JP5810758B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device having a COB structure in which a plurality of light emitting elements are mounted two-dimensionally, and more particularly to a planar light emitting device that emits light arranged in two or more colors.

  Semiconductor light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are small, power efficient and emit light in vivid colors, and because they are semiconductor elements, there is no fear of running out of spheres, and initial drive characteristics are further improved. It has the characteristics that it is excellent and strong against vibration and repeated on / off lighting. Because of such excellent characteristics, a light emitting device equipped with a semiconductor light emitting element as a light source has a structure corresponding to its use as a general consumer light source for backlights of luminaires and liquid crystal displays (LCD). It's being used.

  Usually, a light-emitting device using a semiconductor light-emitting element as a light source is a base material provided with wiring for supplying a drive current to the light-emitting device of a semiconductor light-emitting element (hereinafter referred to as a light-emitting element), similarly to a general semiconductor element. It is mounted on and electrically connected to the wiring, and the light emitting element is sealed with resin. For this resin, a light-transmitting material is applied to transmit light emitted by the light-emitting element. Further, by adding a phosphor to the light-transmitting resin (sealing member), the light-emitting element emits light. A light emitting device that emits light not only in the color of the light to be emitted but also in a mixed color with light that has been wavelength-converted by a phosphor is known.

  In addition, one of the structures of the light emitting device is that a semiconductor element is mounted on a flat substrate having a lead electrode pattern formed of a metal film on the surface, electrically connected to the lead electrode, and sealed with resin. There is a COB (Chip on Board) structure. In a light emitting device having a COB structure, a light emitting element is mounted on a predetermined mounting area of a substrate, and an electrode of the light emitting element is electrically connected to a lead electrode (inner lead) on the substrate by wire bonding or the like. The mounting area is sealed with a translucent resin so as to cover the wire.

  In a light emitting device having a COB structure, a substrate can be formed in a flat plate shape, and a large number of light emitting elements can be arranged at relatively short intervals. Further, by forming a closed annular frame (frame body) surrounding the arranged light emitting elements on the substrate, the liquid resin material before curing as a sealing member even if the area of the arranged light emitting elements is large Can be easily sealed by filling the inside of the frame, and a large planar light emitting device having a desired irradiation region shape can be obtained by the shape of the frame. In addition, since the frame body is formed of a material having high reflectance such as white resin, light emitted from the light emitting element to the side is reflected and irradiated upward, so that the number of light emitting elements mounted on the number of light emitting elements can be increased. A light emitting device with high extraction efficiency, that is, high light emission efficiency is obtained. Therefore, a COB-structured light-emitting device is used as a lighting fixture such as an LED bulb or a spotlight, and tens or more light-emitting elements are arranged at a high density (narrow) so that a single unit emits strong light from an irradiation area of a wide area. This structure is particularly suitable for a large planar light emitting device mounted at a pitch).

  In a light emitting device having a COB structure (hereinafter referred to as a light emitting device) in which a plurality of light emitting elements are arranged and mounted, two or more types of light emitting elements of different emission colors are mounted, or the region where the light emitting elements are arranged is divided into two or more. A light emitting device that emits light of a different color for each region is known by sealing with a translucent resin to which different phosphors are added. The light emitted by such a light emitting device is extracted as mixed light, and depending on the color or color scheme of light from each region, the color rendering properties can be improved over the light emitting device that emits monochromatic light. Therefore, various light emitting devices have been developed.

  Specifically, as a light emitting device from which white light is obtained, an LED having a blue emission color (blue LED) is mounted as a light emitting element, and sealed with a translucent resin to which a yellow phosphor is added. One that synthesizes white light from blue light and yellow light that has been wavelength-converted by a phosphor is known. Such a light-emitting device can be manufactured at a relatively low cost, but has poor color rendering properties due to the lack of components in the wavelength range of red and green light. Therefore, by dividing the area by one or a plurality of the light emitting elements arranged, and irradiating light of three colors of red, green, and blue or two colors of complementary colors from each area, As a result, light emitting devices capable of obtaining white light closer to natural light have been developed.

  In such a light-emitting device, for example, a light-emitting device in which two types of LEDs of blue-green and orange are mounted and one type of blue LED are arranged and red and green phosphors are added respectively. And a resin that is divided and sealed by region. The former light-emitting device equipped with light-emitting elements with different emission colors has high emission efficiency because it directly takes out the light emitted by the light-emitting elements, but the light emitted by each LED has a narrow wavelength range, so the desired color In order to manufacture a light emitting device that can obtain only white light, it is necessary to select the LEDs to be mounted, which is expensive. In addition, mounting two or more types of light-emitting elements having different electrical characteristics depending on the emission color on a light-emitting device that is driven by a pair of currents causes the drive current to be evenly supplied to each light-emitting element. Connection may be difficult in design. On the other hand, the latter light emitting device that irradiates light having a wavelength converted to two or more colors with different phosphors has a certain wavelength range because the wavelength-converted light with the phosphor has a certain width. It is possible to easily manufacture a light-emitting device that can obtain white light. Furthermore, a light emitting device has been developed in which a color rendering property is further improved by irradiating colors of various wavelengths by combining LEDs of different emission colors and different phosphors (for example, Patent Documents 1 and 2).

  In Patent Document 1, 1 to 3 arrayed light emitting elements (LED chips) are sealed with different light-transmitting resins such as the kind of added phosphor, and the whole is further covered. A light emitting device in which a lens is provided with a transparent resin is disclosed. In this light emitting device, the translucent resins having different phosphors are not spaced apart or are filled with a translucent resin with a narrower spacing. Further, in Patent Document 2, as a light emitting device sealed with a translucent resin to which a different phosphor is added for each region, the light emitting elements arranged in each region are surrounded by a frame body made of a reflective member, A light emitting device in which a translucent resin is filled inside is disclosed.

JP 2007-227679 A Registered Utility Model No. 3156731

  In the light-emitting device described in Patent Document 1, the light-emitting element is sealed with a light-transmitting resin in which the type of phosphor is changed only in a desired region. Thus, in order to provide the translucent resin at a height that covers the light emitting element, a paste-like resin material having a certain degree of viscosity is formed. However, when the region to be sealed is widened, workability decreases with a high viscosity resin material. Further, when a phosphor is mixed with a highly viscous resin material, the phosphor is cured in a relatively uniformly dispersed state. In the process of light passing through such a sealing member, light that has been wavelength-converted by the phosphor is further absorbed and diffused when it reaches the phosphor, so that the light extraction efficiency decreases.

  On the other hand, since the light emitting device described in Patent Document 2 is filled with a low-viscosity resin material on the inner side where the frame body is formed by the reflecting member, it can be easily sealed even in a wide area. it can. Further, since the mixed phosphor is precipitated before the resin material is cured, it is distributed unevenly in the vicinity of the light emitting element placed on the substrate. In such a sealing member, light is suitably wavelength-converted as soon as it is emitted from the light emitting element, and is efficiently extracted through the region where the phosphor of the sealing member is not distributed. However, since the light emitting elements are not placed in the region where the frame is provided, the number of mounted light emitting devices as a whole is reduced, and the light emitting efficiency for the number of mounted light emitting elements can be increased by the reflecting member. The brightness is also reduced. In particular, in a light-emitting device in which a planar view shape of an irradiation region partitioned by a frame is mainly a curved shape such as a circle, the interval between the light-emitting elements in the vicinity of the frame is easily vacant, The number of light emitting elements to be produced is further reduced, and the luminance in the vicinity of the frame body is lowered as well as the whole.

  The present invention has been made in view of the above problems, and is excellent in color rendering by irradiating different light from each of the partitioned areas, and the light emitting elements are not spaced widely at the boundary between adjacent areas. It is an object to provide a light emitting device that is arranged and emits light effectively.

That is, a light emitting device according to the present invention includes a substrate, a plurality of light emitting elements arranged in a mounting region on the substrate, a pair of lead electrodes formed on the substrate, and a periphery of the mounting region on the substrate. a frame formed on a light transmitting sealing member for sealing the plurality of light emitting elements, wherein the plurality of light emitting elements that are electrically connected to the pair of lead electrodes. In the light emitting device, the mounting region is partitioned into two or more irradiation regions by a wall body, and the sealing member is filled in the wall body or inside surrounded by the wall body and the frame body, and Separately provided for each irradiation region, the sealing members of the two adjacent irradiation regions include only one of the phosphors or phosphors different from each other, and the wall body includes the wall. It is characterized by covering at least a part of the light emitting element in the irradiation region provided with the body and made of a light transmissive material.

  In this way, the light emitting device is sealed without mixing the resin material into other regions at the time of manufacturing by providing a light transmitting wall in one of two adjacent regions to partition the sealing member. Therefore, different phosphors can be included in each region so that light of different colors can be obtained, and even if the wall covers the light emitting element, the wall transmits light, so that the light emission efficiency is impaired. The light emitting elements can be arranged without any problem.

  Further, in the light emitting device according to the present invention, the wall body may contain a phosphor corresponding to the color of light irradiated from the irradiation region provided with the wall body. By containing the phosphor in the wall body, the wavelength of light transmitted through the wall body can be converted to a desired color.

  Furthermore, in the light emitting device according to the present invention, the wall body is preferably made of a material having a refractive index different from that of at least one of the adjacent sealing members. By setting the refractive index to be different between the wall body and the sealing member, the light emitted from the light emitting element to the side is easily reflected on the interface, and the light enters the different irradiation region and is absorbed by the phosphor and attenuates. This can be suppressed, and a light emitting device in which a decrease in light extraction efficiency is suppressed can be obtained.

  In the light emitting device according to the present invention, the light emitting elements may be arranged in two or more types that emit light of different colors, and may not be placed on the boundary between two adjacent irradiation regions. preferable. In this manner, by mounting two or more types of light emitting elements having different emission colors, it is possible to obtain light emitting devices with various colors regardless of the phosphor. Further, by arranging the light emitting elements so as not to straddle the irradiation area, a part of the light emitting elements having different emission colors in other irradiation areas adjacent to each other is not arranged in the irradiation area. Also, a light emitting device that emits light of a desired color can be obtained.

