JP5940328B2 - Exposure drawing apparatus, program, and exposure drawing method - Google Patents

Description

  The present invention relates to an exposure drawing apparatus, a program, and an exposure drawing method, and in particular, an exposure drawing apparatus that draws a circuit pattern by exposing a light beam to an exposed substrate, a program executed by the exposure drawing apparatus, and The present invention relates to an exposure drawing method for drawing a circuit pattern by exposing a substrate to be exposed with a light beam.

  Conventionally, when a plurality of processing requests are continuously made to an apparatus such as an image recording apparatus and an exposure / drawing apparatus, a plurality of related processing requests requested at one time are collectively made into one job, and the processing request A plurality of jobs are successively executed sequentially according to the order in which the occurrences occur. At this time, at the stage where the processing of the number of processing sheets set for the job being executed is completed, the job being executed is ended and the execution of the next job is started.

  However, when executing multiple jobs, if the number of recording media to be processed is insufficient or the type and size of the transported recording media are different from those set for the job, the processing is performed. Since it cannot continue, an error is generated and the process is stopped. In particular, when the apparatus is an exposure drawing apparatus, it takes a certain amount of time to recover once the exposure process is stopped due to an error or the like. Therefore, the exposure process is continued until the end without stopping as much as possible. It is desirable.

  As a technique for solving this problem, Patent Document 1 discloses a technique for suppressing a line stop and secondary damage occurrence due to an error by registering a dummy job exposure process when jobs set in advance are different. Has been. In this technology, when the recipe that is the job registration data sent from the upstream is not in the recipe file, the dummy job is registered, the operator is notified that the dummy job has been registered, and waits for an event. enter. The operator who is notified that the dummy job has been registered replaces the dummy job with a normal job, so that the exposure process continues normally and the exposure process is interrupted even when the job is executed. Can continue without.

Japanese Patent Laid-Open No. 11-162827

  In the technique disclosed in Patent Document 1, it is necessary to replace a dummy job with a normal job after the dummy job is registered until the dummy job is executed. If the replacement cannot be made in time, the exposure process is interrupted. Even if the process can be continued, there is a problem in that useless exposure processing by a dummy job occurs.

  The present invention has been made in view of the above problems, and an exposure drawing apparatus and program capable of suppressing an inadvertent line stop without performing unnecessary exposure processing as much as possible when a plurality of jobs are continuously performed. An object of the present invention is to provide an exposure drawing method.

  In order to achieve the above object, the exposure drawing apparatus according to the present invention is set based on a plurality of exposure processing requests that each set substrate information indicating the type of substrate to be exposed and request an exposure process according to the exposure information. Exposure processing execution means for sequentially performing each of the exposure processes on the substrate to be exposed, detection means for detecting the substrate information of the exposure target substrate to be exposed, detection substrate information detected by the detection means and executing A comparison means for comparing the in-execution substrate information set in the exposure processing request, and based on the comparison result of the comparison means, the detected substrate information of the substrate to be exposed next to be subjected to the exposure process is the in-execution substrate information. In the same case, the ongoing exposure processing request is continuously executed for the next substrate to be exposed, and the detected substrate information is different from the executing substrate information and the next exposure processing request Set to If the same as the plate information, the switching means for switching the exposure processing request executed by the exposure processing execution means so as to end the execution of the exposure processing request being executed and start execution of the next exposure processing request. And.

  According to this exposure drawing apparatus, the substrate information indicating the type of the substrate to be exposed is set by the exposure processing execution unit, and the substrate to be exposed is based on a plurality of exposure processing requests that request exposure processing according to the exposure information. Each of the exposure processes is sequentially executed.

  Here, in the present invention, the detection unit detects the substrate information of the exposure target substrate, and the comparison unit sets the detected substrate information detected by the detection unit and the exposure processing request being executed. The substrate information during execution is compared.

  Further, in the present invention, when the detection substrate information of the substrate to be exposed next to be subjected to the exposure processing is the same as the executing substrate information based on the comparison result of the comparison means, the next exposure processing is performed by the switching unit. An ongoing exposure processing request is continuously executed for the target substrate to be exposed, and the detected substrate information is different from the executing substrate information and is the same as the substrate information set in the next exposure processing request. The exposure process request executed by the exposure process execution means is switched so that the currently executed exposure process request is terminated and the execution of the next exposure process request is started.

  Thus, according to the exposure drawing apparatus according to the present invention, when a plurality of exposure processing requests (jobs) are continuously performed, according to the substrate information of the substrate to be exposed next, the substrate to be exposed Is the substrate to be used in the next job instead of the substrate used in the job being executed, the unnecessary job is processed as much as possible as a result of starting the next job and starting the next job. An inadvertent line stop can be suppressed without performing.

  According to the present invention, each of the plurality of exposure processing requests is set with number information indicating the number of processed substrates, and the switching means is executing the number of exposure processing executed by the exposure processing execution means. The detected substrate information of the next substrate to be exposed is executed based on the comparison result of the comparison means when the predetermined number of sheets determined according to the number of sheets set in the exposure processing request is reached. If it is the same as the intermediate substrate information, the ongoing exposure processing request is continuously executed for the next exposure target substrate, and the detected substrate information is different from the active substrate information and the next When the exposure information is the same as the substrate information set in the exposure processing request, it is executed by the exposure processing execution means so as to end the ongoing exposure processing request and start execution of the next exposure processing request. Disconnect the exposure processing request It may be obtained. This makes it possible to determine whether or not to switch jobs at an appropriate timing.

  Further, in order to achieve the above object, an exposure drawing apparatus according to the present invention is based on a plurality of exposure processing requests in which substrate information indicating the type of a substrate to be exposed is set and an exposure process corresponding to the exposure information is requested. Exposure processing execution means for sequentially executing each of the exposure processes on the substrate to be exposed, detection means for detecting the substrate information of the exposure target substrate to be exposed, and detection substrate information detected by the detection means, The comparison means for comparing the switching substrate information set in the switched exposure processing request, and the comparison after switching so that the execution of the next exposure processing request is started after finishing the current exposure processing request. Based on the comparison result of the means, when the detected substrate information of the next exposure target substrate is the same as the switching substrate information, the exposure after switching to the next exposure target substrate Processing request When the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request that was executed immediately before switching, the detected substrate information is the next to the exposure target substrate to be exposed. Switching means for switching the exposure processing request executed by the exposure processing execution means so that the exposure processing request executed immediately before the switching is continuously executed.

  As described above, according to the exposure drawing apparatus according to the present invention, when a plurality of exposure processing requests (jobs) are continuously performed, after the job is switched, the substrate information of the substrate to be exposed to be processed next is used. If the substrate to be exposed is not the substrate to be used in the job after switching but the substrate to be used in the previous job, the job immediately before switching is continuously executed, resulting in unnecessary exposure processing. Inadvertent line stoppage can be suppressed without performing as much as possible.

  In the present invention, each of the plurality of exposure processing requests is set with number information indicating the number of processed substrates, and the switching means terminates the currently executing exposure processing request and performs the next exposure processing request. When the number of exposure processes executed by the exposure process execution means becomes a predetermined number determined according to the number of processes set in the exposure process request being executed. Based on the comparison result of the comparing means, when the detected substrate information of the next exposure target substrate is the same as the switching substrate information, the next exposure target substrate is switched. When the subsequent exposure processing request is executed and the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request executed immediately before switching, the next exposure processing target Substrate to be exposed To run continuously exposure processing request that was being executed immediately before switching for, it may be switched to the exposure processing request to be executed in the exposure process execution means. This makes it possible to determine whether or not to switch jobs at an appropriate timing.

