JP5945187B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate while adsorbing and holding the substrate by a substrate holding means.

  Conventionally, when manufacturing a semiconductor component, a flat panel display, or the like, various processes such as cleaning are performed on a substrate such as a semiconductor wafer or a liquid crystal substrate using a substrate processing apparatus.

  In the substrate processing apparatus, the substrate is processed while the substrate is held by the substrate holding means. As one form of the substrate holding means, there is known a configuration in which the substrate is held by adsorbing the back surface of the substrate on the upper surface of the substrate holding means (see, for example, Patent Document 1).

  In the substrate processing apparatus, the substrate to be processed is carried into the substrate holding means, the back surface of the substrate is sucked and held by the substrate holding means, and the front surface, the side surface, the back surface edge and the like of the substrate are processed. Thereafter, the processed substrate is unloaded from the substrate holding means, and the next substrate to be processed is loaded into the substrate holding means. Thereby, a plurality of substrates are processed continuously.

JP 2003-197570 A

  However, in the conventional substrate processing apparatus, since the back surface of the substrate is attracted and held by the substrate holding means, dust or the like adhering to the back surface of the substrate is easily transferred to the substrate holding means.

  When dust or the like is transferred to the substrate holding means, the dust adheres to a substrate to be processed later, and so-called cross contamination occurs in which dust or the like is transferred between the substrates via the substrate holding means. There is a risk.

Therefore, in the present invention, in the substrate processing apparatus, the substrate holding means for sucking and holding the substrate or the cleaning substrate, the substrate suction mechanism provided in the substrate holding means, and the control for controlling the suction force of the substrate suction mechanism A normal processing step of processing the substrate while adsorbing and holding the substrate to the substrate holding means with a first suction force; and a cleaning substrate to the substrate holding means. And cleaning the substrate holding means by sucking and holding with a suction force of 2, and making the second suction force larger than the first suction force, the normal processing step . than the adhesion force between the substrate and the substrate holding means when performing the processing suction holds the substrate have, when holding adsorb different the cleaning substrate is a Oite the substrate to the cleaning treatment step the cleaning for the substrate and the of It decided to increase the adhesion between the plate holding means.

The substrate holding means includes a plate-shaped plate and a ring made of an elastic material, and elastically deforms when the ring is sucked by the first or second suction force, so that the substrate or the cleaning plate is We decided to adhere to the substrate .

  In addition, the cleaning substrate is made of a material that is more easily adhered to the substrate holding means than the substrate, or heavier than the substrate.

  Further, a cleaning substrate cleaning apparatus for cleaning the cleaning substrate and repeatedly using it is provided.

According to the present invention, in the substrate processing method, a normal processing step of processing the substrate while adsorbing and holding the substrate to the substrate holding means with a first suction force, and a second suction of the cleaning substrate to the substrate holding means. and suction-held with a force and a cleaning process for cleaning of the substrate holding means by the second suction force is greater than the first suction force, Oite the to the normal processing step than the adhesion force between the substrate and the substrate holding means for performing the process the substrate held by suction, the when sucking and holding the different the cleaning substrate is a Oite the substrate to the cleaning treatment step The adhesion between the cleaning substrate and the substrate holding means was increased.

The substrate holding means includes a plate-shaped plate and a ring made of an elastic material, and elastically deforms when the ring is sucked by the first or second suction force, so that the substrate or the cleaning plate is We decided to adhere to the substrate .

  Further, the cleaning substrate is made of a material that is more easily adhered to the substrate holding means than the substrate or heavier than the substrate.

  Further, the cleaning substrate is washed and used repeatedly.

  In the present invention, occurrence of cross contamination between substrates via the substrate holding means can be suppressed.

The top view which shows a substrate processing apparatus. Side surface sectional drawing which shows a substrate processing apparatus. Side surface sectional drawing which shows a substrate liquid processing apparatus. Side surface sectional drawing which shows the board | substrate cleaning apparatus for cleaning. Operation | movement explanatory drawing of a substrate processing apparatus.

  Hereinafter, specific configurations of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 and 2, the substrate processing apparatus 1 forms a carry-in / out unit 2 at the front end. A carrier 4 containing a plurality of (for example, 25) substrates 3 (here, semiconductor wafers) is carried into and out of the carry-in / out section 2.