  Furthermore, in the light emitting device according to the present invention, it is preferable that the inner wall surface be a reflecting surface so that the frame irradiates light emitted from the light emitting element upward. In this way, by using the frame surrounding the arranged light emitting elements as the reflecting surface, the light extraction efficiency from the light emitting elements is improved.

  Furthermore, it is preferable that the light emitting device according to the present invention further includes a translucent member that fills the inside of the frame body, is formed on the wall body and the sealing member, and transmits light emitted from the light emitting element. The appearance of the light emitting device is adjusted, and the light irradiated from each of the irradiation regions can be taken out as one body.

  In addition, one of the irradiation regions has a center in plan view substantially coincident with the center of the mounting region in plan view, and the other irradiation regions adjacent to each other so as to surround the one irradiation region. It is preferable. In this manner, by using a color scheme that changes in color from the center to the peripheral portion, a light-emitting device that emits uniformly mixed light can be obtained.

  Further, in the light emitting device, it is preferable that the light emitted from the outermost irradiation region in a plan view is closest to a color temperature range of 2700 to 4000K. Alternatively, with respect to two or more irradiation regions, it is preferable that the irradiation region closer to the periphery in the plan view of the mounting region emits light having a longer wavelength. In this way, by setting the color scheme according to the position of the irradiation region, it is possible to obtain a light emitting device with further excellent color rendering.

  According to the light emitting device according to the present invention, even when two or more colors are arranged, the number of mounted light emitting elements is arranged over the entire irradiation region, so that a planar light emitting device with a large amount of light is obtained.

1 is an external view of a light emitting device according to a first embodiment of the present invention. It is a top view in the mounting area of a light emitting element, and its circumference of a light emitting device concerning a 1st embodiment of the present invention. It is a fragmentary sectional view of the light-emitting device which concerns on 1st Embodiment of this invention, and is an enlarged view corresponding to the AA arrow directional cross-sectional view of FIG. It is a schematic diagram explaining irradiation of the light of the light-emitting device based on this invention, (a) is 1st Embodiment, (b), (c) is a fragmentary sectional view of 2nd Embodiment. It is an external view of the light-emitting device which concerns on 2nd Embodiment thru | or 4th Embodiment of this invention. It is a top view in the mounting area | region of a light emitting element, and its periphery of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a top view in the mounting area | region of a light emitting element, and its periphery of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a top view in the mounting area | region of a light emitting element, and its periphery of the light-emitting device which concerns on 4th Embodiment of this invention. It is a top view in the mounting area | region of a light emitting element, and its periphery of the light-emitting device which concerns on the modification of 4th Embodiment of this invention.

  The light-emitting device according to the present invention is used in lighting fixtures such as LED bulbs and spotlights, and can have the same appearance as a known light-emitting device. Hereinafter, a light emitting device according to the present invention will be described with reference to the drawings. Note that a plane (upper surface) in this specification is a light irradiation surface of a light-emitting device. The description of the shape and position of the components and the like of the light emitting device is in plan view unless otherwise described.

[First Embodiment]
As shown in FIG. 1, the light emitting device 10 according to the first embodiment of the present invention is provided with a rectangular ring (square ring) -like frame body 7 at the center of the upper surface of a rectangular flat substrate 1. A transparent member (translucent member) 9 is formed inside the body 7, and a sealing member 8 is formed below the translucent resin. Further, the light emitting device 10 irradiates light upward using the light emitting element 4 (not shown in FIG. 1) mounted and covered with the sealing member 8 as an irradiation region. The light emitting device 10 includes a pad portion 21c of each of the positive electrode 21 and the negative electrode 22 as a pair of pad electrodes (outer leads) for applying a driving voltage of the light emitting element 4 from the outside to the outside of the frame 7 on the upper surface of the substrate 1. , 22c are formed of a metal film. In the light emitting device 10, the cathode mark and the recognition mark are formed of a metal film on the upper surface of the substrate 1 like the pad portions 21c and 22c. The cathode mark has a “−” shape and is provided in the vicinity of the pad portion 22 c of the negative electrode 22 in order to identify the pad portions 21 c and 22 c when the light emitting device 10 is used. The recognition mark is a mark for recognizing a position when the light emitting element 4 is mounted on the substrate 1 in manufacturing the light emitting device 10. The position and shape of the cathode mark and the recognition mark may or may not be designed according to the specifications of the light emitting device 10, and for example, an anode mark may be provided in the vicinity of the pad portion 21c of the positive electrode 21 instead of the cathode mark (FIG. 5). 2), both an anode mark and a cathode mark may be provided.

  A portion of the light emitting device 10 covered with the frame body 7 and the transparent member 9 will be described with reference to FIGS. 2 and 3. In FIG. 2, the long side direction of the substrate 1 that is rectangular in a plan view is shown in the horizontal direction, and the frame body 7 is formed only inside the outline line by a two-dot chain line, and is formed inside the surface layer frame body 7 (entire irradiation region). The sealing member 8 (81, 82) and the transparent member 9 (see FIG. 3) are omitted.

  The light emitting device 10 arranges the light emitting elements 4, 4,... In the mounting area 1a as the mounting area 1a (indicated by a broken line only in the lower right quarter area in FIG. 2) inside the frame body 7 on the substrate 1. The inner lead portions (lead electrodes) 21a and 22a, which are portions for electrically connecting the light emitting elements 4 in the positive electrode 21 and the negative electrode 22, are provided in the region covered with the frame 7 around the mounting region 1a. Prepare. In the light emitting device 10, the light emitting element 4 emits light when a driving voltage is applied at the pad portions 21c and 22c, and passes through the sealing member 8 (81 and 82) and the transparent member 9 to be inside the frame body 7. Light is irradiated upward with the irradiation region (within the inner contour line shown in FIG. 2) as an irradiation region. Therefore, in the light emitting device 10 according to the present embodiment, the entire planar view shape of the irradiation region is a vertically long rectangle (rounded rectangle) in FIG. The light emitting device 10 further includes a protection element 5 that is electrically connected to the inner lead portions 21a and 22a. The light emitting element 4 and the protection element 5 are electrically connected to the inner lead portions 21a and 22a by bonding wires (wires) as will be described later.

  The light emitting device 10 further includes a rectangular ring-shaped translucent wall (wall body) 6 in the irradiation area on the substrate 1, that is, inside the frame body 7. It is divided into an irradiation region 11 and a second irradiation region 12 outside thereof. As shown in FIG. 2, the light-transmitting wall 6 is provided so as to overlap the arranged light-emitting elements 4, 4,..., In other words, the light-emitting elements 4, 4,. Regardless of the arrangement, they are arranged at equal intervals. In FIG. 2, the translucent wall 6 represents only the contour line with a two-dot chain line (thick line) as in the frame body 7. As shown in FIG. 3, the light emitting element 4 that overlaps the light transmitting wall 6 is partially or entirely embedded in the light transmitting wall 6 including the wire W. The light emitting device 10 embeds the light emitting element 4 and the wire W in the sealing member 8 or the light transmitting wall 6, and the inner lead portion 21 a that is a region to which the protective element 5, the wire W, and the wire W are connected. , 22a are embedded in the frame 7 to protect them from dust, moisture, external force and the like. Hereinafter, the elements constituting the light emitting device 10 will be described in detail.

(substrate)
The substrate 1 is a base material of the light emitting device 10 and is a support body on which the light emitting element 4 and the like are arranged, and is formed in a rectangular flat plate shape as shown in FIG. The substrate 1 is preferably formed of an insulating material having a certain degree of strength, like a substrate for a COB package of a general semiconductor element, and transmits light emitted from the light emitting element 4 and external light. Those formed of a difficult material with low light transmittance are preferable. Specific examples include ceramics (Al ₂ O ₃ , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like. These materials are formed into a flat plate shape by a known method. The shape and size of the substrate 1 are not limited, and are appropriately designed according to the form and application of the light-emitting device provided to the user as a product.

  As shown in FIG. 2, the substrate 1 (the whole of FIG. 2) is a plan view that is slightly smaller than or substantially coincides with a region (inside the outline inside the frame body 7) that is an irradiation region in the light emitting device 10. A shaped mounting area 1a is defined. The mounting area 1 a is an area for arranging the light emitting element 4, and is designed based on the position and shape of the irradiation area in the light emitting device 10. On the upper surface of the substrate 1, in addition to the positive electrode 21 and the negative electrode 22 (collectively referred to as the conductive layer 2), the cathode mark, and the like, the plane of the light emitting element 4 is placed at a position where each of the light emitting elements 4 is placed. The reflective layers 3, 3,... That are slightly larger than the visual shape are formed of a metal film.

(Conductive layer)
The positive electrode 21 and the negative electrode 22 are formed as a pair of electrodes on the upper surface of the substrate 1 as two metal films separated from each other so as to face each other with the mounting region 1a interposed therebetween. The positive electrode 21 and the negative electrode 22 are pad portions 21c and 22c for applying a driving voltage for the light emitting element 4 from the outside, inner lead portions 21a and 22a for electrically connecting pad electrodes of the light emitting element 4, and pads, respectively. It consists of wiring parts 21b and 22b that connect the part 21c (22c) and the inner lead part 21a (22a). The shape and size of the pad portions 21c and 22c and the position on the substrate 1 are not particularly limited as long as they are exposed (after sealing) in the light emitting device 10 and can be electrically connected from the outside. It is designed appropriately according to the application. The inner lead portions 21a, 22a are arranged around the mounting area 1a from the mounting area 1a so that the light emitting elements 4 arranged at the ends of the light emitting elements 4, 4,. It is formed into a key shape with an interval of.

  For the conductive layer 2 (the positive electrode 21 and the negative electrode 22), a metal film formed in a pattern of a lead electrode on a substrate for a COB package of a general semiconductor element can be applied, and examples thereof include Au, Cu, and Al. An Au film is particularly preferable. As will be described later, gold (Au) wire is often applied to the wire W, and if the inner lead portions 21a and 22a of the positive electrode 21 and the negative electrode 22 are Au films made of the same material as the wire W, they are firmly bonded. Easy to do. Alternatively, an Au film may be stacked on a Cu film or the like, and the conductive layer 2 may be formed by stacking two or more different metal films. The metal film used as the conductive layer 2 is preferably formed on the surface of the substrate 1 by electroless plating or electrolytic plating, and at the same time, an anode mark or the like can be formed. The thickness of the conductive layer 2 is not particularly limited, and is appropriately designed according to wire bonding conditions, resistance as a lead electrode, and the like.

(Reflective layer)
The reflective layer 3 is a reflective film that reflects light emitted downward from the light emitting element 4 and irradiates the light upward from the light emitting device 10 in order to improve the light emission efficiency of the light emitting device 10. Furthermore, in the light emitting device 10 according to the present embodiment, the light emitting element 4 (light emitting element 41) having a double-sided electrode structure is mounted, so that the electrode on the lower surface side is electrically connected to the reflective layer 3. The reflective layer 3 is slightly larger than the shape of the light emitting element 4 in a plan view at a position where each of the light emitting elements 4 in the mounting region 1a of the substrate 1 is placed, and between the reflective layers 3 and 3 so as not to short-circuit each other. It is formed with a gap. The material of the reflective layer 3 is not particularly limited as long as it is a metal film having a high light reflectance, but Ag and Au are preferable, and Ag having a high reflectance to visible light is particularly preferable. Although Au absorbs light more easily than Ag, for example, after forming the reflective layer 3 with the Au plating film together with the conductive layer 2, the TiO ₂ film is further formed on the Au plating film surface to increase the light reflectivity. be able to. The reflective layer 3 is preferably formed on the surface of the substrate 1 by electroless plating or electrolytic plating in the same manner as the conductive layer 2, and the thickness of the reflective layer 3 is not particularly limited. These may be simultaneously formed on the surface of the substrate 1. Alternatively, the conductive layer 2 may be an Au plating film, and the reflective layer 3 may be an Ag plating film, and may be plated in a separate process.

(Light emitting element)
The light-emitting element 4 is a semiconductor element that emits light by applying a voltage. A known semiconductor light-emitting element composed of a nitride semiconductor or the like can be applied, and light is emitted over a wide area as a light source of a planar light-emitting device. A light emitting diode (LED) is preferred. The light emitting element 4 may be selected with an arbitrary wavelength in order to obtain a desired emission color. Specifically, as a light emitting diode that emits blue light (wavelength 430 nm to 490 nm) or green light (wavelength 490 nm to 570 nm), In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, As a light emitting diode that emits red light (wavelength of 620 nm to 750 nm) using a nitride semiconductor represented by X + Y ≦ 1), an arsenic compound or a phosphorous compound semiconductor represented by GaAlAs, AlInGaP, or the like is used. The light emitting diode can be applied, and the light emission color is changed by the mixed crystal ratio. If the light emitted from the light emitting device 10 is red, GaAlAs or the like may be applied. If the color is other than that, a nitride semiconductor is applied, and sealing is performed as necessary, as described later. The members 81 and 82 contain a phosphor. The light emitting device 10 according to the present embodiment is equipped with light emitting elements 41 and 42 which are two types of light emitting diodes having different emission colors, and these are collectively referred to as the light emitting element 4 as appropriate.

  In the light emitting device 10 according to the present embodiment, as shown in FIG. 2, the light emitting elements 4 (41, 42) are rectangular in plan view, and are arranged at regular intervals so as to fill the mounting region 1 a of the substrate 1. The arranged light emitting elements 4, 4,... Integrally emit planar light from the irradiation area of the light emitting device 10. As described above, the light emitting elements 4 are arranged at regular intervals, so that the light emitted from the light emitting device 10 exhibits uniform luminance in the plane. In the present embodiment, the light-emitting elements 4, 4,... Are provided with a total of 60 × 6 × 10 columns arranged in a matrix with the longitudinal direction aligned in the horizontal direction in FIG. 24 light emitting elements 41 of 4 × 6 rows are mounted on the first irradiation region 11, and 36 light emitting elements 42 are mounted on the second irradiation region 12.

  Further, the light emitting elements 41 and 42 mounted on the light emitting device 10 according to the present embodiment correspond to face-up (FU) mounting, and as shown in FIG. 3, the light emitting element 41 has a double-sided electrode structure and a pair of pads. The p electrode of the electrode is formed on the upper surface, the n electrode is formed on the lower surface, and the light emitting element 42 has a pair of pad electrodes formed on the upper surface. Therefore, when the light emitting element 41 is arranged in the mounting area 1a of the substrate 1, the bottom surface is bonded to the surface of the reflective layer 3 by a known conductive bonding member such as solder or conductor paste, and at the same time, the n electrode is formed. Electrically connected. Similarly, the bottom surface of the light emitting element 42 is bonded to the surface of the reflective layer 3, but a non-conductive bonding member such as a resin may be used. For the light emitting element 41, the p-electrode is directly connected to the wire W by wire bonding, and the n-electrode has the reflective layer 3 connected to the wire W. On the other hand, in the light emitting element 42, both the p electrode and the n electrode are connected to the wire W.

  Further, the light emitting elements 41 and 42 are arranged so that the side on which the p-electrode is formed is aligned to the left in FIGS. 2 and 3, and the respective light emitting elements 4 (41, 42) are arranged on the inner lead portion 21 a of the positive electrode 21. From the light emitting element 4 (42) arranged at the end of the adjacent array to the light emitting element 4 (42) arranged at the end of the array near the inner lead portion 22a of the negative electrode 22, one or more adjacent light emitting elements 4 are passed through. By connecting the two in series with a wire W, without being routed, they are electrically connected to the inner lead portions 21a and 22a. By being connected in this way, it is possible to apply a voltage from the inner lead portions 21a, 22a outside the mounting region 1a to all of the light emitting elements 4, 4,... Arranged two-dimensionally in the mounting region 1a. .

  Here, in the light emitting device 10, it is desirable that the number of the light emitting elements 4 in the group of the light emitting elements 4 connected in series is unified. The light emitting elements 4, 4,... Are connected to the inner lead portions 21a, 22a in parallel in units, and a common voltage is applied. Therefore, when the number of the light emitting elements 4 is different for each group, the resistance is different. Depending on the set, a difference occurs in the voltage applied to each light emitting element 4 and the amount of emitted light is not uniform, resulting in in-plane variation in luminance in the irradiated area. Further, when two or more types of light emitting diodes (light emitting elements 41 and 42) having different forward drop voltages Vf are mounted as in the light emitting device 10 according to the present embodiment, the numbers of the light emitting elements 41 and 42 are unified. . Specifically, as shown in FIG. 2, a total of 15 light emitting elements 41 and 9 light emitting elements 42 are connected in series as a set, and 4 sets are connected in parallel. Thus, the connection specifications are designed according to the number and arrangement of the light emitting elements 4 (41, 42). Alternatively, all the light emitting elements 4 may be connected in parallel one by one. For example, the p electrodes and the n electrodes of each light emitting element 4 may be connected by wires and connected to the inner lead portions 21a and 22a. (Not shown).

(Protective element)
The protection element 5 is a Zener diode, a capacitor, or the like, and is mounted in order to prevent the light emitting element 4 from being destroyed due to overvoltage application. The protection element 5 is preferably disposed outside the irradiation region so as not to block light emitted from the light emitting element 4, and therefore preferably embedded in the frame body 7. In the light emitting device 10 according to the present embodiment, the protective element 5 includes an anode electrode (not shown) on the bottom surface and is connected to the surface of the inner lead portion 21a with solder, conductor paste, or the like, and the cathode electrode provided on the top surface is the inner lead portion. 22a is connected by wire bonding.

(Wire)
The wire W is a conductive wiring for electrically connecting electronic components such as the light emitting element 4 (41, 42) and the protection element 5 to the inner lead portions 21 a, 22 a of the positive electrode 21 and the negative electrode 22. The wire W is a wire generally used in wire bonding, and examples of the material include Au, Cu, Pt, Al, and alloys thereof. In particular, Au is preferable because it is excellent in thermal conductivity and is generally applied to the pad electrode material of the light emitting element 4. The diameter of the wire W is not particularly limited, and is appropriately selected according to the material of the wire W, the resistance, the wire bonding conditions, the specifications of the light emitting element 4 and the protection element 5, and the like.

(Frame, translucent wall)
The frame body 7 divides the entire irradiation area of the light emitting device 10 on the substrate 1, and the irradiation wall 6 further divides the irradiation area into two irradiation areas 11 and 12. As will be described later, the translucent wall 6 and the frame 7 are sealed by filling the translucent resin material with the translucent wall 6, the inside of the frame 7, and between the translucent wall 6 and the frame 7. This is a weir for forming the stop members 81 and 82 and the transparent member 9.

  The frame body 7 seals (embeds) the wires W and the like together with the sealing members 81 and 82 and the translucent wall 6 to protect them. Therefore, as shown in FIG. 2, the frame body 7 is formed in a rectangular (long rectangular shape) ring in the region covering the inner lead parts 21a and 22a so as to surround the mounting region 1a. The wire W to be connected to and the protective element 5 on the inner lead portion 21a are embedded. Further, the frame body 7 is a reflecting plate for improving the light emission efficiency of the light emitting device 10 by reflecting light emitted from the light emitting element 4 to the side by the inner wall surface upward. Alternatively, the frame body 7 may be formed of a material that transmits light in the same manner as the translucent wall 6, and light may be irradiated from the irradiation region of the light emitting device 10 to the side.

The frame body 7 is an insulator and is preferably formed of a material having a certain level of strength and having a low light transmittance through which light emitted from the light emitting element 4 and external light are difficult to transmit, like the substrate 1. Further, in order to embed the wire W previously provided by wire bonding so as not to be deformed as much as possible, the frame body 7 is made of a material that can be formed on the substrate 1 in a liquid or paste form and solidified as it is. . Although details will be described later in the production method, a paste-like, that is, high-viscosity liquid material is preferable in order to form a sufficient height as a weir. Examples of such materials include thermosetting resins and thermoplastic resins, and specific examples include phenol resins, epoxy resins, BT resins, PPA, and silicone resins. Moreover, it is preferable that the frame 7 is white in order to increase the reflectance. Further, in order to further increase the reflectivity, the frame body 7 has a reflection material that hardly absorbs the light emitted from the light emitting element 4 and has a large refractive index difference with respect to the resin that is the base material. For example, TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, etc.) powder may be dispersed in advance.

