JP5966146B2 - Multilayer electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a laminated electronic component such as a common mode noise filter used in various electronic devices such as digital devices, AV devices, and information communication terminals, and a method for manufacturing the same.

  As shown in FIG. 12, a conventional multilayer electronic component of this type includes a multilayer body 1 having a plurality of insulating layers and internal conductors formed of a ceramic material, and is formed on the surface of the multilayer body 1 and has internal conductors. The external electrode 2 is formed by providing a through hole 3 in a part of the exposed surface of the laminate 1 and filling the through hole 3 with a conductive material such as Ag.

  As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.

Japanese Patent Laid-Open No. 11-329895

  In the above-described conventional multilayer electronic component, the ceramic material constituting the multilayer body 1 and the conductive material constituting the external electrode 2 have different thermal shrinkage rates, so that stress is generated at the interface between the multilayer body 1 and the external electrode 2 during firing. As a result, the bonding strength between the laminate 1 and the external electrode 2 deteriorates.

  The present invention solves the above-described conventional problems, and an object thereof is to provide a laminated electronic component capable of improving the bonding strength with an external electrode.

  In order to achieve the above object, the present invention has the following configuration.

The invention according to claim 1 of the present invention is a laminate including a plurality of insulating layers and inner conductors formed of a ceramic material, and is formed from the lower surface to the side surface of the laminate and connected to the inner conductors . An external electrode at least a part of which is exposed from the laminate, and a through hole is formed in the insulating layer, and the external electrode is provided by filling the through hole with a conductive material. Is formed as a protruding external electrode having a protruding portion protruding from another external electrode in a top view, and this protruding external electrode is formed at least at a location other than the lower surface of the laminate. Since the protruding portion can cause a part of the external electrode to bite into the laminated body, an anchor effect is produced, and thereby the bonding strength between the laminated body and the external electrode can be improved. Cormorant is as it has the effect effect.

  According to the second aspect of the present invention, in particular, other external electrodes are formed on both the upper surface and the lower surface of the projecting external electrode. According to this configuration, the stress is either upward or downward. Even if it arises, it has the effect that the joint strength between the laminate and the external electrode is not lowered by the protruding portion.

  The invention according to claim 3 of the present invention is such that, in particular, only a part of the protruding external electrode is exposed from the laminate, and according to this configuration, it contacts the cutting blade when dividing the protruding external electrode into individual pieces. Since the projecting external electrode can be reduced by being pulled by the cutting blade when dividing the individual pieces, the projecting portion can be made to exist. This has the effect of improving the bonding strength with the external electrode.

  The invention described in claim 4 of the present invention is such that, in particular, the protruding external electrode is not exposed from the laminate, and according to this configuration, the protruding external electrode contacts the cutting blade when dividing the piece. Therefore, it is possible to prevent the protruding external electrode from being pulled out by being pulled by the cutting blade when dividing the individual pieces, and thus the protruding portion can be surely present. This has the effect of improving the bonding strength.

  In the invention according to claim 5 of the present invention, in particular, the protruding external electrode and another external electrode adjacent to the protruding external electrode are connected through a through hole provided in an insulating layer therebetween. Thus, according to this configuration, even if the protruding external electrode contacts the cutting blade at the time of dividing the piece, it is possible to reduce the possibility that the protruding external electrode is pulled out by the through hole, and thus the protruding portion Therefore, it is possible to improve the bonding strength between the laminate and the external electrode.

  In the invention according to claim 6 of the present invention, in particular, after forming a green sheet serving as an insulating layer on the base film, a through hole is formed in a predetermined portion of the base film and the green sheet. A step of filling the conductive material and providing an external electrode, and when forming the external electrode, a part of the conductive material protrudes from the inside of the through-hole and spreads to the surface of the green sheet, In this way, a protruding external electrode as defined in claim 1 is provided to protrude from another external electrode. According to this manufacturing method, the protruding external electrode can be easily formed. It has the effect of being able to.

  As described above, in the multilayer electronic component of the present invention, a through hole is formed in an insulating layer, an external electrode is provided by filling the through hole with a conductive material, and a part of the external electrode is viewed from above. The projecting external electrode has a projecting portion projecting from the other external electrode, and this projecting external electrode is formed at least at a location other than the lower surface of the stacked body. As a result, an anchor effect is produced, and thus an excellent effect is obtained in that the bonding strength between the laminate and the external electrode can be improved.

The perspective view of the multilayer electronic component in one embodiment of this invention Side view of the same laminated electronic component Bottom view of the same laminated electronic component Top view showing the production process of the laminated electronic component Sectional view showing the production process of the laminated electronic component Sectional view showing the production process of the laminated electronic component Sectional view showing the production process of the laminated electronic component Side view of another example of the same laminated electronic component Top view of other parts of the multilayer electronic component Top view of other parts of the multilayer electronic component Top view of other parts of the multilayer electronic component Perspective view of a conventional multilayer electronic component

  Hereinafter, a laminated electronic component according to an embodiment of the present invention will be described.

  1 is a perspective view of a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a side view of the multilayer electronic component, and FIG. 3 is a bottom view of the multilayer electronic component.

  As shown in FIGS. 1 to 3, the multilayer electronic component according to one embodiment of the present invention includes a multilayer body 11 including a plurality of insulating layers and internal conductors formed of a ceramic material, and a bottom surface of the multilayer body 11. And an external electrode 12 formed from the side surface to the side surface and connected to the internal conductor.

  Then, through holes are formed in the plurality of insulating layers so as to be continuous at least in the vertical direction, the external electrodes 12 are provided by filling the through holes with a conductive material, and a part of the external electrodes 12 is formed. The protruding external electrode 13 has a protruding portion 13 a protruding from another external electrode in a top view, and the protruding external electrode 13 is not positioned on the lowermost surface of the laminate 11.

  In the above configuration, the multilayer body 11 is configured by laminating a plurality of insulating layers and internal conductors.

  Here, the plurality of insulating layers are formed of a ceramic material such as a dielectric material, a magnetic material, or a nonmagnetic material, and are stacked in the vertical direction. The inner conductor is formed by plating, printing, vapor deposition, or the like with a conductive material such as Ag on the insulating layer, and becomes an element for exhibiting the characteristics as a laminated electronic component. For example, when the multilayer electronic component is an inductor, the inner conductor is formed in one or more spirals or spirals, and in the case of a capacitor, the inner conductor is a plurality of plate electrodes.

  The external electrode 12 is connected to the internal conductor, is formed from below the side surface of the multilayer body 11 to the lower surface, and is exposed to the side surface and the lower surface of the multilayer body 11. Here, the lower surface of the laminated body 11 refers to a mounting surface, and the external electrode 12 located in this portion and the mounting solder are connected. The side surface of the multilayer body 11 is a surface on the long side and short side of the multilayer body 11 in a top view, and the external electrode 12 is formed on one or both of them. The number of external electrodes 12 is not limited to four.

  Furthermore, the external electrode 12 is formed by providing a through hole in one or a plurality of insulating layers located below including the lowermost surface of the multilayer body 11 and filling the through hole with a conductive material such as Ag. In addition, when providing a through-hole in several insulating layers, a through-hole is formed in the insulating layer adjacent to an up-down direction, and the external electrode 12 is comprised continuously.

  Further, a protruding external electrode 13 having a protruding portion 13 a protruding from the other external electrode 12 in a top view is formed on a portion of the external electrode 12 other than the lower surface of the stacked body 11. As long as the protruding external electrode 13 is formed at a place other than the lower surface of the multilayer body 11, as shown in FIG. 1 and FIG. It may also be formed on the lower surface.

  Next, in FIG. 4 to FIG. 7, a method for manufacturing a laminated electronic component according to an embodiment of the present invention will be described.

  In order to improve manufacturing efficiency, generally, after forming a laminate constituting a plurality of laminated electronic components, the laminate is cut into individual pieces so as to obtain a plurality of laminated electronic components at the same time. Here, in order to simplify the description, FIG. 4 shows the laminate 11a in three rows and two rows as viewed from above, and the position of the external electrode 12 is clearly shown. 5 to 7, only one laminated electronic component and its vicinity are shown in the cross section along the line AA in FIG. 4, and the internal conductor is not shown. In the manufacturing process, the mounting surface (corresponding to the lowermost surface of the multilayer body 11) is stacked so that the mounting surface is upward.

  First, as shown in FIG. 5A, a green sheet 16 made of a ceramic material such as a dielectric material is formed on a base film 15 made of PET or the like.

  Next, as shown in FIG. 5 (b), after the through holes 17 are formed at predetermined locations of the base film 15 and the green sheet 16, as shown in FIG. 5 (c), the through holes 17 are made of Ag or the like. The external electrode 12 is formed by filling with a conductive material. At this time, a part of the conductive material protrudes from the inside of the through hole 17 and spreads to the lower surface of the green sheet 16. Thus, the protruding external electrode 13 is formed by providing the protruding portion 13a protruding from the other external electrode 12 in a top view.

  Then, as shown in FIG. 6A, a laminate in which an internal conductor 18 and a plurality of insulating layers 19 are laminated is prepared. Here, the plurality of insulating layers 19 are in a green sheet state before firing, and the green sheet 16 results in the insulating layer 19 as a result.

  Next, as shown in FIG. 6B, the one obtained in FIG. 5C is laminated on the upper surface of the laminated inner conductor 18 and the plurality of insulating layers 19 described above. At this time, the internal conductor 18 and the external electrode 12 are connected.

  Next, as shown in FIG. 6C, after the base film 15 is removed, as shown in FIG. 7A, pressing is performed from above, whereby the uppermost layer of the external electrode 12 is the green sheet 16. It spreads on the top surface. As a result, a portion protruding from the other external electrode 12 in the top view is formed on the lowermost surface of the multilayer body 11. The protruding portion is caught during cutting, and the external electrode 12 is difficult to come off.

  Next, as shown in FIG. 7 (b), the cutting blade 20 is put in a substantially central portion of the external electrode 12 and cut into pieces. As a result, as shown in FIG. 7C, one laminated electronic component is obtained. Thereafter, firing is performed at a predetermined temperature and time.

  If necessary, a plating layer made of Cu or Sn is formed on the surface of the external electrode 12 thereafter. Further, the external electrode 12 may be formed not on one insulating layer 19 but on a plurality of insulating layers 19.

  As described above, in the multilayer electronic component according to the embodiment of the present invention, the through hole 17 is formed in the insulating layer 19, and the external electrode 12 is provided by filling the through hole 17 with a conductive material. A part of the external electrode 12 is a protruding external electrode 13 having a protruding portion 13 a protruding from the other external electrode 12 in a top view, and the protruding external electrode 13 is formed at a place other than the lower surface of the multilayer body 11. For this reason, a part of the external electrode 12 can be caused to bite into the multilayer body 11 by the protruding portion 13a, whereby the effect that the bonding strength between the multilayer body 11 and the external electrode 12 can be improved is obtained. is there.

  That is, when the product is downsized, it is conceivable to form a through hole in a part of the exposed surface of the laminate and fill the through hole with a conductive material such as Ag to form an external electrode. When the body and the external electrode are simultaneously fired, there is a possibility that the bonding strength between the laminate and the external electrode is deteriorated due to the difference in shrinkage. However, a part of the external electrode 12 is formed on the laminate 11 as in the present invention. By making it bite, an anchor effect is produced, and deterioration of the bonding strength between the laminate 11 and the external electrode 12 is suppressed.

  In the laminated electronic component according to the embodiment of the present invention described above, one protruding external electrode 13 is formed, but a plurality of protruding external electrodes 13 may be formed as shown in FIG.

  Further, as shown in FIG. 8, if another external electrode 12 is formed on both the upper surface and the lower surface of the protruding external electrode 13, the protruding portion 13a can The bonding strength with the external electrode 12 does not decrease.

