the work set W, and polishes the surface of the plate-shaped workpiece W1 with an arc-shaped polishing region. By selectively using the central polishing portion 102 and the outer periphery polishing portion 103, the surface of the work set W (plate-like workpiece W1) is polished into various shapes.

  When polishing by the central polishing unit 102, the outer peripheral polishing unit 103 is located outside the central polishing unit 102, so that the outer peripheral polishing unit 103 may come into contact with the work set W when the central polishing unit 102 polishes the work set W. Is prevented. Next, when polishing by the outer peripheral polishing portion 103, the outer peripheral polishing portion 103 protrudes below the central polishing portion 102, so that the central polishing portion 102 is prevented from contacting the work set W. In the example illustrated in FIG. 2, the central polishing portion 102 is provided without gaps on the inner side of the outer peripheral polishing portion 103. However, the configuration is not limited thereto. As shown in FIG. 3, a central polishing portion 113 may be provided inside the outer peripheral polishing portion 114 with a predetermined interval.

  As shown in FIG. 3, the polishing pad 111 is provided with a circular plate-like central polishing portion 113 at the center of the lower surface of the disk base 112, and on the outer surface of the lower surface of the disk base 112, similar to the polishing pad 89 shown in FIG. A ring-shaped outer peripheral polishing portion 114 is provided. A central portion 115 on the lower surface of the disk base 112 is formed wider than the central polishing portion 113, and the outer peripheral polishing portion 114 is located outside the central polishing portion 113 with a predetermined interval. That is, an empty space is formed between the center polishing portion 113 and the outer periphery polishing portion 114. This empty space functions as an escape portion 117 that creates a non-contact area between the central polishing portion 113 and the work set W during polishing by the central polishing portion 113 (see FIG. 5D).

  The grinding pattern and the polishing pattern will be described with reference to FIGS. FIG. 4 is an explanatory diagram of a grinding pattern according to the present embodiment. FIG. 5 is an explanatory diagram of a polishing pattern according to the present embodiment. FIG. 6 is an explanatory diagram in the case of combining a plurality of polishing patterns according to the present embodiment. Note that FIG. 4 illustrates an example of rough grinding for the sake of convenience of explanation, but finish grinding can also be performed in the same manner.

  First, the grinding pattern will be described. As shown in FIG. 4, the work set W is held on the holding table 43 along a gently inclined conical holding surface 44. The holding table 43 is tilted by the tilt adjusting means 45 (see FIG. 1) so that the left side of the paper surface is lowered in accordance with the gradient of the conical holding surface 44, and the slope on the right side of the paper surface of the work set W is horizontal when viewed from the side. To be adjusted. A horizontal portion from the center of the work set W to the outer peripheral edge is set as a processing area to be ground by the grinding wheel 85. In the normal grinding pattern shown in FIG. 4A, the work set W is ground to a uniform thickness in the radial direction by bringing the grinding wheel 85 into horizontal contact with the horizontal portion of the work set W.

  In the grinding pattern shown in FIG. 4B, the grinding means 51 is tilted to the left side of the drawing so that the grinding wheel 85 contacts the center 121 of the work set W and is ground from the center 121 side of the work set W. As a result, the surface shape of the work set W is processed into a concave shape in which the work set W becomes thinner from the outer periphery 122 toward the center 121. In the grinding pattern shown in FIG. 4C, the grinding means 51 is tilted to the right side of the drawing surface so that the grinding wheel 85 comes into contact with the outer periphery 122 of the work set W and is ground from the outer periphery 122 of the work set W. As a result, the surface shape of the work set W is processed into a convex shape in which the work set W becomes thinner from the center 121 toward the outer periphery 122.

  In the grinding pattern shown in FIG. 4D, the grinding means 51 is tilted toward the front side of the sheet so that the grinding wheel 85 contacts the intermediate position 123 within the radius of the work set W, and is ground from the intermediate position 123 of the work set W. The As a result, the surface shape of the work set W is processed so that the intermediate position 123 in the radial direction of the work set W becomes thin. In the grinding pattern shown in FIG. 4E, the grinding means 51 is tilted to the back side of the paper so that the grinding wheel 85 contacts the center 121 and the outer periphery 122 of the work set W, and is ground from the center 121 and the outer periphery 122 of the work set W. . As a result, the surface shape of the work set W is processed so that the center 121 and the outer periphery 122 of the work set W become thin.

