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JP6029821B2 - Light emitting device package and manufacturing method thereof - Google Patents

Light emitting device package and manufacturing method thereof Download PDF

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JP6029821B2
JP6029821B2 JP2011256926A JP2011256926A JP6029821B2 JP 6029821 B2 JP6029821 B2 JP 6029821B2 JP 2011256926 A JP2011256926 A JP 2011256926A JP 2011256926 A JP2011256926 A JP 2011256926A JP 6029821 B2 JP6029821 B2 JP 6029821B2
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light emitting
emitting element
electrode portion
wiring
mounting member
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JP2013115070A (en
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謙磁 塚田
謙磁 塚田
政利 藤田
政利 藤田
雅登 鈴木
雅登 鈴木
明宏 川尻
明宏 川尻
和裕 杉山
和裕 杉山
良崇 橋本
良崇 橋本
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Priority to CN201280057767.7A priority patent/CN103959450B/en
Priority to PCT/JP2012/077870 priority patent/WO2013077144A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24101—Connecting bonding areas at the same height
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7615—Means for depositing
    • H01L2224/76151—Means for direct writing
    • H01L2224/76155—Jetting means, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/821—Forming a build-up interconnect
    • H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
    • H01L2224/82102—Forming a build-up interconnect by additive methods, e.g. direct writing using jetting, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Description

本発明は、搭載部材に形成した素子搭載凹部内に発光素子を搭載した発光素子パッケージ及びその製造方法に関する発明である。 The present invention relates to a light emitting device package in which a light emitting device is mounted in a device mounting recess formed in a mounting member, and a method for manufacturing the same.

従来より、半導体素子の実装工程では、半導体素子を搭載部材（回路基板、リードフレーム等）にダイボンドした後に、該半導体素子側の電極部と搭載部材側の電極部との間をワイヤボンディングで配線するのが一般的である。   Conventionally, in the mounting process of a semiconductor element, after the semiconductor element is die-bonded to a mounting member (circuit board, lead frame, etc.), wiring is performed between the electrode part on the semiconductor element side and the electrode part on the mounting member side by wire bonding. It is common to do.

しかし、特許文献１（特許第３９９２０３８号公報）に記載されているように、ワイヤボンディングを行うときの機械的なストレスによって不良が発生する可能性があるため、ワイヤボンディングに代わる接続信頼性の高い実装構造を低コストで実現することを目的として、配線基板上に搭載した半導体素子の周囲に流動性の樹脂材料をディスペンサで吐出して、半導体素子の上面と配線基板の表面との間を傾斜面でつなぐ樹脂スロープを形成した後、半導体素子上面の電極部と配線基板の電極部との間を接続する配線パターンを、インクジェット等の液滴吐出法により樹脂スロープ上に形成する配線技術が提案されている。   However, as described in Patent Document 1 (Japanese Patent No. 3992038), there is a possibility that defects may occur due to mechanical stress when wire bonding is performed. Therefore, connection reliability that replaces wire bonding is high. In order to realize the mounting structure at a low cost, a fluid resin material is discharged around the semiconductor element mounted on the wiring board with a dispenser, and the upper surface of the semiconductor element and the surface of the wiring board are inclined. Proposed wiring technology to form a wiring pattern that connects the electrode part on the upper surface of the semiconductor element and the electrode part of the wiring board on the resin slope by the droplet discharge method such as inkjet after forming the resin slope connecting the surfaces Has been.

上記特許文献１の実装構造では、半導体素子上面の電極部と配線基板の電極部との間の配線経路に半導体素子の高さ相当分の段差ができるため、配線パターンを液滴吐出法で形成するには、半導体素子の側面上端から配線基板上面に跨がる樹脂スロープを形成して、半導体素子上面の電極部と配線基板の電極部との間を、段差のない傾斜面で結ぶ必要がある。   In the mounting structure disclosed in Patent Document 1, since a step corresponding to the height of the semiconductor element is formed in the wiring path between the electrode part on the upper surface of the semiconductor element and the electrode part of the wiring substrate, the wiring pattern is formed by a droplet discharge method. In order to achieve this, it is necessary to form a resin slope that extends from the upper end of the side surface of the semiconductor element to the upper surface of the wiring board, and connect the electrode part on the upper surface of the semiconductor element and the electrode part of the wiring board with an inclined surface having no step. is there.

