JP6040592B2 - Metallized film capacitors - Google Patents

Description

  The present invention relates to a metallized film capacitor used for various electronic equipment, electrical equipment, industrial equipment, and automotive electrical equipment.

  Generally, metallized film capacitors are roughly classified into those using a metal foil as an electrode and those using a deposited metal provided on a dielectric film as an electrode. Among these, metallized film capacitors using evaporated metal as an electrode (hereinafter referred to as “deposited electrode”) have a smaller volume occupied by the electrode than those using metal foil and can be reduced in size and weight. In the case where a short circuit occurs in an insulation defect part, the deposition electrode around the defect part is evaporated and scattered by the short circuit energy to insulate and insulate it, and the function of the capacitor is restored). Widely used.

  The structure of this conventional metallized film capacitor described in Patent Document 1 will be described with reference to FIG. Here, FIG. 5A is a cross-sectional view of the metallized film capacitor described in Patent Document 1, FIG. 5B is a top view of one metallized film, and FIG. 5C is a top view of the other metallized film. FIG.

  As shown in FIG. 5A, in the metallized film capacitor described in Patent Document 1, a vapor deposition electrode 103 is formed by vapor-depositing metal on one side of a dielectric film 101 except for an insulating margin 102 at one end. Two metallized films 104 are overlapped, wound or stacked so that the insulation margins 102 are opposite to each other. Further, a metallicon electrode 105 is provided on the side opposite to the insulating margin 102 by metal spraying, and the vapor deposition electrode 103 is connected to the metallicon electrode 105.

  Further, the two metallized films 104 constituting the metallized film capacitor described in Patent Document 1 are divided electrode portions 107 configured by a plurality of independent divided electrodes 106 on the insulating margin 102 side of the metallized film 104. And a large electrode portion 109 composed of one large electrode 108 on the side far from the insulation margin 102 (on the metallicon electrode 105 side). In this way, the metallized film capacitor described in Patent Document 1 is composed of two metallized films 104. These two metallized films 104 are shown in FIGS. 5B and 5C. As shown in FIG. 5, the configuration itself is the same except that the connection direction with the metallicon electrode 105 is different.

  Here, as shown in FIGS. 5B and 5C, each of the divided electrodes 106 and the large electrode portion 109 has a margin (hereinafter, referred to as a center margin 110) provided at approximately the center in the width direction of the metallized film 104. And are electrically connected in parallel by a fuse 111 provided in the center margin 110. The fuse 111 is cut by a current flowing into the divided electrode 106 when the insulation defect portion is destroyed, thereby electrically isolating the insulation defect portion to prevent a short circuit or a fire, so-called self-protection function is formed. To do.

  Thus, the metallized film capacitor described in Patent Document 1 has a configuration in which the divided electrode portion 107 is provided at a position close to the insulation margin 102 and is connected to the large electrode portion 109. In general, in a metallized film capacitor, the closer to the metallicon electrode 105, the larger the current flowing through the vapor deposition electrode 103, so the entire half surface on the metallicon electrode 105 side is a large electrode part 109 without a fuse, and the metallized film capacitor In the metallized film capacitor described in Patent Document 1 in which a fuse 111 is provided at a substantially central portion in the width direction of 104, heat generation in the fuse 111 is relatively small, and temperature rise of the metallized film capacitor is suppressed. It was possible.

JP 2004-134561 A

  Certainly, the metallized film capacitor described in Patent Document 1 can suppress the temperature rise by reducing the heat generation in the fuse 111, but the conventional metalized film capacitor including the metalized film capacitor described in Patent Document 1 is known. Had the following problems. This problem will be described with reference to FIG. 6A is a schematic diagram and an equivalent circuit diagram showing the state of the vapor deposition electrode 103 when the fuse 111 of the conventional metallized film capacitor is not cut, and FIG. 6B is the state of the vapor deposition electrode 103 when the fuse 111 is cut. It is the schematic diagram and equivalent circuit diagram which are shown.