  Further, the substrate processing apparatus 1 forms a transport unit 5 at the rear part of the carry-in / out unit 2. The transfer unit 5 has a substrate transfer device 6 disposed on the front side, and a substrate delivery table 7 disposed on the rear side. Each substrate delivery table 7 has a processing substrate storage portion 7a for storing the substrates 3 before and after processing in the upper and lower sides on the upper side, and a cleaning substrate for cleaning the chuck (portion for sucking the substrate 3) on the lower side. A cleaning substrate housing portion 7b for housing 3 ′ (details will be described later) is formed. In the transport unit 5, the substrate 3 is transported by using the substrate transport device 6 between any of the carriers 4 placed on the carry-in / out unit 2 and the processing substrate storage unit 7 a of the substrate delivery table 7.

  Further, the substrate processing apparatus 1 forms a processing unit 8 at the rear part of the transport unit 5. The processing unit 8 has substrate transfer devices 9 and 9 extending vertically in the center and vertically arranged substrate liquid processing devices 10 for liquid processing the substrate 3 on the left and right sides of each substrate transfer device 9. Deploy. In addition, the processing unit 8 arranges a cleaning substrate cleaning device 11 for cleaning the cleaning substrate 3 ′ at the rear end. In the processing section 8, the substrate 3 is transported between the processing substrate storage section 7 a of the substrate delivery table 7 and the substrate liquid processing apparatus 10 using the substrate transport apparatus 9, and the substrate 3 is processed using the substrate liquid processing apparatus 10. Liquid treatment is performed. Further, in the processing unit 8, the cleaning substrate 3 ′ is transported between the cleaning substrate storage unit 7 b of the substrate delivery table 7 and the substrate liquid processing apparatus 10 using the substrate transporting device 9, and the cleaning substrate 3 ′ is transported. The substrate liquid processing apparatus 10 is used for cleaning. Further, in the processing section 8, the cleaning substrate 3 ′ is transferred between the substrate liquid processing apparatus 10 and the cleaning substrate cleaning apparatus 11 using the substrate transfer apparatus 9, and the cleaning substrate cleaning apparatus 11 is used for cleaning. The substrate 3 ′ is cleaned. The details of loading and unloading of the substrate 3 and the cleaning substrate 3 ′ in the processing unit 8 will be described later.

  In the following description, the substrate liquid processing apparatus 10 is an apparatus that cleans the edge portion of the substrate 3 with a cleaning liquid. However, the present invention is not limited to this, and any apparatus that processes the substrate 3 may be used. It may be a substrate cleaning processing apparatus that cleans the back surface of the substrate 3 with a cleaning liquid, a substrate cleaning processing apparatus that cleans the edge of the substrate 3 with a brush, or the like. Further, as the cleaning substrate cleaning device 11, a dedicated device for cleaning the cleaning substrate 3 ′ is used, but is not limited thereto, and any device that cleans the back surface of the cleaning substrate 3 ′ may be used. A substrate cleaning apparatus for cleaning the back surface of the substrate 3 may also be used. Further, the cleaning substrate housing portion 7b only needs to be able to accommodate the cleaning substrate 3 ′, and is not limited to the case where the cleaning substrate housing portion 7b is provided together with the processing substrate housing portion 7a. It may be provided.

  As shown in FIG. 3, the substrate liquid processing apparatus 10 is provided with a substrate holding means 13, a cleaning liquid supply means 14, a rinse liquid supply means 15, and a drainage means 16 in the substrate processing chamber 12. Here, the substrate holding means 13 sucks and holds the back surface of the substrate 3 or the cleaning substrate 3 ′. The cleaning liquid supply unit 14 supplies a cleaning liquid (for example, SC1) to the edge portion of the substrate 3 to perform the cleaning process on the substrate 3. The rinsing liquid supply means 15 supplies a rinsing liquid (for example, pure water) to the edge of the substrate 3 to perform a rinsing process on the substrate 3. The drainage means 16 collects the cleaning liquid and rinse liquid supplied to the substrate 3 and discards them outside.