  Next, the polishing pattern will be described. As shown in FIG. 5, the work set W is held on the holding table 43 along a gently inclined conical holding surface 44. In the polishing process, the holding table 43 is returned to the horizontal state by the inclination adjusting means 45. In the polishing pattern shown in FIG. 5A, the polishing position of the polishing pad 89 is adjusted by the polishing moving means 72 (see FIG. 1) so that the central polishing portion 102 contacts the entire surface of the work set W. At this time, the rotation center of the work set W on the holding table 43 and the rotation center of the polishing pad 89 are adjusted so as not to coincide with each other, so that the polishing amount on the surface of the work set W is adjusted to be uniform.

  In the polishing pattern shown in FIG. 5B, the polishing position of the polishing pad 89 is adjusted by the polishing moving means 72 (see FIG. 1) so that a part of the outer peripheral polishing portion 103 contacts within the radius range of the work set W. At this time, the center side 124 of the work set W is not in contact with the outer peripheral polishing portion 103 than the contact position between the work set W and the outer peripheral polishing portion 103. On the other hand, the outer peripheral side 125 of the work set W is brought into contact with the outer peripheral polishing portion 103 as the work set W rotates from the contact position between the work set W and the outer peripheral polishing portion 103, but the outer side from the contact position is directed outward. The contact frequency becomes low. As a result, the surface shape of the work set W is processed so as to become thicker from the contact position toward the outer peripheral side 125 while leaving the center side 124 from the contact position of the work set W.

  In the polishing pattern shown in FIG. 5C, the polishing position of the polishing pad 89 is adjusted by the polishing moving means 72 (see FIG. 1) such that a part of the outer peripheral polishing portion 103 contacts the outer peripheral portion 126 of the work set W. At this time, the center side of the work set W from the contact position between the work set W and the outer peripheral polishing portion 103 is not in contact with the outer peripheral polishing portion 103. As a result, only the outer peripheral portion 126 of the work set W is polished by the outer peripheral polishing portion 103, and the surface shape of the work set W is processed so that the outer peripheral portion 126 becomes thinner.

  In the polishing pattern shown in FIG. 5D, another polishing pad 111 is used, and the polishing moving means 72 (see FIG. 1) causes the outer periphery of the central polishing portion 113 to be positioned inside the outer periphery of the work set W. The polishing position of the polishing pad 111 is adjusted. As described above, in the polishing pad 111, the escape portion 117 is formed between the central polishing portion 113 and the outer peripheral polishing portion 114, and a part of the outer peripheral portion 126 of the work set W is positioned on the escape portion 117. Yes. The outer peripheral portion 126 of the work set W also contacts the central polishing portion 113 by the rotation of the work set W. However, since the contact frequency is low, the surface shape of the work set W is processed so as to be thin leaving the outer peripheral portion 126.

  Next, a case where a plurality of polishing patterns are combined will be described. In the polishing pattern shown in FIG. 6A, another polishing pad 111 is used. First, the polishing position of the polishing pad 111 is adjusted by the polishing moving means 72 (see FIG. 1) so that a part of the outer peripheral polishing portion 114 contacts the outer peripheral portion 126 of the work set W. At this time, the center side of the work set W from the contact position between the work set W and the outer peripheral polishing portion 114 is not in contact with the outer peripheral polishing portion 114. Then, only the outer peripheral portion 126 of the work set W is polished by the outer peripheral polishing portion 114, and the surface shape of the work set W is processed so that the outer peripheral portion 126 becomes thinner.

  Subsequently, the polishing position of the polishing pad 111 is adjusted by the polishing moving means 72 (see FIG. 1) so that the outer periphery of the central polishing portion 113 is positioned inside the outer peripheral portion 126 of the work set W. For this reason, the outer peripheral region 127 including the outer peripheral portion 126 of the work set W is positioned in the relief portion 117 of the polishing pad 111. Then, the surface frequency of the work set W is processed so that the contact frequency with the central polishing portion 113 is low in the outer peripheral area 127 of the work set W, and the outer peripheral area 127 is left thin. As a result, the surface shape of the work set W is processed so that the ring-shaped convex portion 128 remains in the outer peripheral region 127.

  In the polishing pattern shown in FIG. 6B, another polishing pad 111 is used. First, the polishing position of the polishing pad 111 is adjusted by the polishing moving means 72 (see FIG. 1) so that a part of the outer peripheral polishing portion 114 is in contact with the radius of the work set W. At this time, the center side 124 of the work set W is not in contact with the outer peripheral polishing portion 114 from the contact position between the work set W and the outer peripheral polishing portion 114. On the other hand, the outer peripheral side 125 of the work set W is brought into contact with the outer peripheral polishing portion 114 as the work set W rotates rather than the contact position between the work set W and the outer peripheral polishing portion 114, but it goes outward from the contact position. The contact frequency becomes low. As a result, the surface shape of the work set W is processed so as to become thicker from the contact position toward the outer peripheral side 125 while leaving the center side 124 from the contact position of the work set W.

