JP5966915B2 - Optical bonding apparatus and optical component connecting method - Google Patents

Description

  The present invention relates to an optical bonding apparatus and an optical component connecting method.

  Since it is necessary to replace electrical transmission with optical transmission and transmit light to a plurality of systems in data transmission between optical communication apparatuses, a device having an optical waveguide capable of transmitting optical signals in parallel is required. The optical communication device includes an optical semiconductor device that converts electrical communication into light, an optical waveguide, and the like. The optical input / output end of the optical waveguide may be connected to an optical fiber in order to transmit / receive optical signals to / from other optical components. In this case, although the optical waveguide and the optical fiber are aligned and connected to each other, there are the following requirements as the signal density increases.

  For example, when an optical fiber core having a diameter of several μm is used for thinning, it is necessary to suppress a connection loss due to a shift of the optical axes between the optical waveguides. For this reason, high alignment accuracy at the submicron level is required for the connection between the optical waveguide and the optical fiber. Also, communication lines have been multiplexed due to an increase in the communication wavelength band used in optical communication, and it is required to join an optical waveguide and an optical fiber with high throughput.

  As a method of connecting an optical waveguide chip provided with an optical waveguide and an optical fiber array to which an optical fiber is attached, a positioning pin groove is formed on both, and a guide pin is inserted into each pin groove while positioning. There is a method of joining a waveguide and an optical fiber. The pin groove processing method includes a machining method using a slicer and the like, and an etching method using a semiconductor process, but high accuracy cannot be obtained by the machining method.

  In a method using a semiconductor process, first, a mask having an opening is formed on the (100) plane of the silicon substrate, and the main surface of the silicon substrate is exposed. Thereafter, when the silicon substrate is etched through the opening, a V-groove on which the guide pin is placed is formed due to crystal anisotropy.

JP-A-5-264864 JP-A-5-264859 JP-A-6-167635

  However, when the V-groove is formed by etching with crystal anisotropy, the angle of the slope of the V-groove with respect to the main surface is about 54.7 degrees due to crystal anisotropy, and the V-groove depends on the width of the V-groove, that is, the width of the mask. The depth of is determined uniquely. For this reason, if the size of the opening of the mask is deviated or the direction of the substrate is shifted during etching, the width of the V-groove differs from the originally assumed size. As a result, the depth of the V-groove is also deviated, and a deviation in the height direction occurs between the center of the guide pin inserted into the V-groove and the center of the optical waveguide, resulting in a large optical connection loss.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an optical joining device and an optical component connecting method capable of suppressing the deviation in the height direction of a guide pin attached to a pin groove formed in an optical component and satisfactorily optically connecting the optical components. It is to provide.

According to one aspect of the present embodiment, a fiber V-groove and a first pin V-groove disposed along the longitudinal direction of the fiber V-groove on the side of the fiber V-groove are formed. An optical fiber component including a fixed chip, an optical fiber fitted in the fiber V-groove, and a guide pin fitted with one end protruding outward in the first pin V-groove, from the end toward the inside A substrate having a plurality of successive steps, the width of which changes narrowly in stages, and a second pin V-groove in which the one end of the guide pin is fitted in any of the plurality of steps; Among these, there is provided an optical connecting device having an optical waveguide component including an optical waveguide formed on a side of the second pin V-groove and optically connected to an end portion of the optical fiber.
The objects and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the appended claims. It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention.

  According to the present embodiment, it is possible to suppress the deviation in the height direction of the guide pins attached to the pin grooves formed in the optical component, and to optically connect the optical components with each other.

FIG. 1 is a perspective view illustrating a method of connecting optical components in the optical connection device according to the embodiment. FIG. 2A is a plan view showing a method of connecting the optical waveguide chip and the optical fiber array used in the optical connecting device according to the embodiment, and FIG. 2B is used in the optical connecting device according to the embodiment. FIG. 2C is a cross-sectional view of an optical fiber array used in the optical connecting device according to the embodiment. FIG. 3 is an end view showing an example of a V-groove formed in the optical waveguide chip in the optical connecting device according to the embodiment. FIG. 4 is a diagram illustrating a relationship between the width of the V-groove formed in the optical waveguide chip and the center position of the guide pin on the V-groove in the optical connecting device according to the embodiment. 5A to 5D are cross-sectional views illustrating an example of the optical waveguide chip forming process in the optical connecting device according to the embodiment. 6A to 6D are cross-sectional views illustrating an example of a process for forming an optical waveguide chip in the optical connection device according to the embodiment. FIG. 7 is a plan view illustrating an example of a mask formed in the optical waveguide chip forming step in the optical connecting device according to the embodiment. 8A to 8D are cross-sectional views illustrating an example of a process for forming an optical fiber ferrule in the optical connecting device according to the embodiment. 9A to 9C are end views showing the positional relationship between the V-groove formed in the optical waveguide chip and the optical fiber fitted thereon, in the optical connecting device according to the embodiment. 10A and 10B are end views showing a manufacturing error of the V-groove formed in the optical fiber ferrule in the optical connecting apparatus according to the embodiment, and a positional relationship between the optical fiber fitted on the V-groove and the guide pin. is there.