  The present invention further includes accepting means for accepting an input of the number of substrates to be exposed that allows switching of exposure processing requests, wherein the predetermined number is the number of processed sheets set for an ongoing exposure process and the accepting means. It may be determined in accordance with the number of sheets received by. This makes it possible to determine whether or not to switch jobs according to the number of substrates to be exposed that allow switching of exposure processing requests.

  In addition, the present invention further includes a receiving unit that receives an input of the number of substrates to be exposed that allows switching of an exposure processing request, and the switching unit is executed in the exposure processing request being executed by the exposure processing execution unit. When the number of exposure processes is equal to or greater than the number obtained by subtracting the number accepted by the accepting unit from the number set for the exposure process being executed, and adding one, based on the comparison result of the comparing unit If the detected substrate information of the substrate to be exposed next is the same as the switching substrate information, an exposure processing request after switching is executed on the substrate to be exposed next. When the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request executed immediately before switching, the next exposure processing target substrate To run continuously exposure processing request was being executed immediately before switching to, and is may be switched to the exposure processing request executed by the exposure process execution means. In addition, the present invention further includes a receiving unit that receives an input of the number of substrates to be exposed that allows switching of an exposure processing request, and the switching unit is executed in the exposure processing request being executed by the exposure processing execution unit. The detected substrate information of the substrate to be exposed next is the same as the switching substrate information based on the comparison result of the comparing means when the number of exposure processing sheets is less than or equal to the number accepted by the accepting means. The exposure processing request after switching is executed for the substrate to be exposed next, and the detected substrate information is different from the switching substrate information and is executed immediately before switching. If it is the same as the set substrate information, the exposure processing request that was executed immediately before switching is continuously executed for the next exposure target substrate to be exposed. It may be switched to the exposure processing request to be executed in the exposure process execution means. This makes it possible to determine whether or not to switch jobs according to the number of substrates to be exposed that allow switching of exposure processing requests.

Further, the present invention, the switching means, when switching an exposure processing request to be executed in the exposure process real Gyote stage may further include an output means for outputting information determined in advance. Thereby, it is possible to notify the operator that the job has been switched.

  According to the present invention, the substrate information is information including a size of the substrate and a position and a type of an alignment mark formed on the substrate, and the detection means includes the size of the substrate to be exposed, the size of the substrate to be exposed. You may make it detect at least 1 of the position of the alignment mark formed in the exposure board | substrate, and the kind of alignment mark formed in the to-be-exposed board | substrate as board | substrate information. Thereby, the board | substrate information of a to-be-exposed board | substrate can be detected easily.

  In the present invention, when the detected substrate information is different from the executing substrate information and different from the substrate information set in the next exposure processing request, the exposure substrate to be exposed next is exposed. You may make it further provide the discharge means which discharges outside the apparatus without performing a process. In the present invention, when the detected substrate information is different from the switching substrate information and different from the substrate information set in the exposure processing request executed immediately before the switching, the exposure target to be subjected to the next exposure processing target You may make it further provide the discharge means which discharges | emits a board | substrate outside the apparatus, without performing an exposure process. Thereby, it is possible to avoid performing unnecessary exposure processing when the exposure processing cannot be continued.

  In the present invention, the detection means detects the size of the exposure target substrate when the next exposure target substrate is carried in, and detects the size based on the comparison result of the comparison means. If the substrate information is different from the substrate information being executed and is different from the substrate information set in the next exposure processing request, the substrate to be exposed next is directly exposed outside the apparatus without performing the exposure processing. You may make it further provide the discharge means to discharge | emit. In the present invention, the detection means detects the size of the exposure target substrate when the next exposure target substrate is carried in, and detects the size based on the comparison result of the comparison means. If the substrate information is different from the switching substrate information and different from the substrate information set in the exposure processing request that was executed immediately before switching, the exposure substrate to be exposed next is not subjected to the exposure processing. You may make it further provide the discharge means which discharges to the apparatus exterior as it is. Thereby, it is possible to avoid performing unnecessary exposure processing when the exposure processing cannot be continued.

  On the other hand, in order to achieve the above object, a program according to the present invention causes a computer to function as a comparison unit and a switching unit in an exposure drawing apparatus according to any one of claims 1 to 13.

  Therefore, according to the program according to the present invention, since the computer can be operated in the same manner as the exposure drawing apparatus, the computer operates in the same manner as the exposure drawing apparatus. When performing, unnecessary line stop can be suppressed without performing unnecessary exposure processing as much as possible.

On the other hand, in order to achieve the above object, an exposure drawing method according to the present invention is based on a plurality of exposure processing requests in which substrate information indicating the type of a substrate to be exposed is set and an exposure process corresponding to the exposure information is requested An exposure process execution step for sequentially executing each of the exposure processes on the substrate to be exposed, a detection step for detecting substrate information of the exposure target substrate to be exposed, and detected substrate information detected in the detection step; Based on the comparison step of comparing the execution substrate information set in the exposure processing request being executed and the comparison result of the comparison step , the detection substrate information of the substrate to be exposed next is the execution substrate. If the information is the same as the information, the exposure processing request being executed for the next exposure target substrate is continuously executed, and the detected substrate information is different from the executing substrate information and the next If it is the same as the substrate information set in the exposure process request, it is executed in the exposure process execution step so that the currently executed exposure process request is terminated and the execution of the next exposure process request is started. And a switching step for switching the exposure processing request.

  Therefore, according to the exposure drawing method according to the present invention, since it operates in the same manner as the exposure drawing apparatus, when performing a plurality of jobs in succession as in the exposure drawing apparatus, unnecessary exposure processing is performed as much as possible. An inadvertent line stop can be suppressed.

In order to achieve the above object, an exposure drawing method according to the present invention is based on a plurality of exposure processing requests that each set substrate information indicating the type of a substrate to be exposed and request an exposure process according to the exposure information. An exposure process execution step for sequentially executing each of the exposure processes on the substrate to be exposed, a detection step for detecting substrate information of the exposure target substrate to be exposed, and detected substrate information detected in the detection step; The comparison step for comparing the switched substrate information set in the switched exposure processing request, and the comparison after the switching is performed so that the execution of the next exposure processing request is started after finishing the exposure processing request being executed. based on the comparison result of the step, then when the detection board information to be exposed substrate to be exposed processed is the same as the switching board information, turn with respect to the exposed substrate to be exposed processed to the next When the subsequent exposure processing request is executed and the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request executed immediately before switching, the next exposure processing target A switching step of switching the exposure processing request executed in the exposure processing execution step so that the exposure processing request executed immediately before switching is continuously executed for the substrate to be exposed. .

  Therefore, according to the exposure drawing method according to the present invention, since it operates in the same manner as the exposure drawing apparatus, when performing a plurality of jobs in succession as in the exposure drawing apparatus, unnecessary exposure processing is performed as much as possible. An inadvertent line stop can be suppressed.

  According to the present invention, when a plurality of jobs are continuously performed, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.

It is a block diagram which shows the whole structure of the exposure drawing system which concerns on embodiment. It is a perspective view which shows the internal structure of the exposure drawing apparatus which concerns on embodiment. It is a schematic top view which shows the installation position of the board | substrate size measurement part of the exposure drawing apparatus which concerns on embodiment. It is a block diagram which shows the structure of the electric system of the exposure drawing apparatus which concerns on embodiment. It is a block diagram which shows the structure of the electric system of the control apparatus of the exposure drawing system which concerns on embodiment. It is a flowchart which shows the flow of a process of the job setting process program which concerns on embodiment. (A) is a schematic diagram which shows an example of the execution job information in the exposure drawing system which concerns on embodiment, (B) is a schematic diagram which shows an example of the board | substrate type information in the exposure drawing system which concerns on embodiment. It is a conceptual diagram for demonstrating the exposure drawing process in the exposure drawing system which concerns on embodiment. It is a flowchart which shows the flow of a process of the 1st exposure monitoring process program which concerns on 1st Embodiment. (A) And (B) is a conceptual diagram for demonstrating the 1st monitoring process in the exposure drawing system which concerns on 1st Embodiment. (A) And (B) is a conceptual diagram for demonstrating the other example of the 1st monitoring process in the exposure drawing system which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process of the 2nd exposure monitoring process program which concerns on 1st Embodiment. (A) And (B) is a conceptual diagram for demonstrating the 2nd monitoring process in the exposure drawing system 1 which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process of the 3rd exposure monitoring process program which concerns on 2nd Embodiment.

[First Embodiment]
Hereinafter, the exposure drawing system according to the first embodiment will be described in detail with reference to the accompanying drawings. In the first embodiment, the exposure drawing system 1 is an example of a system that performs exposure drawing on one or both sides of a substrate to be exposed using a flat substrate such as a printed wiring board and a glass substrate for a flat panel display as the substrate to be exposed. explain.

  FIG. 1 is a configuration diagram showing the overall configuration of an exposure drawing system 1 according to the first embodiment. As shown in FIG. 1, an exposure drawing system 1 includes an exposure drawing apparatus 2 that draws an image such as a circuit pattern by exposing a substrate to be exposed (exposed substrate C to be described later) to a light beam, and an exposure drawing apparatus 2. Is provided with a control device 3 for controlling exposure drawing.

  FIG. 2 is a perspective view showing an internal configuration of the exposure drawing apparatus 2 according to the first embodiment. In the following, the direction in which the stage 10 moves is defined as the Y direction, the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction, and the direction orthogonal to the Y direction in the vertical plane is defined as the Z direction. Further, the rotation direction that rotates clockwise about the Z axis is defined as the θ direction.

  As shown in FIG. 2, the exposure drawing apparatus 2 includes a flat stage 10 for fixing the substrate C to be exposed. When the exposed substrate C is placed on the upper surface, the stage 10 sucks air between the exposed substrate C and the stage 10 and causes the exposed substrate C to be vacuum-adsorbed on the upper surface.

  The stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11. One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported so as to be freely movable in the Y direction along the guide rail 14, and is moved by a stage drive unit (stage drive unit 41 described later) configured by a motor or the like. The stage 10 is supported on the upper surface of the movable base 12 and moves along the guide rail 14 in conjunction with the movement of the base 12. In addition, the substrate C to be exposed fixed to the stage 10 moves to an exposure position as the stage 10 moves, and an image such as a circuit pattern is drawn by being irradiated with a light beam by an exposure unit 16 described later.

  A gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14. The gate 15 exposes the surface of the substrate C to be exposed placed on the stage 10. An exposure unit 16 is attached. The exposure unit 16 includes a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10. An optical fiber 18 drawn from a light source unit 17 described later and a signal cable 20 drawn from an image processing unit 19 described later are connected to the exposure unit 16.

  Each exposure head 16 a has a digital micromirror device (DMD) as a reflective spatial light modulation element, and controls the DMD based on the image data input from the image processing unit 19 to emit light from the light source unit 17. Modulate the beam. The exposure drawing apparatus 2 performs exposure drawing by irradiating the substrate C to be exposed with the modulated light beam. Note that a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.

  A gate 22 is provided on the upper surface of the base 11 so as to straddle the guide rail 14. The gate 22 includes one or a plurality (two in the present embodiment) of image capturing units 23 for photographing the alignment marks for exposure reference provided on the substrate C to be exposed placed on the stage 10. It is attached. The photographing unit 23 is a CCD camera or the like having a built-in strobe with a very short light emission time. Each photographing unit 23 is installed to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in a horizontal plane.

  The exposure drawing apparatus 2 is an auto that transports the exposed substrate C carried from the outside to the first transport unit 5 to the upper surface of the stage 10 and transports the exposed substrate C exposed from the stage 10 to the second transport unit 6. A carrier hand (hereinafter referred to as an AC hand) 24 is provided. The AC hand 24 is formed in a flat plate shape and is movably provided in the horizontal direction and the vertical direction. Further, on the lower surface of the AC hand 24, a suction mechanism having a suction portion 25 that sucks and holds the substrate C to be exposed by vacuum suction by sucking air, and a vertically movable member that presses the substrate C to be exposed downward are freely movable. A pressing mechanism having a pressing portion 26 is provided. The AC hand 24 lifts the unexposed substrate C placed on the first transport unit 5 upward by sucking and holding it by a suction mechanism, and the lifted exposed substrate C is predetermined on the upper surface of the stage 10. Place it at a different position.

  When the AC hand 24 places the exposed substrate C on the stage 10, the AC hand 24 releases the suction by the suction unit 25 while pressing the exposed substrate C against the stage 10 by a pressing mechanism, thereby bringing the exposed substrate C into the stage 10. The substrate to be exposed C is sucked and fixed to the stage 10. The AC hand 24 lifts the exposed substrate C, which has been exposed, placed on the upper surface of the stage 10 by suction and holds it by a suction mechanism, and holds the lifted exposed substrate C by suction. The substrate C to be exposed is moved to the second transport unit 6 by moving to the transport unit 6 and then releasing the suction by the suction mechanism. The exposed substrate C transported to the second transport unit 6 is discharged outside the exposure drawing apparatus 2.

  Further, a conveyor unit 5 a that conveys the substrate to be exposed C is provided on the upper surface of the first conveyance unit 5. The conveyor unit 5a includes a plurality of rotating rollers and a drive motor that rotates the rotating rollers. A plurality of rotating rollers are laid in parallel, and a sprocket or pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a means for transmitting the rotational force of the drive motor that rotates the rotating roller, a transmission method using a cylindrical magnet can be employed in addition to the belt or the wire. The conveyor unit 5a is provided with a substrate size measuring unit 27 that measures the size of the substrate C to be exposed. The substrate size measuring unit 27 includes a width measuring unit 27a that measures the width (short side) of the substrate C to be exposed and a length measuring unit 27b that measures the length (long side) of the substrate C to be exposed. Yes.

  FIG. 3 is a schematic top view showing an installation position of the substrate size measuring unit 27 of the exposure drawing apparatus 2 according to the first embodiment. As shown in FIG. 3, the width measuring unit 27a is installed in the vicinity of the center where the exposed substrate C always passes through the upper surface of the conveyor unit 5a regardless of the size. The width measuring unit 27a measures the transport time of the exposed substrate C when the exposed substrate C is transported on the conveyor unit 5a, and calculates the exposed substrate C from the product of the transport speed and the transport time of the exposed substrate C. The width of is derived.

  On the other hand, a plurality of length measuring units 27b (two in the present embodiment) are provided so as to be movable in the Y direction on the upper surface of the conveyor unit 5a. The plurality of length measuring units 27b sandwich the exposed substrate C from both sides in the Y direction so that the exposed substrate C is in contact with the side surface of the exposed substrate C when the exposed substrate C is conveyed in the X direction. Then, the distance between each length measuring unit 27b is measured, and the length of the substrate C to be exposed is derived from the measured distance.

