JP5903930B2 - Substrate transfer apparatus and semiconductor manufacturing apparatus using the substrate transfer apparatus - Google Patents

Description

  The present invention relates to a substrate transfer device for moving a substrate transfer table provided in a vacuum chamber whose inside is maintained in a vacuum by a drive mechanism provided outside the vacuum chamber, and a semiconductor manufacturing apparatus using the substrate transfer device It is about.

  For example, in the manufacture of a semiconductor substrate used for a liquid crystal television or the like, an ion implantation apparatus which is a kind of semiconductor manufacturing apparatus is used in order to impart desired characteristics by ion implantation.

  In such an ion implantation apparatus, an ion implantation chamber in which an ion beam is irradiated onto a substrate needs to be maintained at a predetermined degree of vacuum. For this reason, when a substrate in atmospheric pressure is carried into the ion implantation chamber, the substrate is first carried into the vacuum preparatory chamber, the pressure is reduced from atmospheric pressure to a predetermined degree of vacuum, and then the ion implantation is performed from the vacuum preparatory chamber. The substrate is transferred to the chamber so as to maintain the degree of vacuum in the ion implantation chamber.

  For example, in Patent Document 1, a substrate in atmospheric pressure is carried in, and a vacuum preliminary chamber in which the pressure is reduced to a predetermined pressure, and a vacuum is constantly maintained. There is shown an ion implantation apparatus including a vacuum chamber that is transported and a substrate is transferred to the ion implantation chamber, and a substrate transport table for transporting the substrate from the vacuum preliminary chamber to the vacuum chamber.

  When the substrate is carried into the vacuum preparatory chamber, the substrate carrier is disposed at a closed position that hermetically closes a boundary opening between the vacuum preparatory chamber and the vacuum chamber, and the vacuum chamber and the vacuum preparatory chamber are It is also used for complete isolation. When the decompression in the vacuum preparatory chamber is completed, the substrate transfer table moves to an open position set on the vacuum chamber side, and opens the boundary opening.

  By the way, in order to maintain the degree of vacuum and cleanliness in the vacuum chamber, a driving device is provided outside the vacuum chamber and the vacuum preliminary chamber. More specifically, the substrate transfer table is a rod provided through a toggle link mechanism which is a driving device provided outside the vacuum chamber and the vacuum preliminary chamber and a wall forming the vacuum chamber. And the toggle link mechanism is driven by external power by moving the rod forward and backward.

  However, in such a case, external air may flow into the vacuum chamber from the gap between the wall and the rod, and the degree of vacuum may not be maintained at a predetermined value. Further, since the rod moves back and forth between the vacuum chamber in which a high degree of vacuum is maintained and the atmosphere, dust or the like adhering to the rod in the atmosphere is scattered from the rod into the vacuum chamber of the ion implantation apparatus. As a result, the cleanliness in the vacuum chamber may not be maintained.

JP 2011-18799 A

  The present invention has been made in view of the above-described problems, and a wall that forms the rod and the vacuum chamber or the vacuum preparatory chamber so that air, dust or the like does not enter the inside of the vacuum chamber or the vacuum preparatory chamber. It is an object of the present invention to provide a substrate transfer device capable of hermetically sealing with a body and a semiconductor manufacturing apparatus using the same.

  That is, the substrate transfer apparatus of the present invention is a closed position that hermetically closes a boundary opening between a vacuum chamber maintained at a predetermined degree of vacuum and a vacuum preliminary chamber for carrying the substrate in and out of the outside. And a substrate transfer table configured to be movable between an opening position in the vacuum chamber that opens the boundary opening, and provided outside the vacuum chamber and the vacuum preliminary chamber, and are pivotally connected to each other. A toggle link mechanism that includes a toggle link composed of a plurality of linked elements, and that extends and retracts the output end by bending and stretching the toggle link; and a wall that forms the vacuum chamber or the vacuum preparatory chamber. One or a plurality of rods interposed between the substrate transfer table and the output end of the toggle link mechanism and transmitting the advancing / retreating operation of the output end to the substrate transfer table, between the rod and the wall body Airtightly sealed Wherein the seal structure is provided.