そこで、搭載部材に形成した素子搭載凹部内に半導体素子を搭載することで、半導体素子上面の電極部と該搭載部材の素子搭載凹部の外側に設けた電極部とを同一高さとしたものがある。このような構造に対しては、特許文献２（特開２００５−５０９１１号公報）に記載されているように、搭載部材の素子搭載凹部の内周側面と半導体素子の外周側面との間の隙間（溝）に絶縁体を埋め込むことで、半導体素子上面の電極部と搭載部材の電極部との間の配線経路を平坦化して、該配線経路にインクジェット等の液滴吐出法で導電性のインクを吐出して配線を形成することが提案されている。   Therefore, there is one in which the semiconductor element is mounted in the element mounting recess formed in the mounting member, so that the electrode portion on the upper surface of the semiconductor element and the electrode portion provided outside the element mounting recess of the mounting member have the same height. . For such a structure, as described in Patent Document 2 (Japanese Patent Laid-Open No. 2005-50911), a gap between the inner peripheral side surface of the element mounting recess of the mounting member and the outer peripheral side surface of the semiconductor element. By embedding an insulator in the (groove), the wiring path between the electrode part on the upper surface of the semiconductor element and the electrode part of the mounting member is flattened, and conductive ink is applied to the wiring path by a droplet discharge method such as inkjet. It has been proposed to form a wiring by discharging the liquid.

特許第３９９２０３８号公報Japanese Patent No. 3992038 特開２００５−５０９１１号公報JP 2005-50911 A

上記特許文献２のように、インクジェット等の液滴吐出法で導電性のインクを吐出して配線を形成する場合、配線を形成する下地表面（樹脂表面）のインク滴の濡れ性が高いため、インク滴の着滴径が大きくなって配線の線幅が広がってしまい、細線化の要求を十分に満たすことができない。また、この配線形成方法を例えばＬＥＤ等の発光素子パッケージに適用すると、発光素子の側面から透明な充填樹脂（配線の下地材）を通して放出される光が配線で遮られる割合が増加して、外部に放出される光の取り出し効率が低下するという欠点がある。   When the wiring is formed by discharging conductive ink by a droplet discharge method such as inkjet, as in Patent Document 2, the wettability of the ink droplets on the base surface (resin surface) on which the wiring is formed is high. The droplet diameter of the ink droplet is increased and the line width of the wiring is increased, so that the demand for thinning cannot be sufficiently satisfied. Further, when this wiring forming method is applied to a light emitting element package such as an LED, for example, the rate at which the light emitted from the side surface of the light emitting element through the transparent filling resin (wiring base material) is blocked by the wiring increases. There is a disadvantage that the extraction efficiency of the light emitted to the light source decreases.

また、半導体素子上面の電極部と搭載部材の電極部との間をつなぐ配線経路には、素子（チップ）、樹脂、搭載部材（リードフレーム等）が存在するため、濡れ性が異なる複数の下地表面に跨がって導電性のインクを吐出して配線を形成する必要がある。このため、下地表面の濡れ性が変わる毎に、配線の線幅や厚みが不均一になり、配線が通電オン／オフの繰り返しにより発生する熱応力等により断線する可能性があった。しかも、配線とその下地表面との密着性が低いため、配線が下地表面から剥がれることがあり、これも断線を生じさせる原因となっていた。   In addition, since there are elements (chips), resin, and mounting members (such as lead frames) in the wiring path that connects the electrode portions on the upper surface of the semiconductor element and the electrode portions of the mounting member, a plurality of substrates having different wettability It is necessary to form wiring by discharging conductive ink across the surface. For this reason, every time the wettability of the base surface changes, the line width and thickness of the wiring become non-uniform, and there is a possibility that the wiring is disconnected due to thermal stress generated by repeated energization on / off. In addition, since the adhesion between the wiring and the underlying surface is low, the wiring may be peeled off from the underlying surface, which also causes disconnection.

そこで、本発明が解決しようとする課題は、発光素子側の電極部と該搭載部材側の電極部との間を接続する配線を液滴吐出法又は印刷法で形成した発光素子パッケージの配線の細線化及び接続信頼性向上並びに発光素子の光の取り出し効率向上を実現できる発光素子パッケージ及びその製造方法を提供することである。 Accordingly, the problem to be solved by the present invention is that the wiring of the light emitting element package in which the wiring connecting the electrode part on the light emitting element side and the electrode part on the mounting member side is formed by a droplet discharge method or a printing method is used. It is an object to provide a light emitting device package and a method for manufacturing the same that can realize thinning, improved connection reliability, and improved light extraction efficiency .