  First, when the fuse 111 is not cut during actual use of the metallized film capacitor, the opposing vapor deposition electrode surfaces (W range) of the two metallized films 104 are effective as shown in FIG. It becomes the electrode surface and forms one capacitor (C), and the metallized film capacitor functions. This state is a state in which the metallized film capacitor is operating without any problem without causing an insulation defect portion or the like.

  On the other hand, when the fuses 111 of the vapor deposition electrodes 103 facing each other are cut during actual use of the metallized film capacitor, the divided electrodes 106 having an insulation defect portion are to be electrically completely separated. However, in reality, the vapor deposition electrode surfaces (in the range of W1, W2, and W3) that face each other even after the fuse is cut are effective electrode surfaces, and a capacitor is formed between them, and the divided electrode 106 is completely formed. May not be electrically separated. Specifically, as shown in FIG. 6B, three series-connected capacitors (C1, C2, C3) are formed between the vapor deposition electrode surfaces facing each other. Among the capacitors formed in this way, the capacitor (C2) in the center portion formed by overlapping the divided electrodes 106 in particular has a small facing area between the P-electrode and the N-electrode deposition electrode 103, that is, the capacitance is extremely large. Therefore, since most of the voltage is applied to the capacitor in the central portion, there is a possibility that dielectric breakdown may occur in the central portion in some cases.

  In this example, the capacitor at the center is formed by overlapping the divided electrodes 106, but depending on the design of the vapor deposition electrode 103, the large electrodes 109 may be formed as shown in FIG. It may be formed by overlapping. In this case, one capacitor (C4) having a small facing area (range of W4) between the P-pole and N-pole vapor deposition electrodes 103 is formed, and the facing portion remains, and as a result, the divided electrodes are completely divided. Not be able to.

  As described above, in the structure of the conventional metallized film capacitor, dielectric breakdown occurs due to the capacitor being formed in the current path even after the fuse 111 is cut, thereby reducing the reliability of the metallized film capacitor. There was a case.

  Therefore, an object of the present invention is to improve the reliability of a metallized film capacitor by preventing a capacitor from being formed after cutting a fuse and suppressing the possibility of dielectric breakdown.

In order to solve the above problems, a metallized film capacitor of the present invention includes a first metallized film in which a first metal deposition electrode is formed on one side of a dielectric film, and a second metal deposition on one side of the dielectric film. A metallized film capacitor in which a pair of second metallized films on which electrodes are formed, and the first metallized film and the second metallized film are overlapped and wound or laminated, Both the metal vapor deposition electrode and the second metal vapor deposition electrode are composed of a plurality of divided electrodes at a center margin provided so as to extend in the longitudinal direction of the dielectric film at a substantially central portion in the width direction of the dielectric film. The divided electrode portion is separated into a large electrode portion composed of one electrode, and the center margin of the first metal deposition electrode and the center of the second metal deposition electrode are separated. Over margin and at least partially overlap the center of the width of the center margin of the first metal deposition electrode is larger than the width of the center margin of the second metal deposition electrode, wherein the second metal deposition electrode The margin is characterized in that it overlaps without protruding outward from the center margin range of the first metal deposition electrode .

  With this configuration, a series-connected capacitor is not formed between the vapor deposition electrode surfaces facing each other in the current path from the P pole to the N pole as described above, and the current path in the fuse cut portion is completely Can be cut.

  As a result, the possibility of dielectric breakdown can be suppressed, and the reliability of the metallized film capacitor can be improved.

