JP5799206B2 - Mounting component inspection apparatus, component mounting system, and component mounting method - Google Patents

Description

  The present invention relates to a mounting component inspection apparatus, a component mounting system, and a component mounting method for inspecting a component mounted board mounted by a component mounting apparatus for mounting components on a substrate.

  The component mounting apparatus mounts components at a plurality of component mounting positions provided on the upper surface of the substrate by lowering a suction nozzle that sucks and holds components such as electronic components with respect to the substrate. Here, the lowering distance of the suction nozzle with respect to the substrate is set in advance based on the distance between the component adsorbed by the suction nozzle and the electrode surface, and the component is pushed more than necessary by the lowering operation of the suction nozzle. Parts are prevented from being damaged.

  On the other hand, with the progress of downsizing and higher functionality of electronic devices in recent years, the thickness of substrates has been reduced. Such thin substrates are likely to be warped and deformed. For this reason, when the lowering distance of the suction nozzle is set on the premise of a flat substrate that does not warp and deform, the component is pressed more than necessary against the substrate during the lowering operation of the suction nozzle and the component is damaged. In some cases, the component is not attracted by the suction nozzle before the component comes into contact with the substrate, and the component is displaced with respect to the electrode.

  For this reason, conventionally, before executing the component mounting operation, the height of a plurality of measurement points on the board set arbitrarily is measured to detect the warp deformation state of the board, and the warp deformation state of the detected board is detected. A method of correcting the descending distance of the suction nozzle according to the above has been proposed (see, for example, Patent Document 1). Thereby, even if it is a case where curvature deformation | transformation has arisen in the board | substrate, components can be mounted with sufficient precision with respect to a component mounting position. Thereafter, the mounting board on which the component is mounted is inspected by the inspection device for the quality of mounting at each component mounting position on the board, and the inspection result is displayed by a display means such as a monitor.

JP 2000-299597 A

  If the detection accuracy of the warp deformation state of the board is insufficient, even if the lowering distance of the suction nozzle is set based on the detected warp deformation state, mounting defects such as component breakage and mounting position deviation occur. There was a case. Further, if the component mounting operation is continued while the detection accuracy of the warped deformation state of the substrate is insufficient, there may be a case where a mounting failure inspection result is continuously displayed at a certain component mounting position. However, if the worker who handles the component mounting device is an inexperienced person, he / she can not realize that the accuracy of detection of the warp deformation state of the board is insufficient as a cause of such mounting failure, and quick mounting I couldn't take measures against the defect.

  Accordingly, the present invention provides a mounting component inspection apparatus, a component mounting system, and a component that can be quickly taken by a worker with little experience when a mounting failure is continuously detected at a certain component mounting position on a substrate. The purpose is to provide an implementation method.

  The mounted component inspection apparatus according to the first aspect of the present invention detects the warped deformation state of the substrate by measuring the height of a plurality of measurement points on the substrate, and the component mounting height according to the warped deformation state of the substrate. A mounting component inspection apparatus that inspects a mounting state for a component mounted board that is unloaded from a component mounting apparatus that mounts components at a plurality of component mounting positions set on the board by correcting An imaging unit that images a component mounting position on a substrate after mounting, a determination unit that determines whether the mounting state is good or not based on an imaging result of the imaging unit, and outputs a determination result, and the determination result for a plurality of substrates Storage means for accumulating and storing each mounting position, component mounting position map display means for visually displaying the component mounting position on the board as a component mounting position map, and the component mounting position map A determination result accumulation display means for displaying a determination result accumulated and stored for each component mounting position on the component, and whether or not the ratio or number of times that the determination means determines that the mounting is defective satisfies a predetermined condition. Check the setting status of measurement points in the vicinity of the component mounting position for each component mounting position that is determined to be determined each time, and for the component mounting position at which the ratio or number of times determined as defective mounting by the determining means satisfies a predetermined condition An informing means for informing the user to do so.

  In the component mounting system according to the second aspect of the present invention, the warp deformation state of the substrate is detected by measuring the heights of a plurality of measurement points on the substrate, and the component mounting height is determined according to the warp deformation state of the substrate. A component mounting system including a component mounting apparatus that corrects and mounts components at a plurality of component mounting positions set on a board, and the mounting component inspection apparatus according to claim 1, wherein the component mounting apparatus includes: Measurement point setting means for newly adding and setting a measurement point in the vicinity of the component mounting position notified by the mounting component inspection apparatus is provided.

  According to a third aspect of the present invention, the component mounting method of the present invention detects the warp deformation state of the substrate by measuring the height of a plurality of measurement points on the substrate, and determines the component mounting height according to the warp deformation state of the substrate. A component mounting method for performing component mounting at a plurality of component mounting positions corrected and set on a board, based on an imaging process for imaging a component mounting position on a board after component mounting, and an imaging result in the imaging process A determination process for determining whether the mounting state is good and outputting a determination result, a storage process for accumulating and storing the determination results for each component mounting position for a plurality of boards, and a component mounting position on the board as a component mounting position map A component mounting position map display step of displaying an image on the component mounting position, a determination result cumulative display step of displaying a determination result accumulated and stored for each component mounting position on the component mounting position map, A determination step for determining, for each component mounting position, whether or not a ratio or number of times determined to be mounting failure in a predetermined step satisfies a predetermined condition; and a ratio or number of times determined as mounting failure in the determination step is a predetermined condition For the component mounting position determined to satisfy the above, a notification step for notifying that the setting state of the measurement point in the vicinity of the component mounting position is confirmed, and a new measurement point in the vicinity of the notified component mounting position are provided. It includes a height measurement setting process that is additionally set.

  According to the present invention, when there is a component mounting position in which the ratio or the number of times determined as mounting failure satisfies a predetermined condition, a notification that the setting status of measurement points in the vicinity of the component mounting position is confirmed is notified. Therefore, even workers with little experience in the parts mounting field may notice that the detection accuracy of the warped deformation state of the board was insufficient because the measurement point setting status was not good as the cause of mounting failure. In addition, it is possible to take quick countermeasures against mounting defects, such as adding a new measurement point in the vicinity of the component mounting position. As a result, it is possible to improve the productivity of the mounting substrate by suppressing the generation of the mounting defective substrate.

The top view of the component mounting line of one embodiment of this invention The top view of the component mounting apparatus of one embodiment of this invention Sectional drawing of the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of the one mounting form of this invention (A) The figure which shows the state which measures the measurement point set on the board | substrate in the component mounting apparatus of one embodiment of this invention (b) The measurement point on a board | substrate in the component mounting apparatus of one embodiment of this invention The figure which shows the state which displayed the picture where is set on the touch panel (A), (b) The figure which shows the state which mounts an electronic component on a board | substrate with the component mounting apparatus of one embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS (a) Top view (b) Side view of mounting component inspection apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the mounted component inspection apparatus of one embodiment of this invention The figure which shows the image displayed on the touchscreen of the mounting component inspection apparatus of one embodiment of this invention (A) The figure which shows the position of the measurement point set with the component mounting apparatus of one embodiment of this invention, and the component mounting position where the mounting defect was detected with the mounting component inspection apparatus (b) One implementation of this invention The figure which shows the state which added and set the measurement point newly in the component mounting apparatus of the form of The flowchart of the mounting component inspection method of one embodiment of this invention The flowchart of the mounting component inspection method of one embodiment of this invention

  First, a component mounting system including a component mounting inspection apparatus according to the present invention will be described with reference to FIG. A component mounting line 1 forming this component mounting system includes a component mounted substrate 5 (hereinafter referred to as a component mounted substrate 5) in which an electronic component 4 as a component is mounted on each of electrodes 3 as a plurality of component mounting positions set on the substrate 2. Each device for manufacturing and inspecting (referred to as a “mounting substrate”) is connected.

  As shown in FIG. 1, the component mounting line 1 includes a printing device M1, a printing state inspection device M2, a plurality of component mounting devices M3 to M5, and a mounting component inspection device M6 from the upstream side (left side in FIG. 1). , And connected in the X direction, which is the substrate transport direction. The printing apparatus M1 has a function of printing cream solder as a bonding material on the plurality of electrodes 3 set on the substrate 2. The printing state inspection apparatus M2 has a function of inspecting the printing state of the substrate 2 on which the cream solder is printed on the electrode 3. The component mounting apparatuses M3 to M5 have a function of mounting the electronic component 4 on the substrate 2 on which cream solder is printed. The mounting component inspection apparatus M6 has a function of inspecting the mounting state of the electronic component 4 for the mounting substrate 5 on which the electronic component 4 is mounted. Each of these devices is connected to a management computer 7 via a communication network 6, and the management computer 7 controls the mounting / inspection work by each device on the component mounting line 1 in an integrated manner.

  As shown in FIG. 1, the printing state inspection device M2, the component mounting devices M3 to M5, and the mounting component inspection device M6 according to the present embodiment each have a pair of transport conveyors described later on the front side and the rear side of each device, respectively. A first conveyor line L1 formed by connecting one conveyor on the front side (lower side in FIG. 1) of each apparatus, and another conveyor on the rear side (upper side in FIG. 1) of each apparatus. Predetermined operations in the respective apparatuses can be performed simultaneously on the second transport line L2 formed by being connected. By adopting such a configuration, the productivity of the mounting substrate can be improved.

  Next, the printing apparatus M1 will be described with reference to FIG. A first printing mechanism 11A and a second printing mechanism 11B that are individually controlled and can perform printing operations individually on the upper surface of the base 10 are arranged in the Y direction orthogonal to the X direction that is the transport direction of the substrate 2. They are arranged side by side. Each of the printing mechanisms 11A and 11B mainly includes a mask plate 12 and a squeegee head (not shown) provided with two squeegee members disposed above and opposed to the mask plate 12. Cream solder (not shown) is supplied onto the mask plate 12 by a cream solder supply device (not shown). A pair of substrate transport conveyors 13 for transporting the substrate 2 in the X direction are provided on the upper surface of the base 10 and below the printing mechanisms 11A and 11B so as to be movable in the X and Y directions. .

  The substrate 2 carried in by the pair of substrate transport conveyors 14 provided on the upstream side of the printing apparatus M1 is transferred to the substrate transport conveyor 13 and then transported to a predetermined printing position. The substrate 2 transported to a predetermined printing position is held by the upper surface of the substrate holding unit when the substrate holding unit (not shown) rises from below the substrate 2, and the substrate holding unit further rises. As a result, the upper surface of the substrate 2 comes into contact with the lower surface of the mask plate 12, and the squeegee member slides in the Y direction on the mask plate 12 to which the cream solder is supplied. Cream solder is transferred (printed) to each electrode 3 on the substrate 2 via (not shown). When the cream solder is transferred to each electrode 3, the substrate holder is lowered with respect to the mask plate 12, whereby the substrate 2 is released from the mask plate 12. The substrate 2 on which cream solder is printed on each electrode 3 is transferred to a pair of substrate transport conveyors 15 provided on the downstream side of the printing apparatus M1, and is transported to the downstream printing state inspection apparatus M2.

  Next, the printing state inspection apparatus M2 will be described with reference to FIG. The printing state inspection apparatus M2 includes a Y-axis movement table 21 extending in the Y-axis direction on the base 20, two X-axis movement tables 22 movable in the Y direction with respect to the Y-axis movement table 21, and an X-axis movement. A print state having a head moving mechanism composed of two plates 23 movable in the X-axis direction with respect to the table 22, and each plate 23 of the head moving mechanism having an inspection camera with the imaging field of view facing downward Each inspection head 24 is provided. Further, in the center of the upper surface of the base 20, the substrate 2 that is part of the first transport line L1 and the second transport line L2 and is delivered from the printing apparatus M1 is transported in the substrate transport direction (X direction). A pair of board | substrate conveyance conveyors 25 are each provided before and after the printing state inspection apparatus M2.

  The printing state inspection apparatus M2 conveys and positions the substrate 2 delivered from the upstream printing apparatus M1 by the substrate conveyance conveyor 25, moves the inspection camera by the head moving mechanism, and moves the electrodes 3 on the substrate 2 to each other. Take an image from above. Then, image recognition is performed based on the captured image of each electrode 3, and a print state inspection is performed to determine whether or not the cream solder is normally printed on each electrode 3.

  Next, the configuration of the component mounting apparatuses M3 to M5 will be described with reference to FIGS. Since the component mounting apparatuses M3 to M5 have the same structure, the component mounting apparatus M3 will be described as a representative. 2 and 3, in the center of the upper surface of the base 30, a pair of board transfer conveyors 31 constituting the first transfer line L1 and the second transfer line L2 and extending in the X direction are on the front side of the component mounting apparatus M3.・ Each is provided on the rear side. A pair of board | substrate conveyance conveyors 31 are supported on the base 30 by the pair of conveyor support member 32 provided facing the Y-axis direction. At the upper end of each conveyor support member 32, a pair of substrate end pressing members 32 a are provided so as to project over the substrate transfer conveyor 31.

  As shown in FIG. 3, in a state where the substrate 2 is held on a pair of substrate transfer conveyors 31, a substrate support mechanism 33 is disposed below the substrate 2. The substrate support mechanism 33 has a configuration in which a plurality of receiving pins 36 are erected in a vertical posture on a receiving base 35 that is moved up and down by a lifting drive unit 34. The lower receiving pin 36 is detachable from the lower receiving base 35.

  In FIG. 3, when the elevating drive unit 34 is driven and the lower receiving base 35 is raised from below with respect to the substrate 2 (arrow a), the lower surface 2 a of the substrate 2 comes into contact with the upper ends of the plurality of receiving pins 36. When the lower receiving base 35 is further raised, the substrate 2 stops at a position where the upper surface thereof is in contact with the lower surface of the substrate end pressing member 32a. Thereby, the board | substrate 2 is hold | maintained in the mounting work height position.

  In FIG. 2, a plurality of tape feeders 37 as component supply units are mounted on both sides of the component mounting apparatus M3. The tape feeder 37 has a function of supplying the electronic component 4 to the component extraction position 37a by pitch-feeding a carrier tape (not shown) holding the electronic component 4.

  2 and 3, a Y-axis movement table 38 extending in the Y-axis direction, two X-axis movement tables 39 movable in the Y direction with respect to the Y-axis movement table 38, and X A head moving mechanism 41 including two plates 40 that are movable in the X-axis direction with respect to the axis moving table 39 is disposed, and a mounting head 42 is mounted on each of the two plates 40. The mounting head 42 is a multiple-type head including a plurality of holding heads, and suction nozzles 42a capable of sucking and holding the electronic component 4 and individually moving up and down are attached to lower end portions of the respective holding heads.

  In addition, the mounting head 42 is positioned on the lower surface side of the X-axis moving table 39 and moves integrally to image the substrate from above, and a displacement in the measurement axis direction (Z-axis direction) such as a laser displacement meter. A height sensor 45, which is a measuring instrument that can detect non-contact, is mounted. Furthermore, a component recognition camera 44 that captures an image of the electronic component 4 sucked and held by the suction nozzle 42 a is provided between the tape feeder 37 and the substrate transport conveyor 31.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 46 provided in the component mounting apparatus M3 includes a mechanism control unit 47, an arithmetic processing unit 48, a measurement point setting unit 49, and a storage unit 50, and a head moving mechanism 41, a mounting head 42, and a tape feeder 37. , The substrate transfer conveyor 31, the substrate support mechanism 33, the height sensor 45, the communication unit 51, the touch panel 52, and the mouse pointer 53.

  The control unit 46 controls the operations of the head moving mechanism 41, the mounting head 42, the tape feeder 37, and the board support mechanism 33 through the mechanism control unit 47, thereby performing the positioning of the board 2 and the component mounting work on the board 2. Is done. Further, as shown in FIG. 5A, the control unit 46 moves any height sensor 45 on the substrate 2 while moving the height sensor 45 in the horizontal direction by the head moving mechanism 41 with respect to the substrate 2 via the mechanism control unit 47. Height H (displacement in the Z-axis direction of the substrate 2 with reference to the case where the substrate 2 is not warped) is measured by the height sensor 45 (arrow b).

  The measurement result is sent to the arithmetic processing unit 48, and the three-dimensional shape of the upper surface of the substrate 2, that is, the substrate 2 is processed by calculating the height of the measurement point M based on the measurement result sent by the arithmetic processing unit 48. A warp deformation state is detected. As described above, in the present embodiment, the mechanism control unit 47, the head moving mechanism 41, and the height sensor 45 serve as a height measuring unit that measures the height H of a plurality of measurement points M set on the substrate 2. ing. The arithmetic processing unit 48 serves as a detection unit that detects a warp deformation state of the substrate 2 based on a measurement result obtained by the height measurement unit.

  And the control part 46 correct | amends the component mounting height at the time of component mounting operation | movement according to the detection result of the curvature deformation state of the board | substrate 2. FIG. Here, the component mounting height is the distance between the lower surface of the electronic component 4 sucked and held by the suction nozzle 42a and the upper surface of the substrate 2 before the suction nozzle 42a is lowered, in other words, the lowering of the suction nozzle 42a with respect to the substrate 2. This is the distance (component mounting height L shown in FIG. 6).

  As shown in FIG. 5B, the control unit 46 displays the image of the substrate 2 on the touch panel 52, and the operator can set the measurement point M on the image of the substrate 2 displayed by the control unit 46. it can. The measurement point M is set by clicking a desired position on the image with the mouse pointer 53, for example. When the measurement point M on the substrate 2 is set by the operator, the measurement point setting unit 49 calculates and stores the coordinates of the measurement point M from the set position. Such a measuring point setting method is known. The storage unit 50 stores a mounting program and production information necessary for executing a board transfer operation and a component mounting operation.

  The communication unit 51 exchanges control signals and data with other devices via the communication network 6 shown in FIG. The touch panel 52 is used for operation input and production data for operating the apparatus including the setting of the measurement point M described above, and displays output information from the control unit 46.

  Next, the operation in the component mounting apparatus M3 will be described. When the control unit 46 detects that the board 2 has been sent from the upstream apparatus, it operates the board transfer conveyor 31 to receive and transfer the board 2, and positions the board 2 at a predetermined component mounting position. Next, the control unit 46 drives the elevating drive unit 34 to raise the lower receiving base 35 to which the lower receiving pin 36 is attached from below, so that the upper end of the lower receiving pin 36 is placed on the lower surface of the substrate 2. Abut. When the lower receiving base 35 further rises in this state, the substrate 2 stops at a position where the upper surface abuts on the lower surface of the substrate end pressing member 32a while the lower surface is supported by the lower receiving pins 36.

  If the upper surface of the substrate 2 stops at a position where it contacts the lower surface of the substrate end pressing member 32a, the control unit 46 drives the head moving mechanism 41 to move the substrate recognition camera 43 above the substrate 2. The board | substrate 2 is imaged and the position shift of the board | substrate 2 is detected. After detecting the displacement of the substrate 2, the control unit 46 moves the height sensor 45 in the horizontal direction with respect to the substrate 2, and determines the heights of the plurality of measurement points M set on the substrate 2 as height sensors. Measure by 45. The measurement result is sent to the calculation processing unit 48, and the calculation processing unit 48 calculates the height of the measurement point M, thereby detecting the warped deformation state of the substrate 2.

  Next, the control unit 46 moves the mounting head 42 onto the component extraction position 37a of the tape feeder 37, and lowers the suction nozzle 42a on the component extraction position 37a, thereby holding the electronic component 4 on the suction nozzle 42a. After sucking and holding the electronic component 4, the control unit 46 moves the mounting head 42 holding the electronic component 4 above the component recognition camera 44, and moves the electronic component 4 sucked and held by the suction nozzle 42 a by the component recognition camera 44. An image is captured and recognized, and a positional shift of the electronic component 4 with respect to the suction nozzle 42a is detected.

  After detecting the displacement, the control unit 46 moves the mounting head 42 above the substrate 2 to align it, and lowers the suction nozzle 42a relative to the substrate 2 (arrow c shown in FIGS. 6A and 6B). As a result, the electronic component 4 is mounted on the substrate 2. At this time, the control unit 46 corrects the component mounting height L according to the detection result of the warped deformation state of the substrate 2, and also recognizes the recognition result of the electronic component 4 by the component recognition camera 44 and the substrate 2 by the substrate recognition camera 43. The mounting operation of the electronic component 4 is performed after correcting the mounting position in consideration of the recognition result.

  The correction of the component mounting height L will be specifically described with reference to FIGS. 6 (a) and 6 (b). As shown in FIG. 6A, when the warped deformation state of the substrate 2 is convex upward, the detected component of the substrate 2 is detected from the component mounting height L0 of the suction nozzle 42a with respect to the substrate 2 that is assumed not to be warped. The height obtained by subtracting the height of the mounting point Δh1 obtained from the warped shape is the component mounting height L after correction. Further, as shown in FIG. 6B, when the warped deformation state of the substrate 2 is convex downward, the detected substrate 2 is set to the component mounting height L0 of the suction nozzle 42a with respect to the substrate 2 assuming that there is no warp deformation. The height obtained by adding the height of the mounting point Δh2 obtained from the warped shape is the component mounting height L after correction. The mounting substrate 5 that has been mounted by the component mounting apparatus M5 disposed at the most downstream of the component mounting apparatuses M3 to M5 is transported to the downstream mounting component inspection apparatus M6.

  In the above configuration, the component mounting apparatuses M3 to M5 in the present embodiment detect the warped deformation state of the substrate by measuring the height of a plurality of measurement points on the substrate, and the components according to the warped deformation state of the substrate. It has a function of mounting a component at a plurality of component mounting positions set on the substrate by correcting the mounting height.

  Next, the mounting component inspection apparatus M6 will be described with reference to FIGS. 7 and 8, the mounting component inspection apparatus M6 includes a base 60, a transport of the mounting substrate 5 on which the electronic component 4 is mounted, and a pair of substrate transports that position the mounting substrate 5 at the inspection position. A conveyor 61, a head moving mechanism 62 provided on the base 60, and a mounting state inspection head 63 moved by the head moving mechanism 62 are provided. The base 60 is provided with a touch panel 64 as an input / output device.

  The pair of board transfer conveyors 61 are provided on the front side and the rear side of the mounting component inspection apparatus M6 in a state extending in the X direction, and each board transfer conveyor 61 has a first transfer line L1 and a second transfer line L2, respectively. Part of it. The head moving mechanism 62 includes a Y-axis moving table 65 extending on the base 60 in the Y-axis direction, two X-axis moving tables 66 that are movable in the Y direction with respect to the Y-axis moving table 65, and an X-axis moving table. It consists of two plates 67 that are movable in the X-axis direction with respect to 66. The mounting state inspection head 63 is attached to each plate 67 and includes an inspection camera 63a with the imaging field of view facing downward. For this reason, the mounting state inspection head 63 moves the X-axis movement table 66 in the Y direction relative to the Y-axis movement table 65 constituting the head movement mechanism 62 and moves the plate 67 in the X direction relative to the X-axis movement table 66. It can be moved in the horizontal plane by combining with movement.

  The operation of transporting the mounting substrate 5 by the substrate transporting conveyor 61 is performed by the mechanism control unit 69 included in the control unit 68 included in the mounting component inspection apparatus M6 performing operation control of a substrate transporting conveyor driving unit including an actuator (not shown). Similarly, the movement operation of the mounting state inspection head 63 is performed by the mechanism control unit 69 controlling the operation of the head movement mechanism 62 described above.

  Next, the configuration of the control system of the mounted component inspection apparatus M6 will be described with reference to FIG. The control unit 68 includes a mechanism control unit 69, an inspection processing unit 70, and a storage unit 71. The inspection processing unit 70 includes an image processing unit 70a, a pass / fail inspection unit 70b, a count unit 70c, a statistical processing unit 70d, a determination unit 70e, and a display processing unit 70f. The storage unit 71 includes a program storage unit 72, an inspection data storage unit 73, an inspected mounting board target number storage unit 74, a mounting failure cumulative data storage unit 75, and a mounting failure determination ratio threshold value storage unit 76. .

  The above-described touch panel 64 is connected to the control unit 68, an input signal from the touch panel 64 is input to the control unit 68, and output information from the control unit 68 is displayed on the touch panel 64. That is, the output operation of the touch panel 64 is controlled by the control unit 68.

  Next, the storage unit 71 will be described. The program storage unit 72 stores a processing program for an inspection operation by the head moving mechanism 62 and the mounting state inspection head 63. The inspection data storage unit 73 stores component mounting position data 73a, mounting component data 73b, and inspection threshold data 73c. The component mounting position data 73a is data indicating the coordinate position on the board 2 of the component mounting position where the electronic component 4 is mounted on the board 2. The mounted component data 73b is data indicating the type of the electronic component 4 mounted at each component mounting position. The inspection threshold data 73c is data that defines an allowable positional deviation amount with respect to the normal position of the electronic component 4. The inspected mounting board target number storage unit 74 stores the target number of inspected mounting boards 5 necessary for the calculation of a mounting defect determination ratio described later. The mounting failure accumulation data storage unit 75 stores mounting failure accumulation data at each component mounting position subjected to statistical processing by the statistical processing unit 70d. The mounting failure determination ratio threshold value storage unit 76 stores a threshold value as to whether or not to display an estimated failure factor in a mounting failure detail image 83 to be described later.

  Next, the mechanism control unit 69 will be described. The mechanism control unit 69 executes inspection processing of a substrate transport conveyor 61, a head moving mechanism 62, a mounting state inspection head 63 including an inspection camera 63a, and a CCU (camera control unit) 77 that performs imaging control of the mounting state inspection head 63. The mechanism 78 to be provided is controlled.

  Next, the inspection processing unit 70 will be described. The image processing unit 70a receives the image data of the mounting board 5 imaged by the mounting state inspection head 63 via the CCU 77, and performs predetermined image processing such as detection of positional deviation of the electronic component 4 with respect to a predetermined component mounting position. The pass / fail inspection unit 70b compares the image processing result processed by the image processing unit 70a with each data stored in the inspection data storage unit 73 to determine whether or not the electronic component 4 is normally mounted on the electrode 3. The quality of the component mounting state is determined, and the determination result is output to the statistical processing unit 70d. Specifically, if the amount of deviation of the electronic component 4 from the predetermined component mounting position exceeds the threshold value stored in the inspection threshold value data 73c, it is determined that the mounting is defective. That is, the image processing unit 70a and the quality inspection unit 70b are determination units that determine the quality of the mounting state based on the imaging result of the imaging unit and output the determination result.

  When the determination result is output by this determination means, not only the mounting failure is determined but also the type of mounting failure is output together. Specifically, the determination means determines “component position deviation NG” when the mounting position of the electronic component 4 deviates from the normal position, and “parts” when the electronic component 4 is not mounted at the component mounting position. If the electronic component 4 is mounted upside down, it is determined as “reversed NG”, and if the electronic component 4 is mounted in the wrong mounting direction, “polarity NG” is determined. If foreign matter is mixed in the component mounting position, it is judged as “foreign matter NG”.

  The counting unit 70c counts the number of inspected mounting boards 5 that have been determined by the determination unit to determine whether the mounting state is good, and the number of inspected mounting boards 5 is stored in the inspected mounting board target number storage unit 74. When it is determined that the value has reached, a command is issued to the statistical processing unit 70d so as to calculate a mounting failure determination ratio described later.

  The statistical processing unit 70d accumulates and aggregates the determination results for each mounting board 5 by the determination unit, and performs predetermined statistical processing. Specifically, the number of times that mounting failure is determined for each component mounting position is counted, and the proportion of types of mounting failures at each component mounting position on the mounting substrate 5 is calculated. Further, the statistical processing unit 70d receives a command from the counting unit 70c, outputs the statistical processing result to the mounting failure accumulated data storage unit 75, calculates the proportion determined to be mounting failure at each component mounting position, and calculates the result. Is output to the mounting failure accumulation data storage unit 75. The mounting failure determination ratio is calculated by dividing the number of mounted substrates 5 that have been inspected from the number of mounting failures determined at each component mounting position. That is, the statistical processing unit 70d serves as a mounting failure determination ratio calculation unit that calculates the ratio determined as mounting failure by the determination unit for each component mounting position.

  The determination unit 70e determines whether or not the mounting failure determination rate at each component mounting position calculated by the statistical processing unit 70d exceeds the threshold value stored in the mounting failure determination rate threshold storage unit 76. to decide. When it is determined that the mounting defect determination ratio exceeds the threshold value, the display processing unit 70f is instructed to perform a display process of an estimated defect factor described later on the component mounting position determined to exceed the threshold value. Put out. That is, the determination unit 70e is a determination unit that determines, for each component mounting position, whether or not the ratio determined as a mounting failure by the determination unit satisfies a predetermined condition.

  The display processing unit 70 f displays on the touch panel 64 an image indicating the component mounting position of the mounting board 5 that has been inspected. Further, the statistical processing data at each component mounting position stored in the mounting failure accumulation data storage unit 75 is displayed and output to the touch panel 64. Further, an estimated defect factor display process, which will be described later, is performed on the component mounting position at which the determination unit 70e determines that the mounting defect determination ratio has exceeded a predetermined threshold.

  FIG. 9 shows an image displayed on the touch panel 64 by display processing of the data stored in the mounting failure accumulation data storage unit 75 by the display processing unit 70f. The image displayed on the touch panel 64 includes a component mounting position map 79 that displays, for each component mounting position, a portion determined to be defective on the board 2.

  The display method of the mounting failure location in the component mounting position map 79 performed by the control unit 68 will be described in detail. When the operator operates the cumulative display button 80 displayed on the touch panel 64, the display processing unit 70f is mounted on the component mounting position where the mounting defect has occurred on the image of the mounting board displayed on the component mounting position map 79. Display defect determination data. In the present embodiment, as a method for displaying mounting failure determination data, display is made using a plot mark P at a component mounting position determined as a mounting failure in the component mounting position map 79, and plotting is performed according to a mounting failure determination ratio. The color of the mark P is made different. The color assignment of the plot mark P can be confirmed by the color reference column 81 displayed on the touch panel 64. Thus, the worker can visually know the mounting failure determination ratio by comparing the color of the plot mark P displayed on the component mounting position map 79 with the color reference field 81.

  The color of the plot mark P assigned in accordance with the mounting failure determination ratio, the range of numerical values to which the color of the plot mark P is assigned, etc. can be arbitrarily set. When the cumulative reset button 82 displayed on the touch panel 64 is operated by the worker, the control unit 68 resets the stored mounting failure cumulative data, and newly starts the cumulative storage of the determination result from that point. .

  In the above configuration, the mounting failure accumulation data storage unit 75 is a storage unit that accumulates and stores the determination results for each of the component mounting positions for the plurality of mounting boards 5, and the display processing unit 70 f and the touch panel 64 are provided on the mounting board 5. The component mounting position map display means visually displays the component mounting position as a component mounting position map 79. The statistical processing unit 70d and the display processing unit 70f constitute a determination result accumulation display unit that displays the determination result accumulated and stored for each component mounting position on the component mounting position map 79.

  When the operator selects a plot mark P displayed on the component mounting position map 79, the control unit 68 displays a mounting defect detailed image 83 on the touch panel 64, which displays detailed information on the mounting defect in the plot mark P. . In the mounting failure detailed image 83, “board No.” indicating the type of the mounting board 5 to be inspected displayed on the component mounting position map 79, and in the case of a multi-sided board, a pattern to which the component mounting position belongs is displayed. “Pattern No.”, “Block No.” indicating the mounting order of the electronic component 4 mounted at the selected component mounting position on the substrate 2, and component mounting where the electronic component 4 is mounted at the selected component mounting position Mounted at the selected component mounting position among the plurality of suction nozzles 42a provided in the component mounting apparatuses M3 to M5 indicated by the “mounting machine No.” indicating the devices M3 to M5 and the “mounting machine No.”. “Use nozzle No.” indicating the suction nozzle 42a used for the mounting operation of the electronic component 4 that was mounted, and the tape cartridge that supplied the electronic component 4 mounted at the selected component mounting position. "Supplier Feeder No." indicating the feeder 37, "Defective content" indicating the specific content of mounting failure such as misalignment of the electronic component 4 at the selected component mounting position or no component, etc., and "Estimated failure factor: board "The detection state of the warp deformation state is poor. Check the measurement point setting status."

  Regarding the “defect content” in the detailed mounting defect image 83 described above, since the content of the mounting defect at the selected component mounting position may be different for each unit mounting board, “component misalignment NG”, “no component NG”. , “Inversion NG”, “Polarity NG”, and “Foreign matter mixed NG” occurrence ratios are displayed as a pie chart. Thereby, it is possible to easily grasp the details of the mounting failure at each component mounting position. In addition, the phrase “estimated failure factor: detection failure of the warp deformation state of the substrate. Check the setting state of the measurement point.” Is the ratio of the component mounting position where the plot mark P is displayed is determined as mounting failure. Displayed for the component mounting position determined by the determination unit 70e that the threshold stored in the mounting failure determination rate threshold storage unit 76 has been exceeded. For example, when the determination unit 70e determines that the mounting failure determination ratio at a certain component mounting position exceeds 41%, the determination unit 70e outputs the determination result to the display processing unit 70f, and the display processing unit 70f outputs the determination result. Based on the above, the above-mentioned wording is displayed on the touch panel 64. The threshold value may be arbitrarily set by the worker.

  As described above, in electronic component mounting in which the electronic component 4 is mounted on the substrate 2 and the mounting substrate 5 is manufactured, mounting defects may occur at a plurality of component mounting positions. In addition, there are various mounting failure determination ratios and specific contents of mounting failures for each component mounting position. The occurrence of such a mounting defect has a significant effect on the quality of the mounting board 5. Therefore, when a component mounting position having a high mounting failure determination ratio occurs, the worker quickly identifies the cause of the mounting defect and determines the cause. It is necessary to take appropriate measures. Here, the reason why the estimated defective factor is displayed in the mounting defect detailed image 83 by the control unit 68 is considered to be insufficient detection of the warped deformation state of the substrate 2 as one of the causes determined to be mounting defects. However, inexperienced workers cannot easily understand the cause and tend to be unable to take concrete measures. The setting state of the measurement point M in the vicinity of the component mounting position of the displayed location is confirmed. If the measurement point M is not set, a measurement point M is newly added and set in the vicinity of the component mounting position. Measures can be taken. Hereinafter, the contents of mounting defects that may occur due to the detection failure of the warped deformation state of the substrate and countermeasures for them will be described.

  As described above, the warped deformation state of the substrate 2 is detected based on the height of the substrate 2 at the measurement point M set by the worker, but the heights other than the measurement point M are estimated values based on a complementary expression. Only. For this reason, when a local warpage deformation has occurred at a certain component mounting position and the measurement point M is not set at or near the position, the warpage deformation state at the component mounting position is not accurately detected. A plot mark P1 shown in FIG. 10A indicates a component mounting position where the component mounting height L is not appropriately set because the measurement point M is not set in the vicinity thereof, and mounting defects continuously occur. . In order to obtain a more accurate height at the component mounting position indicated by the plot mark P1, it is necessary to newly set a measurement point MA at the position or the vicinity thereof and detect the warped deformation state again. .

  FIG. 10B shows a state in which the worker newly sets a measurement point MA in the vicinity of the plot mark P1. As a result, the control unit 46 of the component mounting apparatuses M3 to M5 detects the warped deformation state of the board 2 again including the newly set measurement point MA in addition to the measurement point M that has already been set. In mounting, the electronic component 4 is mounted on the board 2 by correcting the height based on the warped deformation state of the board 2 detected again.

  In the above-described configuration, the touch panel 64 and the control unit 68 that controls the touch panel 64 measure points in the vicinity of the component mounting position for the component mounting position determined by the determination unit that the ratio determined to be mounting failure satisfies a predetermined condition. It is an informing means for informing to confirm the setting status of. In addition, the control unit 46, the touch panel 52, and the mouse pointer 53 included in the component mounting apparatuses M3 to M5 are newly set at a measurement point in the vicinity of the component mounting position notified by the mounting component inspection apparatus M6. It is a setting means. The component mounting system according to the present embodiment includes the above-described component mounting apparatuses M3 to M5 and the mounted component inspection apparatus M6.

  Next, a mounting component inspection execution flow will be described with reference to FIGS. First, the control unit 68 acquires inspection data of the predetermined number of mounting boards 5 necessary for calculating the mounting failure determination ratio (ST1). An execution flow for acquiring inspection data of the mounting board 5 will be described with reference to FIG.

  As shown in FIG. 12, first, the mechanism control unit 69 controls the board transport conveyor 61 to carry the mounting board 5 into the mounting component inspection apparatus M6 (ST11). Next, the mechanism control unit 69 drives the head moving mechanism 62 to move the mounting state inspection head 63 onto the mounting substrate 5, and the inspection camera 63 a or a plurality of inspection images included in the imaging range of the inspection camera. A mounting component image of the mounting substrate 5 is acquired by imaging the component mounting position (ST12). That is, the mounting state inspection head 63 serves as an imaging unit that images the component mounting position on the substrate 2 after component mounting. The mounted component image is subjected to image processing by the image processing unit 70a, and based on the processing result, the pass / fail inspection unit 70b performs a pass / fail inspection of the mounting state at the component mounting position (ST13).

  Then, the pass / fail inspection unit 70b determines whether the mounting state of the component mounting position is good (ST14). If it is determined that the mounting is defective, the pass / fail inspection unit 70b determines whether the mounting substrate 5 includes the component mounting position and the content of the mounting failure. The inspection data is output to the statistical processing unit 70d (ST15). Then, the control unit 68 determines whether or not the pass / fail inspection for all the component mounting positions on one mounting board 5 is completed (ST16), and if the pass / fail inspection for all the component mounting positions is not ended. Returning to (ST12), mounting component images at other component mounting positions that have not yet been checked for pass / fail are acquired and similar processing is executed. If the control unit 68 determines that the quality inspection for all component mounting positions has been completed, the control unit 68 carries the mounting board 5 out of the mounting component inspection apparatus M6 (ST17). The carried-out mounting board 5 is counted by the counting unit 70c, and whether or not the statistical processing unit 70d has acquired the inspection data for the predetermined number of mounting boards 5 stored in the inspected mounting board target number storage unit 74. Judgment is made (ST18). If the predetermined number of sheets has not been reached, the process returns to ST11 and the inspection of the mounting board 5 is continued. By repeatedly executing the inspection process of the mounting board 5 in this way, the statistical processing unit 70d acquires the inspection data of the predetermined number of mounting boards.

  As shown in FIG. 11, when the count unit 70c determines that the statistical processing unit 70d has acquired inspection data for a predetermined number of mounting boards 5, each component mounting of the mounting board 5 on the statistical processing unit 70d is performed. A command is issued to calculate a mounting failure determination ratio at the position. In response to this instruction, the statistical processing unit 70d calculates a mounting failure determination ratio (ST2), calculates the mounting failure determination ratio at each component mounting position, the number of mounting failures at each component mounting position, and the mounting at each component mounting position. The statistically processed mounting failure cumulative data including the proportion of types of failures is output to the mounting failure cumulative data storage unit 75, and the mounting failure cumulative data storage unit 75 stores this. Then, the display processing unit 70 f displays an image of the mounting board 5 including the component mounting position on the component mounting position map 79 based on the data stored in the mounting failure accumulation data storage unit 75.

  When the operator operates the cumulative display button 80 displayed on the touch panel 64, the display processing unit 70f uses the plot mark P to store the data stored in the mounting failure cumulative data storage unit 75 on the component mounting position map 79. Display processing. When the operator operates the plot mark P displayed on the component mounting position map 79, the above-described mounting failure detailed image 83 is displayed on the touch panel 64 by the display processing unit 70f.

  In the display processing of the mounting failure detailed image 83 by the display processing unit 70f, it is determined whether or not the mounting failure determination ratio at the component mounting position where the plot mark P is displayed by the determination unit 70e exceeds a predetermined threshold value. When it is determined for each component mounting position (ST3) and the determination unit 70e determines that the threshold value is exceeded, the determination result is output to the display processing unit 70f. Then, the display processing unit 70f receives the determination result and performs a process of displaying the estimated failure factor in the mounting failure detailed image 83 (ST4).

  When the above-mentioned wording is notified on the mounting failure detailed image 83, the worker confirms the setting state of the measurement point M in the component mounting apparatuses M3 to M5 that have received the indication of the detection failure. When the measurement point M is not set near the component mounting position where the above wording is displayed, measures such as newly adding a measurement point MA near the component mounting position are taken. The mounting board 5 in which the mounting component inspection has been completed and no defect has been detected is carried into a reflow device 84 (see FIG. 1) connected to the downstream side. 4 is soldered.

  In other words, the warp deformation state of the substrate is detected by measuring the heights of a plurality of measurement points on the substrate, and the component mounting height is corrected according to the warp deformation state of the substrate to set a plurality of the set points on the substrate. In a component mounting method for mounting a component at a component mounting position, an imaging process for imaging the component mounting position on the board after component mounting, and whether the mounting state is good or not is determined based on the imaging result in the imaging process. A determination step for outputting, a storage step for accumulating and storing determination results for each component mounting position for a plurality of substrates, a component mounting position map display step for visually displaying a component mounting position on the substrate as a component mounting position map, A judgment result cumulative display process that displays the judgment results accumulated and stored for each part mounting position on the part mounting position map, and a percentage that is determined to be a mounting failure in the judgment process. For each component mounting position, and a component mounting position for which it is determined that the proportion determined to be defective in the determination step satisfies the predetermined condition. A notification step for notifying that the setting state of measurement points in the vicinity of the device is confirmed, and a height measurement setting step for newly adding and setting a measurement point in the vicinity of the notified component mounting position. ing.

  As a result, even a worker with little experience in the component mounting field can easily and quickly understand that the cause of the mounting failure is due to the detection failure of the warp deformation state of the board, and the component mounting position where the failure has been pointed out Alternatively, it is possible to quickly take measures such as adding a new measurement point to the vicinity thereof. As a result, it is possible to improve the productivity of the mounting substrate by suppressing the generation of the mounting defective substrate.

  In the present embodiment described above, the display of the estimated failure factor in the mounting failure detailed image 83 is performed when the ratio determined to be mounting failure at the component mounting position where the plot mark P is displayed satisfies a predetermined condition. However, it may be performed when the number of times determined as mounting failure satisfies a predetermined condition. That is, if the count unit 70c determines that the number of inspected mounting boards 5 has reached the number stored in the inspected mounting board target number storage unit 74, each component mounting position statistically processed by the statistical processing unit 70d. The determination unit 70e determines whether or not the number of times the mounting failure is determined exceeds the predetermined threshold value. If the determination unit 70e determines that the mounting threshold value is exceeded, the display processing unit 70f The detailed image 83 is used to display the estimated failure factor. That is, the determination means (determination step) according to the present invention is configured to determine, for each component mounting position, whether or not the ratio or the number of times determined as mounting failure satisfies a predetermined condition, and also provides notification means (notification step). Is for confirming the setting status of measurement points in the vicinity of the component mounting position for the component mounting position where it is determined that the ratio or number of times determined as defective mounting in the determination means (determination step) satisfies a predetermined condition. It is configured to perform notification.

  The mounting component inspection apparatus and the mounting component inspection method of the present invention can effectively use the inspection result information obtained in the mounting component inspection, correct the setting of the measurement point, and improve the usefulness of the mounting component inspection. This is effective in the field of inspecting the mounting state of components mounted on a board.

2 substrate 4 electronic component 5 mounted substrate 45 height sensor 46, 68 control unit 52, 64 touch panel 53 mouse pointer 63 mounting state inspection head 70 inspection processing unit 70a image processing unit 70b pass / fail inspection unit 70c count unit 70d statistical processing unit 70e Judgment unit 70f Display processing unit 75 Mounting failure accumulated data storage unit 79 Component mounting position map 83 Mounting failure detailed image M3 to M5 Component mounting device M6 Mounting component inspection device

Claims (3)

Measure the height of multiple measurement points on the board to detect the warp deformation state of the board, correct the component mounting height according to the warp deformation state of the board, and mount multiple parts set on the board A mounting component inspection device that inspects a mounting state for a component-mounted substrate that is unloaded from a component mounting device that mounts a component at a position,
Imaging means for imaging the component mounting position on the substrate after component mounting;
A determination unit that determines the quality of the mounting state based on an imaging result of the imaging unit and outputs a determination result;
Storage means for accumulating and storing the determination results for each of the component mounting positions for a plurality of boards;
Component mounting position map display means for visually displaying the component mounting position on the board as a component mounting position map;
Determination result accumulation display means for displaying the determination result accumulated and stored for each component mounting position on the component mounting position map;
A determination unit that determines, for each component mounting position, whether or not the ratio or the number of times determined as mounting failure in the determination unit satisfies a predetermined condition;
Informing means for informing the component mounting position where it is determined that the ratio or the number of times determined as defective mounting satisfies the predetermined condition in the determining means to confirm the setting status of measurement points in the vicinity of the component mounting position. And a mounting component inspection apparatus. Measure the height of multiple measurement points on the board to detect the warp deformation state of the board, correct the component mounting height according to the warp deformation state of the board, and mount multiple parts set on the board A component mounting system that includes a component mounting device that mounts a component at a position, and a mounting component inspection device according to claim 1,
The component mounting apparatus includes a measurement point setting means for newly adding and setting a measurement point in the vicinity of the component mounting position notified by the mounted component inspection apparatus. Measure the height of multiple measurement points on the board to detect the warp deformation state of the board, correct the component mounting height according to the warp deformation state of the board, and mount multiple parts set on the board A component mounting method for mounting a component at a position,
An imaging process for imaging the component mounting position on the substrate after component mounting;
A determination step of determining the quality of the mounting state based on the imaging result in the imaging step and outputting the determination result;
A storage step of accumulating and storing the determination results for each of the component mounting positions for a plurality of boards;
A component mounting position map display step for visually displaying the component mounting position on the board as a component mounting position map;
A determination result accumulation display step of displaying a determination result accumulated and stored for each component mounting position on the component mounting position map;
A determination step of determining, for each component mounting position, whether or not the ratio or number of times determined as mounting failure in the determination step satisfies a predetermined condition;
An informing process for informing that the setting state of the measurement points in the vicinity of the component mounting position is confirmed for the component mounting position at which the ratio or the number of times determined as mounting failure in the determining step satisfies a predetermined condition. When,
A component mounting method comprising a height measurement setting step of newly adding and setting a measurement point in the vicinity of the notified component mounting position.

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