JP6014315B2 - Measuring method of electronic component mounting device - Google Patents

Description

  The present invention relates to a measuring method of an electronic component mounting apparatus that recognizes an electronic component mounted on a substrate for inspection and measures the position of the electronic component.

  An inspection apparatus that mounts an electronic component on an inspection-dedicated jig substrate by the electronic component mounting apparatus, recognizes the mounted electronic component, and measures the mounting position is disclosed in, for example, Patent Document 1 or the like. In the electronic component mounting apparatus for mounting the electronic component on the board by setting the inspection dedicated jig substrate thus mounted on the inspection device, measuring the position of the electronic component with the inspection device, and mounting the electronic component on the substrate, for example, the mounting head This is used as offset data on the attachment position of the suction nozzle with respect to the electronic component mounting apparatus to increase the mounting accuracy of the electronic component.

JP 2007-103660 A

  However, in order to obtain the offset data from the mounting position of the electronic component measured by using the inspection device, the time required to set the inspection dedicated jig substrate is set in the inspection device. The work becomes troublesome. From such a problem, it is conceivable that the electronic component mounting apparatus uses the substrate recognition camera to image the inspection dedicated jig substrate, recognize the position of the electronic component, and calculate and use the offset data from the measurement result. However, when the electronic component mounting apparatus images the inspection-dedicated jig substrate and recognizes the position of the electronic component, the position of the electronic component can be determined even if the substrate is slightly rotated or tilted in the vertical direction. Accurate recognition is difficult, and as a result, there is a possibility that the offset data cannot be obtained accurately to improve the mounting accuracy.

  Accordingly, an object is to accurately measure the position of the electronic component mounted by the electronic component mounting apparatus, and to obtain as accurate offset data as possible to improve the mounting accuracy.

For this reason, according to a first aspect of the present invention, there is provided a measurement method of an electronic component mounting apparatus for measuring the position of an electronic component held by a mounting head and mounted on a substrate, and a calibration mark in which a plurality of marks are arranged in a matrix is attached. An electronic component is mounted on the jig substrate, the calibration mark is imaged and recognized by a camera, a parameter of inclination when one side of the jig substrate is tilted upward, and an electronic component mounted on the jig substrate is obtained. A component is imaged with a camera to recognize a mounting position, and a position where the electronic component is mounted is corrected based on the parameter.

According to a second aspect of the present invention, there is provided a measuring method of an electronic component mounting apparatus for measuring a position of an electronic component held by a mounting head and mounted on a substrate, and a calibration mark in which a plurality of marks are arranged in a matrix is attached. An electronic component is mounted on the jig substrate, the calibration mark is imaged and recognized by a camera, a parameter of inclination when one side of the jig substrate is tilted upward, and an electronic component mounted on the jig substrate is obtained. A fiducial mark placed around the component is imaged and recognized by a camera, the position of the fiducial mark is corrected based on the parameter, a reference position of the electronic component is obtained based on the corrected position, and a jig substrate The electronic component mounted on the camera is imaged with a camera to recognize the mounting position, and the position where the electronic component is mounted is determined based on the parameter. Correct, and obtains the position and angle of deviation the electronic component with respect to the reference position is implemented.

  The present invention can accurately measure the position of an electronic component mounted by the electronic component mounting apparatus, and can obtain offset data as accurate as possible.

It is a top view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is a simplified explanatory view of a state where an illumination lamp is turned on and an electronic component mounted on an inspection substrate is irradiated with inclined light. It is a figure which shows the flowchart which calculates | requires the mounting precision (or offset) in an electronic component mounting apparatus. It is a top view of the board | substrate for an inspection before and after an electronic component is mounted | worn. It is a top view of the board | substrate for demonstrating arrangement | positioning of the board | substrate positioning mark in a board | substrate. It is a figure explaining arrangement | positioning of the calibration mark in a board | substrate. It is the simplified explanatory drawing when the board | substrate for a test | inspection is imaged with the board | substrate recognition camera, and the figure of the image of the calibration mark when it images. It is an explanatory view when imaging two marks on a diagonal line and obtaining a reference position. It is a figure of explanation when carrying out recognition processing of mounting parts, and obtaining the position and angle. It is explanatory drawing which showed that the coordinate of the electronic component in the coordinate system of the imaged image changes to the coordinate after correction | amendment. It is explanatory drawing when calculating | requiring the shift | offset | difference of an electronic component mounting position and an angle.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view of an electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks on the front and rear of the apparatus main body 2 of the electronic component mounting apparatus 1, and a plurality of them are arranged in parallel. It is installed.