  FIG. 4 is a block diagram showing the configuration of the electrical system of the exposure drawing apparatus 2 according to the first embodiment. As shown in FIG. 4, the exposure drawing apparatus 2 is provided with a system control unit 40 that is electrically connected to each part of the apparatus, and the system control unit 40 controls each part in an integrated manner. The system control unit 40 controls the AC hand 24 to perform an operation for loading the substrate C to be exposed into the stage 10 and an operation for discharging it from the stage 10. In addition, the system control unit 40 acquires information indicating the size (width and length) of the substrate to be exposed from the substrate size measurement unit 27. Further, the system control unit 40 controls the stage driving unit 41 to move the stage 10 and moves the imaging unit 23 via a movement control unit 43 described later to capture the alignment mark of the substrate C to be exposed. To adjust the exposure position and control the light source unit 17 and the image processing unit 19 to cause the exposure head 16a to perform the exposure process. The system control unit 40 starts the exposure process for the exposure target substrate C at the timing when the signal for instructing the start of exposure is received from the control device 3, and the timing at which the signal for instructing the stop of exposure is received. The exposure process is stopped when the exposure process for the substrate C to be exposed is completed.

  The exposure drawing apparatus 2 includes an operation device 42. The operation device 42 includes a display unit that displays information under the control of the system control unit 40 and an input unit that inputs information through a user operation. The input unit is operated by the user when inputting, for example, an instruction to forcibly stop exposure processing on the substrate C to be exposed.

  Further, the exposure drawing apparatus 2 includes a movement control unit 43. Based on an instruction from the system control unit 40, the movement control unit 43 causes the alignment mark of the substrate to be exposed C to pass through one of the plurality of imaging units 23 or the center of each imaging region when the stage 10 is moved. The moving drive of the photographing unit 23 is controlled.

  FIG. 5 is a block diagram showing the configuration of the electrical system of the control device 3 of the exposure drawing system 1 according to the first embodiment. As shown in FIG. 5, the exposure drawing system 1 includes a control unit 50 that controls exposure processing in the exposure drawing system 1, an exposure processing program necessary for exposure processing by the control unit 50, and a ROM and HDD that store various data. A storage unit 51, a display unit 52 such as a display for displaying data based on the control of the control unit 50, an input unit 53 such as a keyboard for inputting data by a user operation, and an exposure drawing based on the control of the control unit 50 A communication interface 54 for transmitting / receiving data to / from the apparatus 2 is provided.

  Here, the exposure drawing apparatus 2 according to the present embodiment receives a batch exposure processing request (hereinafter, referred to as the following) from the control apparatus 3 for exposing and drawing the same image on a plurality of exposed substrates C of the same type under the same conditions. When “Job” is also received, exposure processing is performed on a plurality of exposed substrates C according to the contents of the received job. Further, when the exposure drawing apparatus 2 receives a plurality of jobs from the control apparatus 3 in a state in which the execution order is designated, the exposure drawing apparatus 2 performs jobs for the plurality of exposed substrates C according to the designated job execution order. It has a function to perform exposure processing continuously every time.

  When the operator wants the exposure drawing apparatus 2 to continuously execute a plurality of jobs, the control apparatus 3 causes the control apparatus 3 to perform processing for each type of substrate C to be exposed, the number of processed substrates, the front image, and the back surface. An image, image magnification, etc. are input, and the execution order of each job is input. The control device 3 performs job setting processing for setting each job so that a plurality of input jobs are performed in the input execution order.

  Here, a flow of job setting processing by the exposure drawing system 1 according to the first embodiment will be described.

  FIG. 6 is a flowchart showing a processing flow of the job setting processing program according to the first embodiment, and the program is stored in advance in a predetermined area of a ROM which is a recording medium provided in the storage unit 51 of the control device 3. ing.

  The control unit 50 of the control device 3 has a predetermined timing (in this embodiment, a timing when a predetermined operation for instructing job setting via the input unit 53 is performed by the operator). Execute the job setting processing program.

  First, in step S <b> 101, the control unit 50 determines whether a job creation instruction has been input via the input unit 53 by the operator. The job creation instruction is input by a predetermined operation of the input unit 53. If no job creation instruction is input in step S101, the control unit 50 waits until a job creation instruction is input.

  If a job creation instruction is input in step S101, in step S103, the control unit 50 accepts an input of the substrate type to the substrate C to be exposed in the job instructed in step S101. Information regarding a plurality of substrate types may be stored in advance in the storage unit 51, and the user may input information on the substrate types by selecting one of the plurality of substrate types via the input unit 53. The storage unit 51 stores the size (width, length, etc.) of the substrate and the position and type of the alignment mark (hereinafter also referred to as “position, etc.”) for each substrate type.

  In step S105, the control unit 50 receives an input of the number of processed substrates C in the job instructed to be created in step S101. In step S107, the control unit 50 exposes and draws a surface image on the first surface (hereinafter also referred to as a surface) that is the main surface of the substrate C to be exposed in the job instructed to create in step S101, and the first image. An input of a back surface image to be exposed and drawn on a second surface (hereinafter also referred to as a back surface) which is a main surface facing the surface C1 is received.

  In step S109, the control unit 50 receives an input of exposure conditions in the job instructed to create in step S101. The exposure condition input at this time is the magnification of the image to be exposed and drawn. In step S111, the control unit 50 receives an input of the execution order of the job instructed to create in step S101. The execution order input at this time is information indicating the order in which exposure processing is performed.

  In step S113, the control unit 50 creates the job instructed to be created in step S101 based on the information input in steps S103 to S111, and stores information related to the created job in the storage unit 51.

  FIG. 7A is a schematic diagram showing an example of execution job information 60 in the exposure drawing system according to the first embodiment, and FIG. 7B is substrate type information in the exposure drawing system according to the first embodiment. FIG. The control device 3 stores information relating to a series of jobs to be continuously executed in the storage unit 51 as execution job information 60.

  As shown in FIG. 7A, the execution job information 60 includes, for each job, job order information 61 indicating job execution order, job identification information 62 for identifying the job, and an exposed substrate in the job. Process number information 63 indicating the number of processed sheets of C, front surface image information 64 indicating an image to be exposed and drawn on the surface of the exposed substrate C in the job, back surface image information 65 indicating an image to be exposed and drawn on the back surface of the exposed substrate C, The magnification information 66 indicating the magnification of the image to be exposed and drawn on the substrate C to be exposed, the substrate identification information 67 indicating the type of the substrate C to be exposed, and the like are associated with each other. The execution job information 60 appropriately stores information indicating the exposure pitch of other images, information indicating materials used, and the like for each job. Based on the execution job information 60, the control device 3 continuously executes jobs for a plurality of exposed substrates C in accordance with a predetermined execution order (the order described in the job order information 61). The exposure process is performed while switching.

  In addition, the storage unit 51 stores in advance substrate type information 70 indicating the characteristics of the substrate for each substrate type. As shown in FIG. 7B, the substrate type information 70 includes size information 72 indicating the width, length and thickness of the substrate, the size information 72 indicating the size of the substrate, and the substrate identification information 67 indicating the substrate type. The mark information 73 indicating the position and type (for example, shape and size) of the alignment mark formed in advance is information associated with each other. In the exposure drawing system 1, the control unit 50 can specify the substrate type of the substrate C to be exposed from the size of the substrate C to be exposed or the position of the alignment mark on the substrate C to be exposed.

  In step S115, the control unit 50 determines whether to continue input, that is, whether to create a next job. At this time, for example, when an operation for creating a next job is performed via the input unit 53, the control unit 50 determines to create the next job.

  If it is determined in step S115 that the next job is to be created, the control unit 50 performs the processing of steps S101 to S115 for the next job, while if it is determined in step S115 that the next job is not to be created, In step S117, the control unit 50 executes an exposure process based on the execution job information 60. Note that the control unit 50 may execute the exposure process when an operator inputs an exposure process execution instruction via the input unit 53 without executing the exposure process in step S117. .

  FIG. 8 is a conceptual diagram for explaining exposure drawing processing in the exposure drawing system 1 according to the first embodiment. In the exposure drawing system 1 according to the present invention, a plurality of jobs are continuously executed based on the execution order according to the execution job information 60. For example, in the exposure processing based on the execution job information 60 shown in FIG. 7A, jobs are executed in the execution order of job A (10 processed sheets), job B (15 processed sheets), and job C (20 processed sheets). Executed. Then, when a plurality of jobs are continuously executed, the number of processed sheets set in the execution job information 60 is compared with the number of exposed substrates C that are actually subjected to exposure processing, and the job being executed is compared. At the stage where the exposure processing for the set number of substrates to be exposed C has been completed, job switching, the job being executed is terminated, and execution of the next job is started.

  The operator confirms the type and the number of processed substrates C in each of the plurality of jobs according to the execution order set in the execution job information 60, and waits for the exposed substrate C to be exposed. Arranged at the substrate standby position. On the other hand, the exposure drawing apparatus 2 sequentially acquires the exposed substrate C arranged at the substrate standby position, and performs the exposure process according to the contents described in the execution job information 60.

  In step S119, the control unit 50 monitors whether or not the executed job is executed as set in the execution job information 60 when a plurality of jobs are executed in step S117. A first exposure monitoring process, a second exposure monitoring process, and a third exposure monitoring process of the second embodiment, which will be described later, are executed.

  In this way, the operator places the exposed substrate C to be exposed with reference to the execution job information 60 at a position for manually loading the exposure drawing apparatus 2 while confirming the type and number of sheets. It is conceivable that the number of substrates C to be exposed is mistakenly arranged due to carelessness of a person. In this case, in the conventional exposure drawing apparatus, an error occurs and the exposure process stops.

  In particular, when the operator counts one more (or less) when the number of substrates C to be exposed is counted, even if the execution job information is correctly set, the exposure to be arranged by the operator Since only one substrate C is displaced, the exposure drawing apparatus cannot correctly recognize job switching, and an error occurs. Since it takes time to recover if the exposure drawing apparatus stops due to an error or the like, it is desirable to continue the exposure process to the end without stopping the exposure process as much as possible.

  Therefore, in the exposure drawing system 1 according to the present embodiment, the control device 3 determines the exposure target based on the size of the substrate C to be exposed and the position of the alignment mark of the substrate C to be obtained, which are obtained immediately before exposure. A first exposure monitor that monitors whether the job being executed matches the set job by comparing the substrate type of the substrate C to be exposed with the substrate type of the set job. Processing and second exposure monitoring processing are performed.

  FIG. 9 is a flowchart showing the flow of processing of the first exposure monitoring processing program according to the first embodiment. This program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. It is remembered.

  The control unit 50 of the control device 3 executes the exposure monitoring processing program at a predetermined timing (in this embodiment, the timing when the exposure processing by the exposure drawing device 2 is started in step S119 or the like).

  In this embodiment, k sheets immediately before job switching (k sheets from N−k + 1 to N sheets in a job with N processing sheets) and k sheets (number of processing sheets) immediately after job switching. In the N jobs, it is determined whether or not it is the timing for job switching for k sheets from the first sheet to the kth sheet. The value of k is a value smaller than N (for example, k is 2 or 3 when N is 10), and is input in advance by the operator via the input 53 and stored in the storage unit 51.

  First, in the state in which the exposure process is being executed in step S117, in step S201, the control unit 50 determines that the total number of processed jobs currently being executed is N. It is determined whether the exposed substrate C is N−k + 1 or more in the job currently being executed.

  If it is determined in step S201 that the number is N−k + 1 or more, the control unit 50 acquires the measured size of the substrate C to be processed next in step S203. At this time, the control unit 50 detects the substrate C to be exposed measured by the substrate size measuring unit 27 of the exposure drawing apparatus 2 when the substrate C to be processed next is being transported by the first transport unit 5. Get information about the size of the.

  In step 205, the control unit 50 acquires the position and the like of the alignment mark of the substrate C to be processed next. At this time, the system control unit 40 detects the alignment mark from the captured image in which the substrate C to be processed next is imaged by the imaging unit 23 and generates information indicating the position of the detected alignment mark. . The control unit 50 acquires the information indicating the position and the like of the alignment mark from the system control unit 40.

  In step S207, the control unit 50 stores the size of the exposed substrate C acquired in step S203, the position of the alignment mark of the exposed substrate acquired in step S205, and the like for each substrate type stored in the storage unit 51 in advance. Next, the substrate type of the substrate C to be exposed to be processed is determined by comparing the size and the position of the alignment mark.

  In step S209, the control unit 50 compares the substrate type of the exposed substrate C to be processed next determined in step S207 with the substrate type set in the job being executed, thereby obtaining the substrate type. Is determined to be suitable for the job set in the execution job information 60. At this time, if the substrate type of the substrate C to be processed next matches the substrate type set in the job being executed, the control unit 50 determines that the job is being executed. To do.

  If it is determined in step S209 that the job is compatible with the job being executed, in step S211, the control unit 50 continues the exposure process with the job being executed as it is.

  If it is determined in step S209 that the job is not compatible with the job being executed, in step S213, the control unit 50 determines the substrate type of the substrate C to be processed next determined in step S207 and the execution type. By comparing the board type set in the next job of the middle job, it is determined whether or not the board type is suitable for the next job.

  If it is determined in step S213 that it is suitable for the next job, in step S215, the control unit 50 determines that the number of exposed substrates C for the job being executed is insufficient, The current job is advanced by one, and the next job is switched so that the next job of the current job is executed for the substrate C to be exposed next.

  FIGS. 10A and 10B are conceptual diagrams for explaining the first monitoring process in the exposure drawing system 1 according to the first embodiment. FIG. 10 shows a case where k is set to 1 or more. As shown in FIG. 10A, when the exposure process is performed on the N (= N−1 + 1) th exposed substrate C of N jobs A, the exposed substrate C becomes job B. If it is a board to be used, as shown in FIG. 10B, the control unit 50 shifts the timing of switching from job A to job B one sheet ahead, and the Nth substrate of job A is covered. Assuming that the exposure substrate C is the first substrate C to be exposed in job B, at this point, job A is completed and job B is started.

  FIGS. 11A and 11B are conceptual diagrams for explaining another example of the first monitoring process in the exposure drawing system 1 according to the first embodiment. FIG. 11 shows a case where k = 3 or more. As shown in FIG. 11A, when the exposure process is performed on the N-2 (= N-3 + 1) th exposed substrate C of the job A with N processed sheets, this exposed substrate is similarly used. When C is a substrate used for job B, as shown in FIG. 11B, the control unit 50 shifts the timing of switching from job A to job B by three sheets before, The N-2th exposed substrate C is set as the first exposed substrate C of job B, and at this point, job A is terminated and job B is started.

