JP5867110B2 - Semiconductor device assembling apparatus and method - Google Patents

Description

  The present invention relates to an assembling apparatus and method for a semiconductor device in which a sensor section and a lead frame body are joined with an adhesive.

  Conventionally, a semiconductor device including a sensor chip for detecting an acceleration has a gap formed between a sensor portion in which the sensor chip is accommodated and a lead frame body in which a part of the lead frame is covered with resin, and is arranged in the gap. The sensor portion and the lead frame body are joined with the thermosetting adhesive thus prepared. When the adhesive is heated and cured, the sensor unit and the lead frame body are held by a jig, and are transported to a heating device of a production line to heat the adhesive.

  The adhesive has a damper function to prevent vibration corresponding to noise from being transmitted from the lead frame body to the sensor unit. And in order to obtain a predetermined damper characteristic, the thickness of the adhesive is managed with high accuracy.

  In order to manage the thickness of the adhesive with high accuracy, the gap between the sensor part and the lead frame body is maintained by holding the sensor part and the lead frame body with a jig during the process of heating and curing the adhesive. Must be maintained at a predetermined dimension. In addition, the jig is required to have a holding force for securely holding the sensor portion and the lead frame body, as well as ease of attachment / detachment and ease of conveyance.

  Incidentally, in Patent Document 1, wax is interposed between the wafer and the support substrate, they are pressed by the upper surface plate and the lower surface plate, and the wafer and the support substrate are attracted by the magnetic force of the electromagnet. An apparatus for bonding a wafer and a support substrate with wax is disclosed. According to this, the requirements for holding power and ease of attachment / detachment are satisfied.

JP-A-10-154671

  However, in the conventional apparatus shown in Patent Document 1, the wafer and the support substrate are pressed by the upper surface plate and the lower surface plate to bring the wafer and the support substrate into close contact with each other, and the thickness of the wax as an adhesive is increased. Is difficult to manage with high accuracy. In addition, since the jig for holding the wafer and the support substrate includes an upper surface plate, a lower surface plate, and an electromagnet, the configuration is complicated. Furthermore, since there is a mechanism for driving the surface plate, an electromagnet harness, and the like, it is difficult to move them between the production lines while holding the wafer and the support substrate with a jig.

  SUMMARY OF THE INVENTION In view of the above points, the present invention has an object to make it possible to manage the thickness of an adhesive with high accuracy and to simplify a jig used when joining a sensor portion and a lead frame body with an adhesive. To do.

In order to achieve the above object, according to the first aspect of the present invention, a sensor unit (1) in which a sensor chip (12) for acceleration detection is housed in a sensor case (10, 11) at least partially made of a magnetic material. ) And a lead frame body (2) in which a part of the lead frame (20) made of a non-magnetic material is covered with a resin, and a sensor is formed by an adhesive (5) disposed in the gap. 1 is a semiconductor device assembling apparatus in which a lead frame body is joined to a first reference plane (310) on which the sensor section is placed and the top and bottom direction position of the sensor section is determined and the lead frame body is placed A first jig (3) having a second reference surface (302) for determining the position and having the first permanent magnet (34) and the second permanent magnet (35) embedded therein, and the lead frame body as the first jig of And a second jig magnetic body made of sandwich (4), the sensor portion by the first permanent magnet is attracted to the first reference surface, by the second permanent magnet and the second jig is sucked The lead frame body is urged toward the second reference surface via the second jig.

  According to this, since the position of the sensor unit in the vertical direction is determined by the first reference plane, and the position of the lead frame body in the vertical direction is determined by the second reference plane, the vertical direction between the sensor unit and the lead frame body is determined. It is possible to manage the gap dimension of the adhesive with high accuracy, and consequently to manage the thickness of the adhesive with high accuracy. As a result, a predetermined damper characteristic can be given to the adhesive.

  In addition, since the sensor unit and the lead frame body are held by the magnetic force of the permanent magnet, in other words, since there is no surface plate or electromagnet as in the conventional device, the jig can be simplified.