上記課題を解決するために、請求項１に係る発明は、搭載部材に形成された素子搭載凹部内に発光素子が搭載され、該発光素子上面の電極部と該搭載部材上面の電極部との間が配線で接続された発光素子パッケージにおいて、前記搭載部材は、前記素子搭載凹部内に搭載された前記発光素子上面の電極部が該搭載部材上面の電極部と同じ高さとなるように形成され、前記発光素子上面の電極部と前記搭載部材上面の電極部との間の配線経路は、前記素子搭載凹部内の前記発光素子の周囲の隙間に充填された透明な絶縁性樹脂により平坦化され、該配線経路上に前記発光素子上面の電極部のうちの前記搭載部材上面の電極部に近い側の一部と前記搭載部材上面の電極部のうちの前記発光素子上面の電極部に近い側の一部とに跨がってそれぞれの電極部の全部が覆われないように撥液性のプライマ樹脂インクで撥液性のプライマ樹脂層が直線状又は直線帯状に形成され、前記プライマ樹脂層上に前記発光素子上面の電極部のうちの該プライマ樹脂層で覆われていない部分と前記搭載部材上面の電極部のうちの該プライマ樹脂層で覆われていない部分とに跨がって導電性のインクで前記配線が直線状又は直線帯状に形成されていることを特徴とするものである。 In order to solve the above-mentioned problem, the invention according to claim 1 is characterized in that a light emitting element is mounted in an element mounting recess formed in a mounting member, and an electrode portion on the upper surface of the light emitting element and an electrode portion on the upper surface of the mounting member in the light emitting device package between are connected by wire, the mounting member, the electrode portion of the light emitting element upper surface mounted on the element mounting in the recess is formed so as to have the same height as the electrode portion of the mounting member top surface The wiring path between the electrode part on the upper surface of the light emitting element and the electrode part on the upper surface of the mounting member is flattened by a transparent insulating resin filled in a gap around the light emitting element in the element mounting recess. A part of the electrode part on the upper surface of the light emitting element on the wiring path that is close to the electrode part on the upper surface of the mounting member, and a part of the electrode part on the upper surface of the mounting member that is close to the electrode part on the upper surface of the light emitting element. part and in each of the straddling of Is formed on the liquid repellent primer resin layer is a straight-linear or linear strip with liquid repellency of the primer resin ink not covered all of the pole portion, the electrode portion of the light emitting element top surface to said primer resin layer The wiring is linear or conductive with conductive ink straddling the portion not covered with the primer resin layer and the portion of the electrode portion on the top surface of the mounting member not covered with the primer resin layer. It is characterized by being formed in a straight strip shape.

