JP5970941B2 - Light reflecting laminate and semiconductor light emitting device - Google Patents

Description

  The present invention relates to a light reflecting laminate and a semiconductor light emitting device using the light reflecting laminate.

  An LED element, which is one of semiconductor light emitting devices, is widely used as a light source for an indicator lamp or the like because it is small and has a long lifetime and is excellent in power saving. In recent years, LED elements with higher brightness have been manufactured at a relatively low cost, and therefore, use as a light source to replace fluorescent lamps and incandescent bulbs has been studied. When applying to such a light source, in order to obtain a large illuminance, a plurality of LED elements are arranged on a surface-mounted LED package, that is, a metal substrate (LED mounting substrate) such as aluminum, and each LED element. A system is often used in which a reflector (reflector) that reflects light in a predetermined direction is disposed around the.

For example, in Patent Document 1, it is reflected by a white thermosetting silicone resin composition containing a thermosetting organopolysiloxane, a white pigment, an inorganic filler (excluding a white pigment), a condensation catalyst, and a predetermined coupling agent. An optical semiconductor case constituting a body has been proposed.
Further, Patent Document 2 proposes a package molded body that enhances light reflection by coating a predetermined part with a coating member containing a specific thermosetting resin and an inorganic member.

JP 2009-221393 A JP 2005-136378 A

In these patent documents, the effect of the white pigment or the inorganic member is actually confirmed only when titanium oxide is used, and the effect when other pigments or inorganic members are used is specifically described. Not disclosed.
In addition, since the refractive index of titanium oxide is as high as about 2.71 for rutile crystals and about 2.52 for anatase crystals, it is a very useful material for white pigments or inorganic members used for reflection. Absorption of light occurs near the wavelength of 411 nm and also at the wavelength of about 387 nm in the anatase crystal, thereby inhibiting the reflection of ultraviolet light. Further, the photocatalytic action may accelerate the deterioration of the resin, which is not practical.

On the other hand, white pigments other than titanium oxide, such as aluminum oxide, do not absorb ultraviolet light, but have a low refractive index of about 1.76. Is impractical because it must be
In addition, high-efficiency light reflection in a wide wavelength range improves the light emission efficiency of optical products that use ultraviolet light and prevents deterioration due to ultraviolet light. It is expected to improve the color rendering properties.

  As described above, the present invention provides a light reflection laminate having high reflection characteristics not only for light in the visible light region but also for ultraviolet light having a wavelength of 400 nm or less, and a semiconductor light emitting device including the light reflection laminate. For the purpose.

  As a result of intensive studies to achieve the above object, the present inventor has found that the object can be achieved by the following present invention. That is, the present invention is as follows.

[1] A resin composition comprising a resin composition layer A comprising a resin composition containing titanium oxide particles, and non-titanium oxide particles of at least one of boron nitride particles, melamine cyanurate particles, aluminum oxide particles, and magnesium oxide particles. And a resin composition layer B made of a product, and the resin composition layer B and the resin composition layer A are sequentially formed from the light incident side.
[2] The light reflecting laminate according to [1], wherein the non-titanium oxide particles are at least one of boron nitride particles and melamine cyanurate particles.
[3] The light reflecting laminate according to [1] or [2], wherein each of the resin composition layer A and the resin composition layer B has a thickness of 50 to 200 μm.
[4] The resin composition layer B is further provided, and the resin composition layer B, the resin composition layer A, and the resin composition layer B are sequentially formed from the light incident side. [1] to [3] The light reflection laminated body in any one.
[5] An optical semiconductor element and a reflector provided around the optical semiconductor element and reflecting light from the optical semiconductor element in a predetermined direction are provided on a substrate, and at least a light reflecting surface of the reflector A semiconductor light-emitting device, part of which comprises the light-reflecting laminate according to any one of [1] to [4].

  According to the present invention, there are provided a light reflecting laminate having high reflection characteristics not only for light in the visible light region but also for ultraviolet light having a wavelength of 400 nm or less, and a semiconductor light emitting device including the light reflecting laminate. Can do.

It is a schematic sectional drawing which shows an example of the semiconductor light-emitting device of this invention. It is a schematic sectional drawing which shows an example of the semiconductor light-emitting device of this invention. It is a figure which shows the reflectance in the area | region of wavelength 300-800 nm of the light reflection laminated body of Examples 1-5 and Comparative Example 1. FIG. It is a figure which shows the reflectance in the area | region of wavelength 300-800 nm of the light reflection laminated body of the comparative examples 3 and 4. FIG. It is a figure which shows the reflectance in the wavelength range of 300-800 nm of the light reflector of the comparative examples 1, 2, and 5. FIG. It is a figure which shows the reflectance in the area | region with a wavelength of 300-800 nm of the light reflector of the comparative example 6.

[1. Light reflecting laminate]
The light reflecting laminate of the present invention includes a resin composition layer A composed of a resin composition containing titanium oxide particles, and non-oxidized at least one of boron nitride particles, melamine cyanurate particles, aluminum oxide particles, and magnesium oxide particles. And a resin composition layer B made of a resin composition containing titanium particles, and the resin composition layer B and the resin composition layer A are sequentially formed from the light incident side.

Since the particles contained in the resin composition layer B on the light incident side are non-titanium oxide particles, they do not absorb ultraviolet light like titanium oxide and reflect ultraviolet light. For this reason, the ultraviolet light can be reflected mainly by the resin composition layer B. Moreover, since a certain amount of ultraviolet light is reflected on the resin composition layer B side, the ultraviolet light transmitted to the resin composition layer A side is reduced. Therefore, deterioration of the resin component due to the reaction between the ultraviolet light and the titanium oxide particles contained in the lower layer is suppressed. Visible light transmitted without being reflected by the resin composition layer B is reflected by the resin composition layer A containing titanium oxide particles. As a result, the reflectance of light from the ultraviolet region to the visible region can be increased.
On the other hand, when the resin composition layer A is on the light incident side, ultraviolet light is absorbed by the titanium oxide particles, so that the ultraviolet light can hardly be reflected and is not transmitted. It cannot be reflected by. Moreover, deterioration of resin will be accelerated | stimulated with photocatalysis.
Below, each layer of the light reflection laminated body of this invention is demonstrated.

(Resin composition layer B)
The resin composition layer B is made of a resin composition containing non-titanium oxide particles of at least one of boron nitride particles, melamine cyanurate particles, aluminum oxide particles, and magnesium oxide particles, and substantially does not contain titanium oxide particles. .

  The boron nitride particles according to the present invention are applied to any of hexagonal structure (h-BN), zinc blende structure (c-BN), wurtzite structure (w-BN), and rhombohedral structure (r-BN). Although possible, the so-called hexagonal boron nitride particles having a scale shape are preferable from the viewpoint of heat resistance and cost.

  The average particle diameter of the boron nitride particles is preferably 0.1 to 300 μm, more preferably 0.1 to 12 μm, and further preferably 0.5 to 2 μm. The average particle diameter can be obtained as a mass average value D50 in particle size distribution measurement by a laser light diffraction method (the same applies to other particles described below).

  The content of the boron nitride particles is preferably 10 to 300 parts by mass, more preferably 20 to 200 parts by mass, and preferably 25 to 100 parts by mass with respect to 100 parts by mass of the resin component in the resin composition. More preferably it is. As long as the moldability is not impaired, 300 parts or more may be filled.

The melamine cyanurate according to the present invention refers to a compound in which melamine molecules and cyanuric acid molecules are arranged in a plane by hydrogen bonds and represented by the chemical formula C ₆ H ₉ N ₉ O _3. ) Or a structural formula such as formula (2).

  The method for producing melamine cyanurate particles is not particularly limited as long as it can be produced so as to have a specific particle diameter, and can be produced by a conventionally known method. For example, JP-A-5-310716, It can be produced with reference to the descriptions in Kaihei 7-149739 and JP-A-7-224049.

As an example of a method for producing melamine cyanurate particles, melamine powder and cyanuric acid were charged at a predetermined mixing ratio into a device capable of mixing and stirring, and the temperature inside the tank was raised to a predetermined temperature while mixing. Then, when water is gradually added to the tank while stirring and neutralization reaction is performed, a white precipitate is generated, and the precipitate is filtered and dried and granulated. The method of obtaining the melamine cyanurate particle | grains of this is mentioned.
In addition, the melamine cyanurate particle | grains can also be obtained as a commercial item.

  The average particle size of the melamine cyanurate particles is preferably 0.1 to 100 μm, more preferably 0.2 to 20 μm, and more preferably 0.5 to 4 μm from the viewpoint of production and reflection characteristics. Further preferred.

  The content of the melamine cyanurate particles is preferably 5 to 300 parts by mass, more preferably 10 to 200 parts by mass, and further preferably 15 to 150 parts by mass with respect to 100 parts by mass of the resin component. It is preferably 20 to 115 parts by mass. In addition, as long as a moldability is not impaired, you may fill 300 mass parts or more.

As the aluminum oxide particles according to the present invention, various aluminum oxide particles such as α-alumina and γ-alumina can be used. The production method of alumina is not particularly limited as long as it can be produced so as to have a specific particle size and purity, and can be produced by a conventionally known method. For example, a method in which metallic aluminum powder is introduced into an oxidation flame, a method in which alumina powder is spheroidized by being melted in a flame and then cooled and solidified, a combination of these, alumina ball mill, vibrating ball mill, jet Examples thereof include a method of pulverizing with a general pulverizer such as a mill and a planetary mill.
The average particle diameter of the aluminum oxide particles is preferably 0.1 to 100 μm, more preferably 0.1 to 20 μm, and further preferably 0.5 to 10 μm.

  The content of the aluminum oxide particles is preferably 10 to 600 parts by mass, more preferably 30 to 500 parts by mass, and 45 to 400 parts by mass with respect to 100 parts by mass of the resin component in the resin composition. More preferably it is.

The magnesium oxide particles according to the present invention are not particularly limited as long as they can be produced so as to have a specific particle size and purity, and can be produced by a conventionally known method. For example, it can be produced by firing magnesium hydroxide or magnesium carbonate.
The average particle diameter of the magnesium oxide particles is preferably 0.1 to 100 μm, more preferably 0.1 to 20 μm, and further preferably 0.5 to 10 μm.

  The content of the magnesium oxide particles is preferably 10 to 500 parts by mass, more preferably 20 to 400 parts by mass, and 40 to 300 parts by mass with respect to 100 parts by mass of the resin component in the resin composition. More preferably it is.

  From the viewpoint of improving dispersibility, each of the above particles may be subjected to a hydrophobic treatment. Representative examples of the hydrophobizing agent include silane coupling agents, silicone oils, fatty acids, and fatty acid metal salts. Among these, a silane coupling agent and silicone oil are preferably used because they have a high effect of improving dispersibility.

Examples of the silane coupling agent include disilazane such as hexamethyldisilazane; cyclic silazane; trimethylsilane, trimethylchlorosilane, dimethyldichlorosilane, methyltrichlorosilane, allyldimethylchlorosilane, benzyldimethylchlorosilane, methyltrimethoxysilane. , Methyltriethoxysilane, isobutyltrimethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, trimethylmethoxysilane, hydroxypropyltrimethoxysilane, phenyltrimethoxysilane, n-butyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-octadecyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, Alkyl silane compounds such as vinyltriacetoxysilane; γ-aminopropyltriethoxysilane, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ- (2-aminoethyl) aminopropylmethyldimethoxysilane, N-phenyl Aminosilane compounds such as -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxysilane, and N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane And the like.
Examples of the silicone oil include dimethylpolysiloxane, methylhydrogenpolysiloxane, methylphenylpolysiloxane, and amino-modified silicone oil. These hydrophobizing agents can be used alone or in combination of two or more.

  The method for hydrophobizing the particles is not particularly limited as long as it is a conventionally known method, and examples thereof include a dry method and a wet method. Specifically, a dry method in which the hydrophobic treatment agent is dropped or sprayed while stirring the particles at a high speed; a wet method in which the hydrophobic treatment agent is dissolved in an organic solvent, and the particles are added while stirring the organic solvent; And the like.

The resin component in the resin composition includes epoxy resin, acrylic resin, urethane resin, silicone resin, polysiloxane-organic block copolymer, polysiloxane-organic graft copolymer, carbon-carbon double bond reactive with SiH group. A thermosetting resin such as an organic-inorganic hybrid resin, a cyanate ester resin, a phenol resin, a polyimide resin, or a bismaleimide resin, or a resin obtained by ring-opening metathesis polymerization of an acrylic resin, a polycarbonate resin, a norbornene derivative, or a norbornene derivative Cycloolefin resins such as hydrogenated products, olefin-maleimide resins, polyester resins, polysulfone resins, polyether resins, polyoxybenzylene resins, polyphenylene oxide resins, polyethersulfone resins Polyphenylene sulfide resin, polyether ether ketone resin, polyether imide resin, polyether ketone ketone resin, polyphenylene ether resin, polyimide resin, polyimide amide resin, polyarylate resin, polyvinyl acetal resin, polyethylene resin, polypropylene resin, polymethylpentene Resins, polystyrene resins, polyamide resins, wholly aromatic polyester resins (liquid crystal resins), resins obtained by singly or copolymerizing vinyl monomers, thermoplastic resins such as fluororesins and rubber-like resins may be used.
As the thermosetting resin, a silicone resin (including a silicone-modified resin) is preferable from the viewpoint of light resistance. The thermoplastic resin is preferably a norbornene polymer, a polymethylpentene resin, or a polypropylene resin from the viewpoint of light resistance.

  Here, there are addition type silicone and condensation type silicone as the curing type of the silicone resin, and examples of the structure include dimethyl silicone and methylphenyl silicone. For example, the condensation type silicone is a thermosetting organopolysiloxane obtained by hydrolysis reaction of methyltrichlorosilane, methyltrimethoxysilane, methyltriethoxysilane, tetrachlorosilane, tetramethoxysilane, tetraethoxysilane or the like.

  Examples of the norbornene polymer include a ring-opening polymer of a monomer having a norbornene structure, a ring-opening polymer of a monomer having a norbornene structure and another monomer, or a hydride thereof; a norbornene structure Examples thereof include addition polymers of monomers, addition polymers of monomers having a norbornene structure and other monomers, or hydrides thereof. Among these, a ring-opening (co) polymer hydride of a monomer having a norbornene structure is particularly preferably used from the viewpoints of moldability, heat resistance, low hygroscopicity, dimensional stability, lightness, and the like. Can do.

  Examples of polymethylpentene include a homopolymer of 4-methylpentene-1 and a copolymer of 4-methylpentene-1 and other olefins. Examples of copolymers of 4-methylpentene-1 and other olefins include 4-methylpentene-1 and α-olefins such as ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-hexene, With an α-olefin having 2 to 20 carbon atoms such as octene, 1-decene, 1-dodecene, 1-tetradecene, 1-octadecene, 1-eicocene, 3-methyl-1-butene, 3-methyl-1-pentene, etc. Mention may be made of copolymers. When a copolymer of 4-methylpentene-1 and another olefin is used, the copolymer preferably contains 90 mol% or more of 4-methyl-1-pentene.

  In the present invention, among the exemplified polymethylpentenes, a homopolymer of 4-methylpentene-1 can be preferably used. Among these, a homopolymer of 4-methylpentene-1 having a polymerization average molecular weight (Mw) of 1000 or more, particularly 5000 or more is preferable. According to these polymethylpentenes, the heat resistance of the reflector can be further improved. In addition, the molecular weight of the homopolymer of 4-methylpentene-1 is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography.

  Further, the norbornene polymer and the polymethylpentene resin may have a three-dimensional network structure. In the three-dimensional network structure, heat resistance and reflection performance are expected to be further improved.For example, it can be obtained by crosslinking between molecules by reacting with a crosslinking treatment agent that causes an ultraviolet crosslinking reaction or an electron beam crosslinking reaction. it can. In addition to this, a resin having a three-dimensional network structure can be obtained by using a copolymer obtained by copolymerizing monomers of a crosslinking agent that causes an ultraviolet crosslinking reaction or an electron beam crosslinking reaction.

(Resin composition layer A)
The resin composition layer A is made of a resin composition containing titanium oxide particles. The titanium oxide particles may be any of a rutile type, anatase type and brookite type, but a rutile type is preferred. Moreover, it is preferable to suppress deterioration of the resin component by subjecting the titanium oxide particles to a surface treatment as necessary to reduce the photocatalytic action. Examples of the surface treating agent include a silane coupling agent, a titanium coupling agent, an organic acid, a polyol, and silicone.

The average particle diameter of the titanium oxide particles is preferably 0.1 to 20 μm, and more preferably 0.5 to 5 μm.
The content of the titanium oxide particles is preferably 5 to 500 parts by mass and more preferably 20 to 250 parts by mass with respect to 100 parts by mass of the resin component in the resin composition.

  In the resin composition layer A, those listed in the resin composition layer B can be used as the resin component in the resin composition. In this case, the resin component of the resin composition layer A may be the same as or different from the resin component used in the resin composition layer B.

  Each thickness of the resin composition layer A and the resin composition layer B is preferably 50 to 100 μm, and more preferably 75 to 100 μm. Further, the ratio of the thickness of the resin composition layer A to the resin composition layer B (resin composition layer A / resin composition layer B) is preferably 1/3 to 3, preferably 1/2 to 2. More preferably. When the ratio is 1 to 2, the film thickness can be reduced while keeping the reflectance high.

  The resin composition layer A and the resin composition layer B can contain various additives as long as the effects of the present invention are not impaired. For example, various whisker, silicone powder, thermoplastic elastomer, organic synthetic rubber, fatty acid ester, glycerate ester, zinc stearate, calcium stearate and other additives such as internal mold release agents for the purpose of improving the properties of the resin composition Can be blended.

When the light reflecting laminate of the present invention is a sheet, it can be produced, for example, as follows.
That is, while supplying the raw material to be a resin component and a composition containing titanium oxide particles from the first extruder, the raw material to be a resin component and a composition containing non-titanium oxide particles are supplied from a second extruder, A light-reflecting laminate in which the resin composition layer A and the resin composition layer B are laminated and integrated can be manufactured by co-extrusion in a sheet form from a co-extrusion die connected to the first and second extruders. .

  In addition, the light reflection laminated body of this invention can be made into the multilayered structure of 3 or more layers. For example, the resin composition layer B, the resin composition layer A, and the resin composition layer B are sequentially formed from the light incident side, or transparent between the resin composition layer B and the resin composition layer A. It is good also as a structure which provided the intermediate | middle layer.

  The light reflecting laminate of the present invention as described above can be applied to various uses. For example, the present invention can be applied as a reflector for a light source for a light reflection sheet or LED for a solar battery or a television.

[2. Semiconductor light emitting device]
As illustrated in FIG. 1, the semiconductor light emitting device of the present invention is provided around an optical semiconductor element (for example, an LED element) 10 and the optical semiconductor element 10, and reflects light from the optical semiconductor element 10 in a predetermined direction. The reflecting body 12 is provided on the substrate 14. And at least one part (all in the case of FIG. 1) of the light reflection surface of the reflector 12 is comprised by the light reflection laminated body of the above-mentioned this invention.

  The optical semiconductor element 10 emits radiated light (generally UV or blue light in a white light LED), for example, an active layer made of AlGaAs, AlGaInP, GaP or GaN sandwiched between n-type and p-type cladding layers. It is a semiconductor chip (light emitter) having a double heterostructure, and has a hexahedral shape with a side length of about 0.5 mm, for example. In the case of wire bonding mounting, it is connected to an electrode (connection terminal) (not shown) via a lead wire 16.

The shape of the reflector 12 conforms to the shape of the end portion (joint portion) of the lens 18 and is usually a cylindrical shape such as a square shape, a circular shape, an elliptic shape, or a ring shape. In the schematic cross-sectional view of FIG. 1, the reflector 12 is a cylindrical body (annular body), and all end surfaces of the reflector 12 are in contact with and fixed to the surface of the substrate 14.
In addition, in order to improve the directivity of the light from the optical semiconductor element 10, the inner surface of the reflector 12 may be expanded upward in a tapered shape (see FIG. 1).
The reflector 12 can also function as a lens holder when the end portion on the lens 18 side is processed into a shape corresponding to the shape of the lens 18.

  As shown in FIG. 2, the reflector 12 may have only the light reflection surface side as a light reflection layer 12a made of the light reflection laminate of the present invention. In this case, the thickness of the light reflection layer 12a is preferably 500 μm or less, and more preferably 300 μm or less, from the viewpoint of reducing the thermal resistance. The member 12b on which the light reflecting layer 12a is formed can be made of a known heat resistant resin.

  As described above, the lens 18 is provided on the reflector 12, but this is usually made of resin, and various structures may be adopted and colored depending on the purpose and application.

  The space formed by the substrate 14, the reflector 12, and the lens 18 may be a transparent sealing portion, or may be a gap if necessary. This space portion is usually a transparent sealing portion filled with a light-transmitting and insulating material, and the force applied by directly contacting the lead wire 16 in wire bonding mounting and indirectly. Prevents electrical defects caused by the lead wire 16 being disconnected, cut, or short-circuited from the connection portion with the optical semiconductor element 10 and / or the connection portion with the electrode due to applied vibration, impact, etc. can do. At the same time, the optical semiconductor element 10 can be protected from moisture, dust, etc., and the reliability can be maintained over a long period of time.

  Examples of the material (transparent encapsulant composition) that imparts light-transmitting properties and insulating properties usually include silicone resins, epoxy silicone resins, epoxy resins, acrylic resins, polyimide resins, polycarbonate resins, and the like. Of these, silicone resins are preferred from the viewpoints of heat resistance, weather resistance, low shrinkage, and discoloration resistance.

Below, an example of the manufacturing method of the optical semiconductor device shown in FIG. 1 is demonstrated.
First, the reflector 12 having a predetermined shape is molded from the reflector resin composition of the present invention by transfer molding, compression molding, injection molding or the like using a mold having a cavity space having a predetermined shape. Thereafter, the separately prepared optical semiconductor element 10, electrodes and lead wires 16 are fixed to the substrate 14 with an adhesive or a bonding member, and further fixed to the reflector 12 on the substrate 14. Next, a transparent sealant composition containing a silicone resin or the like is poured into the recess formed by the substrate 14 and the reflector 12, and cured by heating, drying, or the like to form a transparent sealing portion. Thereafter, the lens 18 is disposed on the transparent sealing portion to obtain the semiconductor light emitting device shown in FIG.
In addition, after mounting the lens 18 in a state where the transparent sealant composition is uncured, the composition may be cured.

  There is no limitation in particular about the luminescent color of the light emitting element of a semiconductor light-emitting device, White light may be sufficient and the semiconductor light emitting element of desired luminescent color can also be used. In order to develop white light, one LED chip emitting three primary colors having a red emission wavelength of 610 nm to 700 nm, a green emission wavelength of 495 nm to 565 nm, and a blue emission wavelength of 430 nm to 490 nm is provided. A light emitting color conversion member that converts to yellow may be provided on the surface of the LED chip that emits blue light having a light emission wavelength of 400 nm to 530 nm, and may be provided by mixing and mixing in the light emitting element. White light can also be obtained by providing light emitting color conversion members that convert red, green, and blue on the surface of the LED chip that emits ultraviolet light having an emission wavelength shorter than 400 nm, and mixing the light converted into the respective colors. You can also.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples. The materials used in this example are as follows.

(1) Resin component / thermosetting resin: Silicone resin (SR7010A and SR7010B mixed at a mass ratio of 1: 1: both manufactured by Toray Dow Corning Co., Ltd.)
-Thermoplastic resin: norbornene polymer (ZEONOR 1600: manufactured by Nippon Zeon Co., Ltd.)
-Thermoplastic resin: Polymethylpentene (TPX RT-18 manufactured by Mitsui Chemicals, Inc., molecular weight: MW 500,000 to 600,000)
-Thermoplastic resin: Polypropylene (WF836DG3 (manufactured by Sumitomo Chemical Co., Ltd.))

(2) Titanium oxide particles: PFC-107 (Ishihara Sangyo Co., Ltd. Rutile structure average particle size 0.25 μm)
(3) Boron nitride particles: UHP-S1 (manufactured by Showa Denko KK, scaly hexagonal crystal structure, average particle size 1.5 μm)
(4) Melamine cyanurate particles: MC-6000 (Nissan Chemical Co., Ltd., average particle size 2.0 μm)
(5) Aluminum oxide particles: CB-P02 (Showa Denko Co., Ltd. average particle size 2.0 μm)
(6) Magnesium oxide particles: Wako Pure Chemical Industries, Ltd. average particle size 0.2 μm

[Examples 1-14, Comparative Examples 1-6]
A light-reflecting laminate was produced in which a resin composition layer A and a resin composition layer B in which filler (the above-mentioned various particles) were blended in 45 parts with respect to 100 parts of the resin were laminated and integrated. The formation of each layer of Examples 1 to 14 and Comparative Examples 3 and 4 is performed by pressing the resin composition layers A and B under the conditions of 150 ° C., 30 seconds, 10 MPa, and then superposing the resin composition layers A and B. It was set as the laminated body with the roll. In addition, Comparative Examples 1, 2, 5, and 6 have a single layer configuration.
The composition and film thickness of the laminated structure are as shown in Table 1 below. The “number of parts” means a mass standard (parts by mass).

  About the produced light reflection laminated body, light was irradiated from the resin composition layer B side, and the light reflectance in wavelength 300-800 nm was measured using the spectrophotometer UV-2550 (made by Shimadzu Corporation). The results are shown in Table 1 below and FIGS.

From Table 1, the reflectance in the visible light region is high in all examples, and the reflectance in the ultraviolet light region (wavelength 300 to 400 nm) is also very high compared to the comparative example (Example 1). The results of ˜5 are shown in FIG.
On the other hand, in Comparative Examples 3 and 4 in which the light incident side is opposite to that of the example shown in FIG. 4, the reflectance in the ultraviolet light region was remarkably low. In addition, Comparative Examples 1, 2, and 5 having a single layer configuration shown in FIG. 5 had low reflectance in both the visible light region and the ultraviolet light region. Further, in the case of Comparative Example 6 shown in FIG. 6 in which titanium oxide particles and boron nitride particles were mixed in a single layer configuration, the reflectance in the ultraviolet region was remarkably low as in the other comparative examples.

  From the above, it can be said that the light reflecting laminate of the present invention is useful as a reflective material for a semiconductor light emitting device that reflects not only the visible light region but also the ultraviolet light region. From the results of Examples and Table 1, it can be said that the light reflecting laminate of the present invention is particularly suitable for light reflection at the time of a thin film.

DESCRIPTION OF SYMBOLS 10 ... Optical semiconductor element 12 ... Light reflection laminated body 14 ... Substrate 16 ... Lead 18 ... Lens

Claims (5)

And the resin composition layer A comprising a resin composition containing rutile type titanium oxide particles, boron nitride particles, melamine cyanurate particles, resins comprising a resin composition containing at least one non-titanium oxide particles 及 beauty magnesium oxide particles A composition layer B,
A light reflection laminate in which a resin composition layer B and a resin composition layer A are sequentially formed from the light incident side.   The light reflecting laminate according to claim 1, wherein the non-titanium oxide particles are at least one of boron nitride particles and melamine cyanurate particles.   3. The light reflecting laminate according to claim 1, wherein each of the resin composition layer A and the resin composition layer B has a thickness of 50 to 100 μm.   The resin composition layer B is further provided, and the resin composition layer B, the resin composition layer A, and the resin composition layer B are sequentially formed from the light incident side. The light reflection laminated body of description. An optical semiconductor element and a reflector provided around the optical semiconductor element and reflecting light from the optical semiconductor element in a predetermined direction on a substrate;
The semiconductor light-emitting device which at least one part of the light reflection surface of the said reflector consists of the light reflection laminated body of any one of Claims 1-4.