  The substrate holding means 13 is provided with a rotating shaft 17 extending vertically in the substrate processing chamber 12. The rotating shaft 17 forms an intake passage 18 on the rotating shaft. A plate-like plate 20 having a plurality of intake holes 19 is attached to the upper end opening of the intake passage 18. An annular ring 21 made of an elastic material such as rubber is attached to the upper surface of the plate 20. A substrate 3 or a cleaning substrate 3 ′ is placed on the ring 21. A substrate suction mechanism 22 is connected to the lower end opening of the intake passage 18. The substrate suction mechanism 22 is driven and controlled by the control means 23 and can change the suction force. The control means 23 controls the drive of the entire substrate processing apparatus 1.

  Thus, when the substrate suction mechanism 22 is driven, the substrate holding means 13 sucks air from the suction holes 19 and sucks and holds the substrate 3 or the cleaning substrate 3 ′ placed on the ring 21 by the suction force. To do. At that time, the back surface of the substrate 3 or the cleaning substrate 3 ′ crushes the ring 21 and adheres to the upper surface of the ring 21 with a predetermined adhesion force.

  The substrate holding means 13 is not limited to the above-described configuration, and the back surface of the substrate 3 or the cleaning substrate 3 ′ is applied with a predetermined adhesion force (described later, the adhesion force in the case of the substrate 3 and the cleaning substrate 3 ′. It is sufficient if it can be adsorbed and held by a different force. For example, the back surface of the substrate 3 or the cleaning substrate 3 ′ may be directly placed on the upper end surface of the rotating shaft 17 without providing the ring 21. Here, the ring 21 is elastically deformed at the time of suction so that the ring 21 is in good contact with the back surface of the substrate 3 or the cleaning substrate 3 ′.

  Further, the substrate holding means 13 connects the substrate rotating mechanism 24 and the substrate lifting mechanism 25 to the rotating shaft 17. The substrate rotating mechanism 24 and the substrate lifting mechanism 25 are rotationally controlled and lifted / lowered by the control means 23.

  As a result, the substrate holding means 13 rotates the substrate 3 or the cleaning substrate 3 ′ while being sucked and held by driving the substrate suction mechanism 22 and the substrate rotating mechanism 24 during processing. Further, by driving the substrate suction mechanism 22 and the substrate lifting mechanism 25 at the time of loading / unloading before and after processing, the substrate 3 or the cleaning substrate 3 ′ is lifted and lowered.

  The cleaning liquid supply means 14 is provided with a cleaning liquid supply nozzle 26 inside the substrate processing chamber 12. In the cleaning liquid supply nozzle 26, a discharge port 27 is formed at the front end portion toward the edge of the substrate 3, and a cleaning liquid supply source 28 is connected to the base end portion via a flow rate regulator 29. The flow regulator 29 is controlled to open and close and flow by the control means 23.

  The rinse liquid supply means 15 is provided with a rinse liquid supply nozzle 30 inside the substrate processing chamber 12. The rinsing liquid supply nozzle 30 has a discharge port 31 formed at the distal end thereof toward the end edge of the substrate 3, and a rinsing liquid supply source 32 is connected to the base end via a flow rate regulator 33. The flow regulator 33 is opened and closed and its flow rate is controlled by the control means 23.

  The drainage means 16 is provided with a cup 34 outside the outer periphery of the substrate 3 or the cleaning substrate 3 ′. The cleaning liquid and the rinsing liquid are shaken off to the outer periphery of the substrate 3 by the centrifugal force of the rotating substrate 3 and collected in the cup 34. The cup 34 is connected to a drain line 35 for discarding the recovered cleaning liquid and rinse liquid to the outside.

  The substrate liquid processing apparatus 10 has the configuration described above, and drives the substrate suction mechanism 22 to suck and hold the substrate 3 or the cleaning substrate 3 ′. At that time, if the substrate 3 and the cleaning substrate 3 'have the same hardness (same material, thickness, etc.), the substrate 3 and the substrate holding means are changed by changing the suction force by the substrate suction mechanism 22. The adhesion force between the cleaning substrate 3 ′ and the cleaning substrate 3 ′ and the substrate holding means 13 can be changed. Further, by changing the material and thickness of the substrate 3 and the cleaning substrate 3 ′, the ease of contact with the substrate holding means 13 is changed, and the contact force can be changed even with the same suction force.