  In step S217, the control unit 50 outputs that the job has proceeded because the number of substrates C to be exposed for job A is small, and in step S211, the exposure processing is continued with the next job. The method for outputting the message may be a method for displaying the message on the display unit 52 or a method for outputting the message by voice.

  If it is determined in step S213 that the job does not conform to the next job, in step S219, the control unit 50 determines that the exposure process cannot be continued, and discharges the exposed substrate C to the outside of the exposure drawing apparatus 2. .

  Thus, in the exposure drawing system 1 according to the first embodiment, when a plurality of jobs are continuously performed, the job executed according to the size of the substrate C to be exposed matches the set job. If they are different, it is further determined whether the job being executed and the next job of the set job match. By switching the target job to the job next to the set job and continuing the execution, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.

  FIG. 12 is a flowchart showing the flow of processing of the second exposure monitoring processing program according to the first embodiment. The program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. It is remembered.

  The control unit 50 of the control device 3 executes the exposure monitoring processing program at a predetermined timing (in this embodiment, the timing when the exposure processing by the exposure drawing device 2 is started in step S119 or the like).

  First, in a state where the exposure process is being executed in step S117, in step S301, when the total number of processed jobs currently being executed is N, the control unit 50 sets the next processing target. It is determined whether or not the exposed substrate C is the kth or less in the job currently being executed.

  If it is determined in step S301 that the number is the kth or less, in step S303, the control unit 50 acquires the size of the substrate C to be processed next by the same method as in step S203. In step 305, the control unit 50 acquires the position of the alignment mark of the substrate C to be processed next, etc., using the same method as in step S205.

  In step S307, the control unit 50 stores the size of the exposed substrate C acquired in step S303 and the position of the alignment mark of the exposed substrate C acquired in step S305 in the storage unit 51 in advance. The substrate type of the substrate to be exposed C to be processed next is determined by comparing each size, the position of the alignment mark, and the like.

  In step S309, the control unit 50 uses the same method as the process in step S209, and the substrate type of the exposure target substrate C to be processed next determined in step S307 and the substrate set in the job after switching. By comparing the type, it is determined whether or not the board type is suitable for the job after switching.

  If it is determined in step S309 that the job is suitable for the job after switching, in step S311, the control unit 50 continues the exposure process for the job after switching as it is.

  If it is determined in step S309 that the job is not suitable for the switched job, in step S313, the control unit 50 switches the substrate type of the exposed substrate C to be processed next determined in step S307, and the switching type. By comparing the substrate type set in the job immediately before the subsequent job, it is determined whether or not the substrate type is suitable for the previous job.

  If it is determined in step S313 that the job conforms to the previous job, in step S315, the control unit 50 determines that the number of exposed substrates C of the job before the job after switching is large, Even when the job switching timing is reached, without switching the job, the current job is returned to one, and the job immediately before the switched job is set.

  13A and 13B are conceptual diagrams for explaining the second monitoring process in the exposure drawing system 1 according to the first embodiment. FIG. 13 shows a case where k is set to 1 or more. As shown in FIG. 13A, when the exposure processing is performed on the first exposed substrate C of the job B with N processed sheets, the exposed substrate C is a substrate used for the job A. In this case, as shown in FIG. 13B, the control unit 50 shifts the timing of switching from the job A to the job B by one sheet, and moves the first exposed substrate C of the job B to the job A. As the last substrate to be exposed C, the job B is not started at this point and is switched to the job A and executed.

  In step S317, the control unit 50 outputs that the job has been returned (not advanced) because the number of substrates C to be exposed in job A is large, and in step S311, the exposure processing is continued with the previous job. The method for outputting the message may be a method for displaying the message on the display unit 52 or a method for outputting the message by voice.

  If it is determined in step S313 that the job does not conform to the next job, in step S319, the control unit 50 determines that the exposure process cannot be continued, and discharges the exposed substrate C to the outside of the exposure drawing apparatus 2. .

  Thus, in the exposure drawing system 1 according to the first embodiment, when a plurality of jobs are continuously performed, the job is set as a job that is executed depending on the size of the substrate C to be exposed and the position of the alignment mark. If they are different, and if they are different, it is further determined whether the job being executed and the next job of the set job match. In such a case, by switching the execution target job to the job next to the set job and continuing the execution, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.

  In the exposure drawing system 1 according to the first embodiment, when a plurality of jobs are continuously performed, a job that is executed according to the size of the substrate C to be exposed, the position of the alignment mark, and the like are set. If they are different, it is determined whether the job being executed and the job before the set job match. By switching the execution target job to a job before the set job and continuing the execution, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.

  Furthermore, in the exposure drawing system 1 according to the first embodiment, the timing for monitoring a job is from k sheets immediately before the job switching is scheduled to k sheets immediately after the job switching is performed, By allowing the operator to appropriately set the value of k, it is possible to avoid inadvertent job switching. When k = 0 is set, it is not allowed to change the job switching timing set in the execution job information 60 at the time of execution.

  In addition, in the exposure drawing system 1 according to the first embodiment, in step S207 (S307), the size of the exposed substrate C acquired in step S203 (S303), the position of the alignment mark acquired in step S205 (S305), and the like. Therefore, even if the size of the exposed substrate C is the same between continuously executed jobs, the job can be accurately determined. Job switching can be performed accurately.

  In the exposure drawing apparatus 2 according to the first embodiment, information related to a job is input. However, the present invention is not limited to this, and the operator inputs the execution job information stored in advance in the storage unit 51 via the input unit 53. In this case, a job to be executed may be set.

  In the exposure drawing system 1 according to the first embodiment, in step S207 (S307), the size of the exposed substrate C acquired in step S203 (S303), the position of the alignment mark acquired in step S205 (S305), and the like. However, the present invention is not limited to this. In step S207 (S307), the size of the substrate C to be exposed, the position of the alignment mark formed on the substrate C to be exposed, and the substrate C to be exposed. The substrate type may be determined using at least one of the types of alignment marks formed on the substrate.

[Second Embodiment]
Hereinafter, the exposure drawing system 1 according to the second embodiment will be described in detail with reference to the accompanying drawings. Since the exposure / drawing system 1 according to the second embodiment has the configuration shown in FIGS. 1 to 5 like the exposure / drawing system 1 according to the first embodiment, overlapping description of the configuration is given. Omitted.

  In the exposure drawing system 1 according to the first embodiment, when executing a plurality of jobs according to a predetermined execution order, the substrate type of the substrate C to be exposed is estimated based on the size of the substrate C to be exposed, the position of the alignment mark, and the like. When the estimated substrate type is different from the substrate type set for the job, it is determined that the job is different. However, the exposure drawing system 1 according to the second embodiment If the size of the exposed substrate C is assumed to be the substrate type of the exposed substrate C, and the estimated substrate type is different from the substrate type set in the job, it is determined that the job is different. It is.

  In the exposure drawing system 1 according to the second embodiment, a plurality of jobs are continuously executed according to the execution job information 60 of the first embodiment, and the job being executed at that time is different from the set job. A third exposure monitoring process is performed to monitor whether or not there is any.

  A flow of the third exposure monitoring process in the exposure drawing system 1 according to the second embodiment will be described.

  FIG. 14 is a flowchart showing the flow of processing of the third exposure monitoring processing program according to the second embodiment. This program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. It is remembered.

  The control unit 50 of the control device 3 executes the exposure monitoring processing program at a predetermined timing (in this embodiment, the timing when the exposure processing by the exposure drawing device 2 is started in step S119 or the like).