  The frame body 7 does not particularly define the height from the substrate 1, but as shown in FIG. 3, as shown in FIG. 3, the irradiation region further above the light transmitting wall 6 and the sealing members 81 and 82 formed by filling the inside and outside of the light transmitting wall 6. In order to form the entire inside of the frame body 7 by filling the transparent member 9 with the transparent member 9, the height is preferably higher than that of the translucent wall 6. Further, the frame body 7 has a height that forms a reflection surface so that light that is emitted from the light emitting element 4 to the side and goes to the outside of the irradiation region is not emitted as it is to the outside of the light emitting device 10. Further, the frame body 7 does not particularly define a width (wall thickness) in plan view, and may be a width that can cover the inner lead portions 21a and 22a and can be formed at a desired height.

  The translucent wall 6 is a weir for forming the first sealing member 81 and the second sealing member 82 separately, and thereby the irradiation area of the light emitting device 10 is defined as the first irradiation area 11 and the second irradiation area. It is divided into 12. Further, the translucent wall 6 is formed of a material that transmits light in the same manner as the sealing members 81 and 82 so that the translucent wall 6 itself constitutes a part of one of the irradiation regions 11 and 12. Specifically, in the present embodiment, the translucent wall 6 has a closed annular shape, and is divided into the translucent wall 6 and a first irradiation area 11 configured inside thereof and a second irradiation area 12 configured outside. To do. That is, the outer contour line of the translucent wall 6 shown in FIG. 2 is a boundary line between the first irradiation region 11 and the second irradiation region 12. Since the translucent wall 6 is provided, the sealing members 81 and 82 are formed by filling a liquid resin material inside and outside the translucent wall 6 respectively. It is possible to contain phosphors different from each other without being mixed with each other separated by the light transmitting wall 6.

  Further, since the light transmitting wall 6 is formed of a material that transmits light, even if the light transmitting element 4 is formed so as to cover the light emitting element 4, the light emitted from the light emitting element 4 is extracted outside the light transmitting wall 6 (see FIG. 4 (a)), the translucent wall 6 can be formed in an arbitrary plan view shape without matching the arrangement of the light emitting elements 4. In other words, the light emitting device 10 does not need to arrange the light emitting elements 4 avoiding the position where the light transmitting wall 6 is formed on the substrate 1 (mounting region 1a), and also at the boundary between the irradiation regions 11 and 12, etc. Since they can be arranged at regular intervals, unevenness in the amount of light in the entire irradiation area is reduced. Furthermore, in the manufacture of the light emitting device 10, the workability of mounting the light emitting element 4 on the substrate 1 is not deteriorated, and the connection (wire bonding) of the wire W between the light emitting elements 4 and 4 is easy. However, in the present embodiment, since the light emitting elements 41 and 42 having different emission colors are mounted on the irradiation areas 11 and 12, the irradiation areas 11 and 12 are partitioned so that the boundary line is between the light emitting elements 41 and 42. It is preferred that Therefore, as shown in FIG. 2, the translucent wall 6 is formed in a square ring shape like the frame body 7 so that at least the outer contour line follows the arrangement of the light emitting elements 4 (41, 42). It is divided into a vertically long rectangular first irradiation region 11 whose center substantially coincides with the center of the entire irradiation region and a square ring-shaped second irradiation region 12 surrounding the first irradiation region 11.

  The light transmitting wall 6 is an insulator that transmits light, and embeds (seals) the light emitting element 4 previously mounted on the substrate 1 and the wire W provided by wire bonding. Therefore, the translucent wall 6 can be made of a translucent resin material such as a silicone resin, an epoxy resin, or a urea resin, similarly to the sealing members 81 and 82, depending on the form and use of the light emitting device 10. For example, when a high output light emitting diode is mounted as the light emitting element 4, a silicone resin having particularly excellent heat resistance is preferable. Then, similarly to the frame 7, the resin material which is paste-formed by adjusting the viscosity is formed on the substrate 1 and solidified as it is. Details will be described later in the manufacturing method.

  Further, when the light transmitting wall 6 irradiates the light emitted from the light emitting elements 4 (41) arranged from the first irradiation region 11 including the light transmitting wall 6 with wavelength conversion, the first sealing member 81 is used. Similarly, the phosphor is added to the resin material (see the third embodiment). However, since the translucent wall 6 is a high-viscosity resin material at the time of formation as described above, the translucent wall 6 is cured while maintaining a state in which the added and mixed phosphors are uniformly dispersed. Therefore, the light extraction efficiency tends to be lower than the sealing members 81 and 82 in which the phosphor is likely to be precipitated and distributed in the vicinity of the light emitting element 4. Moreover, in the same 1st irradiation area | region 11, since the distribution state of a fluorescent substance differs in the translucent wall 6 and the 1st irradiation area | region 11, it is difficult to make the color of the light irradiated from each correspond. Therefore, when irradiating the light wavelength-converted with the phosphor only in one of the irradiation regions 11 and 12, it is preferable to include the light transmitting wall 6 on the side not including the phosphor. Thus, the translucent wall 6 (first irradiation region 11), together with the first sealing member 81, balances the amount of light emitted from the second irradiation region 12 and the amount of light when not containing a phosphor. A light diffusing agent may be added.

  The translucent wall 6 does not particularly define the height from the substrate 1, but as shown in FIG. 3, the sealing members 81 and 82 formed between the inner and outer frames 7 emit light. The element 4 and the wire W are completely buried so as not to be exposed. On the other hand, the transparent wall 6 is preferably lower than the frame body 7 because the transparent member 9 is formed on the transparent wall 6 as described later. Moreover, the translucent wall 6 should just be a width | variety which can be formed in desired height, without prescribe | regulating especially the width | variety (thickness of a wall) in planar view. However, if the width of the translucent wall 6 is too thick, the region where the first sealing member 81 is filled becomes small.

(Sealing member)
The light emitting device 10 according to the present invention serves as a sealing member 8 that seals (embeds) the light emitting element 4 and the wire W to protect them, and transmits light emitted from the light emitting element 4 to take it out. As shown in FIG. 2, a first sealing member 81 and a second sealing member 82 are provided in each of the two regions (irradiation regions 11 and 12) divided in plan view. Specifically, the first sealing member 81 is inside the translucent wall 6, and the second sealing member 82 is outside the translucent wall 6 and between the frame body 7 and the liquid resin on the substrate 1. Filling the material, as described above, the light emitting element 4 and the wire W are completely buried and formed so as not to be exposed. Furthermore, at least one of the first sealing member 81 and the second sealing member 82 contains a fluorescent substance (phosphor) and converts the wavelength when light is transmitted.

  As the sealing members 81 and 82, a translucent resin material used for sealing a general light emitting device on which a light emitting diode or the like is mounted can be applied. Specifically, a silicone resin, an epoxy resin, or a urea resin can be used. Etc. The sealing members 81 and 82 can be formed of a liquid resin material having a relatively low viscosity because the light-transmitting wall 6 and the frame body 7 previously formed on the substrate 1 serve as a weir. It is suitable for sealing a wide area (irradiation areas 11 and 12) like the light emitting device 10 according to the embodiment. Further, since the sealing members 81 and 82 are separated from each other by the light transmitting wall 6 and are not mixed with each other, the phosphors can be contained in only one or different types. Further, when the phosphor is mixed with such a low-viscosity resin material, the phosphor is likely to precipitate before it is cured, so that the second sealing member 82 shown in FIG. The phosphor FL is distributed in the vicinity of the surface (upper surface and side surface) of the light emitting element 4 placed on the light source, and the light emitted from the light emitting element 4 is suitably wavelength-converted. Further, these resin materials may contain a colorant, a light diffusing agent, a filler and the like in addition to the phosphor according to the purpose and application of the light emitting device 10. Hereinafter, the phosphors contained in the sealing members 81 and 82 and the translucent wall 6 will be described.

The phosphor is a wavelength conversion member that absorbs at least part of the light emitted from the light emitting element 4 and converts it into light of a different wavelength. A known material may be applied to the phosphor, for example, a YAG-based phosphor activated with Ce or the like by mixing Y (yttrium), Al (aluminum), and Ga (garnet), or a lanthanoid such as Eu or Ce. Nitride-based phosphors, oxynitride-based phosphors and the like mainly activated with a system element can be used. From these materials, the light emitted from the first irradiation region 11 and the second irradiation region 12 is selected so as to have a desired color in combination with the emission color of the light emitting element 4 as will be described later. Examples include YAG phosphors and chlorosilicate phosphors that emit green and yellow, SCASN phosphors such as (Sr, Ca) AlSiN ₃ : Eu that emit red, and CASN phosphors such as CaAlSiN ₃ : Eu. In addition, two or more kinds of phosphors may be mixed and used.

(Transparent material)
The light emitting device 10 preferably includes a transparent member 9 that covers the entire irradiation region. As shown in FIG. 3, the transparent member 9 is formed thereon so as to level the unevenness of the surface formed by the translucent wall 6 and the sealing members 81 and 82, and adjusts the appearance of the light emitting device 10. Moreover, the light irradiated from each of the translucent wall 6 and the sealing members 81 and 82 can be taken out integrally. The transparent member 9 is formed by filling the inside of the frame body 7 with a translucent resin material, similarly to the sealing members 81 and 82. The surface shape of the translucent wall 6 is not limited, and may be flat or convex lens shape (see FIG. 5), for example, and is appropriately designed according to the form and application of the light emitting device 10 provided to the user as a product. The

(Method for manufacturing light emitting device)
Next, an example of a method for manufacturing a light emitting device according to an embodiment of the present invention will be described. The light emitting device 10 can be manufactured by a method similar to that of a general semiconductor element COB package or a conventional light emitting device. Further, the substrate 1 may be manufactured in a state where a plurality of light emitting devices 10 are connected in the surface direction. In this case, the substrate 1 is cut one by one at the end (after the transparent member 9 is formed). Separated and completed.

  First, the conductive layer 2 and the reflective layer 3 are formed on the surface (upper surface) of the substrate 1 by patterning a metal film into a predetermined shape by electroless plating. At this time, the cathode mark and the recognition mark (see FIG. 1) can be formed simultaneously or before and after.

  Next, the light emitting elements 4 (41, 42) are mounted and arranged on the reflective layer 3 formed at a predetermined interval in the mounting region 1a on the substrate 1. At this time, the bottom surface of the light emitting element 4 is bonded to the reflective layer 3 with a bonding member. Further, the protection element 5 is mounted at a predetermined position on the inner lead portion 21a. Depending on the bonding member, after all the light emitting elements 4 and the protective elements 5 are arranged, the substrate 1 is heated to cure or melt and bond and fix the bonding member. In addition, the mounting order of the light emitting elements 41 and 42 and the protection element 5 is not limited. Then, the wire W is connected to the respective pad electrodes or the reflective layer 3 of the mounted light emitting element 4 and protection element 5 by wire bonding, and is electrically connected to the inner lead portions 21a and 22a.

  Next, the translucent wall 6 and the frame 7 are formed. Specifically, in a resin discharge device provided with ring-shaped discharge ports (nozzles) that match the shapes of the translucent wall 6 and the frame 7 in plan view, paste-like resin material is applied to the frame 7 on the substrate 1. It discharges to a formation position and it hardens or solidifies by the process corresponding to resin materials, such as heat processing. Alternatively, the base on which the substrate 1 is placed is matched with the planar view shape of the translucent wall 6 and the frame body 7 by the discharge port having a diameter matched to the width of the translucent wall 6 and the frame body 7 (the thickness of the ring). The translucent wall 6 and the frame 7 can also be formed by discharging the resin material while moving horizontally so as to draw a rectangle. The translucent wall 6 and the frame 7 may be discharged simultaneously with a resin material, may be simultaneously cured by heat treatment or the like, or may be cured after either one is formed.

  Next, a translucent resin material containing a desired phosphor is filled in the inside and outside of the translucent wall 6 and between the frame body 7 and heat treatment or light as necessary. The first sealing member 81 and the second sealing member 82 are formed by being cured by a process such as irradiation. The sealing members 81 and 82 may be filled with the respective translucent resin materials at the same time, may be cured at the same time, or may be filled with the other after curing one of them. Alternatively, the second sealing member 82 can be formed by forming the frame 7 after forming only the light-transmitting wall 6 and forming the first sealing member 81 on the inside thereof. Further, for example, when the first sealing member 81 is formed of a transparent translucent resin material that does not contain a phosphor or the like, after forming only the second sealing member 82, it is integrated with the next transparent member 9. The first sealing member 81 can also be formed.

  Finally, a transparent translucent resin material is filled inside the frame body 7 and cured in the same manner as the sealing members 81 and 82 to form the transparent member 9, whereby the light emitting device 10 is completed. When the surface shape of the transparent member 9 is formed in a convex lens shape, a resin material having a certain degree of viscosity may be applied.

(Light emitting device design)
In the planar light emitting device, in order to irradiate light of different colors from each of the irradiation areas divided into two or more, and to obtain integrated light that is mixed as a whole, the color is changed from the center of the irradiation area toward the outer periphery. It is preferable to change. In a light-emitting device in which light-emitting diodes are arranged and mounted as light-emitting elements, each of the light-emitting elements emits light in all directions, so that the light mixed in the vicinity of the boundary of the irradiation region becomes uniform. Hereinafter, an example of the design of the light emitting device according to the first embodiment of the present invention will be described.

  As shown in FIG. 2, the light emitting device 10 according to the present embodiment includes a first irradiation region 11 having a vertically long rectangle and substantially the same center as the entire irradiation region, and a second irradiation region 12 surrounding the first irradiation region 11. It is designed to divide and emit light of different colors to produce white light close to natural light as a whole. Here, in the 1st irradiation area | region 11, the light emitting element 41 is made into red LED, and a red light is irradiated without wavelength conversion. On the other hand, in the 2nd irradiation area | region 12, the light emitting element 42 is made into blue LED, and white light is irradiated by yellow fluorescent substance. With such a configuration, light that is close to incandescent bulb light (light with a color temperature of 2700 to 4000 K) is obtained by mixing the bluish white light from the second irradiation region 12 with the red light from the first irradiation region 11. Irradiated. Furthermore, by irradiating light that is closer to the white light to be expressed in the entire irradiation region from the second irradiation region 12 at the outermost periphery of the irradiation region, the light irradiation device 10 is viewed from a direction not facing the irradiation surface. Is irradiated with light of a relatively uniform color.

  In the light emitting device 10, it is preferable that the translucent wall 6 is provided in the first irradiation region 11 that does not require a phosphor. As described above, at the time of manufacture, the phosphor is difficult to precipitate on the light-transmitting wall 6 formed of a high-viscosity resin material, and it is difficult to make the wavelength conversion efficiency by the phosphor equal to that of the sealing members 81 and 82. Because. As shown in FIG. 2, the translucent wall 6 is formed so as to be partially embedded with respect to the eight light emitting elements 41, but the entire light emitting element 41 is embedded with a wider width. (Refer to the fourth embodiment). Further, although depending on the difference in the output of the light emitting elements 41 and 42, the first irradiation region 11 does not absorb light accompanying the wavelength conversion, and therefore the amount of light per one of the light emitting elements 41 and 42 is the second irradiation. More than region 12. Therefore, the area of the first irradiation region 11 and the number of mounted light emitting elements 41 are further reduced, and a light diffusing agent is contained in the first sealing resin 81 and the light transmitting wall 6 as necessary, so that the second It is preferable to balance the amount of light with the irradiation region 12.

(Operation of light emitting device)
The operation (light irradiation) of the light emitting device according to the first embodiment designed as described above will be described with reference to FIG. In FIG. 4A, the pad electrode, the wire W, and the reflective layer 3 of the light emitting element 4 (41, 42) are omitted.

In the light emitting device 10 according to the first embodiment, the phosphor FL is precipitated in the second sealing member 82 and is distributed in the vicinity of the surface of the light emitting element 4 (42). Therefore, the light emitted from the light emitting element 42 is efficiently wavelength-converted by the phosphor FL, passes through the second sealing member 82 and the transparent member 9, and is irradiated outside the light emitting device 10. Here, since the light emitting element 4 (41, 42) emits light in all directions from the light emitting layer (active layer) of the light emitting element 4, light is emitted not only upward but also laterally and downward. . Therefore, a part of light (for example, the light beam L ₂ ) emitted from the light emitting element 42 to the side or emitted downward and reflected by the reflective layer 3 is transmitted from the second sealing member 82 to the first irradiation region 11. It enters the wall 6 or further enters the first sealing member 81. Since these translucent walls 6 and the like do not contain a phosphor, the light emitted from the light emitting element 42 and wavelength-converted by the second sealing member 82 is wavelength-converted by the translucent wall 6 and the first sealing member 81. Without being absorbed, the light passes through the transparent member 9 and is irradiated from the first irradiation region 11 to the outside of the light emitting device 10.

On the other hand, a part of light (for example, light rays L ₁ and L ₃ ) emitted from the first sealing member 81 in the first irradiation region 11 or the light emitting element 4 (41) embedded in the light transmitting wall 6 is second sealed. The stop member 82 is entered. However, in the second sealing member 82, the phosphor FL is deposited on the bottom (on the substrate 1 and on the light emitting element 42), so that the light from the light emitting element 41 passes through the second sealing member 82. Without being absorbed, the light passes through the transparent member 9 and is irradiated from the second irradiation region 12 to the outside of the light emitting device 10.

  In this way, since the irradiation areas 11 and 12 are not shielded, the light emitted from the light emitting elements 41 and 42 mounted in the irradiation areas 11 and 12 or the light whose wavelength has been further converted is applied to the irradiation areas 11 and 12. The light is emitted to the outside of the light emitting device 10 while mixing colors near the boundary. Therefore, the light-emitting device 10 can extract light that is close to the whole irradiation region.

  As described above, in the light emitting device according to the first embodiment, even if the irradiation area is divided into two or more, the light emitting elements can be arranged evenly including the vicinity of the boundary. Since both the emission color of the mounted light emitting element and the presence or absence of the phosphor can be switched in each of the matching irradiation regions, the coloration selectivity is wide and the color rendering can be improved.

[Second Embodiment]
In the light emitting device according to the first embodiment, the irradiation area is partitioned along the arrangement of the matrix light emitting elements, and the light emitting elements having different emission colors are mounted in the respective irradiation areas. It may be divided into any plan view shape without. Hereinafter, the light emitting device according to the second embodiment will be described with reference to FIGS. 5 and 6. The same elements as those of the light emitting device 10 according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 5, the light emitting device 10 </ b> A according to the second embodiment has an annular shape at the center of the upper surface of the rectangular plate-like substrate 1 </ b> A, similarly to the light emitting device 10 according to the first embodiment (see FIG. 1). A frame body 7A is provided, a transparent member 9A is formed inside the frame body 7A, and a sealing member 8 (not shown) is formed below the frame body 7A, and an irradiation region is formed inside the frame body 7A. In this embodiment, since the frame body 7A has an annular shape, the irradiation area is circular. Further, the transparent member 9A is formed in a convex lens shape on the surface, but may be flat, for example. In addition, an anode mark is formed on the upper surface of the substrate 1A instead of the cathode mark, and a temperature measurement point is formed of a metal film. The temperature measurement point is a metal film that measures the temperature on the surface in order to inspect the operating temperature and the junction temperature of the light emitting element 4 mounted on the light emitting device 10A. The pad portions 21c and 22c and the recognition mark of the positive electrode 21A and the negative electrode 22A are the same as those of the light emitting device 10 except for the shape, and thus the description thereof is omitted.

  A portion of the light emitting device 10A covered with the frame 7A, the transparent member 9A, and the sealing member 8 will be described with reference to FIG. In FIG. 6, the long side direction of the substrate 1 </ b> A that is rectangular in plan view is shown in the vertical direction, and the frame body 7 </ b> A and the translucent wall 6 </ b> A are formed inside the frame body 7 </ b> A by representing only the outlines with two-dot chain lines. The transparent member 9A and the sealing member 8 (81, 82) are omitted.

  The light emitting device 10A has a circular mounting region 1a (indicated by a broken line only in the upper left quarter region in FIG. 6) in the inner contour line of the frame 7A on the substrate 1A that is slightly smaller than the contour line. The light emitting elements 4, 4,. Around the mounting area 1a on the substrate 1A, inner lead portions 21a and 22a are formed in a shape along the semicircumference at a predetermined interval from the circular mounting area 1a.

  Furthermore, the light emitting device 10A further includes an annular light transmitting wall (wall body) 6A concentric with the frame body 7A in the irradiation area on the substrate 1A, that is, inside the frame body 7A. It is divided into a circular first irradiation region 11A substantially coincident with the entire center and an annular second irradiation region 12A surrounding the first irradiation region 11A. In the present embodiment, similarly to the first embodiment, the translucent wall 6A constitutes a part of the first irradiation region 11A, and the outer contour line of the translucent wall 6A is the boundary line between the irradiation regions 11A and 12A. Become. Thus, since the translucent wall 6A is formed in a curved shape in plan view, a part of the light emitting elements 4, 4,... Arranged in a matrix as described below is irradiated region 11A, It is placed across the 12A boundary.

  In the light emitting device 10A, light emitting elements 43 and 42, which are two types of light emitting diodes having different emission colors, are mounted as the light emitting element 4 (similarly referred to as the light emitting element 4 collectively as in the first embodiment). The light emitting elements 43 and 42 have the same rectangular shape in plan view, and a pair of pad electrodes are formed on the upper surface as in the light emitting element 42 of the first embodiment (see FIG. 3). The light-emitting elements 4 (light-emitting elements 43 and 42) are arranged in a matrix of 9 × 8 columns in the center of the mounting region 1a with the longitudinal direction aligned in the horizontal direction in FIG. Three rows above and below are shifted by a half pitch in the horizontal direction and arranged in a total of 14 rows, and further, each three at the left and right ends of the array are rotated 90 ° to the right. By arranging in this way, a total of 110 light emitting elements 4 are mounted on the mounting region 1a evenly and efficiently in a symmetrical manner in FIG. Among them, 60 light emitting elements 43 are mounted on the first irradiation region 11A, and 50 light emitting elements 42 are mounted on the second irradiation region 12A, respectively.

  Since the light emitting device 10A according to the present embodiment is equipped with two types of light emitting elements 4 of 60 light emitting elements 43 and 50 light emitting elements 42, the six light emitting elements 43 and 5 are formed by wires W. A total of 11 light emitting elements 42 are connected in series as a set, and 10 sets are connected in parallel. In the light emitting device 10A, the light emitting elements 4 (43, 42) all have a pair of pad electrodes formed on the upper surface, and therefore the light emitting elements directly connected to the inner lead portions 21a, 22a at the ends of the array. For the light emitting elements 4 other than 4, the wire W may be connected to the pad electrode of the adjacent light emitting element 4. Therefore, the height difference between the connection positions of both ends of the wire W is small, and wire bonding is easy even if the intervals between the light emitting elements 4 and 4 are arranged relatively short.

In addition, since all of the light emitting elements 4 (43, 42) mounted on the light emitting device 10A according to the present embodiment have a pair of pad electrodes formed on the upper surface, the metal film (reflective) as in the first embodiment. It is not necessary to bond to the layer 3), and it is not necessary to use a metal film separated for each light emitting element 4. In the light emitting device 10A, the reflective layer 3A has a circular shape that is slightly larger than the mounting region 1a over the entire mounting region 1a of the substrate 1A, and the inner lead portion 21a, It is formed at an interval from 22a. Note that the reflective layer 3A may not be provided when the surface reflectance is sufficiently high, such as when the substrate 1A is made of alumina (Al ₂ O ₃ ), for example.

(Light emitting device design and operation)
Next, an example of the design of the light emitting device according to the second embodiment of the present invention and its operation (light irradiation) will be described. As with the light emitting device 10 according to the first embodiment, the light emitting device 10A according to the present embodiment includes a first irradiation region 11A whose center substantially coincides with the entire irradiation region, and a second irradiation region 12A surrounding the first irradiation region 11A. It is divided and emits light of different colors. Here, in the first irradiation area 11A, the light emitting element 43 is a green LED, and the green light is irradiated without wavelength conversion. On the other hand, in the second irradiation region 12A, the light emitting element 42 is a blue LED, and red-violet (magenta) light is emitted from the red phosphor. Therefore, in the light emitting device 10A, as in the first embodiment, the translucent wall 6A is preferably provided in the first irradiation region 11A that does not require a phosphor. Of course, the same color scheme as that of the light emitting device 10 may be used.

  Unlike the light emitting device 10 according to the first embodiment shown in FIG. 2, in the present embodiment, the irradiation regions 11A, 12A are partitioned without matching the arrangement of the light emitting elements 4 (43, 42). Therefore, on the boundary line between the irradiation regions 11A and 12A, a part of the light emitting element 43 or the light emitting element 42 mounted on one of the irradiation regions 11A and 12A protrudes to the other side. Here, as shown in FIG. 6, about 8 light emitting elements 43 mounted on the first irradiation region 11A, a part of each of the light emitting elements 43 protrudes from the translucent wall 6A, and the second sealing member of the second irradiation region 12A. 82 is buried. The light emitted from the portion embedded in the second sealing member 82 of the light emitting element 43 is converted from green to yellow light by the red phosphor contained in the second sealing member 82. Yellow light is locally irradiated from the vicinity of the boundary between the regions 11A and 12A. However, such light is minute relative to the light irradiated from the entire irradiation region of the light emitting device 10A, and as described with reference to FIG. 4A in the first embodiment, the irradiation is performed. Light emitted from each of the regions 11A and 12A is emitted outside the light emitting device 10A while being mixed in the vicinity of the boundary. Therefore, even with such a configuration, the light emitting device 10A can extract light that is close to being integrated in the entire irradiation region.

  When the light emitting device 10A has the same color scheme as that of the light emitting device 10 according to the first embodiment, the light emitting element 43 is a red LED. Therefore, the portion embedded in the second sealing member 82 is made of yellow phosphor. Absorbed. Moreover, it is good also as a structure which changes the division of irradiation region 11A, 12A, and the light emitting element 42 protrudes to 11A of 1st irradiation regions. That is, since a part of the light emitting element 42 is embedded in the translucent wall 6A, blue light is irradiated to the outside without being wavelength-converted. As described above, the color of light emitted from the light emitting element 43 or the light emitting element 42 protruding to the irradiation regions 12A and 11A depending on the emission color of the light emitting elements 43 and 42 and the type of the phosphor contained in the second sealing member 82. Or the presence or absence of light is different. However, in any case, the influence of the light emitted from the light emitting device 10A on the whole is very small, and in order to further suppress the influence, any of the light emitting elements 43 and 42 is placed on the boundary between the irradiation areas 11A and 12A. The irradiation regions 11A and 12A may be partitioned so that the portions protruding to the irradiation regions 12A and 11A of the light emitting elements 43 and 42 are minimized.

  As described above, the light-emitting device according to the second embodiment is provided for each irradiation region defined by the light-transmitting walls formed in an arbitrary plan view shape regardless of the positions of the light-emitting elements arranged uniformly. Irradiate light with different colors. Therefore, even if the irradiation region is partitioned into a shape made of a curve such as a circle, it is not necessary to arrange the light emitting elements at intervals between adjacent irradiation regions or to reduce the number of mounted elements. The light emitting device has a uniform luminance and a large amount of irradiated light.

[Third Embodiment]
In the light emitting device according to the first and second embodiments, a light emitting element having a different emission color is mounted in each of the divided irradiation areas, and a sealing member containing a phosphor is provided only in one of the adjacent irradiation areas. The wavelength-converted light is irradiated, but the other of the irradiation regions can be irradiated with the light whose wavelength has been converted by the phosphor including the translucent wall. Hereinafter, with respect to the light emitting device having the same appearance as the light emitting device according to the second embodiment shown in FIG. 5, refer to FIG. 7, FIG. 4B, and FIG. I will explain. The same elements as those in the first and second embodiments are denoted by the same reference numerals and description thereof is omitted.

  The light emitting device 10B according to the third embodiment is the light emitting device according to the second embodiment except for the translucent wall 6B, the sections of the irradiation regions 11B and 12B, the configuration of the first sealing member 81A, and the arrangement of the light emitting elements 4. Same as 10A. The light emitting elements 4 mounted on the light emitting device 10B are all the same type, and have the same shape and pad electrode structure as the light emitting elements 43 and 42 mounted on the light emitting device 10A.

  The light emitting elements 4, 4,... Are arranged in a total of 14 rows in a matrix similar to the light emitting device 10A shown in FIG. 6, but are shifted by a half pitch in the horizontal direction with respect to the light emitting device 10 at the center of the mounting region 1a. Ten rows are arranged in six rows, and the two rows in total, the first row from the top and the first row from the bottom, are arranged shifted by a half pitch in the horizontal direction. By arranging in this way, similarly to the second embodiment, a total of 110 light emitting elements 4 are evenly and efficiently symmetrically arranged in the horizontal and vertical directions in FIG. Mounted on. Since the light emitting device 10B is equipped with 110 one type of light emitting elements 4, 11 light emitting elements 4 are connected in series as a set, and 10 sets are connected in parallel. In the present embodiment, the wires W are connected symmetrically in FIG.

  As shown in FIG. 7, the light emitting device 10B further includes an annular light transmitting wall (wall body) 6B concentric with the frame body 7A in the irradiation region on the substrate 1A, that is, inside the frame body 7A. Thus, the center is divided into a circular first irradiation region 11B substantially coincident with the center of the entire irradiation region and an annular second irradiation region 12B surrounding the first irradiation region 11B. In the present embodiment, the translucent wall 6B constitutes a part of the second irradiation region 12B, and therefore the inner contour line of the translucent wall 6B becomes the boundary between the irradiation regions 11B and 12B. Similar to the second embodiment, since the light transmitting wall 6B is formed without matching the arrangement of the light emitting elements 4, the light emitting element 4 is placed across the boundary line between the irradiation regions 11B and 12B.

(Light emitting device design)
Next, an example of the design of the light emitting device according to the third embodiment of the present invention will be described. As in the first and second embodiments, the light emitting device 10B according to the present embodiment is divided into a first irradiation region 11B whose center substantially coincides with the entire irradiation region, and a second irradiation region 12B surrounding the first irradiation region 11B. Designed to irradiate light of different colors to produce white light close to natural light as a whole. In a light emitting device 10B including one type of light emitting element 4, a blue LED is mounted as the light emitting element 4, and light of different colors obtained by wavelength conversion from the irradiation regions 11B and 12B using a red phosphor and a green phosphor, respectively. Shall be irradiated.

  When color is arranged in an annular shape from the center of the irradiation region toward the outer periphery as in this embodiment, it is preferable to irradiate stronger light from the center, and in particular, irradiate light closer to the wavelength 555 nm that is most intensely visible to the human eye. It is preferable to arrange in the center of the region. Therefore, the green phosphor that does not absorb blue light more in the first sealing member 81A in the first irradiation region 11B, the red phosphor in the second sealing member 82 and the translucent wall 6B in the second irradiation region 12B, Each is contained. Further, since the red phosphor absorbs more light than the green phosphor, the amount of light emitted from the second irradiation region 12B tends to be weaker per light emitting element 4. Therefore, the area of the second irradiation region 12B and the number of mounted light emitting elements 4 are increased to balance the amount of light with the first irradiation region 11B. Here, for a total of 110 light emitting elements 4, the first irradiation region 11B includes 36 and a part including 8 parts (about 1/2 and 4 including each about 1/4), It is partitioned to have a total of 42 equivalents. On the other hand, the second irradiation region 12 </ b> B includes the remaining 68 light emitting elements 4.

(Operation of light emitting device)
The operation (light irradiation) of the light emitting device according to the second embodiment designed as described above will be described with reference to FIGS. 4B and 4C, the pad electrode, the wire W, and the reflective layer 3A of the light emitting element 4 are omitted as in FIG. 4A. As described above, the light emitting element 4 is a blue LED, and the phosphor FL ₁ contained in the first sealing member 81A is the green phosphor, the phosphor FL contained in the second sealing member 82 and the light transmitting wall 6B. ₂ is a red phosphor.

As shown in FIG. 4B, the light emitted from the light emitting element 4 embedded in the second sealing member 82 in the second irradiation region 12B is wavelength-converted by the phosphor FL ₂ and further emitted to the side. A part of the light enters the translucent wall 6B from the second sealing member 82 (for example, the light beam L ₂₁ ). Since this light is light whose wavelength has been converted by the phosphor FL ₂ , when the light is transmitted through the light transmitting wall 6B, it is absorbed and attenuated by the same phosphor FL ₂ dispersed in the light transmitting wall 6B. On the other hand, the light (for example, light rays L ₃₁ and L ₃₂ ) emitted from the light emitting element 4 embedded in the light transmitting wall 6B of the second irradiation region 12B is emitted to the side, and the second sealing member 82 and the first irradiation Even when the light enters the first sealing member 81A in the region 11B, the phosphors FL ₂ and FL ₁ are deposited on the bottom, so that the light-emitting device 10B passes through the sealing members 81A and 82 without being absorbed. Irradiate outside.

Similarly, the light emitting element 4 emits light, which is embedded in the first seal member 81A of the first irradiation region 11B is wavelength-converted by the phosphor FL _1, further part of the light emitted laterally, the 2 The light enters the translucent wall 6B of the irradiation region 12B (for example, the light beam L ₁₁ ). Here, since the wavelength-converted light by the phosphor FL ₁ has a wavelength that can excite the phosphor FL ₂ , the light is further wavelength-converted by the phosphor FL ₂ dispersed on the light transmitting wall 6B. The light passes through the wall 6B and is irradiated outside the light emitting device 10B.

  As described above, when the light transmitting wall 6B contains a phosphor, the light that has entered from the light emitting element 4 embedded in the sealing members 81A and 82 is absorbed by the phosphor dispersed in the light transmitting wall 6B. When the wavelength is converted, it is attenuated due to some absorption. Therefore, in order to further improve the light extraction efficiency, the light emitting device 10B preferably has the following configuration.

Between two types of light-transmitting substances having different refractive indexes, when light enters from a higher refractive index to a lower one, part or all of the light corresponding to the incident angle is reflected at the interface. Therefore, in a light emitting device, it is generally preferable to dispose a material having a higher refractive index on the light extraction side (the upper side in FIGS. 3 and 4). In the present embodiment, the light transmitting wall 6B is formed of a material having a low refractive index with respect to the sealing members 81A and 82, so that the sealing members are like the light rays L ₁₂ and L ₂₂ shown in FIG. A part of the light entering the translucent wall 6B from each of 81A and 82 is reflected. Thereby, the light (light rays L ₁₁ and L ₂₁ ) transmitted through the translucent wall 6B is reduced, and attenuation of light by the translucent wall 6B is suppressed. In FIG. 4B, the sealing members 81A and 82 and the transparent member 9A are expressed as the same refractive index. Such a difference in refractive index is provided by selecting a resin material to be applied to each of the sealing members 81A and 82, the translucent wall 6B, and the transparent member 9A.

Further, when the light-transmitting wall 6B has a low refractive index in this way, the light (light ray L ₁₁ ) that is converted by the first sealing member 81A and further wavelength-converted by the light-transmitting wall 6B and extracted is reduced. In order to further reduce the light whose wavelength is converted in two steps, the phosphor FL ₁ is dispersed in the light transmitting wall 6B, that is, the light transmitting wall 6B is included in the first irradiation region 1B. (Not shown). Furthermore, in this case, a light emitting device in which color mixing of light between the irradiation regions 11B and 12B is suppressed is obtained.

Moreover, you may form the translucent wall 6B with a material with a high refractive index with respect to sealing member 81A, 82. In this case, as shown in FIG. 4C, light (light rays L ₃₄ , L ₃₅ ) emitted from the light-emitting element 4 embedded in the light-transmitting wall 6B, or from the first sealing member 81A to the light-transmitting wall 6B. A part of the light (light ray L ₁₃ ) that has entered the light is reflected at the interface with the sealing members 81A and 82. As a result, light other than the light (light ray L ₃₃ ) emitted from above the light transmitting wall 6B to the transparent member 9A is repeatedly reflected in the light transmitting wall 6B, and particularly when the phosphor is contained in the light transmitting wall 6B. Light is absorbed and attenuated. Therefore, the light near the boundary between the irradiation regions 11B and 12B is attenuated to some extent, but the light emitting device in which color mixing is suppressed is obtained. In FIG. 4C, the translucent wall 6B and the transparent member 9A are expressed as the same refractive index.

  As described above, when a difference in refractive index is provided between the sealing members 81A and 82 and the translucent wall 6B, the wall surface (the interface between the translucent wall 6B and the sealing members 81A and 82) is more easily reflected. In addition, the width of the translucent wall 6B may be adjusted to incline the wall surface at a desired angle. For example, the inclination angle (width with respect to the height) of the translucent wall 6B may be controlled by the viscosity of the resin material. it can.

Here, as shown in FIG. 4C, the light emitting element 4 is placed on the boundary line between the first irradiation region 11B and the second irradiation region 12B, that is, the first sealing member 81A and the light transmitting wall. When embedded in 6B, the light emitted from the light emitting element 4 includes light that passes through the first sealing member 81A (light ray L ₃₆ ) and light that passes through the light transmitting wall 6 (light ray L ₃₃ ). The phosphors FL ₁ and FL ₂ contained therein are wavelength-converted to different colors and irradiated to the outside. Therefore, as shown in FIG. 7, even if the translucent wall 6B is formed and divided into the first irradiation region 11B and the second irradiation region 12B regardless of the arrangement of the light emitting elements 4, the irradiation regions 11B and 12B are respectively separated. To a light emitting device 10B that emits light of a desired color.

As in the present embodiment, even if the light transmitting wall 6B contains the phosphor FL _{2 in the same} manner as the second sealing member 82 that constitutes the same second irradiation region 12B, the second sealing member 82 Thus, since the phosphor FL ₂ does not precipitate, it is difficult to obtain a wavelength conversion efficiency equivalent to that of the second sealing member 82. Therefore, although the color of the light irradiated by the translucent wall 6B and the 2nd sealing member 82 may not correspond completely, what is necessary is just to irradiate the light of the same color as the integrated 2nd irradiation area | region 12B. Further, the light transmitting wall 6B and the second sealing member 82 may contain different phosphors, and the light emitting elements 4 having different emission colors may be embedded.

(Modification)
In order to further improve the color rendering properties, as a light emitting device according to a modification of the third embodiment, light (wavelength 555 nm from the first irradiation region 11B of the light emitting device 10B according to the third embodiment shown in FIG. It is designed such that light as close as possible to yellow-green) is irradiated from the second irradiation region 12B with light having a color temperature of 2700 to 4000K (yellowish white) or light close thereto. As described above, it is preferable to irradiate light having a wavelength of 555 nm from the center of the irradiation region. On the other hand, light close to light having a color temperature of 2700 to 4000 K to be expressed in the entire irradiation region from the outermost periphery of the irradiation region. By doing so, light of a relatively uniform color is irradiated even when viewed from a direction not facing the irradiation surface of the light emitting device.

  A blue-green LED is mounted on the first irradiation area 11B and yellow-green light is irradiated by the red phosphor, and a blue LED is mounted on the second irradiation area 12B and white light is irradiated by the yellow phosphor. To do. Since the white light from the blue LED and the yellow phosphor tends to be light with a bluish color temperature exceeding 4000K, the phosphor does not easily precipitate in order to make the wavelength conversion by the yellow phosphor highly efficient. The wall 6B is preferably provided in the first irradiation region 11B rather than the second irradiation region 12B (see FIG. 6). In addition, since the light emitting diode with which the forward drop voltage Vf approximates can be applied to blue-green LED and blue LED, it can electrically connect as the same light emitting element 4. FIG. Moreover, about the eight light emitting elements 4 arrange | positioned on the boundary line of irradiation region 11B, 12B, although blue-green LED and blue LED may be mounted, the red fluorescent substance of 1st irradiation region 11B is contained. It is preferable that the blue-green LED is embedded in the second sealing member 82 containing the yellow phosphor rather than the blue LED embedded in the translucent wall 6B. That is, it is preferable to place the blue-green LED of the first irradiation region 11B on the boundary line between the irradiation regions 11B and 12B. Or you may comprise the translucent wall 6B by straight lines, such as a rounded square, by planar view so that the light emitting element 4 may not straddle the boundary line of irradiation region 11B, 12B (refer FIG. 2). That is, the shape of the entire irradiation region and the central first irradiation region 11B (11) are not necessarily the same.

  As described above, the light emitting device according to the third embodiment and the modification thereof is formed in an arbitrary plan view shape regardless of the positions of the light emitting elements arranged evenly, similarly to the second embodiment. Each of the irradiation areas defined by the light transmitting walls is irradiated with light arranged in different colors. Further, by including phosphors in both adjacent irradiation regions including the light transmitting wall, a light emitting device with further improved color rendering can be obtained. In the first, second, and third embodiments, one annular translucent wall is formed and divided into two, a central first irradiation region and a second irradiation region surrounding it. However, the present invention is not limited to this, and it is possible to divide into three or more irradiation regions by forming two (double rings) or more translucent walls.

[Fourth Embodiment]
The light emitting devices according to the first, second, and third embodiments all irradiate light that is colored by dividing the irradiation region into a central region and a surrounding annular region. Not limited. Hereinafter, the light emitting device having the same appearance as the light emitting devices according to the second and third embodiments shown in FIG. 5 will be described with reference to FIG. 8 and FIG. The same elements as those of the light emitting devices 10, 10A, and 10B are denoted by the same reference numerals, and description thereof is omitted.

  In plan view, the light emitting device 10C according to the fourth embodiment divides the circular irradiation area into four equal parts as shown in FIG. 8, and the upper right and lower left are the first irradiation areas 11C and 11C, and the upper left and lower right. Is divided into second irradiation areas 12C and 12C. Therefore, the translucent wall 6C is included in each first irradiation region 11C and is formed in a key shape along the boundary line between the irradiation regions 11C and 12C. In addition, the two light transmitting walls 6C and 6C are separated from each other at the center (bent portion), and the second irradiation regions 12C and 12C are continuous at the center, but by connecting the light transmitting walls 6C and 6C at the center. It may be completely separated (not shown). When the two second irradiation regions 12C and 12C are completely separated by the translucent walls 6C and 6C, different phosphors can be contained in the respective second sealing members 82 to irradiate light of different colors. it can.

  In this embodiment, the light-emitting elements 4, 4,... Are arranged in the same manner as the light-emitting device 10B shown in FIG. Without shifting the pitch, they are arranged in a complete matrix, so that one more each is arranged on either side of the irradiation regions 11C, 12C (on the first irradiation region 11C side in FIG. 8). By arranging in this way, the light emitting element 4 does not straddle the boundary line between the irradiation regions 11C and 12C as in the first embodiment (see FIG. 2). The light emitting elements 4 mounted on the light emitting device 10C according to the present embodiment are all of the same type (same forward voltage drop Vf) as the light emitting device 10B, but the light emitting device 10A according to the second embodiment (FIG. 6), the type of the light emitting element can be switched. In this case, as in the second embodiment, the number of the light emitting elements in the set connected in series is equalized for each type, and the wires W are connected. Furthermore, since the light transmitting walls 6C and 6C are formed so that the entire light emitting element 4 is buried, in the first irradiation region 11C, for example, the light emitting element 4 and the fluorescent light covered with the transparent light transmitting wall 6C are fluorescent. As a type different from the light emitting element 4 covered with the first sealing member 81 </ b> A containing the body, the same color light may be irradiated as a whole.

  A light emitting device 10D according to a modification of the fourth embodiment shown in FIG. 9 has a circular irradiation area divided into four crosses in a plan view, as in the light emitting device 10C, but the translucent wall 6D has a cross shape. The first irradiation region 11D is divided into an upper right and a lower left by the translucent wall 6D, and a second irradiation region 12D having a larger area than the first irradiation region 11D including the translucent wall 6D.

  In this modification, the light emitting elements 4, 4,... Are arranged in the same manner as the light emitting device 10A shown in FIG. The light emitting elements 4 in the second row from the top and the second row from the bottom are arranged one more in the first irradiation area 11D, except for three each rotated 90 ° at the left and right ends of the array. Are arranged in a matrix. By arranging in this way, 110 light emitting elements 4 (43, 42) are arranged similarly to the light emitting device 10A, and the light emitting elements 4 do not straddle the boundary lines of the irradiation regions 11D, 12D. The entire light emitting element 4 (42) is embedded in the light transmitting wall 6D. Furthermore, in this modification, 40 light emitting elements 43 are arranged in the first irradiation area 11D, and 70 light emitting elements 42 are arranged in the second irradiation area 12D, and the four light emitting elements 43 and the seven light emitting elements 43 are arranged. A total of 11 light emitting elements 42 are connected in series as a set, and 10 sets are connected in parallel. Therefore, in the present modification, the second irradiation region 12D has a larger area than the first irradiation region 11D and the number of mounted light emitting elements 42 is larger, so that the amount of light per one of the light emitting elements 43 and 42 is less than the first irradiation region 11D. It is preferable that the irradiation region 11D is applied when there are more irradiation regions 11D than the second irradiation region 12D. Furthermore, since two types of light emitting elements 43 and 42 having different electrical characteristics (forward voltage drop Vf) can be mounted, the coloration selectivity is wide as in the first and second embodiments.

  As described above, the light emitting device according to the fourth embodiment and the modification thereof emits light arranged in different colors for each irradiation region divided into four crosses by a translucent wall constituted by straight lines. Irradiate. Therefore, the irradiation region can be partitioned into various shapes depending on the shape of the light transmitting wall. In the fourth embodiment and the modification thereof, it is assumed that light of two colors is emitted from the four irradiation areas. However, the present invention is not limited to this, and the irradiation area is further divided into three or more colors. Irradiation with colored light can be performed. Moreover, it can also be combined with the annular translucent wall of the light emitting device according to the second and third embodiments. Moreover, it can also be applied to a light emitting device having a rectangular irradiation area as in the first embodiment.

  As mentioned above, although the form for implementing this invention was demonstrated about the light-emitting device based on this invention, this invention is not limited to the said embodiment, What was variously changed and modified | changed based on these description Needless to say, this is also included in the spirit of the present invention.

10, 10A, 10B, 10C, 10D Light emitting device 1, 1A Substrate 1a Mounting area 11, 11A, 11B, 11C, 11D First irradiation area (irradiation area)
12, 12A, 12B, 12C, 12D Second irradiation area (irradiation area)
21, 21A Positive electrode 21a Inner lead part (lead electrode)
21b Wiring part 21c Pad part 22, 22A Negative electrode 22a Inner lead part (lead electrode)
22b Wiring part 22c Pad part 3, 3A Reflective layer 4 Light emitting element 41, 42, 43 Light emitting element 5 Protection element 6, 6A, 6B, 6C, 6D Translucent wall (wall body)
7, 7A Frame 8 Sealing member 81, 81A First sealing member (sealing member)
82 Second sealing member (sealing member)
9, 9A Transparent member (translucent member)
FL, FL ₁ , FL ₂ phosphor

Claims (10)

A substrate, a plurality of light emitting elements arranged in a mounting region on the substrate, a pair of lead electrodes formed on the substrate, a frame formed around the mounting region on the substrate, and comprising a light transmitting sealing member for sealing the plurality of light emitting elements, and the light-emitting device that is electrically connected the plurality of light emitting elements to the pair of lead electrodes,
The mounting area is divided into two or more irradiation areas by a wall,
The sealing member is filled in the wall body or inside surrounded by the wall body and the frame body, and is provided separately for each irradiation region,
Only one of the sealing members in the two adjacent irradiation regions contains a phosphor, or contains phosphors different from each other,
The light emitting device, wherein the wall body covers at least a part of the light emitting element in an irradiation region provided with the wall body and is made of a light transmissive material.   The light emitting device according to claim 1, wherein the wall body includes a phosphor corresponding to a color of light irradiated from an irradiation region in which the wall body is provided.   The light emitting device according to claim 1, wherein the wall body is made of a material having a refractive index different from that of at least one of adjacent sealing members.   The light emitting device according to any one of claims 1 to 3, wherein two or more types of the light emitting elements that emit light of different colors are arranged.   The light emitting device according to any one of claims 1 to 4, wherein the light emitting element is not placed on a boundary between two adjacent irradiation regions.   The light emitting device according to any one of claims 1 to 5, wherein the frame body has an inner wall surface as a reflection surface so as to irradiate light emitted from the plurality of light emitting elements upward. .   2. The light emitting device according to claim 1, further comprising a translucent member that fills the inside of the frame body and is formed on the wall body and the sealing member and transmits light emitted from the light emitting element. Item 7. The light emitting device according to any one of Items 6. One of the irradiation regions has a center in plan view substantially coincident with a center in plan view of the mounting region,
The light emitting device according to any one of claims 1 to 7, wherein another adjacent irradiation region is partitioned so as to surround the one irradiation region.   9. The light emitting device according to claim 8, wherein the light irradiated from the outermost irradiation region in plan view has a color temperature closest to a range of 2700 to 4000K.   10. The light emitting device according to claim 8, wherein the two or more irradiation regions irradiate light having a longer wavelength in the irradiation region closer to the periphery in a plan view of the mounting region.

Images