JP6017382B2 - Device and method for conveying individualized electronic components - Google Patents

Description

  The present invention relates to a transport apparatus and a transport method for individualized electronic components that transport a plurality of individual electronic components by cutting a plate-shaped workpiece.

  A substrate made of a printed circuit board, a lead frame, or the like is virtually divided into a plurality of grid-like areas, chip-like elements are mounted in each area, and the entire board is resin-sealed. It is called (sealed substrate). An electronic component is obtained by cutting the resin sealing body with a singulation device using a rotary blade or the like, and dividing the resin into individual regions.

  Electronic parts separated by cutting the resin sealing body, for example, BGA (Ball Grid Array Package) products, inspect the sealing resin side (mold surface) and the substrate side (ball surface) in the inspection process Whether the product is good or defective is determined. All inspected electronic components are placed in the index table. The electronic components arranged on the index table are sorted into non-defective products and defective products, and are accommodated in the non-defective product tray and the defective product tray by the transfer mechanism, respectively.

  In recent years, electronic components have been increasingly miniaturized, and in order to increase the production efficiency of electronic components, there has been a strong demand for increasing the number of electronic components to be taken out from a single substrate by increasing the size of the substrate. As a result, the index table and the tray are increased in size, and the area for storing the electronic components tends to be smaller.

  In the singulation apparatus, the number of electronic components arranged in the index table is usually different from the number of electronic components accommodated in the tray. Furthermore, the pitch for arranging the electronic components on the index table is different from the pitch for accommodating the electronic components on the tray. Therefore, a technique for efficiently transporting and storing the electronic components arranged on the index table to the tray becomes important.

  As a transport device that picks up and transports an electronic component, “in a transport device including a plurality of pickup units having suction means for picking up a device to be inspected, an engagement member provided in each pickup unit; And a common member movable with the engagement groove engaged therewith, wherein the pickup unit moves in accordance with the movement of the common member, and the interval of the suction means changes. A “conveying device” has been proposed (for example, paragraph [0013], FIG. 1 of Patent Document 1).

JP 2004-39706 A

  However, in the above patent document, when the number and pitch of electronic components arranged along one direction in the index table is different from the number and pitch of electronic components accommodated along one direction in the tray, There is no mention of how to efficiently store electronic components from the index table to the tray.

  The present invention relates to the number of empty pockets in a tray when the number and pitch of electronic components arranged along one direction in the index table are different from the number and pitch of electronic components accommodated along one direction in the tray. Accordingly, it is an object of the present invention to provide an apparatus and a method for transporting individual electronic components that can be efficiently accommodated in a tray by adsorbing the electronic components.

  In order to solve the above-described problems, a device for transporting an individualized electronic component according to the present invention is manufactured by dividing a plate-like member into units of a plurality of regions provided in the plate-like member. A device for transporting individual electronic components for transporting a plurality of electronic components, the storage member having a plurality of placement locations where the electronic components are respectively placed, and the plurality of accommodation locations where the electronic components are respectively accommodated A housing member, a transfer mechanism that sucks and transports electronic components from a plurality of placement locations to a plurality of placement locations, a function provided in the transport mechanism and sucks the electronic components, and suction to the electronic components N (N is an integer greater than or equal to 2) suction portions having a function of releasing the number, and the number of empty places in the storage place in one line along one direction of the plurality of storage places (M is positive) Integer) and M <N If M ≧ N, the electronic parts are adsorbed by the adsorption part, and if M ≧ N, the N electronic parts are adsorbed by the adsorption part, and the adsorbed electronic parts are transferred. It is transferred to an accommodation member by a mechanism, and is accommodated in at least a part of M free spaces by releasing the suction.

  In addition, according to the present invention, the device for transporting the separated electronic parts calculates the number of empty places and sucks and stores the number of electronic components according to the number of empty places in the above-described transport device. A control unit is provided for controlling the transfer mechanism so as to be transferred from the member to the storage member and stored.