この構成では、発光素子上面の電極部と搭載部材上面の電極部との間の配線経路を絶縁性樹脂で平坦化し、該配線経路上に撥液性のプライマ樹脂層を直線状又は直線帯状に形成し、該プライマ樹脂層上に発光素子上面の電極部のうちの該プライマ樹脂層で覆われていない部分と前記搭載部材上面の電極部のうちの該プライマ樹脂層で覆われていない部分とに跨がって導電性のインクで配線を形成するため、配線を形成するインク滴の着滴径が大きくなることを、その下地となる撥液性のプライマ樹脂層によって防止できて、配線の線幅が広がることを防止でき、配線の細線化を実現できる。従って、発光素子の側面から放出される光が配線で遮られる割合を配線の細線化により低減できて、外部に放出される光の取り出し効率を高めることができる。また、配線の下地となる撥液性のプライマ樹脂層を発光素子上面の電極部の搭載部材上面の電極部に近い側の一部と搭載部材上面の電極部のうちの発光素子上面の電極部に近い側の一部とに跨がって形成するようにしているため、発光素子上面の電極部と搭載部材上面の電極部との間の配線経路に、発光素子（チップ）、絶縁性樹脂、搭載部材等、濡れ性が異なる複数の部材が存在していても、これらをプライマ樹脂層で覆って配線全体の下地表面の濡れ性を均一化でき、液滴吐出法で形成する配線の線幅や厚みが不均一になることを防止できて、配線の線幅や厚みの均一化できる。しかも、配線とその下地表面（プライマ樹脂層）との密着性を向上できて、配線が下地表面から剥がれることを防止でき、上述した配線の線幅や厚みの均一化と相俟って配線の断線を効果的に防止でき、発光素子パッケージの配線を細線化しながら接続信頼性も向上できる。 In this configuration, flattened, liquid repellency of primer resin layer of a straight-linear or linear on the wiring path in the insulating resin wiring path between the electrode portion of the mounting member top surface and the electrode portion of the light emitting element top surface It is formed in a strip shape, and is not covered with the primer resin layer on the primer resin layer, on the portion of the electrode portion on the upper surface of the light emitting element that is not covered with the primer resin layer and on the electrode portion on the upper surface of the mounting member Since the wiring is formed with the conductive ink across the portion, it is possible to prevent the droplet diameter of the ink droplets forming the wiring from being increased by the liquid repellent primer resin layer as the base, An increase in the line width of the wiring can be prevented, and the wiring can be made thinner. Therefore, the rate at which the light emitted from the side surface of the light emitting element is blocked by the wiring can be reduced by thinning the wiring, and the extraction efficiency of the light emitted to the outside can be increased. The electrode portion of the light emitting element upper surface of the electrode portion of the part and the mounting member top surface near the liquid repellency of the primer resin layer underlying the wiring to the electrode portion of the mounting member upper surface of the electrode portion of the light emitting element top side In the wiring path between the electrode part on the upper surface of the light emitting element and the electrode part on the upper surface of the mounting member, the light emitting element (chip) and the insulating resin are formed. Even if there are multiple members with different wettability, such as mounting members, these can be covered with a primer resin layer to uniformize the wettability of the underlying surface of the entire wiring, and the wiring lines formed by the droplet discharge method The width and thickness can be prevented from becoming uneven, and the line width and thickness of the wiring can be made uniform. In addition, the adhesion between the wiring and the underlying surface (primer resin layer) can be improved, and the wiring can be prevented from peeling off from the underlying surface, coupled with the uniformization of the wiring width and thickness described above. The disconnection can be effectively prevented, and the connection reliability can be improved while thinning the wiring of the light emitting element package.

更に、本発明では、プライマ樹脂層を直線状又は直線帯状に形成しているが、配線の下地となるプライマ樹脂層は、光の透過を減少させるため、直線状又は直線帯状に形成することで、発光素子の側面から透明な絶縁性樹脂を通して放出される光がプライマ樹脂層で減少される割合を少なくできて、外部に放出される光の取り出し効率を高めることができる。 Further, in the present invention, the primer resin layer is formed in a straight-linear or linear strip, primer resin layer underlying the wiring to reduce the transmission of light is formed in a straight-linear or linear strip Accordingly, the rate at which light emitted from the side surface of the light emitting element through the transparent insulating resin is reduced by the primer resin layer can be reduced, and the extraction efficiency of the light emitted to the outside can be increased.

具体的には、請求項２のように、プライマ樹脂層の線幅を配線の線幅よりも太くして、該配線が該プライマ樹脂層からはみ出さないように形成すれば良い。このようにすれば、配線の下面全体をプライマ樹脂層に密着させることができ、配線とプライマ樹脂層との密着性を確実に高めることができる。 Specifically, as claimed in claim 2, the line width of the primer resin layer is thicker than the line width of the wiring, the wiring may be shaped formed so as not to protrude from the primer resin layer. If it does in this way, the whole lower surface of wiring can be stuck to a primer resin layer, and the adhesiveness of wiring and a primer resin layer can be improved certainly.

尚、請求項３に係る発明は、請求項１に係る「発光素子パッケージ」の発明と実質的に同一の技術思想を、カテゴリーの異なる「発光素子パッケージの製造方法」の発明として記載したものである。 The invention according to claim 3 describes the technical idea substantially the same as the invention of “ light emitting device package” according to claim 1 as an invention of “method of manufacturing light emitting device package” of different categories. is there.

図１は本発明の一実施例のＬＥＤパッケージの構造を図３のＡ−Ａ線に沿って示す断面図である。FIG. 1 is a cross-sectional view showing the structure of an LED package according to an embodiment of the present invention along the line AA in FIG. 図２は図３のＢ−Ｂ線に沿って示す断面図である。2 is a cross-sectional view taken along line BB in FIG. 図３はＬＥＤパッケージの平面図である。FIG. 3 is a plan view of the LED package.

以下、本発明を実施するための形態をＬＥＤパッケージに適用して具体化した一実施例を説明する。
搭載部材１１は、リードフレーム、回路基板等により形成され、その所定位置に素子搭載凹部１２が形成されている。この搭載部材１１の素子搭載凹部１２の底面中央部には、発光素子であるＬＥＤ素子１３がダイボンディング（接合）されている。素子搭載凹部１２の深さ寸法（高さ寸法）は、ＬＥＤ素子１３の高さ寸法とほぼ同一に設定され、素子搭載凹部１２内に搭載したＬＥＤ素子１３上面の電極部１４が搭載部材１１上面の電極部１５とほぼ同じ高さとなっている。 Hereinafter, an embodiment in which a mode for carrying out the present invention is applied to an LED package will be described.
The mounting member 11 is formed of a lead frame, a circuit board, or the like, and an element mounting recess 12 is formed at a predetermined position thereof. The LED element 13 which is a light emitting element is die-bonded (joined) to the center of the bottom surface of the element mounting recess 12 of the mounting member 11. The depth dimension (height dimension) of the element mounting recess 12 is set to be substantially the same as the height dimension of the LED element 13, and the electrode portion 14 on the upper surface of the LED element 13 mounted in the element mounting recess 12 is the upper surface of the mounting member 11. The height of the electrode part 15 is almost the same.

搭載部材１１の素子搭載凹部１２内のうちのＬＥＤ素子１３の周囲に、透明な絶縁性樹脂１６がインクジェット、ディスペンサ等の液滴吐出法により充填されている。図１及び図３に示すように、ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間をつなぐ配線経路は、絶縁性樹脂１６で平坦化され、該絶縁性樹脂１６の上面に、後述する配線１７の下地となる撥液性のプライマ樹脂層２０がＬＥＤ素子１３上面の電極部１４のうちの搭載部材１１上面の電極部１５に近い側の一部と搭載部材１１上面の電極部１５のうちのＬＥＤ素子１３上面の電極部１４に近い側の一部とに跨がって直線状又は直線帯状に形成されている。具体的には、インクジェット、ディスペンサ等の液滴吐出法により撥液性のプライマ樹脂インクを絶縁性樹脂１６上に吐出してプライマ樹脂層２０のパターンを直線状又は直線帯状に描画する。
A transparent insulating resin 16 is filled around the LED element 13 in the element mounting recess 12 of the mounting member 11 by a droplet discharge method such as inkjet or dispenser. As shown in FIGS. 1 and 3, the wiring path connecting the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11 is flattened with an insulating resin 16, and the insulating resin 16 A portion of the electrode member 14 on the upper surface of the LED element 13 on the side closer to the electrode portion 15 and the mounting member 11 on the upper surface of the LED element 13 are a liquid-repellent primer resin layer 20 serving as a base of the wiring 17 described later. It is formed into a straight line shape or linear strip straddling a portion of the side closer to the LED element 13 the upper surface of the electrode portion 14 of the upper surface of the electrode portion 15. Specifically, jet, the liquid repellency of the primer resin ink is ejected on the insulating resin 16 to draw a pattern of the primer resin layer 20 in a straight linear or straight strip by a droplet discharge method such as a dispenser.

そして、液滴吐出法で描画したプライマ樹脂層２０を乾燥・硬化させた後に、インクジェット、ディスペンサ等の液滴吐出法により導電性のインク（Ａｇ等の導体粒子を含むインク）をプライマ樹脂層２０上に吐出して、該プライマ樹脂層２０上に、配線１７のパターンをＬＥＤ素子１３上面の電極部１４のうちの該プライマ樹脂層２０で覆われていない部分と搭載部材１１上面の電極部１５のうちの該プライマ樹脂層２０で覆われていない部分とに跨がって描画し、これを乾燥・焼成して、ＬＥＤ素子１３上面の電極部１４と搭載部材１１上面の電極部１５との間を該配線１７で接続する。 After the primer resin layer 20 drawn by the droplet discharge method is dried and cured, conductive ink (ink containing conductive particles such as Ag) is applied to the primer resin layer 20 by a droplet discharge method such as inkjet or dispenser. The portion of the electrode portion 14 on the upper surface of the LED element 13 that is not covered with the primer resin layer 20 and the electrode portion 15 on the upper surface of the mounting member 11 are discharged onto the primer resin layer 20. Between the electrode portion 14 on the upper surface of the LED element 13 and the electrode portion 15 on the upper surface of the mounting member 11. They are connected by the wiring 17.

この場合、プライマ樹脂層２０は、配線１７が該プライマ樹脂層２０からはみ出さないように該配線１７の線幅よりも製造ばらつき相当値以上太い線幅に形成されている。具体的には、プライマ樹脂層２０の線幅は、例えば、配線１７の線幅の１．２〜２．５倍、より好ましくは、１．５〜２．０倍の範囲で設定すると良い。尚、搭載部材１１の素子搭載凹部１２内に搭載したＬＥＤ素子１３及び配線１７等は、透明な封止材料１８によって封止されている。   In this case, the primer resin layer 20 is formed to have a line width that is larger than the line width of the wiring 17 by a value corresponding to a manufacturing variation or more so that the wiring 17 does not protrude from the primer resin layer 20. Specifically, the line width of the primer resin layer 20 may be set in the range of, for example, 1.2 to 2.5 times the line width of the wiring 17, more preferably 1.5 to 2.0 times. The LED element 13 and the wiring 17 mounted in the element mounting recess 12 of the mounting member 11 are sealed with a transparent sealing material 18.

以上説明した本実施例によれば、ＬＥＤ素子１３の電極部１４と搭載部材１１の電極部１５との間の配線経路を絶縁性樹脂１６で平坦化し、該配線経路上に撥液性のプライマ樹脂層２０を形成し、該プライマ樹脂層２０上に液滴吐出法で配線１７を形成するため、配線１７を形成するインク滴の着滴径が大きくなることを、その下地となる撥液性のプライマ樹脂層２０によって防止できて、配線１７の線幅が広がることを防止でき、配線１７の細線化を実現できる。従って、本発明をＬＥＤパッケージに適用する場合でも、ＬＥＤ素子１３の側面から放出される光が配線１７で遮られる割合を配線１７の細線化により低減できて、外部に放出される光の取り出し効率を高めることができる。   According to the present embodiment described above, the wiring path between the electrode part 14 of the LED element 13 and the electrode part 15 of the mounting member 11 is flattened by the insulating resin 16 and a liquid repellent primer is formed on the wiring path. Since the resin layer 20 is formed and the wiring 17 is formed on the primer resin layer 20 by the droplet discharge method, the ink droplets forming the wiring 17 have a large droplet landing diameter, and the liquid repellency that forms the foundation thereof This primer resin layer 20 can prevent the wiring 17 from being widened, and the wiring 17 can be thinned. Therefore, even when the present invention is applied to the LED package, the ratio of the light emitted from the side surface of the LED element 13 blocked by the wiring 17 can be reduced by thinning the wiring 17, and the extraction efficiency of the light emitted to the outside can be reduced. Can be increased.

また、配線１７の下地となる撥液性のプライマ樹脂層２０をＬＥＤ素子１３の電極部１４の一部と搭載部材１１の電極部１５の一部とに跨がって形成するようにしているため、ＬＥＤ素子１３の電極部１４と搭載部材１１の電極部１５との間の配線経路に、ＬＥＤ素子１３のチップ、絶縁性樹脂１６、搭載部材１１等、濡れ性が異なる複数の部材が存在していても、これらをプライマ樹脂層２０で覆って配線１７全体の下地表面の濡れ性を均一化でき、液滴吐出法で形成する配線１７の線幅や厚みが不均一になることを防止できて、配線１７の線幅や厚みの均一化できる。しかも、配線１７とその下地表面（プライマ樹脂層２０）との密着性を向上できて、配線１７が下地表面から剥がれることを防止でき、上述した配線１７の線幅や厚みの均一化と相俟って配線１７の断線を効果的に防止でき、ＬＥＤパッケージの配線１７を細線化しながら接続信頼性も向上できる。 In addition, a liquid-repellent primer resin layer 20 as a base of the wiring 17 is formed across a part of the electrode part 14 of the LED element 13 and a part of the electrode part 15 of the mounting member 11. Therefore, a plurality of members having different wettability, such as the chip of the LED element 13, the insulating resin 16, and the mounting member 11, exist in the wiring path between the electrode portion 14 of the LED element 13 and the electrode portion 15 of the mounting member 11. Even so, the primer resin layer 20 is covered so that the wettability of the ground surface of the entire wiring 17 can be made uniform, and the line width and thickness of the wiring 17 formed by the droplet discharge method can be prevented from becoming non-uniform. Thus, the line width and thickness of the wiring 17 can be made uniform. In addition, the adhesion between the wiring 17 and the underlying surface (primer resin layer 20) can be improved, and the wiring 17 can be prevented from being peeled off from the underlying surface. Accordingly, the disconnection of the wiring 17 can be effectively prevented, and the connection reliability can be improved while the wiring 17 of the LED package is thinned.