It is a figure which shows the structure of the metallized film capacitor | condenser of Embodiment 1, (a) is sectional drawing, (b) is a top view of a 1st metallized film, (c) is an upper surface of a 2nd metallized film. Figure The top view which shows the state which overlap | superposed the 1st metallized film and the 2nd metallized film in the metallized film capacitor of Embodiment 1. FIG. The schematic diagram and equivalent circuit figure which show the state of the vapor deposition electrode at the time of the fuse cutting | disconnection of the metallized film capacitor of Embodiment 1 It is a figure which shows the structure of the metallized film capacitor of Embodiment 2, (a) is sectional drawing, (b) is a top view which shows the positional relationship of a 1st vapor deposition electrode and a 2nd vapor deposition electrode. It is a figure which shows the structure of the conventional metallized film capacitor, (a) is sectional drawing, (b) is a top view of one metallized film, (c) is a top view of the other metallized film. It is the schematic diagram and equivalent circuit diagram which show the state of the vapor deposition electrode of the conventional metallized film capacitor, (a) is the schematic diagram and equivalent circuit diagram at the time of fuse uncut, (b) is the schematic diagram and equivalent at the time of fuse cutting Circuit diagram, (c) is a schematic diagram and equivalent circuit diagram at the time of fuse cutting in vapor deposition electrode design of other patterns

(Embodiment 1)
Hereinafter, the configuration of the metallized film capacitor of the present embodiment will be described with reference to FIGS. 1 and 2.

  1A and 1B are diagrams showing a configuration of a metallized film capacitor according to the present embodiment, in which FIG. 1A is a cross-sectional view, FIG. 1B is a top view of a first metallized film 1, and FIG. 3 is a top view of the metallized film 2. FIG. FIG. 2 is a top view showing a state in which the first metallized film 1 and the second metallized film 2 are overlapped in the metallized film capacitor of the present embodiment.

  In FIG. 1, the first metallized film 1 is a metallized film electrically connected to the P pole, and the second metallized film 2 is electrically connected to the N pole. Then, the first metallized film 1 and the second metallized film 2 are overlapped as a pair, and a metallized film capacitor is formed by using a plurality of turns wound as an element. Here, the first metallized film 1 and the second metallized film 2 are shifted by 1 mm in the width direction in order to take out external electrodes.

  As shown in FIG. 1, the first metallized film 1 has a metal vapor-deposited electrode 4 formed on one side of a polypropylene film 3 serving as a dielectric, and is insulated from the second metallized film 2 at the end. Therefore, an insulation margin 5 having a width of 5 mm is provided. In this example, a polypropylene film 3 having a thickness of 3.0 μm was used as the dielectric of each metallized film, but other than this, polyethylene terephthalate, polyethylene naphthalate, polyphenyl sulfide, polystyrene, etc. having an appropriate thickness were used. May be.

  The metallicon electrode 6 is formed by spraying zinc or other metal material or alloy on one end of the polypropylene film 3. The metallicon electrode 6 is electrically connected to the outside by soldering or welding a metal bus bar or lead wire, for example.

  The metal vapor deposition electrode 4 is divided into a plurality of electrode portions by margins provided in the longitudinal direction (winding direction) and the width direction of the first metallized film 1. Specifically, as shown in FIG. 1B, a center margin 7 which is a margin provided so as to extend in a straight line in the longitudinal direction of the polypropylene film 3 at a substantially central portion in the width direction of the polypropylene film 3, and a center margin The width is smaller than 7 and extends in the direction of the insulation margin 5 from the center margin 7, and is divided into a plurality of electrode portions by a width direction margin 8 connecting the center margin 7 and the insulation margin 5.

  No margin in the width direction is provided on the side of the metal margin electrode 6 of the center margin 7, and therefore the large electrode portion 9 composed of one electrode is disposed on the side of the metal margin electrode 6 of the center margin 7.

  On the other hand, on the insulating margin 5 side of the center margin 7, a plurality of width direction margins 8 are provided at regular intervals in the longitudinal direction of the polypropylene film 3, that is, as shown in FIG. The insulating margin 5 side is a divided electrode portion 11 constituted by divided electrodes 10 continuously provided in the longitudinal direction of the polypropylene film 3. As shown in FIG. 1B, the divided electrode 10 has a rectangular shape, and its short side is parallel to the longitudinal direction of the polypropylene film 3. In the present embodiment, the divided electrode 10 is provided in a single stage from the center margin 7 to the insulating margin 5, but the longitudinal direction of the polypropylene film 3 in the divided electrode portion 11 is not limited to this configuration. Further, a grid-like divided electrode portion in which two or more divided electrodes are provided from the center margin 7 toward the insulating margin 5 may be provided by further providing a margin and dividing into smaller divided electrodes.