  According to another aspect of the present invention, there is provided a device for transporting individualized electronic components, including the first transport mechanism and the second transport mechanism as the transport mechanism in the transport device described above. While one of the transfer mechanisms adsorbs the electronic component on the storage member, the other accommodates the electronic component adsorbed on the adsorbing portion in the accommodating member.

  In addition, in the transport device for individualized electronic components according to the present invention, in the transport device described above, the suction unit adjusts the spacing between the suction units to the pitch of a plurality of placement locations or the pitch of a plurality of storage locations. And has a variable function.

  Further, according to the present invention, there is provided a device for transporting individualized electronic components, wherein the plate-shaped member is a resin sealing body, and the electronic component includes a circuit board and a chip including a passive element or an active element. And a sealing resin made of a cured resin.

  According to another aspect of the present invention, there is provided an apparatus for transporting separated electronic components, wherein the plate-like member is a semiconductor wafer and the electronic component is a semiconductor chip.

  In order to solve the above-described problems, the method for transporting an individualized electronic component according to the present invention is manufactured by dividing a plate-like member into a plurality of regions provided in the plate-like member. A method of transporting individual electronic components for transporting a plurality of electronic components, the step of disposing the individual electronic components at a plurality of placement locations provided in a storage member, and a transfer mechanism A step of adsorbing electronic components from a plurality of arrangement locations by the provided N (N is an integer of 2 or more) adsorbing portions, and a plurality of arrangement locations from the plurality of arrangement locations by a transfer mechanism A step of transferring the component and a step of accommodating the electronic component in the accommodation location by releasing the adsorption to the electronic component. In the adsorption step, the empty space of the accommodation location is arranged in one line along one direction of the accommodation member. Number is M (M is a positive integer), and when M <N, M electronic components are sucked from the storage member by the suction unit. When M ≧ N, N electronic components are stored from the storage member. In the process of adsorbing and transferring by the adsorption unit, the electronic component is transferred to at least a part of the M empty places by the transfer mechanism, and in the process of storing, the M empty parts are released by releasing the adsorption to the electronic part. It is housed in at least a part of the place.

  In addition, the method for transporting individualized electronic components according to the present invention is the above transport method, wherein the number of empty places is calculated and the number of electronic components according to the number of empty places is sucked and stored. A step of controlling the transfer mechanism so as to be transferred from the member to the storage member and stored therein is provided.

  According to another aspect of the present invention, there is provided a method for transporting individualized electronic components, wherein one of a first transport mechanism and a second transport mechanism provided as a transport mechanism is an electronic component in a storage member. While the component is adsorbed, the other is characterized in that the electronic component adsorbed by the adsorbing portion is accommodated in the accommodating member.

  Further, the method for transporting the separated electronic components according to the present invention includes the step of varying the interval between the suction portions in accordance with the pitch of the plurality of placement locations or the pitch of the plurality of storage locations in the transport method described above. It is characterized by providing.

  In addition, the method for transporting the separated electronic component according to the present invention is the above-described transport method, wherein the plate-like member is a resin sealing body, and the electronic component includes a circuit board and a chip including a passive element or an active element. And a sealing resin made of a cured resin.

  According to another aspect of the present invention, there is provided a method for transporting an individualized electronic component, wherein the plate-like member is a semiconductor wafer and the electronic component is a semiconductor chip.

  According to the present invention, when the number M of vacant places is smaller than the number N of suction portions in one row along one direction of the housing member, electronic components equal to the number of vacant places are sucked from the storage member. . The electronic component sucked by the transfer mechanism is transferred to the storage member and stored in the empty space. By controlling the transfer mechanism in accordance with the number of empty places, it is possible to avoid performing the operation of accommodating electronic components twice in the empty places. Therefore, it is possible to efficiently accommodate the electronic component from the storage member to the accommodating member.