  If this is the case, since a seal structure is provided to hermetically seal the gap between the rod and the wall body, air from outside can be prevented from flowing into the vacuum chamber, and the degree of vacuum can be maintained. it can. In addition, dust does not enter the inside of the vacuum chamber or the vacuum preparatory chamber via the rod that goes back and forth between the inside and the outside of the vacuum chamber, and the cleanliness is improved by the dust scattering inside. The situation of decline can also be prevented.

  In consideration of the maintenance work of the rods, stability at the time of substrate transfer, etc., a plurality of the rods are provided, and the toggle link mechanism is provided on the inner side of each rod as viewed from the forward and backward directions of the rods. If it is.

  In such a case, since the toggle link mechanism is arranged between the rods, the spacing between the rods can be widened, and the space necessary for the maintenance work of the rods can be widened. Cheap. In addition, the following special effects can be obtained as compared with the conventional configuration in which the toggle link mechanism is not provided inside each rod.

  Even when a large-sized substrate or a plurality of substrates are mounted on the substrate transfer table, the spacing between the rods is wide, so that the substrate transfer table can be stably supported. Even if a difference occurs in the length direction of each rod due to an attachment error, the distance between the rods is wide, so that the posture of the substrate transfer table does not change greatly from a predetermined one. For this reason, the substrate can be transported stably.

  Furthermore, since the spacing between the rods is widened, it can be expected that the degree of freedom in design is greatly improved.

  As a more specific configuration example, the toggle link mechanism further includes a guide portion that restricts the moving direction of the output end to the forward / backward direction of the rod, and the guide portion is viewed from the forward / backward direction of the rod. What is arrange | positioned inside is mentioned. If it is such, after making the said rod penetrate the said guide part, a wall body is not penetrated further. That is, since the rod is inserted only into the hole formed in one member, it can be easily removed at the time of maintenance work of the rod.

  In the case where the toggle link mechanism is attached to the outer surface of the wall body forming the vacuum chamber or the vacuum preparatory chamber and separated from the ground, as a configuration capable of taking a wide working space, the guide portion includes the A guide bar extending in the forward / backward direction of the rod, a toggle link mechanism and one end of the rod attached, a slider that moves along the guide bar, and an attachment portion for attaching the guide bar to the wall. Provided that the mounting portion and the guide bar are disposed inside each rod as viewed from the advancing / retreating direction of the rod.

  In order to make the progress of deterioration of the seal structure due to repeated movement of the rod as slow as possible and to make the seal structure last longer, the seal structure includes an outer surface of the wall body, the toggle link mechanism, What is necessary is just to have a bellows provided between and covering the rod. If it is such, since the part exposed to the outside in the rod can be lengthened if necessary as compared with a narrow vacuum chamber, the bellows can be easily lengthened, and the movement of the rod The amount of deformation of the bellows per unit length that occurs sometimes can be reduced. Therefore, by moving the rod repeatedly, even if periodic deformation occurs in the bellows, the amount of deformation can be reduced, so that the durability of the bellows can be improved.

  As another configuration example for maintaining the degree of vacuum and cleanliness in the vacuum chamber, the seal structure includes a bellows that is provided between the inner surface of the wall body and the substrate transfer table and covers the rod. The thing which was done is mentioned.

  In order to be able to maintain the degree of vacuum in the vacuum chamber with a simple configuration and prevent scattering of dust and the like due to the movement of the rod inside and outside, the seal structure has a through-hole through which the rod passes. What is necessary is just to have the seal ring provided in the inner surface.

  In order to support the force due to the external atmospheric pressure when the substrate is carried in and out of the substrate transport table in the closed position without using power from the driving unit, the toggle link is configured so that the substrate transport table is closed. What is necessary is just to be comprised so that it may become the state where the at least 3 pivot point of each link element was located in a line when it exists in a position.

  Specifically, if at least three pivot points of each link element are arranged in a straight line, a force acts along the direction in which the link elements are arranged. Does not occur. Accordingly, since the toggle link is in a state of supporting the substrate transfer table without bending, the closed position can be used without using a power of a motor or the like even when a large force is applied to the substrate transfer table due to a pressure difference. Thus, the substrate transfer table can be kept stationary to maintain airtightness.

  Further, for example, in the present invention, airtightness can be easily maintained with an appropriate force as compared with the case where the substrate transfer table is continuously pressed against the boundary opening by a direct pressure cylinder. Therefore, it is possible to prevent an excessive force from being applied to the packing provided to maintain the airtightness when the substrate transport table is in the closed position, and to make the packing last longer while maintaining the required airtightness. become.

  In addition, as compared with the case where the substrate transfer table is moved by a hydraulic cylinder and kept at a position where a partition wall is formed between the vacuum preparatory chamber and the vacuum chamber, a hydraulic cylinder always has working oil. In the present invention, the toggle link in an extended state supports the substrate carrier, where the amount of working oil is increased and the running cost is high. Therefore, it is possible to reduce the running cost without using extra energy.

  In order to be able to adjust the posture of the substrate transfer table with a simple configuration and to sufficiently exhibit the function as an airtight partition between the vacuum preliminary chamber and the vacuum chamber at the closed position, the toggle link mechanism What is necessary is just to provide the adjustment mechanism which adjusts the length of the said rod from the said board | substrate conveyance stand.

  A preferable application example of the substrate transfer apparatus of the present invention is a semiconductor manufacturing apparatus provided with the substrate transfer apparatus.

As described above, according to the substrate transfer apparatus and the semiconductor manufacturing apparatus of the present invention, the seal structure can hermetically seal between the rod and the wall through which the rod passes, so that the inside and outside of the vacuum chamber Even if the substrate carrier provided inside the vacuum chamber is moved by a rod that moves back and forth, the inflow of air from the outside into the vacuum chamber, and external dust or the like through the rod It can be prevented from entering and scattering inside. Therefore, the degree of vacuum and cleanliness in the vacuum chamber can be maintained even if the rod penetrates the wall. Moreover, if it is this invention, it can comprise so that work space can be easily taken about the adjustment operation | work of each rod, and a maintenance operation | work, and the burden and effort in an operation | work can be reduced.

The schematic diagram which shows the whole structure of the ion implantation apparatus which concerns on 1st Embodiment of this invention. The schematic diagram which shows the structure of a board | substrate conveyance apparatus in case the board | substrate conveyance stand in 1st Embodiment exists in a blockade position. The schematic diagram which shows the structure of a board | substrate conveyance apparatus in case the board | substrate conveyance stand in 1st Embodiment exists in an open position. The schematic diagram which shows the structure of the board | substrate conveyance apparatus which concerns on 2nd Embodiment of this invention. The schematic diagram which shows the structure of the board | substrate conveyance apparatus which concerns on 3rd Embodiment of this invention. The schematic diagram which shows the example of the adjustment mechanism of the board | substrate conveyance apparatus which concerns on 4th Embodiment of this invention. The schematic diagram which shows the structure of the board | substrate conveyance apparatus which concerns on other embodiment of this invention. The typical enlarged view which shows the sealing structure in the obstruction | occlusion position which concerns on another embodiment of this invention.

  A first embodiment of the present invention will be described with reference to FIGS.

  The ion implantation apparatus 200 of the first embodiment is a kind of semiconductor manufacturing apparatus in which the inside is maintained at a predetermined degree of vacuum, and is used, for example, to add desired characteristics to a substrate W for a liquid crystal panel. is there. More specifically, the ion implantation apparatus 200 is for irradiating the substrate W with an ion beam to perform ion implantation and adjust the characteristics as a semiconductor.

  As shown in FIG. 1, the ion implantation apparatus 200 includes an atmospheric transfer chamber A in which atmospheric pressure is picked up by a robot to pick up a substrate W, and a predetermined vacuum from atmospheric pressure when the substrate W is loaded by the robot. A substrate loading chamber B in which the pressure is reduced to a degree, a pretreatment chamber C in which pretreatment is performed before the substrate W in a horizontal state is erected and irradiated with an ion beam when the substrate W is received from the substrate loading chamber B; And an ion implantation chamber D in which an ion beam is irradiated from an ion source onto a standing substrate W. In addition, as a flow after the ion beam irradiation, the above-described process may be performed in the reverse direction, or a structure including a separate substrate unloading chamber may be used.

  Hereinafter, the structure of the substrate carry-in chamber B and details of the substrate transfer apparatus 100 used therein will be described.