  Each of the component supply devices 3A, 3B, 3C, and 3D has a large number of component supply units 5 arranged side by side on a feeder base provided on a cart that is a mounting carriage, and a tip portion on the component supply side serves as a substrate. Is attached to the apparatus main body 2 through a connector (not shown) so as to face the transport path of the printed circuit board P, and when the handle is released by pulling the handle, the caster is provided on the lower surface. It can be moved.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip on the component supply side faces the pickup region (component extraction region) of the mounting head 6, and each component supply unit 5 includes The storage tape is rotated by a predetermined angle by rotating a feed sprocket whose teeth are fitted to feed holes opened at predetermined intervals on a storage tape that is sequentially wound in a state of being wound around a supply reel that is rotatably mounted on the cart table. A tape feed mechanism that intermittently feeds the electronic component to the component pickup / extraction position by a feed motor, and a cover tape release mechanism for peeling the cover tape from the carrier tape in front of the pickup / extraction position by driving the peeling motor. The cover tape is peeled off by the peeling mechanism, and the electronic parts loaded in the carrier tape storage section are sequentially supplied to the component pick-up / removal position. It can be taken out by the suction nozzle as a retainer to be described later from.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, there are two supply conveyors, positioning units 8 and 8 (having a conveyor) that constitute the substrate transport mechanism, and discharge. A conveyor is provided. Each supply conveyor conveys each printed board P received from the upstream to each positioning unit 8, and electronic components are mounted on each board P positioned by a positioning mechanism (not shown) in each positioning unit 8. Then, it conveys to each discharge conveyor, and conveys to a downstream apparatus after that. The printed circuit board P is positioned in the front / rear / left / right direction (planar direction) and the vertical direction (vertical direction) by the positioning mechanism.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor in the Y direction is provided with a mounting head 6 that is moved by the X-axis drive motor in the longitudinal direction, that is, in the X direction. A book suction nozzle is provided. The mounting head 6 is equipped with a vertical axis drive motor for moving the suction nozzle up and down, and a θ-axis drive motor for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Reference numeral 12 denotes a component recognition camera. How much each electronic component is displaced and held with respect to the suction nozzle. The electronic component sucked and held by the suction nozzle in order to recognize the position in the XY direction and the rotation angle. Take an image. Reference numeral 19 denotes a board recognition camera provided on the mounting head 6 for picking up an image of a positioning mark attached to the printed board P. The images captured by the cameras 12 and 19 are subjected to recognition processing by a recognition processing device.

  Next, the control block diagram of FIG. 2 will be described. The electronic component mounting apparatus 1 includes a CPU (Central Processing Unit) 20 as a control device that performs overall control of the electronic component mounting apparatus 1, and the CPU 20. A RAM (Random Access Memory) 21 and a ROM (Read Only Memory) 22 connected via a bus line are provided. Based on the data stored in the RAM 21, the CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 22. That is, the CPU 20 controls driving of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15, and the like via the interface 24 and the drive circuit 27.

  The RAM 21 stores component mounting data relating to component mounting for each type of printed circuit board P, and a plurality of mounting areas divided in the printed circuit board P for each mounting order except skip information to be written later. Information on which mounting area of each of the board parts (represented by “U”) and information on which board parts of a plurality of board parts on which electronic components are mounted in a repetitive pattern (“O”). ), Mounting order information (represented by “P”) in the mounting region or in the split substrate portion, the X direction (represented by “X”) of the mounting coordinates of each electronic component in the printed circuit board P, Y The direction (represented by “Y”) and angle information (represented by “Z”), the arrangement number information of each component supply unit 5 (represented by “Fdr”), and the like are stored.

  The RAM 21 stores component library data representing characteristics such as the size of electronic components, component arrangement data in which a component ID is stored for each arrangement number of the component supply unit 5, and the like.

  A recognition processing device 23 is connected to the CPU 20 via an interface 24. The recognition processing device 23 performs recognition processing of an image captured by the component recognition camera 12 or the board recognition camera 19. The processing result is sent to the CPU 20. That is, the CPU 20 outputs an instruction to the recognition processing device 23 to perform recognition processing on the images captured by the component recognition camera 12 and the board recognition camera 19 and receives a recognition processing result from the recognition processing device 23.

  Reference numeral 25 denotes a monitor for displaying a part image and a screen for setting various data. The monitor 25 is provided with various touch panel switches 26 as input means. Can be set.

  The electronic component mounting apparatus 1 described above also functions as an inspection apparatus that inspects the mounting accuracy of the electronic components mounted on the printed circuit board P, and the configuration thereof will be described below.

  In FIG. 3, the inspection substrate PP, which is a jig substrate to be specified for the inspection, is a milky white glass substrate or ceramic substrate, and an illumination lamp 30 which is a light source to be described later of the substrate recognition camera 19 is added to the inspection substrate PP. This is made of a material that diffusely reflects inside the inspection substrate PP when the light from is obliquely irradiated.

  Further, a substrate positioning mark M is deposited on the inspection substrate PP by vapor deposition at a peripheral position of the mounted electronic component 31 in order to recognize the position of the electronic component 31 mounted on the inspection substrate PP. (See FIG. 3). Specifically, as shown in FIG. 3, the positioning mark M is placed on the inspection substrate PP so as to straddle the electronic component 31 after mounting and at a predetermined interval from the electronic component.

  Reference numeral 30 denotes an electronic component 31 mounted on the inspection substrate PP and a plurality of illuminating lamps that irradiate light (tilted light) obliquely from above to the positioning mark. The longest portion when the electronic component 31 is viewed in plan view. Are arranged at intervals longer than the length of. The plurality of illuminating lamps 30 are arranged in two rows on the mounting head 6 at the interval so as to oppose a group of illuminating lamps 30 arranged in a row at a predetermined interval. Alternatively, a plurality of the gaps may be arranged on the circumference having the diameter as a ring at a predetermined interval. Reference numeral 32 denotes a lens barrel attached to the lower surface of the substrate recognition camera 19, and a lens 33 for forming a reflected image is disposed therein.

  Next, an operation when the mounting position of the mounted electronic component 31 is inspected, that is, when the mounting accuracy is obtained or when the offset of the mounting position is obtained will be described based on the flowchart shown in FIG.

  First, the mounting operation (step S1) of the electronic component 31 in step 1 will be briefly described. First, the inspection substrate PP, which is a dedicated inspection jig substrate, is conveyed from the upstream device to the positioning unit 8 via the supply conveyor and positioned and fixed, and the mounting head 6 is moved according to the mounting coordinate data of the electronic component 31 to be inspected. The electronic component 31 to be mounted by the suction nozzle corresponding to the component type of the electronic component 31 to be inspected is sucked and taken out from the predetermined component supply unit 5.

  More specifically, in this case, it moves so as to be positioned above the component supply unit 5 that houses the target electronic component 31, but the Y-axis drive motor 11 is driven in the Y direction to move the beam 10, and is orthogonal to the Y direction. The X-axis drive motor 13 is driven in the X direction, which is the direction along the beam 10 and the mounting head 6 is moved, and the predetermined component supply unit 5 has already been driven by the feed motor and the peeling motor to take out the component suction Since the electronic component 31 is ready to be taken out at the position, the vertical axis drive motor 14 lowers the predetermined suction nozzle to pick up and take out the electronic component 31, and then the mounting head 6 moves up.

  The suction nozzle moves so as to mount the electronic component 31 at a predetermined position on the printed circuit board P positioned by the positioning unit 8. During the movement of the mounting head 6, the mounting head 6 moves. However, the electronic component 31 sucked and held by the suction nozzle when passing the upper position of the component recognition camera 12 is imaged by the component recognition camera 12 (fly recognition).

  Based on the imaging result, the recognition processing device recognizes how much the electronic component 31 is displaced with respect to the suction nozzle and is held by the recognition processing device. The suction nozzle holding the electronic component 31 by driving the X-axis drive motor moves to the inspection substrate PP, which is a jig substrate dedicated for inspection. Therefore, the Y axis drive motor, the X axis drive motor, and the θ axis drive motor are corrected and controlled by the control device by adding the position recognition processing result of the electronic component 31 to the mounting coordinates of the mounting data, and the suction of each mounting head 6 is controlled. The electronic component 31 is mounted at a predetermined position between the positioning marks M on the inspection substrate PP while the nozzle corrects the positional deviation. Similarly, a plurality of electronic components 31 are mounted in a matrix at predetermined positions on the inspection substrate PP (see FIG. 5).

  As described above, after the plurality of electronic components 31 to be inspected are mounted on the inspection substrate PP, the substrate positioning marks 32 attached to the three corners of the inspection substrate PP on which the substrate recognition camera 19 is mounted are displayed. The image is picked up (see FIG. 6) and recognized by the recognition processing device 23, and the position of the inspection substrate PP (the displacement in the X direction and the Y direction of the inspection substrate) and the angle (the angular displacement that is the inclination of the inspection substrate) are detected. It is grasped (step S2). In FIG. 6 and FIG. 7 described later, the description of the electronic component 31 and the like is omitted in order to clearly illustrate the positions of the substrate positioning mark 32 and the calibration mark 33 on the illustrated inspection substrate PP.

  Next, the board recognition camera 19 moves above the calibration mark 33 attached to the center of one side of the mounted inspection board PP and images the calibration mark 33. As shown in the enlarged right part of FIG. 7, the calibration mark 33 is a plurality of recognition marks 34 arranged in a matrix in the X and Y directions, and can be imaged by the substrate recognition camera 19 at a time. As such, the size fits in the field of view 35. FIGS. 8A and 8B show a simplified explanatory diagram when the inspection substrate PP with one side of the substrate inclined upward is imaged by the substrate recognition camera 19 and a calibration mark 33 when the image is captured. The intervals of the recognition marks 34 of the calibration mark 33 are different. In FIG. 8B, the recognition marks 34 are arranged in a matrix, and a grid-like line that is not actually imaged is shown so that it can be easily understood that the intervals are different.

  The captured calibration mark 33 is subjected to recognition processing by the recognition processing device 23, and the position (interval and distribution) of each recognized recognition mark 34 and each calibration mark 33 stored in the storage device 27 in advance. The rotation angle, magnification, and the like of the calibration mark 33 are obtained based on the positions (equal intervals) of the marks, that is, deviations from the positions of the respective marks, and the calibration parameters (hereinafter referred to as the following) of the inspection substrate PP are obtained from the results. Is referred to as a parameter) (step S3). Since the inspection substrate PP is inclined as shown in FIG. 8A, the interval between the recognition marks 34 subjected to the recognition process is different, and the right side near the substrate recognition camera 19 is wide. For example, the rotation angle and magnification of the calibration mark 33 around the vertical line can be obtained by comparing this interval with other positions. The position of the calibration mark 33 is obtained, for example, as the center position (center of gravity position) of the collection of the recognition marks 34. Since the positional relationship between the obtained position of the calibration mark 33 and each mark M is known in advance, the position of each mark M is obtained from the position of the calibration mark 33. The rotation angle of the calibration mark is obtained from the direction in which the recognition marks are arranged, for example.

  These parameters are parameters A, B, E, and F of the rotation and magnification components of the inspection substrate PP, calibration marks 33 provided on the inspection substrate PP, and offset amounts X and Y in the XY directions of the respective marks M and inspection. Each of the obtained parameters is stored in the storage device 27.

  Next, the board recognition camera 19 moves above the mark M around the mounted component, picks up and recognizes two marks M on the diagonal line that sandwich the mounted component, and recognizes the position where the mounted component is to be mounted (reference (Position) 37 (see FIG. 9) is obtained (step S4).

Here, the position obtained by recognizing each mark M is corrected using each parameter obtained in step S3 and stored in the storage device 27. For example, the position of each mark M, that is, the coordinates (Px, Py) is corrected using each parameter based on the following equations 1 and 2, and the coordinates (Qx) corresponding to each corrected mark M position are corrected. , Qy), the reference position 37 is obtained. It is also possible to return the coordinates (Qx, Qy) of the corrected mark M to the coordinates before correction (Px, Py) by a return expression.
Qx = (A × Px + B × Py + X) / (1 + C × Px + D × Py) Equation 1
Qy = (E × Px + F × Py + Y) / (1 + C × Px + D × Py) Equation 2
When the illumination lamp 30 is turned on when the mark M is imaged, the inspection substrate PP is irradiated with light (inclined light) obliquely. Then, as shown in FIG. 3, the inspection substrate PP is a milky white glass substrate or ceramic substrate, and when the light from the illumination lamp 30 is obliquely irradiated to the inspection substrate PP, the electronic component 31 and the positioning substrate PP are positioned. The light irradiated to the mark M is reflected and is not imaged by the lens 33, but the light incident on the inside of the inspection substrate PP and irregularly reflected is imaged by the lens 33, and the substrate recognition camera 19 uses the electronic component 31 and the positioning mark. An M transmission image is captured.

  The reference position 37 obtained by recognizing the two marks M is corrected based on the substrate position obtained in step S2.

  Next, the board recognition camera 19 moves above the mounting component 31, captures and recognizes the mounting component 31, and obtains the position and angle (see FIG. 10) of the mounting component 31 (step S5).

  Here, the position obtained by recognizing the mounting component 31 is corrected using each parameter obtained in step S3 and stored in the storage device 27, as in the case of obtaining the reference position described above. For example, the position of the mounting component 31, that is, the coordinates (Px, Py) is corrected using each parameter based on the above-described formulas 1 and 2, and the coordinates (Qx, Qy) that are the positions of the mounting component 31 are corrected. Desired.

  FIG. 11 shows that the coordinate 41 (Px, Py) of the electronic component in the coordinate system of the captured image changes to the corrected coordinate 42 (Qx, Qy) by correcting using the calibration parameters. It is explanatory drawing shown.

  As described above, the position obtained by recognizing the mounting component 31 is corrected by using the calibration parameters obtained in step S3 and stored in the storage device 27. When the position of the mounted component is recognized using the inspection substrate PP, the position can be obtained more reliably.

  Next, the electronic component 31 is mounted from the corrected electronic component position 38 (coordinate of the component recognition result) obtained in step 5 with respect to the position (reference position) 37 where the mounting component obtained in step S4 is to be mounted. A position and angle deviation 39 (see FIG. 12) is obtained (step S6).

  Further, the angle obtained by recognizing the mounting component 31 is corrected based on the angle of the substrate obtained in step S2.

  The obtained mounting position and angle deviation of the electronic component 31 are stored in the storage device 27.

  Thereafter, the steps for obtaining the mounting position and angle deviation of the electronic component 31 from Step 4 to Step 6 described above are repeated for each of the other mounting components 31, and the mounting positions of the electronic components 31 obtained for all the electronic components 31 are repeated. The angle deviation is stored in the storage device 27.

  Then, the usage purpose of the stored mounting position and angle of the electronic component 31, that is, the purpose of the measurement described above is determined (step S <b> 8). When the measurement purpose is to calculate and teach offset data of the electronic component mounting apparatus, use the stored mounting position and angle deviation of the electronic component 31 to calculate and teach the offset data as accurately as possible. The calculated offset data is used as offset data in the X direction, the Y direction, and θ (rotation) for the attachment position of the suction nozzle with respect to the mounting head 6, and the mounting accuracy of the electronic component in the electronic component mounting apparatus 1 is improved. Can be increased.

  Further, when the measurement purpose is to measure the mounting accuracy of the electronic component mounting apparatus 1, the mounting accuracy of the electronic component can be more accurately used by using the mounting position and angle deviation of the electronic component 31 stored in the storage device 27. Can be calculated.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 6 Mounting head 19 Substrate recognition camera 31 Electronic component 33 Calibration mark 34 Recognition mark M Mark PP Inspection substrate

Claims (2)

In the measuring method of the electronic component mounting apparatus for measuring the position of the electronic component held by the mounting head and mounted on the substrate,
Attach the electronic components to the jig substrate with the calibration marks with multiple marks arranged in a matrix,
Recognizing the calibration mark imaged with a camera, obtaining a tilt parameter when one side of the jig substrate is tilted upward ,
An electronic component mounting apparatus measuring method comprising: imaging an electronic component mounted on a jig substrate with a camera to recognize a mounting position; and correcting the position where the electronic component is mounted based on the parameter. In the measuring method of the electronic component mounting apparatus for measuring the position of the electronic component held by the mounting head and mounted on the substrate,
Attach the electronic components to the jig substrate with the calibration marks with multiple marks arranged in a matrix,
Recognizing the calibration mark imaged with a camera, obtaining a tilt parameter when one side of the jig substrate is tilted upward ,
A fiducial mark placed around the electronic component mounted on the jig substrate is imaged and recognized by a camera, the position of the fiducial mark is corrected based on the parameter, and the electronic component of the electronic component is corrected based on the corrected position. Find the reference position,
Recognize the mounting position by imaging the electronic component mounted on the jig substrate with a camera, correct the position where the electronic component is mounted based on the parameter,
A method of measuring an electronic component mounting apparatus, wherein a deviation of a position and an angle where the electronic component is mounted with respect to the reference position is obtained.

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