  Subsequently, the polishing position of the polishing pad 111 is adjusted by the polishing moving means 72 (see FIG. 1) so that the outer periphery of the central polishing portion 113 is positioned inside the outer periphery of the work set W. For this reason, the outer peripheral region 127 of the work set W is positioned in the relief portion 117 of the polishing pad 111. Then, the surface frequency of the work set W is processed so that the contact frequency with the central polishing portion 113 is low in the outer peripheral area 127 of the work set W, and the outer peripheral area 127 is left thin. As a result, the center side 124 of the work set W is thinned, and the surface shape of the work set W is processed so that the concave portion 129 surrounding the center side 124 remains in the radius range of the work set W.

  In the present embodiment, these plural types of grinding patterns and polishing patterns are appropriately selected to process the surface shape of the workpiece set W, that is, the surface shape of the plate-like workpiece W1. Thereby, even if the plate-like workpiece W1 is undulated due to the variation in the thickness of the bonding member 99, the plate-like workpiece W1 peeled off from the substrate W2 is performed by combining the grinding pattern and the polishing pattern. Can be formed flat. For example, after the work set W is formed with a uniform thickness with the normal grinding pattern shown in FIG. 4A, the ring-shaped convex portion 128 is formed in the outer peripheral region 127 of the work set W with the polishing pattern shown in FIG. 6A. May be. Further, after the work set W is formed with a uniform thickness with the normal grinding pattern shown in FIG. 4A, the ring-shaped recess 129 may be left in the work set W with the polishing pattern shown in FIG. 6B.

  With reference to FIGS. 1 and 7, the flow of grinding and polishing will be described. FIG. 7 is a flowchart of grinding and polishing according to the present embodiment. Note that the following flowchart is merely an example, and can be changed as appropriate.

  As shown in FIG.1 and FIG.7, the recognition part 93 of the control means 90 recognizes the upper surface height of the bonding member 99 of the work set W (step S01). In this case, the light irradiated from the measurement unit 23 is reflected from the lower surface of the plate-like workpiece W1 with respect to the workpiece set W on the measurement table 22, and the upper surface height of the bonding member 99 is measured. Then, measurement data is output from the measurement unit 23 to the recognition unit 93, and the recognition unit 93 recognizes the upper surface shape of the bonding member 99. Next, the selection unit 94 of the control unit 90 selects a grinding pattern and a polishing pattern based on the measurement data (step S02). In this case, a grinding pattern and a polishing pattern suitable for the upper surface shape of the bonding member 99 are selected from the plurality of types of grinding patterns and polishing patterns described above.

  Next, the work set W is transported from the measurement table 22 to the holding table 43, and the work set W is positioned in the rough grinding area by the turntable 41 (step S03). Next, the relative inclination between the holding table 43 and the grinding unit 51 is adjusted based on the grinding pattern selected by the selection unit 94, and the surface of the work set W is roughly ground by the grinding unit 51 (step S04). . Next, the roughly ground workpiece set W is positioned from the rough grinding area to the finish grinding area by the turntable 41 (step S05). Next, the relative inclination between the holding table 43 and the grinding means 51 is adjusted based on the grinding pattern selected by the selection unit 94, and the surface of the work set W is finish-ground by the grinding means 61 (step S06).

  Next, the work set W that has been subjected to finish grinding is positioned from the finish grinding area to the polishing area by the turntable 41 (step S07). At this time, the inclination of the holding table 43 is returned so that the holding table 43 is horizontal. Next, the position of the polishing unit 71 is adjusted based on the polishing pattern selected by the selection unit 94, and the surface of the work set W is polished by the polishing unit 71 (step S08). The processed work set W is cleaned by the cleaning mechanism 25 and then transferred to the loading cassette 15. The surface shape of the processed work set W is formed following the upper surface shape of the bonding member 99. Therefore, the plate-like workpiece W1 peeled from the substrate W2 is formed flat.

(Example)
Here, with reference to FIG. 8, the correction example of the flatness of the grinding process and the polishing process according to the present embodiment will be described. In the example shown in FIG. 8A, the outer periphery of the plate-like workpiece W1 (work set W) before processing is low, and the flatness (TTV) is about 2.0 μm. For the work set W, the center 121 and the outer periphery 122 of the work set W were thinly formed with the grinding pattern shown in FIG. 4E, and then the outer peripheral portion 126 of the work set W was thinly formed with the polishing pattern shown in FIG. 5C. As a result, the flatness of the plate-like workpiece W1 peeled from the substrate W2 was improved to about 0.8 μm.