  The large electrode portion 9 and each divided electrode 10 are connected by a fuse 12 extending from the center of the short side of the divided electrode 10 toward the large electrode portion 9, and the plurality of divided electrodes 10 are large electrodes. The part 9 is electrically connected in parallel. The fuse 12 is cut by a current flowing into the divided electrode 10 when the insulation defect portion is broken, thereby forming a self-security function for electrically isolating the insulation defect portion. The fuses 12 are provided at regular intervals in the longitudinal direction of the polypropylene film 3. As described above, when the divided electrode portion 11 is configured by a smaller divided electrode, the capacity reduction when the fuse 12 is cut can be further reduced.

  The second metallized film 2 has the same configuration as that of the first metallized film 1 except for the center margin 13 and the fuse 14 as shown in FIGS. 1 (a) and 1 (c). In FIG. 1A and FIG. 1C, the same components as those of the first metallized film 1 are denoted by the same reference numerals, and description thereof is omitted. However, the direction in which the second metallized film 2 and the first metallized film 1 are connected to the metallicon electrode 6 is different, and the first metallized film 1 and the second metallized film 2 are respectively connected. Metallicon electrodes 6 are arranged opposite to each other.

  The center margin 13 of the second metallized film 2 is provided so as to extend in a straight line in the longitudinal direction of the polypropylene film 3 at a substantially central portion in the width direction of the polypropylene film 3 in the same manner as the center margin 7 of the first metallized film 1. It has been. Unlike the center margin 7, the width of the center margin 13 is smaller than the center margin 7. The center margin 13 forms a self-security function that electrically isolates an insulation defect portion in the same manner as the center margin 7.

  Also, the fuse 14 of the second metallized film 2 has a smaller width than the fuse 12 of the first metallized film 1. The ratio of the width of the fuse 12 of the first metallized film 1 and the width of the fuse 14 of the second metallized film 2 is such that the width of the center margin 7 of the first metallized film 1 and the second metallized film 1 When the ratio of the width of the fuse 12 of the first metallized film 1 and the width of the fuse 14 of the second metallized film 2 is a: b, The ratio of the width of the center margin 7 of the metallized film 1 to the width of the center margin 13 of the second metallized film 2 is also designed to be a: b. Regarding the width direction margin 8 and the insulation margin 5, both the first metallized film 1 and the second metallized film 2 have the same width. The area of the divided electrode 10 is slightly different because the width of the center margin 7 and the width of the center margin 13 are different, but the divided electrode 10 in the first metallized film 1 and the second metallized film 2 is slightly different. The areas of are almost the same. The interval at which the fuses 14 are provided in the second metallized film 2 is equal to the interval at which the fuses 12 are provided in the first metallized film 1.

  Next, the state in which the first metallized film 1 and the second metallized film 2 are overlapped will be described with reference to FIG. FIG. 2 is a top view showing a state in which the first metallized film 1 and the second metallized film 2 are overlapped, and the second metallized film 2 is a dotted line to distinguish it from the first metallized film 1. It is shown in

  As shown in FIG. 2, when the first metallized film 1 and the second metallized film 2 are overlapped and wound, the center margin 7 of the first metallized film 1 and the second metallized film 2 are The center margin 13 is adjusted so as to overlap each other. Furthermore, as described above, the center margin 7 is wider than the center margin 13, and the center margin 13 does not protrude outward from the range of the center margin 7, but overlaps within the range of the center margin 7. .