  As shown in FIG. 2, the substrate carry-in chamber B includes a vacuum preparatory chamber 8 that is depressurized from atmospheric pressure to a predetermined degree of vacuum, and a vacuum chamber 9 that is kept at a predetermined degree of vacuum. The preliminary chamber 8 and the vacuum chamber 9 are adjacent to each other, and a boundary opening 42 is formed at each boundary. The substrate transport table 4 on which the substrate W picked up by the robot is placed closes the boundary opening 42 to form a partition, thereby being completely partitioned. The substrate transfer table 4 is configured to be movable in the vertical direction by the substrate transfer device 100 attached to the outer surface of the lower surface of the wall body forming the vacuum chamber 9.

  The preliminary vacuum chamber 8 is a chamber for preparing to introduce the substrate W in atmospheric pressure into the ion implantation apparatus 200 maintained at a high degree of vacuum. When the substrate W is introduced, the atmosphere is opened. After the substrate W is introduced, the carry-in port is closed by the lid 81, and vacuuming is performed by a vacuum pump (not shown) until the degree of vacuum of the vacuum chamber 9 becomes approximately the same. It is configured to be

  In the vacuum chamber 9, after the substrate transfer table 4 of the substrate transfer apparatus 100 is lowered, the substrate W placed on the substrate transfer table 4 is transferred to the pretreatment chamber C. It is a room for being.

  Next, details of the substrate transfer apparatus 100 will be described.

  The substrate transfer apparatus 100 forms the vacuum chamber 9 inside the ion implantation apparatus 200, that is, the substrate transfer table 4 provided mainly in the vacuum chamber 9 and outside the vacuum chamber 9. The toggle link mechanism 1 which is a driving device provided on the lower side of the wall body, and the substrate transport table 4 inside and outside the vacuum chamber 9 and the toggle link mechanism 1 are connected by two rods 21. is there. More specifically, by moving the rod 21 up and down by the toggle link mechanism 1, the substrate transport table 4 is moved up and down. Further, the substrate transport apparatus 100 is adjusted to adjust the seal structure for preventing dust and the like in the atmosphere from entering the substrate carry-in chamber B through the rod 21 and the inclination of the substrate transport table 4. A mechanism 22 is provided.

  Each part will be described.

  As shown in FIG. 2, the substrate carrier 4 has a substantially flat disk shape, and an annular elastically deformable packing 41 is attached to the outer periphery. The substrate transport table 4 includes a closed position that airtightly closes the boundary opening 42 between the vacuum preliminary chamber 8 and the vacuum chamber 9, and a predetermined distance downward from the closed position toward the vacuum chamber 9. It is separated and configured to be movable between an open position where the boundary opening 42 is opened. Here, the closed position is a state where the substrate transfer table 4 is at the uppermost position, and the open position is the position where the substrate transfer table 4 is positioned at the lowest position, and the substrate to the pretreatment chamber C in the vacuum chamber 9 is provided. This is the position where W is delivered.

  More specifically, as shown in FIG. 2, the substrate transport table 4 is configured such that the packing 41 deforms and contacts a wall around the boundary opening 42 and the packing 41 by a predetermined amount at the closed position. In addition, when the substrate W is introduced, sealing is performed so that air from the outside atmosphere does not flow into the vacuum chamber 9 and the chambers maintained at a high vacuum after that. That is, the packing 41 that is an elastic body is crushed and deformed by a predetermined amount to seal the boundary opening 42. At this time, it can be seen from the deformation amount how much force is generated between the substrate carrier 4 and the wall body, so that the packing 41 can be crushed with an appropriate pressing force. Therefore, it is possible to prevent the packing 41 from deteriorating due to an excessive pressing force, and to extend its life.

  The substrate transport table 4 moves to the open position after the substrate W is placed from the outside at the closed position and the inside of the vacuum preliminary chamber 8 is depressurized to a predetermined degree of vacuum. The substrate W is transported inside.

  The rod 21 has a substantially round bar shape that transmits the forward / backward movement of the output end of the toggle link mechanism 1 to the substrate carrier 4, and has a through hole formed in the lower wall of the vacuum chamber 9. It penetrates to be slidable. One end of each rod 21 is attached so as to be line symmetric at the outer peripheral portion of the lower surface of the substrate carrier 4. The other end of the rod 21 is attached to the toggle link mechanism 1.

  The toggle link mechanism 1 moves the substrate transport table 4 by moving the rod 21 forward and backward by the bending and stretching of the toggle link 11, and the toggle link 11 attached to be able to bend and stretch in the vertical direction; A drive unit 12 that bends and extends the toggle link 11 and power from the drive unit 12 are transmitted to the toggle link 11 and the advancing / retreating direction of the output end of the toggle link mechanism 1 is restricted to the advancing / retreating direction of the rod 21. It is comprised from the guide part 13. FIG. In the present embodiment, the output end of the toggle link mechanism 1 corresponds to the tip end portion of the toggle link 11 or a slider 133 of the guide portion 13 described later.

  The toggle link 11 is formed by pivotally connecting three link elements to each other (that is, rotatably attached to each other), one end of the first link element 11a pivotally connected to the guide portion 13, and one end of the toggle link 11 The second link element 11b is pivotally connected to the movable part of the guide part 13 and the other end is pivotally connected to the first link element 11a, and one end is pivotally connected to the drive part 12, and the other end is the first link. The second link element 11b is pivotally shifted from the point where the second link element 11b is pivoted with respect to the element 11a. A first toggle link T1 is formed by the pivot points P1, P2, P3 of the first link element 11a and the second link element 11b, and P4 is formed by the first link element 11a and the third link element 11c. , P5 and P2 form a double toggle link so as to form a second toggle link T2. That is, the first link element 11a is a common link element constituting the first toggle link T1 and the second toggle link T2.

  When viewed from the horizontal direction, the first toggle link T1 and the second toggle link T2 are substantially human characters when extended as shown in FIG. 2, and are bent as shown in FIG. It is formed so as to form an N shape. That is, the toggle link 11 is configured to always protrude inward even if deformation occurs, and is configured to be inside the rods 21 regardless of the position of the substrate transport table 4. . Therefore, even if the toggle link 11 is deformed, it does not interfere with the rods 21. Therefore, it is not necessary to take a large separation distance between the members in consideration of the interference, and the substrate transport apparatus 100 itself is made compact. be able to.

  Further, when the substrate transport table 4 is in the closed position, the pivot points P1, P2, P3 of the first toggle link T1 or the pivot points P4, P5, P2 of the second toggle link T2 are linear. To be lined up. As shown in FIG. 2, in this embodiment, the pivot points P4, P5, P2 constituting the second toggle link T2 are arranged on a straight line, but the three pivot links constituting the first toggle link T1 are arranged. The points P1, P2, and P3 may be arranged on a straight line.

  In this way, by forming a portion where the pivot points P4, P5, and P2 are arranged in a straight line, the substrate transport table 4 to which a force due to atmospheric pressure is applied when the substrate W is loaded is supported by the toggle link mechanism 1. In this case, since the force is generated only in the extending direction of the straight line at the pivot points P arranged on the straight line, no rotational moment is generated around the pivot points P4, P5, P2, and the toggle point P is toggled. The link 11 can be prevented from bending. That is, when the substrate transport table 4 is in the closed position, the toggle link 11 has substantially no inflection point, and continues to support the substrate transport table 4 as one rigid structure. Can do.

  The driving unit 12 includes a driving body 125 that moves in the same direction as the substrate transport table 4, and includes a motor 121, a pulley 123, a belt 122, a ball screw 124, and a driving body 125. More specifically, the ball screw 124 is attached so as to extend in the vertical direction in the center of the substrate transport apparatus 100, and the rotation of the ball screw 124 is converted into a linear motion by the driver 125 corresponding to a nut. It is configured. Further, the third link element 11c is rotatably attached to the drive body 125, and the toggle body 11 is extended by moving the drive body 125 upward, and the output end thereof is raised. Move in the direction.

  The guide portion 13 is provided with two guide bars 132 extending in the vertical direction that is the forward and backward direction of the rod 21, an output end of the toggle link 11, and one end of the rod 21. A slider 133 that moves, an attachment portion 131 for attaching the guide bar 132 to the wall body, and a fixed end connection portion 134 to which a fixed end whose position does not change in the toggle link 11 is rotatably attached; The rods 21 are arranged inside the rods 21 when viewed from the forward / backward direction and the direction perpendicular to the forward / backward direction. More specifically, the attachment portion 131 and the guide bar 132 are disposed inside each rod 21 as viewed from the advancing / retreating direction of the rod 21.

  A description will be given of how the slider 133 and the rod 21 are moved in the vertical direction by the toggle link 11 configured as described above. As shown in FIG. 3, when the driving body 125 is at the lowest point, the toggle link 11 is bent. When the driving body 125 moves upward from this state, the first link element 11a is pushed in the horizontal direction by the third link element 11c. Then, since one end of the first link element 11a is fixed, a force is applied to the slider 133 side of the second link element 11b, and the slider 133 and the rod 21 are pushed upward. .

  In other words, as the driving body 125 moves upward, the bent first link element 11a and second link element 11b are expanded and finally the first link as shown in FIG. The element 11a and the second link element 11b are extended in a substantially linear shape, and the position of the slider 133 is fixed. This state corresponds to a state in which the toggle link 11 is extended, and the substrate transport table 4 is disposed at the highest closed position, and the boundary opening 42 is closed with an appropriate force by the substrate transport table 4. I am trying to make it.

  Next, the seal structure will be described.

  The seal structure has a bellows 3 that is provided between the outer surface of the wall and the toggle link mechanism 1 and covers the rod 21. More specifically, the bellows 3 is attached so that one end is attached to a position where the rod 21 is attached in the slider 133 and the other end is covered with an outer opening of the through hole in which the rod 21 is inserted. It is what was done. That is, the bellows 3 is provided so as to cover all the portions where the rod 21 is exposed to the atmosphere outside the substrate loading chamber B.

  In other words, the rod 21 does not substantially have a portion in contact with the atmosphere by the bellows 3 and hermetically seals the rod 21 and the wall body. Therefore, air from the outside does not flow into the substrate carry-in chamber B, and the vacuum degree can be prevented from lowering due to the presence of the rod 21. Further, dust or the like existing in the outside air does not adhere to the portion where the rod 21 is exposed inside the substrate loading chamber B, and dust or the like does not scatter inside. For this reason, the cleanliness can be maintained in the substrate carry-in chamber B or the subsequent rooms.

  Further, as shown in FIGS. 2 and 3, the rod 21 of the first embodiment is not provided so as to penetrate the attachment portion 131 or the like, or the rod 21 is located outside the toggle link mechanism 1. Since it is arranged, it is easy to freely set the length of the portion exposed to the outside of the rod 21. Therefore, the natural length of the bellows 3 can be as long as possible, and the amount of deformation per unit length can be reduced. Therefore, even if a very large number of substrates W are processed in the ion implantation apparatus 200 and the deformation of the bellows 3 is repeated, the progress of the deterioration can be slowed and the durability can be greatly improved.

  Next, the adjustment mechanism 22 will be described.

  The adjustment mechanism 22 is a mechanism that adjusts the length of the rod 21 from the toggle link mechanism 1 to the substrate carrier 4. More specifically, the rod 21 is attached by screwing a screw formed at the other end into a screw hole provided in the slider 133, so that the degree of this screwing is finely adjusted. Thus, the length of the rod 21 between the substrate carrier 4 and the slider 133 can be changed. That is, by changing the amount of protrusion of the left and right rods 21 from the slider 133, the inclination of the substrate transport table 4 is corrected, and the boundary opening 42 can be hermetically sealed as a preferred state such as horizontal. . More specifically, the protrusion amount of the rod 21 with respect to the slider 133 is determined so that the substrate transport table 4 contacts the peripheral wall body of the boundary opening 42 with a predetermined pressing force when the toggle link 11 is extended. It has been adjusted to do.

  As described above, according to the substrate transfer apparatus 100 and the ion implantation apparatus 200 of the first embodiment, since the seal structure for sealing between the rod 21 and the wall body is provided, air flows from the outside to the inside. Thus, dust does not enter the inside where the degree of vacuum is maintained through the rod 21 that goes back and forth between the inside and the outside of the ion implantation apparatus 200. Accordingly, the degree of vacuum of the vacuum chamber 9 can be suitably maintained, and a situation where the cleanliness is lowered due to dust or the like being scattered inside can be prevented.

  In addition, since the substrate transport table 4 is in the closed position with the pivot points P of the toggle links 11 aligned on a straight line, the boundary opening 42 is airtightly closed. A large force is sometimes applied from the atmospheric pressure side to the vacuum side. A large amount of energy is consumed to keep the substrate transport table 4 in a predetermined position, and it is larger than necessary to counter pressure. The force is not applied to the substrate carrier 4 and the durability of the packing 41 or the like is not reduced.

  Further, since the toggle link mechanism 1 is arranged on the inner side of each rod 21 when viewed from the advancing / retreating direction of the rod 21, the separation distance between the rods 21 should be increased. It is possible to increase the work space for adjustment work and maintenance. Further, since the rod 21 is on the outside, the distance from the outer surface of the wall of the substrate loading chamber B to the slider 133 to which one end of the rod 21 is attached can be increased, and the natural length of the bellows 3 can be increased. Long ones can be applied. In other words, this structure not only improves the maintainability but also contributes to improving the durability of the seal structure.

  In addition, the posture and the like of the substrate transport table 4 can be adjusted by a simple adjustment mechanism 22 that does not use the motor 121 or the like as compared with the prior art, and the manufacturing cost can be reduced.

  Next, a second embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol shall be attached | subjected to the member corresponding to the member demonstrated in 1st Embodiment.

  In the first embodiment, the bellows 3 as the sealing structure is provided so as to cover all the exposed portions of the rod 21 to the outside. However, as in the second embodiment shown in FIG. You may attach so that the inside of the board | substrate carrying-in chamber B may cover from the opening of the through-hole for inserting the rod 21 to the lower surface of the board | substrate conveyance stand 4. FIG. In short, even if there is a portion exposed to the outside in the rod 21, if the rod 21 is not directly exposed to the vacuum atmosphere inside, it is possible to prevent dust and the like from scattering inside.

  Next, a third embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol shall be attached | subjected to the member corresponding to the member demonstrated in 1st Embodiment.

In the third embodiment, instead of using the bellows 3 as in the first and second embodiments, a seal ring is used. More specifically, an O-ring 31 is provided around the opening of the through hole in the substrate loading chamber B as a seal ring.

  Thus, if it is 3rd Embodiment, the degree of vacuum and cleanliness in the board | substrate carrying-in chamber B etc. can be maintained with a simpler structure.

  Next, a fourth embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol shall be attached | subjected to the member corresponding to the member demonstrated in 1st Embodiment.

  The adjustment mechanism 22 for adjusting the posture or the like of the substrate carrier 4 is not limited to that shown in the first embodiment. For example, a height adjustment shim is provided between the slider 133 and the rod 21. You may make it pinch. Even in such a case, it is possible to easily adjust the posture of the substrate transport table 4 while simplifying the adjustment mechanism 22 as compared with the prior art, and to maintain the sealing function in the vacuum preliminary chamber 8 with high accuracy. .

  Other embodiments will be described.

  In each of the embodiments described above, the toggle link mechanism 1 is mounted so as to be suspended from the wall body. However, the toggle link mechanism 1 is provided on the ground as shown in FIG. 7 so as to move the substrate carrier 4 from the ground. You may comprise. Further, the rod is provided through the wall forming the vacuum chamber, but connects the substrate transport table and the toggle link mechanism through the wall forming the vacuum prechamber. It may be. As for the toggle link mechanism, it is only necessary that the toggle link can be deformed into an extended state and a bent state. In some cases, the guide portion may be omitted.

  In each of the above embodiments, the description has been made based on the application example of the substrate transfer apparatus in the ion implantation apparatus. However, the substrate transfer apparatus of the present invention is not limited to the ion implantation apparatus, and can be applied to other semiconductor manufacturing apparatuses. It is. For example, application to a sputtering apparatus, a vacuum evaporation apparatus, and an ion beam alignment apparatus is conceivable. Further, the moving direction of the substrate transfer table is not limited to the vertical direction, and may be, for example, the horizontal direction.

  Furthermore, the substrate transfer apparatus is not only applied to the substrate carry-in chamber, but can also be applied to, for example, a substrate carry-out chamber for deriving a substrate that has been processed in a vacuum to atmospheric pressure again. .

  Further, if the packing 41 is as shown in FIG. 8, the boundary opening 42 can be more preferably airtightly closed when the substrate transport table 4 is in the closed position. Specifically, the packing 41 is detachably provided in a recess formed in the peripheral portion of the substrate transport table 4, and is a substantially annular Teflon (registered trademark) attached to the substrate transport table 4. ). In this embodiment, the packing 41 uses Teflon, which is a resin, but metal packing 41 may be used.

A part of the inside of the upper surface of the packing 41 is attached to the substrate transport table 4 by being pressed by a substantially annular pressing part 411 fixed to the substrate transport table 4 with mounting screws 412. That is, by removing the mounting screw 412 and removing the pressing portion 411, for example, the packing 41 can be easily replaced.

  Further, in order to prevent the inflow of air from the vacuum preliminary chamber 8 to the vacuum chamber 9 at the closed position, an O-ring 413 is provided between the lower surface of the packing 41 and the substrate carrier 4. An O-ring 414 is also provided between the wall forming the vacuum preliminary chamber 8 and the portion where the upper surface of the packing 41 contacts.

  In addition, various modifications and combinations of embodiments may be performed without departing from the spirit of the present invention.

1: Toggle link mechanism 11: Toggle link 12: Drive part 13: Guide part 21: Rod 22: Adjustment mechanism 3: Bellows (seal structure)
31: O-ring (seal structure)
4: substrate transfer table 42: boundary opening 100: substrate transfer device 200: ion implantation device W: substrate

Claims (8)

A closed position for airtightly closing a boundary opening between a vacuum chamber maintained at a predetermined degree of vacuum and a vacuum preliminary chamber for carrying in and out of the substrate between the outside and the vacuum chamber for opening the boundary opening A substrate carrier configured to be movable between the open position of
A toggle provided outside the vacuum chamber and the vacuum preparatory chamber, comprising a toggle link composed of a plurality of link elements pivoted to each other, wherein the toggle is bent and stretched to advance and retract the output end. A link mechanism;
It passes through the wall forming the vacuum chamber or the vacuum preparatory chamber and is interposed between the substrate transport table and the output end of the toggle link mechanism, and transmits the advance / retreat operation of the output end to the substrate transport table. One or more rods,
A seal structure that hermetically seals between the rod and the wall body is provided,
A plurality of the rods are provided , and are configured to advance and retract together with the output end of the toggle link mechanism .
The substrate transfer apparatus, wherein the toggle link mechanism is provided inside each rod when viewed from the forward / backward direction of the rod. The toggle link mechanism further comprises a guide part for restricting the moving direction of the output end to the forward / backward direction of the rod,
The substrate transfer apparatus according to claim 1, wherein the guide portion is disposed on the inner side of each rod when viewed from the advancing and retracting direction of the rod. The guide portion has a guide bar extending in the forward / backward direction of the rod, a toggle link and one end of the rod attached, a slider that moves along the guide bar, and the guide bar attached to the outside of the wall body. A mounting portion for,
The board | substrate conveyance apparatus of Claim 2 with which the said attaching part and guide bar are arrange | positioned inside each rod seeing from the advance / retreat direction of the said rod.   4. The substrate transfer apparatus according to claim 1, wherein the seal structure includes a bellows provided between the outer surface of the wall body and the toggle link mechanism to cover the rod.   The substrate transfer apparatus according to claim 1, wherein the seal structure has a seal ring provided on an inner surface of a through hole through which the rod passes.   6. The toggle link according to any one of claims 1 to 5, wherein the toggle link is configured to be in an extended state in which at least three pivot points of each link element are arranged in a straight line when the substrate carrier is in the closed position. The board | substrate conveyance apparatus of description.   The substrate transfer apparatus according to claim 1, further comprising an adjustment mechanism that adjusts a length of the rod from the toggle link mechanism to the substrate transfer table.   A semiconductor manufacturing apparatus comprising the substrate transfer apparatus according to claim 1.