  In the example shown in FIG. 8B, the substantially intermediate position in the radial direction of the plate-like workpiece W1 (work set W) before processing is low, and the flatness (TTV) is about 2.0 μm. After thinly forming the work set W from the outer periphery 122 of the work set W toward the center 121 with the grinding pattern shown in FIG. 4B, a ring-shaped recess 129 is left in the work set W with the polishing pattern shown in FIG. 6B. Formed as follows. As a result, the flatness of the plate-like workpiece W1 peeled from the substrate W2 was improved to about 0.8 μm.

  As described above, according to the grinding and polishing apparatus 1 according to the present embodiment, bonding is performed based on measurement data obtained by measuring the upper surface height of the bonding member 99 between the substrate W2 and the plate-like workpiece W1. A grinding pattern and a polishing pattern are selected in consideration of variations in the thickness of the member 99. With this grinding pattern and polishing pattern, grinding and polishing are performed along the undulations of the plate-like workpiece W <b> 1 caused by the variation in the thickness of the bonding member 99. Therefore, the polishing surface along the upper surface shape of the bonding member 99 can be obtained on the plate-like workpiece W1, and the plate-like workpiece W1 peeled off from the substrate W2 can be formed flat.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in each of the above-described embodiments, the work set W is polished by the polishing pad 89 having the central polishing unit 102 and the outer peripheral polishing unit 103. However, the present invention is not limited to this configuration. As shown in FIG. 9, the work set W may be polished using a normal polishing pad 131. In this case, for example, as shown in FIG. 9, after the work set W is formed to have a uniform thickness with a normal grinding pattern, the polishing pad is placed inside the outer periphery of the work set W by the polishing moving means 72 (see FIG. 1). The outer periphery of 131 is positioned. The outer peripheral portion 126 of the work set W also contacts the polishing pad 131 by the rotation of the work set W. However, since the contact frequency is low, the surface shape of the work set W is processed so that the central portion 132 becomes thin.

  In the present embodiment, the recognition unit 93 of the control unit 90 acquires the measurement data from the measurement unit 23 and recognizes the upper surface height of the bonding member 99. However, the configuration is limited to this configuration. Not. The recognition unit 93 may capture measurement data from an external device and recognize the upper surface height of the bonding member 99.

  In the present embodiment, the grinding and polishing apparatus 1 provided with the grinding means 51 for rough grinding, the grinding means 61 for finish grinding, and the polishing means 71 has been described. However, the present invention is not limited to this configuration. The grinding and polishing apparatus 1 only needs to include the grinding means 51 and the polishing means 71 for rough grinding, and may not include the grinding means 61 for finish grinding.

  Moreover, in this Embodiment, although the grinding / polishing apparatus 1 which has the turntable 41 as a positioning means was demonstrated, it is not limited to this structure. The positioning means may be any configuration that positions the holding table 43 at a position corresponding to the grinding wheel.

  Further, in the present embodiment, the tilt adjusting means 45 is configured to adjust the tilt of the holding table 43 by two movable support portions and one fixed support portion, but is not limited to this configuration. The tilt adjusting means 45 may have any configuration as long as it adjusts the relative tilt between the holding table 43 and the grinding means 51.

  In the present embodiment, the grinding pattern and the polishing pattern are generated by the grinding pattern generation unit 91 and the polishing pattern generation unit 92. However, each pattern may be generated in the apparatus or external data is taken in. May be generated.

  Further, in the above-described embodiment, the full-auto type grinding and polishing apparatus is exemplified, but the present invention is not limited to this configuration. The present invention is also applicable to a semi-auto type grinding and polishing apparatus.

  As described above, the present invention has an effect that a plate-like workpiece bonded to a substrate via a bonding member can be polished and finished with a uniform thickness according to the thickness of the bonding member. In particular, it is useful for a grinding and polishing apparatus capable of grinding and polishing a work set in which a plate-like work is bonded to a substrate.

DESCRIPTION OF SYMBOLS 1 Grinding polisher 21 Measuring mechanism 22 Measuring table 23 Measuring part 41 Turntable (positioning means)
43 holding table 44 holding surface 45 inclination adjusting means 51, 61 grinding means 52, 62 grinding moving means 71 polishing means 72 polishing moving means 85, 87 grinding wheel 86, 88 grinding wheel 89, 111 polishing pad 90 control means 91 grinding pattern generation Part 92 Polishing pattern generation part 93 Recognition part 94 Selection part 99 Bonding member 102, 113 Central polishing part 103, 114 Peripheral polishing part 128 Convex part 129 Concave part W1 Plate work W2 Substrate W Work set

Claims (7)

A holding table having a holding surface for holding a work set bonded to a substrate serving as a base by a bonding member, a grinding means for grinding the work set held on the holding table, and the grinding A grinding wheel in which a grinding wheel is mounted in an annular manner rotatably mounted on the means, a positioning means for positioning the holding table at a grinding position corresponding to the grinding wheel, and the work set held on the holding table is polished Polishing means, a polishing pad rotatably attached to the polishing means, and polishing for moving the polishing means parallel to the holding surface of the holding table positioned by the positioning means and positioning the polishing means at a predetermined polishing position A moving means, an inclination adjusting means for adjusting the inclination of the holding table and the grinding means relative to each other, and a grinding operation and a polishing operation are controlled. And a control that means,
The control unit includes a grinding pattern generation unit that generates a grinding pattern that is adjusted by the inclination adjusting unit and then is ground by the grinding unit to change a thickness in a radial direction of the work set, and the polishing movement A polishing pattern generating unit for generating a polishing pattern for changing the thickness in the radial direction of the work set after the polishing means is positioned using the means, and from above with the substrate of the work set facing down A recognition unit for recognizing measurement data obtained by measuring the upper surface height of the bonding member; a grinding pattern that can be generated by the grinding pattern generation unit based on the measurement data for the bonding member recognized by the recognition unit; A grinding and polishing apparatus comprising: a selection unit that selects a polishing pattern that can be generated by the polishing pattern generation unit. A first grinding method in which the grinding pattern generating unit of the control means adjusts the inclination using the inclination adjusting means and grinds the work set to a uniform thickness in the radial direction;
The work set ground by the first grinding method is moved from the outer periphery of the work set held by the holding table using the polishing moving means by the polishing pattern generation unit of the control means. 2. The grinding and polishing apparatus according to claim 1, wherein the first polishing method is performed by positioning the inner side and polishing the work set by the polishing means so that a central portion is formed thinner than an outer peripheral portion of the work set. .   The polishing pad includes a central polishing portion formed in a circular shape with an area covering the holding table at a rotation center portion, and a ring-shaped outer peripheral polishing portion that surrounds the central polishing portion and protrudes from the central polishing portion. The grinding and polishing apparatus according to claim 1. A first grinding method in which the grinding pattern generating unit of the control means adjusts the inclination using the inclination adjusting means and grinds the work set to a uniform thickness in the radial direction;
The outer peripheral polishing portion of the polishing pad is positioned on the outer peripheral portion of the work set by using the polishing movement means by the polishing pattern generation portion of the control means for the work set ground by the first grinding method. A second polishing method for polishing with a polishing means;
The work set polished by the second polishing method is polished by the polishing means by positioning the outer periphery of the central polishing portion of the polishing pad inside the outer periphery of the work set using the polishing moving means. Polishing method of
The grinding / polishing apparatus according to claim 3, wherein a convex portion is formed within a radius range of the work set by performing the step. A first grinding method in which the grinding pattern generating unit of the control means adjusts the inclination using the inclination adjusting means and grinds the work set to a uniform thickness in the radial direction;
The outer peripheral polishing portion of the polishing pad is positioned within the radius range of the work set by using the polishing moving means by the polishing pattern generating portion of the control means for the work set ground by the first grinding method. A fourth polishing method for polishing with a polishing means;
The work set polished by the fourth polishing method is polished by the polishing means with the outer periphery of the central polishing portion of the polishing pad positioned inside the outer periphery of the work set using the polishing moving means. Polishing method of
The grinding / polishing apparatus according to claim 3, wherein a recess is formed within a radius range of the work set.   A measurement table for holding the work set with the substrate down, a measurement unit for measuring the height of the bonded member in the radial direction of the work set held on the measurement table, and rotating the measurement table The grinding and polishing apparatus according to claim 1, further comprising: a rotating mechanism that causes the measurement unit to output measurement data to the recognition unit.   The selection unit includes a plurality of types of the grinding patterns that can be generated by grinding the work set held by the holding table with the grinding means after the inclination is adjusted using the inclination adjusting means, and the polishing moving means. The polishing means is positioned with respect to the holding table using the polishing table, and the work set held by the holding table is polished by the polishing means, and each of the plurality of types of polishing patterns that can be generated is selected. The grinding / polishing apparatus according to any one of claims 1 to 6, wherein the grinding / polishing apparatus is selected from a combination of a plurality of types of grinding / polishing that is possible.

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