It is a schematic plan view which shows the singulation apparatus which concerns on a present Example. It is a schematic plan view which shows the structure of an index table, a transfer mechanism, and a tray. It is a schematic sectional drawing which shows the process of accommodating an electronic component in a tray with a transfer mechanism. It is the schematic which shows the state which accommodates an electronic component in the pocket of the 1st line of a tray. It is the schematic which shows the state which accommodates an electronic component in the pocket of the 2nd line of a tray. It is the schematic which shows the state which accommodates an electronic component in the whole tray.

  When the number of empty pockets in each row of the non-defective product tray is smaller than the number of sucking parts of the transfer mechanism, a number of electronic components equal to the number of empty pockets are sucked from the index table. The electronic component sucked by the transfer mechanism is transferred to a non-defective tray and accommodated in an empty pocket.

  As an embodiment, a description will be given of a device for transporting separated electronic components according to the present invention with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  FIG. 1 is a schematic plan view showing a singulation apparatus 1 according to this embodiment. The singulation apparatus 1 divides an object to be cut into a plurality of electronic components. The singulation apparatus 1 includes a receiving unit A, a singulation unit B, an inspection unit C, and a storage unit D as components (modules).

  The receiving unit A, the singulation unit B, the inspection unit C, and the housing unit D are detachable and replaceable with respect to other components, respectively, and each of the specifications differs according to the expected required specifications. It is prepared in advance so as to have. The singulation apparatus 1 includes the receiving unit A, the singulation unit B, the inspection unit C, and the accommodation unit D.

  The receiving unit A is provided with a prestage 2. A resin-sealed body (molded substrate) 3 corresponding to an object to be cut is received by the prestage 2 from a resin-sealing device that is a device in the previous process. The resin sealing body 3 is disposed on the prestage 2 with the sealing resin side down.

  The resin sealing body 3 includes a circuit board such as a lead frame or a printed board, a chip including passive elements or active elements mounted in a plurality of grid-like regions on the circuit board, and a cured resin formed in a lump. And a sealing resin.

  The separation unit B is provided with a cutting table 4. The cutting table 4 can move in the X direction in the figure and can rotate in the θ direction. A cutting stage 5 is attached on the cutting table 4. Two spindle units 6 are provided as a cutting mechanism at the back of the singulation unit B. The two spindle units 6 can move independently in the Y direction. Each of the two spindle units 6 is provided with a rotary blade 7. These rotary blades 7 cut the resin sealing body 3 by rotating in a plane along the X direction. Therefore, in this embodiment, the cutting unit B is provided with two cutting mechanisms each using the rotary blade 7. There may be one cutting mechanism or three or more cutting mechanisms.

  The inspection unit C is provided with an inspection stage 8. The assembly 9 composed of a plurality of electronic components P cut into pieces by cutting the resin sealing body 3 is collectively sucked to the inspection stage 8. The inspection stage 8 is configured to be rotatable about the X direction. A plurality of separated electronic parts P (for example, BGA products) are sorted into non-defective products and defective products by inspecting the sealing resin side (mold surface) and the substrate side (ball surface). The inspected electronic components P are arranged on the index table 10 in a checkered pattern (checker flag pattern) or lattice. In FIG. 1, it has shown about the case where it arrange | positions in checkered pattern shape. The inspection unit C is provided with a plurality of transfer mechanisms 11A and 11B that transfer the electronic components P arranged on the index table 10 to a tray.

  The storage unit D is provided with a non-defective product tray 12 for storing non-defective products and a defective product tray 13 for storing defective products. The electronic components P are sorted into non-defective products and defective products by the transfer mechanisms 11A and 11B and stored in each tray. Here, it is assumed that all the electronic components P arranged in the index table 10 are non-defective products.

  The configuration and operation of the singulation apparatus 1 have been described above. The operation in the singulation apparatus 1 is controlled by a control unit CTL provided in the receiving unit A, for example.

