JP5886793B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
- Publication number
- JP5886793B2 JP5886793B2 JP2013122910A JP2013122910A JP5886793B2 JP 5886793 B2 JP5886793 B2 JP 5886793B2 JP 2013122910 A JP2013122910 A JP 2013122910A JP 2013122910 A JP2013122910 A JP 2013122910A JP 5886793 B2 JP5886793 B2 JP 5886793B2
- Authority
- JP
- Japan
- Prior art keywords
- photodiode
- row
- imaging device
- solid
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003384 imaging method Methods 0.000 title claims description 55
- 238000007599 discharging Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 12
- 230000010354 integration Effects 0.000 description 24
- 239000000969 carrier Substances 0.000 description 20
- 230000003071 parasitic effect Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
- H04N25/671—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
- H04N25/671—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
- H04N25/673—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction by using reference sources
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
- H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
- H04N25/628—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for reducing horizontal stripes caused by saturated regions of CMOS sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
Claims (4)
- 第1のフォトダイオード、及び該第1のフォトダイオードに一端が接続された第1のスイッチ回路を各々含み、M行N列(M,Nは2以上の整数)に二次元配列されたM×N個の画素を有する受光部と、
各列毎に配設され、対応する列の前記画素に含まれる前記第1のスイッチ回路の他端に接続されたN本の読出用配線と、
前記N本の読出用配線に接続された読出回路部と、
前記受光部に対して行方向に並んで配置され、前記第1のスイッチ回路の開閉状態を各行毎に制御するシフトレジスタと、
前記シフトレジスタと前記受光部との間の領域において各行毎に配置されたM個のダミーフォトダイオードと、
前記M個のダミーフォトダイオードにそれぞれの一端が接続されたM個の第2のスイッチ回路と、
前記M個の第2のスイッチ回路の他端に接続されるとともに基準電位線に短絡された電荷排出用配線と
を備えることを特徴とする、固体撮像装置。 - 行方向における前記ダミーフォトダイオードの幅が、該方向における前記第1のフォトダイオードの幅よりも短いことを特徴とする、請求項1に記載の固体撮像装置。
- 前記シフトレジスタと前記受光部とが共通の基板上に形成されていることを特徴とする、請求項1または2に記載の固体撮像装置。
- 開閉状態を制御するための前記第1及び第2のスイッチ回路の各制御端子と前記シフトレジスタとを互いに電気的に接続するために各行毎に配設されたM本の行選択用配線を更に備えることを特徴とする、請求項1〜3のいずれか一項に記載の固体撮像装置。
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013122910A JP5886793B2 (ja) | 2013-06-11 | 2013-06-11 | 固体撮像装置 |
KR1020157033521A KR102333891B1 (ko) | 2013-06-11 | 2014-05-29 | 고체 촬상 장치 |
CN201480033464.0A CN105284104B (zh) | 2013-06-11 | 2014-05-29 | 固体摄像装置 |
EP20170348.5A EP3709363A1 (en) | 2013-06-11 | 2014-05-29 | Solid-state imaging device |
PCT/JP2014/064319 WO2014199838A1 (ja) | 2013-06-11 | 2014-05-29 | 固体撮像装置 |
KR1020217008953A KR102398375B1 (ko) | 2013-06-11 | 2014-05-29 | 고체 촬상 장치 |
US14/897,144 US10090341B2 (en) | 2013-06-11 | 2014-05-29 | Solid-state imaging device |
EP14811345.9A EP3010227B1 (en) | 2013-06-11 | 2014-05-29 | Solid-state imaging device |
TW103119946A TWI610572B (zh) | 2013-06-11 | 2014-06-09 | 固體攝像裝置 |
US16/055,927 US10685991B2 (en) | 2013-06-11 | 2018-08-06 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013122910A JP5886793B2 (ja) | 2013-06-11 | 2013-06-11 | 固体撮像装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016024555A Division JP6185098B2 (ja) | 2016-02-12 | 2016-02-12 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014241490A JP2014241490A (ja) | 2014-12-25 |
