JP6020621B2 - Suspension board, suspension, suspension with head, and hard disk drive - Google Patents

Description

  The present invention relates to a suspension substrate (flexure) used in a hard disk drive (HDD), and more particularly to a suspension substrate that can improve the reliability of electrical connection with a magnetic head slider.

  In general, a hard disk drive (HDD) includes a suspension substrate on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. This suspension substrate has a plurality of wirings laminated on a metal support substrate having a spring property via a base insulating layer.

  On the other hand, the magnetic head slider includes a substantially rectangular parallelepiped slider body, a magnetic head provided on one side surface of the slider body, and a plurality of slider terminal portions provided on the same side surface as the magnetic head and connected to the magnetic head. And have.

  At the end of each wiring of the suspension board, a wiring terminal portion having gold plating or the like on the upper surface is provided corresponding to the slider terminal portion, and the slider terminal portion and the wiring terminal portion are connected to each other. The data can be written to or read from the disk by electrically connecting and flowing an electric signal through each wiring.

  As a method of electrically connecting the slider terminal portion and the wiring terminal portion, the slider terminal portion and the wiring terminal portion are brought close to each other at a substantially right angle, and the terminal portions are joined with molten solder. A method (solder jet method) is known (Patent Document 1).

  Also, a spherical solder (solder ball) is placed between the slider terminal portion and the wiring terminal portion that are close to each other at a substantially right angle as described above, and then heated with a laser to melt the solder ball. There is also a method (solder ball bonding method) for joining both terminal portions (Patent Document 2). Patent Document 2 proposes to provide a concave opening or the like in the wiring terminal portion in order to prevent the placement position of the solder ball before melting from shifting due to the spherical shape.

  In addition, in order to prevent damage to the base insulating layer due to laser irradiation when the solder ball is melted, a structure in which the end of the wiring extends beyond the end surface of the base insulating layer in the wiring terminal portion has been proposed (Patent Document 3). Patent Document 3 also proposes a wiring terminal portion having a structure that prevents a solder ball arrangement position shift by forming a step due to the presence or absence of a base insulating layer or a step in the base insulating layer.

Japanese Patent Laid-Open No. 2002-50018 JP 2003-123217 A JP 2006-120288 A

  In recent years, as the capacity of HDDs has increased, the functionality of magnetic heads has increased, and the number of slider terminal portions tends to increase. However, in order to maintain the accuracy of reading and writing data while maintaining a very small gap with respect to the disk, it is difficult to increase the size of the slider body.

Therefore, in order to arrange a large number of slider terminal portions in the limited terminal portion area, the plane size of the slider terminal portions must be designed to be small and the spacing between the slider terminal portions must be reduced. The plane size of the corresponding wiring terminal portion is also reduced, and the interval between the wiring terminal portions is also reduced.
The amount of solder used for connecting the slider terminal portion and the wiring terminal portion must be reduced in accordance with the planar size of each terminal portion and the interval between the terminal portions.

  Accordingly, the bonding area between the solder and the wiring terminal portion is reduced, and the bonding strength between the two is reduced in accordance with the reduction in the bonding area, and the reliability of the electrical connection between the slider terminal portion and the wiring terminal portion is reduced. There is.

  The present invention has been made in view of the above circumstances, and has a suspension substrate, a suspension, and a head that can ensure reliability of electrical connection with the slider terminal portion even when the planar size of the wiring terminal portion is reduced. An object is to provide a suspension and a hard disk drive.

According to a first aspect of the present invention, there is provided a laminated wiring structure in which a wiring pattern made of a second conductor is laminated on a wiring pattern made of a first conductor via an intermediate insulating layer, and a plurality of slider terminals of a magnetic head slider A suspension board having a plurality of wiring terminal portions for electrical connection with a portion, wherein the wiring terminal portions are (A) a first conductor terminal pattern and a first conductor terminal pattern. A second conductor terminal pattern to be formed; in plan view, the second conductor terminal pattern overlaps the first conductor terminal pattern; and an area of the second conductor terminal pattern is equal to that of the first conductor terminal pattern. smaller than the area, wherein the first conductive terminal pattern second conductive terminal pattern is connected the intermediate insulating layer interposed not electrically, the first conductive terminal pattern the first conductor And (B) a first conductor terminal pattern having a configuration in which the second conductor terminal pattern is a termination of the wiring pattern composed of the second conductor, and (B) a first conductor terminal pattern. And a second conductor terminal pattern formed on the first conductor terminal pattern, and in plan view, the second conductor terminal pattern overlaps the first conductor terminal pattern, and the second conductor terminal pattern Is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without the intermediate insulating layer, and the first conductor terminal pattern An arrangement in which the pattern is an isolated conductor pattern made of the first conductor, and the second conductor terminal pattern is an end of the wiring pattern made of the second conductor. A terminal portion, a suspension substrate which comprises a.

According to a second aspect of the present invention, there is provided a laminated wiring structure in which a wiring pattern made of a second conductor is laminated on a wiring pattern made of a first conductor via an intermediate insulating layer, and a plurality of magnetic head sliders. A suspension substrate having a plurality of wiring terminal portions to be electrically connected to a slider terminal portion, wherein the plurality of wiring terminal portions include (A) a first conductor terminal pattern and a first conductor terminal pattern. A second conductor terminal pattern formed on the first conductor terminal pattern , wherein the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view, and the area of the second conductor terminal pattern is equal to the first conductor terminal pattern; smaller than the area of the pattern, wherein the first conductive terminal pattern second conductive terminal pattern is connected the not electrically through the intermediate insulating layer, the first conductive terminal pattern is the first A wiring terminal portion having a configuration that is a terminal end of a wiring pattern made of a conductor, and wherein the second conductor terminal pattern is a terminal end of the wiring pattern made of the second conductor; and (C) a first conductor terminal. And a second conductor terminal pattern formed on the first conductor terminal pattern, and the second conductor terminal pattern overlaps the first conductor terminal pattern in a plan view, and the second conductor terminal The area of the pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without the intermediate insulating layer, and the first conductor The terminal pattern is the end of the wiring pattern made of the first conductor, and the second conductor terminal pattern is an isolated conductor pattern made of the second conductor. A wiring terminal that is a suspension substrate which comprises a.