しかも、本実施例では、液滴吐出法でプライマ樹脂インクを絶縁性樹脂１６上に吐出してプライマ樹脂層２０を線状又は帯状に形成するようにしているため、ＬＥＤ素子１３の側面から透明な絶縁性樹脂１６を通して放出される光がプライマ樹脂層２０で減少される割合を少なくできて、外部に放出される光の取り出し効率を高めることができる。   In addition, in this embodiment, the primer resin ink is ejected onto the insulating resin 16 by the droplet ejection method so that the primer resin layer 20 is formed in a linear shape or a strip shape. The rate at which the light emitted through the insulating resin 16 is reduced by the primer resin layer 20 can be reduced, and the extraction efficiency of the light emitted to the outside can be increased.

また、本実施例では、プライマ樹脂層２０を配線１７が該プライマ樹脂層２０からはみ出さないように該配線１７の線幅よりも製造ばらつき相当値以上太い線幅（具体的には該配線１７の線幅の１．２〜２．５倍の線幅）に形成するようにしたので、配線１７の下面全体をプライマ樹脂層２０に密着させることができ、配線１７とプライマ樹脂層２０との密着性を確実に高めることができる。 In the present embodiment, the line width of the primer resin layer 20 is larger than the line width of the wiring 17 by an amount equivalent to the manufacturing variation (specifically, the wiring 17 so that the wiring 17 does not protrude from the primer resin layer 20). since so as to form the line width) of 1.2 to 2.5 times the line width, the entire lower surface of the wiring 17 can be brought into close contact with the primer resin layer 20, the wiring 17 and the primer resin layer 20 Adhesion can be reliably increased.

尚、配線１７を形成する方法は、液滴吐出法に限定されず、スクリーン印刷等の印刷法で形成しても良い。
その他、本発明は、要旨を逸脱しない範囲内で種々変更して実施できることは言うまでもない。 The method of forming the wiring 17 is not limited to the droplet discharge method, and may be formed by a printing method such as screen printing.
In addition, the present invention is, of course, can be variously modified without departing from the Abstract.

１１…搭載部材、１２…素子搭載凹部、１３…ＬＥＤ素子（発光素子）、１４…電極部、１５…電極部、１６…絶縁性樹脂、１７…配線、１８…封止材料、２０…プライマ樹脂層
DESCRIPTION OF SYMBOLS 11 ... Mounting member, 12 ... Element mounting recessed part, 13 ... LED element ( light emitting element), 14 ... Electrode part, 15 ... Electrode part, 16 ... Insulating resin, 17 ... Wiring, 18 ... Sealing material, 20 ... Primer resin layer

Claims (3)

搭載部材に形成された素子搭載凹部内に発光素子が搭載され、該発光素子上面の電極部と該搭載部材上面の電極部との間が配線で接続された発光素子パッケージにおいて、
前記搭載部材は、前記素子搭載凹部内に搭載された前記発光素子上面の電極部が該搭載部材上面の電極部と同じ高さとなるように形成され、
前記発光素子上面の電極部と前記搭載部材上面の電極部との間の配線経路は、前記素子搭載凹部内の前記発光素子の周囲の隙間に充填された透明な絶縁性樹脂により平坦化され、
前記配線経路上に前記発光素子上面の電極部のうちの前記搭載部材上面の電極部に近い側の一部と前記搭載部材上面の電極部のうちの前記発光素子上面の電極部に近い側の一部とに跨がってそれぞれの電極部の全部が覆われないように撥液性のプライマ樹脂インクで撥液性のプライマ樹脂層が直線状又は直線帯状に形成され、
前記プライマ樹脂層上に前記発光素子上面の電極部のうちの該プライマ樹脂層で覆われていない部分と前記搭載部材上面の電極部のうちの該プライマ樹脂層で覆われていない部分とに跨がって導電性のインクで前記配線が直線状又は直線帯状に形成されていることを特徴とする発光素子パッケージ。 In the light emitting element package in which the light emitting element is mounted in the element mounting recess formed in the mounting member, and the electrode portion on the upper surface of the light emitting element and the electrode portion on the upper surface of the mounting member are connected by wiring.
The mounting member is formed such that the electrode portion on the upper surface of the light emitting element mounted in the element mounting recess is at the same height as the electrode portion on the upper surface of the mounting member,
The wiring path between the electrode part on the upper surface of the light emitting element and the electrode part on the upper surface of the mounting member is flattened by a transparent insulating resin filled in a gap around the light emitting element in the element mounting recess ,
A portion of the electrode portion on the upper surface of the light emitting element on the wiring path that is closer to the electrode portion on the upper surface of the mounting member and a portion of the electrode portion on the upper surface of the mounting member that is closer to the electrode portion on the upper surface of the light emitting element. lyophobic primer resin layer is formed in a straight linear or straight strip-shaped liquid-repellent of the primer resin ink as is not covered the whole of the respective electrode portions straddling a portion,
The portion of the electrode portion on the top surface of the light emitting element that is not covered with the primer resin layer and the portion of the electrode portion on the top surface of the mounting member that is not covered with the primer resin layer on the primer resin layer. Accordingly, the light-emitting element package is characterized in that the wiring is formed in a linear shape or a linear belt shape with conductive ink. 前記プライマ樹脂層の線幅は、前記配線の線幅よりも太く、且つ、該配線は、該プライマ樹脂層からはみ出さないように形成されていることを特徴とする請求項１に記載の発光素子パッケージ。 The line width of the primer resin layer is thicker than the line width of the wiring, and, the wiring is according to claim 1, characterized in that it is made form so as not to protrude from the primer resin layer Light emitting device package. 搭載部材に形成した素子搭載凹部内に発光素子を搭載し、該発光素子上面の電極部と該搭載部材上面の電極部との間を配線で接続した発光素子パッケージの製造方法において、 前記素子搭載凹部内に前記発光素子を、該発光素子上面の電極部が前記搭載部材上面の電極部と同じ高さとなるように搭載する工程と、
前記素子搭載凹部内の前記発光素子の周囲の隙間に透明な絶縁性樹脂を充填して該発光素子上面の電極部と前記搭載部材上面の電極部との間の配線経路を該絶縁性樹脂で平坦化する工程と、
前記配線経路上に前記発光素子上面の電極部のうちの前記搭載部材上面の電極部に近い側の一部と前記搭載部材上面の電極部のうちの前記発光素子上面の電極部に近い側の一部とに跨がってそれぞれの電極部の全部が覆われないように撥液性のプライマ樹脂インクを吐出して撥液性のプライマ樹脂層を直線状又は直線帯状に形成する工程と、
前記プライマ樹脂層上に前記発光素子上面の電極部のうちの該プライマ樹脂層で覆われていない部分と前記搭載部材上面の電極部のうちの該プライマ樹脂層で覆われていない部分とに跨がって導電性のインクを吐出又は印刷して前記配線を直線状又は直線帯状に形成して前記発光素子上面の電極部と前記搭載部材上面の電極部との間を該配線で接続する工程とを含むことを特徴とする発光素子パッケージの製造方法。 In the method for manufacturing a light emitting element package, in which a light emitting element is mounted in an element mounting recess formed in a mounting member, and an electrode portion on the upper surface of the light emitting element and an electrode portion on the upper surface of the mounting member are connected by wiring. Mounting the light emitting element in the recess so that the electrode part on the upper surface of the light emitting element is at the same height as the electrode part on the upper surface of the mounting member ;
A transparent insulating resin is filled in a gap around the light emitting element in the element mounting recess, and a wiring path between the electrode portion on the upper surface of the light emitting element and the electrode portion on the upper surface of the mounting member is made of the insulating resin. A planarization step;
A portion of the electrode portion on the upper surface of the light emitting element on the wiring path that is closer to the electrode portion on the upper surface of the mounting member and a portion of the electrode portion on the upper surface of the mounting member that is closer to the electrode portion on the upper surface of the light emitting element. forming part and each of all the electrode portion by discharging a liquid repellency of the primer resin ink not covered lyophobic primer resin layer straddling the straight linear or straight strip ,
The portion of the electrode portion on the top surface of the light emitting element that is not covered with the primer resin layer and the portion of the electrode portion on the top surface of the mounting member that is not covered with the primer resin layer on the primer resin layer. A step of discharging or printing conductive ink to form the wiring in a straight line or a straight belt and connecting the electrode portion on the upper surface of the light emitting element and the electrode portion on the upper surface of the mounting member with the wiring. A method for manufacturing a light emitting device package, comprising:
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