  As shown in FIG. 4, the cleaning substrate cleaning apparatus 11 is provided with a cleaning substrate holding means 37, a cleaning liquid supply means 38, and a drainage means 39 in the cleaning substrate processing chamber 36. Here, the cleaning substrate holding means 37 holds the edge of the cleaning substrate 3 ′. The cleaning liquid supply means 38 supplies a cleaning liquid (for example, pure water) to the front and back surfaces of the cleaning substrate 3 ′ to perform the cleaning process on the cleaning substrate 3 ′. The drainage means 39 collects the cleaning liquid supplied to the cleaning substrate 3 ′ and discards it outside.

  In the following description, an apparatus for cleaning both the front and back surfaces of the cleaning substrate 3 ′ will be described as the cleaning substrate cleaning apparatus 11. However, an apparatus for cleaning only the back surface of the cleaning substrate 3 ′ may be used. When supplying the cleaning liquid to the cleaning surface with the cleaning surface (back surface) of the cleaning substrate 3 ′ facing upward, a reversing mechanism that reverses the front and back of the cleaning substrate 3 ′ is required.

  The cleaning substrate holding means 37 is provided with a rotating shaft 40 extending vertically in the cleaning substrate processing chamber 36. A disc-shaped turntable 41 is attached to the upper end portion of the rotating shaft 40. A holding body 42 is attached to the outer periphery of the turntable 41 at intervals in the circumferential direction. A cleaning substrate 3 ′ is placed on top of the holding body 42. A rotating mechanism 43 and a lifting mechanism 44 are connected to the rotating shaft 40. The rotation mechanism 43 and the lifting mechanism 44 are rotationally controlled and lifted / lowered by the control means 23. Thereby, the cleaning substrate holding means 37 rotates the cleaning substrate 3 ′ while holding the cleaning substrate 3 ′ by driving the rotation mechanism 43 during the cleaning process. Further, by driving the elevating mechanism 44 at the time of carrying in / out before and after the cleaning process, the elevating mechanism 44 is moved up and down while holding the cleaning substrate 3 ′.

  The cleaning liquid supply means 38 is provided with a cleaning liquid supply nozzle 45 inside the cleaning substrate processing chamber 36. The cleaning liquid supply nozzle 45 has a discharge port 46 formed at the front end portion toward the center of the surface of the cleaning substrate 3 ′, and a cleaning liquid supply source 47 is connected to the base end portion via a flow rate regulator 48. . The flow rate regulator 48 is controlled to open and close and flow rate is controlled by the control means 23.

  Further, the cleaning liquid supply means 38 forms a cleaning liquid supply nozzle 52 on the rotation shaft 40 of the cleaning substrate holding means 37 and the central axis of the turntable 41. The cleaning liquid supply nozzle 52 has a discharge port 53 formed in the center of the turntable 41 toward the center of the back surface of the cleaning substrate 3 ′ and a communication hole 54 extending vertically in the center of the rotating shaft 40. Yes. A cleaning liquid supply source 47 is connected to the communication hole 54 via a flow rate regulator 55. The flow rate regulator 55 is opened / closed and flow rate controlled by the control means 23.

  The drainage means 39 is provided with a cup 49 outside the outer periphery of the cleaning substrate 3 ′. The cleaning liquid is spun off to the outer periphery of the cleaning substrate 3 ′ by the centrifugal force of the rotating cleaning substrate 3 ′ and collected in the cup 49. The cup 49 is connected to a drain line 50 for discarding the recovered cleaning liquid to the outside.

  The substrate processing apparatus 1 is configured as described above, and processes the substrate 3 according to the substrate processing program recorded on the recording medium 51 readable by the control means 23 (computer) (see FIG. 5). The substrate 3 is transported from the carrier 4 to the processing substrate housing portion 7a of the substrate delivery table 7 before processing, and is transported from the processing substrate housing portion 7a to the carrier 4 after processing. The cleaning substrate 3 ′ used during the processing of the substrate 3 is previously stored in the cleaning substrate storage portion 7b.

  First, the substrate processing apparatus 1 carries the substrate 3 into the substrate liquid processing apparatus 10 from the processing substrate container 7a using the substrate transfer apparatus 9.

  In the substrate liquid processing apparatus 10, a normal processing process for cleaning the substrate 3 is executed. In this normal processing step, the substrate 3 is held using the substrate holding means 13. At that time, the substrate suction mechanism 22 is driven to attract the back surface of the substrate 3 to the upper portion of the ring 21 with a predetermined adhesion force by the suction force. As a result, when dust or the like adheres to the back surface of the substrate 3, the dust or the like adheres from the back surface of the substrate 3 to the substrate holding means 13 (ring 21) due to the adhesion between the substrate 3 and the substrate holding means 13. Transferred. Thereafter, the substrate 3 is rotated by the substrate rotating mechanism 24, and the cleaning liquid is supplied to the edge portion of the substrate 3 by the cleaning liquid supply means 14 for a predetermined time to perform the cleaning process of the substrate 3. Thereafter, the rinsing liquid is supplied to the edge portion of the substrate 3 by the rinsing liquid supply means 15 for a predetermined time to perform the rinsing process on the substrate 3. Thereafter, the substrate 3 is rotated for a predetermined time by the substrate rotating mechanism 24, and the rinsing liquid is spun off from the surface of the substrate 3 to perform a drying process.

  Next, the substrate processing apparatus 1 unloads the substrate 3 from the substrate liquid processing apparatus 10 to the processing substrate accommodating portion 7a using the substrate transfer apparatus 9.

  Next, the substrate processing apparatus 1 carries the cleaning substrate 3 ′ into the substrate liquid processing apparatus 10 from the cleaning substrate housing portion 7 b using the substrate transfer device 9.

  In the substrate liquid processing apparatus 10, a cleaning process for cleaning the substrate holding means 13 with the cleaning substrate 3 ′ is executed. In this cleaning process, the cleaning substrate 3 ′ is held using the substrate holding means 13. At that time, the substrate suction mechanism 22 is driven, and the back surface (cleaning surface) of the cleaning substrate 3 ′ is adsorbed to the upper portion of the ring 21 with a predetermined adhesion force by the suction force. Here, the adhesion force between the cleaning substrate 3 ′ and the substrate holding means 13 in the cleaning process step is made larger than the adhesion force between the substrate 3 and the substrate holding means 13 in the previous normal processing step. ing. As a result, when dust or the like adheres to the substrate holding means 13 (ring 21) (when dust or the like is transferred from the substrate 3 to the substrate holding means 13 in the normal processing step), the normal processing step Dust or the like is removed from the substrate holding means 13 (ring 21) by the adhesion force between the cleaning substrate 3 ′ and the substrate holding means 13 which is higher than the adhesion force between the substrate 3 and the substrate holding means 13. It is transferred to the back surface (cleaning surface). That is, dust or the like adhering to the substrate holding means 13 is removed.

  Next, the substrate processing apparatus 1 transfers the cleaning substrate 3 ′ from the substrate liquid processing apparatus 10 to the cleaning substrate cleaning apparatus 11 using the substrate transfer apparatus 9.

  The cleaning substrate cleaning apparatus 11 executes a cleaning process for cleaning the surface (cleaning surface) in contact with the substrate holding means 13 of the cleaning substrate 3 ′. In this cleaning process, the cleaning substrate 3 ′ is held using the cleaning substrate holding means 37. Thereafter, the cleaning substrate 3 ′ is rotated by the rotation mechanism 43, and the cleaning liquid is supplied to the front and back surfaces of the cleaning substrate 3 ′ by the cleaning liquid supply means 38 and 52 for a predetermined time to perform the cleaning process on the cleaning substrate 3 ′. Thereafter, the cleaning substrate 3 ′ is rotated by the rotation mechanism 43 for a certain period of time, and the cleaning liquid is shaken off from the front and back surfaces of the cleaning substrate 3 ′ to perform a drying process. Thereby, dust etc. are removed from the back surface (cleaning surface) of the cleaning substrate 3 ′, and the cleaning substrate 3 ′ can be used repeatedly.

  Next, the substrate processing apparatus 1 uses the substrate transport device 9 to carry it out of the cleaning substrate cleaning device 11 to the cleaning substrate housing portion 7b.

  In the substrate processing apparatus 1, a plurality of substrates 3 are continuously processed by repeating the above processing. Each time a normal processing step for processing the substrate 3 is executed, a cleaning processing step for cleaning the substrate holding means 13 using the cleaning substrate 3 ′ may be executed, and after a plurality of normal processing steps are executed. One cleaning process may be performed. Further, each time the cleaning process step is executed, a cleaning process step for cleaning the cleaning substrate 3 ′ may be executed, or a single cleaning process step may be executed after a plurality of cleaning process steps are executed. . Furthermore, the normal processing step and the cleaning processing step may be performed in parallel.

  As described above, in the substrate processing apparatus 1, the normal processing process for processing the substrate 3 while adsorbing and holding the substrate 3 by the substrate holding means 13 and the cleaning substrate 3 ′ are adsorbed by the substrate holding means 13. A cleaning process for holding and cleaning the substrate holding means 13 is performed. In the substrate processing apparatus 1, the adhesion force between the cleaning substrate 3 ′ and the substrate holding means 13 in the cleaning process step is greater than the adhesion force between the substrate 3 and the substrate holding means 13 in the normal processing step. It is getting bigger.

  Thereby, dust or the like adhering to the substrate 3 is temporarily transferred to the substrate holding means 13 in the normal processing step, but is transferred from the substrate holding means 13 to the cleaning substrate 3 ′ in the cleaning processing step. Removed. Therefore, dust or the like can be prevented from reattaching to the substrate 3 to be processed later, and occurrence of cross contamination between the substrates via the substrate holding means 13 can be suppressed.

  The adhesion force to the substrate holding means 13 can be easily increased by making the suction force of the substrate suction mechanism 22 of the substrate holding means 13 larger in the cleaning process than in the normal process.

  Further, by making the material and weight of the cleaning substrate 3 ′ different from the substrate 3, the cleaning substrate 3 ′ can be more closely attached to the substrate holding means 13 than the substrate 3, and the adhesion force to the substrate holding means 13 can be improved. Can also be increased.

  In the substrate processing apparatus 1, the case where the present invention is applied to the cleaning processing apparatus for the substrate 3 has been described, but the present invention can also be applied to an exposure processing apparatus, a coating processing apparatus, a plating processing apparatus, and the like.

1 Substrate processing device 3 Substrate
3 'Cleaning substrate
7a Processing substrate holder
7b Cleaning substrate container 9 Substrate transfer device
10 Substrate liquid processing equipment
11 Substrate cleaning equipment for cleaning
13 Substrate holding means

Claims (8)

A substrate holding means for adsorbing and holding a substrate or a cleaning substrate;
A substrate suction mechanism provided in the substrate holding means;
Control means for controlling the suction force of the substrate suction mechanism;
Have
The control means includes
A normal processing step of processing the substrate while adsorbing and holding the substrate to the substrate holding means with a first suction force;
A cleaning process for cleaning the substrate holding means by adsorbing and holding the cleaning substrate to the substrate holding means with a second suction force; and
And
To be greater than the first suction force said second suction force, between the substrate and the substrate holding means when performing the normal processing steps for Oite the substrate adsorbed and held in the processing than adhesion, characterized in that to increase the adhesion between said cleaning substrate at the time of suction holding different the cleaning substrate the substrate holding means and Oite the substrate to the cleaning treatment step Substrate processing equipment. The substrate holding means includes a plate-like plate and a ring made of an elastic material, and is elastically deformed when the ring is sucked by the first or second suction force to the substrate or the cleaning substrate. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is closely attached .   The substrate processing apparatus according to claim 1, wherein the cleaning substrate is made of a material that is more easily adhered to the substrate holding unit than the substrate or is heavier than the substrate.   The substrate processing apparatus according to claim 1, further comprising a cleaning substrate cleaning apparatus for cleaning and repeatedly using the cleaning substrate. A normal processing step for processing the substrate while adsorbing and holding the substrate to the substrate holding means with a first suction force; and
A cleaning process for cleaning the substrate holding means by adsorbing and holding the cleaning substrate to the substrate holding means with a second suction force; and
Have
To be greater than the first suction force said second suction force, between the substrate and the substrate holding means when performing the normal processing steps for Oite the substrate adsorbed and held in the processing than adhesion, characterized in that to increase the adhesion between said cleaning substrate at the time of suction holding different the cleaning substrate the substrate holding means and Oite the substrate to the cleaning treatment step Substrate processing method. The substrate holding means includes a plate-like plate and a ring made of an elastic material, and is elastically deformed when the ring is sucked by the first or second suction force to the substrate or the cleaning substrate. The substrate processing method according to claim 5, wherein the substrates are in close contact .   7. The substrate processing method according to claim 5, wherein the cleaning substrate is made of a material that is more easily adhered to the substrate holding unit than the substrate or heavier than the substrate. The substrate processing method according to claim 5, wherein the cleaning substrate is washed and used repeatedly.

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