  Furthermore, at this time, as shown in FIG. 9, if only a part of the protruding external electrode 13 is exposed from the laminated body 11, the area that contacts the cutting blade when the protruding external electrode 13 is divided into individual pieces is reduced. Therefore, it is possible to reduce the possibility that the protruding external electrode 13 is pulled by the cutting blade when the piece is divided, and thus the protruding portion 13a can be present. The bonding strength with the electrode 12 can be improved. In FIG. 9, the shape of the protruding external electrode 13 is comb-shaped, but other shapes may be used. Here, the protruding external electrode 13 on the upper right represents a state in which the entire surface is exposed from the stacked body 11 for reference.

  Then, as shown in FIG. 10, the protruding external electrode 13 may not be exposed at all from the laminated body 11, and with this configuration, the protruding external electrode 13 does not come into contact with the cutting blade when dividing the piece. Therefore, it is possible to prevent the protruding external electrode 13 from being pulled out by being pulled by the cutting blade when the piece is divided, and thus the protruding portion 13a can be surely present. The joint strength can be improved.

  Moreover, as shown in FIG. 11, the protruding external electrode 13 and another external electrode 12 adjacent to the protruding external electrode 13 may be connected via a through hole 21 provided in an insulating layer therebetween. . According to this configuration, even if the protruding external electrode 13 comes into contact with the cutting blade at the time of dividing the piece, the possibility that the protruding external electrode 13 is pulled and pulled out by the through hole 21 can be reduced. Since the portion 13a can be present, the bonding strength between the multilayer body 11 and the external electrode 12 can be improved.

  9 to 11 show only the laminate 11, the other external electrode 12, and the protruding external electrode 13 for the sake of simplicity. 9 to 11, the shape of the protruding external electrode 13 is substantially rectangular when viewed from above, but may be other shapes such as a spiral shape. If the shape is a mesh, the mesh Thus, the upper and lower insulating layers can be more closely attached to each other.

  Further, in FIGS. 9 to 11, the protruding external electrode 13 is not formed by the above-described method, but after forming the external electrode 12 by filling the through hole 17 provided in the insulating layer 19 with a conductive material, The protruding external electrode 13 is formed by screen printing on the upper surface of the insulating layer 19.

  The multilayer electronic component and the method for manufacturing the same according to the present invention have an effect that the bonding strength with the external electrode can be improved. In particular, the common mode used for digital devices, AV devices, information communication terminals, and the like. The present invention is useful in laminated electronic components such as noise filters and the manufacturing method thereof.

DESCRIPTION OF SYMBOLS 11 Laminated body 12 External electrode 13 Protruding external electrode 13a Protruding part 15 Base film 16 Green sheet 17 Through-hole 18 Internal conductor 19 Insulating layer

Claims (6)

A laminate including a plurality of insulating layers and inner conductors formed of a ceramic material, and formed from the lower surface to the side surface of the laminate and connected to the inner conductor , and at least part of the laminate is exposed from the laminate. An external electrode, the through-hole is formed in the insulating layer, and the external electrode is provided by filling the through-hole with a conductive material. A laminated electronic component in which a protruding external electrode having a protruding portion protruding from an electrode is formed, and the protruding external electrode is formed at least at a place other than the lower surface of the laminated body. 2. The multilayer electronic component according to claim 1, wherein another external electrode is formed on both the upper surface and the lower surface of the protruding external electrode. The multilayer electronic component according to claim 2, wherein only a part of the protruding external electrode is exposed from the multilayer body. The multilayer electronic component according to claim 2, wherein the protruding external electrode is not exposed from the multilayer body. The multilayer electronic component according to claim 2, wherein the protruding external electrode and another external electrode adjacent to the protruding external electrode are connected through a through hole provided in an insulating layer therebetween. After forming a green sheet serving as an insulating layer on the base film, the base film, a step of forming a through hole in a predetermined portion of the green sheet, filling the through hole with a conductive material and providing an external electrode, When forming the external electrode, a part of the conductive material protrudes from the inside of the through hole and spreads to the surface of the green sheet, and forms a protruding portion that protrudes from the other external electrode in a top view, Thereby, the manufacturing method of the multilayer electronic component which provided the protrusion external electrode of Claim 1.

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