  Furthermore, since a mechanism for driving the surface plate, an electromagnet harness, and the like are unnecessary, it is possible to move them in the production line while holding the sensor portion and the lead frame body with a jig.

  As in the invention described in claim 2, in the semiconductor device assembling apparatus described in claim 1, a thermosetting resin can be used as the adhesive.

  According to a third aspect of the present invention, in the semiconductor device assembling apparatus according to the first or second aspect, the pin (33) formed in the first jig is a pin insertion hole (200) formed in the lead frame body. And the horizontal relative position between the first jig and the lead frame body is determined.

  According to this, the relative positioning of the first jig and the lead frame body in the horizontal direction can be accurately performed with a simple configuration.

In the invention according to claim 4, the sensor part (1) in which at least a part is made of a magnetic material and the sensor chip (12) for detecting acceleration is housed in the sensor case (10, 11) and the non-magnetic material. A gap is formed between the lead frame (2) and a part of the lead frame (20) covered with resin, and the sensor part and the lead frame body are joined by the adhesive (5) disposed in the gap. 1st reference surface (310) which mounts a sensor part and determines the top-and-bottom direction position of a sensor part, and the 2nd reference surface which mounts a lead frame body and determines the top-and-bottom direction position of a lead frame body (302) and a magnetic body sandwiching the lead frame body between the first jig (3) in which the first permanent magnet (34) and the second permanent magnet (35) are embedded, and the first jig Made of Prepared and the jig (4), an adhesive is applied to at least one of the sensor unit and the lead frame body, it sucks the sensor unit to the first reference surface by the first permanent magnet, the first by the second permanent magnet 2. The sensor part and the lead frame body are bonded with an adhesive in a state where the lead frame body is biased to the second reference plane side via the second jig by sucking the two jigs. .

  Accordingly, the same effect as that of the first aspect of the invention can be obtained.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is front sectional drawing of the sensor part in a semiconductor device. It is a figure which shows the lead frame body in a semiconductor device. It is a figure which shows the 1st jig | tool in the assembly | attachment apparatus which concerns on one Embodiment of this invention. It is a figure which shows the 2nd jig | tool in the assembly | attachment apparatus which concerns on one Embodiment of this invention. It is front sectional drawing which shows the state by which the semiconductor device was hold | maintained at the assembly | attachment apparatus which concerns on one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front sectional view of a sensor portion in a semiconductor device assembled by an assembling apparatus according to an embodiment of the present invention, and FIG. 2A is a lead frame in the semiconductor device assembled by the assembling apparatus according to an embodiment of the present invention. 2B is an enlarged sectional view taken along the line AA in FIG. 2A, and FIG. 2C is an enlarged sectional view taken along the line BB in FIG. 2A. .

  A semiconductor device assembled by the assembling apparatus according to the present embodiment includes a sensor unit 1 shown in FIG. 1 and a lead frame body 2 shown in FIG.

  As shown in FIG. 1, the sensor unit 1 includes a first sensor case 10 made of ceramic, a plate-like second sensor case 11 made of a magnetic metal such as iron, and a sensor chip 12 for detecting acceleration. .

  The first sensor case 10 has a shape in which one surface of a rectangular parallelepiped box is opened, in other words, a substantially bowl shape. The sensor chip 12 is accommodated in the first sensor case 10, and the opening of the first sensor case 10 is closed by the second sensor case 11.

  As shown in FIG. 2, the lead frame body 2 includes a plate-like lead frame 20 made of a non-magnetic conductive metal such as copper, and a lead case 21 that covers a part of the lead frame 20 with a resin. Yes.

  The lead case 21 is cylindrical and has a rectangular cross section perpendicular to the axis. In the lead case 21, a lead case partition wall 210 is formed at an axially intermediate portion, and the lead case partition wall 210 is formed with a cross-shaped lead case hole 211. Four circular adhesive application portions 213 surrounded by an annular lead case groove 212 are formed around the lead case hole 211 in the lead case partition wall 210.

  The lead frame 20 is formed with two lead portion pin insertion holes 200 into which pins of a first jig described later are inserted. These lead portion pin insertion holes 200 are disposed substantially diagonally across the lead case hole 211.

  Next, the assembling apparatus according to this embodiment will be described. 3A is a plan view of the first jig in the assembling apparatus according to the embodiment of the present invention, FIG. 3B is an enlarged cross-sectional view taken along the line CC of FIG. 3A, and FIG. a) is a plan view of the second jig in the assembling apparatus according to one embodiment of the present invention, FIG. 4B is a front view of the second jig of FIG. 4A, and FIG. 5 is one embodiment of the present invention. It is front sectional drawing which shows the state with which the semiconductor device was hold | maintained at the assembly | attachment apparatus which concerns on a form.

  The assembling apparatus according to the present embodiment includes a first jig 3 shown in FIG. 3 and a second jig 4 shown in FIG.

  As shown in FIG. 3, the first jig 3 is made of a metal such as stainless steel, and has a plate-like base plate portion 30, a first protrusion 31 protruding upward from the base plate portion 30, and the base plate portion 30. A second projection 32 projecting upward from the base plate 30, a pin 33 projecting upward from the base plate 30, a first permanent magnet 34 embedded in the first projection 31, and the second projection 32 The second permanent magnet 35 is embedded.

  In addition, one 1st projection part 31, a pair of 2nd projection part 32, a pair of pin 33, one 1st permanent magnet 34, a pair of 2nd permanent magnet 35, and one 2nd jig | tool 4, one semiconductor device is held. The first jig 3 includes a number of first protrusions 31 and the like, and a plurality of semiconductor devices can be held by one first jig 3 and a plurality of second jigs 4. It has become.

  The pair of second protrusions 32 is located in the base plate portion width direction (left and right direction in FIG. 3A) and along the base plate portion longitudinal direction (up and down direction in FIG. 3A). It extends in parallel. The first protrusion 31 is disposed between the pair of second protrusions 32.

  One pin 33 is disposed close to one second protrusion 32, and the other pin 33 is disposed close to the other second protrusion 32. More specifically, the pair of pins 33 are arranged substantially diagonally with the first protrusion 31 interposed therebetween.

  In the base plate portion 30, a first magnet insertion hole 300 is formed from the lower surface side of the base plate portion 30 at a position corresponding to the central portion in plan view of the first protrusion portion 31, and the length of the base plate portion in the second protrusion portion 32. A second magnet insertion hole 301 is formed from the lower surface side of the base plate portion 30 at a position corresponding to the center portion in the hand direction.

  The first permanent magnet 34 is embedded in the first magnet insertion hole 300, and the first permanent magnet 34 is held at a predetermined position by a plug (not shown) press-fitted into the opening side of the first magnet insertion hole 300. . The second permanent magnet 35 is embedded in the second magnet insertion hole 301, and the second permanent magnet 35 is held at a predetermined position by a plug (not shown) press-fitted into the opening side of the second magnet insertion hole 301. ing.

  The first permanent magnet 34 and the second permanent magnet 35 may be sumaboko magnets. The samakoba magnet is a sintered product mainly composed of samarium (Sm) and cobalt (Co), and is a rare earth magnet that is resistant to high temperatures and has high corrosion resistance and excellent temperature characteristics even without rust prevention treatment. However, the Samakoba magnet has a low mechanical strength, and is likely to be chipped or cracked. Therefore, in this embodiment, the first permanent magnet 34 and the second permanent magnet 35 are embedded in the first jig 3 to prevent the occurrence of chipping or cracking.

  In the process of assembling the semiconductor device, the sensor unit 1 is placed on the upper surface 310 (hereinafter referred to as a first reference surface 310) of the first protrusion 31 (see FIG. 5), and the sensor unit 1 is formed by the first reference surface 310. The top and bottom direction position is determined.

  Further, in the process of assembling the semiconductor device, a region 302 (hereinafter referred to as a second reference surface 302) excluding the first protrusion 31 between the pair of second protrusions 32 on the upper surface of the base plate 30. The lead frame body 2 is placed (see FIG. 5), and the position of the lead frame body 2 in the vertical direction is determined by the second reference surface 302.

  As shown in FIG. 4, the second jig 4 is a rectangular plate member made of a magnetic metal such as iron, and is used to hold the lead frame body 2 between the first jig 3 ( (See FIG. 5). In the second jig 4, a rectangular second jig portion opening 40 is formed in the central portion in plan view. The second jig 4 has two second jig portion pin insertion holes 41 into which the pins 33 of the first jig 3 are inserted. These second jig part pin insertion holes 41 are arranged substantially diagonally with the second jig part opening 40 interposed therebetween.

  Next, a semiconductor device assembling process by the assembling apparatus according to the present embodiment will be described.

  First, the lead frame body 2 is inserted into the first jig 3 while the pin 33 of the first jig 3 is inserted into the lead part pin insertion hole 200 and the first protrusion 31 is inserted into the lead case hole 211. Assemble. As a result, the bottom portion of the lead case 21 contacts the second reference surface 302 of the first jig 3, and the top and bottom position of the lead frame body 2 is determined by the second reference surface 302. Further, by inserting the pin 33 of the first jig 3 into the lead portion pin insertion hole 200, the relative position in the horizontal direction between the first jig 3 and the lead frame body 2 is determined.

  Subsequently, the second jig 4 is inserted while the pin 33 of the first jig 3 is inserted into the second jig part pin insertion hole 41 and the lead case 21 is inserted into the second jig part opening 40. Is assembled to the first jig 3. As a result, the lead frame 20 is sandwiched between the second protrusion 32 of the first jig 3 and the second jig 4. Then, when the second jig 4 is attracted by the second permanent magnet 35, the lead frame body 2 is biased toward the second reference surface 302 via the second jig 4, and the bottom portion of the lead case 21. Is pressed against the second reference surface 302 of the first jig 3.

  Subsequently, a predetermined amount of the adhesive 5 is applied to the adhesive application portion 213 of the lead case 21. Here, the lead case groove 212 prevents the adhesive 5 from spreading outside the adhesive application portion 213. The adhesive 5 can be a thermosetting resin, more specifically, a silicon-based resin.

  Subsequently, the sensor unit 1 is inserted into the lead case 21 with the second sensor case 11 facing downward, and the sensor unit 1 is placed on the first reference surface 310 of the first jig 3. More specifically, the sensor unit 1 is sucked and held by a nozzle (not shown) to which negative pressure is supplied, and the horizontal relative position of the sensor unit 1 with respect to the lead frame body 2 is confirmed by the image processing apparatus. The sensor unit 1 is inserted into the lead case 21 by controlling the position of the sensor unit 1, and after the sensor unit 1 is placed on the first reference surface 310, the negative pressure supply to the nozzle is stopped and the sensor unit 1 is moved from the nozzle. Separate and retract the nozzle. Thereby, the sensor unit 1 is attracted by the first permanent magnet 34, the bottom portion of the second sensor case 11 abuts on the first reference surface 310, and the top-and-bottom position of the sensor unit 1 is determined by the first reference surface 310. .

  Here, in a state where the sensor unit 1 is placed on the first reference surface 310 and the lead frame body 2 is placed on the second reference surface 302, the gap between the second sensor case 11 and the adhesive application portion 213 of the lead case 21. A gap is formed in the gap. Further, the amount of application of the adhesive 5 is set so that it adheres to the second sensor case 11 and does not protrude outside the lead case groove 212.

  The dimension of the gap is determined by the vertical position of the sensor unit 1 and the lead frame body 2. In this embodiment, the vertical position of the sensor unit 1 is determined by the first reference surface 310, and the second reference surface 302 is determined. Since the position of the lead frame body 2 in the vertical direction is determined, the gap dimension is managed with high accuracy.

  Subsequently, the sensor unit 1 and the lead frame body 2 are conveyed to a heating device (not shown) while being held by the first jig 3 and the second jig 4, and the adhesive 5 is heated to be cured and bonded. The sensor unit 1 and the lead frame body 2 are joined with the agent 5.

  As described above, in this embodiment, the vertical direction position of the sensor unit 1 is determined by the first reference surface 310, and the vertical position of the lead frame body 2 is determined by the second reference surface 302. Is managed with high accuracy, and as a result, the thickness of the adhesive 5 is managed with high accuracy. Therefore, a predetermined damper characteristic can be given to the adhesive 5.

  In addition, since the sensor unit 1 and the lead frame body 2 are held by the magnetic force of the first permanent magnet 34 and the second permanent magnet 35, in other words, since there is no surface plate or electromagnet as in the conventional device, a jig is used. It can be simplified.

  Furthermore, since a mechanism for driving the surface plate, an electromagnet harness, and the like are not required, the sensor unit 1 and the lead frame body 2 can be moved between the production lines while being held by the jig.

  Furthermore, since the relative position of the first jig 3 and the lead frame body 2 in the horizontal direction is determined by the pin 33 of the first jig 3 and the lead portion pin insertion hole 200, the first jig 3 and the lead Relative positioning of the frame body 2 in the horizontal direction can be performed with a simple configuration with high accuracy.

DESCRIPTION OF SYMBOLS 1 Sensor part 2 Lead frame body 3 1st jig | tool 4 2nd jig | tool 5 Adhesive 10 1st sensor case 11 2nd sensor case 12 Sensor chip 20 Lead frame 34 1st permanent magnet 35 2nd permanent magnet 310 1st reference | standard Surface 302 Second reference surface

Claims (4)

A sensor part (1) in which a sensor chip (12) for acceleration detection is accommodated in a sensor case (10, 11) at least partially made of a magnetic material and a part of a lead frame (20) made of a non-magnetic material. A semiconductor device assembling apparatus in which a gap is formed between the lead frame body (2) covered with resin, and the sensor section and the lead frame body are joined by the adhesive (5) disposed in the gap. Because
The first reference surface (310) for determining the vertical position of the sensor unit by mounting the sensor unit and the second reference surface (302) for determining the vertical position of the lead frame body by mounting the lead frame body. A first jig (3) in which a first permanent magnet (34) and a second permanent magnet (35) are embedded;
A second jig (4) made of a magnetic material for sandwiching the lead frame body with the first jig;
The sensor part is attracted to the first reference plane side by the first permanent magnet,
The semiconductor device assembling apparatus, wherein the second permanent magnet attracts the second jig to bias the lead frame body toward the second reference surface via the second jig. .   The semiconductor device assembling apparatus according to claim 1, wherein the adhesive is a thermosetting resin.   A pin (33) formed on the first jig is inserted into a pin insertion hole (200) formed on the lead frame body, and the horizontal relative position of the first jig and the lead frame body is determined. The semiconductor device assembling apparatus according to claim 1, wherein the structure is determined. A sensor part (1) in which a sensor chip (12) for acceleration detection is accommodated in a sensor case (10, 11) at least partially made of a magnetic material and a part of a lead frame (20) made of a non-magnetic material. A semiconductor device assembling method in which a gap is formed between the lead frame body (2) covered with a resin, and the sensor portion and the lead frame body are joined by an adhesive (5) disposed in the gap. Because
The first reference surface (310) for determining the vertical position of the sensor unit by mounting the sensor unit and the second reference surface (302) for determining the vertical position of the lead frame body by mounting the lead frame body. A first jig (3) in which a first permanent magnet (34) and a second permanent magnet (35) are embedded;
Preparing a second jig (4) made of a magnetic material for sandwiching the lead frame body with the first jig;
Applying the adhesive to at least one of the sensor part and the lead frame body,
Sucks the sensor portion by the first permanent magnet to said first reference surface, the said lead frame body via the second jig by sucking second jig by said second permanent magnet A method of assembling a semiconductor device, wherein the sensor portion and the lead frame body are joined with the adhesive while being biased toward the second reference plane side.

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