  Also, as shown in FIG. 2, the fuse 12 of the first metallized film 1 and the fuse 14 of the second metallized film 2 are displaced from each other as shown in FIG. The film 2 is wound. Here, since the interval between the fuses 12 in the first metallized film 1 and the interval between the fuses 14 in the second metallized film 2 are designed to be equal, the metallized film capacitor to be produced can be at any location. As shown in FIG. 2, the fuse 14 is positioned between the fuses 12, and the fuses 12 and 14 of the first metallized film 1 and the second metallized film 2 facing each other do not overlap each other.

  Next, the effect of the metallized film capacitor of this embodiment will be described with reference to FIG. FIG. 3 is a schematic diagram and an equivalent circuit diagram showing the state of the metal deposition electrode 4 when the fuse 12 and the fuse 14 that are relatively close to each other are cut in the metalized film capacitor of the present embodiment.

  As described above, the metallized film capacitor of the present embodiment has a configuration in which the center margin 7 of the first metallized film 1 and the center margin 13 of the second metallized film 2 are overlapped.

  For this reason, as shown in FIG. 3, the divided electrodes 10 or the large electrode portions 9 of the first metallized film 1 and the second metallized film 2 do not overlap each other, and the two sets of vapor deposition electrode surfaces facing each other. (Range of W5, W6) Since the electrical connection is completely cut off, the capacitor is not formed in the current path from the P pole to the N pole as in the conventional metalized film capacitor. The current path from the pole to the N pole can be completely cut off. Therefore, the location where most of the voltage is applied to a part of the metallized film does not occur unlike the conventional metallized film capacitor. As a result, the metallized film capacitor according to the present embodiment has a lower possibility of dielectric breakdown than the conventional metallized film capacitor, and is highly reliable.

  As described above, the metallized film capacitor of the present embodiment has a configuration in which the center margin 7 of the first metallized film 1 and the center margin 13 of the second metallized film 2 are overlapped. When the winding operation is performed without paying particular attention when producing the metallized film capacitor of the form, the fuse 12 and the second metallized film of the first metallized film 1 have the above-described unique configuration. The possibility that the two fuses 14 overlap each other is inevitably higher than that of other metallized film capacitors. On the other hand, it is generally known that the fuse portion of the metallized film capacitor is one of the locations where the heat generation amount is the largest in the metallized film capacitor because the current flows in a state where the current density is high. Therefore, when the fuse 12 of the first metallized film 1 and the fuse 14 of the second metallized film 2 overlap each other, there is a possibility that this part will locally become a part having a large heat generation amount. As a result, the characteristics of the metallized film capacitor may be deteriorated.

  Therefore, the metallized film capacitor of the present embodiment is configured such that the fuse 12 of the first metallized film 1 is always positioned between the fuses 14 of the second metallized film 2. For this reason, in the 1st metallized film 1 and the 2nd metallized film 2 which oppose, the position of the fuse 12 and the fuse 14 does not overlap, and generation | occurrence | production of the location where the emitted-heat amount is large locally is suppressed. The metallized film capacitor of the present embodiment has a suppressed possibility of characteristic deterioration.

  Further, the width of the center margin 7 of the first metallized film 1 is larger than the width of the center margin 13 of the second metallized film 2, and the center margin 13 does not protrude from the range of the center margin 7. The center margin 7 is configured to overlap.

  According to such a configuration, it is possible to suppress the variation in capacitance of the metallized film capacitor as a finished product.

  In the metallized film capacitor according to the present embodiment, as described above, when cutting the fuse 12 and the fuse 14, the capacitor is not formed in the current path from the P pole to the N pole, and at least the center is cut. The margin 7 and the center margin 13 may be partially overlapped with each other. However, the manufacturing apparatus uses the first metallized film 1 and the center margin 7 and the center margin 13 while maintaining the overlap width of a predetermined dimension. It is difficult and practically impossible to keep winding the second metallized film 2. As a result, the overlapping width of the center margin 7 and the center margin 13 is shifted, and the area where the metal vapor deposition electrodes 4 face each other varies, resulting in a variation in capacity between finished metalized film capacitors.

  However, if the center margin 13 and the center margin 7 are overlapped without the center margin 13 protruding from the range of the center margin 7 as in the present embodiment, the positional relationship in which the center margin 7 and the center margin 13 are overlapped to some extent. Even if they deviate, there is almost no variation in the opposing areas. Therefore, in the metallized film capacitor of the present embodiment, the possibility of characteristic deterioration can be suppressed as described above, and the capacity variation between the finished products during mass production can be suppressed.

  Further, in the metallized film capacitor of the present embodiment, the width ratio between the fuse 12 and the fuse 14 is designed to be equal to the width ratio between the center margin 7 and the center margin 13.

  If the width ratio of the fuse 12 and the fuse 14 is designed to be extremely different from the width ratio of the center margin 7 and the center margin 13, the fuse 12 and the fuse 14 are blown from the viewpoint of the current density flowing through each fuse. The characteristics are greatly different, and the operability may vary.

  Therefore, the metallized film capacitor according to the present embodiment is designed as described above to suppress variations in the operability between the fuse 12 and the fuse 14.

  In particular, in the metallized film capacitor of the present embodiment in which the width of the center margin 7 of the first metallized film 1 is different from the width of the center margin 13 of the second metallized film 2, the fuse 12 and the fuse It is important that the width of 14 is designed as described above.

(Embodiment 2)
Hereinafter, the structure of the metallized film capacitor of Embodiment 2 will be described with reference to FIG. FIG. 4A is a cross-sectional view of the metalized film capacitor of the present embodiment, and FIG. 4B is a top view showing the positional relationship between the first vapor deposition electrode 21 and the second vapor deposition electrode 22. In FIG. 4B, the position of the second vapor deposition electrode 22 is indicated by a dotted line.

  In the metallized film capacitor of the present embodiment, the configuration of the vapor deposition electrode is different from that of the metallized film capacitor of the first embodiment, and other configurations and materials are the same as those of the metallized film capacitor of the first embodiment. It has become the same thing. Accordingly, the same constituent elements as those of the metalized film capacitor of Embodiment 1 are denoted by the same reference numerals, and the description thereof is omitted.

  In the metallized film capacitor of this embodiment, double-sided metallization in which a first vapor deposition electrode 21 and a second vapor deposition electrode 22 are formed on both surfaces of a polypropylene film 3 serving as a dielectric as shown in FIG. It is configured by winding the film 23 together with the dielectric layer 24. This dielectric layer 24 is for ensuring insulation between the first vapor deposition electrode 21 and the second vapor deposition electrode 22 when the double-sided metallized film 23 is wound. In this embodiment, the dielectric layer 24 is used. As in the above dielectric, a polypropylene film is used.

  Alternatively, as the dielectric layer 24, a dielectric paint in which polycarbonate, polyphenylene oxide, or polyarylate is dissolved in an organic solvent may be used. In this case, the dielectric layer 24 is formed by applying a dielectric coating on one side or both sides of the double-sided metallized film 23 on which the first vapor deposition electrode 21 and the second vapor deposition electrode 22 are formed.

  As shown in FIG. 4B, the first vapor deposition electrode 21 and the second vapor deposition electrode 22 of the metallized film capacitor of the present embodiment are the first metal of the metallized film capacitor shown in the first embodiment. The same electrode pattern as that of the metallized film 1 and the second metallized film 2 is formed.

  That is, both the first vapor deposition electrode 21 and the second vapor deposition electrode 22 are separated into the large electrode portion 9 and the divided electrode portion 11 by the center margin 25 and the center margin 26 provided in the center. The center margin 26 has an overlapping configuration. Further, the center margin 25 is wider than the center margin 26, and the center margin 26 overlaps without protruding outward from the range of the center margin 25.

  As described above, the metallized film capacitor according to the present embodiment is obtained by applying the configuration of the metallized film capacitor according to the first embodiment to the double-sided metallized film 23. The metallized film capacitor according to the present embodiment. The center margin 25 and the center margin 26 can be arranged in the above-described positional relationship with higher accuracy.

  This is because the double-sided metallized film 23 is formed by vapor-depositing aluminum, which is a vapor-deposited metal, on both sides of the polypropylene film 3.

  In the metallized film capacitor of the first embodiment, the center margin 7 of the first metallized film 1 and the center margin 13 of the second metallized film 2 are both about 0.2 mm wide, and they are overlapped. For this purpose, it is necessary to arrange the first metallized film 1 and the second metallized film 2 accurately in the production process and to wind them without shifting.

  On the other hand, the metallized film capacitor of the present embodiment forms the center margin 25 and the center margin 26 by applying margin oil to both surfaces of the polypropylene film 3, and the center margin 25 and the center margin 26 are connected to each other. It is very easy to adjust the positional relationship.

  Therefore, the metallized film capacitor of the present embodiment has the center margin 26 disposed inside the center margin 25 with very high accuracy, and can fully exhibit the effects of the present invention.

  As described above, the metallized film capacitor of the present invention has low possibility of dielectric breakdown and is highly reliable.

  In both of the first embodiment and the second embodiment, the wound metallized film capacitor is exemplified. However, the present invention is not limited to this, and the present invention can be applied to a laminated metallized film capacitor.

  Further, the present invention is not limited to the configuration of the metalized film capacitor of the first embodiment and the second embodiment, and can be implemented with various modifications within the scope of the invention.

  The metallized film capacitor according to the present invention has a structure in which the occurrence of dielectric breakdown is suppressed and has high reliability. Therefore, it can be used for electronic and electrical devices in a wide range of fields such as for automobile electrical equipment.

DESCRIPTION OF SYMBOLS 1 1st metallized film 2 2nd metallized film 3 Polypropylene film 4 Metal vapor deposition electrode 5 Insulation margin 6 Metallicon electrode 7 Center margin 8 Width direction margin 9 Large electrode part 10 Divided electrode 11 Divided electrode part 12 Fuse 13 Center margin 14 fuse 21 first vapor deposition electrode 22 second vapor deposition electrode 23 double-sided metallized film 24 dielectric layer 25 center margin 26 center margin

Claims (2)

A pair of a first metallized film having a first metal vapor-deposited electrode formed on one side of the dielectric film and a second metallized film having a second metal vapor-deposited electrode formed on one side of the dielectric film,
A metallized film capacitor in which the first metallized film and the second metallized film are overlapped and wound or laminated,
Both the first metal vapor deposition electrode and the second metal vapor deposition electrode are divided into a plurality of divisions at a center margin provided so as to extend in the longitudinal direction of the dielectric film at a substantially central portion in the width direction of the dielectric film. It is separated into a divided electrode part composed of electrodes and a large electrode part composed of one electrode,
The center margin of the first metal deposition electrode and the center margin of the second metal deposition electrode are at least partially overlapped ,
The width of the center margin of the first metal deposition electrode is larger than the width of the center margin of the second metal deposition electrode,
The metallized film capacitor according to claim 1, wherein a center margin of the second metal deposition electrode overlaps without protruding outward from a range of the center margin of the first metal deposition electrode . A metallized film capacitor obtained by winding or laminating a double-sided metallized film formed with a first metal vapor deposition electrode and a second metal vapor deposition electrode on both sides of a dielectric film together with a dielectric layer;
Both the first metal vapor deposition electrode and the second metal vapor deposition electrode have a plurality of center margins provided so as to extend in the longitudinal direction of the double-sided metallized film at a substantially central portion in the width direction of the double-sided metallized film. It is separated into a divided electrode part composed of divided electrodes and a large electrode part composed of one electrode,
The center margin of the first metal deposition electrode and the center margin of the second metal deposition electrode are at least partially overlapped ,
The width of the center margin of the first metal deposition electrode is larger than the width of the center margin of the second metal deposition electrode,
The metallized film capacitor according to claim 1, wherein a center margin of the second metal deposition electrode overlaps without protruding outward from a range of the center margin of the first metal deposition electrode .

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