Embodiments will be described below with reference to the drawings. In the drawings, similar components are given the same reference numerals.
FIG. 1 is a perspective view illustrating a state before optical components are connected in the optical connection device according to the embodiment. 2A is a plan view showing a state before optical components are connected in the optical connecting apparatus according to the embodiment, FIG. 2B is a cross-sectional view taken along the line II in FIG. 2A, and FIG. (C) is the II-II sectional view taken on the line of Fig.2 (a).
1 and 2, an optical fiber ferrule 11 and an optical waveguide chip 21 are used as optical components to be optically connected.

  The optical fiber ferrule 11 includes a cubic fixed tip 12, a plurality of optical fibers 16 a to 16 d, a pair of cylindrical guide pins 17 and 18, and a clamp 19. A plurality of fiber V-grooves 13a to 13d are formed in parallel on the main surface of the fixed chip 12 at equal intervals in the width direction (x direction in the figure). A pair of pin V-grooves 14 and 15 are formed on both sides of a region where the fiber V-grooves 13a to 13d are formed. The fiber V-grooves 13a to 13d and the pin V-grooves 14 and 15 are formed linearly in the longitudinal direction (z direction in the figure), and their width and depth are formed to be the same, for example. preferable. However, when the diameter of the guide pin used is larger than the diameter of the optical fiber, the pin V-grooves 14 and 15 are formed larger than the fiber V-grooves 13a to 13d.

  The end portions of the optical fibers 16 a to 16 d are bonded to the plurality of fiber V-grooves 13 a to 13 d with an adhesive, and the end surfaces thereof are aligned so as to be aligned with the end surface of the fixed chip 12. Further, guide pins 17 and 18 are fitted into the pair of pin V grooves 14 and 15 so as to be movable in the longitudinal direction, respectively, and the front end portion and the rear end portion of the guide pins 17 and 18 are outside the front and rear from the fixed chip 12. When attached in a state of protruding in the direction, the protruding amount of the tip is aligned. As shown in FIG. 2A, flange portions 17a and 18a having large diameters may be formed at the rear ends of the guide pins 17 and 18.

  The guide pins 17 and 18 attached to the fixed chip 12 are pressed and temporarily fixed toward the fixed chip 12 by the flat bottom surface inside the clamp 19 that sandwiches the fixed chip 12 from above and below, and the vertical direction (y direction), side Movement in the direction (x direction) is restricted.

  The clamp 19 is formed of an elastic material, and its front and rear ends are opened, and has a structure in which the guide pins 17 and 18 and the optical fibers 16a to 16d on the fixed chip 12 are sandwiched by spring properties with the inner top surface and bottom surface. Yes. A slit 19 a that divides both sides is formed in the upper part of the clamp 19, and the opening amount changes according to the positions of the fixed chip 12 and the guide pins 17 and 18.

  The optical waveguide chip 21 has a substrate 22 and a top plate 29 placed thereon. On the main surface of the substrate 22, a plurality of linear optical waveguides 23a to 23d are formed in parallel in the width direction (x direction) at equal intervals, and their end surfaces are optically coupled to the core C of the optical fibers 16a to 16d. Arranged at intervals. Also, a pair of pin V-grooves 27 and 28 are formed in a direction perpendicular to the end surface of the substrate 22 on both sides of the region where the optical waveguides 23 a to 23 d are formed.

The top plate 29 has a lower surface that presses the end portions of the guide pins 17 and 18 fitted in the pair of pin V-grooves 27 and 28 toward the substrate 22, and is bonded to the substrate 22 at both side ends thereof. Leg portions 29a and 29b. Here, assuming that the radius of the pair of guide pins 17 and 18 is R and the height of the center of the optical waveguides 23 a to 23 d in the vertical direction from the main surface of the substrate 22 is H ₀ , the substrate 22 among the lower surfaces of the top plate 29. It is desirable to set the height from the main surface to be in the range of (R + H ₀ ) to (R + H ₀ ± 0.5 μm).