  In this embodiment, k sheets immediately before job switching (k sheets from N−k + 1 to N sheets in a job with N processing sheets) and k sheets (number of processing sheets) immediately after job switching. In the N jobs, it is determined whether or not it is the timing for job switching for k sheets from the first sheet to the kth sheet. The value of k is a value smaller than N, which is input in advance by the operator via the input 53 and stored in the storage unit 51.

  First, in step S401, in a state where the exposure process is being executed in step S117, the control unit 50 determines that the total number of processed jobs currently being executed is N, and sets the next processing target. It is determined whether the exposed substrate C is N−k + 1 or more in the job currently being executed.

  When it is determined in step S401 that the number is N−k + 1 or more, in step S403, the control unit 50 sets the size of the substrate C to be processed next in the same manner as the process in step S201. get.

  In step S405, the control unit 50 compares the size of the substrate C to be exposed acquired in step S403 with the size of each substrate type stored in advance in the storage unit 51, thereby exposing the object to be processed next. The board type of the board C is determined.

  If it is determined in step S405 that the job is suitable for the job being executed, in step 407, the control unit 50 uses the same method as that in step S205 to align the substrate C to be processed next. Get the mark position and so on.

  In step S409, the control unit 50 compares the position or the like of the alignment mark of the substrate to be exposed acquired in step S407 with the position or the like of the alignment mark stored in advance in the storage unit 51. Judge whether it conforms.

  If it is determined in step S409 that it is suitable for the job being executed, in step S411, the control unit 50 continues the exposure process for the job being executed.

  If it is determined in step S409 that the job is not compatible with the job being executed, in step S413, the control unit 50 determines the substrate type of the exposure target substrate C to be processed next determined in step S409, and the execution. By comparing the board type set in the next job of the middle job, it is determined whether or not the board type is suitable for the next job.

  If it is determined in step S413 that the job conforms to the next job, in step S415, the control unit 50 determines that the number of exposed substrates C for the job being executed is insufficient, The current job is advanced by one, and the next job of the job being executed is switched to the next target substrate C to be processed.

  In step S417, the control unit 50 outputs that the job has proceeded because the number of substrates C to be exposed for job A is small, and in step S411, the exposure processing is continued with the next job. The method for outputting the message may be a method for displaying the message on the display unit 52 or a method for outputting the message by voice.

  On the other hand, if it is determined in step S405 that it is not suitable for the job being executed, in step S419, the control unit 50 determines the size of the substrate C to be processed next determined in step S409, It is determined whether or not the board type is suitable for the next job by comparing the size of the board set in the next job of the job being executed.

  If it is determined in step S419 that the job conforms to the next job, in step S421, the control unit 50 uses the same method as that in step S205 to align the alignment mark of the substrate C to be processed next. Get the position etc.

  In step S <b> 421, the control unit 50 compares the position of the alignment mark on the substrate C to be exposed acquired in step S <b> 419 with the position of the alignment mark stored in the storage unit 51 in advance, thereby executing the job being executed. It is determined whether or not the job matches the next job. If it is determined in step S423 that the job matches the next job, the process proceeds to step S415.

  If it is determined in step S419 or step S423 that it does not conform to the next job, in step S425, the control unit 50 determines that the exposure process cannot be continued, and exposes the substrate C to be processed next as an exposure drawing. Discharge to the outside of the device 2.

  In this way, in the exposure drawing system 1 according to the second embodiment, the job executed and the set job differ depending on the size of the exposure substrate C when the exposure substrate C has been transported. In order to determine whether or not the job is different at the stage when the substrate C to be exposed is carried in, if it is determined that the job is different, the exposure process is not performed (the target The exposed substrate C can be quickly discharged out of the exposure drawing apparatus 2 (without placing the exposed substrate C on the stage 10).

  Further, in the exposure drawing system 1 according to the second embodiment, whether or not the job of the transferred substrate C to be transferred is switched in advance at the stage where the exposed substrate C has been transferred (the exposure substrate C is staged). Therefore, the image data switching start timing can be advanced. In particular, when the data volume of the image data of the exposure target image is large, it takes a certain time to switch the image data, but the waiting time for switching the image data can be shortened.

  In the exposure drawing system 1 according to the second embodiment, the case where it is determined whether or not the substrate type is suitable for the next job immediately before job switching (corresponding to the first exposure monitoring process) has been described. However, the present invention is not limited to this, and it may be determined immediately after job switching whether the substrate type is compatible with the previous job (corresponding to the second exposure monitoring process). In this case, in step S401, it is determined whether or not the current number of processed sheets is N or less in the N number of processed jobs. In step S409, it is determined whether or not the job is suitable for the switched job. In steps S413, S419, and S423, it is determined whether or not the board type is compatible with the job before the job after switching, and in step S415, the job after switching is returned to one, and the previous job is set. In step S417, the fact that the job has been returned is output.

  In the first exposure monitoring process, the second exposure monitoring process, and the third monitoring process, the exposure target to be exposed next to the exposure target substrate C while the exposure target substrate C is being exposed. It may be performed on the exposure substrate C. Thus, it is possible to make a judgment on job switching in advance before starting the exposure process.

  DESCRIPTION OF SYMBOLS 1 ... Exposure drawing system, 2 ... Exposure drawing apparatus, 3 ... Control apparatus, 5 ... 1st conveyance part, 5a ... Conveyor part, 6 ... 2nd conveyance part, 10 ... Stage, 11 ... Base | substrate, 12 ... Base, 14 Guide rail, 15 Gate, 16 Exposure unit, 16a Exposure head, 17 Light source unit, 18 Optical fiber, 19 Image processing unit, 20 Signal cable, 22 Gate, 23 Shooting unit, 24 AC hand, 25 ... suction part, 26 ... pressing part, 27 ... substrate size measurement part, 27a ... width measurement part, 27b ... length measurement part, 40 ... system control part, 41 ... stage drive part, 42 ... operation device, DESCRIPTION OF SYMBOLS 43 ... Movement drive part, 50 ... Control part, 51 ... Memory | storage part, 52 ... Display part, 53 ... Input part, 54 ... Communication interface, 60 ... Execution job information, 70 ... Substrate type information, C ... Substrate to be exposed.

Claims (16)

