JP5832786B2 - Electrolytic plating equipment - Google Patents

Description

  The present invention relates to an electrolytic plating technique.

  In the manufacturing process of a semiconductor device, a so-called jet type electrolytic plating apparatus may be used to form a metal film such as gold or copper on the surface of a material to be processed such as a wafer. Jet-type electroplating equipment generates a jet of an electrolyte solution containing metal ions or complex ions, that is, a plating solution, and collides the jet against the surface of the material to be plated to reduce the metal film (plating film). It is something to be made. This type of jet type electrolytic plating apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2006-265709 (Patent Document 1).

  The electroplating apparatus disclosed in Patent Document 1 includes a plating tank, a plating solution supply pipe for injecting a plating solution into the plating tank, a plate-like anode electrode body disposed inside the plating tank, And a material to be plated disposed above the plating tank. The anode electrode body has a through hole (nozzle hole) through which the plating solution ejected from the plating solution supply pipe passes, and the jet of the plating solution that has passed through the through hole is made to collide with the surface of the material to be plated. The anode electrode body is a soluble anode containing phosphorous copper and the like, and metal ions and complex ions used for plating are eluted from the anode electrode body and supplied into the plating solution.

JP 2006-265709 A (paragraphs 0029 to 0030, paragraphs 0036 to 0043, FIG. 1, FIG. 2, etc.)

  As described above, the anode electrode body disclosed in Patent Document 1 is a soluble anode. For this reason, when the plating process proceeds, a gap is formed between the anode electrode body whose size has been changed by melting and a member (for example, a bolt) that fixes the anode electrode body to the plating tank, and thus the plating solution The anode electrode body subjected to the jet pressure may vibrate. When such vibration of the anode electrode body occurs, there is a problem that the thickness and composition of the plating film cannot be made uniform.

  In view of the above, an object of the present invention is to provide an electrolytic plating apparatus capable of forming a plating film having a uniform film thickness and composition even when a soluble anode is used.

An electroplating apparatus according to the present invention includes a bottom portion having an inflow hole into which a plating solution is introduced, a side portion, and an opening for discharging a jet of the introduced plating solution, and forms a cathode electrode in the vicinity of the opening. A plating tank in which a material to be plated is disposed, and a first surface which is immersed in the plating solution accommodated in the plating tank and is opposed to the bottom portion, and penetrates into a region corresponding to the inflow hole. A soluble anode electrode provided with the first surface having a hole and spaced apart from the bottom and the inflow hole; and a region corresponding to the inflow hole in the plating tank and surrounding the soluble anode electrode It said first surface being disposed between said bottom portion, characterized in that it comprises an elastic support member you support the first surface of the soluble anode with an elastic force.

  The electrolytic plating apparatus according to the present invention can form a plating film having a uniform film thickness and composition even when a soluble anode which is a supply source of metal ions or complex ions is used.

It is a figure which shows schematic structure of the jet type electroplating apparatus of Embodiment 1 which concerns on this invention. FIG. 3 is an apparatus cross-sectional view showing an anode electrode arranged in the plating tank of the first embodiment. FIG. 3 is a plan view of the anode electrode when the anode electrode of FIG. 2 is viewed from above. FIG. 3 is a diagram schematically showing an annular recess (counterbore) formed on the back surface of the anode electrode 30 according to the first embodiment. FIG. 3 is a diagram showing a state where a wafer W is arranged in the vicinity of the opening of the plating tank of the first embodiment. (A), (B) is sectional drawing which shows the structure of a comparative example. It is apparatus sectional drawing which shows the anode electrode arrange | positioned in the plating tank of Embodiment 2 which concerns on this invention. FIG. 8 is a plan view of the anode electrode when the anode electrode of FIG. 7 is viewed from above. 6 is a plan view of an anode electrode according to a modification of the second embodiment. FIG. It is apparatus sectional drawing which shows the anode electrode arrange | positioned in the plating tank of Embodiment 3 which concerns on this invention. It is apparatus sectional drawing which shows the anode electrode arrange | positioned in the plating tank of Embodiment 4 which concerns on this invention. FIG. 12 is a plan view of the anode electrode when the anode electrode of FIG. 11 is viewed from above. It is apparatus sectional drawing which shows the anode electrode arrange | positioned in the plating tank of Embodiment 5 which concerns on this invention. FIG. 13 is a plan view of the anode electrode when the anode electrode of FIG. 12 is viewed from above. FIG. 10 is a cross-sectional view showing a modification of the third embodiment.

  Embodiments according to the present invention will be described below with reference to the drawings.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a schematic configuration of a jet-type electrolytic plating apparatus 1 according to Embodiment 1 of the present invention. As shown in FIG. 1, the electrolytic plating apparatus 1 includes a pressing member 10 for pressing a wafer W as a material to be plated from above, and a plating tank (inner tank) 20 which is a container for storing a plating solution 40. An outer tank 21 that is a container for storing the plating liquid 40 overflowing from the edge of the opening 20a of the plating tank 20, a plating liquid supply section 23 for flowing the plating liquid 40 into the plating tank 20, and an anode The upper electrode 17 and the upper electrodes 13 and 15 for the cathode are provided.

  The plating solution supply unit 23 includes a pump 24 and a flow rate control valve 25. The pump 24 has a function of pumping up the plating solution 40 discharged from the outer tank 21 toward the inflow hole 20 f of the plating tank 20 via the flow rate control valve 25. The flow rate control valve 25 controls the flow rate of the plating solution 40 so that the plating solution 40 having a flow rate designated by the operator circulates in the plating tank 20.

  The pressing member 10 can move up and down with respect to the plating tank 20. On the surface of the wafer W, a seed layer (not shown) is formed in a separate process in a region where a plating film is to be formed. The cathode upper electrodes 13 and 15 are connected to the claw portions 14 and 16, respectively, and these claw portions 14 and 16 are mounted on the annular support base 12 so as to be movable in the horizontal direction (the radial direction of the wafer W). Has been. As will be described later, the upper electrodes 13 and 15 are electrically connected to the seed layer (cathode) of the wafer W through the internal wiring (not shown) of the claw portions 14 and 16. In addition to the upper electrodes 13 and 15 and the claw portions 14 and 16 shown in FIG. 1, a plurality of cathode upper electrode and claw portions (not shown) are arranged on the support base 12. .

  The plating tank 20 has an inflow hole 20 f into which the plating solution 40 flows from the lower plating solution supply pipe 22. Moreover, the anode electrode 30 is detachably attached to the inside of the plating tank 20 immediately above the inflow hole 20f. The shape of the anode electrode 30 is a disk shape having a thickness in the inflow direction 40 j of the plating solution 40. The anode electrode 30 is disposed so as to be completely immersed in the plating solution 40 stored in the plating tank 20. The anode electrode 30 is a soluble anode that supplies metal ions or complex ions into the plating solution 40. When depositing a Cu (copper) film on the surface to be plated of the wafer W, for example, a copper sulfate solution may be used as the plating solution 40 and phosphorous copper containing copper as a main component may be used as the constituent material of the anode electrode 30. . A through hole 30 c through which the plating solution 40 flows is formed at the center of the anode electrode 30.

  FIG. 2 is a device cross-sectional view showing the anode electrode 30 disposed in the plating tank 20. FIG. 3 is a plan view of the anode electrode 30 when the anode electrode 30 of FIG. 2 is viewed from above. In FIG. 2, the plating tank 20 and the anode electrode 30 are shown in cross section, but the head portion 31Ah of the bolt 31A, the shaft portion 31As of the bolt 31A, the head portion 31Bh of the bolt 31B, and the compression elastic member 33 are shown in cross section. It has not been. As shown in FIG. 2, the peripheral edge portion of the anode electrode 30 is supported by an annular support portion 20 w that forms a part of the inner wall of the plating tank 20.

  As shown in FIGS. 2 and 3, the peripheral edge of the anode electrode 30 is attached to the plating tank 20 by metal bolts 31A, 31B, 31C arranged in an annular shape along the peripheral edge. . Specifically, as shown in FIG. 2, the shaft portions 31As, 31Bs of the bolts 31A, 31B are screwed into the bolt mounting holes of the plating tank 20 through the bolt insertion holes of the anode electrode 30, respectively, and the bolts 31A, 31B, The heads 31Ah and 31Bh of 31B are in contact with the surface of the anode electrode 30 and press the peripheral edge downward. The same applies to the bolt 31C. These bolts 31A, 31B, 31C press the peripheral edge of the anode electrode 30 in the direction opposite to the inflow direction 40j of the plating solution 40. In this embodiment, bolts 31A, 31B, and 31C are used as members for attaching the anode electrode 30 to the inner wall of the plating tank 20, but the present invention is not limited thereto, and a connecting member other than the bolt is used. May be.

  On the other hand, in the vicinity of the central portion of the anode electrode 30, a compression elastic member (elastic support member) 33 that is compressively deformed is interposed between the back surface of the anode electrode 30 and the inner wall of the plating tank 20. The lower end of the compression elastic member 33 is supported by the inner wall of the plating tank 20, and the upper end of the compression elastic member 33 is pressed by the back surface of the anode electrode 30. For this reason, the compression elastic member 33 elastically urges the vicinity of the center of the back surface of the anode electrode 30 in the inflow direction 40 j of the plating solution 40. As a constituent material of the compression elastic member 33, any conductive material having corrosion resistance to the plating solution 40 may be used. For example, a metal material such as tantalum (Ta), titanium (Ti), or platinum (Pt), Of these, an alloy material containing at least one element may be used. In the present embodiment, a compression coil spring is used as the compression elastic member 33, but the present invention is not limited to this.

  A concave or convex counterbore (locking portion) that locks the upper end of the compression elastic member 33 may be formed on the back surface of the anode electrode 30. Thereby, the compression elastic member 33 can support the back surface of the anode electrode 30 in a stable state against the flow pressure of the plating solution 40. FIG. 4 is a view schematically showing a partial cross section of the anode electrode 30 having a counterbore 30a of an annular recess formed on the back surface of the anode electrode 30 and a cross section of the compression elastic member 33. As shown in FIG. As shown in FIG. 4, one end (upper end) of the compression elastic member 33 is locked to the counterbore 30a.

  As shown in FIG. 1, the shaft portion of the bolt 31 </ b> A is electrically connected to the anode upper electrode 17 through the wiring 18 provided in the plating tank 20. Further, the shaft portion 31 As of the bolt 31 A is electrically connected to the compression elastic member 33 via another wiring 19 in the plating tank 20. For this reason, the upper electrode 17 can supply a voltage to the anode electrode 30 via the wires 18 and 19 in the plating tank 20, the bolt 31 </ b> A, and the compression elastic member 33.

  FIG. 5 is a view showing a state in which the wafer W is disposed in the vicinity of the opening 20a of the plating tank 20 during the plating process. The peripheral edge of the wafer W is placed on the annular support 12. The pressing member 10 presses the back surface of the wafer W and completely immerses the plating surface of the wafer W in the plating solution 40 without completely closing the opening 20a of the plating tank 20, and the plating solution covers the side surface of the wafer W. 40 so as not to be immersed in 40. The claw portions 14 and 16 are disposed so as to contact the side surfaces of the wafer W, respectively. In this way, the upper electrodes 13 and 15 for the cathode can be electrically connected to the cathode of the wafer W via the claw portions 14 and 16. In this state, a constant current is passed between the anode upper electrode 17 and the cathode upper electrodes 13, 15, so that metal ions or complex ions eluted from the anode electrode 30 into the plating solution 40 are removed from the surface of the wafer W. The electron is obtained from the cathode and a plating film is formed. In this embodiment, the pressing member 10 does not have a configuration for holding the wafer W. However, the pressing member 10 has a configuration so that the wafer W can be held by vacuum suction of the back surface of the wafer W, for example. It may be changed.

  As described above, in the electroplating apparatus 1 of the first embodiment, the compression elastic member 33 supports the soluble anode electrode 30 with elastic force, so that the anode electrode 30 is dissolved as the plating process proceeds. Even when the outer dimensions of the anode electrode 30 change, it is possible to suppress the vibration of the anode electrode 30 that has received the fluid pressure of the plating solution 40. Therefore, an effect that a plating film having a uniform film thickness and composition can be formed is obtained.

  6A and 6B are cross-sectional views showing the structure of a comparative example for explaining this effect. The configuration of this comparative example is the same as the configuration of FIGS. 2 and 3 of the first embodiment except that the compression elastic member 33 and the wiring 19 are not provided. As shown in FIG. 6A, at the beginning of the plating process, the anode electrode 30 is fixed to the inner wall of the plating tank 20 by bolts 31A, 31B, 31C. Even if it does not vibrate. However, after the plating process proceeds, as shown in FIG. 6B, the thickness of the anode electrode 30 decreases, and the diameter of the bolt insertion hole through which the bolts 31A, 31B, 31C pass increases. A gap is created between the bolt 30 and the bolts 31A, 31B, 31C. In this state, when the fluid pressure of the plating solution 40 is received, the anode electrode 30 vibrates greatly, thereby causing a problem that the thickness and composition of the plating film cannot be controlled. On the other hand, in the configuration of the first embodiment, as shown in FIG. 2, the vicinity of the central portion of the anode electrode 30 is elastically biased in the inflow direction 40j of the plating solution 40 by the compression elastic member 33. Even when the dissolution of the anode electrode 30 proceeds, the anode electrode 30 can be pressed against the heads of the bolts 31A, 31B, 31C, which are coupling members. Thereby, it is possible to suppress vibration (flutter) of the anode electrode 30.

  Further, since the soluble anode electrode 30 is a consumable item, it is necessary to periodically replace the anode electrode 30. Along with this replacement work, replacement of the plating solution 40 and readjustment of the operation of the electrolytic plating apparatus are necessary. Therefore, the higher the replacement frequency of the anode electrode 30, the higher the manufacturing cost and the lower the yield. There is. In the present embodiment, the replacement frequency of the anode electrode 30 can be reduced. Therefore, compared to the configuration of the comparative example, there is an advantage that improvement in productivity, reduction in manufacturing cost, and improvement in yield can be realized. .

  Further, since the compression elastic member 33 is disposed so as to elastically support the periphery of the through hole 30c of the anode electrode 30 where the flow pressure of the plating solution 40 is high, vibration of the anode electrode 30 is effectively suppressed. Can do.

  Further, in the present embodiment, the anode upper electrode 17 is electrically connected to the anode electrode 30 via the compression elastic member 33, so that a stable voltage is supplied from the upper electrode 17 to the anode electrode 30. Can do. For this reason, a high-quality plated film can be formed.

Embodiment 2. FIG.
Next, a jet type electroplating apparatus according to Embodiment 2 of the present invention will be described. The configuration of the electrolytic plating apparatus according to the present embodiment is the same as that of the first embodiment except for the configuration of the elastic support member that supports the anode electrode 30 with an elastic force and the configuration of the internal wiring and a part of the plating tank. The configuration of the apparatus 1 is almost the same.

  FIG. 7 is an apparatus cross-sectional view showing the anode electrode 30 arranged in the plating tank 20M of the second embodiment. FIG. 8 is a plan view of the anode electrode 30 when the anode electrode 30 of FIG. 7 is viewed from above. In FIG. 7, the plating tank 20M and the anode electrode 30 are shown in cross section, but the head portion 31Ah of the bolt 31A, the shaft portion 31As of the bolt 31A, the head portion 31Bh of the bolt 31B, and the compression elastic members 33A and 33B are in cross section. Not shown in 7 and 8 that have the same reference numerals as those in FIGS. 2 and 3 have the same configuration as the components in FIGS. 2 and 3, and thus detailed description thereof is omitted. To do. Moreover, the structure of the plating tank 20M is the same as the structure of the plating tank 20 of Embodiment 1 except that the inner wall of the plating tank 20M has a flat bottom surface as shown in FIG. .

  As shown in FIGS. 7 and 8, a plurality of compression elastic members (elastic support members) 33A, 33B, and 33C that are compressed and deformed are provided between the back surface of the anode electrode 30 and the flat surface of the inner wall of the plating tank 20M. Intervene. These compression elastic members 33A, 33B, and 33C are arranged so as to surround the central portion (through hole 30c) of the anode electrode 30 and along the peripheral portion of the anode electrode 30. Further, the lower ends of the compression elastic members 33A, 33B, and 33C are supported by the inner wall of the plating tank 20M, and the upper ends of the compression elastic members 33A, 33B, and 33C are pressed by the back surface of the anode electrode 30. For this reason, the compression elastic members 33A, 33B, and 33C elastically urge the back surface of the anode electrode 30 in the inflow direction 40j of the plating solution 40 around the through hole 30c. The constituent material of the compression elastic members 33A, 33B, and 33C can be the same as the constituent material of the compression elastic member 33 of the first embodiment.

  Further, the shaft portion 31As of the bolt 31A is electrically connected to the compression elastic member 33A via the wiring 19M in the plating tank 20. Therefore, the upper electrode 17 can supply a voltage to the anode electrode 30 via the wirings 18 and 19M in the plating tank 20, the bolt 31A, and the compression elastic member 33A.

  Note that a concave or convex counterbore (locking portion) for locking the upper ends of the compression elastic members 33A, 33B, and 33C may be formed on the back surface of the anode electrode 30. Thereby, the compression elastic members 38A, 38B, and 38C can support the back surface of the anode electrode 30 in a stable state against the flow pressure of the plating solution 40. For example, like the counterbore 30a shown in FIG. 4, annular recesses are formed at three positions on the back surface of the anode electrode 30, and these are used as counterbocks that lock the upper ends of the compression elastic members 33A, 33B, and 33C. it can.

  Further, as shown in the top view of FIG. 9, the positions of the compression elastic members 33 </ b> A, 33 </ b> B, 33 </ b> C may be moved to the outer peripheral side of the anode electrode 30.

  As described above, in the electrolytic plating apparatus of the second embodiment, the compression elastic members 33A, 33B, and 33C support the soluble anode electrode 30 with an elastic force. Therefore, as the plating process proceeds, the anode electrode 30 Even when the outer dimensions of the metal oxide melt and change, it is possible to suppress the vibration of the anode electrode 30 that has received the fluid pressure of the plating solution 40. In particular, since the compression elastic members 33A, 33B, and 33C support the back surface of the anode electrode 30 at a plurality of points, vibration of the anode electrode 30 can be effectively suppressed. Therefore, as in the case of the first embodiment, a plating film having a uniform film thickness and composition can be formed. In addition, since the replacement frequency of the anode electrode 30 can be lowered, it is possible to improve productivity, reduce manufacturing cost, and improve yield.

Embodiment 3 FIG.
Next, a jet type electroplating apparatus according to Embodiment 3 of the present invention will be described. The configuration of the electrolytic plating apparatus of the present embodiment is substantially the same as the configuration of the electrolytic plating apparatus 1 of the first embodiment except for the configuration of the elastic support member that supports the anode electrode 30 with elastic force.

  The elastic support member according to the present embodiment is wound around the shafts of bolts 31A, 31B, 31C for fixing the anode electrode 30 to the inner wall of the plating tank 20, and elastically biases the back surface of the anode electrode 30. It is. FIG. 10 is a cross-sectional view schematically showing a part of the configuration of an electrolytic plating apparatus using such an elastic support member. As shown in FIG. 10, a compression elastic member 39A as an elastic support member is wound around the shaft portion 31As of the bolt 31A, and a compression elastic member 39B as an elastic support member is wound around the shaft portion 31Bs of the other bolt 31B. It has been turned. A compression elastic member is also wound around the shaft portion 31Cs of the bolt 31C not shown in FIG. These compression elastic members 39A and 39B are interposed between the back surface of the anode electrode 30 and the flat surface of the inner wall of the plating tank 20 in a state of being compressed and deformed. The constituent material of the compression elastic members 39A and 39B can be the same as the constituent material of the compression elastic member 33 of the first embodiment.

  In the electrolytic plating apparatus of the third embodiment, the compression elastic members 33A and 33B support the soluble anode electrode 30 with elastic force. Therefore, as the plating process proceeds, the anode electrode 30 is dissolved and the outer dimensions thereof are increased. Even when it changes, it can suppress that the anode electrode 30 which received the fluid pressure of the plating solution 40 vibrates. In particular, since the compression elastic members 33A and 33B are wound around the shaft portions 31As and 31Bs of the bolts 31A and 31B, respectively, the anode electrode 30 is held at a plurality of points in a stable posture with respect to the flow pressure of the plating solution 40. It can be supported by elastic force. Therefore, vibration of the anode electrode 30 can be effectively suppressed. Therefore, a plating film having a uniform film thickness and composition can be formed. In addition, since the replacement frequency of the anode electrode 30 can be reduced, it is possible to improve productivity, reduce manufacturing costs, and improve yield.

Embodiment 4 FIG.
Next, a jet type electroplating apparatus according to Embodiment 4 of the present invention will be described. The configuration of the electrolytic plating apparatus of the present embodiment is substantially the same as the configuration of the electrolytic plating apparatus 1 of the first embodiment except for the configuration of the elastic support member that supports the anode electrode 30 with elastic force.

  FIG. 11 is an apparatus cross-sectional view showing the anode electrode 30 disposed in the plating tank 20 of the fourth embodiment. FIG. 12 is a plan view of the anode electrode 30 when the anode electrode 30 of FIG. 11 is viewed from above. In FIG. 11, the plating tank 20 and the anode electrode 30 are shown in cross section, but the head portion 31Ah of the bolt 31A, the shaft portion 31As of the bolt 31A, the nut 32A, the head portion 31Bh of the bolt 31B, the nut 32B, and the leaf spring 37A. 37B and compression elastic members 38A, 38B are not shown in cross section. 11 and 12 having the same reference numerals as those in FIGS. 2 and 3 have the same configuration as the components in FIGS. 2 and 3, and thus detailed description thereof is omitted. .

  As shown in FIGS. 11 and 12, the back surface of the anode electrode 30 is plated by a plurality of dog-shaped plate springs 37 </ b> A, 37 </ b> B, 37 </ b> C arranged in a ring shape along the peripheral edge of the anode electrode 30. The liquid 40 is supported by an elastic force in the inflow direction 40j. Compression elastic members 38A, 38B, and 38C that are compressed and deformed are interposed between the tip portions 37At, 37Bt, and 37Ct of the leaf springs 37A, 37B, and 37C and the back surface of the anode electrode 30. Here, on the back surface of the anode electrode 30, a concave or convex counterbore (locking portion) that locks the upper ends of the compression elastic members 38A, 38B, and 38C may be formed. Thereby, the compression elastic members 38A, 38B, and 38C can support the back surface of the anode electrode 30 in a stable state against the flow pressure of the plating solution 40. For example, like the counterbore 30a shown in FIG. 4, annular recesses are formed at three locations on the back surface of the anode electrode 30, and these are used as counterbocks that lock the upper ends of the compression elastic members 38A, 38B, and 38C. it can.

  On the other hand, as shown in FIG. 11, the base end portion 37Ab of the leaf spring 37A is fixed to the inner wall of the plating tank 20 by using bolts 31A and nuts 32A together with the peripheral portion of the anode electrode 30, and the leaf spring The base end portion 37Bb of 37B is also fixed to the inner wall of the plating tank 20 by using bolts 31B and nuts 32B together with the peripheral portion of the anode electrode 30. The same applies to the base end portion 37Cb of the leaf spring 37C. Bolt insertion holes are formed in the base end portions 37Ab, 37Bb, and 37Cb of the plate springs 37A, 37B, and 37C to pass the shaft portions of the bolts 31A, 31B, and 31C, respectively. The means for fixing the anode electrode 30 is not limited to bolts and nuts.

  Constituent materials of the leaf springs 37A, 37B, and 37C and the compression elastic members 38A, 38B, and 38C are materials that have corrosion resistance against the plating solution 40 and elastically deform (for example, tantalum (Ta), titanium ( (Ti) or a metal material such as platinum (Pt) or an alloy material containing at least one of these elements) may be used, and is not particularly limited. In the present embodiment, compression coil springs are used as the compression elastic members 38A, 38B, 38C, but the present invention is not limited to this.

  As described above, in the electrolytic plating apparatus of the fourth embodiment, the back surface of the soluble anode electrode 30 is supported by elastic force using the leaf springs 37A, 37B, 37C and the compression elastic members 38A, 38B, 38C. Therefore, even when the anode electrode 30 is melted and its outer dimensions change with the progress of the plating process, the anode electrode 30 that has received the fluid pressure of the plating solution 40 can be prevented from vibrating. Therefore, as in the case of the first embodiment, a plating film having a uniform film thickness and composition can be formed. In addition, since the replacement frequency of the anode electrode 30 can be lowered, it is possible to improve productivity, reduce manufacturing cost, and improve yield.

  The leaf springs 37A, 37B, and 37C and the compression elastic members 38A, 38B, and 38C are arranged along the periphery of the disk-like anode electrode 30 and support the back surface of the anode electrode 30 at a plurality of points. The vibration of the electrode 30 can be effectively suppressed.

Embodiment 5 FIG.
Next, a jet type electroplating apparatus according to Embodiment 5 of the present invention will be described. The configuration of the electrolytic plating apparatus of the present embodiment is substantially the same as the configuration of the electrolytic plating apparatus 1 of the first embodiment except for the configuration of the elastic support member that supports the anode electrode 30 with elastic force.

  FIG. 13 is an apparatus cross-sectional view showing the anode electrode 30 arranged in the plating tank 20 of the fifth embodiment. FIG. 14 is a plan view of the anode electrode 30 when the anode electrode 30 of FIG. 13 is viewed from above. In FIG. 13, the plating tank 20 and the anode electrode 30 are shown in cross section, but the head portion 31Ah of the bolt 31A, the shaft portion 31As of the bolt 31A, the nut 32A, the head portion 31Bh of the bolt 31B, the nut 32B, and the elastic gripping member. 35A and 35B are not shown in cross section. 13 and 14 having the same reference numerals as those in FIGS. 2 and 3 have the same configuration as the components in FIGS. 2 and 3, and thus detailed description thereof is omitted. To do.

  As shown in FIGS. 13 and 14, the front surface and the back surface of the peripheral edge of the anode electrode 30 are gripped by elastic gripping members (clip members) 35A, 35B, and 35C with elastic force. The base end portions 35Ab, 35Bb, and 35Cb of the elastic gripping members 35A, 35B, and 35C have bolt insertion holes that pass through the shaft portions of the bolts 31A, 31B, and 31C, respectively. As shown in FIG. 6, the base end portion 35Ab of the elastic gripping member 35A is fixed to the inner wall of the plating tank 20 using a nut 32A and a bolt 31A. Similarly, the base end portion 35Bb of the elastic gripping member 35B is fixed to the inner wall of the plating tank 20 using a nut 32B and a bolt 31B, and the base end portion 35Cb of the elastic gripping member 35C is also a nut (not shown). It is fixed to the inner wall of the plating tank 20 using bolts 31C. The means for fixing the anode electrode 30 is not limited to bolts and nuts.

  The constituent material of the elastic gripping members 35A, 35B, and 35C is a material that has corrosion resistance to the plating solution 40 and elastically deforms (for example, tantalum (Ta), titanium (Ti), platinum (Pt), etc.). A metal material or an alloy material containing at least one element among them may be used, and is not particularly limited.

  As described above, in the electrolytic plating apparatus of the fifth embodiment, the elastic gripping members 35A, 35B, and 35C support the soluble anode electrode 30 with elastic force. Even when the outer dimensions of the metal oxide melt and change, it is possible to suppress the vibration of the anode electrode 30 that has received the fluid pressure of the plating solution 40. In particular, since the elastic gripping members 35A, 35B, and 35C grip the front surface and the back surface of the peripheral edge of the anode electrode 30 with elastic force, the thickness of the anode electrode 30 decreases as the plating process proceeds. However, there is no gap between the elastic gripping members 35A, 35B, and 35C and the anode electrode 30. Thereby, the vibration (flutter) of the anode electrode 30 can be effectively suppressed. Therefore, as in the case of the first embodiment, a plating film having a uniform film thickness and composition can be formed. In addition, since the replacement frequency of the anode electrode 30 can be lowered, it is possible to improve productivity, reduce manufacturing cost, and improve yield.

  Further, the elastic gripping members 35A, 35B, and 35C are evenly arranged along the periphery of the disc-shaped anode electrode 30 and support the periphery of the anode electrode 30 at a plurality of points, so that the vibration of the anode electrode 30 is effective. Can be suppressed.

Modifications of Embodiments 1 to 5.
As mentioned above, although embodiment which concerns on this invention was described with reference to drawings, these are the especially suitable illustrations of this invention, and various forms other than the above are also employable. For example, a configuration in which the anode electrode 30 is elastically biased from above to below can be adopted. FIG. 15 is a cross-sectional view showing a modification of the third embodiment for realizing such a configuration. As shown in FIG. 15, the compression elastic members 39A and 39B are wound around the shaft portions 31As and 31Bs of the bolts 31A and 31B, respectively, and the front surface (upper surface) of the anode electrode 30 and the heads of the bolts 31A and 31B. It is interposed between 31Ah and 31Bh in a compressed and deformed state.

  In the first to fifth embodiments, the anode electrode 30 has one through hole 30c that allows the plating solution 40 to pass therethrough at the center. However, the position and number of the through holes are the same as those of the anode electrode 30. It is not limited.

  Further, although the wafer W has been described as an example of the material to be plated, the material to be plated is not limited to the wafer W.

  W wafer (material to be plated), 1 electrolytic plating apparatus, 10 pressing member, 12 support base, 13, 15 cathode upper electrode, 14, 16 claw part, 17 anode upper electrode, 18, 19, 19M wiring, 20, 20M plating tank (inner tank), 20a opening, 20f inflow hole, 21 outer tank, 22 plating solution supply pipe, 23 plating solution supply unit, 24 pump, 25 flow control valve, 30 anode electrode, 30c through hole, 31A to 31C bolt, 32A to 32C nut, 33, 33A to 33C compression elastic member, 35A to 35C elastic gripping member (clip), 37A to 37C leaf spring, 38A to 38C, 39A to 39C compression elastic member, 40 plating solution.

Claims (12)

Plating having a bottom portion and a side surface portion having an inflow hole into which a plating solution is introduced, and an opening for discharging a jet of the introduced plating solution, and a material to be plated forming a cathode electrode is disposed in the vicinity of the opening. A tank,
A first surface immersed in the plating solution contained in the plating tank and facing away from the bottom, the first surface having a through hole in a region corresponding to the inflow hole, A soluble anode electrode disposed away from the bottom and the inflow hole;
Is disposed between the bottom portion and the first surface of the soluble anode surrounds the area corresponding to the inlet hole in the plating tank, supporting the first surface of the soluble anode with an elastic force electrolytic plating apparatus characterized by comprising an elastic supporting member you. The electroplating apparatus according to claim 1, wherein the flow of the flowing plating solution is caused to collide with the surface of the cathode electrode. The electroplating apparatus according to claim 1 or 2 ,
A binding member for attaching the soluble anode electrode to the plating tank;
The electroplating apparatus, wherein the elastic support member elastically biases the soluble anode electrode in the inflow direction of the plating solution. 4. The electroplating apparatus according to claim 3 , wherein the coupling member presses the soluble anode electrode in a direction opposite to the inflow direction of the plating solution. 5. The electroplating apparatus according to claim 3 , wherein the elastic support member is a compression coil spring. 6. The electrolytic plating apparatus according to any one of claims 3 to 5 ,
The peripheral edge of the soluble anode electrode is attached to the plating tank by the binding member,
The electrolytic plating apparatus, wherein the vicinity of the central portion of the soluble anode electrode is elastically biased by the elastic support member. The electrolytic plating apparatus according to any one of claims 3 to 5 ,
There are a plurality of the elastic support members,
The plurality of elastic support members are arranged so as to surround a region corresponding to the inflow hole . A plating tank having an inflow hole into which a plating solution is introduced and an opening for discharging a jet of the introduced plating solution, and a material to be plated forming a cathode electrode is disposed in the vicinity of the opening;
Elastic gripping that is arranged between the inflow hole and the opening in the plating tank, supplies a voltage to the soluble anode electrode, and grips the upper and lower surfaces of the peripheral edge of the soluble anode electrode with elastic force. Members,
An upper electrode for supplying a voltage to the soluble anode electrode through the elastic gripping member;
Electrolytic plating apparatus characterized by comprising a coupling member for attaching the elastic grasping members in the plating bath. A electroplating device according to any one of claims 3 to 8, wherein the coupling member is electroplating apparatus which comprises a bolt. A electroplating device according to any one of claims 3 9, the shape of the soluble anode electrode, characterized in that the a plate shape having a thickness in the inflow direction of the plating solution Electroplating equipment. The electrolytic plating apparatus according to any one of claims 1 to 7 ,
An upper electrode for supplying a voltage to the soluble anode electrode;
The elastic support member is made of a conductive material,
The electrolytic plating apparatus, wherein the soluble anode electrode is electrically connected to the upper electrode through the elastic support member. A electroplating device according to any one of claims 1 to 11, wherein the soluble anode electrode, electrolytic plating apparatus characterized by having a locking portion for locking said resilient support member .

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