JP5943585B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting device, and more particularly to a manual type cutting device.

  A semiconductor wafer (hereinafter simply abbreviated as a wafer) formed on a surface by a plurality of devices such as ICs and LSIs divided by division lines formed in a lattice shape is an opening that accommodates the wafer via a dicing tape. Is divided into individual devices by a cutting device, and the divided devices are widely used in various electric devices such as mobile phones and personal computers.

  The cutting apparatus includes: a chuck table that holds a workpiece such as a wafer; a cutting means that rotatably supports a cutting blade that cuts the workpiece held on the chuck table; and the cutting blade and the workpiece. A cutting water supply means for supplying cutting water, a loading / unloading area for loading and unloading a workpiece with respect to the chuck table, and a positioning means for positioning the chuck table in a cutting area in which the cutting means is disposed. Thus, the workpiece can be divided into individual devices with high accuracy (see, for example, JP-A-2007-103833).

  The wafer is cut by the cutting blade while supplying cutting water. Cutting water adheres to both the front and back surfaces of the wafer after cutting. In a conventional manual type cutting device, an air gun is locked to the outer cover on the front side of the loading / unloading area of the cutting device, and the cutting water adhering to the surface of the wafer is blown off by this air gun so that the wafer is carried out from the chuck table. I was doing.

JP 2007-103833 A

  When cutting water adhering to the surface of the wafer with an air gun and removing the wafer from the chuck table, the cutting water adhering to the back surface of the wafer, that is, the back surface of the dicing tape disposed on the ring frame, drops and wets the floor. There is.

  Therefore, conventionally, the operator (operator) has to perform the work of blowing off the cutting water adhering to the back surface of the dicing tape attached to the frame with an air gun after unloading the wafer from the chuck table, and it is not easy to endure. There was a problem.

  The present invention has been made in view of the above points, and the object of the present invention is to cut cutting adhered to the back surface of a dicing tape adhered to a frame with an air gun when a workpiece is unloaded from a chuck table. It is an object of the present invention to provide a cutting device that can eliminate the need to blow off water.

According to the present invention, there is provided a cutting apparatus for cutting a workpiece having a plurality of devices formed on the front surface and a dicing tape attached to the back surface, the chuck table holding the workpiece via the dicing tape, A cutting means for rotatably supporting a cutting blade for cutting the workpiece held on the chuck table, a cutting water supply means for supplying cutting water to the cutting blade and the workpiece, and a chuck table The dicing tape is disposed in the vicinity of the front side of the carry-in / out area, and positioning means for positioning the chuck table in the carry-in / out area for carrying in and out the workpiece and the cutting area in which the cutting means is arranged. comprising of a wiper made of an elastic member which wipe the cutting water workpiece is attached to a surface that is not attached, the cutting water attached to the surface of the workpiece is blown with air Cutting device is provided, characterized in that the field.

  In the cutting device of the present invention, a wiper made of an elastic member for wiping off the cutting water adhering to the back surface of the workpiece is disposed in the vicinity of the front surface side of the carry-in / out region. The operation of blowing off the cutting water adhering to the back surface of the dicing tape thus made becomes unnecessary.

It is a perspective view of the cutting device concerning the embodiment of the present invention. It is a perspective view which shows a mode that the cut wafer is carried out from a chuck table. It is a perspective view which shows a mode that the cutting water adhering to the back surface of a dicing tape is wiped off with a wiper, carrying out the cut wafer from a chuck | zipper table.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device 2 according to an embodiment of the present invention is shown. The cutting device 2 is a manual-type cutting device, in which an operator holds a workpiece by hand and loads it onto the chuck table 18 or unloads a workpiece that has already been cut from the chuck table 18. .

  Reference numeral 4 denotes an exterior cover of the cutting apparatus 2. A transparent cover 6 is attached to the exterior cover 4 so as to be opened and closed by a hinge 8, and a transparent cover 10 is attached so as to be opened and closed by a hinge 12. The transparent covers 6 and 12 are made of a transparent resin such as polycarbonate. The transparent cover 6 is opened and closed by holding the handle 14 by hand, and the transparent cover 10 is opened and closed by holding the handle 16 by hand.

  A chuck table 18 sucks and holds a workpiece, and is configured to be rotatable and reciprocally movable in the X-axis direction by a machining feed mechanism. As best shown in FIG. 3, the chuck table 18 has a suction holding portion 18a formed of porous ceramics or the like, and the workpiece carried on the chuck table 18 is sucked and held by the suction holding portion 18a. Is done. Four clamps 32 are disposed around the chuck table 18.

  The back surface of the semiconductor wafer W, which is a workpiece, is attached to the dicing tape T, and the outer periphery of the dicing tape T is attached to the ring frame F. As a result, the semiconductor wafer W is supported by the frame F via the dicing tape T and is put into the cutting apparatus 2 in this state. The clamp 32 clamps the ring frame F.

  Reference numeral 20 denotes a cutting unit, and the cutting unit 20 includes a cutting blade 26 attached to the tip of a spindle (not shown). When cutting a workpiece, the spindle on which the cutting blade 26 is mounted is rotated at a high speed (for example, 30000 rpm) by a motor (not shown).

  The upper half of the cutting blade 26 is covered with a blade cover 28. The blade cover 28 is provided with a cutting water nozzle 30 for supplying cutting water to the cutting blade 26 and the workpiece when cutting the workpiece. .

  The chuck table 18 is moved by a work feeding mechanism between a carry-in / out area 22 for carrying in and out a workpiece and a cutting area 24 in which the cutting unit 20 is disposed. This processing feed mechanism acts as positioning means for positioning the chuck table 18 in the carry-in / out area 22 and the cutting area 24.

  Reference numeral 31 denotes an image pickup unit including a microscope and a CCD camera, and picks up an image of the wafer W to detect a division line that is an area to be cut. In the vicinity of the front side of the carry-in / out area 22, a wiper 34 for wiping off the cutting water adhering to the dicing tape T is disposed. The wiper 34 is made of rubber or sponge.

  Reference numeral 36 denotes an air gun that blows off the cutting water adhering to the surface of the wafer W and is engaged with the hook 40. A flexible hose 38 sends compressed air to the air gun 36.

  Hereinafter, the operation of the cutting apparatus 2 configured as described above will be described. When cutting the wafer W, the operator of the cutting apparatus 2 grasps the handle 14 to open the transparent cover 6, and the wafer W supported by the frame F is placed on the chuck table 18 positioned at the loading / unloading position 22. The wafer W is placed and sucked and held via the dicing tape T by applying a negative pressure to the sucking and holding part 18a, and the frame F is clamped and fixed by the clamp 32.

  Next, the processing feed mechanism is driven to move the wafer W directly below the image pickup unit 31, and the image pickup unit 31 picks up an image of the wafer W, and performs alignment for detecting a planned division line of the wafer W to be cut. This alignment is performed on the lines to be divided in two orthogonal directions.

  After the alignment is performed, the machining feed mechanism is driven to position the chuck table 18 in the cutting area 24, and the cutting blade 26 is rotated at a high speed in this cutting area 24 to be cut into the planned dividing line of the wafer W to drive the machining feed mechanism. Then, the wafer W is cut along the division line. During this cutting, cutting is performed while cutting water is supplied from the cutting water nozzle 30 to the cutting blade 26 and the wafer W.

  While the cutting unit 20 is indexed and fed in the Y-axis direction, all the division lines that extend in the first direction are cut. Next, after the chuck table 18 is rotated by 90 degrees, the wafer W is cut along a planned division line extending in the second direction. When the cutting process is completed, the wafer W is divided into individual devices, but since the wafer W is adhered to the dicing tape T, the shape of the wafer W is maintained.

  When the cutting of the wafer W is completed, the chuck table 18 is positioned in the carry-in / out region 22 by a processing feed mechanism that functions as positioning means. In this state, the operator grasps the air gun 36 and blows off the cutting water adhering to the surface of the wafer W.

  Next, the suction holding of the chuck table 18 is released, the clamp 32 is unclamped, and the wafer W supported by the frame F is pulled out in the direction indicated by the arrow Y1, as shown in FIGS.

  At this time, since the wiper 34 is provided on the front side in the vicinity of the carry-in / out area 22, the cutting water adhering to the back surface of the dicing tape T is wiped off by the wiper 34, and the cutting water dripped and wets the floor. Can be solved.

  In the present embodiment, since the wiper 34 intends to wipe off the cutting water adhering to the back surface of the dicing tape T, the operator does not draw the wafer W after the cutting process in an obliquely upward direction, and the arrow Y1 The cutting water adhering to the back surface of the dicing tape T is wiped off by the wiper 34 by being pulled out in the horizontal direction indicated by.

2 Cutting device 18 Chuck table 20 Cutting unit 22 Loading / unloading area 24 Cutting area 26 Cutting blade 34 Wiper 36 Air gun

Claims (1)

A cutting apparatus that cuts a workpiece having a plurality of devices formed on the front surface and a dicing tape attached to the back surface,
A chuck table for holding a workpiece via the dicing tape ;
Cutting means for rotatably supporting a cutting blade for cutting a workpiece held on the chuck table;
Cutting water supply means for supplying cutting water to the cutting blade and the workpiece;
Positioning means for positioning the chuck table in a loading / unloading area for loading and unloading the workpiece with respect to the chuck table and a cutting area in which the cutting means is disposed;
A wiper made of an elastic member that is disposed near the front side of the carry-in / out region and wipes off the cutting water adhering to the surface to which the workpiece of the dicing tape is not attached ,
A cutting apparatus in which cutting water adhering to the surface of a workpiece is blown off by air .

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