Substrate information indicating the type of substrate to be exposed is set, and exposure processing is executed to sequentially execute each of the exposure processing on the substrate to be exposed based on a plurality of exposure processing requests that require exposure processing according to the exposure information. Means,
Detecting means for detecting substrate information of a substrate to be exposed;
Comparison means for comparing the detected substrate information detected by the detection means with the in-execution substrate information set in the exposure processing request being executed;
Based on the comparison result of the comparison means, if the detected substrate information of the next exposure target substrate is the same as the in-execution substrate information, it is executed on the next exposure target substrate. If the detected substrate information is different from the currently executed substrate information and is the same as the substrate information set in the next exposure process request, the currently executed exposure process request is Switching means for switching the exposure process request executed by the exposure process execution means so that the execution of the next exposure process request is started after finishing,
An exposure drawing apparatus comprising: In each of the plurality of exposure processing requests, number information indicating the number of processed substrates is set,
The switching means, when the number of exposure processing executed by the exposure processing execution means becomes a predetermined number determined according to the number of processing set in the exposure processing request being executed, the comparison result of the comparison means If the detected substrate information of the substrate to be exposed next to be subjected to exposure processing is the same as the substrate information being executed, an exposure processing request being executed for the substrate to be exposed next is processed. If the detected substrate information is different from the currently executed substrate information and is the same as the substrate information set in the next exposure process request, the currently executed exposure process request is terminated and the next The exposure drawing apparatus according to claim 1, wherein the exposure processing request executed by the exposure processing execution unit is switched so that execution of the exposure processing request is started. Substrate information indicating the type of substrate to be exposed is set, and exposure processing is executed to sequentially execute each of the exposure processing on the substrate to be exposed based on a plurality of exposure processing requests that require exposure processing according to the exposure information. Means,
Detecting means for detecting substrate information of a substrate to be exposed;
Comparison means for comparing the detected substrate information detected by the detection means with the switched substrate information set in the switched exposure processing request;
After the current exposure process request is terminated and the execution of the next exposure process request is started, based on the comparison result of the comparison means, the detection substrate of the next substrate to be exposed is detected. When the information is the same as the switching substrate information, an exposure processing request after switching is executed for the next exposure target substrate, and the detected substrate information is different from the switching substrate information and immediately before switching. When the same substrate information is set in the exposure processing request that has been executed, the exposure processing request that was executed immediately before switching is continuously executed for the next exposure target substrate to be exposed. Switching means for switching an exposure processing request executed by the exposure processing execution means,
An exposure drawing apparatus comprising: In each of the plurality of exposure processing requests, number information indicating the number of processed substrates is set,
The switching means switches the exposure processing request being executed and ends the next exposure processing request so that the exposure processing number of exposure processing executed by the exposure processing execution means is being executed. When the predetermined number of sheets determined according to the number of processing sheets set in the request is reached, based on the comparison result of the comparison means, the detected substrate information of the substrate to be exposed next is the switching substrate information. In the same case, the exposure processing request after switching is executed for the next substrate to be exposed, and the exposure processing executed before the switching is different from the switching substrate information. When the substrate information set in the request is the same, the exposure processing is executed so that the exposure processing request executed immediately before switching is continuously executed for the exposure target substrate to be exposed next. Execution means Exposure drawing device according to claim 3, wherein switching the exposure processing request to be executed. Receiving means for accepting an input of the number of substrates to be exposed that allows switching of exposure processing requests;
The exposure drawing apparatus according to claim 2, wherein the predetermined number is determined according to a processing number set for an exposure process being executed and a number received by the receiving unit. Receiving means for accepting an input of the number of substrates to be exposed that allows switching of exposure processing requests;
The switching means subtracts the number of exposure processes executed in the exposure process request being executed by the exposure process execution means from the number of processes set in the exposure process being executed from the number of processes accepted by the reception means. If the detected substrate information of the next substrate to be exposed is the same as the switching substrate information based on the comparison result of the comparing means when the number is equal to or greater than 1, the next exposure processing When the exposure processing request after switching is executed for the target substrate to be exposed, and the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request executed immediately before switching Includes an exposure process executed by the exposure process execution means so that the exposure process request executed immediately before switching is continuously executed for the exposure target substrate to be exposed next. Exposure drawing device according to claim 2, wherein switching the management request. Receiving means for accepting an input of the number of substrates to be exposed that allows switching of exposure processing requests;
The switching means, when the number of exposure processing executed in the exposure processing request being executed by the exposure processing execution means is equal to or less than the number accepted by the accepting means, based on the comparison result of the comparison means, If the detected substrate information of the substrate to be exposed is the same as the switching substrate information, the exposure processing request after switching is executed for the next substrate to be exposed and detected. If the substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request that was executed immediately before switching, the processing is executed immediately before switching for the substrate to be exposed next. The exposure drawing apparatus according to claim 4, wherein the exposure process request executed by the exposure process execution unit is switched so that the exposure process request that has been performed is continuously executed. It said switching means, said exposure process when switching exposure processing request to be executed in real Gyote stage, of any one of claims 1 to 7, further comprising output means for outputting information to a predetermined Exposure drawing device. The substrate information is information including the size of the substrate and the position and type of the alignment mark formed on the substrate,
The detection means detects at least one of the size of the substrate to be exposed, the position of the alignment mark formed on the substrate to be exposed, and the type of alignment mark formed on the substrate to be exposed as substrate information. The exposure drawing apparatus according to any one of claims 1 to 8. When the detected substrate information is different from the executing substrate information and different from the substrate information set in the next exposure processing request, the exposure substrate to be exposed next is not subjected to the exposure processing. The exposure drawing apparatus according to claim 1, further comprising discharge means for discharging to the outside. If the detected substrate information is different from the switching substrate information and different from the substrate information set in the exposure processing request that was executed immediately before switching, exposure processing is performed on the substrate to be exposed next. The exposure drawing apparatus according to claim 3, further comprising discharge means for discharging to the outside of the apparatus. The detecting means detects the size of the substrate to be exposed when the next substrate to be exposed is carried in,
Based on the comparison result of the comparison means, if the detected substrate information is different from the executing substrate information and different from the substrate information set in the next exposure processing request, the substrate to be exposed next to the exposure processing target The exposure drawing apparatus according to claim 1, further comprising discharge means for discharging the light as it is to the outside of the apparatus without performing exposure processing. The detecting means detects the size of the substrate to be exposed when the next substrate to be exposed is carried in,
Based on the comparison result of the comparison means, if the detected substrate information is different from the switching substrate information and different from the substrate information set in the exposure processing request executed immediately before switching, the next exposure processing target The exposure drawing apparatus according to claim 3, further comprising discharge means for discharging the exposed substrate as it is to the outside of the apparatus without performing exposure processing.   A program for causing a computer to function as a comparison unit and a switching unit in the exposure drawing apparatus according to any one of claims 1 to 13. Substrate information indicating the type of substrate to be exposed is set, and exposure processing is executed to sequentially execute each of the exposure processing on the substrate to be exposed based on a plurality of exposure processing requests that require exposure processing according to the exposure information. Steps,
A detection step of detecting substrate information of an exposure target substrate to be exposed;
A comparison step of comparing the detected substrate information detected in the detection step with the in-execution substrate information set in the exposure processing request being executed;
Based on the comparison result of the comparison step , if the detected substrate information of the substrate to be exposed next is the same as the in-execution substrate information, the processing is performed on the substrate to be exposed next. If the detected substrate information is different from the currently executed substrate information and is the same as the substrate information set in the next exposure process request, the currently executed exposure process request is A switching step of switching the exposure processing request executed in the exposure processing execution step so that the execution of the next exposure processing request is started after being terminated;
An exposure drawing method comprising: Substrate information indicating the type of substrate to be exposed is set, and exposure processing is executed to sequentially execute each of the exposure processing on the substrate to be exposed based on a plurality of exposure processing requests that require exposure processing according to the exposure information. Steps,
A detection step of detecting substrate information of an exposure target substrate to be exposed;
A comparison step of comparing the detected substrate information detected in the detection step with the switched substrate information set in the switched exposure processing request;
After switching so that the exposure process request being executed is terminated and execution of the next exposure process request is started, based on the comparison result of the comparison step , the substrate to be exposed to be exposed next is detected. When the information is the same as the switching substrate information, an exposure processing request after switching is executed for the next exposure target substrate, and the detected substrate information is different from the switching substrate information and immediately before switching. When the same substrate information is set in the exposure processing request that has been executed, the exposure processing request that was executed immediately before switching is continuously executed for the next exposure target substrate to be exposed. A switching step for switching the exposure processing request executed in the exposure processing execution step,
An exposure processing method comprising:

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