JP5990418B2 - On-vehicle electronic control device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a vehicle-mounted electronic control device having a board on which electronic components are mounted and a connector connected to the board.

  Various electronic control devices such as for engine control, motor control, and automatic transmission control are mounted on vehicles such as automobiles. These on-vehicle electronic control devices are installed in places with large vibrations, such as engine rooms, engines, and automatic transmissions. For this reason, vibration resistance is required for the on-vehicle electronic control device.

  As an in-vehicle electronic control device, a metal base having a frame portion formed around a rectangular flat plate portion, a flexible board on which various electronic components are mounted, and a connector, a resin material is entirely placed in the frame portion of the metal base. A structure that is filled and integrally formed is known (see, for example, Patent Document 1).

JP 2006-190725 A

  In the on-vehicle electronic control device described in Patent Document 1, the flexible substrate and the connector are supported by a metal base having a frame portion frame portion, and are covered with a resin filled in the frame portion. For this reason, the metal base has a large area, is heavy, and is expensive.

The vehicle-mounted electronic control device according to the present invention includes a frame member having a plurality of attachment portions and formed with an opening penetrating in a thickness direction, and is integrated on one surface of the frame member, A resin container having a recess having an opening communicating with the opening , and a plurality of substrate support portions provided in the recess, and an electronic component are mounted and accommodated in the recess of the resin container and the substrate support A substrate supported by a portion, a connector having a plurality of connection pins, one end of which is connected to the substrate and the other end of which is exposed to the outside of the resin container; A sealing material formed so as to cover the electronic component, wherein the elastic modulus of the frame member is larger than the elastic modulus of the resin container and the sealing material.
The vehicle-mounted electronic control device according to the present invention includes a frame member having a plurality of attachment portions and having an opening that penetrates in the thickness direction, and the opening of the frame member integrated with the frame member. A resin container having a concave portion communicating with a portion and a plurality of substrate support portions provided in the concave portion, and an electronic component are mounted, accommodated in the concave portion of the resin container, and supported by the substrate support portion A substrate, a connector having a plurality of connection pins, one end connected to the substrate and the other end exposed to the outside of the resin container; and the substrate and the electronic component are covered in the recess of the resin container. And a support member to which the attachment portion of the frame member is attached, and a separate member from the connector at least partially covered by the sealant. The connector is the support member Through in the thickness direction, are connected to the external terminal, the elastic modulus of the frame member, being larger than the elastic modulus of the resin container and the sealing member.
The on-vehicle electronic device manufacturing method of the present invention is the on-vehicle electronic control device manufacturing method, wherein the sealing material in the on-vehicle electronic device is formed by injecting a fluid resin material into the recess. It is formed.

  According to the present invention, the resin container is integrally provided on the frame member having the opening, and the sealing material is formed in the recess of the resin container. For this reason, weight reduction can be achieved and a price can be reduced.

1 shows an embodiment of an on-vehicle electronic control device according to the present invention, (A) is a cross-sectional view of the on-vehicle electronic control device, and (B) is a plan view of the on-vehicle electronic control device in (A) as viewed from below. . The disassembled perspective view of the state which reversed the vehicle-mounted electronic control apparatus illustrated by FIG. 1 (A) and 1 (B) upside down. (A)-(D) are sectional drawings for demonstrating the manufacturing method of the vehicle-mounted electronic control apparatus illustrated by FIG. 1 (A) and 1 (B). The modification of Embodiment 1 is shown, (A)-(C) are sectional drawings for demonstrating the manufacturing method. (A)-(C) are sectional drawings for demonstrating the process following FIG. 4 (A)-(C). The top view which showed Embodiment 2 of the vehicle-mounted electronic control apparatus of this invention, and was seen from the downward direction. Sectional drawing of Embodiment 4 of the vehicle-mounted electronic control apparatus of this invention. (A) And (B) is sectional drawing for demonstrating the manufacturing method of the vehicle-mounted electronic control apparatus of Embodiment 4. FIG. Embodiment 5 of the vehicle-mounted electronic control apparatus of this invention is shown, (A) is sectional drawing, (B) and (C) are sectional drawings for demonstrating the manufacturing method of Embodiment 5. FIG. Embodiment 6 of the vehicle-mounted electronic control apparatus of this invention is shown, (A) is the sectional drawing, (B) is the top view which looked at the vehicle-mounted electronic control apparatus in (A) from the bottom. The figure for demonstrating Embodiment 7 of the vehicle-mounted electronic control apparatus of this invention, and explaining the method of producing by transfer molding. Sectional drawing of Embodiment 8 of the vehicle-mounted electronic control apparatus of this invention. Modification 1 of Embodiment 8 of the vehicle-mounted electronic control apparatus of this invention. Modification 2 of Embodiment 8 of the vehicle-mounted electronic control apparatus of this invention. Modification 3 of Embodiment 8 of the vehicle-mounted electronic control device of the present invention. Modification 4 of Embodiment 8 of the vehicle-mounted electronic control apparatus of this invention. Modification 5 of Embodiment 8 of the vehicle-mounted electronic control apparatus of this invention. The figure of the vehicle-mounted electronic control apparatus as a comparative example. The characteristic view which shows the relationship between a resonant frequency, the elasticity modulus of a frame member, and a fixed number. The figure which shows the structure of each embodiment of this invention and a comparative example, and the evaluation result of a test.