  The pair of pin V grooves 27 and 28 in the optical waveguide chip 21 have a size and a depth for guiding the tip portions of the guide pins 17 and 18 protruding from the optical fiber ferrule 11 toward the inside of the substrate 22. The widths and depths of the pair of pin V-grooves 27 and 28 have shapes that change in a plurality of steps so as to gradually decrease from the insertion ends of the guide pins 17 and 18 toward the inside. In the length direction of the pair of pin V-grooves 27 and 28, the amount of change on one side of each of n stages (2 <n: natural number) of the width is, for example, 0.5 μm. The widths of the pin V-grooves 27 and 28 indicate the width of the main surface of the substrate 22.

Here, as illustrated in FIG. 3, the radius of the guide pins 17 and 18 is R, the height of the center of the guide pins 17 and 18 with respect to the main surface of the substrate 22 is H _0, and the V grooves 27 and 28 for pins. The width of the groove is W, and the angle inside the groove with respect to the main surface of the slope is θ degrees. In this case, H ₀ is preferably set to a height from the main surface of the substrate 22 to the centers of the optical waveguides 23a to 23d in the vertical direction. Further, in the vertical direction of the main surface of the substrate 22, the distance from the bottom of the pin V-grooves 27, 28 to the center of the guide pins 17 and 18 thereon and _{H 1,} from the bottom of the pin V-grooves 17 and 18 the distance to the main surface of the substrate 22 and _{H 2.}

As a result, the relationship of H ₁ = R / cos θ, H ₂ = H ₁ −H ₀ , W / 2 = H ₂ / tan θ is established, and the width W of the pin V-grooves 27 and 28 is obtained by the following equation. .

W = 2 × H ₂ / tan θ = 2 × (R / cos θ−H ₀ ) / tan θ

Accordingly, the angle θ of the inclined surfaces of the pin V-grooves 27 and 28 is 54.7 degrees, the diameter 2R of the guide pins 17 and 18 is 125 μm, and the height H ₀ of the center of the guide pins 17 and 18 with respect to the main surface of the substrate 22 is set. Is 15 μm, the width W of the upper ends of the V-grooves for pins 27 and 28 is about 131.9 μm. Further, the relationship between the height H ₀ of the center of the optical waveguides 23 a to 23 d with respect to the main surface of the substrate 22 and the width W of the pin V-grooves 27 and 28 is expressed by the following equation, and is shown in the graph of FIG.

H ₀ = 108.1-0.706W

If the number of steps for changing the width W with respect to the longitudinal direction of the pin V-grooves 27 and 28 is, for example, “3” as shown in FIG. 2A, the second step 27b from the insertion end of the guide pins 17 and 18 is used. 28b are designed to have a width W of 131.9 μm, respectively. In this case, the center height H ₀ of the guide pins 17 and 18 having a diameter of 125 m fitted on the second tiers 27 b and 28 b is 15 μm.

On the other hand, when the width W of the actually produced pin V-grooves 27 and 28 is enlarged by 0.5 μm on one side due to a processing error, the width W of the second steps 27b and 28b is 132.9 μm. The height H ₀ of the center of the guide pins 17 and 18 placed on is 14.27 μm, which is lower than the target value of 15 μm. In contrast, the width W of the third step 27c, 28c in the longitudinal direction of the pin V-grooves 27, 28 is designed to be 0.5 μm narrower on one side than the width W of the second step 27b, 28b. As a result, the actually produced width W is 131.9 μm, so that the center height H ₀ of the guide pins 17 and 18 is set to 15 μm by fitting the guide pins to the third steps 27 c and 28 c. Can do.

Further, when the width W of the actually processed pin V-grooves 27a and 28a is reduced by 0.5 μm on one side due to a processing error, the width W of the second steps 27b and 28b becomes 130.9 μm. The center height H ₀ of the guide pins 17 and 18 to be fitted is 15.68 μm, which is higher than the target value of 15 μm. On the other hand, the width W of the first step 27a, 28a in the longitudinal direction of the pin V-grooves 27, 28 is designed to be 0.5 μm wider on one side than the second step 27b, 28b. The resulting width W is 131.9 μm. Thus, by fitting the guide pins 17, 18 first stage 27a, to 28a, it is possible to make the height _{H 0} of the center of the guide pin 17, 18 15μm target value.