  FIG. 2 is a schematic diagram showing the configuration of the index table 10, the transfer mechanisms 11 </ b> A and 11 </ b> B, and the non-defective product tray 12. FIG. 2 shows a case where the electronic components P are arranged in a grid pattern. The arrangement along the horizontal direction (X direction) of the index table 10 is called “row”, and the arrangement along the vertical direction (Y direction) is called “column”. In this case, a total of 280 electronic components P of 10 rows × 28 columns are arranged in each partitioned area of the index table 10. Since the electronic component P is arranged on a matrix of 10 rows × 28 columns, for example, the electronic component P arranged in the fourth column of the third row is referred to as an electronic component P34. Therefore, the electronic components P11 to P128 are arranged in the first row, the electronic components P21 to P228 are arranged in the second row, and the electronic components P101 to P1028 are arranged in the tenth row, and a total of 280 electronic components P are arranged. Arranged in the index table 10.

  Similarly, the non-defective product tray 12 is provided with pockets S for accommodating a total of 153 electronic components P of 9 rows × 17 columns. Each pocket S is formed in a shape having a recess for accommodating the electronic component P. Pockets S11 to S117 are provided on the first line, pockets S21 to S217,... Are provided on the second line, and pockets S91 to S917 are provided on the ninth line.

  In the index table 10, the electronic components P are arranged with a pitch a in both the X direction and the Y direction. Similarly, in the non-defective product tray 12, the pockets S are formed at an interval of a pitch b in both the X direction and the Y direction. The pitch a of the index table 10 and the pitch b of the non-defective tray 12 are different. The number of electronic components arranged in the index table 10 and the number of electronic components accommodated in the non-defective product tray 12 vary depending on the target product. As described above, the number and pitch of the electronic components P arranged on the index table 10 are usually different from the number and pitch of the electronic components P accommodated in the non-defective product tray 12.

  In FIG. 2, each of the transfer mechanisms 11 </ b> A and 11 </ b> B includes a plurality of independent suction portions H (specifically, six suction portions H <b> 1 to H <b> 6). Each of the suction portions H1 to H6 has a function of lifting and lowering the electronic component P and a function of releasing the suction. In addition, the transfer mechanisms 11A and 11B are configured so that the intervals between the suction portions H1 to H6 can be varied. The transfer mechanisms 11A and 11B can suck up to six electronic components P arranged on the index table 10 by the suction portions H1 to H6. The transfer mechanisms 11 </ b> A and 11 </ b> B sequentially transfer the sucked electronic components P to the non-defective product tray 12 and store them in a predetermined pocket S. The transport mechanisms 11A and 11B adsorb the electronic parts P from the index table 10 when the electronic parts P are adsorbed according to the pitch a, and when the electronic parts P are accommodated in the non-defective product tray 12, the electronic components P are adjusted according to the pitch b. The part P is accommodated.

  As shown in FIG. 2, the electronic components P arranged in the index table 10 are transferred by the transfer mechanisms 11A and 11B to P11 to P128 on the first row, P228 to P21 on the second row, P31 to P328 on the third row, The fourth row P428 to P41,... And each row are alternately adsorbed and transferred along the direction of the two-dot chain line arrow. Similarly, in the non-defective product tray 12, the first row S11 to S117, the second row S217 to S21, the third row S31 to S317, the fourth row S417 to S41,. The electronic component P is accommodated in the pocket S along the direction of the two-dot chain line arrow.

  FIG. 3 is a schematic cross-sectional view showing a process of accommodating the electronic components P11 to P16 in the non-defective product tray 12 by the transfer mechanism 11A. As shown in FIG. 3A, the index table 10 is provided with suction ports 14 for sucking each electronic component P. If each divided area of the index table 10 is provided with a recess for placing the electronic component P, the suction port 14 may not be provided.