Hereinafter, an embodiment of an on-vehicle electronic control device according to the present invention will be described with reference to the drawings.
Embodiment 1
[Structure of in-vehicle electronic control unit]
FIG. 1 shows an embodiment of an on-vehicle electronic control device according to the present invention. FIG. 1 (A) is a cross-sectional view of the on-vehicle electronic control device, and FIG. 1 (B) is an on-vehicle electronic control device in FIG. It is the top view which looked at the electronic controller from the lower part. FIG. 2 is an exploded perspective view of the on-vehicle electronic control device illustrated in FIGS. 1A and 1B in an upside down state.
The on-vehicle electronic control device 1 includes a frame member 10, a resin container 20, a circuit board (substrate) 30, a connector 40, and a sealing material 50.
The frame member 10 is formed of FRP (fiber reinforced resin), and includes a rectangular main body 11 and four attachment portions 12 provided on the outer periphery of the central portion of each side. The main body 11 has an opening 11a that is opened in a rectangular shape, and each attachment portion 12 has a through hole 12a in the center. As will be described later, through a through hole 12a formed in each attachment portion 12, a fastening member is inserted and fixed to a support member such as a chassis or a bracket of the vehicle. The main body part 11 and the attachment part 12 are made of a material having an elastic modulus of 10 GPa or more. The elastic modulus of the frame member 10 is larger than the elastic modulus of the resin container 20 and the sealing material 50.

  The upper side of the resin container 20 is open and has an inclined side surface that expands from the bottom 21 toward the upper surface 22 (see FIG. 2), and the interior of the resin container 20 faces from the bottom 21 to the upper surface 22. A conical recess 23 having a truncated pyramid shape is formed. The recess 23 is provided with a substrate support 24 that rises from the bottom 21 and extends to the middle of the depth of the recess 23. A pair of substrate support portions 24 are provided at corners on one diagonal line of the bottom portion 21 and are not provided on the other diagonal lines.

The circuit board 30 is, for example, a double-sided circuit board, and a plurality of electronic components 31 and 32 for control are mounted on both sides. The control electronic components mounted on the circuit board 30 include a microcomputer and a power semiconductor element, and an ECU (electronic control unit) is configured. In the illustrated example, the electronic component 32 is a power semiconductor element and is mounted on the surface of the circuit board 30 opposite to the bottom 21 of the resin container 20. The circuit board 30 is accommodated in the recess 23 of the resin container 20 in a state where the electronic components 31 and 32 are mounted, and is supported by the pair of board support parts 24.
In FIG. 1B, the circuit board 30 is not shown.

  The connector 40 includes a plurality of connection pins 42 and a resin main body 41 that covers the outer periphery of the connection pins 42. One end 42 a of the connection pin 42 is inserted into a through hole provided in the circuit board 30 and soldered to a connection pad (not shown) provided in the circuit board 30. The other end 42 b of the connection pin 42 is inserted through a through hole provided in the resin container 20 and protrudes to the outside.

The recess 23 of the resin container 20 is filled with a sealing material 50, and the outer surfaces of the electronic components 31 and 32 and the front and back surfaces of the circuit board 30 are covered with the sealing material 50.
The sealing material 50 is formed of a resin and ensures reliability such as vibration resistance and salt water resistance in addition to heat resistance and waterproofness. It is preferable that a gap of at least 0.5 mm is formed between the upper surface of the electronic component 31 mounted on the circuit board 30 and the inner surface of the bottom portion 21 of the resin container 20. If the gap is 0.5 mm or less, the thickness of the sealing material 50 that goes into the gap between the top surface of the electronic component 31 and the bottom portion 21 of the resin container 20 becomes thin, and cracks are likely to occur due to insufficient strength.
In FIG. 2, the sealing material 50 is not shown.

When the electronic components 31, 32 or the connection pins 42 are soldered to the circuit board 30, the solder distortion is reduced by the sealing material 50, and the reliability of soldering is improved. Further, since the resin has a higher thermal conductivity than air, the heat dissipation is improved by covering the circuit board 30 on which the electronic components 31 and 32 are mounted with the sealing material 50.
Furthermore, in the present embodiment, the sealing material 50 also has a function of holding the circuit board 30 in contact with the board support portion 24.

The connector 40 is bonded to the resin container 20 with an adhesive 61 provided between the bottom surface of the main body 41 and the bottom 21 of the resin container 20.
The resin container 20 is bonded to the frame member 10 with an adhesive 62. That is, the connector 40, the resin container 20, and the frame member 10 are integrated by adhesion.
As the adhesives 61 and 62, for example, a silicone adhesive, an epoxy resin adhesive, a polyurethane adhesive, a bismaleimide adhesive, a phenol resin adhesive, an acrylic resin adhesive, or the like can be used.
When the resin container 20 is formed of a thermoplastic resin, the resin container 20 is melted using vibration heat by ultrasonic vibration or heating by laser irradiation, and joined to the frame member 10 and / or the connector 40 by this molten layer. It is possible. In this case, the adhesive 61 and / or the adhesive 62 are not necessary.

[Manufacturing method of in-vehicle electronic control device]
With reference to FIGS. 3A to 3D, an example of a method for manufacturing the on-vehicle electronic control device according to the embodiment will be described.
As shown in FIG. 3A, the opening side of the recess 23 of the resin container 20 faces the frame member 10 side, and the resin container 20 is bonded to the frame member 10 with an adhesive 62. For bonding, the opening edge of the recess 23 of the resin container 20 is aligned with the opening 11 a of the frame member 10.

  Further, the connection pin 42 of the connector 40 is inserted into a through hole provided in the bottom portion 21 of the resin container 20, and the main body portion 41 is bonded to the upper surface of the bottom portion 21 of the resin container 20 by the adhesive 61. In this state, one end 42 a of each connection pin 42 is disposed at a predetermined position in the depth direction in the recess 23 of the resin container 20. In order to improve the bonding strength, a recess is formed in the bonding portion between the bottom portion 21 of the resin container 20 and the connector 40. The recess may be omitted.

After the frame member 10, the resin container 20, and the connector 40 are integrated, the assembly is turned upside down as shown in FIG.
A through hole into which the connection pin 42 is inserted is formed in the circuit board 30 on which the electronic components 31 and 32 are mounted. The circuit board 30 is inserted into the resin container by inserting the through hole from one end 42a of the connection pin 42. 20 substrate support portions 24 are brought into contact with each other. The board support 24 is provided at a position corresponding to each corner on one diagonal line of the circuit board 30, and the circuit board 30 is held by the pair of board support 24.
In this state, each connection pin 42 is soldered to a connection pad (not shown) of the circuit board 30.

  Soldering may be local bonding in which a laser beam is irradiated to a soldering portion. When the electronic components 31 and 32 are mounted on the circuit board 30 by soldering, melting of the solder can be prevented by performing local bonding. When the solder at the soldered portion is melted, the positions of the electronic components 31 and 32 are shifted or the bonding force is reduced. Local bonding can prevent remelting of the solder and ensure the reliability of electrical connection. The substrate support 24 may be used for alignment with the circuit board 30. In this way, when the circuit board 30 is soldered, the solder connection location can be automatically recognized.

  Instead of soldering, the connector 40 and the circuit board 30 may be electrically connected by press-fitting the connection pins 42 into the via holes of the circuit board 30. In this case, the connection pin 42 may be of a type in which a slit for reducing the diameter by elastic deformation is formed in the axial direction.

  The electrical connection between the connector 40 and the circuit board 30 can also be performed by reflow. In the case of reflow, a small electronic component 31 such as a chip component is arranged on the bottom 21 side (lower surface side) of the resin container 20 in the circuit board 30, and a large electronic component 32 such as a microcomputer is placed on the resin on the circuit board 30. It is preferable to arrange it on the opening side (upper surface side) of the recess 23 of the container 20. By doing in this way, the large-sized electronic component 32 arrange | positioned at the lower surface side of the circuit board 30 can be prevented. In the case of reflow, the electronic component 32 disposed on the upper surface side of the circuit board 30 can be soldered when the connection pins 42 of the connector 40 are soldered.

After the electrical connection between the circuit board 30 and the connector 40 is performed, the sealing material 50 is formed in the recess 23 of the resin container 20. FIG. 3C shows a method of forming the sealing material 50 by a potting method.
A fluid resin 50 a is discharged from the nozzle 55 and injected into the recess 23 of the resin container 20. The circuit board 30 is supported by a pair of board support portions 24 provided at positions corresponding to the respective corners on the pair of diagonal lines of the circuit board 30 in the recess 23 of the resin container 20. A gap is formed between the circuit board 30 and the peripheral edge of the recess 23 in a region excluding the portion supported by the above. For this reason, the resin 50 a goes from the gap to the lower surface side of the circuit board 30 and is filled in the recess 23 between the circuit board 30 and the bottom 21 of the resin container 20.

As described above, if a gap of at least 0.5 mm is provided between the upper surface of the electronic component 31 mounted on the circuit board 30 and the inner surface of the bottom portion 21 of the resin container 20, the resin 50a on this portion can be removed. The wraparound is also reliable, ensuring reliability.
The resin 50 a is filled in the recess 23 until it covers the upper surface of the electronic component 32 mounted on the upper surface side of the circuit board 30. The resin 50a is preferably filled in the opening 11a of the frame member 10 until it reaches the middle of the thickness of the frame member 10. By doing in this way, the adhesive strength of the resin container 20 and the frame member 10 can be improved with the resin 50a.

When a predetermined amount of fluid resin 50a is filled in the recess 23 of the resin container 20, the sealing material 50 is formed by curing the resin 50a by heating or the like.
Thereby, the vehicle-mounted electronic control apparatus 1 shown by FIG. 1 (A) is produced.
The in-vehicle electronic control device 1 is fixed to a vehicle member in an engine room, for example. As shown in FIG. 3D, a fastening member 56 such as a bolt is inserted into the through hole 12a of the mounting portion 12, and the in-vehicle electronic control device 1 is fixed to the vehicle member (support member) 91 by fastening. .

According to the one embodiment, the frame member 10, the resin container 20, and the connector 40 are integrated, and the recess 23 of the resin container 20 is used as a container for the sealing material 50. The circuit board 30 is housed and assembled in the recess 23 of the resin container 20 in a state where the electronic components 31 and 32 are mounted in advance.
As described above, the assembly of electronic components and the container are separately prepared and assembled, so that maintenance of electronic components that require management of temperature, humidity, air cleanliness, and the like is facilitated. Further, the assembly is completed by a simple process in which the circuit board 30 is supported by the board support portion 24 and the connection pins 42 of the connector 40 are connected to the connection pads of the circuit board 30 and are fixed by the sealing material 50 in this state. Therefore, it is excellent in mass productivity.

Since the frame member 10 has the opening 11a of a size through which the circuit board 30 is inserted, the frame member 10 is light in weight and can be reduced in price by reducing the material. By using FRP having a high elastic modulus as the frame member 10, the weight can be reduced as compared with the case of a metal material.
Since the opening part 11a is formed in the frame member 10, vibration resistance falls. However, since the sealing material 50 is filled in the recess 23 of the resin container 20 integrated with the frame member 10, the rigidity is increased and the vibration resistance can be improved.

The resonance frequency of the frame member 10 varies depending on the elastic modulus of the frame member 10 and the number (fixed number) of locations where the attachment portion 12 is fixed to the support member.
FIG. 19 illustrates the relationship between the resonance frequency and the elastic modulus and fixed number of the frame member 10.
As shown in FIG. 19, the resonance frequency increases as the elastic modulus increases. Further, in relation to the fixed number, the greater the fixed number, the higher the resonance frequency. That is, as the fixed number increases, the rigidity of the frame member 10 increases and the resonance frequency increases.

In the engine room, the resonance frequency is greater than 2KH _Z, the degree of vibration is not a problem has been confirmed.
Referring to FIG. 19, the attachment portion 12 shown in the embodiment four and the, in the case of 4-point fixed, the elastic modulus exceeds about 3 GPa, the resonant frequency is greater than 2KH _Z, at least, an elastic modulus If is 10 GPa or more, resonance is not a problem.
Similarly, in the case of fixing at three points, if the elastic modulus is 20 GPa or more, resonance is not a problem. When fixed at 2 points, it is almost the same as when fixed at 3 points, but when the elastic modulus is about 20 GPa, it is delicate whether resonance is a problem, and if it is 25 GPa or more, there is no problem. Is clear.

[Modification of Embodiment 1]
4 (A) to 4 (C) and FIGS. 5 (A) to 5 (C) show modifications of the on-vehicle electronic control device shown in the first embodiment.
Below, the structure and manufacturing method of the vehicle-mounted electronic control apparatus 1 shown in a modification are demonstrated. However, in the following description, the difference from the in-vehicle electronic control device 1 shown in FIGS. 3A to 3D will be mainly described, and the same components are denoted by the same reference numerals for the same configurations. Therefore, the description is omitted.
In the vehicle-mounted electronic control device 1 shown in the first modification, the substrate support 24 provided in the recess 23 of the resin container 20 has a columnar portion 25 protruding at the upper end thereof toward the opening side of the recess 23. Is formed. In addition, a through hole 33 is formed in the circuit board 30 at a position corresponding to the columnar portion 25. The resin container 20 is formed of a thermoplastic resin, and the columnar portion 25 is formed such that its height is larger than the thickness of the circuit board 30.

  The frame member 10, the resin container 20, and the connector 40 are integrated using adhesives 61 and 62, and the integrated assembly is turned upside down as shown in FIG. Then, the alignment between the through-hole 33 and the columnar portion 25 of the circuit board 30 is performed.

As shown in FIG. 4B, the through hole 33 of the circuit board 30 is inserted into the columnar part 25 of the resin container 20, and the circuit board 30 is pushed down to contact the substrate support part 24. At this time, the connection pins 42 of the connector 40 are inserted through through holes (not shown) provided in the circuit board 30.
In a state where the circuit board 30 is in contact with the board support portion 24, the upper end portion of the columnar portion 25 protrudes from the circuit board 30.

  As shown in FIG. 4C, the upper part of the columnar portion 25 protruding from the circuit board 30 is thermocompression bonded by a thermocompression bonding tool 58. Thereby, when the upper part of the columnar part 25 is melted to form a large diameter part 25a and cooled, the circuit board 30 is held by the large diameter part 25a so as not to come out of the columnar part 25.

As shown in FIG. 5A, the assembly in this state is turned upside down, and the connection pins 42 of the connector 40 and the circuit board 30 are soldered by spot flow (local soldering). The substrate support portions 24 provided in the resin container 20 are provided at each corner portion on the pair of diagonal lines of the bottom portion 21, and the columnar portions 25 are formed on the respective substrate support portions 24. In the state shown in FIG. 5A, the circuit board 30 is supported by the large-diameter portion 25a of the pair of columnar portions 25 and does not fall.
In the spot flow, the jet guide member 59 is provided so that the periphery of the soldering region does not contact the solder jet 57, and the solder jet flows between the one end 42a of the connection pin 42 and the connection pad (not shown) of the circuit board 30. It is immersed in 57 and soldered.
Therefore, the entire one end 42a of the connection pin 42 protruding from the upper part of the circuit board 30 is covered with solder. Thereby, the reliability of soldering can be made high.

Thereafter, as shown in FIG. 5B, as in the case of the first embodiment, the resin 50a having fluidity is filled into the recess 23 of the resin container 20 by the potting method, and the resin 50a is cured. Then, the sealing material 50 is formed. Thereby, the vehicle-mounted electronic control apparatus 1 of a modification is produced.
The vehicle-mounted electronic control device 1 of the modified example is also fixed to the vehicle member 91 by a fastening member 56 such as a bolt as shown in FIG.

  The on-vehicle electronic control device 1 shown in the modification also has the same effect as that of the first embodiment. Further, in the modification, the connection pins 42 of the connector 40 and the connection pads of the circuit board 30 can be connected by a spot flow with high soldering reliability. Even in the spot flow, remelting of the solder of the electronic components 31 and 32 soldered to the circuit board 30 can be prevented.

The vehicle-mounted electronic control device 1 of the present invention can employ various embodiments.
Embodiments 2 to 8 will be described below.
And the test result obtained by the various tests performed with respect to each embodiment is shown in comparison with a comparative example, and the effect of the present invention will be specifically described.

Embodiment 2
The on-vehicle electronic control device 1 according to the second embodiment is obtained by producing the frame member 10 according to the first embodiment from CFRP (carbon fiber reinforced resin) having an elastic modulus of 100 GPa.
The on-vehicle electronic control device 1 is fixed at two points.
FIG. 6 is a plan view of the in-vehicle electronic control device 1 according to the second embodiment as viewed from below, similarly to FIG.
The on-vehicle electronic control device 1 illustrated in FIG. 6 is different from that illustrated in FIG. 1B in that there are two mounting portions 12 provided on the frame member 10. .
Each attachment portion 12 is provided on the outer peripheral side edge of the pair of short sides of the rectangular frame member 10. The in-vehicle electronic control device 1 according to the second embodiment is fixed to the vehicle member 91 by two fastening members 56 that are inserted through the through holes 12a of the pair of attachment portions 12.

Embodiment 3
The on-vehicle electronic control device 1 according to Embodiment 3 is obtained by manufacturing the frame member 10 according to Embodiment 1 from aluminum having an elastic modulus of 70 GPa.
The on-vehicle electronic control device 1 is fixed at two points as in the second embodiment. That is, it is the same as the in-vehicle electronic control device 1 shown in FIG.

-Embodiment 4-
FIG. 7 shows a cross-sectional view of Embodiment 4 of the present invention.
In the vehicle-mounted electronic control device 1 according to the fourth embodiment, the connector portion 40A is formed integrally with the resin container 20A by, for example, injection molding.
FIGS. 8A and 8B are cross-sectional views for explaining a method for manufacturing the on-vehicle electronic control device of the fourth embodiment.
The resin container 20A in which the connector portion 40A is integrally molded is bonded to the frame member 10 using an adhesive 62. A through hole 44 to which the connection pin 42 is attached is formed in the connector portion 40A. The through hole 44 of the connector 40A is preferably formed at the time of molding, but may be formed by machining after molding.

Each connecting pin 42 is provided with a stopper portion 42c having a large diameter at an intermediate portion in the length direction, and the connecting pin 42 is pushed in until the stopper portion 42c contacts the connector portion 40A. The connection pin 42 is preferably a type having elasticity that reduces in the radial direction by press-fitting into the through hole 44.
By preliminarily sealing the through hole 44 with a highly thixotropic epoxy resin, silicone resin, or the like, it is possible to completely prevent resin leakage when the sealing material 50 is formed.
Thereby, the assembly illustrated in FIG. 8B is manufactured. This assembly corresponds to the assembly illustrated in FIG. Therefore, thereafter, the vehicle-mounted electronic control device 1 according to the fourth embodiment can be manufactured by the same steps as those shown in FIG.
In addition, the vehicle-mounted electronic control device 1 of Embodiment 4 was manufactured as a two-point fixing structure by forming the frame member 10 from aluminum.

  The on-vehicle electronic control device 1 according to the fourth embodiment can reduce the price because the connector portion 40A is integrally formed with the resin container 20A. Moreover, since the process of joining the connector 40 and the resin container 20 can be reduced, mass productivity is good. In the above-described embodiment, the stopper 42c is provided on the connection pin 42 so as to be in close contact with the connector 40A, and the through-hole 44 is sealed with a resin having strong thixotropy, so that the resin 50a during potting leaks from the connector 40A. Can be prevented.

-Embodiment 5-
FIG. 9 shows Embodiment 5 of the on-vehicle electronic control device of the present invention, FIG. 9 (A) is a cross-sectional view, and FIGS. 9 (B) and 9 (C) are shown in FIG. 9 (A). It is sectional drawing for demonstrating the manufacturing method of the mounted vehicle-mounted electronic control apparatus.
A feature of the in-vehicle electronic control device 1 shown in the fifth embodiment is that it is formed as a frame container 100 in which the frame member 10, the resin container 20, and the connector 40 in the first embodiment are integrated.
As a fourth embodiment, the frame container 100 inserts the frame member 10 into a mold when the resin container 20A in which the connector portion 40A illustrated in FIG. 8A is integrated is formed by injection molding. And mold.

After the frame container 100 is manufactured, it is manufactured by the same method as in the fourth embodiment.
In the frame container 100 in which the resin container 20A having the connector portion 40A and the frame member 10 are integrated by insert molding, the connection pins 42 are attached to the connector portion 40A as shown in FIG. 9B. A through hole 44 is formed.
In this state, as shown in FIG. 9C, each connection pin 42 is press-fitted into the through hole 44 to a depth where the stopper portion 42c contacts the connector portion 40A.
Thereafter, by performing the same steps as in the fourth embodiment, the in-vehicle electronic control device 1 in the fifth embodiment is manufactured.
In addition, the vehicle-mounted electronic control device 1 according to the fifth embodiment is manufactured as a two-point fixing structure by forming the frame member 10 from aluminum.

  The on-vehicle electronic control device 1 according to the fifth embodiment uses a frame container 100 in which a frame member 10 is integrally molded together with a connector portion 40A and a resin container 20A. Therefore, the price can be further reduced as compared with the case of the fourth embodiment. Further, since the process of joining the resin container 20A and the frame member 10 to the fourth embodiment can be reduced, the mass productivity is further improved.

Embodiment 6
10 shows Embodiment 6 of the on-vehicle electronic control device of the present invention, FIG. 10 (A) is a sectional view thereof, and FIG. 10 (B) shows the on-vehicle electronic control device in FIG. 10 (A). It is the top view seen from the bottom.
The on-vehicle electronic control device 1 according to the sixth embodiment is different from the fifth embodiment in that a heat radiating plate 71 is disposed on the upper surface of the sealing material 50 (located below in FIG. 10A). It is different.

The resin container 20 </ b> A is provided with a step portion 28 on the frame member 10 side, and the heat radiating plate 71 is disposed on the step portion 28. In the circuit board 30, an electronic component 32 having a large calorific value, such as a power semiconductor element, is disposed on the opening side of the recess 23 of the resin container 20 </ b> A, and a material having high thermal conductivity is used as the sealing material 50. By doing so, the heat radiated from the electronic components 31 and 32 can be efficiently radiated from the heat radiating plate 71.
The on-vehicle electronic control device 1 according to the sixth embodiment is manufactured as a two-point fixing structure by forming the frame member 10 from aluminum.

-Embodiment 7-
FIG. 11 shows a seventh embodiment of the on-vehicle electronic control device of the present invention, and is a diagram for explaining a method of making a transfer mold.
The on-vehicle electronic control device 1 of Embodiment 7 is characterized in that the sealing material 50 in the on-vehicle electronic control device 1 of Embodiment 6 is formed by transfer molding. Everything else is the same as the in-vehicle electronic control device 1 of the sixth embodiment.

As shown in FIG. 11, a frame container 100 in which a frame member 10 is integrally molded with a resin container 20 </ b> A having a connector portion 40 </ b> A is accommodated in a chamber 81, and the frame member 10 is formed by an upper mold 82 and a lower mold 83. And the heat-softened resin 50b is press-fitted into the chamber 81. If the elastic modulus of the frame member 10 clamped by the upper mold 82 and the lower mold 83 is low, the possibility of resin leakage increases.
In Embodiment 7, since the frame member 10 is made of aluminum having an elastic modulus of 70 GPa, there is an effect of preventing resin leakage. Further, since the sealing material 50 is formed by transfer molding, the molding cycle is fast and the dimensional accuracy can be increased.

-Eighth embodiment-
FIG. 12 is a cross-sectional view of Embodiment 8 of the on-vehicle electronic control device of the present invention.
The on-vehicle electronic control device 1 according to the eighth embodiment is characterized in that it includes a plurality of connectors.
As illustrated in FIG. 12, the on-vehicle electronic control device 1 according to the eighth embodiment includes a second connector 45 with respect to the on-vehicle electronic control device 1 illustrated in FIG. 9A. It is different.
The second connector 45 is disposed on the opposite side of the circuit board 30 from the connector portion 40A. The second connector 45 has a root side buried in the sealing material 50, and a distal end side protruding outward from the upper surface of the sealing material 50.

  For example, if the circuit board 30 on which the electronic components 31 and 32 are mounted includes a control circuit for engine control and automatic transmission control, the connector portion 40A is used for the engine, and the second connector 45 is used for the automatic transmission. Can be connected. In this way, a plurality of control functions can be integrated, and the vehicle space and price can be reduced.

  In order to manufacture the in-vehicle electronic control device 1 according to the eighth embodiment, the second connector 45 is mounted on the circuit board 30 together with the electronic components 31 and 32. If it does in this way, since it will be in the state where the 2nd connector 45 was additionally mounted in the circuit board 30 in FIG. 3 (B) of Embodiment 1, after this, after FIG. What is necessary is just to perform a process.

[Modification 1 of Embodiment 8]
FIG. 13 shows a first modification of the eighth embodiment of the in-vehicle electronic control device of the present invention.
The modification 1 is different from the in-vehicle electronic control device 1 of FIG. 12 in that a heat radiating plate 72 is disposed on the electronic component 32. The effect of the heat sink 72 is as described for the sixth embodiment.

[Modification 2 of Embodiment 8]
FIG. 14 shows a second modification of the eighth embodiment of the in-vehicle electronic control device of the present invention.
In the second modification, another vehicle member 92 is arranged below the vehicle member 91.
The in-vehicle electronic control device 1 according to Modification 2 is not different in basic structure from the in-vehicle electronic control device 1 illustrated in FIG. In the second modification, the connection pin 46 of the second connector 45 is connected to another vehicle member 92 via a cable 47 inserted through a through hole provided in the vehicle member 91.

[Modification 3 of Embodiment 8]
FIG. 15 shows a third modification of the on-vehicle electronic control device according to the eighth embodiment of the present invention.
The modification 3 is characterized in that the connector part 40A and the connector part 40B are provided side by side. That is, the frame container 100 is formed by integrally molding the connector portions 40A and 40B as the resin container 20A and then integrating the frame member 10 by insert molding. With such a structure, it is possible to reduce the component price of the second connector 45 and to make the mounting work on the circuit board 30 efficient.

[Modification 4 of Embodiment 8]
FIG. 16 shows a fourth modification of the on-vehicle electronic control device according to the eighth embodiment of the present invention.
Modification 4 is basically the same as Modification 3. The difference from the modification 3 is that the pitches of the connection pins provided in the connector part 40A and the connector part 40B are different.
That is, the pitch of the connection pins 48 of the connector part 40B is smaller than the pitch of the connection pins 42 of the connector part 40A. The connector portions 40A and 40B may have different numbers, lengths, and the like in addition to the pitch of the connection pins 42 and 48.

FIG. 17 shows a fifth modification example of the eighth embodiment of the vehicle-mounted electronic control device of the invention.
Modification 5 is different from Modification 4 shown in FIG. 16 in that the orientations of connector portions 40A and 40B are different.
In FIG. 17, the connection pin 42 of the connector portion 40A extends perpendicularly from the one end 42a connected to the circuit board 30 to the circuit board 30 and is bent 90 degrees to the left on the other end 42b side. On the other hand, the connection pin 48 of the connector part 40B extends perpendicularly to the circuit board 30 from one end 48a connected to the circuit board 30, and is bent 90 degrees rightward on the other end 48b side.