Further, when the width W of the actually produced pin V-grooves 27 and 28 is increased by 0.3 μm on one side due to a processing error, the width W of the second steps 27b and 28b is 132.5 μm, The center height H ₀ of the guide pins 17 and 18 to be fitted is about 14.56 μm, which is lower than the target value. On the other hand, the width of the third step 27c, 28c of the pin V-grooves 27, 28 was designed to be 0.5 μm smaller on one side than the second step 28b, 28b. The width W is 131.5 μm. As a result, the height H ₀ of the guide pins 17 and 18 fitted into the third steps 27c and 28c is 15.26 μm, which is higher than the target value. Furthermore, the width W of the first steps 27a and 28a of the pin V-grooves 27 and 28 is designed to be 0.5 μm wider on one side than the second steps 27b and 28b. Becomes 133.5 μm, and the height H ₀ of the center of the guide pins 17 and 18 fitted thereon is 13.85 μm, which is lower than the target value.

  In such a state, the center of the guide pins 17 and 18 is close to the target height in the third steps 27c and 28c, so the guide pins 17 and 18 are connected to the third steps 28c and 28c of the pin V-grooves 27 and 28. Fit into. In addition, when the guide pins 17 and 18 cannot be inserted on the third steps 27c and 28c due to an error generated in the interval between the top plate 29 and the substrate 22, they are fitted into the second steps 27b and 28b. Note that the step value of the stepped width of the pin V-grooves 27 and 28 is determined based on an allowable range of errors between the centers of the guide pins 17 and 18 and the centers of the optical waveguides 23a to 23d in the height direction. Also good.

  As described above, with the positions where the guide pins 17 and 18 are fitted are determined, the tips of the guide pins 17 and 18 abut against the end portions of the pin V grooves 27 and 28. Thereafter, the fixed tip 12 and the clamp 19 of the optical fiber ferrule 11 are moved along the surfaces of the guide pins 17 and 18 while sliding, and the tip surface of the optical fiber ferrule 11 is brought into contact with the pin insertion end surface of the optical waveguide chip 21. . Thereafter, the opposing end surfaces of the optical waveguide chip 21 and the optical fiber ferrule 11 are bonded together with an adhesive.

  In this way, the width and depth of the pin V-grooves 27 and 28 of the optical waveguide chip 21 are divided into a plurality of stages in the longitudinal direction, and the width and depth are gradually reduced stepwise as the distance from the end to the inside increases. It is changing. As a result, even if a processing error occurs in the width and depth of the pin V-grooves 27, 28, the pin V-grooves 27, 28 have areas of the optimum or error range. The center height of the guide pins 17 and 18 can be adjusted to the target value.

  Thereby, the optical fibers 13a to 13d adjusted according to the center height of the guide pins 17 and 18 can be aligned with the optical waveguides 23a to 23d at the submicron level. In addition, when the optical fibers 13a to 13d and the optical waveguides 23a to 23d are optically connected, alignment by optical measurement becomes unnecessary, and optical bonding with high throughput becomes possible.

  In the above description, the number of stages for changing the width and depth of the pin V grooves 28 and 29 of the optical waveguide chip 21 is described as three. However, the number of stages is not limited to three. A structure having two steps or four or more steps from the guide pin insertion end toward the inside may be used. For example, in the case of four steps, if the step is 0.5 μm on one side, the positional deviation of 2 μm due to the processing error of the pin V grooves 28 and 29 can be adjusted within 0.5 μm. Further, these steps are not limited to 0.5 μm on one side of the width, but are set based on an allowable range of deviation in the height direction between the centers of the optical fibers 13a to 13d and the optical waveguides 23a to 23d.

  Next, an example of a process of forming the optical waveguides 23a to 23d and the pin V-grooves 27 and 28 on the substrate 22 in the optical waveguide chip 21 will be described with reference to FIGS.

  As the substrate 22 on which the optical waveguide chip 21 is manufactured, an SOI substrate 20 as shown in the cross section of FIG. The SOI substrate 20 includes a silicon substrate 20a applied as the above-described substrate 22, and a silicon oxide layer 20b and a silicon layer 20c that are sequentially formed thereon. Although the SOI substrate 20 is a substantially circular wafer, in the following description, a region where one optical waveguide chip is formed will be described. The wafer is finally divided for each optical waveguide chip.

  First, a photoresist is applied on the (100) surface which is the main surface of the silicon-con layer 20c, and this is subjected to exposure, development, and the like, whereby a plurality of resist patterns 31a to 31d in parallel with each other are formed. Form. In this case, the longitudinal directions of the waveguide-shaped resist patterns 31a to 31d are arranged in a direction perpendicular to the (110) plane. Further, the center of the end face width of the waveguide-shaped resist patterns 31a to 31d is arranged at the same interval as the core C of the plurality of optical fibers 13a to 13d in the optical fiber ferrule 11 shown in FIGS. .

  Thereafter, using the resist patterns 31a to 31d as a mask, the silicon layer 20c is etched. Thus, the silicon layer 20c left under the resist pattern 31 is used as the optical waveguides 23a to 23d. Thereafter, as shown in FIG. 5B, the resist patterns 31a to 31d are removed.

  Subsequently, as shown in FIG. 5C, a silicon oxide film, for example, is formed as the insulating film 26 on the optical waveguides 23a to 23d and the silicon oxide film 20b. Thereafter, a photoresist is applied on the insulating film 26, and is subjected to exposure, development, and the like, thereby forming a resist pattern 32 that covers regions where the optical waveguides 23a to 23b are to be formed. Thereafter, using the resist pattern 32 as a mask, the insulating film 26 is etched, and then the resist pattern 32 is removed. Thereby, as shown in FIG. 5D, the optical waveguides 23a to 23d are covered with the insulating film 26, and the silicon oxide film 23c is exposed in other regions.

  Next, as shown in FIG. 6A, a photoresist is applied on the insulating film 26 and the silicon oxide film 20b, and a resist pattern 33 for forming a V-groove is formed by exposing and developing the photoresist. . As illustrated in the plan view of FIG. 7, the V-groove forming resist pattern 33 has a groove-forming opening 33 a whose width changes narrowly in a plurality of stages from the end on the side where the optical fiber is inserted to the inside. 33b is provided on both sides of the insulating film 26. The longitudinal direction of the groove forming openings 33a and 33b is perpendicular to the (110) plane of the silicon substrate 20a. FIG. 7 shows five stages different from those in FIGS. 1 and 2, and the width of the third break is designed to be a target value. In addition, the amount of change in width for each stage is, for example, 0.5 μm on one side, and the length of each stage is, for example, several mm. Note that the number of stages is not limited to five.

  Next, as shown in FIG. 6B, the silicon oxide film 20b is etched through the openings 33a and 33b of the V-groove forming resist pattern 33 to form openings 34a and 34b. Etching may be dry or wet, and fluorine-containing gas is used in the case of dry etching, for example, reactive ion etching (RIE), and diluted hydrofluoric acid is used in the case of wet etching.

  Subsequently, as shown in FIG. 6C, after removing the V-groove forming resist pattern 33, the silicon substrate 20a is wet etched through the openings 34a and 34b using the insulating film 26 and the silicon oxide film 20b as a mask. To do. For wet etching, for example, potassium hydroxide (KOH) solution is used, but the present invention is not limited to this, and other alkaline etching solution, for example, tetramethylammonium hydroxide (TMHA) solution may be used.

  Since the etching of the silicon substrate 20a having the (100) plane as the main surface has crystal anisotropy, the groove formed by the etching is V-shaped as shown in FIG. (111) plane pin V grooves 27 and 28 are formed, and the angle θ of the inclined surfaces of the pin V grooves 27 and 28 with respect to the main surface of the silicon substrate 20a is 54.7 degrees. Therefore, the depths of the pin V-grooves 27 and 28 change in accordance with the widths of the openings 33a and 33b of the V-groove forming resist pattern 33, and the openings 33a and 33b (34a and 34b) in the longitudinal direction thereof. This shape is transferred to form a plurality of stages having different widths and depths.

  Next, a method of forming the optical fiber ferrule 11 shown in FIGS. 1 and 2 will be described with reference to FIG.

  First, as shown in FIG. 8A, a silicon substrate 41 in which a silicon oxide film 42 is formed on a (100) surface which is a main surface is used. Then, a photoresist is applied on the main surface, and this is exposed, developed, etc., so that the plurality of optical fibers 13a to 13d and the first and second guide pins 17 and 18 are disposed in the region. A resist pattern 43 having a plurality of V groove forming openings 43a to 43f is formed. The longitudinal direction of the V-groove forming openings 43 a to 43 f is aligned with the (110) plane of the silicon substrate 41 in the vertical direction. Further, the centers of the widths of the V-groove forming openings 43a to 43f are arranged in accordance with the centers of the optical waveguides 23a to 23d and the V-grooves 27 and 28 shown in FIG.

  When the diameters of the guide pins 17 and 18 and the centers of the optical fibers 13a to 13d are the same in order to prevent them from shifting, all the V groove forming openings 43a to 43f are formed to have the same width. . For example, when the optical fibers 13a to 13d having a diameter of 125 μm and the guide pins 17 and 18 are used, the width of the V groove forming openings 43a to 43f is set to 131.9 μm, for example, as described above.

  Thereafter, as shown in FIG. 8B, the silicon oxide film 42 is etched through the V groove forming openings 43a to 43f using the resist pattern 43 as a mask. As a result, the plurality of V groove forming openings 43a to 43f of the resist pattern 43 are transferred to the silicon oxide film 42 to form a plurality of V groove forming openings 42a to 42f. Thereafter, as shown in FIG. 8C, the resist pattern 43 is removed.

  Next, as shown in FIG. 8C, using the silicon oxide film 42 as a mask, the silicon substrate 41 is wet-etched through the V-groove forming openings 42a to 42f, and the fiber V-grooves 13a to 13d and pins V grooves 14 and 15 are formed. For example, a KOH solution is used for the wet etching, but the KOH solution is not limited to this, and other alkaline etching solutions may be used.

  As a result, as shown in FIG. 8D, the etching of the silicon substrate 41 whose principal surface is the (100) surface has crystal anisotropy, so that the groove formed by the etching becomes V-shaped, However, the (111) plane V-groove is formed, and the angle of the inclined surface with respect to the main surface of the silicon substrate 20 is 54.7 degrees. The outermost two of these V-grooves are used as pin V-grooves 14 and 15, and the V-groove between them is used as fiber V-grooves 13a to 13d. The silicon substrate 41 on which the pin V grooves 14 and 15 and the fiber V grooves 13a to 13d are formed is cut into a chip shape and used as the fixed chip 12 of the optical fiber ferrule 11 shown in FIGS. .

  The fiber V-grooves 13a to 13d are bonded with an adhesive in a state where the end surfaces of the optical fibers 16a to 16d are aligned with one surface of the fixed chip 12. The guide pins 17 and 18 are fitted in the pin V-grooves 14 and 15 and are not fixed by an adhesive, but are pressed against the fixed chip 12 by the clamp 19 shown in FIGS. It is temporarily fixed so that it can move along. The guide pins 17 and 18 may be formed from a metal, for example, a cemented carbide alloy in which tantalum carbide and cobalt are bonded, or a high-speed alloy in which tungsten, molybdenum, chromium, or the like is bonded to a carbon steel base, A short cut optical fiber may be used.

Next, a method for connecting the optical waveguides 23a to 23d and the optical fibers 13a to 13d will be described.
First, as shown in FIG. 2A, the guide pins 14 and 15 sandwiched between the clamp 19 and the pin V-grooves 14 and 15 in the optical fiber ferrule 11 are connected to the substrate 22 and the top plate 29 of the optical fiber ferrule 21. Between the V-grooves 27 and 28 for the pin. In this case, it is preferable to insert while sliding on the lower surface of the top plate 29.

  As described above, errors may occur in the width and depth of the pin V-grooves 27 and 28 due to a processing error or the like. For example, if the processing of the pin V-grooves 27 and 28 can be formed without error, the guide pins 17 and 18 are inserted into the pin V-grooves while touching the inner upper surface of the top plate 29 as shown in FIG. Then, as designed, the guide pins 17 and 18 are placed on the central step of the pin V-grooves 27 and 28 that change in a stepped manner, and the guide pins 17 and 18 abut against the inner wall of the step and stop further.

  On the other hand, for example, when the width and depth of the pin V grooves 27 and 28 are formed larger than originally planned due to processing errors, as shown in FIG. The guide pins 27, 28 abut on the step farther from the center step of the grooves 27, 28, that is, the step farther from the insertion end face.

  If the width and depth of the pin V-grooves 27 and 28 are smaller than originally planned due to processing errors, as shown in FIG. The guide pins 27, 28 abut on the step closer to the front than the central step of 28, that is, the step closer to the insertion end face.

  After reaching the end of the pin V-grooves 27 and 28 like those, the optical fiber ferrule 11 is moved along the guide pins 27 and 28 to a position where the end surface is in contact with the insertion end surface of the optical waveguide chip 21. It moves and bonds the end faces of the optical waveguide chip 21 and the optical fiber ferrule 11 together. Adhesion methods include, but are not limited to, adhesion with a photocurable resin, anodic bonding, and the like.

  As described above, the position where the guide pins 17 and 18 abut on each other in the guide pin grooves 27 and 28 formed in a plurality of stages changes, resulting in a processing error in the width and depth of the pin V grooves 27 and 28. Even so, the guide pins 17 and 18 are fitted into the steps of the V-grooves 27 and 28 for pins of a suitable size. Thereby, the heights of the centers of the optical waveguides 23a to 23d and the guide pins 17 and 18 coincide with each other with high accuracy.

  Further, as shown in FIGS. 10A and 10B, by simultaneously processing the fiber V-grooves 13a to 13d and the pin V-grooves 14 and 15 on the optical fiber ferrule 11, the V-grooves 13a to 13d are processed. Even if processing errors occur in the widths and depths of 13d, 14, 15 and the relative position of each V-groove does not change, the guide pins 17, 18 and the optical fibers 16a to 16d with respect to the main surface of the fixed chip 12 The height matches precisely. 10A and 10B, the broken lines indicate fiber V grooves 13a to 13d and pin V grooves 14 and 15 formed in an ideal state. Therefore, even if processing errors occur in the V grooves 13a to 13d, 14, 15, 27, and 28, the heights of the optical waveguides 23a to 23b and the optical fibers 16a to 16d are accurately matched.

  As described above, according to the present invention, the optical waveguides 23a to 23d and the optical fiber can be used even if errors in the groove width and depth occur when the pin V grooves 27 and 28 are processed in the positioning by the guide pins 17 and 18. 16a-16d can be aligned at the submicron level. In addition, according to the optical bonding apparatus having the above-described structure, alignment by optical measurement is unnecessary, and optical bonding of optical components with high throughput becomes possible.

  In the above description, the optical waveguides 13a to 13d have been described as being linear, but may have a shape in which the interval between them changes in the longitudinal direction. In addition, a semiconductor laser, a photodiode, or the like may be mounted on the optical waveguide chip. Furthermore, components may also be mounted on the optical fiber ferrule.

  All examples and conditional expressions given here are intended to help the reader understand the inventions and concepts that have contributed to the promotion of technology, such examples and It is interpreted without being limited to the conditions, and the organization of such examples in the specification is not related to the superiority or inferiority of the present invention. While embodiments of the present invention have been described in detail, it will be understood that various changes, substitutions and variations can be made thereto without departing from the spirit and scope of the invention.

Next, embodiments of the present invention will be additionally described.
(Supplementary Note 1) A V-groove for a fiber, a fixed chip in which a V-groove for a first pin disposed along a longitudinal direction of the fiber V-groove on the side of the fiber V-groove is formed, and the fiber An optical fiber component including an optical fiber fitted into a V-groove, a guide pin with one end projecting outwardly into the first pin V-groove, and a width that gradually decreases from the end toward the inside. A substrate having a plurality of continuously changing steps, and a second pin V-groove in which the one end of the guide pin is fitted in any of the plurality of steps; and for the second pin among the substrates An optical connection device comprising: an optical waveguide component including an optical waveguide formed on a side of the V-groove and optically connected to an end of the optical fiber.
(Supplementary Note 2) The fixed chip is formed of a silicon substrate, the fiber V-groove and the first pin V-groove are formed on the (100) surface of the silicon substrate, and the longitudinal direction of the fiber V-groove is 2. The optical connection device according to appendix 1, wherein the optical connection device is disposed in a direction perpendicular to a (110) plane of a silicon substrate.
(Supplementary Note 3) The substrate is a silicon substrate, the second pin V-groove and the optical waveguide are formed on a (100) plane of the silicon substrate, and the longitudinal direction of the second pin V-groove is the silicon substrate. The optical connection device according to Supplementary Note 1 or Supplementary Note 2, wherein the optical connection device is disposed in a direction perpendicular to the (110) plane.
(Supplementary note 4) The optical connection device according to any one of Supplementary notes 1 to 3, wherein in the optical waveguide component, the guide pin is sandwiched between the second pin V-groove and the top plate.
(Supplementary Note 5) In any one of Supplementary Notes 1 to 4, wherein the plurality of steps of the second pin V-groove are formed so that the steps of the widths of the adjacent steps are equal. Optical connection device.
(Supplementary note 6) The optical connection device according to any one of supplementary notes 1 to 5, wherein the guide pin and the optical fiber have the same diameter.
(Appendix 7) The center of the guide pin fitted in any one of the plurality of steps of the V groove for the second pin and the center in the height direction of the optical waveguide are the same height with respect to the main surface of the substrate. The optical connection device according to any one of Supplementary Note 1 to Supplementary Note 6, wherein the optical connection device has an error within an allowable range.
(Appendix 8) A V-groove for a fiber, a fixed chip in which a V-groove for a first pin disposed along a longitudinal direction of the fiber V-groove is formed on a side of the fiber V-groove, and the fiber An optical fiber component including an optical fiber fitted into a V-groove, a guide pin fitted with one end projecting into the V-groove for the first pin, and a continuous width whose width gradually narrows from the end toward the inside. A substrate on which a second pin V-groove having a plurality of steps is formed; and an optical waveguide formed on a side of the second pin V-groove of the substrate and optically connected to an end of the optical fiber; An optical waveguide component including a top plate attached to the second pin V-groove at an interval, and the guide pin of the optical fiber component is used as the second pin of the optical waveguide component. The second pin while being inserted between the V-groove for use and the top plate Light component soldering method having the step of inserting to a position impinging on any one of said plurality of stages of the V-groove.
(Supplementary note 9) The optical component connecting method according to supplementary note 8, wherein in the optical fiber component, at least the guide pin is pressed against the first pin V groove by a clamp and temporarily fixed.
(Supplementary note 10) The optical component connection method according to supplementary note 8 or appendix 9, characterized in that, in the plurality of steps of the second pin V-groove, steps of adjacent widths are formed equally. .
(Additional remark 11) The diameter of the said guide pin and the said optical fiber is equal, The optical component connection method as described in any one of Additional remark 8 thru | or Additional remark 10.
(Appendix 12)
The center of the guide pin fitted in any one of the plurality of steps of the V groove for the second pin and the center in the height direction of the optical waveguide are the same height or within an allowable range with respect to the main surface of the substrate. The optical component connecting method according to any one of appendices 8 to 11, wherein the optical components are matched with each other.

DESCRIPTION OF SYMBOLS 11 Optical fiber ferrule 12 Fixed chip | tip 13a-13d V groove | channel 14 for fibers, 15-pin V groove | channels 16a-16d Optical fiber 17, 18 Guide pin 19 Clamp 21 Optical waveguide chip 22 Substrate 23a-23d Optical waveguide 27, V for pin 27 Grooves 27a-27c, 28a-28c Step 29 Top plate

Claims (5)

A V-groove for fiber, a fixed chip formed with a first pin V-groove arranged along the longitudinal direction of the fiber V-groove on the side of the fiber V-groove, and fitted in the fiber V-groove An optical fiber component, and an optical fiber component including one end projecting outwardly into the first pin V-groove,
A second pin V-groove is formed which has a plurality of continuous steps whose width gradually decreases from the end toward the inside and into which one end of the guide pin is fitted. An optical waveguide component comprising: a substrate; and an optical waveguide formed on a side of the second pin V-groove of the substrate and optically connected to an end of the optical fiber;
An optical connection device.   The fixed chip is formed from a silicon substrate, the fiber V-groove and the first pin V-groove are formed on the (100) surface of the silicon substrate, and the longitudinal direction of the fiber V-groove is the ( 110. The optical connection device according to claim 1, wherein the optical connection device is disposed in a direction perpendicular to a (110) plane.   The substrate is a silicon substrate, and the second pin V-groove and the optical waveguide are formed on a (100) plane of the silicon substrate, and the longitudinal direction of the second pin V-groove is (110) of the silicon substrate. The optical connection device according to claim 1, wherein the optical connection device is arranged in a direction perpendicular to the surface.   The optical connection device according to any one of claims 1 to 3, wherein the guide pins and the optical fibers have the same diameter. A V-groove for fiber, a fixed chip formed with a first pin V-groove arranged along the longitudinal direction of the fiber V-groove on the side of the fiber V-groove, and fitted in the fiber V-groove An optical fiber component, and an optical fiber component including one end projectingly fitted into the first pin V-groove,
A substrate on which a second pin V-groove having a plurality of continuous steps whose width gradually changes from the end toward the inside, and a side of the second pin V-groove of the substrate; An optical waveguide component comprising: an optical waveguide formed and optically connected to an end of the optical fiber; and a top plate mounted on the second pin V-groove at an interval;
Prepare
Inserting the guide pin of the optical fiber component between the second pin V-groove of the optical waveguide component and the top plate to a position where it abuts on any of the plurality of steps of the second pin V-groove. An optical component connecting method comprising:

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