JP6006048B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and uses a laminated sheet formed by laminating a plurality of adhesive sheets, and can peel off the laminated sheet and stick each adhesive sheet to an adherend. The present invention relates to a sheet sticking apparatus and a sticking method.

A semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) is a non-processed surface treatment that is not performed when a surface treatment such as an etching process or a grinding process is performed in the process of forming a semiconductor chip. A protective sheet is affixed to the non-treated surface so that the surface is not damaged or contaminated by foreign substances such as chemicals, water, shavings, and dust. In addition, the wafer is mounted so that the wafer is not damaged or the semiconductor chip is scattered during the wafer transfer process, wafer singulation process, bonding process for bonding the separated semiconductor chip to a lead frame, etc. Mounting on a ring frame via a sheet for use, a dicing sheet or the like is performed.
Patent Document 1 discloses a sticking device that can stick a protective sheet, and Patent Document 2 discloses a sticking device that can stick a dicing sheet.

JP-A-2005-243888 JP 2005-159044 A

  Known protection sheet sticking device and dicing sheet sticking device, etc. are each configured to independently feed out the protective sheet raw material and the dicing sheet raw material, and to attach the protective sheet and dicing sheet to the adherend, There is an inconvenience that materials such as a release sheet for protecting the adhesive layer of each sheet and a paper tube as a core material for winding the adhesive sheet in a roll shape are wasted. Therefore, the present applicant has proposed a laminated sheet formed by laminating a plurality of adhesive sheets shown in Japanese Patent Application No. 2012-175741, and a sheet sticking apparatus corresponding to the laminated sheet has been awaited.

[Object of invention]
The objective of this invention is providing the sheet sticking apparatus and sticking method which can stick each adhesive sheet to a to-be-adhered body using the laminated sheet comprised by laminating | stacking several adhesive sheets mutually.

In order to achieve the above-mentioned object, the present invention provides a supporting means for supporting a strip-shaped original fabric in which a first adhesive sheet and a second adhesive sheet are laminated together so that the first adhesive sheet and the second adhesive sheet can be fed out. First pasting means for peeling from the sheet and sticking to the first adherend, and second pasting means for sticking the second adhesive sheet from which the first adhesive sheet has been peeled to the second adherend , The original fabric unrolled from the support means is guided to the first attaching means, the first adhesive sheet is attached to the first adherend, and the first adhesive sheet is peeled off by the first attaching means. that was guided continuously to the second attaching means portions to sticking the second adhesive sheet in the second adherend, it adopts a configuration that.

  In the present invention, the second adhesive sheet may be formed in a strip shape, and may include a second cutting unit that can cut the second adhesive sheet into a predetermined shape.

  Further, the first adhesive sheet and the second adhesive sheet are each formed in a strip shape, and a configuration including first and second cutting means capable of cutting the first and second adhesive sheets into predetermined shapes, respectively, is adopted. You can also.

  Furthermore, a configuration is adopted in which a sticking interval adjusting means is arranged between the first sticking means and the second sticking means.

In addition, the sheet sticking method according to the present invention includes a step of feeding a belt-shaped raw material in which a first adhesive sheet and a second adhesive sheet are laminated, and peeling the first adhesive sheet from the second adhesive sheet. a first bonding step of sticking a first adherend, the sheet sticking method and a second bonding step of sticking the second adhesive sheet in which the first adhesive sheet is peeled off to the second adherend, feeding The original fabric is guided, the first adhesive sheet is pasted on the first adherend in the first pasting step, and the raw fabric portion from which the first adhesive sheet is peeled off in the first pasting step is continuously provided. The second adhesive sheet is stuck to the second adherend in the second sticking step in such a way as to guide it .

According to the present invention, the first adhesive sheet is attached to the first adherend from the original fabric in which the first adhesive sheet and the second adhesive sheet are laminated to each other, and the second adhesive sheet is attached to the second adherend. Each adhesive sheet can be affixed to an adherend using a laminated sheet that can be affixed and has been developed so as not to waste materials.
Moreover, unlike patent documents 1 and 2, it is not necessary for each sticking device to have a supporting means for supporting the original fabric, and it is possible to share a part of the devices constituting the sticking device and effectively use the space. It becomes possible.
Furthermore, according to the structure provided with the cutting means, the adhesive sheet can be cut into a predetermined shape as necessary.
Moreover, according to the structure which has arrange | positioned the sticking space | interval adjustment means, when sticking one adhesive sheet of a 1st adhesive sheet and a 2nd adhesive sheet, it can prevent interfering with the sticking operation | movement of the other adhesive sheet. .

(A) is a schematic plan view of the sheet sticking apparatus which concerns on embodiment. The AA arrow line view of FIG. The BA arrow line view of FIG. The CA arrow line view of FIG. (A) is a schematic perspective view of an original fabric, (B) is a cross-sectional view taken along arrow DA of (A), and (C) is a schematic perspective view of an original fabric according to a modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Further, when the direction is indicated in the present embodiment, “up” is the Z-axis arrow direction and “down” is the opposite direction, “left” is the X-axis arrow direction and “right” is the opposite direction, “front” "Is the direction of the arrow on the Y axis and" back "is the opposite direction.

  1-4, the sheet sticking device 10 includes a mounting sheet AS1 as a first adhesive sheet and a protective sheet AS2 as a second adhesive sheet, which are laminated on each other and are attached to the paper tube PP. A support roller 11 as a support means for supporting the rolled raw fabric RS so that it can be fed out, a mounting sheet AS1 is peeled off from the protective sheet AS2, and a ring frame RF as a first adherend and the inner side thereof are arranged. First attaching means 12 for attaching to the back surface of the wafer WF, second attaching means 13 for attaching the protective sheet AS2 from which the mounting sheet AS1 has been peeled off to the surface of the wafer WF as the second adherend, and a protective sheet It comprises a second cutting means 14 capable of cutting the AS 2 into a predetermined shape, and a sticking interval adjusting means 15 provided between the first sticking means 12 and the second sticking means 13. There.

As shown in FIG. 1 and FIG. 5 (B), the mounting sheet AS1 has one surface of a circular first base sheet BS1 that is smaller than the outer diameter of the ring frame RF and larger than the opening (FIG. 5 ( B) The first adhesive layer AD1 is provided on the middle and lower surface side, and is temporarily attached to the second base sheet BS2 of the strip-shaped protective sheet AS2 via the first adhesive layer AD1 at a predetermined interval. . The second base sheet BS2 includes a second adhesive layer AD2 on one side (the lower surface in FIG. 5B), and the release sheet RL is temporarily attached to the second adhesive layer AD2.
As shown in FIG. 5C, the raw fabric RS may be provided with a spacer sheet SS on the upper surface side of the protective sheet AS2.

  The first sticking means 12 includes a plurality of guide rollers 22, a peeling plate 24 as a peeling means for peeling the mounting sheet AS1 from the protective sheet AS2, and a mounting sheet AS1 supported and peeled by the support arm 34. A release sheet RL is provided between the pressing roller 25 as pressing means for pressing and sticking to the ring frame RF and the wafer WF, a driving roller 31 driven by a rotation motor DM1 as a driving device, and the driving roller 31. A linear motor LM1 as a drive device that extends in the left-right direction, and includes a pinch roller 32 that sandwiches the protective sheet AS2 and an inclined roller 36 that guides the protective sheet AS2 with the release sheet RL to the second sticking means 13. Supported by LM1A, with ring frame RF and protective sheet AS2 attached on top It is supported by the frame plate FP1 above the first table 40 capable of holding the Fine WF. In addition, when the original fabric RS provided with the spacer sheet SS is adopted, as shown by a two-dot chain line in FIG. 2, a winding roller 37 driven by a rotation motor DM2 as a driving device is provided, and the winding is performed. The spacer sheet SS may be wound up by the roller 37.

  The second sticking means 13 includes a plurality of guide rollers 41 for guiding the protective sheet AS2 with the release sheet RL guided by the inclined roller 36, and a release plate 48 as a release means for peeling the protective sheet AS2 from the release sheet RL. A driving roller 45 driven by a rotation motor DM3 as a driving device, a pinch roller 46 sandwiching the release sheet RL between the driving roller 45, a winding roller 49 driven by a driving device (not shown), A linear roller LM2 serving as a driving device is rotatably supported by a first slider LM2A and supported by a pressing roller 50 that can be moved up and down by a driving device (not shown) and a second slider LM2B of the linear motor LM2. A peeling roller 61 driven by a rotation motor DM4, and a peeling roller 61, A pinch roller 62 that sandwiches the protective sheet AS2 therebetween and a recovery roller 63 that is driven by a rotation motor DM5 as a driving device, and is supported by a slider LM3A of a linear motor LM3 that is extended in the left-right direction. The second and third frame plates FP2 and FP3 are directly or indirectly supported above the second table 70 capable of holding the wafer WF on the upper surface.

  The second cutting means 14 includes a linear motor LM4 as a drive device, a rotation motor DM6 as a drive device supported by a support arm 65 provided on a slider LM4A of the linear motor LM4, and the rotation motor DM6. The rotary arm 66 is supported by the output shaft DM6A, and the cutting blade 67 is supported by the rotary arm 66.

  The sticking interval adjusting means 15 is rotated by a pair of upper and lower guide rollers 79, two linear motors LM5 and LM6 provided between the guide rollers 79, and sliders LM5A and LM6A of the linear motors LM5 and LM6. The dancer rollers 77 and 78 are supported in a possible manner.

  A grinder 16 that grinds the back surface of the wafer WF to a predetermined thickness is disposed on the right rear side of the second pasting unit 13, and is pasted on the wafer WF on the left front side of the first pasting unit 12. A peeling means 17 for peeling the protective sheet AS2 is disposed, and a dicing means 18 for separating the wafer WF into individual chips to form chips is disposed in front of the peeling means 17.

Next, the sheet sticking operation by the sheet sticking apparatus 10 will be described.
First, the original fabric RS is supported by the support roller 11, and as shown in FIG. 2, the original fabric RS is passed through the first sticking means 12, and the protective sheet AS2 with the release sheet RL folded back by the release plate 24 is attached. Folded by the inclined roller 36. Further, as shown in FIG. 4, the protective sheet AS2 with the release sheet RL folded back by the inclined roller 36 is passed through the pasting interval adjusting means 15, and further, as shown in FIG. Pass the paper through.

  When the wafer WF is placed on the second table 70 waiting at the wafer carry-in position TP1 indicated by a two-dot chain line in FIG. The suction unit that does not suck and holds the wafer WF, and the linear motor LM3 moves the second table 70 to the protective sheet attaching position TP2 indicated by the solid line in FIG.

  When the second table 70 stops at the protective sheet sticking position TP2, the second sticking means 13 drives the drive device and the linear motor LM2 (not shown) and lowers the pressing roller 50 from the position indicated by the solid line in FIG. The pressing roller 50 is moved to the right in the figure, and the protective sheet AS2 is attached to the surface of the wafer WF. Next, after the second cutting means 14 drives the linear motor LM4 and the rotation motor DM6 and lowers the cutter blade 67 to a position where it faces the protective sheet AS2, the cutter blade 67 is moved along the outer edge of the wafer WF. The protective sheet AS2 is cut according to the size of the wafer WF. As a result, the protective sheet AS2A having a predetermined shape is attached to the surface of the wafer WF, and the unnecessary protective sheet AS2B is formed outside the protective sheet AS2A having a predetermined shape. After that, after the second cutting means 14 drives the linear motor LM4 and raises the cutter blade 67, the second sticking means 13 drives the linear motor LM2 and a driving device (not shown), and the pressing roller 50 is shown by a solid line in FIG. Return to the position indicated by. Next, the second sticking means 13 drives the linear motor LM2 and the rotation motor DM4 to rotate the driving roller 61 and the pinch roller 62, and from the position indicated by the solid line in FIG. 3 to the position indicated by the two-dot chain line in FIG. The drive roller 61 and the pinch roller 62 are moved, and the unnecessary protective sheet AS2B is peeled off from the second table 70. Then, after the linear motor LM3 has moved the second table 70 to the wafer transfer position TP3 indicated by the two-dot chain line in FIG. 1, the linear motor LM2 is in a state where the second pasting means 13 has stopped the rotation motor DM4. Then, the rotation motor DM5 is driven, and the driving roller 61 and the pinch roller 62 are returned to the positions indicated by the solid lines in FIG. 3, whereby the protective sheet AS2 having a certain length is pulled out in preparation for the next sticking.

When the second table 70 moves to the wafer transfer position TP3, transfer means (not shown) holds the wafer WF with the protective sheet AS2A having a predetermined shape, transfers the wafer WF into the grinder 16, and the wafer WF Then, it is ground until it reaches a predetermined thickness. When the wafer WF is transferred into the grinder 16, the linear motor LM3 returns the second table 70 to the wafer carry-in position TP1, and thereafter the same operation of applying the protective sheet AS2 is repeated.
The wafer WF ground to a predetermined thickness by the grinder 16 is shown on the first table 40 on which the ring frame RF is placed and is waiting at the wafer mounting position TP4 indicated by the two-dot chain line in FIG. The protective sheet AS2A having a predetermined shape is placed on the lower side by the transfer means that does not. Thereafter, a suction unit (not shown) sucks and holds the wafer WF, and the linear motor LM1 moves the first table 40 to the mount sheet attaching position TP5 indicated by a two-dot chain line in FIG. When the first table 40 reaches the mount sheet attaching position TP5, the first attaching means 12 drives the rotation motor DM1, and feeds out the raw fabric RS in accordance with the moving speed of the first table 40 to separate the mounting sheet AS1. Then, the mounting sheet AS1 is affixed to the ring frame RF and the wafer WF to form an integrated object WK1 in which the wafer WF is integrated with the ring frame RF via the mounting sheet AS1. Thereafter, when the first table 40 reaches the one-piece transfer position TP6 indicated by the solid line in FIGS. 1 and 2, the linear motor LM1 stops the movement of the first table 40. Here, since the sticking interval adjusting means 15 is disposed between the first sticking means 12 and the second sticking means 13, the sticking operation of the other sticking means is hindered by the sticking operation of one sticking means. In order to prevent this, the sticking interval adjusting means 15 drives the linear motors LM5 and LM6 and moves the dancer rollers 77 and 78 up and down. When the first table 40 stops at the integrated object transfer position TP6, a transfer means (not shown) holds the integrated object WK1, transfers the integrated object WK1 into the peeling means 17, and the peeling device 17 performs wafer transfer. The protective sheet AS2A having a predetermined shape attached to the surface of the WF is peeled off. When the wafer WF is transferred into the peeling means 17, the linear motor LM1 returns the first table 40 to the wafer mounting position TP4, and thereafter the same operation of attaching the mounting sheet AS1 is repeated. The integrated object WK1 from which the protective sheet AS2A having a predetermined shape is peeled off is transferred to the dicing means 18 by a transfer means (not shown), and is separated into a predetermined chip size by the dicing means 18. Thereafter, the integrated object WK1 is transferred to an integrated object unloading position TP7 indicated by a two-dot chain line in FIG. 1 and then transferred to another process such as a bonding process by a transfer means (not shown). Thereafter, the above operation is repeated in the same manner.

  Therefore, according to such a second embodiment, the mounting sheet AS1 is attached to the ring frame RF and the wafer WF from the raw fabric RS in which the mounting sheet AS1 and the protective sheet AS2 are laminated to each other, and the protective sheet AS2 is attached. Each adhesive sheet can be affixed to an adherend using a raw fabric RS that can be affixed to the wafer WF and is not wastefully consumed.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary, and can adopt various configurations shown below.

For example, in the said embodiment, although it was set as the sheet sticking apparatus provided with the 1st and 2nd sticking means 12 and 13, it does not prevent providing a 3rd or more sticking apparatus. In this case, a raw material in which three or more adhesive sheets are laminated may be used so that they are sequentially peeled off by three or more sticking apparatuses and stuck to a predetermined adherend.
In addition, when a sheet having a protection sheet AS2 is used as the raw fabric RS, the sheet protection sheet AS2 is peeled off from the release sheet RL like the first sticking means. What is necessary is just to set it as the structure to stick, and in this case, the 2nd cutting means 14 can be abbreviate | omitted.
Further, when the belt-like mounting sheet AS1 is laminated on the raw fabric RS or when the mounting sheet AS1 larger than the size of the ring frame RF is adopted, as shown by the two-dot chain line in FIG. After affixing the mounting sheet AS1 to the RF and wafer WF, the first cutting means 43 that cuts the belt-like sheet in a closed loop shape according to the size of the ring frame RF may be employed. Note that the configuration of the first cutting means 43 can be the same as that of the second cutting means 14, and the description thereof is omitted. In this case, a winding device (not shown) is also provided so that an unnecessary sheet portion outside is generated by cutting.
Further, the support means may be a curved member or a plurality of rollers that can support the roll-shaped original fabric from below the outer edge.
The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).
Further, the peeling means may be constituted by a roller or the like, and the pressing means may be constituted by what is applied by blowing a gas or the like, and an alternative member having substantially the same action can be applied.
Further, the adherend in the present invention is not limited to the ring frame RF and the wafer WF, but also any other plate-like member such as an optical disk substrate, a glass plate, a steel plate, a ceramic, a wooden plate, or a resin plate. Members and articles can also be targeted. The semiconductor wafer may be a silicon wafer or a compound wafer.
Moreover, the raw fabric RS may be a laminate of known adhesive sheets other than the mounting sheet and the protective sheet, and the first and second adhesive sheets are not different in characteristics and are the same type of adhesive sheet. It may be.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Support roller (support means)
DESCRIPTION OF SYMBOLS 12 1st sticking means 13 2nd sticking means 14 2nd cutting means 15 Sticking space | interval adjustment means 43 1st cutting means AS1 Mounting sheet (1st adhesive sheet)
AS2 protective sheet (second adhesive sheet)
RF ring frame (first adherend)
RS raw fabric WF semiconductor wafer (first adherend, second adherend)

Claims (3)

A support means for supporting the belt-shaped original fabric in which the first adhesive sheet and the second adhesive sheet are laminated with each other so as to be able to be fed out;
A first attaching means for separating the first adhesive sheet from the second adhesive sheet and attaching the first adhesive sheet to the first adherend;
A second sticking means for sticking the second adhesive sheet from which the first adhesive sheet has been peeled off to the second adherend ,
The raw material fed out from the support means is guided to the first sticking means to stick the first adhesive sheet to the first adherend, and the original adhesive sheet is peeled off by the first sticking means. A sheet sticking apparatus , wherein the opposite portion is continuously guided to the second sticking means to stick the second adhesive sheet to the second adherend .   The sheet sticking apparatus according to claim 1, wherein the second adhesive sheet is formed in a strip shape and includes a second cutting unit capable of cutting the second adhesive sheet into a predetermined shape. A step of feeding a belt-shaped raw material in which the first adhesive sheet and the second adhesive sheet are laminated to each other;
A first pasting step of peeling the first adhesive sheet from the second adhesive sheet and pasting it on the first adherend;
In the sheet sticking method comprising the second sticking step of sticking the second adhesive sheet from which the first adhesive sheet has been peeled off to the second adherend,
The unrolled raw material is guided and the first adhesive sheet is pasted on the first adherend in the first pasting step, and the original fabric part from which the first adhesive sheet is peeled off in the first pasting step A sheet sticking method characterized by continuously guiding and sticking the second adhesive sheet to the second adherend in the second sticking step .

Images