  With this structure, when the vehicle members to which the connector portions 40A and 40B are connected are arranged in different directions, it is easy to connect the cables that connect the connector portions 40A and 40B and the vehicle members. can do.

[Test evaluation]
FIG. 20 shows an evaluation result obtained by conducting various tests on the in-vehicle electronic control device 1 shown as the first to eighth embodiments and comparing it with a comparative example.
20, embodiment 1 is for both structures shown in FIGS. 1 and 3, and embodiment 8 is for the structure shown in FIG.

The comparative example has the structure shown in FIG.
The electronic control device 200 of the comparative example has a base 201 with a frame 201a formed around it, and a circuit board 203 on which an electronic component 202 is mounted is placed on the upper surface of the base 201. The base 201 is made of aluminum. A through hole is formed in the base 201, and a connector 204 is mounted on the back side of the circuit board 203 through the through hole. The connection pins 205 of the connector 204 penetrate the circuit board 203 and are soldered on the surface side of the circuit board 203. A sealing material 206 is filled inside the frame 201 a of the base 201. The sealing material 206 was formed by transfer molding. There are two fixing portions 201b of the base 201.

In FIG. 20, with respect to the weight in the evaluation column, compared to the comparative example, x is equivalent, △ is when the weight reduction is less than 10%, ◯ is when the weight reduction is 10% or more and less than 50%, and the weight is reduced. Is indicated by.
Regarding the solder reliability, evaluation was performed by performing a temperature cycle of −40 ° C. to 125 ° C., but since all are equivalent to the comparative example, all the embodiments are marked with ◯.
The heat dissipation was evaluated by performing an operation test in a constant temperature bath at 120 ° C.
Regarding mass productivity, the case where the process length after mounting the circuit board is equivalent to that of the comparative example is indicated by 〇, and the case where the process length is shortened compared with the comparative example is indicated by ◎.
Regarding the cost, a case equivalent to the comparative example is indicated by Δ, a case where it is reduced from the comparative example is indicated by ◯, and a case where it is significantly reduced by the comparative example is indicated by ◎.

Referring to FIG. 20, regarding the heat dissipation, all the embodiments are better or equivalent than the comparative example with respect to other evaluation items, except that the first to fifth embodiments are inferior to the comparative example. Can be confirmed.
In particular, regarding weight and cost, all of Embodiments 1 to 8 are better than the comparative example.

As described above, according to the first to eighth embodiments of the present invention, there is an effect that the on-vehicle electronic control device 1 can be reduced in weight and price.
Moreover, from the evaluation result that Embodiments 5-8 are equivalent to a comparative example regarding heat dissipation, if a heat sink is used, it is equivalent to the case where the opening part is not formed and the whole surface is a solid metal base. It has been found that it is possible to provide heat dissipation. Moreover, even when a heat radiating plate is provided, it is possible to achieve weight reduction and price reduction.

With respect to vibration resistance, resonant frequency if 2KH _Z, if four fixed, it has been found there is no problem if the above elastic modulus 10 GPa. Further, from FIG. 19, it was also found that if the elastic modulus is 25 GPa or more, there is no problem even if fixing at 2 to 4 points.

By filling the concave portion 23 of the resin container 20 with the sealing material 50, the rigidity is increased and the resonance frequency can be increased. Since the circuit board 30 is supported by the substrate support portions 24 provided at each corner on the diagonal line provided in the resin container 20 when the sealing material 50 is filled, the circuit of the resin 50a having fluidity is employed. The wraparound to the back surface side of the substrate 30 can be ensured.
When the sealing material 50 is formed by transfer molding, a high elastic modulus material is used as the frame member 10 and the frame member 10 is clamped by the upper and lower molds 82 and 83, so that resin leakage can be prevented. .

  In the above embodiments, the elastic modulus of the frame member 10 is made larger than the elastic modulus of the resin container 20 and the sealing material 50. For this reason, the resonance frequency is increased, and the vibration control is suitable as a vehicle-mounted electronic control device having a large vibration such as in an engine room.

  By making the connection pins 42 of the connector 40 and the circuit board 30 soldered locally, it is possible to ensure the reliability of joining of the electronic components 31 and 32 soldered to the circuit board 30.

  Since the connector portion 40A is integrally formed with the resin container 20A, the parts cost can be reduced, and the process of joining the connector 40 and the resin container 20 becomes unnecessary, and the mass productivity can be improved. Further, resin leakage from the connector 40 can be prevented in the step of forming the sealing material 50.

  Since the resin container 20A integrated with the connector part 40A and the frame member 10 are integrated by insert molding to produce the frame container 100, the mass productivity can be further improved.

Since the second connector 45 is mounted on the circuit board 30 and the vehicle-mounted electronic control device 1 is provided with a plurality of connectors, a plurality of control functions can be integrated, thereby reducing vehicle space and cost. be able to.
Moreover, since the resin container 20A is formed by integrally molding the connector portions 40A and 40B, mass productivity can be improved in addition to the integration of a plurality of control functions.
Furthermore, since the connector portions 40A and 40B are configured so as to be directed in different directions in accordance with the arrangement of the vehicle members, the connection of the cables becomes easy and the mass productivity can be improved.

  In the above embodiment, the case where FRP or aluminum is used as the material of the frame member 10 is exemplified. However, the material of the frame member 10 is not limited to this, and, for example, copper, iron, or the like having a higher elastic modulus than aluminum can be used.

  Referring to FIG. 20, all of Embodiments 2 to 8 are exemplified as fixed at 2 points, but in each of these embodiments, naturally, fixed at 3 points and fixed at 4 points can be used.

  Although the substrate support portion 24 is exemplified as a structure formed on a pair of diagonal lines, the position, number, and shape of the substrate support portion 24 can be appropriately changed. The point is that the resin 50a, 50b injected into the recess 23 may have a structure in which an interval is formed between the resin container 20 and the back surface of the circuit board.

The circuit board 30 is exemplified as a single layer, but may be a multilayer board or a plurality of boards.
In addition, the type, structure, shape, and the like of the connector are not limited to those illustrated in the embodiment, and various types including, for example, a movable contact portion can be used.

The on-vehicle electronic control device of the present invention can also be applied by appropriately combining the above-described embodiments.
In addition, various modifications can be applied within the scope of the invention. In short, a frame member having an opening and a resin container in which a recess is formed corresponding to the opening of the frame member. And a substrate on which the electronic component is mounted and disposed in the recess, a connector for connecting the substrate and the external member, and a sealing material filled in the recess so as to cover the electronic component and the substrate It is sufficient that the elastic modulus of the frame member is larger than the elastic modulus of the resin container and the sealing material.

DESCRIPTION OF SYMBOLS 1 Vehicle-mounted electronic control apparatus 10 Frame member 11 Main body part 12 Mounting part 20, 20A Resin container 23 Recessed part 24 Substrate support part 30 Circuit board (board | substrate)
31, 32 Electronic component 40 Connector 40A, 40B Connector portion 42, 46, 48 Connection pin 45 Second connector 50 Sealing material 50a, 50b Resin 61, 62 Adhesive 71, 72 Heat sink 100 Frame container

Claims (15)

A frame member having a plurality of mounting portions and having an opening penetrating in the thickness direction;
A resin container having a recess integrated with the frame member on one surface of the frame member and having an opening communicating with the opening of the frame member ; and a plurality of substrate support portions provided in the recess;
An electronic component is mounted, and is accommodated in the concave portion of the resin container and supported by the substrate support portion,
A connector having a plurality of connection pins, one end of which is connected to the substrate and the other end of which is exposed to the outside of the resin container;
In the recess of the resin container, and a sealing material formed to cover the substrate and the electronic component,
The on-vehicle electronic control device according to claim 1, wherein an elastic modulus of the frame member is larger than an elastic modulus of the resin container and the sealing material.   2. The on-vehicle electronic control device according to claim 1, wherein the frame member is formed of a fiber reinforced resin having an elastic modulus of 10 GPa or more, and the attachment portion is provided at four or more locations on an outer periphery of the frame member. A vehicle-mounted electronic control device.   2. The on-vehicle electronic control device according to claim 1, wherein the frame member is formed of a material having an elastic modulus of 25 GPa or more, and the attachment portion is provided at two to four locations on an outer periphery of the frame member. In-vehicle electronic control device.   2. The on-vehicle electronic control device according to claim 1, wherein the frame member is formed of a metal having an elastic modulus of 70 GPa or more, and the attachment portion is provided at two or three locations on an outer periphery of the frame member. A vehicle-mounted electronic control device. The on-vehicle electronic control device according to claim 1, wherein the connection pin is held in a state of being fitted into a through hole provided in the resin container.   The on-vehicle electronic control device according to claim 1, further comprising a heat dissipation plate, wherein the heat dissipation plate is embedded in the sealing material with one surface exposed. apparatus.   2. The on-vehicle electronic control device according to claim 1, wherein a part of the plurality of connection pins has the other end facing a direction different from the other.   The in-vehicle electronic control device according to claim 1, further comprising another connector, wherein the another connector is at least partially covered with the sealing material. apparatus. A frame member having a plurality of mounting portions and having an opening penetrating in the thickness direction;
A resin container having a recess integrated with the frame member and communicating with the opening of the frame member and a plurality of substrate support portions provided in the recess;
An electronic component is mounted, and is accommodated in the concave portion of the resin container and supported by the substrate support portion,
A connector having a plurality of connection pins, one end of which is connected to the substrate and the other end of which is exposed to the outside of the resin container;
In the recess of the resin container, a sealing material formed to cover the substrate and the electronic component,
A connector different from the connector, at least a part of which is covered with the sealing material;
A support member to which the attachment portion of the frame member is attached ;
The another connector penetrates the support member in the thickness direction and is connected to an external terminal ,
The on-vehicle electronic control device according to claim 1, wherein an elastic modulus of the frame member is larger than an elastic modulus of the resin container and the sealing material . The in-vehicle electronic control device according to any one of claims 1 to 9, prior Symbol resin container and the frame member, and the resin container and the connector, at least one has been formed by thermoplastic resin An in-vehicle electronic control device characterized by being integrated by a bonding layer . The on-vehicle electronic control device according to any one of claims 1 to 9 , wherein the connector is integrated with the resin container by molding. The in-vehicle electronic control device according to claim 11, wherein the frame member, the vehicle-mounted electronic control apparatus characterized by being integrated into the front Symbol resin container. A method of manufacturing a vehicle electronic control device according to any one of claims 1 to 9, wherein the sealing material, characterized by that will be formed by injecting a fluid resin material into said recess A method for manufacturing an on-vehicle electronic control device. 14. The method for manufacturing an on-vehicle electronic control device according to claim 13 , wherein the sealing material is injected by a potting method . A method of manufacturing a vehicle electronic control unit according to claim 13, injection of the sealing material, manufacturing method of the on-vehicle electronic control device, characterized in that is by transfer molding.

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