  First, as shown to Fig.3 (a), the space | interval of the adsorption | suction part H of 11 A of transfer mechanisms is match | combined with the pitch a. The transport mechanism 11A moves to a position where the electronic components P11 to P16 arranged in the first row (see FIG. 2) of the index table 10 can be picked up. The suction portions H1 to H6 descend and each sucks the electronic components P11 to P16.

  Next, as shown in FIG. 3B, the transfer mechanism 11 </ b> A moves onto the pockets S <b> 11 to S <b> 16 provided in the first row (see FIG. 2) of the non-defective product tray 12 and pitches the intervals between the suction portions H. Set to b. After the suction part H is lowered and the electronic components P11 to P16 are accommodated in the pockets S11 to S16, the suction is released. Six electronic components P11 to P16 are accommodated in the first row of the non-defective product tray 12 by the transfer mechanism 11A. As described above, the transfer mechanisms 11A and 11B adsorb the electronic parts P from the index table 10 when the electronic parts P are adsorbed according to the pitch a, and when the electronic parts P are accommodated in the non-defective product tray 12, the electronic components P are adjusted according to the pitch b. The part P is accommodated.

  A specific example in which the electronic component P is accommodated in the non-defective product tray 12 by the transfer mechanisms 11A and 11B will be described with reference to FIGS. Here, description will be made assuming that all the electronic components P arranged in the index table 10 are non-defective products. If there is a defective product, only the good product is first transferred from the index table 10 to the good product tray 12 and stored. Then, after all the non-defective products are accommodated, the remaining defective products are transferred to the defective product tray 13 and accommodated.

  FIG. 4 shows a state where the electronic component P is accommodated in the pocket S in the first row of the non-defective product tray 12. First, the transfer mechanism 11A sucks the six electronic components P11 to P16 arranged in the first row of the index table 10 and transfers them to the pockets S11 to S16 provided in the first row of the non-defective product tray 12. Then, the suction of the electronic components P11 to P16 is released and the electronic components P11 to P16 are accommodated. The transfer mechanism 11 </ b> A moves and returns to a position on the index table 10. While the transfer mechanism 11A accommodates the electronic components P11 to P16 in the pockets S11 to S16 of the good product tray 12, the transfer mechanism 11B has six electronic components P17 to P112 arranged in the first row of the index table 10. To adsorb. Then, the electronic components P17 to P112 are accommodated in the pockets S17 to S112 provided in the first row of the non-defective product tray 12. As described above, the transfer mechanisms 11 </ b> A and 11 </ b> B alternately repeat the operation of sucking the electronic component P from the index table 10 and the operation of storing the electronic component P in the non-defective product tray 12.

Up to this point, the number M of empty pockets in the first row of the non-defective product tray 12 is larger than N (six in this embodiment), which is the number of suction portions H (the number of suction portions) of the transfer mechanisms 11A and 11B. The six electronic components P are sucked from the index table 10 by the transfer mechanisms 11A and 11B and stored in the non-defective product tray 12. In this state, 12 electronic components P11 to P112 are accommodated in the pockets S11 to S112 in the first row of the good product tray 12, and the five pockets S113 to S117 are empty pockets. Since the number M of empty pockets in the first row is smaller than the number N of sucked portions, next, five electronic components P corresponding to the number of empty pockets M are sucked from the index table 10. Accordingly, the transfer mechanism 11A sucks the five electronic components P113 to P117 from the index table 10 and stores them in the pockets S113 to S117 of the non-defective product tray 12. In this way, in the first row of the non-defective product tray 12, the transfer mechanisms 11A and 11B perform a series of operations (cycles) of adsorption, transfer, storage, and return three times, thereby causing 17 electronic components P11. -P117 are all stored in the pockets S11-S117 in the first row of the non-defective product tray 12.

Consider a case where the number of empty pockets M in each row of the non-defective product tray 12 is smaller than the number N of sucked portions, and the electronic component P is sucked more than the number of empty pockets M. In this case, for example, when the N electronic parts P that can be picked up by the transfer mechanisms 11A and 11B are picked up, the electronic parts P must be continuously accommodated over two lines, that line and the next line. Disappear. When the electronic component P is accommodated over two rows, the accommodating operation is divided into two consecutive times, and the accommodating time is doubled. If the electronic component P is accommodated by the accommodating operation divided into two consecutive times, the accommodation efficiency is deteriorated. In order to avoid such a situation, in this embodiment, in each row of the non-defective product tray 12, when the number of empty pockets M is smaller than the number of sucked portions N , the number of electronic components P equal to the number of empty pockets M is sucked. And stored in the non-defective product tray 12. Accordingly, it is possible to avoid the electronic component P from being accommodated in the non-defective product tray 12 by the accommodating operation divided into two consecutive times, and to enhance the accommodation efficiency.

  The operation of sucking the electronic component P from the index table 10, the operation of transporting and storing the electronic component P in the good product tray 12, the process of calculating the number of empty pockets of the good product tray 12, and the number of empty pockets of the good product tray 12 All operations and processes such as an operation of sucking an equal number of electronic components P from the index table 10 are controlled by a control unit CTL (see FIG. 1) provided in the singulation apparatus 1.

FIG. 5 shows a state in which the electronic component P is stored in the pocket S in the second row of the non-defective product tray 12. The transport mechanism 11B sucks the six electronic components P 118 to P123 from the index table 10 and stores them in the second-row pockets S217 to S212 of the non-defective product tray 12. Next, the transfer mechanism 11 </ b> A sucks a total of six electronic components P including five of P 124 to P 128 in the first row of the index table 10 and one of P 228 in the second row. And it accommodates in the pockets S211 to S26 of the good product tray 12. In this way, in each row of the non-defective product tray 12, when the number of empty pockets M is larger than the number N of suction parts, and the remaining number L of electronic components P in that row in the index table 10 is smaller than the number N of suction parts, From the index table 10, six electronic components P are sucked and stored in the non-defective product tray 12 over two rows.

Next, the transfer mechanism 11B adsorbs the five electronic components P227 to P223 equal to the number of empty pockets in the second row of the non-defective product tray 12 and stores them in the pockets S25 to S21. In this way, all the electronic components P217 to P21 are accommodated by the accommodating operation three times in the second row. Similarly, the electronic parts P are attracted and accommodated from the index table 10 in the third to ninth lines of the non-defective product tray 12.

FIG. 6 shows a state where all the electronic parts P are accommodated up to the ninth line of the non-defective product tray 12. Similarly to the first and second lines of the non-defective product tray 12, each electronic component is also transferred by the transfer mechanisms 11A and 11B in the third, fourth,. P is accommodated in each pocket S of the non-defective product tray 12. The non-defective product tray 12 accommodates a total of 153 electronic components P in 9 rows × 17 columns . After all the electronic components P are stored in the pockets S of the non-defective product tray 12, the electronic components P are stored in a new tray by exchanging with the next tray.

  In the embodiment, 17 pockets S are provided in each row of the good product tray 12. Six suction portions H of the transfer mechanisms 11A and 11B are provided. Therefore, when the electronic component P is attracted from the index table 10 by six, six, and five operations and stored in the non-defective product tray 12, all the electronic components P are stored in the pockets S of each row. That is, all the electronic parts P are filled in the pockets of each row of the non-defective product tray 12 by the accommodating operation three times. The number M of pockets in each row of the non-defective product tray 12 and the number N of suction portions in the transfer mechanism are not limited to this, and can be arbitrarily set.

  As described above, when the number of empty pockets M in each row of the non-defective product tray 12 is smaller than the number N of sucked portions, the number of electronic components P equal to the number of empty pockets M is sucked from the index table 10. In the empty pocket of the non-defective product tray 12. As a result, it is possible to avoid performing the accommodating operation continuously over two rows of the non-defective product tray 12, and it is possible to perform all the operations of accommodating the electronic components P in each row in one operation. Therefore, the time for accommodating the electronic component P in the non-defective product tray 12 can be shortened, and the accommodation efficiency can be improved.

  The transfer mechanisms 11 </ b> A and 11 </ b> B alternately repeat the operation of sucking the electronic component P in the index table 10 and the operation of receiving it in the non-defective product tray 12. Thus, the electronic parts P can be efficiently transferred from the index table 10 to the non-defective product tray 12 and accommodated by the two transfer mechanisms 11A and 11B. In this embodiment, the control unit CTL of the singulation apparatus 1 calculates the number of empty pockets M in each row of the non-defective product tray 12, and controls the operation of the two transfer mechanisms 11A and 11B according to the number of empty pockets M. To do. Thus, the electronic component P can be efficiently sucked from the index table 10 and stored in the non-defective product tray 12. Therefore, the time for accommodating the electronic component P in the non-defective product tray 12 can be shortened, and the productivity of the singulation apparatus 1 can be improved.

  According to the present invention, in each row of the non-defective product tray 12, when the number M of remaining empty pockets is smaller than the number N of suction portions of the transfer mechanisms 11A and 11B, the number of electronic components P equal to the number of empty pockets M is indexed. Adsorbed from the table 10 and accommodated in the non-defective product tray 12. Therefore, the adsorbed electronic parts P can be properly accommodated in each row of the non-defective product tray 12 as many as the number of pockets provided in each row. In addition, the operation of sucking and housing the electronic component P is alternately repeated by the two transfer mechanisms 11A and 11B. Therefore, in the singulation apparatus 1, the time for housing the electronic component P can be shortened, and the productivity can be improved.

  In the present embodiment, the case where the two transfer mechanisms 11 </ b> A and 11 </ b> B attract each electronic component P from the index table 10 and accommodate it in the non-defective product tray 12 has been described. However, the number of transfer mechanisms may be one or three or more.

  As the object to be cut, a semiconductor wafer may be used in addition to the resin sealing body 3. Since an electronic circuit is built in each region of the semiconductor wafer, a portion (semiconductor chip) corresponding to each region after cutting becomes an electronic component P.

  Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. Is.

1 Separation device 2 Prestige 3 Resin encapsulant (plate member)
4 Cutting Table 5 Cutting Stage 6 Spindle Unit 7 Rotary Blade 8 Inspection Stage 9 Aggregate of Multiple Electronic Components 10 Index Table (Storage Member)
11A, 11B transfer mechanism (first transfer mechanism, second transfer mechanism)
12 Non-defective tray (housing member)
13 Defective product tray 14 Suction port A Receiving unit B Divided unit C Inspection unit D Storage unit CTL Control unit P Electronic component S Pocket (accommodation place)
H suction part a pitch of electronic parts arranged in the index table b pitch of pockets provided in the tray M number of empty pockets in each line of the tray N number of suction parts in the transfer mechanism L remaining number of electronic parts in each line of the index table

Claims (12)

A device for transporting individualized electronic components for transporting a plurality of electronic components manufactured by separating the plate-shaped member into a plurality of regions provided in the plate-shaped member,
A storage member having a plurality of placement locations where the electronic components are respectively placed;
A housing member having a plurality of housing locations each housing the electronic component;
A transfer mechanism for adsorbing and transferring the electronic components from the plurality of arrangement locations to the plurality of accommodation locations;
Provided with the transfer mechanism, and N (N is an integer of 2 or more) suction portions having a function of sucking the electronic component and a function of releasing the suction to the electronic component;
When the number of empty places in the accommodation place is M (M is a positive integer) and M <N in one row along one direction of the plurality of accommodation places, M pieces of the storage places are stored in the storage member. When the electronic component is adsorbed by the adsorption unit and M ≧ N, N electronic components from the storage member are adsorbed by the adsorption unit,
The sucked electronic component is transferred to the storage member by the transfer mechanism, and is stored in at least a part of the M empty spaces by releasing the suction .
The transfer mechanism includes a first transfer mechanism and a second transfer mechanism;
The first transfer mechanism and the second transfer mechanism alternately repeat the operation of attracting the electronic component from the storage member and the operation of storing the electronic component in the storage member. A device for transporting separated electronic components. In the conveyance device of the separated electronic component according to claim 1,
A control unit that calculates the number of empty places and controls the transfer mechanism so that the number of the electronic components corresponding to the number of empty places is sucked and transferred from the storage member to the receiving member A device for transporting individualized electronic components, comprising: In the conveyance device of the separated electronic component according to claim 1 ,
While one of the first transfer mechanism and the second transfer mechanism attracts the electronic component in the storage member, the other accommodates the electronic component adsorbed by the adsorption portion in the accommodation member. An apparatus for transporting individualized electronic components, characterized in that: In the conveyance device of the separated electronic component according to claim 1,
The adsorbing unit has a function of changing the interval between the adsorbing units according to the pitch of the plurality of arrangement locations or the pitch of the plurality of accommodation locations, and a transport device for the separated electronic components, . In the conveyance device of the separated electronic component according to claim 1,
The plate-shaped member is a resin sealing body, and the electronic component includes a circuit board, a chip including a passive element or an active element, and a sealing resin made of a cured resin. Transport device. In the conveyance device of the separated electronic component according to claim 1,
The plate-like member is a semiconductor wafer, and the electronic component is a semiconductor chip. A method for transporting individualized electronic components that transports a plurality of electronic components manufactured by separating the plate-shaped member into a plurality of regions provided in the plate-shaped member,
Placing each of the separated electronic components at a plurality of placement locations provided in a storage member;
Adsorbing the electronic component from the plurality of arrangement locations by N (N is an integer of 2 or more) adsorbing portions provided in the transfer mechanism;
A step of transferring the electronic component from the plurality of arrangement locations to a plurality of accommodation locations provided in the accommodation member by the transfer mechanism;
A step of accommodating the electronic component in the accommodating place by releasing the suction to the electronic component;
In the adsorbing step, if the number of empty places in the accommodation place is M (M is a positive integer) in one line along one direction of the accommodation member, and M <N, the storage member M pieces of electronic components are sucked by the suction portion, and when M ≧ N, N pieces of electronic components from the storage member are sucked by the suction portion,
In the transferring step, the electronic device is transferred to at least a part of the M empty places by the transfer mechanism,
In the storing step, the suction to the electronic component is released to store in at least a part of the M empty places ,
The transfer mechanism includes a first transfer mechanism and a second transfer mechanism;
The method for transporting individualized electronic components, wherein the first transport mechanism and the second transport mechanism alternately repeat the sucking step and the housing step . In the method for conveying the separated electronic component according to claim 7,
Calculating the number of empty places, and controlling the transfer mechanism so that the number of the electronic components corresponding to the number of empty places is adsorbed and transferred from the storage member to the receiving member and stored. A method for transporting an individualized electronic component, comprising: In the method for conveying the separated electronic component according to claim 7,
Between the one of the said first transfer mechanism said second transfer mechanism adsorbs the electronic component in the storage member, the other is for accommodating the electronic component, wherein the suction portion is adsorbed in the housing member A method for transporting individualized electronic components characterized by the following. In the method for conveying the separated electronic component according to claim 7,
A method for transporting an individualized electronic component, comprising: a step of varying an interval between the suction portions according to a pitch of the plurality of arrangement locations or a pitch of the plurality of accommodation locations. In the method for conveying the separated electronic component according to claim 7,
The plate-shaped member is a resin sealing body, and the electronic component includes a circuit board, a chip including a passive element or an active element, and a sealing resin made of a cured resin. Transport method. In the method for conveying the separated electronic component according to claim 7,
The plate-shaped member is a semiconductor wafer, and the electronic component is a semiconductor chip.

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