According to a third aspect of the present invention, there is provided a laminated wiring structure in which a wiring pattern made of a second conductor is laminated on a wiring pattern made of a first conductor via an intermediate insulating layer, and a plurality of magnetic head sliders. A suspension substrate having a plurality of wiring terminal portions to be electrically connected to the slider terminal portion, wherein the plurality of wiring terminal portions include (B) a first conductor terminal pattern and a first conductor terminal pattern. A second conductor terminal pattern formed on the first conductor terminal pattern , wherein the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view, and the area of the second conductor terminal pattern is equal to the first conductor terminal pattern; smaller than the area of the pattern, wherein the first conductive terminal pattern second conductive terminal pattern is connected the not electrically through the intermediate insulating layer, the first conductive terminal pattern first conductive A wiring terminal portion having a configuration in which the second conductor terminal pattern is an end of the wiring pattern consisting of the second conductor, and (C) the first conductor terminal pattern. And a second conductor terminal pattern formed on the first conductor terminal pattern, and in plan view, the second conductor terminal pattern overlaps the first conductor terminal pattern, and the second conductor terminal pattern Is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without the intermediate insulating layer, and the first conductor terminal pattern The pattern has an end of the wiring pattern made of the first conductor, and the second conductor terminal pattern has an isolated conductor pattern made of the second conductor. A wiring terminal portion, a suspension substrate which comprises a.

In the invention according to claim 4 of the present invention, the first conductor terminal pattern is formed on a base insulating layer, and a metal support substrate is provided under the base insulating layer. based tip of the insulating layer, and projecting from the front end of the first conductive terminal pattern, the tip of the metal support substrate, according to claim 1 to 3, characterized in that protrudes from the front end of the base insulating layer The suspension substrate according to any one of the above.

An invention according to claim 5 of the present invention is a suspension including the suspension substrate according to any one of claims 1 to 4 .

The invention according to claim 6 of the present invention includes the suspension according to claim 5 and a magnetic head slider mounted on the suspension, and a bottom surface of the magnetic head slider is below the wiring terminal portion. A suspension with a head, which is in contact with the surface of the base insulating layer and the surface of the base insulating layer of the magnetic head slider mounting portion.

According to a seventh aspect of the present invention, there is provided a hard disk drive including the suspension with a head according to the sixth aspect.

  According to the present invention, even when the planar size of the wiring terminal portion is reduced, the area corresponding to the wall surface of the step formed by the second conductor terminal pattern can be increased as the surface area of the wiring terminal portion. Since the bonding area with the solder can be increased as compared with the case where no step is provided as described above, and the bonding strength can be increased as the bonding area increases, The reliability of the general connection can be improved.

It is a schematic plan view showing an example of a suspension substrate according to the present invention. It is a typical partial enlarged view of the wiring terminal part vicinity in FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining the wiring terminal part of 1st Embodiment of the board | substrate for suspensions concerning this invention, (a) is a typical top view, (b) is AA sectional drawing in (a). . It is a figure explaining the joining state of a wiring terminal part and solder, (a) shows the joining state of the wiring terminal part which concerns on this invention, (b) shows the joining state of the conventional wiring terminal part. It is a figure explaining the wiring terminal part of 2nd Embodiment of the board | substrate for suspensions which concerns on this invention, (a) is a typical top view, (b) is BB sectional drawing in (a). . It is a figure explaining the wiring terminal part of 3rd Embodiment of the board | substrate for suspensions concerning this invention, (a) is a typical top view, (b) is CC sectional drawing in (a). . It is a figure explaining the wiring terminal part of 4th Embodiment of the board | substrate for suspensions concerning this invention, (a) is a typical top view, (b) is DD sectional drawing in (a). . It is a typical process figure showing an example of a manufacturing method of a substrate for suspensions concerning the present invention. FIG. 9 is a schematic process diagram illustrating an example of a method for manufacturing a suspension substrate according to the present invention, following FIG. 8; It is a typical process figure showing other examples of a manufacturing method of a substrate for suspensions concerning the present invention. FIG. 11 is a schematic process diagram illustrating an example of the manufacturing method of the suspension substrate according to the present invention, following FIG. 10; It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with a head of this invention. It is a figure explaining the example of magnetic head slider mounting in the suspension with a head of this invention, (a) is principal part sectional drawing before mounting, (b) is principal part sectional drawing after mounting. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a figure explaining the example of the wiring terminal part of the conventional suspension board | substrate, (a) is a typical top view, (b) is EE sectional drawing in (a).

  Hereinafter, the suspension substrate, suspension, suspension with head, and hard disk drive of the present invention will be described in detail.

[Suspension substrate]
First, the suspension substrate of the present invention will be described.
FIG. 1 is a schematic plan view showing an example of the suspension substrate of the present invention.
A suspension substrate 1 shown in FIG. 1 has a wiring terminal in which a tongue portion 2 on which a magnetic head slider is mounted and a wiring terminal portion electrically connected to the slider terminal portion of the magnetic head slider are arranged at the tip portion. An external circuit connection terminal area 4 having an external circuit connection terminal area for connecting to a reading circuit or a writing circuit at the tail side end. Between the terminal area 3 and the external circuit connection terminal area 4, at least the write wiring 5 for electrically connecting the magnetic head and the write circuit, and the magnetic head and the read circuit are electrically connected. It has the reading wiring 6 to connect.

  Here, the write wiring 5 and the read wiring 6 are respectively provided at both outer edges in the longitudinal direction of the suspension substrate 1 in order to avoid mutual electrical influence as much as possible and to maintain the mechanical balance of the suspension substrate 1. It is arranged along.

The arrangement relationship between the write wiring 5 and the read wiring 6 in FIG. 1 is an example, and other arrangement relationships may be used. For example, the read wiring 6 may be disposed at the position of the write wiring 5 in FIG. 1, and the write wiring 5 may be disposed at the position of the read wiring 6.
In addition to the write wiring 5 and the read wiring 6 described above, a ground wiring, a power supply wiring, and the like may be provided between the wiring terminal portion 3 and the external circuit connection terminal portion 4.

  FIG. 2 is a schematic partial enlarged view of the vicinity of the wiring terminal portion region 3 in FIG. 2 is a diagram for explaining the arrangement relationship of the wiring terminal portion 10 in the suspension substrate according to the present invention. In order to avoid complication, details of the configuration of the wiring terminal portion, a plating layer, Illustration of the cover layer is omitted.

  In the present invention, in addition to the write wiring 5 and the read wiring 6 described above, a ground wiring, a power supply wiring, and the like may be provided. In any wiring, the configuration of the wiring terminal portion is the same. Therefore, detailed description is omitted here.

For example, as shown in FIG. 2, a wiring terminal portion 10 is formed at the end of the write wiring 5 and the reading wiring 6, and the wiring terminal portion 10 is a metal support on the tongue portion side on which the magnetic head slider is mounted. The insulating layer 12 is disposed on the metal support substrate 11a facing the substrate 11b with the opening 7 therebetween.
Next, the detail of the wiring terminal part which concerns on this invention is demonstrated.

(First embodiment)
3A and 3B are diagrams for explaining the wiring terminal portion of the first embodiment of the suspension board according to the present invention. FIG. 3A is a schematic plan view, and FIG. 3B is a cross-sectional view taken along line AA in FIG. It is sectional drawing.
FIG. 3A is a diagram for explaining the relationship between the schematic planar shape, the arrangement relationship, and the size of the first conductor terminal pattern and the second conductor terminal pattern in the wiring terminal portion according to the present invention. In order to avoid this, the details of the configuration of the wiring terminal portion and the illustration of the plating layer and the cover layer are omitted.

On the other hand, FIG. 16 is a diagram for explaining an example of a wiring terminal portion of a conventional suspension substrate, (a) is a schematic plan view, and (b) is an EE cross-sectional view in (a). .
FIG. 16A is a diagram for explaining a schematic plane shape of the conductor terminal pattern in the conventional wiring terminal portion. In order to avoid complication, details of the configuration of the wiring terminal portion and the plating layer are illustrated. The illustration of the cover layer is omitted.

  4A and 4B are diagrams for explaining the bonding state between the wiring terminal portion and the solder, wherein FIG. 4A shows the bonding state of the wiring terminal portion according to the present invention, and FIG. 4B shows the bonding of the conventional wiring terminal portion. Indicates the state.

  For example, as shown in FIGS. 16A and 16B, the conventional wiring terminal portion 100 is composed of a single-layer conductor terminal pattern 103 without a step, whereas the wiring terminal portion according to the present invention. For example, as shown in FIGS. 3A and 3B, 10 is formed on the first conductor terminal pattern 13 formed on the flat base insulating layer 12 and the first conductor terminal pattern. The second conductor terminal pattern 15 overlaps with the first conductor terminal pattern 13 in plan view, and the area of the second conductor terminal pattern 15 is equal to the first conductor terminal pattern 15 in plan view. The area is smaller than the area of the pattern 13.

Since it has the above-described configuration, for example, as shown in FIGS. 4A and 4B, the wiring terminal portion 10 according to the present invention has the second configuration even when the planar size is reduced. Since the area corresponding to the wall surface of the step formed by the conductor terminal pattern 15 can be increased, the bonding with the solder is made more than the conventional wiring terminal portion 100 having the same plane size and not having the above-described step. The area can be increased.
And in the wiring terminal part 10 which concerns on this invention, since the joining area with solder increases as mentioned above, joining strength with solder will also be increased according to the increase. Therefore, according to the present invention, even when the planar size of the wiring terminal portion is reduced, the connection reliability with the slider terminal portion connected via solder can be improved.

In order to make the area of the second conductor terminal pattern 15 smaller than the area of the first conductor terminal pattern 13, in the wiring terminal portion according to the present invention, for example, as shown in FIG. It is preferable that the width (W2) of the two-conductor terminal pattern 15 is smaller than the width (W1) of the first conductor terminal pattern 13.
Moreover, in the wiring terminal part which concerns on this invention, the front-end | tip of the said 1st conductor terminal pattern protrudes from the front-end | tip of the said 2nd conductor terminal pattern separately from said structure or in addition to said structure. It is preferable to have a configuration. For example, in FIG. 3A, the tip of the first conductor terminal pattern protrudes by a length L from the tip of the second conductor terminal pattern.

  Here, when the planar size of the wiring terminal portion is reduced, the reduced wiring terminal portion has, for example, a shape in which the central portion of the plane is recessed, or the tip of the wiring terminal portion is U-shaped. In general, it is technically difficult to form a complicated step shape such as a V-shaped branch.

However, in general, since the width of the wiring terminal portion is designed to be larger than the width of the wiring pattern, the second width having the same width as the wiring pattern is formed on the first conductor terminal pattern constituting the wiring terminal portion. It is technically possible to form a conductor terminal pattern.
For example, the width of the wiring terminal portion predicted in the future (the width of the first conductor terminal pattern) is about 50 μm to 60 μm when the number of terminals is 8, and about 40 μm to 50 μm when the number of terminals is 10. When the number of terminals is 12, it is about 30 μm to 40 μm.

  Similarly, when the second conductor terminal pattern has the same width as that of the wiring pattern, the tip thereof is inside the tip of the first conductor terminal pattern having a width larger than the width of the second conductor terminal pattern. It is technically sufficiently possible to form the film.

  That is, as described above, the width of the second conductor terminal pattern 15 is formed to be smaller than the width of the first conductor terminal pattern 13 to configure the wiring terminal portion according to the present invention. The end of the conductor terminal pattern 13 is formed so as to protrude beyond the end of the second conductor terminal pattern 15, and the wiring terminal portion according to the present invention is formed so that the center portion of the plane is recessed. Compared to forming a complicated step shape, such as a shape in which the tip of the wiring terminal portion branches into a U-shape or V-shape, it is easier to manufacture and technically possible Is.

  Further, in the wiring terminal portion 10 according to the present invention, the tip of the base insulating layer 12 protrudes beyond the tip of the first conductor terminal pattern 13, and the tip of the metal support substrate 11 is from the tip of the base insulating layer 12. It is also preferable that the overhangs. This is because the problem of short circuit and damage can be solved.

  For example, in the case where the tip of the base insulating layer 12 is drawn inward from the tip of the first conductor terminal pattern 13 and the tip of the metal support substrate 11, the first layer is formed by forming the plating layer 16. There is a possibility that the conductor terminal pattern 13 and the metal supporting board 11 are electrically connected. Therefore, it is preferable that at least the tip of the insulating base layer 12 protrudes beyond the tip of the first conductor terminal pattern 13.

  When the tip of the metal support substrate 11 is drawn inward from the tip of the base insulating layer 12, the base insulating layer 12 has a thickness of about 10 μm. The base insulating layer 12 is susceptible to damage at least in a portion where the base insulating layer 12 protrudes beyond the tip of the first conductor terminal pattern 13. Therefore, it is preferable that the tip of the metal support substrate 11 protrudes beyond the tip of the base insulating layer 12.

  That is, if the tip end of the base insulating layer 12 protrudes beyond the tip end of the first conductor terminal pattern 13 and the tip end of the metal support substrate 11 protrudes beyond the tip end of the base insulating layer 12, Such a problem that the first conductor terminal pattern 13 and the metal support substrate 11 are electrically connected and a problem that the base insulating layer 12 is damaged can be solved.

  In the present invention, the first conductor terminal pattern constituting the wiring terminal portion is the end of the wiring pattern made of the first conductor, and / or the second conductor terminal pattern constituting the wiring terminal portion is The end of the wiring pattern made of the second conductor is preferable.

  For example, a suspension board having a laminated wiring structure having two wiring patterns via an intermediate insulating layer is known. The terminal of the wiring pattern of each layer is connected to the first conductor terminal pattern or the second conductor terminal pattern. Therefore, the wiring pattern formation and the terminal pattern formation can be performed in the same process, and the process can be shortened and the increase in the manufacturing cost can be suppressed as compared with the case where the wiring pattern formation and the terminal pattern formation are manufactured in separate processes. Because it can.

  Furthermore, in the suspension board having the laminated wiring structure in which the wiring pattern made of the second conductor is laminated via the intermediate insulating layer on the wiring pattern made of the first conductor, the configuration of the wiring terminal portion according to the present invention is used. Thus, there is also an effect that the thickness (height) of the wiring terminal portion of each wiring can be made uniform.

  For example, in a conventional suspension wiring board having a multilayer wiring structure, the thickness of the first conductor layer may be different from the thickness of the second conductor layer, and only the first conductor is formed as the end of the wiring pattern made of the first conductor. When the wiring terminal portion formed and the wiring terminal portion formed of only the second conductor as the end of the wiring pattern made of the second conductor are mixed, the thickness (height) of each wiring terminal portion is determined by the thickness of each conductor. Depending on the thickness, the connection with the slider terminal portion becomes non-uniform and connection reliability may be impaired.

  On the other hand, in the present invention, the thickness (height) of each wiring terminal portion is uniform because the thickness (height) of both the first conductor layer and the second conductor layer is overlapped. Connection reliability with the terminal portion can be further improved.

  In the first embodiment of the suspension substrate according to the present invention, the first conductor terminal pattern 13 is the end of the wiring pattern made of the first conductor, and the second conductor terminal pattern 15 is the first conductor terminal pattern 15. This is a form that is the end of a wiring pattern composed of two conductors.

  That is, as shown in FIG. 3B, in the wiring terminal portion 10, the first conductor constituting the first conductor terminal pattern 13 and the second conductor constituting the second conductor terminal pattern 15 are intermediate insulation layers. 14, but electrically connected, but as shown at the left end of FIG. 3B, in a region away from the wiring terminal portion 10, the first conductor constituting the first conductor terminal pattern 13, The 2nd conductor which comprises the 2nd conductor terminal pattern 15 is electrically insulated via the intermediate | middle insulating layer 14, and comprises the wiring pattern of each layer.

  In FIG. 3A, the first conductor terminal pattern 13 and the second conductor terminal pattern 15 are both illustrated as rectangular planar shapes, but in the present invention, the second conductor terminal pattern 15 is illustrated. As long as it is smaller than the area of the first conductor terminal pattern 13, and is not limited to the above-mentioned shape, and various planar shapes such as polygonal, substantially circular, elliptical, oval, rounded, etc. can do. Further, the shape of the first conductor terminal pattern 13 and the shape of the second conductor terminal pattern 15 are not limited to similar shapes, and may be different shapes.

(Second Embodiment)
FIG. 5 is a view for explaining a wiring terminal portion of a second embodiment of the suspension substrate according to the present invention, (a) is a schematic plan view, and (b) is a BB in (a). It is sectional drawing. FIG. 5A is a diagram for explaining the relationship between the schematic planar shape, the arrangement relationship, and the size of the first conductor terminal pattern and the second conductor terminal pattern in the wiring terminal portion according to the present invention. In order to avoid this, the details of the configuration of the wiring terminal portion and the illustration of the plating layer and the cover layer are omitted.

  This embodiment is a form in which only the second conductor terminal pattern 15 is the end of the wiring pattern, and the first embodiment is different from the first embodiment in that the first conductor terminal pattern 13 is not the end of the wiring pattern. Is different.

That is, as shown in FIG. 5B, the second conductor terminal pattern 15 is the end of the wiring pattern made of the second conductor, but the first conductor terminal pattern 13 is an isolated conductor pattern. Yes.
However, in the present invention, the wiring pattern made of the first conductor not connected to the first conductor terminal pattern 13 is formed below the wiring pattern made of the second conductor via the intermediate insulating layer 14. Also good.

  In FIG. 5A, both the first conductor terminal pattern 13 and the second conductor terminal pattern 15 are illustrated as rectangular planar shapes, but in the present invention, the second conductor terminal pattern 15 is illustrated. As long as it is smaller than the area of the first conductor terminal pattern 13, and is not limited to the above-mentioned shape, and various planar shapes such as polygonal, substantially circular, elliptical, oval, rounded, etc. can do. Further, the shape of the first conductor terminal pattern 13 and the shape of the second conductor terminal pattern 15 are not limited to similar shapes, and may be different shapes.

(Third embodiment)
6A and 6B are diagrams for explaining a wiring terminal portion of a third embodiment of the suspension substrate according to the present invention, FIG. 6A is a schematic plan view, and FIG. 6B is a cross-sectional view taken along line CC in FIG. It is sectional drawing.
FIG. 6A is a diagram for explaining the relationship between the schematic planar shape, the arrangement relationship, and the size of the first conductor terminal pattern and the second conductor terminal pattern in the wiring terminal portion according to the present invention. In order to avoid this, the details of the configuration of the wiring terminal portion and the illustration of the plating layer and the cover layer are omitted.

  In the present embodiment, only the first conductor terminal pattern 13 is the end of the wiring pattern, and the second conductor terminal pattern 15 is not the end of the wiring pattern. It is different from the embodiment.

That is, as shown in FIG. 6B, the first conductor terminal pattern 13 is the end of the wiring pattern made of the first conductor, but the second conductor terminal pattern 15 is an isolated conductor pattern. Yes.
In the present invention, the wiring pattern made of the second conductor not connected to the second conductor terminal pattern 15 is formed on the wiring pattern made of the first conductor via the intermediate insulating layer 14. Also good.

  In FIG. 6A, the first conductor terminal pattern 13 and the second conductor terminal pattern 15 are both illustrated as rectangular planar shapes, but in the present invention, the second conductor terminal pattern 15 is illustrated. As long as it is smaller than the area of the first conductor terminal pattern 13, and is not limited to the above-mentioned shape, and various planar shapes such as polygonal, substantially circular, elliptical, oval, rounded, etc. can do. Further, the shape of the first conductor terminal pattern 13 and the shape of the second conductor terminal pattern 15 are not limited to similar shapes, and may be different shapes.

(Fourth embodiment)
FIGS. 7A and 7B are diagrams for explaining the wiring terminal portion of the third embodiment of the suspension substrate according to the present invention, FIG. 7A is a schematic plan view, and FIG. 7B is a DD in FIG. It is sectional drawing. FIG. 7A is a diagram for explaining the relationship between the schematic planar shape, the arrangement relationship, and the size of the first conductor terminal pattern and the second conductor terminal pattern in the wiring terminal portion according to the present invention. In order to avoid this, the details of the configuration of the wiring terminal portion and the illustration of the plating layer and the cover layer are omitted.

  In the present embodiment, the second conductor constituting the second conductor terminal pattern 18 is made of a different metal material from the first conductor constituting the first conductor terminal pattern 13, and only the first conductor terminal pattern 13 is a wiring pattern. This is different from the first to third embodiments in that it is a terminal.

  That is, as shown in FIG. 7B, the first conductor terminal pattern 13 is the end of the wiring pattern made of the first conductor, but the second conductor terminal pattern 18 made of a metal material different from the first conductor. Is an isolated conductor pattern.

  Here, the first conductor constituting the first conductor terminal pattern 13 is mainly made of copper (Cu), but the metal material of the second conductor constituting the second conductor terminal pattern 18 in the present embodiment includes: An example is nickel (Ni).

  In FIG. 7A, the first conductor terminal pattern 13 and the second conductor terminal pattern 18 are both illustrated as rectangular planar shapes, but in the present invention, the second conductor terminal pattern 18 is used. As long as it is smaller than the area of the first conductor terminal pattern 13, and is not limited to the above-mentioned shape, and various planar shapes such as polygonal, substantially circular, elliptical, oval, rounded, etc. can do. Further, the shape of the first conductor terminal pattern 13 and the shape of the second conductor terminal pattern 18 are not limited to similar shapes, and may be different shapes.

  Hereinafter, members constituting the suspension substrate of the present invention will be described.

[Metal support substrate]
The material of the metal support substrate is not particularly limited as long as it functions as a support for the suspension substrate and has a desired spring property. For example, stainless steel can be used.
The thickness of the metal support substrate is, for example, preferably in the range of 10 μm to 30 μm, and more preferably in the range of 15 μm to 25 μm.

[First conductor]
Next, the first conductor in the present invention will be described. In this invention, a 1st conductor is a conductor which comprises the 1st conductor terminal pattern of a wiring terminal part, and is also a conductor which comprises a wiring pattern.
Examples of the material of the first conductor include metal, and specifically, copper (Cu), nickel (Ni), gold (Au), silver (Ag), alloys of these metals, and the like. Among them, copper (Cu) is preferable. This is because it is highly conductive and inexpensive.
The thickness of the first conductor is, for example, preferably in the range of 1 μm to 18 μm, and more preferably in the range of 5 μm to 12 μm.

[Second conductor]
Next, the second conductor in the present invention will be described. In this invention, a 2nd conductor is a conductor which comprises the 2nd conductor terminal pattern of a wiring terminal part, and is also a conductor which comprises a wiring pattern. The first conductor and the second conductor may be made of the same material or different materials.
Examples of the material of the second conductor include metals, and specifically, copper (Cu), nickel (Ni), gold (Au), silver (Ag), alloys of these metals, and the like. Among them, copper (Cu) is preferable. This is because it is highly conductive and inexpensive.
For example, the thickness of the second conductor is preferably in the range of 1 μm to 18 μm, and more preferably in the range of 5 μm to 12 μm.

[Base insulation layer]
Next, the base insulating layer in the present invention will be described. The base insulating layer is formed on the surface of the metal support substrate, and electrically insulates the metal support substrate from the wiring pattern and the wiring terminal portion formed on the base insulating layer.
The material of the base insulating layer is not particularly limited as long as it has a desired insulating property, and examples thereof include polyimide. The material of the base insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the base insulating layer is, for example, preferably in the range of 5 μm to 30 μm, and more preferably in the range of 5 μm to 15 μm.

[Intermediate insulation layer]
Next, the intermediate insulating layer in the present invention will be described. The intermediate insulating layer electrically insulates the wiring pattern made of the first conductor from the wiring pattern made of the second conductor.
The material of the intermediate insulating layer is not particularly limited as long as it has a desired insulating property, and examples thereof include polyimide. The material for the intermediate insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the intermediate insulating layer is preferably in the range of 5 μm to 30 μm, for example, and more preferably in the range of 5 μm to 15 μm.

[Cover layer]
Next, the cover layer used in the present invention will be described. In order to prevent deterioration due to corrosion or the like, the outermost wiring pattern is preferably covered with a cover layer. An example of the material for the cover layer is polyimide. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer is preferably in the range of 3 μm to 30 μm, for example.

[Plating layer]
Next, the plating layer used in the present invention will be described. The plating layer is formed on the surface of the wiring terminal portion, and is intended to improve the bonding strength with the solder and protect the exposed conductor from corrosion.
The plating layer is formed by an electrolytic plating method, and the material thereof can be used without particular limitation as long as it can form the terminal portion of the suspension substrate. For example, Ni (nickel), Au (gold), palladium (Pd), or the like is used.
The plating layer may be formed as a multilayer. For example, electrolytic Ni plating and electrolytic Au plating may be sequentially performed to form a multilayer structure of Ni in the lower layer and Au in the upper layer. In this case, the thickness of the Ni layer is, for example, about 0.1 to 3 μm, and the thickness of the Au layer is, for example, about 1 to 5 μm.

[Method of manufacturing suspension substrate]
Next, the manufacturing method of the suspension substrate of the present invention will be described. In addition, the manufacturing method of the suspension substrate of the present invention is not particularly limited as long as it is a method capable of obtaining the suspension substrate having the above-described configuration.

(First manufacturing method)
An example of the manufacturing method of the suspension substrate of the present invention using the subtractive method will be described with reference to FIGS.
First, as shown in FIG. 8A, a laminated body in which a metal support substrate 11 (for example, stainless steel), a base insulating layer 13 (for example, polyimide), and a first conductor layer 13A (for example, copper) are sequentially stacked. prepare.

  Next, the first conductor layer 13A is processed by photoengraving using a dry film resist and etching to form a wiring pattern made of the first conductor and a first conductor terminal pattern 13 (FIG. 8B). ).

Next, an intermediate insulating layer 14 (for example, polyimide) is formed on the first conductor terminal pattern 13 so that the wiring terminal portion is exposed (FIG. 8C).
Here, when non-photosensitive polyimide is used as the material of the intermediate insulating layer 14, a resist pattern is formed on the intermediate insulating layer 14 so that a desired portion is left and unnecessary portions are removed, and the resist By removing the portion exposed from the pattern using an alkaline etching solution, the cross-sectional shape of the end portion of the intermediate insulating layer 14 can be tapered due to the isotropic property of the etching solution.
Further, when photosensitive polyimide is used as the material of the intermediate insulating layer 14, exposure is performed through a mask pattern so that a desired portion is left and unnecessary portions are removed in the state of polyamic acid after coating and drying. Then, the unexposed portion is removed with an alkaline developer. At this time, the polyimide spreads in the lateral direction and hardens as it approaches the first conductor pattern side due to the wraparound of light toward the unexposed part due to the irregular reflection of light at the exposed part. Then, the cross-sectional shape of the edge part of the intermediate | middle insulating layer 14 can be made into a taper shape by removing an unexposed part using an alkaline developing solution.

  Next, a wiring pattern made of a second conductor (for example, copper) and a second conductor terminal pattern 15 are formed on the intermediate insulating layer 14 and the first conductor terminal pattern 13 by electrolytic plating (FIG. 8D). )).

  Next, the cover layer 17 (for example, polyimide) is formed on the wiring pattern made of the second conductor. However, the wiring terminal portion is exposed (FIG. 9E).

  Next, processing is performed so that the tip of the base insulating layer 12 is drawn more than the tip of the metal support substrate 11 by photoengraving using a dry film resist and etching (FIG. 9F).

  Finally, a plating layer (for example, Ni / Au) is formed on the exposed surface of the first conductor terminal pattern 13 and the second conductor terminal pattern 15 including the side wall surface, thereby obtaining the suspension substrate according to the present invention (FIG. 9). (G)).

  In the above-described manufacturing method, the method for manufacturing the suspension substrate having the wiring terminal portion according to the first embodiment of the present invention has been described. However, the wiring terminal portion according to the second to fourth embodiments according to the present invention. The suspension substrate having the above can be manufactured in the same manner by using this manufacturing method.

(Second manufacturing method)
Next, an example of the manufacturing method of the suspension substrate of the present invention using the additive method will be described with reference to FIGS.
First, a metal support substrate 11 (for example, stainless steel) is prepared (FIG. 10A), and a base insulating layer 12 is formed on the top of the metal support substrate 11 (FIG. 10). (B)).

  Next, a wiring pattern made of a first conductor (for example, copper) and a first conductor terminal pattern 13 are formed on the insulating base layer 12 by electrolytic plating (FIG. 10C).

Next, an intermediate insulating layer 14 (for example, polyimide) is formed on the first conductor terminal pattern 13 so that the wiring terminal portion is exposed (FIG. 10D).
Here, when non-photosensitive polyimide is used as the material of the intermediate insulating layer 14, a resist pattern is formed on the intermediate insulating layer 14 so that a desired portion is left and unnecessary portions are removed, and the resist By removing the portion exposed from the pattern using an alkaline etching solution, the cross-sectional shape of the end portion of the intermediate insulating layer 14 can be tapered due to the isotropic property of the etching solution.
Further, when photosensitive polyimide is used as the material of the intermediate insulating layer 14, exposure is performed through a mask pattern so that a desired portion is left and unnecessary portions are removed in the state of polyamic acid after coating and drying. Then, the unexposed portion is removed with an alkaline developer. At this time, the polyimide spreads in the lateral direction and hardens as it approaches the first conductor pattern side due to the wraparound of light toward the unexposed part due to the irregular reflection of light at the exposed part. Then, the cross-sectional shape of the edge part of the intermediate | middle insulating layer 14 can be made into a taper shape by removing an unexposed part using an alkaline developing solution.

  Next, a wiring pattern made of a second conductor (for example, copper) and a second conductor terminal pattern 15 are formed on the intermediate insulating layer 14 and the first conductor terminal pattern 13 by electrolytic plating (FIG. 11E). )).

  Next, the cover layer 17 (for example, polyimide) is formed on the wiring pattern made of the second conductor. However, the wiring terminal portion is exposed (FIG. 11 (f)).

  Finally, a plating layer (for example, Ni / Au) is formed on the exposed surfaces of the first conductor terminal pattern 13 and the second conductor terminal pattern 15 including the side wall surfaces, thereby obtaining the suspension substrate according to the present invention (FIG. 11). (G)).

  In the above-described manufacturing method, the method for manufacturing the suspension substrate having the wiring terminal portion according to the first embodiment of the present invention has been described. However, the wiring terminal portion according to the second to fourth embodiments according to the present invention. The suspension substrate having the above can be manufactured in the same manner by using this manufacturing method.

[suspension]
Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described suspension substrate.

  FIG. 12 is a schematic plan view showing an example of the suspension of the present invention. A suspension 30 shown in FIG. 12 includes the suspension substrate 1 described above, a load beam 31 provided on the back surface side (metal support substrate 11 side) of the suspension substrate 1, and a base plate (not shown). It is. The load beam and the base plate can be the same as the load beam and base plate used for a general suspension.

  According to the present invention, by using the above-described suspension substrate, it is possible to obtain a suspension having good electrical connection reliability with the magnetic head slider.

[Suspension with head]
Next, the head suspension according to the present invention will be described. A suspension with a head according to the present invention includes the above-described suspension and a magnetic head slider mounted on the suspension, and a bottom end of the bottom surface of the magnetic head slider is a front end of a base insulating layer below the wiring terminal portion. It is characterized by touching.

  FIG. 13 is a schematic plan view showing an example of the suspension with a head according to the present invention. A suspension with head 40 shown in FIG. 13 includes the suspension 30 described above and a magnetic head slider 41 mounted on the gimbal portion 2 of the suspension 30.

  Since the suspension 30 is the same as described above, the description thereof is omitted here. The magnetic head slider 41 can be the same as the magnetic head slider used in a general suspension with a head.

  14A and 14B are diagrams for explaining an example of mounting a magnetic head slider in the suspension with a head according to the present invention. FIG. 14A is a cross-sectional view of the main part before mounting, and FIG. 14B is a cross-sectional view of the main part after mounting. .

First, as shown in FIG. 14A, a base insulating layer 12b is formed in a desired pattern shape on the metal support substrate 11b on the tongue portion 2 side before mounting, and the height position of the upper surface thereof. Corresponds to the height position of the upper surface of the base insulating layer 12a formed on the metal support substrate 11a on the wiring terminal portion 10 side facing the tongue portion 2 with the opening 7 therebetween.
The reason why the height positions of the two coincide is that the metal support substrates 11a and 11b are both made of the same metal support substrate 11, and the opening 7 is provided, so that as shown in FIG. The base insulating layers 12a and 12b are made of the same base insulating layer 12 formed on the metal supporting substrate 11, and are processed into a desired pattern by photoengraving or the like. This is because it is separated to the left and right as shown in FIG.

  As shown in FIG. 14B, when mounted, the bottom surface of the magnetic head slider 41 is the surface of the base insulating layer 12a on the wiring terminal portion 10 side and the surface of the base insulating layer 12b on the tongue portion 2 side. The bottom surface of the magnetic head slider 41 and the metal support substrate 11b are bonded to each other by the conductive adhesive 44.

  Here, as described above, the height position of the upper surface of the insulating base layer 12a coincides with the height position of the upper surface of the insulating base layer 12b, so that the magnetic head slider 41 is level with the height position of both upper surfaces. Will be kept.

  Therefore, in the present invention, the position of the slider terminal portion 42 formed on the side surface of the magnetic head slider 41 is set at a predetermined height and a predetermined angle (approximately perpendicular to the wiring terminal portion) with respect to the wiring terminal portion 10. The wiring terminal portion 10 and the slider terminal portion 42 can be connected well.

Here, the connection between the wiring terminal portion 10 and the slider terminal portion 42 is performed by solder bonding.
As a method of solder joining, a method (solder jet method) in which solder melted by laser heating is ejected with high-pressure nitrogen gas in a narrow tubular solder ejection head to join between desired terminal portions (solder jet method). Can be preferably used.
The wiring terminal portion 10 of the present invention has a step shape with a substantially convex cross section. However, if this solder jet method is used, the solder balls before melting are arranged as in the solder ball bonding method described above. This is because there is no adverse effect that the position shifts.

The melted solder is plated on the plating layer 16 formed on the surface including the stepped side wall of the wiring terminal portion 10 and on the surface of the slider terminal portion 42 as shown in FIG. The layer 43 wets and spreads, and then the temperature decreases and solidifies.
Therefore, in the present invention, the entire plating surface of the wiring terminal portion 10 including the stepped side wall can be made into a bonding area with the solder, and the bonding strength is higher than that of the wiring terminal portion having the same planar shape and no stepped side wall. Can be improved.

Since the melted solder exhibits liquid repellency with respect to the insulating layer and the oxide film, it does not wet and spread on the side surface (the surface is a silicon oxide film) of the base insulating layer 12 or the magnetic head slider 41.
Therefore, even if a quantity of molten solder that fills the space between the wiring terminal portion 10 and the slider terminal portion 42 is discharged, the upper surface of the base insulating layer 12 between the wiring terminal portions or the upper portion of the silicon oxide film between the slider terminal portions. In addition, the molten solder does not wet and spread, and a short circuit between the wiring terminal parts and a short circuit between the slider terminal parts can be avoided.

As described above, according to the present invention, by using the above-described suspension, it is possible to obtain a suspension with a head having good electrical connection reliability with the magnetic head slider.
In particular, in the present invention, the magnetic head slider has a configuration in which the bottom surface of the magnetic head slider is in contact with the surface of the base insulating layer on the wiring terminal portion side and the surface of the base insulating layer on the tongue portion side. It can be held horizontally at the height of the upper surface of both base insulating layers. Therefore, the position of the slider terminal portion of the magnetic head slider can be arranged at a predetermined height and a predetermined angle with respect to the wiring terminal portion, and the connection between the wiring terminal portion and the slider terminal portion can be improved. It can be carried out.

[Hard disk drive]
Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention includes the above-described suspension with a head.

FIG. 15 is a schematic plan view showing an example of the hard disk drive of the present invention.
A hard disk drive 50 shown in FIG. 15 is attached to a case 51, a disk 52 that is rotatably attached to the case 51, stores data, a spindle motor 53 that rotates the disk 52, and a desired flying on the disk 52. A suspension 40 with a head is provided so as to be close to each other while maintaining a height, and includes a slider for writing and reading data to and from the disk 52. Among these, the suspension with head 40 is attached to the case 51 so as to be movable, and the voice coil motor 54 for moving the slider of the suspension with head 40 along the disk 52 is attached to the case 51. The head suspension 40 is attached to the voice coil motor 54 via an arm 55.

  Note that the suspension with a head is the same as that described above, so description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the suspension with a head described above.

  The suspension substrate, suspension, suspension with head, and hard disk drive according to the present invention have been described above, but the present invention is not limited to the above-described embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It falls within the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1 ... Suspension board 2 ... Tongue part 3 ... Wiring terminal part area | region 4 ... External circuit connection terminal part area | region 5 ... Write wiring 6 ... Read wiring 7 ... Opening part DESCRIPTION OF SYMBOLS 10 ... Wiring terminal part 11, 11a, 11b ... Metal support board 12, 12a, 12b ... Base insulating layer 13 ... 1st conductor terminal pattern 13A ... 1st conductor layer 14 ... Intermediate insulation layers 15, 18 ... second conductor terminal pattern 16 ... plating layer 17 ... cover layer 20, 200 ... solder 30 ... suspension 31 ... load beam 40 ... with head Suspension 41 ... Magnetic head slider 42 ... Slider terminal part 43 ... Plating layer 44 ... Conductive adhesive 50 ... Hard disk drive 51 ... Case 52 ... Disk 53 ... Spindle motor 54 ... Voice coil motor 55 ... Arm 100 ... Wiring terminal part 101 ... Metal support substrate 102 ... Base insulating layer 103 ... Conductor terminal pattern 106 ... Plating layer 107 ..Cover layer

Claims (7)

A laminated wiring structure in which a wiring pattern made of a second conductor is laminated on a wiring pattern made of a first conductor via an intermediate insulating layer, and a plurality of terminals for electrically connecting to a plurality of slider terminal portions of the magnetic head slider A suspension board having a wiring terminal portion,
As the plurality of wiring terminal portions,
(A) A first conductor terminal pattern and a second conductor terminal pattern formed on the first conductor terminal pattern are provided, and the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view. The area of the second conductor terminal pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without passing through the intermediate insulating layer. And the first conductor terminal pattern is an end of the wiring pattern made of the first conductor, and the second conductor terminal pattern is an end of the wiring pattern made of the second conductor. A wiring terminal portion having,
(B) A first conductor terminal pattern and a second conductor terminal pattern formed on the first conductor terminal pattern are provided, and the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view. The area of the second conductor terminal pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without passing through the intermediate insulating layer. The first conductor terminal pattern is an isolated conductor pattern made of a first conductor, and the second conductor terminal pattern is an end of a wiring pattern made of the second conductor. Wiring terminal part,
A suspension substrate comprising: A laminated wiring structure in which a wiring pattern made of a second conductor is laminated on a wiring pattern made of a first conductor via an intermediate insulating layer, and a plurality of terminals for electrically connecting to a plurality of slider terminal portions of the magnetic head slider A suspension board having a wiring terminal portion,
As the plurality of wiring terminal portions,
(A) A first conductor terminal pattern and a second conductor terminal pattern formed on the first conductor terminal pattern are provided, and the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view. The area of the second conductor terminal pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without passing through the intermediate insulating layer. And the first conductor terminal pattern is an end of the wiring pattern made of the first conductor, and the second conductor terminal pattern is an end of the wiring pattern made of the second conductor. A wiring terminal portion having,
(C) A first conductor terminal pattern and a second conductor terminal pattern formed on the first conductor terminal pattern are provided, and the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view. The area of the second conductor terminal pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without passing through the intermediate insulating layer. The first conductor terminal pattern is an end of the wiring pattern made of the first conductor, and the second conductor terminal pattern is an isolated conductor pattern made of the second conductor. Wiring terminal part,
A suspension substrate comprising: A laminated wiring structure in which a wiring pattern made of a second conductor is laminated on a wiring pattern made of a first conductor via an intermediate insulating layer, and a plurality of terminals for electrically connecting to a plurality of slider terminal portions of the magnetic head slider A suspension board having a wiring terminal portion,
As the plurality of wiring terminal portions,
(B) A first conductor terminal pattern and a second conductor terminal pattern formed on the first conductor terminal pattern are provided, and the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view. The area of the second conductor terminal pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without passing through the intermediate insulating layer. The first conductor terminal pattern is an isolated conductor pattern made of a first conductor, and the second conductor terminal pattern is an end of a wiring pattern made of the second conductor. Wiring terminal part,
(C) A first conductor terminal pattern and a second conductor terminal pattern formed on the first conductor terminal pattern are provided, and the second conductor terminal pattern overlaps the first conductor terminal pattern in plan view. The area of the second conductor terminal pattern is smaller than the area of the first conductor terminal pattern, and the first conductor terminal pattern and the second conductor terminal pattern are electrically connected without passing through the intermediate insulating layer. The first conductor terminal pattern is an end of the wiring pattern made of the first conductor, and the second conductor terminal pattern is an isolated conductor pattern made of the second conductor. Wiring terminal part,
A suspension substrate comprising: The first conductor terminal pattern is formed on a base insulating layer,
A metal supporting substrate is provided under the base insulating layer,
The tip of the base insulating layer protrudes beyond the tip of the first conductor terminal pattern,
The suspension substrate according to any one of claims 1 to 3, wherein a tip end of the metal support substrate protrudes beyond a tip end of the base insulating layer.   A suspension comprising the suspension substrate according to any one of claims 1 to 4.   6. The suspension according to claim 5, and a magnetic head slider mounted on the suspension, wherein the bottom surface of the magnetic head slider has a surface of a base insulating layer under the wiring terminal portion and a base of the magnetic head slider mounting portion. A suspension with a head, which is in contact with a surface of an insulating layer.   A hard disk drive comprising the suspension with a head according to claim 6.

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