JP5886793B2 true JP5886793B2 (ja) | 2016-03-16 |
Family
ID=52022137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013122910A Active JP5886793B2 (ja) | 2013-06-11 | 2013-06-11 | 固体撮像装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10090341B2 (ja) |
EP (2) | EP3709363A1 (ja) |
JP (1) | JP5886793B2 (ja) |
KR (2) | KR102398375B1 (ja) |
CN (1) | CN105284104B (ja) |
TW (1) | TWI610572B (ja) |
WO (1) | WO2014199838A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3407592B1 (en) * | 2016-01-18 | 2020-01-29 | Fujifilm Corporation | Image capture device and image data generation method |
KR20200006083A (ko) * | 2017-05-08 | 2020-01-17 | 브리제 유니버시타이트 브루셀 | 전자기 방사선의 고속-게이트 검출을 위한 검출기 |
WO2018206606A1 (en) * | 2017-05-08 | 2018-11-15 | Vrije Universiteit Brussel | Detector for fast-gated detection of electromagnetic radiation |
CN109087925B (zh) * | 2018-08-09 | 2020-11-13 | 京东方科技集团股份有限公司 | 阵列基板、x射线平板探测器及x射线探测方法 |
JP7446826B2 (ja) * | 2020-01-23 | 2024-03-11 | 株式会社ジャパンディスプレイ | 検出装置 |
JP2022012182A (ja) * | 2020-07-01 | 2022-01-17 | キヤノン電子管デバイス株式会社 | 放射線検出器 |
JP7361008B2 (ja) * | 2020-10-16 | 2023-10-13 | キヤノン電子管デバイス株式会社 | 放射線検出器 |
CN113204506B (zh) * | 2021-04-09 | 2022-06-14 | 华中科技大学 | 一种基于时分复用的智能超表面控制方法、装置及系统 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3146509B2 (ja) * | 1991-04-05 | 2001-03-19 | 富士ゼロックス株式会社 | 2次元密着型イメージセンサ |
JP4386213B2 (ja) | 1998-09-24 | 2009-12-16 | キヤノン株式会社 | 光電変換装置及び画素パネル |
JP2010246129A (ja) * | 1999-06-07 | 2010-10-28 | Toshiba Corp | 放射線検出器 |
JP2001056382A (ja) * | 1999-06-07 | 2001-02-27 | Toshiba Corp | 放射線検出器及び放射線診断装置 |
JP2004037382A (ja) * | 2002-07-05 | 2004-02-05 | Toshiba Corp | 放射線検出器及び放射線診断装置 |
US6928144B2 (en) | 2003-08-01 | 2005-08-09 | General Electric Company | Guard ring for direct photo-to-electron conversion detector array |
JP3890333B2 (ja) * | 2004-02-06 | 2007-03-07 | キヤノン株式会社 | 固体撮像装置 |
JP2006073621A (ja) | 2004-08-31 | 2006-03-16 | Canon Inc | 測距用固体撮像装置とこれを用いたオートフォーカスカメラ |
KR100670538B1 (ko) * | 2004-12-30 | 2007-01-16 | 매그나칩 반도체 유한회사 | 광 특성을 향상시킬 수 있는 이미지센서 및 그 제조 방법 |
JP4773768B2 (ja) | 2005-08-16 | 2011-09-14 | キヤノン株式会社 | 放射線撮像装置、その制御方法及び放射線撮像システム |
JP4130211B2 (ja) | 2006-05-31 | 2008-08-06 | 三洋電機株式会社 | 撮像装置 |
US7755679B2 (en) * | 2007-03-07 | 2010-07-13 | Altasens, Inc. | Apparatus and method for reducing edge effect in an image sensor |
JP2008252691A (ja) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | 画像信号取得方法および装置 |
JP5214904B2 (ja) * | 2007-04-12 | 2013-06-19 | ルネサスエレクトロニクス株式会社 | 固体撮像素子の製造方法 |
JP4935486B2 (ja) | 2007-04-23 | 2012-05-23 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法、固体撮像装置の信号処理方法および撮像装置 |
JP5406473B2 (ja) * | 2007-07-19 | 2014-02-05 | キヤノン株式会社 | 放射線検出装置 |
US8063350B2 (en) | 2007-08-03 | 2011-11-22 | Cognex Corporation | Circuits and methods allowing for pixel array exposure pattern control |
JP4719201B2 (ja) | 2007-09-25 | 2011-07-06 | 浜松ホトニクス株式会社 | 固体撮像装置 |
JP5188221B2 (ja) * | 2008-03-14 | 2013-04-24 | キヤノン株式会社 | 固体撮像装置 |
JP5281943B2 (ja) * | 2009-04-01 | 2013-09-04 | 浜松ホトニクス株式会社 | 固体撮像装置 |
US20110032391A1 (en) * | 2009-08-04 | 2011-02-10 | Himax Imaging, Inc. | Image Sensor with Peripheral Dummy Pixels |
JP5683850B2 (ja) * | 2010-01-28 | 2015-03-11 | 富士フイルム株式会社 | 放射線検出素子、及び放射線画像撮影装置 |
TW201226864A (en) | 2010-12-29 | 2012-07-01 | Himax Imaging Inc | Digital image device with ambient light sensor |
JP2012195734A (ja) * | 2011-03-16 | 2012-10-11 | Sony Corp | 固体撮像装置、撮像装置、電子機器、及び、固体撮像装置の駆動方法 |
JP5749534B2 (ja) | 2011-03-25 | 2015-07-15 | 浜松ホトニクス株式会社 | 赤外線イメージセンサ及び信号読み出し方法 |
TWI596515B (zh) | 2011-10-14 | 2017-08-21 | 劉鴻達 | 交錯式驅動的觸控感應方法、觸控感應模組及顯示器 |
JP5444444B2 (ja) | 2012-12-03 | 2014-03-19 | 浜松ホトニクス株式会社 | 固体撮像装置 |
-
2013
- 2013-06-11 JP JP2013122910A patent/JP5886793B2/ja active Active
-
2014
- 2014-05-29 EP EP20170348.5A patent/EP3709363A1/en not_active Ceased
- 2014-05-29 US US14/897,144 patent/US10090341B2/en active Active
- 2014-05-29 KR KR1020217008953A patent/KR102398375B1/ko active Active
- 2014-05-29 EP EP14811345.9A patent/EP3010227B1/en active Active
- 2014-05-29 WO PCT/JP2014/064319 patent/WO2014199838A1/ja active Application Filing
- 2014-05-29 KR KR1020157033521A patent/KR102333891B1/ko active Active
- 2014-05-29 CN CN201480033464.0A patent/CN105284104B/zh active Active
- 2014-06-09 TW TW103119946A patent/TWI610572B/zh active
-
2018
- 2018-08-06 US US16/055,927 patent/US10685991B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014241490A (ja) | 2014-12-25 |
EP3010227A1 (en) | 2016-04-20 |
CN105284104A (zh) | 2016-01-27 |
US10090341B2 (en) | 2018-10-02 |
KR102333891B1 (ko) | 2021-12-02 |
WO2014199838A1 (ja) | 2014-12-18 |
EP3010227B1 (en) | 2020-06-24 |
TWI610572B (zh) | 2018-01-01 |
EP3010227A4 (en) | 2017-02-15 |
TW201448600A (zh) | 2014-12-16 |
CN105284104B (zh) | 2019-03-15 |
US20160126269A1 (en) | 2016-05-05 |
KR102398375B1 (ko) | 2022-05-16 |
KR20160019059A (ko) | 2016-02-18 |
EP3709363A1 (en) | 2020-09-16 |
US10685991B2 (en) | 2020-06-16 |
US20180374882A1 (en) | 2018-12-27 |
KR20210036423A (ko) | 2021-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5886793B2 (ja) | 固体撮像装置 | |
US10586822B2 (en) | Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera | |
JP6188433B2 (ja) | 固体撮像装置 | |
KR102158897B1 (ko) | 고체 촬상 장치 | |
JP5714982B2 (ja) | 固体撮像素子の制御方法 | |
JP5749873B1 (ja) | 固体撮像素子の制御方法 | |
WO2014178179A1 (ja) | 固体撮像素子および撮像装置 | |
JP6185098B2 (ja) | 固体撮像装置 | |
US10212368B2 (en) | Solid-state imaging device | |
JP6255527B1 (ja) | 固体撮像装置 | |
CN118922944A (zh) | 摄像装置及相机系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151202 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20151202 |
|
TRDD | Decision of grant or rejection written | ||
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20160105 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160112 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160212 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5886793 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |